JPH09251053A - Semiconductor testing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide the semiconductor testing device, which can terminate a high-speed, small-amplitude interface IC with resistors in two directions of the input/output and can measure the IC, by securing a region, wherein a plurality of coaxial cables and resistors are mounted, without deteriorating electric characteristics and without enlarging the outer shape of a socket board. SOLUTION: This semiconductor testing device has a socket board 3,a printed board 6, a resistor 7 and coaxial cables 4. On the socket board 3, an IC socket 2 for mounting a device to be measured l is mounted. Furthermore, the printed board 6 is fixed to the socket board 3 by a conductive fixing pin 8, which is connected to the device to be measured l through the IC socket 2. Furthermore, on the printed board 6, the resistor 7 and a plurality of the coaxial cables 4 are mounted. The resistor 7 is connected to the conductive fixing pin 8. A plurality of the coaxial cables 4 are connected to the resistor 7 and a terminating circuit T contained in a test head 5.

Description

Detailed Description of the Invention

[0001]

The present invention relates to a semiconductor test apparatus,
In particular, the present invention relates to a semiconductor test device for measuring the quality of a high speed small amplitude interface bus IC.

[0002]

2. Description of the Related Art Generally, a semiconductor test apparatus has a structure shown in FIG. In FIG. 4, reference numeral 1 is a device under test, 2 is an IC socket, 3 is a socket board, 4
Is a coaxial cable, 5 is a test head, and 53 is a test board.

A test board 53 including a socket board 3 is provided on the test head 5, and the device under test 1 is mounted on the test board 53 via the IC socket 2 and the test board 53. Within
As shown, the coaxial cable 4 extends.

With this configuration, signals are transmitted and received through the coaxial cable 4, and the device under test 1 is measured by the measurement circuit such as the pin electronics card that constitutes the termination circuit T.

In this case, an example of the prior art of the test board 53 has the structure shown in FIG.

In FIG. 5A, one end 4A of the coaxial cable 4 is connected to the IC socket 2 mounted on the socket board 3, and the other end 4B of the coaxial cable 4 is connected to the test head 5. There is.

That is, as shown in the figure, a core wire 4C and a shield wire 4D extend from one end 4A of the coaxial cable 4.

The core wire 4C is connected to the through hole 3c, and the shield wire 4D is connected to the through hole 3a.

The core wire 4C of the coaxial cable 4 is connected to the pin 2A of the IC socket 2 soldered to the through hole 3b via the conductive pattern 9.

On the other hand, the other end 4B of the coaxial cable 4 has a test head 5, more specifically, a terminating circuit T (FIG. 4) in which a core wire (not shown) extending from the other end 4B is built in the test head 5. Via a connector (not shown) or directly.

[0011]

However, FIG. 5 described above is used.
The semiconductor test apparatus shown in (A) has the following problems.

For example, SSTL (Stub Series Terminate)
This is a case where a high-speed small-amplitude interface IC such as d Logic) or GTL (Gunning Transceiver Logic) is measured by resistance termination in both input and output directions.

That is, the high-speed small-amplitude interface I
When measuring C, as shown in FIG. 5B, in order to connect the device under test 1 to the termination circuit T in the test head 5, the coaxial cable 4 is connected to each pin of the device under test 1 in order to connect the device under test 1. It is necessary to connect a plurality of, for example, two.

Further, as shown in FIG. 5B, a resistor RI is provided between the two coaxial cables 4 and the device under test 1.
The resistor 7 having (for example, 50Ω)
Need to be connected in series near.

For this reason, conventionally, the following two methods have been used to mount the two coaxial cables 4 and the single resistor 7 in an area having a fixed size such as the test board 53. was suggested.

The first method is to reduce the outer diameter of the coaxial cable 4, thereby realizing the circuit shown in FIG. 5 (B).

However, this method has a problem in that the amount of attenuation of the coaxial cable 4 becomes large, which causes the electrical characteristics to deteriorate.

The second method is to enlarge the outer shape of the socket board 3 on which the IC socket 2 is mounted, whereby a circuit composed of a plurality of coaxial cables 4 and resistors 7 (FIG. 5B). ) Is intended to be realized.

However, in this method, since the socket board 3 is made large, the semiconductor test apparatus (FIG. 5) is attached to the existing external equipment (for example, the handler which is the supply apparatus of the device under test) whose dimensions are fixed. It is difficult to apply and connect.

An object of the present invention is to secure a region for mounting a plurality of coaxial cables and resistors without deteriorating the electrical characteristics and without enlarging the outer shape of the socket board, thereby achieving a high speed and small amplitude. Interface I
It is an object of the present invention to provide a semiconductor test device capable of measuring C by resistance termination in both input and output directions.

[0021]

In order to solve the above-mentioned problems, according to the present invention, as shown in FIGS. 1, 2 and 3, a lower surface 31 of a socket board 3 is provided with a conductive fixing pin 8.
The printed circuit board 6 was fixed, and the resistor 7 and the coaxial cable 4 were mounted on the printed circuit board 6.

According to this configuration, the narrow test board 53
By using the printed circuit board 6 inside, a region for mounting a plurality of coaxial cables and resistors can be secured, so that the electrical characteristics are not deteriorated and the outer shape of the socket board is not increased. A high-speed small-amplitude interface IC can now be measured by resistance termination in both input and output directions.

[0023]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the accompanying drawings according to embodiments. 1 is a view showing an embodiment of the present invention, FIG. 2 is a detailed view showing an embodiment of the present invention, and FIG. 3 is a view seen from an arrow III in FIG. The illustrated semiconductor testing device includes a socket board 3, a printed circuit board 6, a resistor 7, and a coaxial cable 4.

The socket board 3 is a test board 5
3 and through holes 3A and 3B are formed respectively.

As shown in the figure, the IC socket 2 is fixed on the socket board 3 by inserting its pins 2A into the through holes 3A and soldering them.
The device under test 1 is attached to the IC socket 2.

The printed board 6 is the socket board 3
The printed circuit board 6 is arranged substantially at right angles to the lower surface 31 (FIG. 1, FIG. 2, FIG. 3), and the printed circuit board 6 has through holes 6A formed in the upper part and through holes 6B, 6C formed in the lower part.

Through hole 6A of the printed circuit board 6
Are formed in the longitudinal direction of the printed circuit board 6 (FIG. 3), the other end 8B of the conductive fixing pin 8 is inserted into each through hole 6A, and one end 8A of the conductive fixing pin 8 is
It is inserted into the through hole 3A of the socket board 3 and soldered.

As shown in FIGS. 1 and 2, the conductive fixing pin 8 is formed in an L shape, for example, and has one end 8A.
Is the pin 2 of the IC socket 2 via the conductive pattern 9.
The other end portion 8B is connected to A, and the other end portion 8B is connected to a resistor 7 described later via the conductive pattern 9.

That is, the conductive fixing pin 8 has a function of mechanically fixing the printed board 6 to the socket board 3 and electrically connecting the same.

A resistor 7 is mounted on the printed circuit board 6, and the resistor 7 is connected to one end 4A of the coaxial cable 4 via a conductive pattern 9 (FIGS. 1 and 2).

That is, the core wire 4C extends from the one end 4A of the coaxial cable 4, and the core wire 4C is inserted into the through hole 6B and soldered, and as shown in FIG. It is connected.

A shielded wire 4D for insulation extends from one end 4A of the coaxial cable 4, and the shielded wire 4D
Are inserted into the through holes 6C and connected to the printed circuit board 6.

On the other hand, the other end 4B of the coaxial cable 4 is connected to the test head 5, more specifically, a core wire (not shown) extending from the other end 4B of the coaxial cable 4 is connected to the test head 5.
Is connected to a terminal circuit T built in the device via a connector (not shown) or directly (FIGS. 3, 4, and 5).
(B)).

Further, the coaxial cable 4 is mounted on the opposite side of the printed circuit board 6 in the same configuration as described above (FIGS. 1 and 2), and the circuit shown in FIG. 5B is realized.

In the prior art, there are a plurality of coaxial cables 4 for each pin 1A of the device under test 1, but in this embodiment, there are two (4) (FIG. 1, FIG. 2, FIG. 5B). .

Further, in the present invention, it is premised that the outer diameter of the coaxial cable 4 is not made small and the outer shape of the socket board 3 is not made large. Therefore, as shown in FIG.
There may be no room in the mounting area on the printed circuit board 6 for the resistor 7.

In this case, as shown in FIG.
However, they are arranged so as to meander in the vertical direction (arrow A), and are mounted in a zigzag arrangement, so to speak.

However, if the mounting area on the printed circuit board 6 has a margin, the resistors 7 can be arranged in a horizontal row at the same height position without meandering.

As shown in FIG. 1, a plurality of printed circuit boards 6 in which the mounting areas of the coaxial cable 4 and the resistor 7 are secured are provided for one device under test 1 as shown in FIG. Each pin 1A of No. 1 is connected to the termination circuit T built in the test head 5 according to the circuit shown in FIG. 5B, and the high speed small amplitude interface IC can be measured.

The operation of the semiconductor test apparatus having the above structure will be described below.

As described above, on the lower surface 31 of the socket board 3, for example, two printed circuit boards 6 are provided for one device under test 1 by the conductive fixing pins 8.

Further, for example, two coaxial cables 4 are mounted on each side of each printed circuit board 6 for each pin 1A of the device under test 1 and for each coaxial cable 4. One resistor 7 is mounted.

In this way, the resistor 7 mounted on the printed board 6 and the device under test 1 mounted on the socket board 3 via the IC socket 2 are electrically conductive pattern 9 and conductively fixed. The resistors 7 mounted on the printed circuit board 6 and the coaxial cables 4 are connected by the pins 8 (FIG. 1), and the coaxial cable 4 is connected to the lower part of the printed circuit board 6 by the conductive pattern 9. It is connected to a termination circuit T built in the test head 5.

In this way, the printed board 6 is provided in the test board 53 interposed between the socket board 3 and the test head 5, and the area for mounting the coaxial cable 4 and the resistor 7 is secured, so that the high speed small size can be achieved. A circuit (Fig. 5 (B)) that can measure the amplitude interface IC by resistance termination in both input and output directions has been realized.

[0045]

According to the present invention, the printed board is provided on the lower surface of the socket board, and the area for mounting a plurality of coaxial cables and resistors for each pin of the device under test can be secured on the printed board. There is an effect that the high-speed small-amplitude interface IC can be resistance-terminated in both input and output directions and measured without deteriorating the electrical characteristics and without enlarging the outer shape of the socket board.

[0046]

[Brief description of drawings]

FIG. 1 is a diagram showing an embodiment of the present invention.

FIG. 2 is a detailed diagram showing an embodiment of the present invention.

FIG. 3 is a view seen from an arrow III in FIG.

FIG. 4 is a general explanatory view of a semiconductor test device.

FIG. 5 is an explanatory diagram of a conventional technique.

[Explanation of symbols]

 1 Device under Test 2 IC Socket 3 Socket Board 4 Coaxial Cable 5 Test Head 6 Printed Circuit Board 7 Resistor 8 Conductive Fixing Pin 9 Conductive Pattern T Termination Circuit

Claims (3)

[Claims] 1. A semiconductor test apparatus comprising a socket board (3) on which an IC socket (2) for mounting a device under test (1) is mounted, and a test head (5) containing a termination circuit (T). In the printed board (6) fixed to the socket board (3) by the conductive fixing pin (8) connected to the IC socket (2), and mounted on the printed board (6). A resistor (7) connected to the conductive fixing pin (8) and a resistor (7) mounted on the printed circuit board (6) and connected to the resistor (7) and the test head (5). A semiconductor test apparatus comprising a plurality of coaxial cables (4). 2. One end (8) of the conductive fixing pin (8)
A) is connected to the pin (2A) of the IC socket (2) by the conductive pattern (9), and the other end (8B) is
The semiconductor test device according to claim 1, wherein the semiconductor test device is connected to the resistor (7) by a conductive pattern (9). 3. Each pin (1A) of the device under test (1)
On the other hand, two coaxial cables (4) are mounted on both surfaces of the printed circuit board (6), and one end portion (4A) of each coaxial cable (4) is connected to the resistor (7) by the conductive pattern (9). The semiconductor test apparatus according to claim 1, which is connected to the.