JP2000165100A - Method and apparatus for recognizing electronic component in electronic component mounter - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method and an apparatus for recognizing an electronic component in electronic component mounter in which various types of electronic component, including an electronic component with bumps, can be recognized. SOLUTION: In an electronic component recognition method performing image recognition by illuminating an electronic component P held by a nozzle 11 and picking up the image thereof, the electronic component P is recognized by transmitting illumination light from the first light source 24 in a light source section 23 and then recognized by reflecting illumination light from the second light source 24. Furthermore, illumination light from the third light source 26 is guided by mirror face parts 29b, 32b and projected sideways to the electronic component with bumps thus recognizing the bumps. According to the method, various types of electronic component including an electronic component with bumps, which can not be recognized by reflection recognition and transmission recognition, can be recognized using an identical recognition apparatus.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component recognizing device and an electronic component recognizing method in an electronic component mounting apparatus for recognizing an image of an electronic component when mounting the electronic component.

[0002]

2. Description of the Related Art In an electronic component mounting apparatus for mounting an electronic component on a substrate, a method of correcting a displacement of an electronic component by image recognition is often used in order to improve mounting position accuracy. In this method, the electronic component is picked up by a camera while the transfer head picks up and holds the electronic component from the parts feeder, and the image pickup result is subjected to image processing to detect a displacement. When the electronic component is mounted on the substrate, the above-described positional deviation is corrected, and the electronic component is accurately positioned and mounted at a correct position.

[0003] As a lighting method when an electronic component is imaged by a camera, a conventional method is to irradiate the electronic component with illumination light from below and receive the reflected light from the electronic component by the camera, or a method behind the electronic component. A method using transmitted illumination in which illumination light is radiated to a provided reflecting plate and the reflected light is received by a camera has been used.

[0004]

In recent years, CSPs have been developed.
Electronic components having bumps formed on a thin substrate such as (Chip Size Package) have been used. In the case of recognizing the CSP, it is necessary to obtain the presence or absence of a bump, partial chipping, the center position of the bump, and the like by image recognition for all the bumps.
However, such bumps cannot be recognized by the above-described reflection illumination or transmission illumination. Since the bumps are included inside the outer shape of the electronic component, they are not recognized by transmitted illumination.In the case of reflective illumination, not only the bumps but also the circuit patterns and edges on the surface reflect light, so only the bumps can be accurately detected. Because it is difficult to recognize. For this reason, among conventional electronic component mounting apparatuses, a mounting apparatus that is versatile and capable of mounting various types of electronic components at high speed cannot mount electronic components with bumps such as CSP, and other dedicated mounting. Needed equipment.

SUMMARY OF THE INVENTION It is an object of the present invention to provide an electronic component recognizing apparatus and an electronic component recognizing method in an electronic component mounting apparatus capable of recognizing various types of electronic components including electronic components with bumps.

[0006]

An electronic component recognizing device in an electronic component mounting apparatus according to claim 1, wherein the electronic component held by the nozzle is illuminated by an illuminating unit, and an image of the electronic component is captured by an imaging unit. An electronic component recognizing device in an electronic component mounting device for performing recognition, comprising: a first light source for transmitting and recognizing an electronic component; a second light source for reflecting and recognizing the electronic component; A third light source for illuminating the electronic component from the side and light guiding means for guiding illumination light of the third light source and irradiating the electronic component with light from a specific direction.

According to a second aspect of the present invention, there is provided an electronic component recognizing apparatus for an electronic component mounting apparatus, wherein the light guide means is a mirror surface disposed to face the electronic component recognizing apparatus. Department.

According to a third aspect of the present invention, there is provided an electronic component recognizing apparatus for an electronic component mounting apparatus, wherein the electronic component recognizing apparatus includes an interval changing means for changing an interval between the mirror surfaces. The irradiation position of the illumination light irradiated from the side to the electronic component is variable.

According to a fourth aspect of the present invention, there is provided an electronic component mounting method for an electronic component mounting apparatus, wherein an electronic component held by a nozzle is illuminated by an illuminating unit, an image is captured by an imaging unit, and an image of the electronic component is recognized. An electronic component recognition method in an apparatus, wherein the electronic component is transmitted and recognized by illumination light from a first light source provided in the illumination unit,
The electronic component is reflected and recognized by the illumination light from the second light source, and the bump is recognized by illuminating the electronic component with the bump from the side with the illumination light from the third light source.

According to the present invention, the first light source for transmitting and recognizing the electronic component to the illumination means, the second light source for recognizing the electronic component, and for illuminating the electronic component from the side. By including the third light source and light guide means for guiding illumination light of the third light source, it is possible to recognize a wide variety of electronic components including electronic components with bumps.

[0011]

Embodiments of the present invention will now be described with reference to the drawings. FIG. 1 is a plan view of an electronic component recognition device according to an embodiment of the present invention, FIG. 2 is a cross-sectional view of the electronic component recognition device, and FIGS. 4A and 4B are partial sectional views of the electronic component recognition device, FIGS. 5A and 5B are partial cross-sectional views of the electronic component recognition device, and FIG. It is an image figure of an electronic component recognition device.

First, the overall structure of the electronic component mounting apparatus will be described with reference to FIG. In FIG. 1, a conveyor 2 is disposed in the center of a base 1 in the X direction. The conveyor 2 transports and positions the substrate 3. Therefore, the conveyor 2 serves as a positioning portion for the substrate 3. A number of parts feeders 4 are arranged on both sides of the conveyor 2. The parts feeder 4 stores and supplies the electronic components P.

A transfer head 7 for electronic components P is mounted on the X-axis table 6. The X-axis table 6 is mounted on two Y-axis tables 5 arranged side by side on the left and right sides.
Therefore, by driving the X-axis table 6 and the Y-axis table 5, the transfer head 7 moves in the horizontal direction, picks up the electronic component P from the parts feeder 4,
Mount on top. An electronic component recognizing device 8 for the electronic component P for recognizing the electronic component P is provided on the moving path of the transfer head 7.

Next, the transfer head 7 and the electronic component recognition device 8 will be described with reference to FIG. In FIG. 2, a plurality of (only one is shown in FIG. 2) θ axes 1
0 is provided. A nozzle 11 for vacuum-sucking the electronic component P is mounted on the θ-axis 10, and the θ-axis 10 and the nozzle 11 are moved up and down integrally by vertical movement means (not shown). A reflection plate 12 that reflects illumination light from the light source unit is mounted on the lower surface of the transfer head 7. The reflection plate 12 includes a reflection plate for transmitted illumination 12a and an infrared transmission filter 12b.

The electronic component recognition device 8 includes a lens 20 and a camera 21. The camera 21 is connected to the image processing unit 22, and the image processing unit 22 processes the image data of the electronic component P recognized by the camera 21 and detects a displacement of the electronic component P. Above the periphery of the lens 20, a light source unit 23 as illumination means is disposed so as to surround the transfer head 7 from the periphery. The light source unit 23 includes an infrared LED light source 24 that emits infrared light having a wavelength of about 850 nm and a red L that emits red light having a wavelength of about 690 nm.
An ED light source 25 and a light source 26 are provided.

Next, the light source section 23 will be described with reference to FIG. In FIG. 3A, a slider 28 is slidably mounted on the side surface of the block 27. Slider 2
A holder 29 is coupled to 8, and a light source 24 of an infrared LED is mounted on a side surface of the holder 29. The lower end of the holder 29 is a bent portion 29a bent in a substantially L shape,
The lower surface of the bent portion 29a is mirror-finished, and the mirror surface portion 29b
It has become. The upper end of the holder 29 is connected to the rod 30a of the cylinder 30, and when the rod 30a is protruded and retracted, the holder 29 moves in the direction of the arrow, and the position of the bent portion 29a moves up and down.

A block 31 is fixed to the lower surface of the block 27, and an LED light source 26 is mounted on a side surface of the block 31. A plate 32 is fixed to the lower surface of the block 31, and a plate-shaped holder 33 is fixed to the lower surface of the plate 32.
Are mounted. The end of the plate 32 is bent to form a bent portion 32a. The upper surface of the bent portion 32a is mirror-finished, and is similarly a mirror surface 32b. The mirror surface portion 29b and the mirror surface portion 32b are disposed to face each other. As shown in FIG. 3B, the illumination light (see the arrow) emitted from the light source 26 is alternately reflected by the mirror portions 29b and 32b, and enters the side surface of the electronic component P from a specific direction. That is, the mirror portions 29b and 32b serve as light guiding means for the illumination light of the light source 26.

FIG. 3B shows a rod 30a of the cylinder 30.
Is immersed to raise the bent portion 29a. As a result, the distance D between the mirror surfaces 29b and 32b is reduced as shown in FIG.
It becomes larger than the state shown in FIG. That is, the interval D
Is changed by driving the cylinder 30, and the cylinder 30 serves as interval changing means. The bent portion 32
The distance D may be changed by moving a up and down.

Next, the function of the light source unit 23 will be described. First, when the light source 24 is turned on, the illumination light of the infrared LED is transmitted through the infrared transmission filter 12b of the illumination reflector 12 disposed above the nozzle 11 as shown in FIG. The image is reflected downward by the plate 12a, and the reflected light is received by the camera 21 to obtain an image in which the electronic component P is a dark image. From this image, the shape of the electronic component P can be recognized. That is, the light source 24 is a first light source that recognizes the electronic component P through transmission.

By turning on the light source 25, FIG.
As shown in (b), the illumination light of the red LED irradiates the lower surface of the electronic component P held by the nozzle 11, and the reflected light enters the camera 21, whereby the electronic component P can be recognized. The illumination light of the red LED is the electronic component P
Since the light does not pass through the infrared transmission filter 12b above, the light is not reflected downward by the reflection plate for transmitted illumination 12a, and only the reflected light from the electronic component P enters the camera 21. That is, the light source 25 is a second light source for reflecting and recognizing the electronic component P.

Next, the recognition of an electronic component P having a bump B provided on the lower surface, such as a CSP, will be described with reference to FIG. First, as shown in FIG. 5A, when an electronic component P which is a CSP is targeted, the position of the mirror surface portion 29b is raised by the cylinder 30. Thereby, the illumination light emitted from the light source 26 is guided by the mirror portions 29b and 32b, and enters the side surface of the electronic component P. At this time, the incident position is set so that the light enters the bump B of the electronic component P from the side surface. Thus, the light is incident only on the side surface of the bump B without being incident on a glossy surface such as a lead formed on the lower surface of the electronic component P. In a state where the side surfaces of the bumps B are illuminated from the plurality of light source units 23 disposed around the periphery, the electronic component P is imaged by the camera 21 from below, and as shown in FIG. P
Can be obtained as a dark image of the background image other than the bump B, and an image in which only the bump B is a bright image. That is, the light source 26
Is a third light source that irradiates the electronic component P from the side.

Similarly, in the case of an electronic component P 'whose size is larger than that of a CSP such as a BGA and whose bumps are shifted downward, the cylinder 30
Is driven to lower the position of the mirror surface portion 29b. Accordingly, the incident position of the illumination light from the light source 26 moves downward, and irradiates the side surface of the bump B. Similarly, an image in which only the BGA bump B is a bright image can be obtained.

As described above, the first light source for transmission recognition, the second light source for reflection recognition, and the third light incident on the electronic component held in the nozzle 11 from a specific lateral direction.
Integrated light source makes it possible to mount electronic components with bumps that could not be mounted with conventional general-purpose electronic component mounting devices such as CSP and BGA using the same mounting device. . Further, even in a device such as a rotary head type electronic component mounting device in which the nozzle holding the electronic component at the recognition position cannot move up and down, the electronic component with bumps can be recognized. Therefore, the versatility of the mounting apparatus can be further improved, and the total equipment cost can be reduced.

[0024]

According to the present invention, the first light source for transmitting and recognizing the electronic component to the illumination means, the second light source for recognizing the electronic component, and the second light source for illuminating the electronic component from the side are provided. 3
And a light guide means for guiding the illumination light of the third light source, so that a wide variety of electronic components, including electronic components with bumps such as CSP, can be recognized by the same recognition device. The versatility of the electronic component mounting apparatus can be improved.

[Brief description of the drawings]

FIG. 1 is a plan view of an electronic component recognition device according to an embodiment of the present invention.

FIG. 2 is a sectional view of the electronic component recognition device according to the embodiment of the present invention;

3A is a cross-sectional view of a light source unit of the electronic component recognition device according to one embodiment of the present invention. FIG. 3B is a cross-sectional view of a light source unit of the electronic component recognition device according to one embodiment of the present invention.

4A is a partial cross-sectional view of an electronic component recognition device according to an embodiment of the present invention. FIG. 4B is a partial cross-sectional view of an electronic component recognition device according to an embodiment of the present invention.

5A is a partial cross-sectional view of an electronic component recognition device according to an embodiment of the present invention. FIG. 5B is a partial cross-sectional view of an electronic component recognition device according to an embodiment of the present invention. Image of electronic component recognition device in the form of

[Explanation of symbols]

 7 Transfer Head 8 Electronic Component Recognition Device 11 Nozzle 12 Reflector 12a Reflector for Transmitted Illumination 12b Infrared Transmitter Filter 21 Camera 22 Image Processor 23 Light Source 24 First Light Source 25 Second Light Source 26 Third Light Source 29b , 32b Mirror surface part 30 cylinder

Claims (4)

[Claims] An electronic component recognizing device in an electronic component mounting apparatus for illuminating an electronic component held by a nozzle by an illuminating unit, capturing an image by an imaging unit, and recognizing the image of the electronic component. A first light source for transmitting and recognizing the electronic component, a second light source for reflecting and recognizing the electronic component, a third light source for illuminating the electronic component from the side, and illumination light of the third light source. An electronic component recognition device in an electronic component mounting apparatus, comprising: a light guide unit for guiding the electronic component to irradiate the electronic component from a specific direction. 2. The electronic component recognizing device according to claim 1, wherein said light guide means is a mirror surface portion disposed to face. 3. An electronic apparatus according to claim 2, further comprising an interval changing means for changing an interval between said mirror surfaces, wherein an irradiation position of illumination light illuminated from the side with respect to said electronic component is variable. An electronic component recognition device in an electronic component mounting device. 4. An electronic component recognizing method in an electronic component mounting apparatus for illuminating an electronic component held by a nozzle by an illuminating unit, capturing an image by an imaging unit, and recognizing an image of the electronic component. An electronic component is transmitted and recognized by illumination light from a first light source provided, and an electronic component is reflected and recognized by illumination light from a second light source. Further, an illumination component from a third light source is mounted on the electronic component with bumps. An electronic component recognition method in an electronic component mounting apparatus, characterized in that the bumps are recognized by irradiating the bump from the side.