JP2001036299A - Electronic component mounting apparatus and method - Google Patents

Abstract

(57) [Summary] [PROBLEMS] To enable various types of electronic components to be mounted on a printed circuit board with high accuracy and at high speed. SOLUTION: A line sensor 55 for detecting electronic components 56a to 56c sucked by suction nozzles 46a to 46c is provided. If the sucked electronic component does not require much mounting accuracy, the component is illuminated with the line light 53 and received by the line sensor 55 to recognize the component. On the other hand, in the case of components requiring mounting accuracy, the components are illuminated from above,
The component is recognized by moving the line sensor 55 below the component and scanning the component. In such a configuration, a sensor or component recognizing means provided on the suction head unit causes
By recognizing components by changing the recognition method, various components can be recognized while the head moves the component sucked by the suction nozzle to the printed circuit board, greatly shortening the tact time for component mounting. Can be improved.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus and a method for mounting an electronic component, and more particularly to a device and method for recognizing and correcting the position of an electronic component sucked by a suction nozzle provided in a head movable in the X and Y directions. Thereafter, the present invention relates to an electronic component mounting apparatus and method for mounting the electronic component at a predetermined position on a printed circuit board.

[0002]

2. Description of the Related Art FIG. 1 and FIG.
No. 8,215, and an electronic mounting device described in JP-A-6-152193. In these figures, on a base 1, a conveyor 2 for transporting a printed circuit board is provided.
Are arranged, and the printed circuit board 3 is transported on the conveyor 2 and stopped at a predetermined component mounting position. A component supply unit 4 having a large number of rows of tape feeders 4a is disposed on the side of the conveyor 2, and each of the tape feeders 4a stores a chip-shaped chip component such as an IC, a transistor, and a capacitor. The head unit 5 is provided with tapes stored and held at predetermined intervals, and chip components are picked up.

[0003] Above the base 1, a head unit 5 for mounting components is provided.
Is moved in the X-axis direction (the moving direction of the conveyor 2) and the Y-axis direction (the direction orthogonal to the X-axis on a horizontal plane) by an XY unit driven by the X-axis servo motor 15 and the Y-axis servo motor 9. The Y-axis servomotor 9 and the X-axis servomotor 15 are provided with position detecting means 10 and 16 each composed of an encoder.

The head unit 5 is provided with a suction nozzle. In the illustrated embodiment, two suction nozzles 2 are provided.
1, 22 are provided. Further, a laser unit 31 is provided below the head unit 5 as an optical detecting means. In the illustrated embodiment, in addition to the component recognition based on the detection of the projection width by the laser unit 31 (detection of the position of the chip component), the fine pitch component is captured by a camera and the component recognition is performed by image processing. So that the component recognition camera device 3 can be mounted on the base 1 at an appropriate position within the moving range of the head unit.
3 are installed.

FIG. 3 is a view for explaining the suction of the component 20 by one suction nozzle 21 of the laser unit 31 mounted on the head unit 5 and the detection of its position. The suction nozzle 21 moves in the Z-axis direction (vertical direction) with respect to the frame of the head unit 5 and moves by θ.
Rotation around an axis (nozzle center axis) is possible. Each servomotor (not shown) is provided with a position detecting means. The suction nozzle 21 is connected to a negative pressure supply means (not shown) via a valve or the like so that a negative pressure for component suction is supplied to the suction nozzle 21 when necessary.

The suction nozzle 21 has a laser generating section (parallel ray irradiating section) 31a which faces each other across the passing space.
When the chip component 20 adsorbed by the suction nozzle 21 is located in the space inside the laser unit 31 having a detector (light receiving unit) 31b composed of a CCD and a chip component, the chip component , And the laser beam not blocked by the chip component 20 is received by the detector 31b, whereby the projection width of the chip component 20 is detected.

FIG. 4 shows a unit for detecting the position of an electronic component and recognizing the component by a component recognition camera device 33 in the electronic component mounting apparatus. The recognition camera 33a captures an image of the fine pitch electronic component 20 ′ illuminated from below through the brightness adjustment illumination device 33b and the brightness adjustment reflector 33c. Here, the electronic component 20 ′ is sucked by the suction nozzle 21 provided on the head unit 5, and the head unit 5 moves to the position of the recognition camera device 33, and the electronic component 20 ′ is imaged. Here, the brightness adjusting reflector 33c is coupled to the suction nozzle 21 on a plane parallel to the plane formed by the XY unit. The suction nozzle 21 rotates around the θ axis on an arbitrary plane parallel to the plane formed by the XY unit as shown in the drawing,
In addition, vertical movement in the vertical direction Z is possible. Recognition camera 3
The lighting device 3a and the brightness adjusting lighting device 33b are fixed at predetermined positions within the operating range of the head unit.

In the operation procedure, the head unit 5 is moved by the XY unit to a position for receiving an electronic component mounted on the printed circuit board 3. Subsequently, the suction nozzles 21 and 22 start moving in the direction of the component recognition camera device 33 or move in the direction of the substrate mounting position using the laser unit 31 according to the type of the component after the vacuum suction of the electronic component 20 or 20 ′. Decide. After imaging the electronic component sucked by the suction nozzle by a predetermined method, position correction data such as a deviation between the suction center of the component and the component center or a deviation of the suction angle of the component is obtained, and the head unit 5 is moved to the electronic component mounting position. Move. At this time, before the mounting, the correction of the angular deviation due to the rotation of the suction nozzle and the final positioning point of the head unit is executed based on the correction data. When the positioning is completed, the suction nozzle is moved downward to the mounting position, and after the positioning is completed, the suction nozzle is turned off and the electronic component 20 or 2
0 'is released, and the electronic component is mounted at a predetermined position on the printed circuit board 3.

[0009]

In the electronic component mounting apparatus as described above, when the picked-up electronic component is the fine pitch electronic component 20 ', the component recognition camera device 33 temporarily detects the shift of the pick-up position. The head unit 5 cannot move to the component mounting position in the shortest distance. For this reason, the time of one process from suction to mounting becomes long, which is disadvantageous in terms of tact time. Therefore, the component position recognition by the component recognition camera device 33 is mainly used for an object requiring high-precision positioning such as an electronic component called a fine pitch in which the terminals are extremely narrow in terms of application. .

On the other hand, in the laser unit 31 shown in FIG. 3, since the components such as the laser diode unit 31a and the line sensor unit 31b for detecting the displacement of the sucked electronic component are all present on the head unit 5, When performing the component position recognition using the laser unit 31,
The head unit 5 can operate at the shortest distance to the component mounting position. However, since the detection is based on the one-dimensional information from the line sensor unit 31b, it is unsuitable in a situation where high-precision positioning of electronic components such as a fine pitch is required. Used for unsolicited subjects.

Therefore, in an electronic component mounting apparatus called a general-purpose machine and having a wide variety of components to be mounted, the function has been satisfied by using both apparatuses in combination, but recently, high-precision positioning such as fine pitch has been required. As the demand for a system capable of high-speed mounting of components to be mounted has been increasing, proposals of component mounting devices having various configurations have been announced. However, all devices have problems in reliability, cost, and difficulty in adjustment.

Accordingly, the present invention has been made in view of such problems, and provides an electronic component mounting apparatus and method capable of mounting various types of electronic components on a printed circuit board with high accuracy and at high speed. Is the task.

[0013]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention recognizes an electronic component sucked by a suction nozzle provided on a head portion movable in the X and Y directions, corrects the position, and corrects the position on a printed circuit board. An electronic component mounting apparatus and method for mounting the electronic component at a predetermined position, wherein the head unit is provided with a recognition unit capable of recognizing the sucked electronic component by a plurality of recognition methods; In addition, one of the plurality of recognition methods is selected according to the electronic component, and the electronic component is recognized by the recognition method selected according to the type of the sucked electronic component.

Further, according to the present invention, a sensor for detecting a sucked electronic component is provided in the head portion, and when the sucked electronic component is a first type component, the sensor is stopped at a predetermined position. In this case, the electronic component is recognized by moving the sensor and scanning the electronic component when the picked-up electronic component is the second type of component.

Further, according to the present invention, the head unit is provided with a sensor for detecting the sucked electronic component, and when the sucked electronic component is the first type of component, the picked-up electronic component is moved to the side. Illuminated with line light from the side, and the illuminated electronic component is detected by the sensor to recognize the component. On the other hand, when the sucked electronic component is the second type of component, the sucked electronic component is The electronic component is illuminated, and the illuminated electronic component is scanned from below by the sensor to recognize the component.

In any of the inventions, the recognition method can be changed by the sensor or the component recognizing means provided in the head portion, so that the component recognition can be performed by changing the recognition method. This makes it possible to greatly improve the tact time for component mounting as compared with a conventional device or method in which the head is once moved to another location depending on the type of component to perform component recognition.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail based on an embodiment shown in the drawings.

FIG. 5 shows an embodiment of the electronic component mounting apparatus of the present invention. In the figure, a printed circuit board (electronic circuit board) 41 on which electronic components are mounted is transported by a transport unit 42 to a component mounting position. A head unit 46 is fixed to the XY robot 45. The head unit 46 is equipped with a plurality of suction nozzles and a line sensor that detects the position of the component sucked by the suction nozzles, as described later. In addition, a CCD camera for detecting a substrate mark and an IC mark is mounted to detect a deviation of the substrate from a reference position. The XY robot 45 is driven by an X-axis drive motor and a Y-axis drive motor (not shown) in the X-axis direction (transfer direction of the substrate 41) and in the Y-axis direction.
The feed unit 4 is moved in the axial direction (the direction orthogonal thereto).
The electronic components supplied from the component supply units 43 and 44 are sucked by the suction nozzles of the head unit 46 to the positions 3 and 44, and the electronic components are mounted at predetermined positions on the printed circuit board 41. Reference numeral 48 denotes a nozzle station provided with a replacement nozzle tip.

FIGS. 7 and 8 show the structure of a suction nozzle mounted on the head unit 46 and a position recognition unit for a component sucked by the suction nozzle. In each drawing, a plurality of suction nozzles 46a, 46
b and 46c are mounted, and the electronic components 56a, 56b and 56c are sucked by these suction nozzles, respectively. A laser light source 50 composed of a laser diode is provided. The laser light generated from the laser light source 50 is generated in the band of the line light 53 by the line light generation optical systems 51 and 52, and then the light path is changed by the light path changing prism 54. Is changed to a substantially right angle, and then received by the line sensor 55 composed of a CCD. Each of the suction nozzles 46a, 46b, 46c
The plane formed by the line light 53 can be moved up and down in the vertical direction (Z-axis direction), and can be rotated about the nozzle axis (θ-axis) in the plane. Diffusion plates 61a, 61b, and 61c to which illumination light sources (light emitting diodes) 60a, 60b, and 60c are attached are fixed to the suction nozzles 46a, 46b, and 46c, respectively. The electronic component sucked by the nozzle is illuminated from above.

The line sensor 55 is mounted on a base 57. The base 57 and the line sensor 55 mounted on the base 57 are
It is possible to move in the X direction via a, and the amount of movement can be detected by the encoder 58b.

Next, a component mounting operation in the electronic component mounting apparatus configured as described above will be described with reference to a flowchart of FIG.

First, the printed circuit board 41 shown in FIG.
2 and is carried into the component mounting position (step S1).
The board marks 67, 68, 69 as shown in FIG. 6 are printed on the printed board 41, and the positions of the board marks are read out from a memory buffer (not shown) as shown in FIG. 10 (not shown). (Corresponds to part numbers 1-3). XY
The robot 45 moves the head unit 46 over the above-mentioned substrate mark position of the printed circuit board 41, and uses a CCD camera (not shown) mounted on the head unit 46 to make each of the substrate marks 67, 6.
The positions of 8, 69 are acquired (step S2). And
The XY direction deviation (X1, Y1) and the substrate inclination (θ1) with respect to the reference position of the substrate are obtained, and a substrate mark correction value for correcting the substrate deviation at the substrate stop position is calculated (step S3).

Next, the part numbers are read from the memory buffer, the head unit 46 is moved to the corresponding part supply units 43 and 44, and the parts 56a to 56c (part numbers 4 to 7) are sucked by the suction nozzles 46a to 46c. (Step S4).
These components are determined to be “B”, that is, chip components from the table of FIG. Then, the side transmission method or the plane transmission method is selected according to the type of the sucked component (step S5).

The suction components 56a to 56c are electronic components such as chip components that do not require much mounting accuracy ("B" in FIG. 10).
Type), and in step S5, it is assumed that the component recognition method by the side surface transmission method is used.
The part is measured by the side transmission method. As shown in FIG. 7, the side transmission method irradiates a laser beam from the side of the component, measures the shadow of the component while rotating the components 56a to 56c, detects the position of the component based on the length of the shadow, and detects the position of the component. This is a method for obtaining a correction value. For this purpose, the laser light source 50 is turned on to form a band of the line light 53, and the line light 53
The components 56a to 56c sucked by the suction nozzles 46a to 46c are moved down in the plane of the band formed by. The shadow of the component is projected on the line sensor 55 by the line light of the laser. When the suction nozzles 46a to 46c are rotated about the θ axis in the same plane, the width of the shadow is extended. By calculating the angle of the inflection point and the width of the shadow at that time, a correction value of the shift in the XY direction between the center of the component and the suction center and the shift of the suction angle is obtained. Such a measuring method is known and is described in detail in, for example, JP-A-6-252598. Since the apparatus of the present invention is equipped with a plurality of suction nozzles, it is possible to simultaneously measure the chip components 56a to 56c sucked by each suction nozzle.

Subsequently, a component mounting position is calculated based on the board mark correction value obtained in step S3 and the component correction value obtained in step S6 (step S7), and the head unit 46 is moved to a target position, and each component 56a is moved. Are mounted on 65a to 65c (FIG. 6) of the printed circuit board 41 (step S8).

Next, when it is determined in step S5 that the suction component is an electronic component such as a fine-pitch QFP or the like (for example, component numbers 8 and 9 in FIG. 10), in step S9 a flat transmission method is used. Part recognition is performed. In the plane transmission method, a component is illuminated from above, the component is imaged by a line sensor disposed below the component, an image is acquired, and a component recognition correction value is obtained. for that reason,
As shown in FIG. 8, the laser light source 50 is turned off, the light source 60b attached to the diffusion plate 61b of the suction nozzle 46b sucking the suction component 56b 'is turned on instead, and the base on which the line sensor 55 is mounted is turned on. 57 is moved by a motor 58. In accordance with the data reading cycle of the line sensor 55, the movement amount of the base 57 is synchronized using the encoder 58b, and the base 57 is moved from the position X to the position X 'while moving the base 57 below the part 56b'. Is taken into a memory (not shown). While the base 57 moves from the position X to the position X ′, the component 56b ′ is scanned by the line sensor 55 in the main scanning and sub-scanning directions. A shift between the suction center and the component center and a shift in the suction angle are obtained by image processing, and a component recognition correction value is obtained. A method for obtaining such a correction value is known, and is disclosed in, for example, Japanese Patent Application Laid-Open No. 8-884.
No. 99, for example.

Next, in step S10, when the head unit has moved to the substrate 41, the mark position coordinates are read from FIG. 10 and the head unit is moved to the IC mark position (I shown in FIG. 6).
The IC mark is moved to the C marks 64a and 64b), and these IC marks are recognized by the CCD camera, and an IC mark correction value is obtained. This correction value indicates the amount of deviation (X2, Y2) and the angle deviation (θ2) in the XY directions with respect to the reference position of the area where the IC mark is provided. When this correction value is obtained, the component mounting position is calculated from the component recognition correction value obtained in step S9, and the head 46 is moved to this mounting position 64 to mount the component (step S8).

The above process is continued until all components have been mounted in step S11.

As described above, according to the present invention, all components from chip components to fine pitch components can be measured and recognized while the head 46 is being moved to the circuit board after the components are sucked. In addition, the tact time can be greatly improved.

FIGS. 11 to 14 show another embodiment of the present invention.

In the embodiment described above, the suction nozzles are arranged in a direction perpendicular to the moving direction of the linear sensor (radiation direction of the laser). In the embodiments of FIGS. 11 and 12, the suction nozzles 46a to 46c are provided. They are arranged in the direction of laser emission or the direction in which the line sensor 55 moves. The detection width of the line sensor 55 is shorter than that of the line sensor 55 of FIGS. Therefore, for example, when the electronic components are chip components, three electronic components 56a to 56c cannot be measured simultaneously as in the example of FIG. 7, and the suction nozzles are sequentially moved into the laser band 53 to measure each component. . In FIG. 11, only the component 56b sucked by the center suction nozzle 46b is measured. On the other hand, when the electronic component is a fine-pitch component, as shown in FIG. 12, by simply moving the line sensor from the position X to the position X ′, the component 56a sucked by the suction nozzles 46a to 46c is moved. '~ 56c' can be measured.

In the case of the embodiment shown in FIGS. 13 and 14, an optical path changing prism 70 and a lens 71 are arranged between the optical path changing prism 54 and the line sensor 55, and the band of the line light 53 is changed to the optical path changing prism. An image is formed on the line sensor 55 by the lens 70 and the lens 71. The optical path changing prism 70 is attached to the same unit as the line light forming optical systems 50 to 52 and the optical path changing prism 54, and the light emitting diode 60b and the lens 71 are attached to the base 57 together with the line sensor 55. I have.

When the chip component is recognized by the side transmission method, as shown in FIG. 13, a shadow of the component is formed on the line sensor 55 via the optical path changing prism 70 and the lens 71, and the above-described method is used. Part recognition is performed. On the other hand, when a fine pitch component is recognized by the plane transmission method, FIG.
As shown in FIG. 4, the laser light source 50 is turned off, the light emitting diode 60b is turned on, and the base 57 on which the lens 71 and the line sensor 55 are mounted as shown by a dotted line.
Is moved below the part 56 b ′, and the part 56 b ′ is scanned by the line sensor 55. The imaging of the component 56b 'by the line sensor 55 is performed by synchronizing with the encoder when the base 57 is under the component (the position is known by the encoder 58b), and the light from the light emitting diode 60b hits the component 56b', and the light image thereof is obtained. To the line sensor 55 by the lens 71.
This is performed by forming an image.

An advantage of using the optical path changing prism 70 and the lens 71 as in the embodiments of FIGS. 13 and 14 is that the length of the line sensor 55 can be shortened by the image forming action of the lens 71.

In the embodiments shown in FIGS. 8, 12, and 14, when the sucked electronic component is a fine pitch component, the electronic component can be recognized by moving the line sensor in both directions. When the next electronic component to be mounted is a chip component, the moved line sensor is returned. On the other hand, when the next electronic component is also a fine-pitch component, it is stopped as it is, and the return movement is performed. Electronic components can also be recognized.

[0036]

As is apparent from the above description, according to the present invention, the components can be recognized by changing the recognition method by the sensor or the component recognition means provided on the suction head.
Various components can be recognized while the head moves the component sucked by the suction nozzle to the printed circuit board, and the tact time for component mounting can be greatly improved.

[Brief description of the drawings]

FIG. 1 is a top view showing the appearance of a conventional electronic component mounting apparatus.

FIG. 2 is a front view of the electronic component mounting apparatus of FIG. 1;

FIG. 3 is a side view illustrating an example of component recognition.

FIG. 4 is a perspective view showing another example of component recognition.

FIG. 5 is a perspective view showing an appearance of an electronic component mounting apparatus according to the present invention.

FIG. 6 is a partially cutaway perspective view showing a printed circuit board on which electronic components are mounted.

FIG. 7 is a configuration diagram illustrating a configuration in which a component is recognized by projecting line light from a side to the component.

FIG. 8 is a configuration diagram showing a configuration in which a component is illuminated from above and a sensor is moved downward to recognize the component.

FIG. 9 is a flowchart illustrating the flow of component mounting.

FIG. 10 is a table showing the structure of component data.

FIG. 11 is a configuration diagram showing an embodiment in which suction nozzles are arranged in a laser irradiation direction.

FIG. 12 is a configuration diagram showing an embodiment in which the arrangement of the suction nozzles is arranged in the moving direction of the line sensor.

FIG. 13 is a configuration diagram illustrating an embodiment in which an image of a component sucked by a suction nozzle is formed and recognized by a lens in a side transmission method.

FIG. 14 is a configuration diagram illustrating an embodiment in which an image of a component sucked by a suction nozzle is formed by a lens and recognized in a plane transmission method.

[Explanation of symbols]

 41 Printed circuit boards 43, 44 Component supply unit 45 XY robot 46 Head unit 46a to 46c Suction nozzle 50 Laser light source 55 Line sensor 56a to 56c Electronic component 57 Base 60a to 60c Light source (light emitting diode) 61a to 61c Diffusion plate

Claims (10)

[Claims] 1. An electronic component mounting device for recognizing and correcting the position of an electronic component sucked by a suction nozzle provided in a head portion movable in XY directions, and then mounting the electronic component at a predetermined position on a printed circuit board. In the apparatus, a recognizing means provided on the head unit and capable of recognizing a sucked electronic component by a plurality of recognition methods, and a means for selecting one of the plurality of recognition methods according to a type of the sucked electronic component An electronic component mounting apparatus, comprising: recognizing an electronic component by a recognition method selected according to a type of the sucked electronic component. 2. An electronic component mounting device for recognizing and correcting the position of an electronic component sucked by a suction nozzle provided in a head portion movable in XY directions, and then mounting the electronic component at a predetermined position on a printed circuit board. In the apparatus, a sensor provided on the head unit for detecting a sucked electronic component; a unit for moving the sensor; a unit for determining a type of the sucked electronic component; In the case of a component of the type, the sensor is stopped at a predetermined position to recognize the component, and when the sucked electronic component is a component of the second type, the sensor is moved to scan the electronic component. An electronic component mounting device, comprising: means for component recognition by: 3. An electronic component mounting device for recognizing and correcting the position of an electronic component sucked by a suction nozzle provided on a head portion movable in the X and Y directions, and then mounting the electronic component at a predetermined position on a printed circuit board. In the apparatus, a sensor provided on the head unit for detecting a sucked electronic component, means for determining a type of the sucked electronic component, and a case where the sucked electronic component is a first type component Means for illuminating the sucked electronic component with line light from the side, means for detecting the electronic component illuminated with the line light with the sensor and recognizing the component, and wherein the sucked electronic component is of a second type. In the case of the above-mentioned component, there are provided means for illuminating the sucked electronic component, and means for recognizing the component by scanning the illuminated electronic component from below with the sensor, and recognizing the first type of component Means Sa and the electronic component mounting apparatus characterized by sensors of the second type of component recognizing means are identical. 4. The electronic device according to claim 2, wherein when the sucked electronic component is a second type component, the electronic component is recognized by bidirectional movement of the sensor. Component mounting device. 5. When the picked-up electronic component is a second type of component and the sensor is moved, the moved sensor is returned to an initial value according to the type of the next electronic component to be mounted. 5. The electronic component mounting apparatus according to claim 2, wherein the electronic component mounting apparatus is stopped as it is and prepares for the next operation. 6. 6. An electronic component mounting device for recognizing and correcting the position of an electronic component sucked by a suction nozzle provided in a head portion movable in the XY directions, and then mounting the electronic component at a predetermined position on a printed circuit board. In the method, a recognition means for recognizing the sucked electronic component by a plurality of recognition methods is provided in the head unit, and one of the plurality of recognition methods is selected according to the type of the sucked electronic component. An electronic component mounting method, wherein an electronic component is recognized by a recognition method selected according to a type of the component. 7. An electronic component mounting device for recognizing and correcting the position of an electronic component sucked by a suction nozzle provided in a head portion movable in the X and Y directions, and then mounting the electronic component at a predetermined position on a printed circuit board. In the method, a sensor for detecting a sucked electronic component is provided in the head unit, and when the sucked electronic component is a first type of component, the sensor is stopped at a predetermined position to recognize the component, An electronic component mounting method, characterized in that, when the electronic component is a second type component, the sensor is moved and the electronic component is scanned to recognize the component. 8. An electronic component mounting device for recognizing an electronic component sucked by a suction nozzle provided in a head portion movable in the X and Y directions, correcting the position, and then mounting the electronic component at a predetermined position on a printed circuit board. In the method, a sensor for detecting the sucked electronic component is provided on the head portion, and when the sucked electronic component is a first type component, the sucked electronic component is illuminated with line light from the side. Detecting the illuminated electronic component with the sensor and recognizing the component; if the sucked electronic component is of the second type, illuminating the sucked electronic component; Wherein the sensor for recognizing the first type of component is the same as the sensor for recognizing the first type of component by scanning the component from below with the sensor. 9. The electronic device according to claim 7, wherein when the sucked electronic component is a second type component, the electronic component is recognized by bidirectional movement of the sensor. Component mounting method. 10. When the picked-up electronic component is the second type of component and the sensor moves, whether the returned sensor returns to the initial value according to the type of the next electronic component to be mounted, Alternatively, the electronic component mounting method according to any one of claims 7 to 9, wherein the method is stopped to prepare for the next operation.