JPH09246600A - Light-emitting diode unit of optical transmitter - Google Patents
Light-emitting diode unit of optical transmitterInfo
- Publication number
- JPH09246600A JPH09246600A JP8047240A JP4724096A JPH09246600A JP H09246600 A JPH09246600 A JP H09246600A JP 8047240 A JP8047240 A JP 8047240A JP 4724096 A JP4724096 A JP 4724096A JP H09246600 A JPH09246600 A JP H09246600A
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting diode
- optical transmitter
- resin
- diode unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、光空間伝送に用い
る光送信機に係り、特に、その発光ダイオードユニット
に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical transmitter used for optical space transmission, and more particularly to a light emitting diode unit thereof.
【０００２】[0002]
【従来の技術】従来、このような分野の先行技術として
は、例えば、以下に示すようなものがあった。図５はか
かる従来の光送信機の外観を示す図である。この図に示
すように、樹脂封止発光ダイオード３が、光送信機筐体
１前面のＬＥＤ配列板２上に複数個（数十個）取り付け
られている。2. Description of the Related Art Conventionally, as prior arts in such a field, there have been the followings, for example. FIG. 5 is a diagram showing the appearance of such a conventional optical transmitter. As shown in this figure, a plurality (tens of pieces) of resin-sealed light emitting diodes 3 are mounted on the LED array plate 2 on the front surface of the optical transmitter housing 1.
【０００３】図６は従来の光送信機の樹脂封止型発光ダ
イオードの構成図、図７はその樹脂封止型発光ダイオー
ドの配置図である。図６に示すように、発光チップ４が
リフレクタ５を有するリードフレーム６ａ上にダイスボ
ンドされ、発光チップ４上面の電極から、もう一方のリ
ードフレーム６ｂに、金線７がワイヤボンドされ、周囲
を樹脂８により封止され、レンズ９が一体成形されてい
る。FIG. 6 is a block diagram of a resin-sealed light emitting diode of a conventional optical transmitter, and FIG. 7 is a layout of the resin-sealed light emitting diode. As shown in FIG. 6, the light emitting chip 4 is die-bonded onto the lead frame 6a having the reflector 5, and the gold wire 7 is wire-bonded from the electrode on the upper surface of the light emitting chip 4 to the other lead frame 6b to surround it. The lens 9 is sealed with a resin 8 and integrally molded.
【０００４】図７に示すように、樹脂封止型発光ダイオ
ード３は、その中の金線７が、全て同一方向で且つ水平
方向を向くように、ＬＥＤ配列板２上に配列されてい
る。As shown in FIG. 7, the resin-sealed light emitting diode 3 is arranged on the LED array plate 2 so that the gold wires 7 therein are all in the same direction and in the horizontal direction.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、上記し
た図６に示した樹脂封止型発光ダイオード３は、金線７
が発光チップ４及びリフレクタ５上を横切る構造となっ
ている。このため樹脂封止型発光ダイオード３の図６中
ｘ軸（水平）方向の樹脂封止型発光ダイオード−ディテ
クタ間の距離が数十ｍｍ以上における指向特性は、図８
に示すように、金線７による相対放射強度比の悪化が現
れ、左右非対称な特性となる。なお、図８において、横
軸は指向角度（度）、縦軸は相対放射強度（％）を示し
ている。However, the resin-sealed light emitting diode 3 shown in FIG.
Has a structure crossing over the light emitting chip 4 and the reflector 5. Therefore, the directional characteristics of the resin-sealed light-emitting diode 3 when the distance between the resin-sealed light-emitting diode and the detector in the x-axis (horizontal) direction in FIG.
As shown in, the deterioration of the relative radiant intensity ratio due to the gold wire 7 appears and the characteristic becomes asymmetrical. In FIG. 8, the horizontal axis represents the directivity angle (degree) and the vertical axis represents the relative radiation intensity (%).
【０００６】光送信機において、複数個の樹脂封止型発
光ダイオード３が配列された場合の、光送信機の水平方
向の指向特性も、送信機−ディテクタ間の距離が数ｍ以
上では図８の樹脂封止型発光ダイオード３単体の指向特
性と同様となる。このような指向特性を有する光送信機
を車両対車両等の移動体間の通信に用いた場合、各車両
は水平である道路上を走行しており、図９に示すよう
に、Ａ車とＢ車及びＣ車間の通信は可能であるが、Ｄ車
との通信が、不可能となり、前方（あるいは後方）左右
の通信可能距離の不均一性が起こるという問題点があっ
た。In the optical transmitter, when a plurality of resin-sealed light emitting diodes 3 are arranged, the horizontal directional characteristic of the optical transmitter is also shown in FIG. 8 when the distance between the transmitter and the detector is several meters or more. This is the same as the directional characteristics of the resin-sealed light emitting diode 3 alone. When an optical transmitter having such directional characteristics is used for communication between moving bodies such as vehicle-to-vehicle, each vehicle is traveling on a horizontal road, and as shown in FIG. Although communication between vehicles B and C is possible, communication with vehicle D is not possible, and there is a problem in that the communicable distance between the front (or rear) left and right sides is uneven.
【０００７】本発明は、上記問題点を除去し、車両対車
両等の移動体間の通信にあたり、どの方向にある車両と
も確実な通信を行うことができる光送信機の発光ダイオ
ードユニットを提供することを目的とする。The present invention eliminates the above problems and provides a light emitting diode unit of an optical transmitter capable of performing reliable communication with a vehicle in any direction in communication between moving bodies such as vehicle-to-vehicle. The purpose is to
【０００８】[0008]
【課題を解決するための手段】本発明は、上記目的を達
成するために、 〔１〕光空間伝送に用いられる光送信機の発光ダイオー
ドユニットにおいて、一方のリードフレーム上にダイス
ボンドされる発光チップと、この発光チップの前面と他
方のリードフレームとを接続するワイヤと、封止され、
レンズが設けられる発光ダイオードを備え、前記ワイヤ
の配線方向が光の放射方向に対して鉛直方向になるよう
に配置するようにしたものである。In order to achieve the above object, the present invention [1] In a light emitting diode unit of an optical transmitter used for optical space transmission, light emission which is die-bonded on one lead frame. A chip and a wire connecting the front surface of the light emitting chip and the other lead frame are sealed,
A light emitting diode provided with a lens is provided, and the wires are arranged such that the wiring direction is perpendicular to the light emission direction.
【０００９】〔２〕上記〔１〕記載の光送信機の発光ダ
イオードユニットにおいて、前記鉛直方向が全て上向き
になるようにしたものである。 〔３〕上記〔１〕記載の光送信機の発光ダイオードユニ
ットにおいて、前記鉛直方向が全て下向きになるように
したものである。 〔４〕上記〔１〕記載の光送信機の発光ダイオードユニ
ットにおいて、前記鉛直方向が上向き又は下向きになる
ようにしたものである。[2] In the light emitting diode unit of the optical transmitter described in the above [1], all the vertical directions are upward. [3] In the light emitting diode unit of the optical transmitter according to the above [1], the vertical direction is entirely downward. [4] The light emitting diode unit of the optical transmitter according to the above [1], wherein the vertical direction is upward or downward.
【００１０】本発明によれば、上記のように構成したの
で、車両対車両等の移動体間の通信にあたり、光送信機
の指向特性は良好になり、どの方向にある車両でも車両
間における確実な通信を行うことができる。According to the present invention, since it is configured as described above, the directional characteristic of the optical transmitter becomes good in communication between moving bodies such as vehicle-to-vehicle, and the vehicle-to-vehicle communication in any direction can be reliably performed. Communication can be performed.
【００１１】[0011]
【発明の実施の形態】以下、本発明の実施の形態につい
て図面を参照しながら説明する。図１は本発明の第１実
施例を示す光送信機の樹脂封止型発光ダイオードが配置
された発光ダイオードユニットの構成図、図２は本発明
の第２実施例を示す光送信機の樹脂封止型発光ダイオー
ドが配置された発光ダイオードユニットの構成図、図３
は本発明の第３実施例を示す光送信機の樹脂封止型発光
ダイオードが配置された発光ダイオードユニットの構成
図であり、それぞれ光送信機のＬＥＤ配列板を正面から
見た図である。Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a configuration diagram of a light emitting diode unit in which a resin-sealed light emitting diode of an optical transmitter showing a first embodiment of the present invention is arranged, and FIG. 2 is a resin of an optical transmitter showing a second embodiment of the present invention. FIG. 3 is a configuration diagram of a light emitting diode unit in which a sealed light emitting diode is arranged.
FIG. 6 is a configuration diagram of a light emitting diode unit in which a resin-sealed light emitting diode of an optical transmitter according to a third embodiment of the present invention is arranged, and is a view of an LED array plate of the optical transmitter as viewed from the front.
【００１２】第１実施例においては、図１に示すよう
に、発光チップ１４がリフレクタ１５を有するリードフ
レーム１６ａ上にダイスボンドされ、発光チップ１４上
面の電極から、もう一方のリードフレーム１６ｂに、金
線１７ａがワイヤボンドされ、周囲を樹脂により封止さ
れ、レンズが一体成形されている。樹脂封止型発光ダイ
オード１３は、その中の金線１７ａが全て同一方向、か
つ鉛直方向（ｙ方向）で上向きとなるように配線されて
いる。In the first embodiment, as shown in FIG. 1, the light emitting chip 14 is die-bonded onto the lead frame 16a having the reflector 15, and the electrode on the upper surface of the light emitting chip 14 is connected to the other lead frame 16b. The gold wire 17a is wire-bonded, the periphery is sealed with resin, and the lens is integrally molded. The resin-sealed light emitting diode 13 is wired such that the gold wires 17a therein are all directed in the same direction and upward in the vertical direction (y direction).
【００１３】すなわち、ＬＥＤ配列板１２上の樹脂封止
型発光ダイオード１３がその中の金線１７ａが、全て鉛
直方向（ｙ方向）で上向きとなるように配線されてい
る。また、第２実施例においては、図２に示すように、
金線１７ｂが全て鉛直方向（ｙ方向）下向きとなるよう
に配線されている。更に、第３実施例においては、図３
に示すように、金線１７ａが鉛直方向（ｙ方向）で上向
き、あるいは金線１７ｂが鉛直方向（ｙ方向）で下向き
となるように配列されている。That is, the resin-sealed light emitting diode 13 on the LED array plate 12 is wired such that the gold wires 17a therein are all directed upward in the vertical direction (y direction). Further, in the second embodiment, as shown in FIG.
The gold wires 17b are all arranged so as to face downward in the vertical direction (y direction). Furthermore, in the third embodiment, as shown in FIG.
As shown in, the gold wire 17a is arranged so as to face upward in the vertical direction (y direction), and the gold wire 17b is arranged so as to face downward in the vertical direction (y direction).
【００１４】図１〜図３に示した第１〜第３実施例のよ
うに、樹脂封止型発光ダイオード１３を配列すること
で、水平方向（ｘ方向）の指向特性には、金線１７ａ，
１７ｂが影響しなくなる。このため、図４に示すように
水平方向においては、金線１７ａ，１７ｂによる相対放
射強度の悪化のない、左右対称な指向特性を有する光送
信機を実現することができる。なお、図４において、横
軸は指向角度（度）、縦軸は相対放射強度（％）を示し
ている。By arranging the resin-sealed light-emitting diodes 13 as in the first to third embodiments shown in FIGS. 1 to 3, the directivity characteristic in the horizontal direction (x direction) has a gold wire 17a. ，
17b has no effect. Therefore, as shown in FIG. 4, in the horizontal direction, it is possible to realize an optical transmitter having a symmetrical directional characteristic without the relative emission intensity of the gold wires 17a and 17b being deteriorated. In FIG. 4, the horizontal axis represents the directivity angle (degree) and the vertical axis represents the relative radiation intensity (%).
【００１５】次に、本発明の第４実施例について説明す
る。図１０は本発明の第４実施例を示す光送信機の発光
ダイオードユニットの構成図である。上記第１〜第３実
施例では、光空間伝送に用いられる送信機の構造とし
て、送信機のＬＥＤ配列板に、樹脂封止型発光ダイオー
ドを配列する場合について説明してきた。Next, a fourth embodiment of the present invention will be described. FIG. 10 is a block diagram of a light emitting diode unit of an optical transmitter showing a fourth embodiment of the present invention. In the above first to third embodiments, as the structure of the transmitter used for the optical space transmission, the case where the resin-sealed light emitting diodes are arranged on the LED array plate of the transmitter has been described.
【００１６】この実施例では、発光ダイオードユニット
は、複数個の発光チップ２１を基板２０上に配列し、各
々の発光チップ２１が金線２３でワイヤボンドされ、レ
ンズ付カバー２４で上から覆うようにしたものである。
なお、２２はリフレクタである。また、レンズ付カバー
２４で上から覆う方法に代えて、樹脂封止でレンズを一
体成形した構造にするようにしてもよい。In this embodiment, a light emitting diode unit has a plurality of light emitting chips 21 arranged on a substrate 20, each light emitting chip 21 is wire-bonded with a gold wire 23, and is covered with a lens-equipped cover 24 from above. It is the one.
Reference numeral 22 is a reflector. Further, instead of covering the lens cover 24 from above, the lens may be integrally molded by resin sealing.
【００１７】光空間伝送用の送信機の場合、数個〜数十
個の発光ダイオードを送信機上に配列する。このため、
第１〜第３実施例のように、樹脂封止型発光ダイオード
単体を数十個配列するよりも、第４実施例のように、発
光ダイオードユニットを送信機上に配列する方が、比較
的安価に、且つ、簡便に送信機が構成することができ
る。In the case of a transmitter for free-space optical transmission, several to several tens of light emitting diodes are arranged on the transmitter. For this reason,
It is relatively better to arrange the light emitting diode units on the transmitter as in the fourth embodiment than to arrange dozens of resin-sealed light emitting diodes as in the first to third embodiments. The transmitter can be configured inexpensively and easily.
【００１８】このようなＬＥＤユニットにおいても、当
然、金線２３は全て上向きか、全て下向きに配置するよ
うにする。ところで、車両対車両といった移動体間にお
ける光空間伝送（通信）では、ほとんどの場合、通信対
象同士が同一平面上を平面移動していると考えられる。
このため、この時用いられる光送信機においては、水平
方向の指向特性は通信の品質に大きく影響するが、鉛直
方向の指向特性は、あまり問題とならない。Also in such an LED unit, naturally, all the gold wires 23 are arranged to face upward or all to face downward. By the way, in optical space transmission (communication) between moving bodies such as vehicle-to-vehicle, in most cases, it is considered that communication targets move in a plane on the same plane.
Therefore, in the optical transmitter used at this time, the directional characteristics in the horizontal direction have a great influence on the communication quality, but the directional characteristics in the vertical direction do not pose a problem.
【００１９】したがって、第１〜第３実施例によれば、
全ての樹脂封止型発光ダイオード１３がその中の金線１
７ａが鉛直方向で上向き、あるいは金線１７ｂが鉛直方
向で下向きとなる様に、配列されているので、光送信機
の指向特性は良好になる。この送信機の指向特性によ
り、図９におけるＡ車の前方左側の通信距離が右側と同
等に改善されて、Ａ車Ｄ車間の通信も可能となり、前方
（あるいは後方）左右の通信可能距離の不均一性を解決
することができる。Therefore, according to the first to third embodiments,
All the resin-sealed light emitting diodes 13 are gold wires 1
The optical transmitter has good directional characteristics because the optical transmitters 7a are arranged so as to be vertically upward and the gold wires 17b are vertically downward. Due to the directional characteristics of this transmitter, the communication distance on the front left side of vehicle A in FIG. 9 is improved to the same as the right side, and communication between vehicle A and vehicle D is also possible. Uniformity can be resolved.
【００２０】なお、本発明は上記実施例に限定されるも
のではなく、本発明の趣旨に基づいて種々の変形が可能
であり、これらを本発明の範囲から排除するものではな
い。The present invention is not limited to the above embodiments, and various modifications can be made based on the spirit of the present invention, and these modifications are not excluded from the scope of the present invention.
【００２１】[0021]
【発明の効果】以上、詳細に説明したように、本発明に
よれば、車両対車両等の移動体間の通信にあたり、光送
信機の指向特性は良好になり、どの方向にある車両でも
車両間における確実な通信を行うことができる。As described above in detail, according to the present invention, the directional characteristic of the optical transmitter is improved in the communication between the moving bodies such as the vehicle and the vehicle, and the vehicle in any direction can be used. It is possible to perform reliable communication between them.
【図１】本発明の第１実施例を示す光送信機の樹脂封止
型発光ダイオードが配置された発光ダイオードユニット
の構成図である。FIG. 1 is a configuration diagram of a light emitting diode unit in which a resin-sealed light emitting diode of an optical transmitter according to a first embodiment of the present invention is arranged.
【図２】本発明の第２実施例を示す光送信機の樹脂封止
型発光ダイオードが配置された発光ダイオードユニット
の構成図である。FIG. 2 is a configuration diagram of a light emitting diode unit in which a resin-sealed light emitting diode of an optical transmitter according to a second embodiment of the present invention is arranged.
【図３】本発明の第３実施例を示す光送信機の樹脂封止
型発光ダイオードが配置された発光ダイオードユニット
の構成図である。FIG. 3 is a configuration diagram of a light emitting diode unit in which a resin-sealed light emitting diode of an optical transmitter according to a third embodiment of the present invention is arranged.
【図４】本発明による光送信機のｘ軸（水平）方向の指
向特性図である。FIG. 4 is a directional characteristic diagram of an optical transmitter according to the present invention in an x-axis (horizontal) direction.
【図５】従来の光送信機の外観を示す図である。FIG. 5 is a diagram showing an appearance of a conventional optical transmitter.
【図６】従来の光送信機の樹脂封止型発光ダイオードの
構成図である。FIG. 6 is a configuration diagram of a resin-sealed light emitting diode of a conventional optical transmitter.
【図７】従来の光送信機の樹脂封止型発光ダイオードの
配置図である。FIG. 7 is a layout view of a resin-sealed light emitting diode of a conventional optical transmitter.
【図８】従来の光送信機のｘ軸（水平）方向の指向特性
図である。FIG. 8 is a directional characteristic diagram of an x-axis (horizontal) direction of a conventional optical transmitter.
【図９】車両対車両の移動体間光空間伝送の説明を行う
平面図である。FIG. 9 is a plan view illustrating vehicle-to-vehicle optical space transmission between moving bodies.
【図１０】本発明の第４実施例を示す光送信機の樹脂封
止型発光ダイオードが配置された発光ダイオードユニッ
トの構成図である。FIG. 10 is a configuration diagram of a light emitting diode unit in which a resin-sealed light emitting diode of an optical transmitter according to a fourth embodiment of the present invention is arranged.
１２ ＬＥＤ配列板 １３ 樹脂封止型発光ダイオード １４，２１ 発光チップ １５，２２ リフレクタ １６ａ，１６ｂ リードフレーム １７ａ，１７ｂ，２３ 金線 ２０ 基板 ２４ レンズ付カバー 12 LED array plate 13 Resin-sealed light emitting diode 14,21 Light emitting chip 15,22 Reflectors 16a, 16b Lead frames 17a, 17b, 23 Gold wire 20 Substrate 24 Lens cover
Claims (4)
ダイオードユニットにおいて、（ａ）一方のリードフレ
ーム上にダイスボンドされる発光チップと、（ｂ）該発
光チップの前面と他方のリードフレームとを接続するワ
イヤと、（ｃ）封止され、レンズが設けられる発光ダイ
オードを備え、（ｃ）前記ワイヤの配線方向が光の放射
方向に対して鉛直方向になるように配置してなる光送信
機の発光ダイオードユニット。1. In a light emitting diode unit of an optical transmitter used for optical space transmission, (a) a light emitting chip die-bonded on one lead frame, and (b) a front surface of the light emitting chip and the other lead frame. A light connecting a wire and (c) a light-emitting diode that is sealed and provided with a lens, and (c) is arranged so that the wiring direction of the wire is perpendicular to the light emission direction. Light emitting diode unit of transmitter.
１記載の光送信機の発光ダイオードユニット。2. The light emitting diode unit of an optical transmitter according to claim 1, wherein all of the vertical directions are upward.
１記載の光送信機の発光ダイオードユニット。3. The light emitting diode unit of an optical transmitter according to claim 1, wherein all of the vertical directions are downward.
請求項１記載の光送信機の発光ダイオードユニット。4. The light emitting diode unit of an optical transmitter according to claim 1, wherein the vertical direction is upward or downward.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8047240A JPH09246600A (en) | 1996-03-05 | 1996-03-05 | Light-emitting diode unit of optical transmitter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8047240A JPH09246600A (en) | 1996-03-05 | 1996-03-05 | Light-emitting diode unit of optical transmitter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09246600A true JPH09246600A (en) | 1997-09-19 |
Family
ID=12769705
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8047240A Withdrawn JPH09246600A (en) | 1996-03-05 | 1996-03-05 | Light-emitting diode unit of optical transmitter |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH09246600A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002076440A (en) * | 2000-08-28 | 2002-03-15 | Stanley Electric Co Ltd | Light emitting device and free-space optical transmitter |
| JP2014042154A (en) * | 2012-08-22 | 2014-03-06 | Stanley Electric Co Ltd | Vehicle-to-vehicle optical communication device |
-
1996
- 1996-03-05 JP JP8047240A patent/JPH09246600A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002076440A (en) * | 2000-08-28 | 2002-03-15 | Stanley Electric Co Ltd | Light emitting device and free-space optical transmitter |
| JP2014042154A (en) * | 2012-08-22 | 2014-03-06 | Stanley Electric Co Ltd | Vehicle-to-vehicle optical communication device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Application deemed to be withdrawn because no request for examination was validly filed |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20030506 |