JPH09251883A - Ic socket - Google Patents

Ic socket

Info

Publication number
JPH09251883A
JPH09251883A JP8057583A JP5758396A JPH09251883A JP H09251883 A JPH09251883 A JP H09251883A JP 8057583 A JP8057583 A JP 8057583A JP 5758396 A JP5758396 A JP 5758396A JP H09251883 A JPH09251883 A JP H09251883A
Authority
JP
Japan
Prior art keywords
socket
base
contact
socket body
contact pin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8057583A
Other languages
Japanese (ja)
Other versions
JP3763156B2 (en
Inventor
Kazuhisa Ozawa
一久 小沢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Enplas Corp
Original Assignee
Enplas Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Enplas Corp filed Critical Enplas Corp
Priority to JP05758396A priority Critical patent/JP3763156B2/en
Publication of JPH09251883A publication Critical patent/JPH09251883A/en
Application granted granted Critical
Publication of JP3763156B2 publication Critical patent/JP3763156B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Testing Of Individual Semiconductor Devices (AREA)
  • Connecting Device With Holders (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide an IC socket capable of simply assembling a contact pin to a socket body and easily connecting the contact pin to an electrode terminal of a printed circuit board. SOLUTION: A contact pin to be assembled to socket bodies 1 and 2 is provided with a disk part 3a' at one end of a base part 3a, and a tip end part 3d' of a connection terminal part 3a' extending downward from the other end of said base part is so constituted as to be curved in the arc shape and to be elastically deformed. The disk part 3a' is engaged with a recess 1c'' provided on the bottom of a mounting groove formed at the socket body, and the base part 3a and the connection terminal part 3d are roughly J-shaped so that a portion of the socket body can be elastically embraced.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、ICパッケージ等
の電気部品をテストするのに用いられるICソケット、
特にバーンイン用ICソケットに関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC socket used for testing electric parts such as IC packages,
Particularly, it relates to a burn-in IC socket.

【0002】[0002]

【従来の技術】ICソケットには、ソケット本体に固定
された基部と、装填されたICパッケージのリード端子
に圧接する接触部と、基部と接触部との間に形成された
ばね部と、前記基部から前記接触部とは反対方向に延び
た接続端子部とを有する多数のコンタクトピンが列設さ
れていて、基部の固定は接続端子部をソケット本体の孔
に圧入するか、基部より垂下した突起部をソケット本体
の孔に圧入することにより行われており、又、接続端子
部は基部より下方へ直線的に延びた剛性の棒状体として
形成されている。
2. Description of the Related Art In an IC socket, a base portion fixed to a socket body, a contact portion which is in pressure contact with a lead terminal of a loaded IC package, a spring portion formed between the base portion and the contact portion, and the base portion. A plurality of contact pins having a connecting terminal portion extending in the opposite direction from the contact portion are arranged in rows, and the base portion is fixed by press-fitting the connecting terminal portion into the hole of the socket body or by a protrusion protruding from the base portion. The connection terminal portion is formed as a rigid rod-shaped member that extends linearly downward from the base portion.

【0003】[0003]

【発明が解決しようとする課題】従来、これをバーンイ
ンソケットとして使用する場合、接続端子部とプリント
回路基板の電極端子との電気的接続は、該基板に設けら
れた小孔(スルーホール)に接続端子部の先端部分を挿
入した後半田付けすることにより行われている。従っ
て、ICソケットをプリント回路基板に接続するのに比
較的手間が掛かるという問題があった。又、ソケット本
体にコンタクトピンを列設する組立作業も比較的複雑で
手間が掛かるという問題があった。
Conventionally, when this is used as a burn-in socket, the electrical connection between the connection terminal portion and the electrode terminal of the printed circuit board is made through a small hole (through hole) provided in the board. This is done by inserting the tip portion of the connection terminal portion and then soldering. Therefore, there is a problem that it takes a relatively long time to connect the IC socket to the printed circuit board. Further, there is a problem that the assembling work of arranging the contact pins in a row on the socket body is relatively complicated and time-consuming.

【0004】本発明は、従来のICソケットの有するこ
のような問題点に鑑みてなされたものであり、その目的
とするところは、ソケット本体へのコンタクトピンの組
付けが簡単で、而もプリント回路基板の電極端子へのコ
ンタクトピンの接続も容易なICソケットを提供しよう
とするものである。
The present invention has been made in view of the above problems of the conventional IC socket, and an object of the present invention is to easily assemble the contact pin to the socket body and to print it. An object of the present invention is to provide an IC socket in which contact pins can be easily connected to electrode terminals of a circuit board.

【0005】[0005]

【課題を解決するための手段】上記目的を達成するため
に、本発明によるICソケットは、ソケット本体に固定
された基部と、ICパッケージのリード端子に圧接する
接触部と、基部と接触部の間に形成されたばね部と、基
部から上記接触部とは反対方向に延びた接続端子部とを
有する多数のコンタクトピンを列設して成るICソケッ
トにおいて、上記接続端子部の先端部分を弧状に湾曲さ
せて弾性変形し得るように構成したことを特徴としてい
る。
In order to achieve the above object, an IC socket according to the present invention comprises a base portion fixed to a socket body, a contact portion for press-contacting a lead terminal of an IC package, and a base portion and a contact portion. In an IC socket comprising a plurality of contact pins having a spring portion formed between them and a connection terminal portion extending from a base portion in a direction opposite to the contact portion, the tip portion of the connection terminal portion is formed in an arc shape. It is characterized in that it is configured to be curved and elastically deformable.

【0006】又、本発明によれば、上記構成のICソケ
ットにおいて、ソケット本体と基部との固定は基部端に
形成された円盤部とソケット本体に形成された円弧状凹
陥部とを嵌合させると共に、基部を枠体部でソケット本
体に挾持固定することにより達成するように構成すると
共に、上記基部端から延びた基部の他端部分と前記接続
端子部とにより略J形を形成し、該J形によりソケット
本体を弾性的に抱持するように形成したことを特徴とし
ている。
Further, according to the present invention, in the IC socket having the above structure, the socket body and the base are fixed by fitting the disk portion formed at the end of the base and the arcuate recess formed in the socket body. Along with that, the base is clamped and fixed to the socket body by the frame, and the other end of the base extending from the end of the base and the connection terminal form a substantially J shape. It is characterized in that it is formed so as to elastically hold the socket body by the J-shape.

【0007】[0007]

【発明の実施の形態】以下、本発明の実施形態を図示し
た一実施例に基づき説明する。図1はICソケットの平
面図、図2は図1のII−II線に沿う断面図、図3はソケ
ット本体の基体部の斜視図、図4は基体部に設けられた
コンタクトピン取付け溝部の一部拡大斜視図、図5はソ
ケット本体の枠体部の斜視図、図6は枠体部に設けられ
たコンタクトピン取付け溝部の一部拡大斜視図、図7は
コンタクトピンの拡大側面図、図8はコンタクトピン押
圧部材の作動過程を説明するための拡大図である。
BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described below with reference to an illustrated example. 1 is a plan view of an IC socket, FIG. 2 is a sectional view taken along line II-II of FIG. 1, FIG. 3 is a perspective view of a base portion of a socket body, and FIG. 4 is a contact pin mounting groove portion provided in the base portion. FIG. 5 is a partially enlarged perspective view, FIG. 5 is a perspective view of the frame body portion of the socket body, FIG. 6 is a partially enlarged perspective view of a contact pin mounting groove portion provided in the frame body portion, and FIG. 7 is an enlarged side view of the contact pin. FIG. 8 is an enlarged view for explaining the operation process of the contact pin pressing member.

【0008】図中、1は中央部に段付き開口1aを、下
面周縁に断面円弧状の突提部1bを、四側面に夫々列設
された多数の絶縁リブ1c(図4)を、絶縁リブ1cの
内方端に隣接して起立している壁部1dを、四隅に夫々
穿設された取付け孔1eを夫々有する平面形状が方形の
ソケット本体の基体部で、図4に明示されたように絶縁
リブ1cにより画成される各溝の底は、外方端から内方
へ延びた平坦部1c′と、この平坦部1c′の内方端に
続く円弧状の凹陥部1c″とから成っている。
In the figure, reference numeral 1 denotes a stepped opening 1a in the central portion, a projecting portion 1b having an arcuate cross-section at the peripheral edge of the lower surface, and a large number of insulating ribs 1c (FIG. 4) arranged on each of four side surfaces. A base portion of the socket body having a rectangular planar shape, which has wall portions 1d standing adjacent to the inner ends of the ribs 1c and mounting holes 1e formed at four corners, respectively, is shown in FIG. As described above, the bottom of each groove defined by the insulating rib 1c has a flat portion 1c 'extending inward from the outer end and an arc-shaped recess 1c "continuing from the inner end of the flat portion 1c'. Made of.

【0009】図中、2は基体部1に積み重ねられた時外
形と取付け孔2aが基体部1の外形と取付孔1eに夫々
整合するように形成されていて、基体部1の壁部1dの
外側面に内側面が所定の間隔を置いて体面するように起
立せしめられ、内側に基体部1の絶縁リブ1cに整合す
る多数の絶縁リブ2b(図6)を夫々列設し、頂面両端
部に取付け孔2c,2cを中央部に取付け孔2dを夫々
穿設した壁部2eを夫々形成したソケット本体への枠体
部で、図6に明示されているように絶縁リブ2bにより
画成される各溝の底は、壁部2eの内側面から内部に向
う湾曲部2b′と、この湾曲部の内端に続く垂直部2
b″とから成っている。
In the figure, reference numeral 2 is formed so that the outer shape and the mounting hole 2a are aligned with the outer shape of the base portion 1 and the mounting hole 1e when they are stacked on the base portion 1, respectively. The inner side surface is erected on the outer side surface so as to face the body at a predetermined interval, and a large number of insulating ribs 2b (FIG. 6) aligned with the insulating ribs 1c of the base portion 1 are arranged in a row on the inner side. Is a frame portion to the socket main body in which the mounting holes 2c, 2c are formed in the respective portions and the wall portions 2e are formed in which the mounting holes 2d are formed in the central portion, respectively, and are defined by insulating ribs 2b as shown in FIG. The bottom of each groove formed is a curved portion 2b 'directed from the inner side surface of the wall portion 2e toward the inside, and a vertical portion 2 continuing to the inner end of this curved portion.
It consists of b ″.

【0010】図1,2及び7において、3は燐青銅やベ
リリウム銅等の薄板をプレス加工することにより成形さ
れていて、基体部1の絶縁リブ1cにより画成された溝
底の平坦部1c′及び円弧状凹陥部1c″に夫々挿着さ
れる基部3a及び円盤部3a′と、後述するICパッケ
ージのリード端子に圧接する接触部3bと、基部3aと
接触部3bとの間に形成されていて枠体部2の絶縁リブ
2bにより画成された溝底の湾曲部2b′に当接するば
ね部3cと、脚部の先端部分3d′が弧状に湾曲せしめ
られていて基部3aと協同して略J形を形成する接続端
子部3dとから成るコンタクトピンである。尚、脚部の
先端部分3d′は、図2に明示されているように常態で
基体部1の突堤部1bの円弧面から若干離間した位置で
弧を形成してソケット本体が下方へ押圧されたとき弾性
変形し得るように構成されている。又、上記J形は好ま
しくは接続端子部3dが常態で若干内方へ偏倚するよう
に成形されていて組み込まれたとき円盤部3a′との協
働作用により基体部1の側面部分を弾性的に抱持し、そ
れによりコンタクトピン3が図2に示す状態に仮止めさ
れるようになっている。
In FIGS. 1, 2 and 7, 3 is formed by pressing a thin plate of phosphor bronze, beryllium copper or the like, and is a flat portion 1c of the groove bottom defined by the insulating rib 1c of the base portion 1. Are formed between the base portion 3a and the contact portion 3b, the base portion 3a and the disc portion 3a 'which are respectively inserted into the circular recessed portion 1c "and the arc-shaped recess portion 1c", the contact portion 3b which is in pressure contact with a lead terminal of an IC package described later. And the spring portion 3c abutting on the curved portion 2b 'of the groove bottom defined by the insulating rib 2b of the frame body portion 2 and the tip portion 3d' of the leg portion are curved in an arc shape and cooperate with the base portion 3a. And a connection terminal portion 3d that forms a substantially J-shape.The tip end portion 3d 'of the leg portion is an arc of the jetty portion 1b of the base portion 1 in the normal state as shown in FIG. An arc is formed at a position slightly separated from the surface The J-shape is incorporated so that the connecting terminal portion 3d is preferably formed so as to be slightly biased inward in the normal state. At this time, the side portion of the base portion 1 is elastically held by the cooperative action with the disc portion 3a ', whereby the contact pin 3 is temporarily fixed in the state shown in FIG.

【0011】図1及び2において、4は基体部1の壁部
1dにより画成された方形のスペース内に上下動可能に
収容されていて、図示しない周知の係止機構により上方
移動が図2に示す位置に限定され、且つICパッケージ
を載置するための載置台4aと、ICパッケージの装填
時ICパッケージを載置台4a内へ導くため四隅に立説
されたガイド用突起4bと、中央部に形成された開口4
cとを有するフローティング部材、5は基体部1とフロ
ーティング部材4との間に介装されていてフローティン
グ部材4を上方へ弾圧するスプリング、6は枠体部2の
各壁部2e上に配設されていて、長手方向両端部に形成
された一対の突起6b(一方のみ図示)を取付け孔2
c,2cに、中央部に設けられた固定ピン6aを取付け
孔2dに夫々スナップフィット式に嵌着することにより
取付けられ、且つ開口端が閉じる方向に弾機習性が付与
されている断面形状が横U字状をなす板ばね、7は各板
ばね6内に挿通されていて押圧縁7aと両端面から突出
したロッド部7bを有する横断面の輪郭が板ばね6の内
側形状に類似した形状を有する押圧部材、Pは四辺に多
数のリード端子Lを有するICパッケージである。
In FIGS. 1 and 2, reference numeral 4 is vertically movably housed in a rectangular space defined by a wall portion 1d of a base portion 1, and is moved upward by a well-known locking mechanism (not shown). A mounting table 4a for mounting the IC package, a guide projection 4b set at four corners for guiding the IC package into the mounting table 4a when the IC package is loaded, and a central portion. Opening 4 formed in
c is a floating member, 5 is a spring interposed between the base member 1 and the floating member 4 and elastically presses the floating member 4 upward, and 6 is provided on each wall 2e of the frame body 2. And a pair of protrusions 6b (only one is shown) formed at both ends in the longitudinal direction are attached to the mounting hole 2
The fixing pin 6a provided at the central portion is attached to each of the c and 2c by snap-fitting in the attachment hole 2d, and the cross-sectional shape that gives the habit of ammunition in the direction in which the opening end is closed. A horizontal U-shaped leaf spring, 7 is inserted into each leaf spring 6 and has a pressing edge 7a and rod portions 7b protruding from both end faces, and a cross-sectional contour similar to the inner shape of the leaf spring 6. And P is an IC package having a large number of lead terminals L on four sides.

【0012】尚、板ばね6は、図8に示したように、押
圧部材7が適宜の手段で実線位置(常態位置)から鎖線
位置へ押し出される時には、押圧縁7aがフローティン
グ部材4の載置台4a上に載置されたICパッケージP
のリード端子Lを上方よりコンタクトピン3の接触部3
bへ向けて押圧し、それによってフローティング部材4
を下降させながらリード端子Lとコンタクトピン3の適
正な接圧が得られるような位置まで弾圧誘導し、又、そ
の位置(鎖線位置)から適宜の手段で実線位置まで移動
させられる時は迅速且つ適確に実線位置へ誘導し得るよ
うに、押圧部材7との相対的形状が選定されている。
As shown in FIG. 8, in the leaf spring 6, when the pressing member 7 is pushed out from the solid line position (normal position) to the chain line position by an appropriate means, the pressing edge 7a is placed on the mounting table of the floating member 4. IC package P mounted on 4a
The lead terminal L of the contact pin 3 from above
pressing towards b, thereby floating member 4
While lowering, the elastic force is induced to a position where an appropriate contact pressure between the lead terminal L and the contact pin 3 is obtained, and when it is moved from that position (chain line position) to the solid line position by appropriate means, The relative shape to the pressing member 7 is selected so that the solid line position can be accurately guided.

【0013】次に、上記ICソケットの組立て及びプリ
ント回路基板への取付け方法の一例について説明する。
先ず、基体部1にコンタクトピン3を列設する。この場
合、コンタクトピン3を絶縁リブ1cにより画成された
溝内へ外部側方より円盤部3a′から基部3aを一杯に
押し込めれば、接続端子部3dの先端部分3d′は若干
広がりながら基体部1の突堤部1bを乗り越えて若干隙
間をあけた状態で密着すると同時に、円盤部3a′は円
弧状凹陥部1c″に嵌入して、コンタクトピン3は基体
部1に仮固定される。
Next, an example of a method of assembling the IC socket and attaching it to the printed circuit board will be described.
First, the contact pins 3 are provided in a row on the base portion 1. In this case, when the contact pin 3 is fully pushed from the outside into the groove defined by the insulating rib 1c from the disk portion 3a 'to the base portion 3a, the tip portion 3d' of the connection terminal portion 3d is slightly expanded and the base body is slightly expanded. The disk portion 3a 'is fitted into the arcuate recessed portion 1c "and the contact pin 3 is temporarily fixed to the base body portion 1 at the same time when the disk portion 3a' is fitted over the jetty portion 1b of the portion 1 with a slight clearance.

【0014】次に、コンタクトピン3のばね部3cを絶
縁リブ2aにより画成された溝内へ各々挿入させながら
枠体部2を基体部1上に重ね、孔2a及び1eを通して
貫通孔を有するリベットを挿入し、かしめることにより
相互に一体化する。これにより、各コンタクトピン3は
基部3aが基体部1と枠体部2に挾持されて固定され
る。その後、リベットの貫通孔を介して図示しないプリ
ント回路基板に設けられた取付け孔とに共通に上方より
図示しないボルトを通してねじ止めすることにより、基
体部1と枠体部2はプリント回路基板と共に一体化され
る。この時、各コンタクトピン3の接続端子部3dの先
端部分3d′は適正な圧接力をもって対応するプリント
回路基板の電極端子に接触し、プリント回路基板との電
気的接続が行われる。
Next, the frame portion 2 is superposed on the base portion 1 while inserting the spring portions 3c of the contact pins 3 into the grooves defined by the insulating ribs 2a, and the through holes are provided through the holes 2a and 1e. The rivets are inserted and caulked to integrate them. As a result, the base 3a of each contact pin 3 is clamped and fixed by the base 1 and the frame 2. Thereafter, the base portion 1 and the frame portion 2 are integrated with the printed circuit board by screwing a bolt (not shown) from above in common with a mounting hole provided in the printed circuit board (not shown) through the through hole of the rivet. Be converted. At this time, the tip portion 3d 'of the connection terminal portion 3d of each contact pin 3 comes into contact with the corresponding electrode terminal of the printed circuit board with an appropriate pressure contact force, and electrical connection with the printed circuit board is performed.

【0015】次に、板ばね6内に押圧部材7を組み込ん
だ状態で、突起6bを取付け孔2cにまた固定ピン6a
を取付け孔2dに夫々圧入することによって、板ばね6
は押圧部材7と共に枠体部2に取付けられる。次に、ス
プリング5を基体部1との間に介在させた状態で、フロ
ーティング部材4を一定範囲を上下に動きうる図示しな
いフック部を基体部に係止させて、基体部1に取付ける
ことにより、ICソケットの組立てとICソケットのプ
リント回路基板上への取付けが完了する。以上説明した
組立て順序は単なる一例であって、これに限定されるも
のではない。
Next, with the pressing member 7 incorporated in the leaf spring 6, the projection 6b is inserted in the mounting hole 2c and the fixing pin 6a is formed.
The plate springs 6 are
Is attached to the frame portion 2 together with the pressing member 7. Next, with the spring 5 interposed between the base member 1 and the floating member 4, the hook member (not shown) that can move up and down within a certain range is locked to the base member 1 and attached to the base member 1. The assembly of the IC socket and the mounting of the IC socket on the printed circuit board are completed. The assembly order described above is merely an example, and the present invention is not limited to this.

【0016】次に、このICソケットの使用方法につい
て説明する。ICパッケージPを装填する場合は、フロ
ーティング部材4の載置台4a内へ上方よりICパッケ
ージPを置けば、該ICパッケージの各コーナーは各ガ
イド用突起4bに案内されて、載置台4a上の正規の位
置に載置される。この状態で、各ロッド部7bを介して
押圧部材7を板ばね6の弾圧力に抗して夫々所定量だけ
内方へ移動させれば、各押圧部材7は各板ばね6に誘導
されて図8に鎖線で示す位置まで進出し、各押圧縁7a
はICパッケージPの各列にあるリード端子Lを対応す
るコンタクトピンの接触部3bに押し付けて、両者を確
実に電気的に接続させる。この接続状態は、板ばね6の
押圧力と各コンタクトピン3のばね部3cの弾性変形に
よる反力とにより適正に維持される。
Next, a method of using this IC socket will be described. When the IC package P is loaded, if the IC package P is placed in the mounting table 4a of the floating member 4 from above, each corner of the IC package is guided by each of the guide protrusions 4b, and the regular position on the mounting table 4a is obtained. Placed in the position. In this state, if the pressing members 7 are moved inward by a predetermined amount against the elastic force of the leaf springs 6 via the rod portions 7b, the pressing members 7 are guided by the leaf springs 6. Each pressing edge 7a is advanced to the position shown by the chain line in FIG.
Presses the lead terminals L in each row of the IC package P against the contact portions 3b of the corresponding contact pins to surely electrically connect them. This connection state is appropriately maintained by the pressing force of the leaf spring 6 and the reaction force due to the elastic deformation of the spring portion 3c of each contact pin 3.

【0017】ICパッケージPを取り出す場合は、各ロ
ッド部7bを介して各押圧部材7を各板ばね6の弾圧力
に抗して夫々外方へ移動させて、図2に示す位置へ持ち
来たせばよい。各押圧部材7の移動は、図8に破線で示
した如き各ロッド部7bに摺接するカム面Cを有する上
下可動な適宜の治具等を用いれば、一斉に行うことがで
きる。
When the IC package P is taken out, each pressing member 7 is moved outwardly against the elastic force of each leaf spring 6 via each rod portion 7b and brought to the position shown in FIG. You can do it. The pressing members 7 can be moved all at once by using an appropriate vertically movable jig or the like having a cam surface C that is in sliding contact with each rod portion 7b as shown by the broken line in FIG.

【0018】[0018]

【発明の効果】上述の如く本発明によれば、ソケット本
体をプリント回路基板に取付けることによりコンタクト
ピンをプリント回路基板の電極端子に適度な接圧力で接
触させることができるから、コンタクトピンと電極端子
との半田付けが不要となり、半田付け設備が不要になる
という利点がある。従って、ICソケットに不良品が発
生したような場合でも、容易にICソケットの変換を行
うことができ、またICソケットの不良発生時やICソ
ケットの寿命によるICソケットの交換時にも、プリン
ト回路基板の再使用が可能であるという利点もある。
As described above, according to the present invention, the contact pin can be brought into contact with the electrode terminal of the printed circuit board with an appropriate contact pressure by mounting the socket body on the printed circuit board. There is an advantage in that the soldering with and the need for soldering equipment are unnecessary. Therefore, even if a defective product is generated in the IC socket, the IC socket can be easily converted, and the printed circuit board can be replaced even when the IC socket has a defect or when the IC socket is replaced due to the life of the IC socket. There is also an advantage that it can be reused.

【0019】更に本発明によれば、コンタクトピンがソ
ケット本体の一部を弾性的に抱持するように形成されて
いるから、コンタクトピンのソケット本体への組み込み
が仮止めすることで容易に行われ得るという利点があ
る。
Further, according to the present invention, since the contact pin is formed so as to elastically hold a part of the socket body, the contact pin can be easily assembled by temporarily fixing it to the socket body. There is an advantage that it can be broken.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明に係るICソケットの一実施例の平面図
である。
FIG. 1 is a plan view of an embodiment of an IC socket according to the present invention.

【図2】図1のII−II線に沿う断面図である。FIG. 2 is a sectional view taken along the line II-II in FIG.

【図3】図1に示したICソケットの基体部の斜視図で
ある。
FIG. 3 is a perspective view of a base portion of the IC socket shown in FIG.

【図4】基体部に設けられたコンタクトピン取付け溝部
の一部拡大斜視図である。
FIG. 4 is a partially enlarged perspective view of a contact pin mounting groove portion provided in a base portion.

【図5】図1に示したICソケットの枠体部の斜視図で
ある。
5 is a perspective view of a frame body portion of the IC socket shown in FIG.

【図6】枠体部に設けられたコンタクトピン取付け溝部
の一部拡大斜視図である。
FIG. 6 is a partially enlarged perspective view of a contact pin attachment groove portion provided in the frame body portion.

【図7】コンタクトピンの拡大側面図である。FIG. 7 is an enlarged side view of a contact pin.

【図8】コンタクトピン押圧部材の作動過程を説明する
ための拡大図である。
FIG. 8 is an enlarged view for explaining the operation process of the contact pin pressing member.

【符号の説明】[Explanation of symbols]

1 ソケット本体の基体部 1a 段付き開口 1b 突堤部 1c,2b 絶縁リブ 1c′ 平坦部 1c″ 凹陥部 1d,2e 壁部 1e,2a,2c,2d 取付け孔 2 枠体部 2b′ 湾曲部 2b″ 垂直部 3 コンタクトピン 3a 基部 3a′ 円盤部 3b 接触部 3c ばね部 3d 端子部 3d′ 脚部の先端部分 4 フローティング部材 4a 載置台 4b ガイド用突起 4c 開口 5 スプリング 6 板ばね 6a 突起 6b 固定ピン 7 押圧部材 7a 押圧縁 7b ロッド部 P ICパッケージ L リード端子 DESCRIPTION OF SYMBOLS 1 Base part of socket body 1a Stepped opening 1b Jetty part 1c, 2b Insulation rib 1c 'Flat part 1c "Recessed part 1d, 2e Wall part 1e, 2a, 2c, 2d Mounting hole 2 Frame part 2b' Curved part 2b" Vertical part 3 Contact pin 3a Base part 3a 'Disc part 3b Contact part 3c Spring part 3d Terminal part 3d' Leg tip part 4 Floating member 4a Mounting table 4b Guide protrusion 4c Opening 5 Spring 6 Leaf spring 6a Protrusion 6b Fixing pin 7 Pressing member 7a Pressing edge 7b Rod part PIC package L Lead terminal

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 ソケット本体に固定された基部と、IC
パッケージのリード端子に圧接する接触部と、前記基部
と接触部の間に形成されたばね部と、前記基部から前記
接触部とは反対方向に延びた接続端子部とを有する多数
のコンタクトピンを列設して成るICソケットにおい
て、前記接続端子部の先端部分を弧状に湾曲させて弾性
変形し得るように構成したことを特徴とするICソケッ
ト。
1. A base fixed to a socket body and an IC
A large number of contact pins having a contact portion that is pressed against the lead terminal of the package, a spring portion formed between the base portion and the contact portion, and a connection terminal portion that extends from the base portion in a direction opposite to the contact portion are arranged. An IC socket comprising: an IC socket, wherein a tip end portion of the connection terminal portion is curved in an arc shape and elastically deformable.
【請求項2】 ソケット本体に固定された基部と、IC
パッケージのリード端子に圧接する接触部と、前記基部
と接触部の間に形成されたばね部と、前記基部から前記
接触部とは反対方向に延びた接続端子部とを有する多数
のコンタクトピンを列設して成るICソケットにおい
て、ソケット本体と基部との固定は、基部端に形成され
た円盤部とソケット本体に形成された円弧状凹陥部とを
嵌合させると共に、基部を枠体部でソケット本体に挾持
固定することにより達成するように構成すると共に、前
記基部と前記接続端子部とにより略J形を形成し、該J
形によりソケット本体を弾性的に抱持するように構成し
たことを特徴とするICソケット。
2. A base fixed to a socket body and an IC
A large number of contact pins having a contact portion that is pressed against the lead terminal of the package, a spring portion formed between the base portion and the contact portion, and a connection terminal portion that extends from the base portion in a direction opposite to the contact portion are arranged. In an IC socket that is provided, the socket body and the base are fixed to each other by fitting a disk portion formed at the end of the base and an arcuate recess formed in the socket body, and by connecting the base portion to the socket by the frame body portion. This is achieved by sandwiching and fixing it to the main body, and a substantially J-shape is formed by the base portion and the connection terminal portion.
An IC socket characterized in that the socket body is elastically held by a shape.
JP05758396A 1996-03-14 1996-03-14 IC socket Expired - Fee Related JP3763156B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP05758396A JP3763156B2 (en) 1996-03-14 1996-03-14 IC socket

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP05758396A JP3763156B2 (en) 1996-03-14 1996-03-14 IC socket

Publications (2)

Publication Number Publication Date
JPH09251883A true JPH09251883A (en) 1997-09-22
JP3763156B2 JP3763156B2 (en) 2006-04-05

Family

ID=13059882

Family Applications (1)

Application Number Title Priority Date Filing Date
JP05758396A Expired - Fee Related JP3763156B2 (en) 1996-03-14 1996-03-14 IC socket

Country Status (1)

Country Link
JP (1) JP3763156B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112803110A (en) * 2021-01-15 2021-05-14 张木念 Unmanned aerial vehicle battery compartment convenient to replace and replacing method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112803110A (en) * 2021-01-15 2021-05-14 张木念 Unmanned aerial vehicle battery compartment convenient to replace and replacing method thereof
CN112803110B (en) * 2021-01-15 2022-10-18 国网福建省电力有限公司莆田供电公司 Unmanned aerial vehicle battery compartment convenient to replace and replacing method thereof

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