JPH09239936A - Synthetic resin laminated plate, its manufacture and secondary working method of synthetic resin laminated plate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a synthetic resin laminated plate of a polycarbonate resin plate and acrylic resin being superior in quality by inhibiting the occurrence of interlayer separation at bending portions at the time of performing secondary working operation such as bend-processing is carried out to a laminated plate. SOLUTION: The polycarbonate resin substrate 1 is joined with an acrylic reins plate 2 being thinly casting-formed than this via non-yellowing polyurethane adhesive film 3. The laminated plate A is manufactured in a manner holding the adhesive film 3 between the polycarbonate resin substrate 1 and the acrylic resin plate 2, and then vacuum packing and heating it. The secondary working operation such as bend-processing or vacuum air pressure forming is executed by heating up to a temperature not lower than the softening temperature of the polycarbonate resin substrate 1 and a temperature not lower than the softening temperature of the acrylic resin plate 2.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a synthetic resin laminate having a surface hardness enhanced by laminating and integrating an acrylic resin plate on a polycarbonate resin substrate, and a method for producing the same. Further, the present invention relates to a method of secondarily processing the synthetic resin laminate.

[0002]

2. Description of the Related Art A transparent synthetic resin laminated plate having an increased surface hardness is scratch-resistant like a window glass, a mechanical cover, an instrument cover, or a transparent plate having a function of blocking noise of a car or a train. Is used in applications where is required.

Japanese Unexamined Patent Publication No. 4-301448 discloses a synthetic resin transparent laminated plate of this type in which an acrylic resin plate and a polycarbonate resin plate are integrally laminated. The synthetic resin transparent laminated plate described in this publication is a polycarbonate resin plate and an acrylic resin plate bonded to each other by a non-yellowing polyurethane adhesive layer, the polycarbonate resin plate and the acrylic resin plate Plate materials having the same thickness (5 mm, 10 mm, 30 mm) are used. In addition, this synthetic resin transparent laminated plate is obtained by polymerizing a polymer in which a film-shaped non-yellowing polyurethane adhesive layer is sandwiched between a polycarbonate resin plate and an acrylic resin plate in a temperature range of 100 to 150 ° C.
It is said that it is manufactured by hot pressing in a pressure range of -50 kg / cm ² .

[0004]

By the way, in a synthetic resin transparent laminated plate in which a polycarbonate resin plate and an acrylic resin plate are laminated, mechanical strength such as impact resistance is mainly carried by the polycarbonate resin plate, Since the hardness is carried by the acrylic resin plate, if the polycarbonate resin plate and the acrylic resin plate have the same thickness as the synthetic resin transparent laminated plate described in the above publication, If the thickness of the polycarbonate resin plate is increased in order to increase the mechanical strength of the laminated plate, the thickness of the acrylic resin plate is unnecessarily increased correspondingly, which is uneconomical.

Further, the synthetic resin transparent laminated plate described in the above publication is manufactured by hot pressing the polymer at a high pressure of 5 to 50 kg / cm ² , so that it is a large-scale manufacturing facility. However, there is a problem that the manufacturing cost is high.

The present invention has been made in view of the above circumstances and problems, and in a synthetic resin laminated plate in which a polycarbonate resin plate and an acrylic resin plate are laminated and integrated, a substrate having mechanical strength for the polycarbonate resin plate. Acrylic resin plate has a role as a protective layer that imparts physical or chemical properties that are difficult to achieve depending on the polycarbonate resin substrate such as surface hardness. An object is to provide a synthetic resin laminate.

Another object of the present invention is to propose a method for producing a synthetic resin laminated plate, which is capable of producing such a synthetic resin laminated plate in a moderate pressure range.

A further object of the present invention is to propose a method for secondary processing of a synthetic resin laminated plate which is less likely to cause delamination when such a synthetic resin laminated plate is subjected to secondary processing.

[0009]

According to a first aspect of the present invention, there is provided a synthetic resin laminated plate, wherein an acrylic resin plate formed by casting, which is thinner than the substrate, is formed on at least one surface of a polycarbonate resin substrate through an adhesive. Are joined together.

With this structure, even if the polycarbonate resin substrate is made thick to increase the mechanical strength of the laminate, it is necessary to make the acrylic resin plate as thick as the polycarbonate resin substrate. There is no. Therefore, the laminated plate is thin despite its high mechanical strength. Also,
Since the acrylic resin plate is a cast-molded plate material, it is not necessary to include additives such as a rubber component and a stabilizer in the acrylic resin plate, unlike the acrylic resin plate extruded. Therefore, the acrylic resin plate forming the laminate is not only useful for increasing the surface hardness, but also rich in oil resistance and heat resistance, which enhances the oil resistance and heat resistance of the laminate. Be useful.

In such a synthetic resin laminated plate, as in the invention according to claim 2, a non-yellowing polyurethane adhesive film is used as an adhesive, and the melting temperature of this film is softening of the polycarbonate resin substrate. In order to obtain a transparent synthetic resin laminated plate, it is desirable to adopt a structure in which the temperature and the softening temperature of the acrylic resin plate are not exceeded and the structure is transparent.

The use of the non-yellowing polyurethane adhesive film makes it possible to form a transparent laminated plate having good weather resistance, and pressurizes at a temperature at which the polycarbonate resin substrate and the acrylic resin plate are not deformed. The melted, non-yellowing polyurethane adhesive film that can be joined spreads evenly over the entire overlapping surface between the polycarbonate resin substrate and the acrylic resin plate, ensuring that the polycarbonate resin substrate and the acrylic resin plate To be joined.

According to a third aspect of the present invention, there is provided a method for manufacturing a synthetic resin laminated plate, wherein a bag body contains a polymer body having an adhesive film sandwiched between a polycarbonate resin substrate and an acrylic resin plate, and the bag body. Vacuum-packing the polymer in a bag by sucking the inside of the body, by performing the above-mentioned adhesive film by performing in an atmosphere having a temperature higher than the melting temperature of the adhesive film and lower than the softening temperature of the acrylic resin plate. The polycarbonate resin substrate and the acrylic resin plate are bonded to each other via.

According to a fourth aspect of the present invention, there is provided a method for manufacturing a synthetic resin laminated plate, wherein a bag body contains a polymer having an adhesive film sandwiched between a polycarbonate resin substrate and an acrylic resin plate, and the bag is filled with the polymer. Vacuum-packing the polymer in a bag by sucking the inside of the body, by performing the above-mentioned adhesive film by performing in an atmosphere having a temperature higher than the melting temperature of the adhesive film and lower than the softening temperature of the acrylic resin plate. The polycarbonate resin substrate and the acrylic resin plate are bonded to each other via the above to produce a laminated body, and then the laminated body taken out from the bag body is reheated and repressurized.

According to these manufacturing methods, the laminated body vacuum-packed in the bag is pressed under the external atmospheric pressure (about 1 atm (absolute atmospheric pressure)), and by the pressurization, the polycarbonate resin substrate and the acrylic resin are bonded via the adhesive film. Since the system resin plate is joined, the laminated plate can be manufactured without using large-scale equipment such as when performing hot pressing. Then, the air in the gap between the adhesive film and the polycarbonate resin substrate and the acrylic resin plate is removed because of being sucked in a vacuum, so that the air is not trapped inside the laminated plate and the layer is formed during use or during secondary processing. No internal peeling occurs.

However, only by applying a low pressure such as the external pressure, the adhesive force of the melted adhesive film may be insufficient, or air may remain.
In order to prevent such a situation, if the process of reheating and repressurizing the laminate taken out from the bag is performed as in the invention according to claim 4 above, the adhesive force is increased. A synthetic resin laminated plate is manufactured in which residual air is also removed.

According to a fifth aspect of the present invention, there is provided a method for secondary processing of a synthetic resin laminated plate according to the invention, wherein the polycarbonate resin substrate is a synthetic resin laminated plate in which a polycarbonate resin substrate and an acrylic resin plate are laminated. Is heated to a temperature not lower than the softening temperature of the polycarbonate resin substrate, and the acrylic resin plate in the laminate is heated to a temperature lower than the heating temperature of the polycarbonate resin substrate and not lower than the softening temperature of the acrylic resin plate. Then, the secondary processing is performed thereafter. In that case, the polycarbonate resin substrate is heated to 150 to 180 ° C.,
The acrylic resin plate is heated to 100 to 130 ° C. to perform bending or embossing, or the polycarbonate resin substrate is heated to 200 to 230 ° C. to set the acrylic resin plate to 160 ° C.
It is heated to ˜200 ° C. to perform any secondary processing selected from vacuum forming, pressure forming, vacuum pressure forming, and free blow forming.

In these secondary processing methods, the heating temperatures of the polycarbonate resin substrate and the acrylic resin plate are changed to obtain optimum temperatures suitable for various secondary processing. The plate and the plate are processed without difficulty.

According to a sixth aspect of the present invention, there is provided a secondary processing method for a synthetic resin laminated plate in which secondary processing is performed while pressure is applied to both sides of the synthetic resin laminated plate.

In this secondary processing method, since pressure is applied to the processed surface, delamination does not occur at the interface between the polycarbonate resin substrate and the acrylic resin plate during processing.

As the above-mentioned adhesive film, a polyurethane film, an EVA film or a polyolefin hot melt film can be used. Particularly, a polyurethane film is preferably used because it has good transparency and adhesiveness and also has good thermal characteristics. Among them, it is a reaction product of a non-yellowing diisocyanate, a polyether diol and a curing agent. A yellowed polyurethane film can be preferably used.

Non-yellowing diisocyanates include, for example, hexamethylene diisocyanate, tetramethylene diisocyanate, dodecamethylene diisocyanate, 2,
In addition to an aliphatic diisocyanate compound such as 4,4-trimethyl-1,6-hexane diisocyanate, an alicyclic diisocyanate compound, an alicyclic mixed diisocyanate compound or the like can be used.

The polyether diol is a compound in which a monoepoxide having 2 to 4 carbon atoms or tetrahydrofuran is added to two types of initiators. Examples of the curing agent include ethylene glycol, 1,3-propanediol,
In addition to fatty acid diols such as 1,4-butanediol and 1,6-hexanediol, amino alcohols such as monoethanolamine and diamines can be used.

An extruded product can be used for the above-mentioned polycarbonate resin substrate. In addition, casting moldings can be preferably used for the acrylic resin plate.

In the synthetic resin laminate according to the present invention, it is possible to use a polycarbonate resin substrate having a thickness of 1 to 15 mm, and an acrylic resin plate having a thickness smaller than that of the polycarbonate resin substrate. 1 to 8 mm can be used, and when these are used, the inorganic glass (safety glass) used for the purpose of preventing the scattering of cutting powder of machine tools and the inorganic glass for preventing the fall of debris into the inside of construction machines can be used. A synthetic resin laminate as an alternative is obtained.

The softening temperature of the above-mentioned polycarbonate resin substrate or acrylic resin plate is a temperature peculiar to softening of those plate materials, and a load of 181.3 N / cm ² is applied according to ASTM D648. Is the load deflection temperature at that time. The melting temperature of the adhesive film is the temperature at which the adhesive film shows an endothermic reaction when analyzed by a differential thermal analyzer.

[0027]

1 is an enlarged cross-sectional view of a transparent synthetic resin laminate A showing an embodiment of the present invention, 1 is a polycarbonate resin substrate, 2 is an acrylic resin plate, and 3 is non-yellowing. This is a polyurethane adhesive film, and the polycarbonate resin substrate 1 and the acrylic resin plate 2 are integrally joined via a non-yellowing polyurethane adhesive film 3 as an adhesive. The polycarbonate resin substrate 1 is an extrusion molded product, the acrylic resin plate 2 is a cast molded product, and the thickness of the acrylic resin plate 2 is smaller than that of the polycarbonate resin substrate 1.

When the laminated board A is used for the purpose of preventing the scattering of the cutting powder of the machine tool or the purpose of preventing the falling of the debris inside the construction machine, the side of the acrylic resin plate 2 is used for practical purposes (that is, the scattered cutting). Use it on the side where the powder and debris collide).

In the laminated plate A of the illustrated example, the polycarbonate resin substrate 1 has a thickness of 1 to 15 mm and the acrylic resin plate 2 has a thickness of 1 to 8 mm. The former is 6 when it is used as a flat plate such as a viewing window.
~ 15 mm, the latter preferably 3-8 mm,
In addition, it is preferable that the former is 1 to 5 mm and the latter is 1 to 3 mm for applications where secondary processing such as bending and curved surface is required. In addition, non-yellowing polyurethane adhesive film 3
Has a thickness of 0.5 to 1 mm. Since the polycarbonate resin substrate 1, the acrylic resin plate 2, and the non-yellowing polyurethane adhesive film 3 are all colorless and transparent, the laminate A, which is a laminate of them, is colorless and has excellent transparency.

The polycarbonate resin substrate 1 serves to maintain the mechanical strength of the laminated plate A, and the acrylic resin plate 2 serves to increase the surface hardness of the laminated plate A. Even if the resin plate 2 is thinned, the surface hardness of the laminate A does not change. Since the acrylic resin plate 2 is a cast-molded plate material, the acrylic resin plate 2 does not contain additives such as a rubber component and a stabilizer. Therefore, the oil resistance and heat resistance of the laminated plate A on the acrylic resin plate 2 side are improved.

Further, since the polycarbonate resin substrate 1 and the acrylic resin plate 2 are laminated and integrated with the non-yellowing polyurethane adhesive film 3 interposed therebetween, the non-yellowing polyurethane adhesive film 3 has a shock absorbing effect. Not only is it exhibited, but even if the acrylic resin plate 3 is broken, its scattering is prevented.

In this laminated plate A, the melting temperature of the yellow-free modified polyurethane adhesive film 3 is a temperature which does not exceed the softening temperature of the polycarbonate resin substrate 1 and the softening temperature of the acrylic resin plate 2. Examples of the yellowing-free modified polyurethane adhesive film 3 having such a melting temperature include PE199 and PE299 under the trade name of Molton International Co., which have a melting temperature of 100 ° C. or lower.

The laminated plate A can be manufactured as follows. That is, as shown in FIG. 2, a polymerized product B in which a non-yellowing polyurethane-based adhesive film 3 is sandwiched between an extrusion-molded polycarbonate resin substrate 1 and a cast-molded acrylic resin plate 2 in a bag body 5 as shown in FIG. To house. Next, as shown in FIG. 3, in the atmosphere of 80 to 100 ° C., which is a temperature higher than the melting temperature of the yellow-free modified polyurethane-based adhesive film 3 and lower than the softening temperature of the acrylic resin plate 3, as shown in FIG. -600 to -750m inside
The polymer B is bag 5 by suction V to mHg.
Vacuum pack with. By doing so, the non-yellowing polyurethane adhesive film 3 and the polycarbonate resin substrate 1
In addition, the non-yellowing polyurethane adhesive film 3 is melted in a state where the air existing at the interface with the acrylic resin plate 2 is sucked and disappeared, and the polycarbonate resin substrate 1 and the acrylic resin plate 3 are exposed to the atmospheric pressure. (Approximately 1 atmosphere)
Since it is pressed like an arrow, the polycarbonate resin substrate 1 and the acrylic resin plate 2 are bonded to each other with the non-yellowing polyurethane adhesive film 3 interposed therebetween.

Since the laminated plate A thus obtained was only pressed at a low pressure of the outside air pressure, in some cases, the polycarbonate resin substrate 1 and the acrylic resin formed by the melted non-yellowing polyurethane adhesive film 3 and the acrylic resin were used. There is a possibility that the adhesive force with the system resin plate 2 may be insufficient, or compressed air may remain at the interface between them. In such a case, there may occur problems such as delamination of the laminate A or generation of bubbles during the subsequent secondary processing or use.

Therefore, in order to improve the quality of the laminate A, it is desirable to continue the following steps. That is,
By reheating and repressurizing the laminated body A taken out from the bag body 5, the non-yellowing polyurethane adhesive film 3 is melted and a pressure higher than 1 atm is applied to strongly press-bond it. The temperature in this step is substantially the same as the temperature when performing the vacuum packing as described above, and is set to a temperature higher than the melting temperature of the adhesive film 3 and lower than the softening temperature of the acrylic resin plate, and the pressure is set to the outside atmospheric pressure. High pressure, specifically 5 to 1
Set to 5 atm. In this way, the bonding force between the polycarbonate resin substrate 1 and the acrylic resin plate 2 is increased,
Moreover, the air remaining on both interfaces of the yellow-free modified polyurethane-based adhesive film 3 is extruded or crushed to the outside to obtain a laminate without delamination or generation of bubbles.

Here, if the above-mentioned product names PE199 and PE299 manufactured by Molton International Co. are used as the non-yellowing polyurethane adhesive film 3, 1 is obtained.
When a polycarbonate resin substrate and an acrylic resin plate are pressed and bonded in a heating temperature atmosphere of about 00 ° C. or 100 ° C. or less, only a low pressure of external pressure is applied to melt the non-yellowing polyurethane-based polyurethane. The adhesive film 3 is evenly distributed over the entire area between the overlapping surfaces of the polycarbonate resin substrate 1 and the acrylic resin plate 2, and the polycarbonate resin substrate 1 and the acrylic resin plate 2 are reliably joined together, and the transparency is high. The laminated board A is manufactured. Since the laminated board A is obtained by joining the polycarbonate resin substrate 1 and the acrylic resin board 2 at a relatively low temperature of 100 ° C. or lower, even if the two boards have different thermal expansion / contraction rates, The amount of expansion and contraction does not show such a large difference, and the laminated plate A does not deform like one warped.

The above-mentioned laminated plate A is used by being fitted into a peep window of a machine tool, the front and side of a special vehicle, a showcase of precious metal, etc. while it is flat, or is secondarily processed into a predetermined shape, for example, a dish shape. The bent product can be used by inserting it into the view window of the machine tool or the front of the vehicle.

Next, a method capable of suitably performing the secondary processing on the laminated plate A will be described.

When the laminated plate A is subjected to the secondary processing, the polycarbonate resin substrate 1 in the laminated plate A is heated to a temperature not lower than the softening temperature of the polycarbonate resin substrate 1, and the acrylic resin in the laminated plate A is heated. It is necessary to heat the resin plate 2 to a temperature lower than the heating temperature of the polycarbonate resin substrate 1 and not lower than the softening temperature of the acrylic resin plate, and then perform secondary processing.

Thus, the polycarbonate resin substrate 1
By changing the heating temperatures of the acrylic resin plate 2 and the acrylic resin plate 2 and making the temperatures suitable for the two, the secondary processing can be reasonably performed and the laminated plate A can be finished into a desired shape. If pressure is applied from both sides to the portion to be processed of the laminated plate A during the secondary processing, the non-yellowing polyurethane adhesive film 3 between the polycarbonate resin substrate 1 and the acrylic resin plate 2 melts. And peeling is prevented, and generation of bubbles is also suppressed. In secondary processing such as bending or embossing that does not require so much softening, the polycarbonate resin substrate 1 is heated to 150 to 180 ° C.,
Good workability can be obtained by heating the acrylic resin plate 2 to 100 to 130 ° C. Further, in the secondary processing that needs to be sufficiently softened such as vacuum forming, pressure forming, vacuum pressure forming, and free blow forming, the polycarbonate resin substrate 1 is heated to 200 to 230 ° C., and the acrylic resin plate 2 is heated. When heated to 160 to 200 ° C., a good molded product can be obtained. Among the above-mentioned secondary processes, pressure molding, vacuum pressure molding, free blow molding, embossing molding, and bending are preferable molding methods because pressure is applied to the adhesive film 3 during molding.

[0041]

[Experimental Example] Next, an experimental example of secondary processing will be described.

<Experimental Example 1> As shown in FIG. 4, bar heaters 6 and 7 are arranged on both sides of the laminated body A and brought into contact with each other.
7 is heated to heat the polycarbonate resin substrate (thickness 8 mm) and the acrylic resin plate (thickness 3 mm) of the laminated plate A, and then the polycarbonate resin is supported by one heater 6 as shown in FIG. The laminate A was bent on both sides of the heater 6 so that the substrate was on the inside. As a comparative example, an experiment in which the heater was freely bent after heating without supporting the heater was also performed.

Table 1 shows the temperatures of the heated polycarbonate resin substrate (PC plate) and acrylic resin plate (MMA plate), and the bending workability at each temperature and the visual evaluation of the appearance. In Table 1, ◯ in the bending workability and comprehensive evaluation columns indicates “good”, Δ indicates “normal”, × indicates “bad”, and XX indicates “especially bad”. The temperature was measured with a contact thermometer on the surface immediately after removing the heaters 6 and 7 from the laminated plate A.

[0044]

[Table 1]

From Table 1, it is inferred that when the PC plate side is heated to 150 to 180 ° C. and the MMA plate side is heated to 100 to 130 ° C., both bending workability and appearance become practical. In this temperature range, it is found that there is a practical impracticality when the bending workability and the appearance are comprehensively evaluated. Further, referring to Example 6 and the comparative experiment, it can be seen that the bending work in which pressure is applied from both sides to the bent portion exhibits good workability.

<Experimental Example 2> As shown in FIG. 6, heaters 8 and 9 are arranged on both sides of the pre-dried laminate A to heat the laminate A, and the heated laminate A is as shown in FIG. Using a molding facility 10, a polycarbonate resin substrate was vacuum-pressure formed so as to come into contact with the mold. The arrow indicates air.

Table 2 shows the polycarbonate resin substrate (PC plate: thickness 3 mm) and the acrylic resin plate (M
(MA plate: thickness 1.5 mm), and the evaluation of the appearance by visual inspection and the formability of vacuum pressure forming at each heating temperature are shown. In Table 2, ◎ for the column of moldability and comprehensive evaluation
Indicates “especially good”, ◯ indicates “good”, Δ indicates “normal”, × indicates “bad”, and XX indicates “especially bad”.
The temperature was measured with a radiation thermometer on both sides of the laminated plate A immediately after heating.

[0048]

[Table 2]

<Experimental Example 3> Table 3 shows an experimental example in which the laminated plate A used in Example 2 was used and the laminated plate A heated in the same manner was vacuum-formed. Table 3 shows the polycarbonate resin substrate (PC plate) and the acrylic resin plate (M
The temperature of (MA plate) and the evaluation of the formability and visual appearance are shown.

[0050]

[Table 3]

From Tables 2 and 3, 200 to 23 on the PC board side.
When heated to 0 ° C. and the MMA plate side is heated to 160 to 200 ° C., it is assumed that the moldability and the appearance both become practical, and outside this temperature range, the bending workability and the appearance are It turns out that there is a practical impossibility when comprehensively evaluated.
Then, comparing Tables 2 and 3, it can be seen that the vacuum forming is slightly inferior to the vacuum pressure forming in formability. It is presumed that this is because the pressure was applied to the front and back of the laminated plate A in the vacuum pressure forming, so that the adhesive was pressed and the generation of bubbles was suppressed.

[0052]

EFFECTS OF THE INVENTION The synthetic resin laminate according to the present invention can reduce the total thickness by reducing the thickness of the acrylic resin plate even if the thickness of the polycarbonate resin substrate is increased to enhance the mechanical strength. Therefore, it can be used as an inexpensive substitute for the inorganic safety glass that has been conventionally used to prevent scattering of cutting powder of machine tools. In addition, since the acrylic resin plate is a casting molded product that does not contain additives such as rubber components and stabilizers, it will be rich in oil resistance and heat resistance by using the acrylic resin plate side as a practical surface. , Useful as an alternative to the above. And
In the case where a yellowing-free polyurethane adhesive film having a melting temperature of 100 ° C. or less is used as an adhesive, the entire area between the overlapping surfaces of the polycarbonate resin substrate and the acrylic resin plate is uniformly covered by the yellowing-free polyurethane intermediate layer. Since it is securely bonded without any intervening, there is an advantage that delamination with time does not easily occur.

According to the method for producing a synthetic resin laminate according to the present invention, the laminate can be economically and efficiently produced without using a large-scale facility such as when performing hot pressing.

According to the secondary processing method for a synthetic resin laminated plate of the present invention, the polycarbonate resin substrate and the acrylic resin plate are heated to temperatures suitable for the secondary processing, so that they can be processed without difficulty, and bubbles and peeling can be achieved. There is an effect that it does not occur. When the secondary processing is performed by a method that does not require so much softening, such as bending and embossing, the polycarbonate resin substrate is 150 to 180.
By heating the acrylic resin plate to 100 ° C. to 130 ° C., good moldability without bubbles or peeling can be ensured. If a method that requires sufficient softening, such as vacuum forming, pressure forming, vacuum pressure forming, or free blow forming, is adopted, a polycarbonate resin substrate is used.
Acrylic resin plate 160-200 at 00-230 ° C
By heating to ℃, it is possible to ensure moldability that does not cause the generation of bubbles and cracks that are sufficiently adhered to the mold.

[Brief description of drawings]

FIG. 1 is an enlarged cross-sectional view of a synthetic resin laminated plate showing an embodiment of the present invention.

FIG. 2 is an explanatory view showing an initial step of a method for manufacturing a synthetic resin laminate according to the present invention.

FIG. 3 is an explanatory view showing the final step of the method for producing a synthetic resin laminate according to the present invention.

FIG. 4 is an explanatory diagram of a preheating stage of a bending method as a secondary processing method according to the present invention.

FIG. 5 is an explanatory diagram of a bending method as a secondary processing method according to the present invention.

FIG. 6 is an explanatory diagram of a preheating stage of a vacuum pressure forming method as a secondary processing method according to the present invention.

FIG. 7 is an explanatory diagram of a vacuum pressure forming method as a secondary processing method according to the present invention.

[Explanation of symbols]

 A Synthetic resin laminated plate 1 Polycarbonate resin substrate 2 Acrylic resin plate 3 Yellow-free denatured polyurethane adhesive film 5 Bag body

Claims (8)

[Claims] 1. A synthetic resin laminate comprising a polycarbonate resin substrate and an acrylic resin plate, which is thinner than the substrate and formed by casting, bonded to at least one surface of the substrate through an adhesive. 2. A non-yellowing polyurethane-based adhesive film is used as an adhesive, and the film has a melting temperature not exceeding the softening temperature of the polycarbonate resin substrate and the softening temperature of the acrylic resin plate and is transparent. Item 2. A synthetic resin laminate according to item 1. 3. A bag containing a polymer having an adhesive film sandwiched between a polycarbonate resin substrate and an acrylic resin plate, and sucking the inside of the bag to bag the polymer. The polycarbonate resin substrate and the acrylic resin plate are bonded via the adhesive film by performing vacuum packing with the body in an atmosphere having a temperature higher than the melting temperature of the adhesive film and lower than the softening temperature of the acrylic resin plate. A method for producing a synthetic resin laminate, comprising: 4. A bag containing a polymer having an adhesive film sandwiched between a polycarbonate resin substrate and an acrylic resin plate, and the inside of the bag is sucked to bag the polymer. The polycarbonate resin substrate and the acrylic resin plate are bonded via the adhesive film by performing vacuum packing with the body in an atmosphere having a temperature higher than the melting temperature of the adhesive film and lower than the softening temperature of the acrylic resin plate. To produce a laminated body, and then reheat and repressurize the laminated body taken out from the bag body. 5. A synthetic resin laminate obtained by laminating a polycarbonate resin substrate and an acrylic resin plate, wherein the polycarbonate resin substrate is heated to a temperature not lower than the softening temperature of the polycarbonate resin substrate, and the acrylic resin in the laminate plate is used. A secondary processing method for a synthetic resin laminate, comprising heating a resin plate to a temperature lower than a heating temperature of a polycarbonate resin substrate and not lower than a softening temperature of an acrylic resin plate, and then performing a secondary processing. 6. The method of secondary processing of a synthetic resin laminated plate according to claim 5, wherein the secondary processing is performed while pressure is applied to both surfaces of the synthetic resin laminated plate. 7. A polycarbonate resin substrate comprising 150 to 18
7. The synthetic resin laminate according to claim 5, wherein the acrylic resin plate is heated to 0 ° C. and the acrylic resin plate is heated to 100 to 130 ° C. to perform bending or embossing.
Next processing method. 8. A polycarbonate resin substrate having a thickness of 200 to 23.
The method according to claim 5, wherein the acrylic resin plate is heated to 0 ° C., the acrylic resin plate is heated to 160 to 200 ° C., and any secondary processing selected from vacuum forming, pressure forming, vacuum pressure forming, and free blow forming is performed. 6. A secondary processing method for a synthetic resin laminate according to claim 6.