JPH09246658A - Optical source device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a low-cost high-accuracy optical source device having a small number of components which have no fear of positional deviation at assembling and allows a collimater lens to be adhered with photosetting adhesives. SOLUTION: This device comprises a base 3 having a fitting hole 3a, a semiconductor laser 2 fitted into the hole 3a at the back of the base, a collimater lens 4 coaxially held at the front of a through-hole to the optical, axis of the laser 2, and an aperture member 5 to shape a laser beam emitted from the lens 4. A lens support 3d having a circular arc-like section having a slightly larger diameter than the outer diameter of the lens 4 is formed in one body with the base so as to locate at the front of the hole 3a coaxially to the optical axis of the laser 2 and the lens 4 is fixed to the support 3d with an ultraviolet- setting type adhesive 8. A nonadhered part G1 is formed between the lens 4 and base wall.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light source device using a semiconductor laser used in a digital copying machine, a laser printer or the like.

[0002]

2. Description of the Related Art A light source device using a semiconductor laser is required to have, as optical characteristics, the directionality (optical axis characteristic) of laser light emitted from the light source device and the parallelism (collimation characteristic) of a light beam. For this reason, the light source device normally adjusts the relative position of the light emitting point of the semiconductor laser and the collimator lens in the three-axis (x, y, z) directions, and the positional accuracy is required to be micron or less. ing. Therefore, in the light source device having the semiconductor laser and the collimator lens, the light source device must have a structure capable of adjusting the position in the three axial directions and fixing at the adjusted position.

When the collimator lens is fixed with an adhesive, the adhesive shrinks at the time of curing, so that it is ideal to minimize the adverse effect on the optical characteristics due to the shrinkage. In particular, in the light source device, since the required accuracy in the z direction (optical axis direction) is high, it is desirable to configure the light source device so that the contraction direction does not occur in the z axis direction. Therefore, the adhesive layer is usually set in a direction substantially parallel to the optical axis (direction parallel to the z-axis), and in other axial directions (x, y directions) as well, in order to facilitate adjustment, It is desirable that the contraction direction be one direction of the x axis or the y axis.

FIG. 11 shows a conventional light source device (Japanese Patent Laid-Open No. 5-8).
No. 8061). This light source device was previously filed by the present applicant, and as shown in the figure, a semiconductor laser 103 for irradiating laser light is press-fitted and fixed in a stepped hole 102 provided in a base 101 as a holding member. ing. Base 101 with two screws 104, 104
The flange 105 attached to the stepped hole 102
A fitting hole 106 is formed at a position opposed to the fitting hole 106.
An inlet portion 106a having a large diameter of about mm is formed.

A cylindrical lens holder 107 is fitted into the fitting hole 106 with a clearance of about 0.01 to 0.03 mm from the fitting hole 106, and a laser is inserted in the lens holder 107. A collimator lens 108 for converting light into parallel light flux is held.

On the other hand, the guide pin 111 protruding from the end face of the base 101 is fitted into the positioning hole 110 formed in the printed circuit board 109.
The base 101 and the printed circuit board 109 are fixed by heat-melting the tip portion of 11 and crushing it as shown by an imaginary line. The lead wire 112 of the semiconductor laser 103 is passed through a lead wire insertion hole formed in the printed board 109,
Soldered to a conductive pattern for wiring on the back side of the printed board.

The flange 105 is the semiconductor laser 10
After adjusting the positions in the x and y directions so that the light emitting points of 3 coincide with the optical axis of the collimator lens 108, they are fixed to the base 101 by the screws 104.

Flange 1 attached to base 101
A notch 113 connected to the inlet 106a is formed at 05, and after the lens holder 107 is adjusted in the z direction so that the light source position of the semiconductor laser 103 coincides with the focal position of the collimator lens 108, the notch 113 is formed. Part 11
By injecting the adhesive from 3 and allowing it to penetrate inside,
The lens holder 107 is fixed to the flange 105.

The aperture forming member 114 is a shield cap for taking out and shaping a parallel light beam in the vicinity of the central portion of the light beam transmitted through the collimator lens 108, and an aperture 114a having a light beam selecting hole and a flange 105. Has a projection 114b for fitting into the flange 105. By fitting the projection 114b into the notch 113 of the flange 105, the aperture forming member 114 is fixed to the flange 105.

When the light source device is attached to a main body of a digital copying machine or a laser printer, a plane 105a perpendicular to the optical axis of the flange 105 serves as a reference plane, and the optical characteristics are adjusted with reference to the plane 105a.

[0011]

However, the above-mentioned conventional light source device has the following problems. (1) Since the adjusting unit in the x and y directions (the adjusting unit for the optical axis characteristic) and the adjusting unit in the z direction (the collimating characteristic, that is, the adjusting unit for the focus direction) have different structures, they are components of the light source device. The number of points is large, and the cost of the product is high.

(2) Since the screw 104 is tightened and the flange 105 is fixed to the base 101 after adjusting in the x and y directions, the base 10 is tightened when the screw 104 is tightened.
By the engagement of the screw seat on the end face of 1 and the flange 105,
There is a case where misalignment occurs in the x and y directions, and the accuracy of the laser directionality (optical axis characteristic) may be reduced.

(3) Semiconductor laser 10 used in the light source device
The laser light of No. 3 has a certain spread, and not all the laser light is incident on the collimator lens 108. The semiconductor laser has a legal standard from the viewpoint of safety for the human body, and it is desirable that the laser light does not leak outside the optical axis direction. This is the same not only during use but also during adjustment in the manufacturing process, and the flange 105 and the base 101 need to be made of a material that prevents laser light from leaking to the outside.

On the other hand, as the adhesive used for fixing the lens holder 107, an ultraviolet curable adhesive which can be arbitrarily cured in a short time is advantageous in shortening the production tact and is excellent in reliability. However, when the base 101 and the flange 105 are made of a material through which ultraviolet rays do not pass, as in the light source device of the prior application, even if the ultraviolet rays are radiated through the gap filled with the ultraviolet curable adhesive, the filled adhesive is Irradiation cannot be performed evenly on the entire surface, resulting in uneven curing and uncured portions. For this reason, distortion due to curing shrinkage acts unevenly, causing problems such as displacement of the lens holder 107 and cracking of component members.

A material that does not transmit laser light such as infrared rays or red light emitted from the laser light source 103 does not transmit ultraviolet light having a shorter wavelength than that. Therefore, if only ultraviolet rays are to be transmitted, a special filter must be added or a special coating must be applied to the flange 105 itself, resulting in a significant increase in cost. Therefore, it was not possible to use an ultraviolet curable adhesive as an adhesive for fixing the collimator lens 108.

(4) Since the adhesive layer exists on the entire circumferential surface of the lens holder 107, that is, in all the x and y directions, the curing and shrinking directions of the adhesive in the x and y directions are not fixed, and the positions in the x and y directions are not determined. Accuracy will vary. To ensure positional accuracy after bonding, it is necessary to offset the initial position in anticipation of a certain amount of shrinkage. However, if the shrinkage direction of the adhesive layer is not constant, it is difficult to give an offset, Accuracy (optical axis characteristics) may be reduced.

(5) Since the adhesive flows in through the notch 113, it is possible to partially solidify and shrink during the inflow process.
Due to the variation of the inflowing manner, distortion occurs in the optical axis direction (z direction), and the positional accuracy varies.

The present invention has been made in order to solve the above-mentioned problems, and the number of constituent parts is small, there is no risk of misalignment during assembly, and the collimator lens uses a photo-curing adhesive. It is an object of the present invention to provide an inexpensive and highly accurate light source device that can be bonded by bonding.

[0019]

In order to solve the above problems, the present invention employs the following means. That is,
According to a first aspect of the present invention, there is provided a base having a fitting hole penetrating through the front and back surfaces, a semiconductor laser located on the back surface side of the base and fitted into the fitting hole, and a through hole of the base surface side of the through hole. A collimator lens positioned on the front surface and coaxially held with the optical axis of the semiconductor laser; and an aperture forming member that shapes the laser light emitted from the collimator lens,
A lens support portion having an arcuate cross-section slightly larger in diameter than the outer circumference circle of the collimator lens is formed integrally with the base in front of the fitting hole so as to be concentric with the optical axis of the semiconductor laser, The collimator lens is adhered and fixed on the lens supporting portion having an arcuate cross section by using a photo-curing adhesive, and at least a non-adhesive portion is provided between the collimator lens adhesively fixed to the lens supporting portion and the base wall surface. It is characterized by being formed.

According to a second aspect of the present invention, in the first aspect of the invention, the non-adhesive portion is formed by an annular recess formed concentrically with the fitting hole on the base wall surface. It is a thing.

A third aspect of the invention is characterized in that, in the first aspect of the invention, the non-bonded portion is formed by a concave groove having a groove width larger than the lens thickness of the collimator lens. is there.

A fourth aspect of the invention is characterized in that, in the first aspect of the invention, the non-bonded portion is formed by a convex base portion having a length substantially equal to the lens thickness of the collimator lens. It is a thing.

The invention according to claim 5 is the same as claims 1 to 4.
In any one of the above aspects, a non-adhesive portion is also formed between the collimator lens and the tip edge of the lens support portion.

In the case of the above structure, the number of constituent parts of the light source device can be reduced, so that the structure is simplified and the positional accuracy can be improved. Further, in the manufacturing thereof, it is possible to directly irradiate a curing light beam from above the collimator lens toward the adhesive layer for curing. Further, since the lens supporting portion is formed concentrically with the optical axis of the semiconductor laser, the adhesive layer formed between the collimator lens and the lens supporting portion has a uniform thickness. Therefore, the entire surface of the adhesive layer is solidified uniformly, so that there is no unevenness in curing,
The displacement of the collimator lens is prevented.

Further, since the direction of curing shrinkage comes out,
The initial position of the collimator lens can be offset by allowing for a certain amount of shrinkage, and the position accuracy after curing can be improved. Furthermore, the irradiation of the curing light from above the collimator lens becomes easy, and uneven curing is further eliminated.

Further, distortion due to curing shrinkage in the left-right direction (x direction) is symmetrically offset and cancels out, and the direction of curing shrinkage is limited to one direction in the up-down direction (y direction). Is further improved, and the position can be adjusted with higher accuracy.

Further, due to the existence of the non-bonded portion formed between the base wall surface and the collimator lens, even if a large amount of adhesive is filled, the protruding adhesive directly adheres to the base wall surface. Disappears, the optical axis direction (z-axis direction) due to the adhesive that adheres to the wall surface of the base and solidifies
No strong curing shrinkage force acts on the collimator lens.

[0028]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. 1 to 4 show an example of the light source device of the present invention. 1A is a vertical sectional view of a light source device, FIG. 1B is an enlarged sectional view of a lens supporting portion, FIG. 2 is an exploded perspective view thereof, FIG. 3 is a schematic front view of a collimator and a lens supporting portion, and FIG. 4 is a schematic vertical sectional view of a collimator lens and a lens supporting portion.

In FIGS. 1 and 2, 1 is a printed circuit board, 2 is a semiconductor laser, 3 is a base serving as a holding member for the semiconductor laser 2, 4 is a collimator lens, and 5 is an aperture forming member. The base 3 is made of a material that does not transmit infrared laser light (eg, 780 nm) emitted from the semiconductor laser 2 and light having a shorter wavelength. The semiconductor laser 2 is press-fitted and fixed from the back surface side of the base into a stepped fitting hole 3a which is formed substantially at the center of the base 3 and penetrates the front and back surfaces.

Two spacers 3 are provided on the back side of the base 3.
b, 3b are formed, and screw holes 3c, 3c for fixing the printed board are formed in the spacers 3b, 3b. Two through holes 1a, 1a are formed in the printed circuit board 1 at positions facing the screw holes 3c, and a screw 6 is screwed into the screw holes 3c through the through holes 1a, whereby the base 3 The printed circuit board 1 is fixed.
The screw hole 3c may be a round hole without a screw groove, and the screw 6 may be a tapping screw.

The three lead wires 2a of the semiconductor laser 2 are
It is inserted into each of the three lead wire insertion holes 1b formed in the printed circuit board 109, and is soldered to a conductive pattern for wiring on the back surface side of the printed circuit board.

In order to directly adhere and fix the collimator lens 4 to the base 3, the base 3 is located on the front side of the fitting hole 3a and has a diameter slightly larger than the outer circumference circle of the collimator lens 4 ( A lens support portion 3d having an arcuate cross section is integrally formed concentrically with the optical axis of the semiconductor laser 2.

The dimension of the lens support portion 3d in the optical axis direction (z direction) is, as will be described later in detail, even when the adhesive 8 is excessively filled, the protruding adhesive adheres to other portions. Non-adhesive portion G1 for preventing
The length is set so that G2 can be formed. Further, the shape of the lens support portion 3d when viewed from the front side is a semicircle or less and a circular arc cross section. From the viewpoint of easiness of position adjustment and bonding work, it is desirable to have a symmetrical arcuate cross section opened at about 60 ° as shown in FIG.

The collimator lens 4 is made of a material capable of transmitting ultraviolet rays. Plastic lenses and glass lenses are conceivable as lenses of such a material,
A glass lens having excellent optical characteristics is more desirable. When assembling the collimator lens 4, as shown in FIG. 3, the collimator lens 4 is held by chucks 7, 7 whose positions can be adjusted in the three-axis (x, y, z) directions, and the light of the semiconductor laser 2 is placed on the lens supporting portion 3d. It is arranged concentrically with the axis.

Then, after the ultraviolet curable adhesive 8 is filled in the gap formed between the adhesive surface 3e of the lens supporting portion 3d and the outer peripheral surface of the collimator lens 4, the optical characteristics are measured by an inspection device (not shown). The position of the collimator lens 4 is finely adjusted during inspection, and when the position where the desired optical characteristics are obtained is determined, the chucks 7, 7 are fixed at the position, and the position shown in FIG.
Further, as shown in FIG. 4, the ultraviolet ray L is irradiated from above the collimator lens 4 toward the adhesive 8 by the ultraviolet ray irradiator 9.

Ultraviolet rays L emitted from the ultraviolet ray irradiator 9
Is transmitted through the collimator lens 4 and irradiated onto the adhesive 8 portion, and uniformly cures the entire adhesive 8. Therefore,
Between the adhesive surface 3e of the lens support portion 3d and the collimator lens 4, an adhesive layer having a uniform thickness and a symmetrical thickness is formed, and the collimator lens 4 is formed by the adhesive layer. It is fixed on the supporting portion 3d while maintaining a predetermined optical characteristic.

In particular, as shown in FIG. 3, the lens support 3
When d has a symmetrical arcuate cross section opened to about 60 °, the chucks 7, 7 can easily and reliably support the collimator lens 4, and the ultraviolet irradiator 9 can be used.
It is possible to uniformly irradiate the entire surface of the adhesive surface 3e with the ultraviolet light L emitted from the through the collimator lens 4, and it is possible to evenly and completely cure the adhesive. For this reason,
A completely solidified and uniform adhesive layer can be obtained, and it is possible to eliminate the occurrence of uneven curing and displacement of the collimator lens 4 due to the uncured portion.

The distortion due to the curing shrinkage of the adhesive is x
The directions (horizontal direction) are symmetrically generated and thus cancel each other out, and are limited to only one direction of the y direction (vertical direction). Therefore, it is possible to slightly offset the y-direction position of the collimator lens 4 before curing in consideration of this shrinkage amount, and the accuracy of the optical characteristics after fixing the collimator lens 4 is improved.

An annular recess 3k having a diameter larger than that of the collimator lens 4 is formed concentrically with the fitting hole 3b on the end face of the circular step 3h formed on the base of the lens support 3d. The depth of the annular recess 3k is such that the protruding adhesive 8 does not adhere to the surface of the circular stepped portion 3h that is the base wall surface even if the amount of the adhesive 8 applied varies and the skirt of the adhesive layer expands. The non-bonded portion G1 is formed between the collimator lens 4 and the surface of the circular step portion 3h which is the depth of the base wall surface. Also, the tip edge side of the lens support portion 3d is sufficiently extended forward of the lens surface of the collimator lens 4 so that the protruding adhesive 8 does not wrap around to the tip edge of the lens support portion 3d and drip. Cage, lens support 3d
A non-bonded portion G2 is formed between the front edge of the collimator lens 4 and the collimator lens 4.

When the non-adhesive portions G1 and G2 are formed before and after the collimator lens 4 as described above, as shown in FIG. 5, even if the application amount varies and a large amount of the adhesive 8 is filled, the adhesive is adhered. Round step 3h where agent 8 is the base wall
Adheres to the surface of the lens and solidifies, or the lens support 3
It is prevented from solidifying in a state of being hung from the tip edge of d. Therefore, the circular step portion 3h that is the base wall surface
The curing shrinkage force in the optical axis direction (z-axis direction) due to the adhesive that sticks to the surface of the lens and solidifies, or the adhesive that wraps around the tip edge of the lens support portion 3d and solidifies.
It is possible to improve the positional accuracy in the optical axis direction since it does not directly act on.

If the non-adhesive portions G1 and G2 do not exist, as shown in FIG. 6, when a large amount of the adhesive 8 is filled, the adhesive 8 is applied to the surface of the circular step portion 3h which is the base wall surface. It will be solidified when it adheres to the. In addition, the lens supporting portion 3d is solidified in a sagging state around the tip edge of the lens supporting portion 3d. Therefore, the curing shrinkage force in the optical axis direction (z-axis direction) due to the adhesive 8 that sticks out and adheres directly acts on the collimator lens 4, causing the collimator lens 4 to be displaced.

As can be seen from FIG. 6, the curing shrinkage force in the optical axis direction (z direction) of the adhesive that adheres and solidifies on the surface of the circular step portion 3h that is the base wall surface is the collimator lens 4.
Since it acts directly and perpendicularly on the lens surface of, it becomes an extremely large force. On the other hand, the adhesive that wraps around the tip edge of the lens support 3d and solidifies is
Since it hardly hangs downward at the tip edge of and sticks directly to the lens surface, the strength is not so great as compared with an adhesive that sticks to the surface of the circular step 3h that is the base wall surface and solidifies. Therefore, the non-bonded portion G2 formed on the tip side of the lens support portion 3d can be omitted depending on the accuracy required of the light source device.

The aperture forming member 5 includes an aperture 5
a and two protrusions 5b, 5b for fixing to the base 3,
Two arcuate grooves 3g, 3g for alignment are formed. Then, after the adhesive fixing of the collimator lens 4 is completed as described above, the aperture forming member 5
The two circular arc-shaped projections 5c and 5c are provided on the circumferential surface of the circular step portion 3h formed at the base of the lens support portion 3d.
g and 3g are aligned and made to face each other, and in this state, the aperture forming member 5 is pushed toward the base 3 side. As a result, the two protrusions 5 of the aperture forming member 5 are
b and 5b are two notches 3f and 3 on the circumferential surface of the circular step 3h.
The aperture forming member 5 is fixed to the circular step portion 3h.

The two elongated holes 3i, 3i formed at the left and right ends of the base 3 are attachment holes for attaching the light source device to a digital copying machine or a laser printer body. In this attachment, the vertical plane 3j on the front surface side of the base 3 and the outer peripheral surface of the circular step portion 3h serve as a reference plane for alignment.

FIG. 7 shows a second structural example of the non-bonded portions G1 and G2. In this example, the distance between the surface of the circular step portion 3h and the collimator lens 4 and the tip edge of the lens support portion 3d are simply irrespective of the annular recess 3k formed on the end surface of the circular step portion 3h described above. The distance between the collimator lens 4 and the collimator lens 4 is increased. With this configuration, the structure can be the simplest.

FIG. 8 shows a third structural example of the non-bonded portions G1 and G2. This example is a modification of FIG. 7, in which a barrier 3m is formed at the tip edge of the adhesive surface 3e of the lens support 3d. As a result, the excess adhesive is removed from the lens supporting portion 3d.
No more spilling from the tip edge of the to the outside and hardening.

FIG. 9 shows a fourth structural example of the non-bonded portions G1 and G2. In this example, a convex base 3n having substantially the same width as the lens thickness of the collimator lens 4 is formed on the bonding surface 3e of the lens support 3d, and the collimator lens 4 is bonded and fixed on the convex base 3n. It was done. With such a configuration, even if a large amount of the adhesive 8 is filled, the leaked excess adhesive is absorbed by the left and right steps of the convex base 3n. Therefore, even if a large amount of the adhesive 8 is filled, the solidifying shrinkage force of the adhesive 8 does not directly act on the lens surface unless the adhesive 8 is accumulated to a height higher than the lower edge of the collimator lens 4. .

FIG. 10 shows a fifth structural example of the non-bonded portions G1 and G2. This example is a modification of FIG. 9, in which a barrier 3m similar to that of FIG. 8 is formed at the tip edge of the lens support portion 3d. This prevents the adhesive 8 from spilling outside from the tip edge of the lens supporting portion 3d and hardening.

In the example described above, the UV-curing type adhesive is used, but not limited to the UV-curing type adhesive, any photo-curing type adhesive can be used.

[0050]

As described above, according to the first to fourth aspects of the present invention, the base having the fitting hole penetrating the front and back and the fitting hole located on the back side of the base are fitted. Semiconductor laser, a collimator lens located on the base surface side and in front of the through hole and coaxially held with the optical axis of the semiconductor laser, and an aperture formation for shaping the laser light emitted from the collimator lens. And a member,
A lens support portion having an arcuate cross-section slightly larger in diameter than the outer circumference circle of the collimator lens is formed integrally with the base in front of the fitting hole so as to be concentric with the optical axis of the semiconductor laser, The collimator lens is adhered and fixed on the lens support portion having an arcuate cross section by using a photo-curing adhesive, and various shapes are formed at least between the collimator lens adhered and fixed to the lens support portion and the base wall surface. Since the non-adhesive part is formed, the following (1) to (5)
It has the excellent effect described in 1.

(1) Since the collimator lens is directly fixed to the lens supporting portion integrally formed with the base, the number of parts of the light source device can be reduced and the light source device can be provided at a low cost. it can.

(2) Further, since the collimator lens is directly fixed to the lens supporting portion integrally formed on the base, the tightening portion such as the screw is eliminated, and the displacement of the parts at the time of tightening is eliminated, and the high precision is achieved. The light source device can be provided.

(3) The collimator lens can be adhered and fixed by using a photo-curing adhesive even though the semiconductor laser light does not leak outside except in the optical axis direction.

(4) Since the collimator lens is adhered and fixed on the lens supporting portion having an arc-shaped cross section by using a photo-curing adhesive, the collimator lens is cured from above the collimator lens toward the adhesive layer during its manufacture. The adhesive can be cured by directly irradiating a working light. Further, since the lens supporting portion is formed concentrically with the optical axis of the semiconductor laser, the adhesive layer formed between the lens supporting portion and the collimator lens can have a uniform thickness. Therefore, it is possible to provide a high-quality light source device in which the entire surface of the adhesive layer is uniformly solidified and curing unevenness is eliminated, and the collimator lens is not displaced due to curing shrinkage.

(5) Due to the existence of the non-adhesive portion formed between the base wall surface and the collimator lens, even if a large amount of adhesive is filled, the protruding adhesive will directly adhere to the base wall surface. The strong curing shrinkage force in the optical axis direction (z-axis direction) due to the adhesive adhered to the base wall surface and solidified does not act on the collimator lens. For this reason, the positional accuracy in the optical axis direction can be improved.

According to the invention described in claim 5,
Since the non-adhesive portion is also formed between the collimator lens and the leading edge of the lens supporting portion, in addition to the effects of the invention described in claims 1 to 4, the adhesive agent wraps around the leading edge of the lens supporting portion 3d. It is also possible to eliminate solidification and to further improve the positional accuracy in the optical axis direction.

[Brief description of drawings]

FIG. 1 shows an example of a light source device according to the present invention (A)
Is a vertical sectional view thereof, and (B) is an enlarged sectional view of a lens supporting portion.

FIG. 2 is an exploded perspective view of the light source device of FIG.

FIG. 3 is a schematic front view of a collimator lens and a lens support portion.

FIG. 4 is a schematic vertical sectional view of a collimator lens and a lens support portion.

FIG. 5 is an explanatory view of the action of a non-adhesive portion.

FIG. 6 is an explanatory view of the operation when there is no non-adhesive portion.

FIG. 7 is a schematic vertical sectional view showing a second structural example of the non-adhesive portion.

FIG. 8 is a schematic vertical cross-sectional view showing a third structural example of the non-bonded portion.

FIG. 9 is a schematic vertical sectional view showing a fourth structural example of the non-bonded portion.

FIG. 10 is a schematic vertical cross-sectional view showing a fifth structural example of the non-bonded portion.

FIG. 11 is a vertical cross-sectional view of a conventional light source device.

[Explanation of symbols]

 1 Printed Circuit Board 1b Lead Wire Insertion Hole 2 Semiconductor Laser 2a Lead Wire 3 Base 3a Fitting Hole 3b Spacer 3c Screw Hole 3d Lens Support 3e Adhesive Surface 3f Cutout 3g Circular Groove 3h Circular Step 3i Long Hole 3j Vertical Plane 3k Annular recess 3m Barrier 3n Convex base 4 Collimator lens 5 Aperture forming member 5a Aperture 5b Protrusion 5c Arc-shaped protrusion 6 Screw 7 Chuck 8 UV-curable adhesive G1 Non-adhesive G2 Non-adhesive L L UV

Claims (5)

[Claims] 1. A base having a fitting hole penetrating through the front and back surfaces, a semiconductor laser located on the back surface side of the base and fitted into the fitting hole, and a base surface surface side and a front surface of the through hole. And a collimator lens that is held coaxially with the optical axis of the semiconductor laser, and an aperture forming member that shapes the laser light emitted from the collimator lens. The cross section having a diameter slightly larger than the outer circumference circle of the collimator lens. An arc-shaped lens supporting portion is located integrally with the base in front of the fitting hole so as to be concentric with the optical axis of the semiconductor laser, and the collimator lens is mounted on the lens supporting portion having an arc-shaped cross section. The present invention is characterized in that it is adhesively fixed using a curable adhesive and that a non-adhesive portion is formed at least between the collimator lens adhesively fixed to the lens support portion and the base wall surface. Light source device. 2. The light source device according to claim 1, wherein the non-adhesive portion is formed by an annular recess formed concentrically with the fitting hole on the base wall surface. 3. The light source device according to claim 1, wherein the non-bonded portion is formed by a concave groove having a groove width larger than the lens thickness of the collimator lens. 4. The light source device according to claim 1, wherein the non-bonded portion is formed by a convex base portion having a length substantially the same as the lens thickness of the collimator lens. 5. The light source device according to claim 1, wherein a non-adhesive portion is also formed between the collimator lens and a tip edge of the lens support portion.