JPH09239571A - Optical beam treating method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To execute a clear marking in one shot on an irradiated surface having irradiated parts at the positions having different beam axial direction. SOLUTION: After forming an irradiating laser beam L from a laser beam oscillator to a rectangular spot shape, the laser beam reaches a mask 4 through a cylindrical lens 2. In the mask 4, punching hole letters 5 are formed and the shape of the mask 4 is formed stepwise corresponding to the shape of the surface 11 to be marked of an electronic parts 10. The laser beam L passed through the punched hole letter 5 part irradiates the electronic parts 10 as the material to be marked after condensing with a meniscus lens 6. The electronic parts 10 provides the surface 11 to be marked having the parts 11a, 11b to be marked at the position having different beam axial C directions. That is, the surface 11 to be marked is the stepwise surface and the laser beam L marks on the surface 11 to be marked.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light beam processing method, and more particularly to a processing method such as marking, exposure and polishing with a light beam.

[0002]

2. Description of the Related Art For example, in the pulse type laser marking method, a laser beam having a generally rectangular spot shape is applied to a flat plate mask arranged substantially perpendicular to the optical axis to form a punched hole character on the mask. The laser beam that has passed through such portions is condensed by a meniscus lens, and the surface to be displayed is irradiated for marking.

[0003]

However, in the conventional laser marking method, when the shape of the surface to be displayed has a step of, for example, 1 mm or more in the optical axis direction, marking with one shot is marked. There was a problem that the letters became unclear. Therefore, the step on the display surface is 1 m
In the case of m or more, the surface to be displayed is divided into a plurality of sections such that the step difference within the section is within 1 mm, and one shot is applied to each section. Therefore, a plurality of shots are required for one display surface, the structure of the laser device becomes complicated, and the cost is increased.

Therefore, an object of the present invention is to provide a light beam processing method capable of performing clear marking or the like with one shot on an irradiated surface having irradiated portions at different positions in the optical axis direction. It is in.

[0005]

In order to achieve the above object, a method of processing a light beam according to the present invention is directed to an irradiation surface having irradiation portions at different positions in the optical axis direction. The light beam is emitted through a mask having a shape corresponding to the shape of. Further, the light beam processing method according to the present invention, a plurality of masks are arranged corresponding to the shape of the irradiated surface having the irradiated portion at different positions in the optical axis direction, and the light beam is irradiated by the plurality of masks. It is characterized in that the surface to be irradiated is irradiated with the light.

Here, as the light beam, there are a laser beam, an ultraviolet ray and the like. Further, examples of the irradiated surface having the irradiated portions at different positions in the optical axis direction include, for example, a stepped surface, an inclined surface, and a curved surface.

[0007]

Function: The mask shape is made to correspond to the shape of the irradiation surface, or a plurality of masks are arranged so as to correspond to the shape of the irradiation surface, so that clear marking, exposure and polishing are performed according to the irradiation surface. Therefore, the position difference of the irradiated portion in the optical axis direction is absorbed.

[0008]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of a light beam processing method according to the present invention will be described below with reference to the accompanying drawings.
Each embodiment will be described by taking an example of marking an identification display of an electronic component. Further, in each embodiment, the same reference numerals are given to the same parts and the same parts.

[First Embodiment, FIG. 1] As shown in FIG. 1, a pulse type laser marking optical system 1 is roughly composed of a laser oscillator (not shown), a cylindrical lens 2 and
It is composed of a mask 4 and a meniscus lens 6.
The laser beam L emitted from the laser oscillator reaches the mask 4 via the cylindrical lens 2 after being made into a spot shape having a rectangular cross section. The mask 4 is formed with punched characters 5, and the shape of the mask 4 is stepwise corresponding to the shape of the display surface 11 of the electronic component 10 described later. The punched hole characters 5 are the punched hole characters 5a used for marking the display portion 11a of the display surface 11 and the display portion 11a.
It is composed of a punched hole character 5b used for marking b.

The laser beam L that has passed through the portion of the punched character 5 is condensed by the meniscus lens 6 and then irradiated on the electronic component 10 of the display object. The electronic component 10 has the display target portions 11a and 11 at different positions in the optical axis C direction.
The display surface 11 having b is provided. That is, the display surface 11 is a stepped surface, and the laser beam L marks the display surface 11.

Next, a method for making a clear marking on the display surface of the electronic component 10 will be described in detail. Generally, when the distance between the mask 4 and the meniscus lens 6 is A1, the distance between the meniscus lens 6 and the display surface 11 is B1, and the focal length of the meniscus lens 6 is f, clear marking is performed on the display surface 11. It is necessary that the following relational expressions (1) and (2) are satisfied as the condition of.

A1 = (k + 1) × f (1) B1 = {(k + 1) / k} × f (2) where 1 / k is a reduction ratio, and 1 / k =
The relationship is (character size on display surface 11) / (character size of punched hole formed in mask 4). By the way, the displayed portions 11a and 11b have a step Δh in the direction of the optical axis C. Therefore, if the above relational expressions (1) and (2) are adopted as the conditions for making clear marking on the displayed portion 11a, the conditions for making clear marking on the displayed portion 11b are as follows. 4) is required to be established. Here, the distance between the punched hole character 5b of the mask 4 and the meniscus lens 6 is A2, and the distance between the meniscus lens 6 and the displayed portion 11b is B2.

A2 = (k + 1) × f−Δh × k (3) B2 = {(k + 1) / k} × f + Δh (4) That is, the step on the display surface 11 is the mask 4 This can be absorbed by changing the distance between the hole character 5a and the meniscus lens 6 and the distance between the hole character 5b and the meniscus lens 6. Specifically, the shape of the mask 4 is stepwise, and between the punched hole character 5a used for marking the displayed portion 11a and the punched hole character 5b used for marking the displayed portion 11b, A dimensional difference of Δh × k is set in the direction of the optical axis C.

By using the mask 4 having the above structure, it is possible to make clear marking with one shot on the irradiated surface 11 having a step of 1 mm or more in the direction of the optical axis C.

[Second Embodiment, FIG. 2] As shown in FIG. 2, the pulse type laser marking optical system 12 includes a mask 1
The optical system 1 is the same as the optical system 1 of the first embodiment except for 4a and 14b. The masks 14a and 14b are provided with punched characters 15a and 15b, respectively. Mask 14a
Is used for marking the displayed portion 11a of the electronic component 10, and the mask 14b is used for marking the displayed portion 11b. The masks 14a and 14b are arranged in the direction of the optical axis C with a mounting position difference of Δh × k in order to perform clear marking on the irradiated surface 11 with one shot.

[Third Embodiment, FIG. 3] As shown in FIG. 3, the pulse type laser marking optical system 21 includes a mask 2
It is the same as the optical system 1 of the first embodiment except for 3. The marking optical system 21 is capable of making clear marking with one shot on the electronic component 30 having the inclined display surface 31.

The mask 23 is formed with punched characters 24. The shape of the mask 23 is a flat plate, and the electronic component 30
Inclining with respect to the optical axis C corresponding to the shape of the surface 31 to be displayed. The punched hole character 24 is composed of a punched hole character 24a and a punched hole character 24b, and the punched hole character 24a corresponds to the displayed surface 31.
It is used to mark the displayed part 31a near the bottom of
The punched-out character 24b is used for marking the displayed portion 31b on the upper side.

[Other Embodiments] The light beam processing method according to the present invention is not limited to the above embodiment.
Various modifications can be made within the scope of the gist. The embodiment has been described by taking the case of marking the product name, standard, etc. of the electronic component as an example, but it can also be used in the case of marking containers or various packages such as pharmaceuticals, cosmetics, and beverages. Furthermore, it can also be used in an exposure process such as photolithography, or a polishing process of a metal surface or the like.

Further, the hole formed in the mask does not necessarily have to be a complete opening, and a transparent body may be interposed as long as it allows laser light to pass therethrough. Further, the shape of the irradiated surface is not limited to the stepped shape or the inclined shape of the above-described embodiment, and may be a curved surface shape or the like.

[0020]

As is apparent from the above description, according to the present invention, a mask having a shape corresponding to the shape of the irradiation surface is used, or a plurality of masks are arranged corresponding to the shape of the irradiation surface. Therefore, the position where clear marking, polishing, and exposure can be performed follows the irradiation surface, and the position difference of the irradiation portion in the optical axis direction can be absorbed. As a result,
It is possible to perform clear marking, polishing, and exposure with one shot on the irradiated surface having the irradiated portions at different positions in the optical axis direction.

[Brief description of drawings]

FIG. 1 is a perspective view showing a first embodiment of a light beam processing method according to the present invention.

FIG. 2 is a perspective view showing a second embodiment of a light beam processing method according to the present invention.

FIG. 3 is a perspective view showing a third embodiment of the light beam processing method according to the present invention.

[Explanation of symbols]

 1, 12, 21 ... Laser marking optical system 4, 14a, 14b, 23 ... Mask 11, 31 ... Displayed surface 11a, 11b, 31a, 31b ... Displayed portion C ... Optical axis L ... Laser beam

Claims (2)

[Claims] 1. A light beam irradiating a surface to be irradiated, each of which has an irradiation target portion at a position different in the optical axis direction, through a mask having a shape corresponding to the shape of the irradiation surface. Beam processing method. 2. A plurality of masks are arranged at different positions in the optical axis direction so as to correspond to the shape of a surface to be irradiated having respective portions to be irradiated, and a light beam is directed to the surface to be irradiated through the plurality of masks. A light beam processing method characterized by irradiating.