JPH09237770A - Wafer processing system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable continuous and efficient execution of such processing operations of a multiplicity of wafers obtained by slicing a work by a wire saw or the like, as cleaning the wafers, releasing the wafers from supporting plates and putting the wafers into a container. SOLUTION: Wafers 22a are obtained by slicing a column-like work 22 bonded onto respective supporting plates 23 with adhesive 23c. The processing system, in order to process the wafers 22a, comprises a cleaning device 24, a releasing device 27, a separating/accommodating device 28 and a transport devices 32, 34, 35 and 38. The cleaning device 24 cleans the wafers in such a condition that the wafers are bonded onto the associated supporting plate 23. The releasing device 27 releases the cleaned wafers from the supporting plates 23. The wafers released from the supporting plates 23 form a column of the assembled wafers. The separating/accommodating device 28 releases the assembled wafers from the column one after another and accommodates them into the container 29. The transport devices 32, 34, 36 and 38 sequentially feed the sliced wafers at least from the cleaning device 24 to the releasing device 27 and separating/accommodating device 28.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a processing system for processing a wafer formed by cutting a silicon ingot, for example. More specifically, the present invention relates to a processing system capable of efficiently performing various kinds of processing such as cleaning of semiconductor wafers.

[0002]

2. Description of the Related Art In general, a semiconductor wafer is formed by cutting an ingot made of silicon into a predetermined thickness using, for example, a wire saw. An example of this cutting method will be briefly described. As shown in FIG. 18A, the work 22 made of a silicon ingot has a cylindrical shape, and the carbon plate 23a and the insulating plate 2 are provided on the upper surface thereof.
A support plate 23 including 3b is attached by an adhesive 23c. As shown in FIG. 19, the work 22 is attached to the support mechanism 17 of the wire saw 16 via the support plate 23. The wire saw 16 includes a plurality of rollers 18, wires 19 spirally wound at a predetermined pitch between the rollers 18, and a supply pipe 15 for supplying slurry containing abrasive grains onto the wires 19. As shown in FIGS. 18B and 19, while the wire 19 is traveling in one direction or in both directions, a slurry containing abrasive grains is supplied onto the wire 19, and in this state, the work 22 is attached to the wire 19.
Is pressed. By this operation, the work 22 is sliced, and a large number of disk-shaped wafers 22a are simultaneously formed.

Conventionally, the sliced wafer 22a is put into a container such as a cassette without being cleaned.
They were housed separately one by one. Then, the wafer 22
While a was stored in the container, it was post-treated by cleaning with a cleaning device or the like.

[0004]

However, the wafer 22
If the cleaning is carried out in the state that the a is stored in the container, the cleaning efficiency is poor and it is difficult to reliably remove the cutting chips, the abrasive grains and the like adhering to the surface of the wafer 22a. Moreover, the wafer 22a may be damaged by chips or abrasive grains during the process of housing the cut wafer 22a in the container.

A main object of the present invention is to provide a wafer processing system capable of continuously and efficiently performing cleaning of a wafer after cutting and various processing associated with the cleaning.

Another object of the present invention is to provide a wafer processing system capable of preventing the wafer after cutting from being damaged.

[0007]

In order to achieve the above object, in the invention of the wafer processing system according to claim 1, the wafer is formed by slicing a columnar work adhered to a support plate with an adhesive. A system for processing a large number of wafers that have been cleaned, a cleaning means for cleaning the wafer while the wafer is still attached to the support plate, and It is provided with a peeling means for peeling and a carrying means for carrying the wafer at least from the cleaning means to the peeling means.

According to a second aspect of the present invention, in the first aspect, the cleaning means includes a first cleaning device for roughly cleaning the wafer to roughly remove dirt adhering to the wafer, and a cleaning device after the rough cleaning. Second cleaning device for cleaning the wafer to almost completely remove the dirt attached to the wafer.

According to a third aspect of the present invention, in the second aspect, the first cleaning apparatus is provided with an injection means for injecting hot water onto the wafer.

According to a fourth aspect of the invention, in the second aspect, the peeling means also serves as the second cleaning device.

According to a fifth aspect of the present invention, in the fourth aspect, the peeling means is a cleaning tank for storing heated liquid, and the wafer is immersed in the cleaning tank together with the support plate. And an ultrasonic wave generating means arranged in the cleaning tank, and an ultrasonic wave generated by the ultrasonic wave generating means removes dirt adhering to the wafer and peels the wafer from the support plate. Swelling or melting the adhesive between the support plate and the wafer.

According to the sixth aspect of the present invention, the first to fifth aspects are provided.
In any one of the above, prior to the cleaning of the wafer by the cleaning means, a preliminary cleaning means for cleaning the wafer, and the transfer means for transferring the wafer from the preliminary cleaning means to the cleaning means. It is a thing.

According to a seventh aspect of the present invention, in the sixth aspect, the preliminary cleaning means includes a cleaning tank for storing a liquid, and the wafer is immersed in the liquid in the cleaning tank.

According to an eighth aspect of the present invention, in the seventh aspect, the preliminary cleaning means includes a bubble generating means for generating bubbles in the liquid in the cleaning tank.

According to a ninth aspect of the present invention, in the sixth aspect, the preliminary cleaning means includes a plurality of nozzles for injecting a jet water stream onto the wafer.

According to a tenth aspect of the present invention, the first to third aspects are provided.
In any one of 5 above, a separating and accommodating unit that separates the wafers in a columnar state one by one and stores them in a container; Be prepared.

According to the eleventh aspect, in the tenth aspect,
A final cleaning means for finally cleaning the wafer accommodated in the container by the separating and accommodating means in the state of being accommodated in the container; And carrying.

According to the invention of claim 12, in claim 11,
In the above, the final cleaning means is provided with a plurality of cleaning devices so as to perform the cleaning process of the wafer and the container a plurality of times.

According to the invention of claim 13, in claim 11,
In the above, the final cleaning means includes a cleaning tank that stores hot water, and the wafer is cleaned together with the container while being immersed in the warm water in the cleaning tank.

According to a fourteenth aspect of the invention, there is provided a thirteenth aspect.
In the above, the final cleaning means includes ultrasonic wave generating means arranged in the cleaning tank, and the wafer and the container are cleaned by the ultrasonic wave generated by the ultrasonic wave generating means.

According to the invention of claim 15, in claim 13,
Alternatively, in 14, the transfer means pulls up the wafer cleaned by the final cleaning means from the warm water together with the container.

According to the invention of claim 16, in claim 15,
The drying means for drying the wafer cleaned by the final cleaning means together with the container, and the transfer means for pulling up the container containing the wafer from the final cleaning means and transferring it to the drying means. .

According to the invention described in Item 17,
In any one of 5, a portable support tool for supporting the wafer attached to the support plate; the cleaning means cleaning the wafer while the wafer is supported by the support tool; The wafer is supported by the support and is peeled off from the support plate.

[0024] According to the invention described in claim 18, according to claim 17 of the present invention.
In the above, the support tool has a holding means for holding the posture of the wafer after being peeled from the support plate.

In the invention described in claim 19, claim 18 is provided.
In the above-mentioned, the holding means has a pair of restricting members for sandwiching the group of wafers from both end surface sides thereof in order to prevent the stacked wafers from falling down.

According to the twentieth aspect, in the nineteenth aspect,
In the above, the holding means further has an adjusting means for adjusting the distance between the both regulating members according to the dimension between both end faces of the group of wafers.

According to the invention of claim 21, claim 20 is
In the above, there is a measuring means for measuring the dimension between both end faces of the group of wafers.

According to the invention described in claim 22, in claim 21
In the above, the measuring means includes either an ultrasonic sensor or a laser length measuring device.

According to the invention of claim 23, the invention of claim 17
In the above, the separating and accommodating means for separating the wafers in a columnar state into a container and accommodating them in a container, and the supporting means for supporting the wafers between the cleaning means, the peeling means and the separating and accommodating means. Having a first transporting means for transporting.

According to the invention of claim 24, in claim 23
In the above, the separating / accommodating means separates the stacked wafers one by one from the uppermost one so that the axes thereof extend in a substantially vertical direction, and the transfer means is a wafer in the support. It has a posture changing means for changing the posture of the supporting tool carried into the separating and accommodating means so that the axis of the group is extended in a substantially vertical direction.

In the invention described in Item 25, Item 10
In the above-mentioned, the transfer means has a carry-in / carry-out means for carrying in an empty container into the separation / accommodation means and carrying out a container accommodating a wafer from the separation / accommodation means.

In the invention described in Item 26, Item 10
In the above, the separating and accommodating means separates the wafers one by one by a water flow.

In the invention described in Item 27, Item 26
In the above, the separation / accommodation means is provided with a separation roller that comes into contact with the wafer to be separated and applies a moving force in the separation direction.

In the invention described in Item 28, Item 27
In the above, the separation roller comprises an inner layer having elasticity and a relatively hard outer layer surrounding the inner layer.

In the invention described in claim 29, claim 26
In the above, the separating / accommodating means is provided with an ejection nozzle for ejecting a wafer which is in the course of separation movement and floating it by a water flow.

According to the invention described in Item 30,
In any one of 5, the control means is provided for controlling the operations of the cleaning means, the peeling means, and the conveying means in accordance with a predetermined control program.

In the invention described in Item 31,
In accordance with a predetermined control program, the control means for controlling the operations of the cleaning means, the peeling means, the separating and accommodating means, and the conveying means is provided.

In the invention described in Item 32, Item 11
In accordance with a predetermined control program, the control means for controlling the operations of the cleaning means, the peeling means, the separating and accommodating means, the final cleaning means and the carrying means are provided.

In the invention described in Item 33, Item 16
In accordance with a predetermined control program, the control means for controlling the operations of the cleaning means, the peeling means, the separating and accommodating means, the final cleaning means, the drying means and the conveying means are provided.

According to a thirty-fourth aspect of the present invention, in a system for processing a large number of wafers formed by slicing a columnar work adhered to a supporting plate with an adhesive, the wafer is supported by the supporting plate. A cleaning station for cleaning the as-attached state, a peeling station for peeling the cleaned wafer from the support plate in a columnar assembled state, and a columnar assembled wafer A separate storage station for separating the sheets one by one and storing them in a container is provided.

Therefore, in the wafer processing system according to the first aspect of the present invention, a large number of wafers sliced by the wire saw are attached to the support plate and cleaned by the cleaning means while being gathered in a columnar shape. Next, the cleaned wafer is conveyed to the peeling means and peeled from the support plate by the peeling means. Therefore, each processing operation of cleaning the wafer and peeling it from the support plate can be continuously and efficiently performed. Further, since the cleaning of the wafer is performed in the exposed state before being surrounded by the container before the accommodation of the wafer in the container that is accommodated after the separation, the wafer can be surely and efficiently performed in a short time.

In the processing system of the second aspect, the cleaning means includes a first cleaning device and a second cleaning device. Therefore, the cleaning of the wafer can be effectively performed by dividing it into the rough cleaning and the cleaning for almost completely removing the dirt.

In the processing system according to the third aspect, the first cleaning device cleans the wafer by jetting hot water. Therefore, the cleaning power of the rough cleaning is enhanced.

In the processing system of the fourth aspect, the peeling means also serves as the second cleaning device. Therefore, the wafer can be separated from the support plate at the same time as the cleaning of the wafer.

In the processing system according to the fifth aspect, the peeling means supports the wafer in the liquid by the ultrasonic wave generating means while removing the dirt adhering to the wafer and peeling the wafer from the support plate. Swell or melt the adhesive between the plate and the wafer. Therefore, the wafer can be reliably peeled off from the support plate in a short time.

In the processing system according to the sixth, seventh and eighth aspects, the preliminary cleaning means performs the preliminary cleaning prior to the cleaning of the wafer by the cleaning means. With this pre-cleaning means, for example, a wafer is immersed in water and pre-cleaned by bubbles generated in water. Therefore, the wafer is stored in a wet state until it is transferred to the next step, and moreover, the chips and the like adhering to the surface of the wafer can be almost removed by this preliminary cleaning. The wafer can be effectively cleaned in a short time.

In the processing system according to claim 9,
The pre-cleaning means cleans the wafer with a jet water stream. Therefore, efficient cleaning can be performed in a short time.

In the processing system of the tenth aspect of the present invention, the wafer is cleaned by the cleaning means and then separated by the separating means. After that, the separated wafers are conveyed to the separating / accommodating means, separated one by one by the separating / accommodating means, and accommodated in the container. Therefore, it is possible to continuously and efficiently perform each processing operation of cleaning, peeling the wafer, and separating and accommodating the wafer. Further, since the cleaning of the wafer is performed prior to the accommodation in the container, the wafer can be cleaned reliably and in a short time. Moreover, the container is not contaminated by the cutting chips and the abrasive grains adhering to the wafer. Further, it is possible to prevent the wafer from being scratched by chips or abrasive grains in the process of being stored in the container.

In the processing system according to the eleventh aspect, after the wafer is accommodated in the container by the separating and accommodating means,
The wafer is finally cleaned by the final cleaning means. Therefore, the final cleaning makes it possible to more reliably remove dirt and the like on the surface of the wafer and also to remove dirt on the container.

In the processing system of the twelfth aspect, the final cleaning means is composed of a plurality of cleaning devices.
Therefore, the final cleaning of the work can be effectively performed.

In the processing system according to the thirteenth aspect, the wafer is cleaned by the final cleaning means while being immersed in hot water. For this reason, drying after pulling up from warm water becomes quick.

In the processing system according to the fourteenth aspect, the final cleaning means cleans the wafer by the ultrasonic wave generating means. Therefore, the cleaning power is high and the final cleaning can be performed in a short time.

In the processing system according to the fifteenth aspect, the wafer is pulled up from the warm water in the final cleaning layer by the transfer means together with the container. Therefore, the surface tension effect of water easily removes water droplets from the surface of the wafer, and the wafer is dried quickly.

In the processing system of the sixteenth aspect, after the final cleaning of the wafer, the wafer is pulled out from warm water and dried by the drying means. For this reason, it is possible to uniformly and surely dry the entire wafer in a state where the wafer is accommodated in the container.

In the processing system according to the seventeenth aspect, the wafer is cleaned and separated while being supported by the support. Therefore, the wafer can be prevented from being damaged, and the wafer can be easily transported.

In the processing system according to the eighteenth aspect, the supporting tool has a holding means for holding the posture after the wafer is peeled off. Therefore, the wafers are held in a columnar state without being broken even after being peeled from the support plate.

In the processing system according to the nineteenth aspect, the wafer is prevented from falling down by the pair of restricting members sandwiching the wafer from both end surfaces. Therefore, the wafer is prevented from being damaged, and the wafer is easily handled in the step of separating the wafers one by one.

In the processing system according to the twentieth aspect, the distance between the pair of regulating members can be adjusted. Therefore, it can be adjusted according to the dimension between both end faces of the group of wafers. .

In the processing system according to the twenty-first and twenty-second aspects, the dimension between the two end faces of the group of wafers is measured by a measuring means such as an ultrasonic sensor or a laser measuring device. Therefore, the distance between the regulation plates is accurately adjusted according to the measurement result, and the wafer group can be reliably held between the regulation plates. Moreover, the obtained measurement result can be used for various controls in the subsequent steps.

In the processing system of the twenty-third aspect, the transfer means transfers the support tool supporting the wafer between the cleaning means, the peeling means and the separation / accommodation means. For this reason, the wafer is transported while being held by the support tool without being damaged, and each processing operation such as cleaning, peeling, and separation / accommodation can be continuously and efficiently performed.

In the processing system according to the twenty-fourth aspect, the columnar wafer group after peeling is changed to a vertical posture by the posture changing means, and separated from the uppermost one by one and housed in a container. For this reason, separation and accommodation can be easily performed.

In the processing system of the twenty-fifth aspect, the carrying means carries in the empty container and carries out the container containing the wafer with respect to the separating and accommodating means. Therefore, the work of separating and accommodating can be efficiently performed.

In the processing system of the twenty-sixth aspect, since the wafers are separated one by one by being placed on the water flow, the wafers can be efficiently separated without damage.

In the processing system according to the twenty-seventh aspect, there is provided a separation roller which comes into contact with the wafer and imparts a moving force in the separation direction when the wafer is separated. Therefore, the wafer separating operation is promoted.

In the processing system according to the twenty-eighth aspect, the separating roller comprises an elastic inner layer and a relatively hard outer layer surrounding the inner layer. For this reason, the separation roller has sufficient elasticity and is excellent in abrasion resistance, so that the separation of the wafer can always be stably performed.

In the processing system of the twenty-ninth aspect, the wafer being separated and moved is jetted and floated by the water flow. For this reason, the adhesive force between the uppermost wafer being separated and the wafer immediately below it is weakened, and the wafer separating operation can be performed smoothly.

In the processing system according to the thirty-third, thirty-first, thirty-second and thirty-third aspects, the cleaning means, the peeling means, the separating and accommodating means, the drying means and the conveying means are controlled in association with each other by a predetermined program. . Therefore, a series of operations such as cleaning, peeling, separation / accommodation, drying, and conveyance between them can be automated.

In the processing system according to the thirty-fourth aspect, there are provided stations for cleaning, peeling, and separation / accommodation. Therefore, the wafer transfer and the automation of the processing system can be easily established.

[0069]

BEST MODE FOR CARRYING OUT THE INVENTION A first embodiment of the present invention will be described below with reference to FIGS.

As described above, the work piece 22 shown in FIG. 18A is cut by the wire 19 of the wire saw 16 as shown in FIGS. 18B and 19. as a result,
A large number of disk-shaped wafers 22a are simultaneously formed. The processing system of this embodiment cleans the wafers 22a thus formed and separates them one by one. Therefore, the processing system will be described in detail below.

(Overall Configuration of Processing System) FIGS. 1 to 4
As shown in, the processing system of the present embodiment is configured by arranging various devices in charge of the first to eighth steps ST1 to ST8 on the frame 20 in a line.

The pre-cleaning device 21 as the pre-cleaning means is in charge of the first step ST1 and pre-cleans the work 22 cut into a wafer by the wire saw 16 while being attached to the support plate 23. The cleaning device 24 as a cleaning means is in charge of the second step ST2 and the third step ST3, and stores the pre-cleaned work 22 in the first cassette 26 as a support on the temporary placing table 25. afterwards,
The cleaning device 24 cleans the work 22 in the first cassette 26 in a tank adjacent to the temporary placing table 25. The peeling device 27 as a peeling unit takes charge of the third step ST3 together with the cleaning device 24, and peels the cleaned work 22 from the support plate 23.

The separation / accommodation device 28 as a separation / accommodation means takes charge of the fourth step ST4, separates the wafers 22a separated from the support plate 23 one by one, and stores them in the second cassette 29 as a container. The precise cleaning device 30 as the final cleaning means is in charge of the fifth step ST5 to the seventh step ST7,
The wafer 22a housed in the cassette 29 is precisely cleaned while being immersed in warm water. Drying device 31 as a drying means
In charge of the eighth step ST8, the wafer 22a that has been subjected to the precise cleaning by the precise cleaning device 30 is pulled out from the warm water and then dried.

The work holding device 32 as a conveying means is arranged above the preliminary cleaning device 21 in charge of the first step ST1. The work 22 attached to the support plate 23 is cut into a wafer by the wire saw 16, and then the pre-cleaning device 21 is loaded by the loading device 33 shown in FIG.
Is loaded above. The holding device 32 temporarily holds the loaded work 22 with its axis extending along the arrangement direction of each device on the frame 20.

The first transfer device 34 as the transfer means is the first
Preliminary cleaning device 2 in charge of steps ST1 to ST4
1, above the temporary placing table 25, the cleaning device 24, the peeling device 27, and the separation / accommodation device 28. First
The transfer device 34 includes the work 22 attached to the support plate 23.
Is received from the holding device 32 and conveyed to the preliminary cleaning device 21. In addition, the first transfer device 34 includes a preliminary cleaning device 21, a temporary placing table 25, a cleaning device 24, and a peeling device 2 for the work 22.
7 and the separation / accommodation device 28 are moved intermittently in order.

When the work 22 received from the holding device 32 is transferred to the pre-cleaning device 21, the first transfer device 34 extends the axis of the work 22 in a direction orthogonal to the arrangement direction of the devices on the frame 20. And in the horizontal plane 9
Rotate 0 degrees. Further, the first transport device 34 accommodates the work 22 in the first cassette 26 on the temporary placing table 25 while being stuck to the support plate 23. Further, the first work transfer device 34 is arranged in a horizontal plane so that when the work 22 is transferred from the peeling device 27 to the separation / accommodation device 28, the axis of the work 22 extends along the arrangement direction of each device on the frame 20. Rotate 90 degrees.

The second transfer device 35 as the transfer means is the fourth transfer device.
It is disposed above the separation / accommodation device 28 that is in charge of the process ST4. The second transfer device 35 rotates the work 22 by 90 degrees in a vertical plane while moving the work 22 along the arrangement direction of each device on the frame 20. In other words, the second transfer device 35 rotates the work 22 so that the axis of the work 22 extends substantially horizontally along the arrangement direction of the devices on the frame 20 and extends substantially vertically.

The cassette transfer device 36 as a transfer means is disposed behind the separation / accommodation device 28 in charge of the fourth step ST4. The cassette transfer device 36 transfers the empty second cassette 29 carried in by the cassette carry-in device 37 shown in FIG. 2 to a position above the separation / accommodation device 28.

The third transfer device 38 as a transfer means is arranged above the separation / accommodation device 28, the precise cleaning device 30, and the drying device 31 which are in charge of the fourth step ST4 to the eighth step ST8. The third transport device 38 is used for the empty second cassette 29.
Receiving from the cassette transfer device 36 and separating and accommodating device 28
Transport to The third transfer device 38 intermittently sequentially moves the work 22 stored in the second cassette 29 between the separation and storage device 28, the precise cleaning device 30, and the drying device 31. In the separation / accommodation device 28, after the work 22 is accommodated in the second cassette 29, the work 22 is placed in a vertical plane so that the axis of the work 22 extends along the arrangement direction of each device on the frame 20. Is rotated 90 degrees.

As shown in FIG. 2, the carry-out device 39 is arranged beside the drying device 31 which is in charge of the eighth step ST8. The carry-out device 39 carries out the work 22 dried by the drying device 31 from the processing system of the present embodiment and transfers it to the next process.

As shown in FIG. 3, the control device 40 as the control means is arranged, for example, on the back side of the frame 20. The control device 40 controls the operation of each device in charge of the first to eighth steps ST1 to ST8 according to a predetermined control program.

Next, the structure and operation of each of the above-mentioned devices will be described in detail.

(First Step) As shown in FIGS. 3 and 5,
The preliminary cleaning device 21 in charge of the first step ST1 includes a preliminary cleaning tank 42. The work 22 attached to the support plate 23 is supported on the support base 43 inside the tank 42. A water supply passage 4 having a valve 44a in the tank 42
Water is supplied via 4. A pump 45a is provided in the tank 42.
The cleaning agent in the tank 46 is supplied through the supply passage 45 having the valve 45b. As the cleaning agent, for example, a neutral detergent is used. By mixing the cleaning agent with the water in the tank 42, a cleaning liquid having a predetermined concentration is formed in the tank 42. A concentration sensor 41 for detecting the concentration of the cleaning liquid is arranged in the tank 42. The control device 40 is the tank 4
The valves 44a and 45b, the pump 45a, and the like are controlled based on the detection result of the concentration sensor 41 so that the concentration of the cleaning liquid in 2 becomes a predetermined value.

The air nozzle 47 as a bubble generating means is arranged at the inner bottom portion of the preliminary cleaning tank 42 and generates bubbles in the cleaning liquid by jetting air. The bubbles 22 preliminarily clean the work 22 dipped in the cleaning liquid. By this preliminary cleaning, stains such as slurry and chips adhering to the surface of each wafer 22a are removed by the cleaning device 24 from the wafer 22a.
Are generally removed prior to washing.

During the preliminary cleaning, the cleaning liquid in the preliminary cleaning tank 42 is pumped by the pump 48a, the valve 48b and the hot water tank 48.
Circulation path 4 having d, heater 48e and filter 48c
It is circulated through 8. By this circulation, the wafer 22
The oil content adhering to a is removed by warm water of about 40 ° C., and the dirt contained in the cleaning liquid is filtered by the filter 48.
filtered by c. Further, during the preliminary cleaning, the air in the tank 42 contaminated by the abrasive grains in the slurry is
The gas is forcibly exhausted from the inlet 42a via the exhaust passage 49.

(Second Step) As shown in FIGS. 1 to 3, the temporary placing table 25 is disposed adjacent to the preliminary cleaning tank 42 of the preliminary cleaning device 21. The work 22 after the preliminary cleaning is accommodated in the first cassette 26 on the temporary placing table 25.
As shown in FIGS. 12 and 13, the first cassette 26 is
A pair of side plates 52 arranged in parallel at a predetermined interval,
It has a plurality of connecting rods 53 installed between both side plates 52. The pair of locking holes 52a are formed at the upper ends of the side plates 52. As will be described later, this locking hole 52a is
It is provided to lift the first cassette 26 by the transfer device 34.

The pair of holders 54 are respectively provided on the side plates 52.
Is projected on the upper part of the inner surface of the. These holders 54
The work 22 is accommodated between the side plates 52 by placing the support plate 23 thereon. The pair of holding rods 55 serving as holding means are provided between the lower portions of the both side plates 52 at a predetermined interval. When the work 22 is peeled from the support plate 23 by the peeling device 27 in charge of the third step ST3, the work 22 is held on both the holding rods 55.

A guide rod 56 extending parallel to the connecting rod 53 is installed between the side plates 52. The screw rod 57 that constitutes the restricting means is rotatably supported between the side plates 52 so as to extend in parallel with the guide rod 56. The threaded rod 57 as a holding means has a pair of threaded portions 57a and 57b on the outer peripheral surface thereof with different spiral directions. An operating portion 57c engageable with the rotary operating body 58 is provided at one end of the screw rod 57 so as to project therefrom. The rotary operation body 58 is the temporary stand 2.
It is arranged in the vicinity of 5 and is rotated by a drive source 50 such as a motor (see FIGS. 1 and 2).

The pair of restricting plates 59 as restricting members constitute means for preventing the wafer 22a from falling down after peeling. Each regulation plate 59 is supported by a guide rod 56 via a support member 60 so as to be movable in the axial direction. Each support member 60 has a screw hole 60a that is screwed into the screw portion 57a, 57b of the screw rod 57. As the screw rod 57 is rotated by the rotating operation body 58, both the regulation plates 59 are moved toward or away from each other, and the distance between the both regulation plates 59 is changed.

A pair of ultrasonic sensors 51 as measuring means
Are installed so as to face the side plates 52 of the first cassette 26 on the temporary placing table 25. Each sensor 51 has a first
The distance between each end face of the work 22 housed in the cassette 26 is detected. The control device 40 recognizes the length of the work 22 in the axial direction based on the detection result of the sensor 51. The control device 40 controls each wafer 2 of the work 22.
The drive source 50 of the rotary operation body 58 is controlled according to the length of the workpiece 22 in the axial direction in order to hold the 2a so as not to fall over by the both regulation plates 59, and the space between the both regulation plates 59 is adjusted.

Instead of the ultrasonic sensor 51, a laser length measuring device for detecting a distance by a laser beam may be used.

As shown in FIGS. 3 and 6, the cleaning device 24
Has a rough cleaning device 24a in charge of the second step ST2. The rough cleaning device 24a includes a first cleaning tank 63. A plurality of jet nozzles 64 as jetting means are arranged at predetermined intervals on both inner sides of the first cleaning tank 63 so as to face the outer peripheral surface of the work 22 arranged in the first cleaning tank 63. . Hot water tank 65 equipped with a heater 65a
Are arranged adjacent to the first cleaning tank 63. Inside the warm water tank 65, there is a water supply passage 66 having a valve 66a.
The water is supplied via.

The water in the hot water tank 65 is kept at about 50 ° C. by the heater 65a. The warm water in the tank 65 is
Injecting nozzle 6 via supply path 67 having pump 67a
4 is supplied. The injection nozzle 64 is about 5 to 20 kg / cm
The high-pressure hot water of 2 is jetted toward the work 22. The sprayed warm water roughly removes dirt such as slurry and chips adhering to the surface of each wafer 22a of the work 22.
In other words, the hot water jetted from the jet nozzle 64 is
The work 22 is roughly cleaned. At the time of this rough cleaning, the air in the first cleaning tank 63 contaminated with abrasive grains or the like is used as the inlet 6
3a is forcibly exhausted through the exhaust passage 68.

(Third Step) As shown in FIGS. 3 and 7,
The cleaning device 24 has an additional cleaning device 24b. Third
The peeling device 27 in charge of the process ST3 is an additional cleaning device 24.
It also serves as b and is provided with a second cleaning tank 71. The hot water tank 72 including the heater 72a is arranged adjacent to the second cleaning tank 71. Inside the hot water tank 72,
Water is supplied through a water supply passage 73 having a valve 73a. The water in the hot water tank 72 is heated to about 90 ° C. by the heater 72a.
4a and a second via a supply passage 74 having a valve 74b
It is supplied into the cleaning tank 71. The cleaning agent in the tank 76 is supplied into the second cleaning tank 71 via a supply path 75 having a pump 75a and a valve 75b. Cleaning agent is second
By being mixed with the warm water in the cleaning tank 71, a cleaning liquid having a predetermined concentration is formed in the tank 71.

The warming heater 77 is provided in the second cleaning tank 71 and keeps the cleaning liquid in the second cleaning tank 71 at a constant temperature. The ultrasonic oscillator 78 is arranged in the second cleaning tank 71. The work 22 stored in the first cassette 26
Is immersed in the cleaning liquid in the second cleaning tank 71. In this state, the ultrasonic oscillator 78 generates ultrasonic waves for cleaning the work 22. This ultrasonic wave completely removes the dirt adhering to the work 22, and the support plate 23 and the work 2
Workpiece 2 by swelling or melting the adhesive 23c between 2 and
2 is peeled from the support plate 23. As shown in FIGS. 12 and 13, the work 22 after peeling is held by both the regulation plates 59 so as not to fall down, and the holding rod 55 is held.
Supported above. Support plate 23 separated from work 22
Are taken out of the first cassette 26 by a known manipulator or robot (not shown). Alternatively, the support plate 23 may be carried out to a predetermined place by the pair of support arms 148a of the first transfer device 34.

As shown in FIG. 7, during the ultrasonic cleaning, the cleaning liquid in the second cleaning tank 71 is circulated through the circulation passage 79 having the pump 79a, the valve 79b and the filter 79c, and is contained in the cleaning liquid. Dirt included is filter 79c
Filtered. Further, during the ultrasonic cleaning, the contaminated air in the second cleaning tank 71 is removed from the inlet 71.
It is forcibly discharged from a through the exhaust passage 80.

(Fourth Process) As shown in FIGS. 3, 8 and 14, the separation / accommodation device 28 in charge of the fourth process ST4.
Is provided with a separation tank 83. The overflow portion 83a is provided so as to surround the entire side surface of the separation tank 83 from the outside. Water is supplied into the separation tank 83 through a water supply passage 84 having a valve 84a.

As shown in FIG. 3, the support base 85 is the separation tank 8
It is arranged in 3. The work 22 separated from the support plate 23 is placed in the first cassette 26 on the support base 85 so that its axis extends substantially horizontally along the arrangement direction of each device on the frame 20. Supported. The support base 85 is moved and rotated by the second transfer device 35. With this movement and rotation, the support base 85
The upper work 22 is rotated along the arrangement direction of each device on the frame 20 and is rotated so that its axis extends substantially vertically.

As shown in FIGS. 3 and 14, the work supporting mechanism 86 is arranged in the separation tank 83. The work support mechanism 86 includes a lift table 87 that can be raised and lowered, and a motor 88 that moves the lift table 87 up and down through a ball screw 89. The lifting platform 87 has a pair of support arms 90 for supporting the wafers 22a in a stacked state at the lower end thereof. As shown in FIGS. 12 to 14 and 17, as the support base 85 moves, the support arm 90 causes the lower side plate 52 and the lower regulation plate 59 of the first cassette 26 to move.
To enter between. Due to this approach, the work 22 is the first
It is transferred from the cassette 26 onto the support arm 90.
That is, as the support base 85 rotates 90 degrees clockwise in FIG. 3 and moves rightward, as shown in FIG.
2 and FIG. 13, the support arm 90 enters the first cassette 26 and is located on the lower surface of the work 22.
In this state, after the support arm 90 is raised, the support base 85
By retreating to the left in FIG. 3, each wafer 22a of the work 22 is supported on the support arm 90 in a stacked state.

As shown in FIG. 14, the work support mechanism 86.
Includes a pair of guide rods 91 for guiding the peripheral surface of the work 22 on the support arm 90. When the work 22 in the first cassette 26 is transferred onto the support arm 90, the guide rod 91 is retracted to a position where it does not interfere with the first cassette 26 and the support base 85. When the transfer is completed, the guide rod 91 returns to the position on the support arm 90 along the peripheral surface of the work 22. Guide rod 91
Guides the work 22 to be lifted, which will be described later, at this return position.

As shown in FIGS. 2, 3, 8 and 14, the cassette support mechanism 92 is arranged in the separation tank 83. The cassette support mechanism 92 includes a lift table 93 that can be raised and lowered, and a motor 94 that moves the lift table 93 up and down via a ball screw 95. Further, the cassette support mechanism 92 includes a cassette support base 96 rotatably supported on the lift base 93 about a support shaft 96a, and a cylinder 97 for rotating the cassette support base 96. The second cassette 29 transferred by the cassette transfer device 36 is supported on the cassette support base 96. The second cassette 29 on the cassette support base 96 is disposed so as to face the work 22 on the support arm 90 while being immersed in the water in the separation tank 83.

First jet nozzle 98 and second jet nozzle 9
9 is arranged in the separation tank 83 so as to face the upper surface of the work 22 on the support arm 90. Water tank 10
0 is installed near the separation tank 83. Water is supplied into the water tank 100 through a water supply passage 101 having a valve 101a. Further, the water overflowing from the separation tank 83 to the overflow portion 83a is collected in the recovery passage 10
The water is recovered in the water tank 100 via 2.

Normally, the water in the water tank 100 is supplied to the first supply path 103 having a pump 103a and a valve 103b.
Is supplied to the first injection nozzle 98 via. The first injection nozzle 98 is configured to transfer the wafer 22a to the upper surface of the uppermost wafer 22a on the support arm 90 (see FIG. 1).
4, water is jetted from diagonally above on the side opposite to the direction indicated by arrow A). The water jetted from the first jet nozzle 98 prevents the uppermost wafer 22a from rising.

Second supply path 104 having valve 104a
Are connected to the pump 103 a in parallel with the first supply path 103. When the uppermost wafer 22a is separated from the other wafers 22a and is transported in the direction indicated by the arrow A in FIG. 14, the water in the water tank 100 passes through the second supply path 104 and the second jet nozzle. 99 is supplied. The second injection nozzle 99 is provided with an arrow A on the upper surface of the uppermost wafer 22a.
Water is sprayed from diagonally above in the direction indicated by. The jetted water separates the wafers 22a one by one from the uppermost one. The shooter 111 is arranged near the water surface of the separation tank 83. The water jetted from the second jet nozzle 99 forms a water flow in the direction of arrow A on the upper surface of the shooter 111. Therefore, the separated wafer 22a is attached to the shooter 11
It is carried by the water stream above 1 and stored in the second cassette 29.

The second cassette 29 has a plurality of storage shelves 29a formed at predetermined intervals in the vertical direction (see FIG. 14). In the second cassette 29, the wafers 22a are stored one by one on each storage rack 29a.

The separation assisting mechanism 105 is arranged so as to face the work 22 on the support arm 90. The separation assisting mechanism 105 includes a rotating plate 106 that is rotatable about a support shaft 106a in a vertical plane, and a ball screw 108.
Motor 107 for rotating the rotating plate 106 via
It has. Further, the separation assisting mechanism 105 includes a rotating shaft 112 and a rotating shaft 1 rotatably supported by the rotating plate 106.
Separation roller 109 fixed to 12 and separation roller 1
The motor 110 for rotating the 09 through a drive transmission mechanism (not shown) is provided.

In separating the uppermost wafer 22a,
Rotating plate 1 via ball screw 108 by motor 107
06 is rotated in the clockwise direction in FIG. 14 about the support shaft 106a, and the separation roller 109 is brought into contact with the upper surface of the uppermost wafer 22a. In this state, the motor 110 rotates the separation roller 109 counterclockwise in FIG. The rotation of the separation roller 109 gives a moving force in the carrying direction to the uppermost wafer 22a. As a result, the separating operation of the uppermost wafer 22a is promoted.

The lift table 87 for supporting the work 22 is driven by the motor 8 every time the uppermost wafer 22a is separated one by one.
8 is once lowered through the ball screw 89 and then raised. By this rise, the uppermost wafer 22a is placed near the water surface (a position corresponding to the upper surface of the shooter 111). Further, in association with the elevation of the elevating table 87, the elevating table 93 supporting the second cassette 29 is lowered by the motor 94 via the ball screw 95 at a pitch corresponding to the arrangement interval of the storage shelves 29a. As a result of this lowering, the empty storage shelf 29a of the second cassette 29 moves near the water surface (shooter 1
11) is arranged at a position corresponding to the upper surface of 11. as a result,
The stacked wafers 22a on the elevating table 87 are reliably separated one by one, and the separated wafers 22a are surely sorted and stored one by one on each storage rack 29a in the second cassette 29. .

All storage shelves 29 in the second cassette 29
After the wafer 22a is stored in a, the elevating table 93 is lifted up to a predetermined upper end position by the motor 94 via the ball screw 95. In this state, the cassette support base 96 is rotated 90 degrees in the clockwise direction in FIG. 14 about the support shaft 96a by the cylinder 97. By this rotation, the second cassette 2
The wafer 22a in 9 is arranged such that its axis extends along the arrangement direction of each device on the frame 20.

(Fifth Step and Sixth Step) As shown in FIGS. 4 and 9, the precise cleaning device 30 includes a first cleaning device 30a in charge of the fifth step ST5 and a first cleaning device 30a in charge of the sixth step ST6. It has two cleaning devices 30b. First cleaning device 30
a and the second cleaning device 30b have the same structure, and the precise cleaning tank 113 is provided with the overflow portion 113a around each of them.
have. Hot water tank 11 equipped with a heater 114a
4 is arranged adjacent to the precise cleaning tank 113. Water is supplied into the warm water tank 11 through a water supply passage 115 having a valve 115a. The water in the hot water tank 114 is heated to about 70 ° C. by the heater 114a.
The hot water in the tank 114 is the pump 116a and the valve 1.
A fine cleaning tank 113 is provided via a supply path 116 having 16b.
Supplied within.

The heat-retaining heater 117 is provided in the precise cleaning tank 113 in order to keep the hot water supplied into the precise cleaning tank 113 at a constant temperature. An ultrasonic oscillator 118 as an ultrasonic wave generating means is arranged in the precise cleaning tank 113. Wafer 22a stored in second cassette 29
Is immersed in warm water in the precise cleaning tank 113. In this state, the ultrasonic oscillator 118 generates ultrasonic waves for cleaning the wafer 22a. A swinging device (not shown) is provided in each of the fine cleaning tanks 113. The rocking device rocks the second cassette 29 in the precise cleaning tank 113 up and down in order to enhance the cleaning effect on the wafer 22a. As a result, the wafer 22a, while being accommodated in the second cassette 29, is repeatedly washed over the two steps of the fifth step ST5 and the sixth step ST6. At the time of this cleaning, the contaminated air in the fine cleaning tank 113 is forcibly exhausted from the introduction port 113b through the exhaust passage 119.

(Seventh Step) As shown in FIGS. 4 and 10, the precision cleaning device 30 includes a third step which is in charge of the seventh step ST7.
It has a cleaning device 30c. The third cleaning device 30c is
Finishing cleaning tank 1 equipped with an overflow section 122a around
22. The warm water tank 123 equipped with the heater 123a and the overflow section 123b is the finish cleaning tank 1
It is arranged adjacent to 22. Water is supplied to the inside of the hot water tank 123 in a heated state via a hot water supply device 124a and a water supply passage 124 having a valve 124b. The hot water in the hot water tank 123 is heated to about 70 ° C. by the heater 123a. The warm water in the tank 123 is supplied into the finish cleaning tank 122 via the supply path 125 having the pump 125a and the valve 125b.

The warming heater 126 is used in the finish cleaning tank 122.
In order to keep the hot water supplied therein at a constant temperature, it is arranged in the finish cleaning tank 122. Ultrasonic oscillator 12
7 is arranged in the finish cleaning tank 122. The wafer 22 a accommodated in the second cassette 29 is immersed in warm water in the finish cleaning tank 122. In this state, the ultrasonic oscillator 127 as the ultrasonic wave generating means is operated by the wafer 22a.
Generate ultrasonic waves for rinsing. As a result, the cleaning liquid attached to the wafer 22a and the second cassette 29 is removed. A swinging device (not shown) is provided in the finish cleaning tank 122. The swing device is the wafer 22a.
Second cleaning tank 122 in order to improve the cleaning effect of
The cassette 29 is rocked up and down.

During the rinsing, the contaminated air in the finish cleaning tank 122 is forcibly exhausted from the inlet 122b through the exhaust passage 128. Overflow part 122a of finish cleaning tank 122 and overflow part 1 of hot water tank 123
The warm water that overflows into the hot water tank 23b passes through the guide path 129 to the hot water tank 6 in the rough cleaning device 24a shown in FIG.
5 and is reused for rough cleaning of the work 22.

When the rinsing and cleaning of the wafer 22a is completed in the finish cleaning tank 122, the third transfer device 38 causes the second cleaning operation to be performed.
The cassette 29 is slowly pulled up from the warm water in the tank 122. As the wafer 22a is pulled up, the surface of the wafer 22a in the second cassette 29 is dried by its own heat.

(Eighth Process) As shown in FIGS. 2, 4, and 11, the drying device 31 in charge of the eighth process ST8 includes a drying chamber 132. The conveyor 133 is the drying chamber 13
It is disposed on the inner bottom portion of No. 2. The wafer 22 a pulled up from the warm water in the finish cleaning tank 122 is placed on the conveyor 133 while being accommodated in the second cassette 29. The air nozzle 134 is arranged in the drying chamber 132 so as to face one end of the conveyor 133. The air nozzle 134 blows air toward the wafer 22a for a certain period of time. Since the wafer 22a has been heated by the hot water in the finish cleaning tank 122 in the seventh step ST7, it is quickly dried as the air is blown.

When the blowing of air is completed, the wafer 22
The a is moved to a position separated from the air nozzle 134 by the conveyor 133, and is held stationary at that position for a certain period of time. Therefore, the wafer 22a and the second cassette 29 are uniformly dried over the entire surface.

During the drying process, the moist air in the drying chamber 132 is discharged from the inlet 132a to the exhaust passage 1.
It is forcedly exhausted via 35. After the drying process,
The second cassette 29 accommodating the wafers 22 a is delivered from the drying chamber 132 by the conveyor 133 and delivered to the carry-out device 39.

Next, the work holding device 32, the first transfer device 34, the cassette transfer device 36, the second transfer device 35 and the third transfer device 38 will be described in detail.

(Work Holding Device) As shown in FIGS. 2 and 3, the work holding device 32 includes a holding arm 139 and a pair of guide rods 138 for supporting the holding arm 139 so that the holding arm 139 can move forward and backward with respect to the frame 20. Is equipped with. The work 22 carried in by the carry-in device 33 is
It is temporarily held by the holding arm 139 in the advanced position. The holding arm 139 holding the work 22 is retracted by the motor 140 via the ball screw 141. As a result, the work 22 is arranged at a position corresponding to the preliminary cleaning device 21 in charge of the first step ST1.

(First Transfer Device) As shown in FIGS. 2 and 3, the first transfer device 34 is provided with a moving base 145 supported on the front surface of the frame 20 via a pair of guide rails 144. The movable base 145 is movable along the longitudinal direction of the guide rail 144, that is, the arrangement direction of the devices on the frame 20. The lifting table 147 is supported on the lower surface of the moving table 145 so as to be able to move up and down via a pair of guide rods 146. The support member 148 is supported on the lower surface of the lift 147 so as to be rotatable around a vertical axis. The support member 148 includes a pair of support arms 148a that can be opened and closed and a support pin 148b that can be opened and closed. Two support pins 148b are provided corresponding to each support arm 148a.

The moving table 145 is horizontally moved by the motor 149 via the rack 150 or the like, and the holding device 32, the preliminary cleaning device 21, the temporary placing table 25, the rough cleaning device 24a, the peeling device 27, and the separation / accommodation device 28 are moved. Are arranged at the positions corresponding to. The lift 147 is raised and lowered by a motor 151 at a position corresponding to each device via a ball screw or the like (not shown). With this rise and fall, the support member 148 approaches or separates from each device.

The support arm 148a of the support member 148 is
The support plate 23 of the work 22 is gripped with the closing operation, and the support plate 23 is released with the opening operation. The support arm 148 a that performs such an operation moves the work 22 among the holding device 32, the preliminary cleaning device 21, and the temporary placing table 25, and moves the work 22 to the first cassette 2 on the temporary placing table 25.
Store for 6. On the other hand, the support pin 148b of the support member 148 engages with the locking hole 52a of the first cassette 26 with the closing operation, and disengages from the locking hole 52a with the opening operation. The support pin 148b performing such an operation moves the first cassette 26 containing the work 22 among the temporary placing table 25, the rough cleaning device 24a, the peeling device 27, and the separation accommodating device 28.

When the work 22 is moved from the holding device 32 to the preliminary cleaning device 21, the support member 148 is rotated 90 degrees in the horizontal plane by the cylinder 152. When the support member 148 is rotated, the axis of the work 22 is aligned with the frame 20.
The orientation of the work 22 is changed so that the workpiece 22 extends in a direction orthogonal to the arrangement direction of the above devices. Work 22
The supporting member 148 is also rotated by 90 degrees in the horizontal plane by the cylinder 152 even when the first cassette 26 accommodating is moved from the peeling device 27 onto the support base 85 of the separation accommodating device 28. The rotation of the support member 148 changes the orientation of the work 22 so that the axis of the work 22 extends in the transport direction (the direction indicated by the arrow A in FIG. 14).

(Cassette Transfer Device) As shown in FIGS. 2 to 4, the cassette transfer device 36 includes a conveyor 155 laid on the frame 20. The supply window 156 is formed in the frame 20 at a position corresponding to the end of the conveyor 155. The conveyor 155 is used for the empty second cassette 2 loaded by the cassette loading device 37.
9 is transferred to a position corresponding to the supply window 156.

The supply mechanism 157 is arranged so as to be retractable from the supply window 156. The supply mechanism 157 has a pair of supply arms 157a that can be opened and closed. The supply mechanism 157 holds the second cassette 29 on the conveyor 155 by the supply arm 157a, and separates and stores the second cassette 29.
To the upper position. After that, the third transfer device 38
Receives the second cassette 29 from between the supply arms 157 a and places it on the cassette support base 96 of the separation and accommodation device 28.

(Third Conveying Device) As shown in FIG.
The transfer device 38 includes a moving base 161 supported on the front surface of the frame 20 via a pair of guide rails 160. The movable table 161 is arranged in the longitudinal direction of the guide rail 160,
That is, it is possible to move along the arrangement direction of each device on the frame 20. The elevating table 162 is supported on the lower surface of the moving table 161 so as to be able to ascend and descend via a pair of guide rods 163. The pair of support rods 164 are attached to the lower surface of the lift 162 so as to be able to open and close.

The moving table 161 is moved by the motor 165 via the rack 166 and the like. By this movement, the support rod 164 causes the cassette transfer device 36 and the first cleaning device 3 to move.
0a, the second cleaning device 30b, the third cleaning device 30c, and the drying device 31 are arranged at the respective positions.
The elevating table 162 is moved up and down by a motor 167 via a ball screw (not shown) at a position corresponding to each device. With this rise and fall, the support rod 1
64 is moved toward or away from each device. The support rod 164 is opened and closed by the cylinder 168. The support rod 164 holds the second cassette 29 with the closing operation, and opens the second cassette 29 with the opening operation. Support rod 16 performing such an operation
4 moves the second cassette 29 between the respective devices.

(Second Transport Device) Next, the second transport device 35
Will be described in detail. As shown in FIGS. 3 and 15 to 17, the recess 171 is formed in the frame 20. The pair of guide rails 172 are arranged parallel to each other inside the recess 171 so as to extend in the horizontal direction. Mobile platform 1
73 is movably supported by a guide rail 172, and a mounting plate 174 is fixed to the front surface of the guide rail 172 so as to extend downward.

The support base 85 of the separation / accommodation device 28 is rotatably supported by the support shaft 175 at the lower end of the mounting plate 174. As shown in FIGS. 3, 15 and 16, the work 22 accommodated in the first cassette 26 is supported on the support base 85 such that its axis extends substantially in the horizontal direction.

The ball screw 176 is rotatably supported in the recess 171 so as to extend parallel to the guide rail 172. The female screw body 177 fixed to the moving table 173 is
It is screwed onto the ball screw 176. The motor 178 is mounted in the frame 20, and its motor shaft has a pulley 17
Ball screw 176 through 9, 180 and belt 181
It is connected to. Ball screw 17 by motor 178
As 6 is rotated, the moving base 173 is moved along the guide rail 172. With the movement of the moving table 173, the work 22 on the supporting table 85 is moved in the lateral direction.

The turning lever 182 is rotatably supported by the moving table 173 by a turning shaft 183 via a pair of bearings 184. The tip of the rotating lever 182 is connected to the free end of the support base 85 via a connecting link 185. The pair of long cam plates 186 are mounted in the frame 20 via a mounting plate 187. Both cam plates 18
A cam groove 188 is formed between the six. Cam groove 188
Has a first groove 188a extending horizontally, an inclined second groove 188b, and a third groove 188c extending horizontally. The rotating arm 189 is fixed to the rotating shaft 183. An engaging roller 190 that engages with the cam groove 188 is rotatably supported at the tip of the rotating arm 189.

As the movable table 173 is moved to the right from the left side position shown in FIG. 15, the engaging roller 190 moves along the first to third grooves 188a to 188c of the cam groove 188. In the moving zone Z1 in which the engagement roller 190 is engaged with the first groove 188a, the work 22 is laterally moved without rotating the support base 85. In the movement zone Z2 in which the engagement roller 190 is engaged with the second groove 188b, the support base 85 moves clockwise through the rotation arm 189, the rotation shaft 183, the rotation lever 182, and the connection link 185. It is rotated 90 degrees. By this rotation, as shown in FIGS. 15 and 17, the work 2
The 2 is turned so that its axis extends from a substantially horizontal orientation to a substantially vertical orientation.
In the movement zone Z3 in which the engagement roller 190 is engaged with the third groove 188c, the work 22 is laterally moved while the direction of the work 22 is changed without the support base 85 being rotated.

(Overall Operation) Next, the overall operation of the wafer processing system configured as described above will be described.

In this processing system, the work 22 cut into a wafer shape by the wire saw is delivered to the holding device 32 at the advanced position. Next, the work 22 on the holding device 32 is gripped by the support arm 148 a of the first transfer device 34 via the support plate 23. After that, the holding device 32 retracts. The work 22 is turned 90 degrees in the horizontal plane by the first transfer device 34, and then immersed in the preliminary cleaning device 21 that is in charge of the first step ST1. The work 22 is placed in the preliminary cleaning device 21,
It is pre-washed by bubbling.

On the other hand, an empty first cassette 26 is placed on the temporary placing table 25. The rotary operation body 58 is fitted to the operation portion 57c of the screw rod 57 provided in the first cassette 26. The first transfer device 34 grasps the work 22 that has been immersed for the longest time among the plurality of works 22 immersed in the preliminary cleaning device 21 by the support arm 148a and pulls up the work 22, and temporarily places the work 22. It is accommodated in the first cassette 26 above 25. After accommodation, the control device 40
Based on the detection result of the ultrasonic sensor 51, the rotary operation body 5
The drive source 50 of No. 8 is controlled to rotate the screw rod 57.
As a result, the distance between the pair of regulation plates 59 is adjusted, and the wafers 22a of the work 22 are held between the regulation plates 59 so as not to fall.

Next, the support pin 148 of the first transfer device 34.
b, the first cassette 26 on the temporary placing table 25 is moved to the second
It is transported into the rough cleaning device 24a which is in charge of the process ST2. The work 22 is roughly washed by jetting high-pressure hot water in the rough cleaning device 24a while being housed in the first cassette 26.

Subsequently, the support pin 14 of the first transfer device 34
8b, the first cassette 26 in the rough cleaning device 24a
Are transported to the peeling device 27 (which also serves as the additional cleaning device 24b) in charge of the third step ST3. Work 2
No. 2 is housed in the first cassette 26, and is cleaned by ultrasonic waves in the additional cleaning device 24b. Further, the adhesive 23c between the support plate 23 and each wafer 22a of the work 22 is swollen or melted by ultrasonic waves,
Each wafer 22a is separated from the support plate 23. Work 2
The support plate 23 peeled off from No. 2 is taken out from the first cassette 26.

Next, the support pin 14 of the first transfer device 34.
8b, the first cassette 26 is pulled up from the additional cleaning device 24b and rotated 90 degrees in the horizontal plane, and then the fourth cassette
It is conveyed onto the support base 85 of the separation / accommodation device 28 that is in charge of the process ST4. Next, the support table 85 is rotated 90 degrees in the vertical plane about the support shaft 175 while being moved rightward in FIG. 3 by the second transfer device 35. As a result, the wafer 22a is transferred from the first cassette 26 onto the support arm 90. After that, the support base 85 supporting the empty first cassette 26 is moved back to the left in FIG. 3 by the second transfer device 35. Empty first cassette 2 on support 85
6 is transferred onto the temporary table 25 by the first transfer device 34.

On the other hand, the supply mechanism 157 receives the empty second cassette 29 from the conveyor 155. The second cassette 29 is transported by the third transport device 38 onto the cassette support base 96 of the separation / accommodation device 28. The wafer 22a laminated and supported on the support arm 90 is formed by ejecting water from the first and second ejection nozzles 98 and 99 and separating the roller 10.
By the rotation of 9, the uppermost one is separated one by one, and is accommodated in the second cassette 29.

A predetermined number of wafers 2 are placed in the second cassette 29.
After the 2a is accommodated, the second cassette 29 is raised by the motor 94 of the cassette support mechanism 92, and
The cylinder 97 rotates 90 degrees about the support shaft 96a and faces upward. Subsequently, the second cassette 29 is gripped by the support rod 164 of the third transfer device 38, and inside the first cleaning device 30a that handles the fifth step ST5 and the second cleaning device 30b that handles the sixth step ST6. It is transported in order. While the wafer 22a is accommodated in the second cassette 29, it is finely cleaned by ultrasonic waves in each of the cleaning devices 30a and 30b.

Thereafter, the second cassette 29 is moved from the inside of the second cleaning device 30b to the seventh step ST by the third transfer device 38.
7 is conveyed into the third cleaning device 30c. The wafer 22a is stored in the second cassette 29 and
In the cleaning device 30c, it is rinsed by ultrasonic waves.

When the cleaning is completed, the second cassette 29 is
After being slowly pulled up from the third cleaning device 30c by the third transfer device 38, it is transferred into the drying device 31 which is in charge of the eighth step ST8. The wafer 22a and the second cassette 29 are dried by blowing air in the drying device 31. After completion of the drying process, the wafer 22a
The second cassette 29 accommodating is sent out from the drying device 31 by the conveyor 133 and is delivered to the carry-out device 39.

The effects expected from the above embodiment will be described below.

(1) In order to send the wafer 22a to other steps after the eighth step ST8, the wafers 22a are housed in the second cassette 29 in a state of being separated one by one. However, the wafer 22a is cleaned in the first step ST1 to the third step ST3 before being stored in the second cassette 29. That is, the wafer 22a is washed in the exposed state before being surrounded by the second cassette 29. Therefore, the wafer 2
2a can be reliably washed in a short time. Moreover, the second cassette 29 is not contaminated by the cutting chips and the abrasive grains attached to the wafer 22a. In addition, it is possible to prevent the wafer 22a from being damaged by cutting chips or abrasive grains during the process until the wafer 22a is stored in the second cassette 29.

(2) The wafer 22a before being accommodated in the second cassette 29 is cleaned by the cleaning device 24.
The cleaning device 24 has a rough cleaning device 24a and an additional cleaning device 24b. The wafer 22a is a rough cleaning device 2
After being roughly cleaned by jetting warm water in 4a, it is further cleaned by ultrasonic waves in the additional cleaning device 24b. Therefore, the cleaning of the wafer 22a can be effectively performed by dividing it into rough cleaning and additional cleaning.

(3) The additional cleaning device 24b also serves as the peeling device 27. During the additional cleaning of the wafer 22a by ultrasonic waves, the adhesive 23c between the support plate 23 and each wafer 22a is swollen or melted by the ultrasonic wave, and each wafer 22a is reliably separated from the support plate 23 in a short time. .

(4) Wafer 22a by cleaning device 24
Prior to the cleaning of the wafer 22a,
Inside, it is pre-cleaned by fine bubbles while being immersed in the cleaning liquid. Therefore, chips and the like adhering to the surface of the wafer 22a are removed by the cleaning device 24 from the wafer 2
Since the wafer 22a can be almost removed prior to the cleaning of 2a, the cleaning of the wafer 22a by the cleaning device 24 can be performed efficiently in a short time.

(5) The chips, abrasives, etc. adhering to the surface of each wafer 22a of the work 22 are dried by the wafer 2
The adhesion to 2a becomes stronger. To prevent this,
Work 22 after cutting, which has been carried in by the carry-in device 33
Is immersed in the cleaning liquid in the preliminary cleaning device 21, and is stored in a wet state until it is transported to the next step. By storing the wafer 22a in a wet state, the subsequent cleaning of the wafer 22a by the cleaning device 24 can be performed more effectively.

(6) The wafer 22a before being accommodated in the second cassette 29 is conveyed between the processes ST1 to ST3 while being accommodated in the first cassette 26. Therefore, it is possible to prevent the wafer 22a from being damaged during the transportation, and the transportation can be easily performed.

(7) Wafer 22 in first cassette 26
The regulation plate 59 prevents the a from falling. For this reason,
Damage to the wafer 22a is prevented. Further, the wafer 22
In the step of separating the wafer a one by one, the wafer 22
The handling of a becomes easy.

(8) The length of the work 22 accommodated in the first cassette 26 in the axial direction is determined by the ultrasonic sensor 5
It is measured based on the detection result of 1. Then, according to the length of the work 22, the distance between the regulation plates 59 is accurately adjusted. Therefore, each wafer 22a of the work 22 is
Can be reliably held between both regulation plates 59. Moreover, the obtained measurement result can be used for various controls in the subsequent steps.

(9) Wafer 2 by the separation / accommodation device 28
The separation of 2a is performed using a water stream. Therefore, the wafer 22a can be separated without damaging it.

(10) At the time of separating the wafer 22a by the separating / accommodating device 28, the separating roller 109 gives a moving force to the uppermost wafer 22a in the carrying direction. Therefore, the separating operation of the wafer 22a is promoted.

(11) Wafer 22a is separated and accommodated in device 2
After being separated one by one by 8 and accommodated in the second cassette 29, they are cleaned again by the precise cleaning device 30. Therefore, it is possible to more reliably remove the dirt attached to the surface of the wafer 22a and also remove the dirt on the second cassette 29.

(12) The precise cleaning device 30 has a first cleaning device 30a, a second cleaning device 30b, and a third cleaning device 30c. Therefore, the precise cleaning of the wafer 22a can be effectively performed by dividing it into two cleanings by ultrasonic waves and a final cleaning by ultrasonic waves. Further, by moving the wafer 22a up and down in warm water by the rocking device, the cleaning can be performed more effectively.

(13) The wafer 22a is used in the precise cleaning device 3
While being heated by the warm water in 0, the cleaning device 30 is slowly pulled up together with the second cassette 29. As a result, due to the surface tension action of water, the wafer 22a
Water droplets are easily removed from the surface of the wafer and the wafer 22a dries quickly.

(14) The wafer 22a is the precision cleaning device 30.
After being thoroughly washed in a state of being immersed in warm water, the product is pulled out from the warm water and dried by the drying device 31.
For this reason, it is possible to uniformly and surely dry the entire wafer 22a in the state where it is accommodated in the second cassette 29, and it is possible to prevent adverse effects on other steps after the eighth step ST8.

The present invention can be modified and embodied as follows.

(1) The peeling device 27 is separately installed without also serving as the additional cleaning device 24b of the cleaning device 24.

(2) In a processing system in which the peeling device 27 is installed separately from the cleaning device 24, a plurality of jet nozzles are arranged in the peeling tank, and the wafer 22 is fed from these jet nozzles.
It should be configured such that steam is sprayed on the portion where a and the support plate 23 are adhered to separate the wafer 22a from the support plate 23 by a steam bath.

(3) The amount of liquid supplied to each of the cleaning tanks of the above-mentioned embodiment is provided with a drainage port so that the upper surface of the liquid stored in each tank has a predetermined position. And to circulate the liquid while adjusting the discharge amount. By doing so, it is possible to prevent the contaminants removed by cleaning from accumulating on the bottom of each tank.

Next, a second embodiment of the present invention will be described with reference to FIG.

In the first embodiment, the preliminary cleaning device 21
As a result, the wafer 22a is washed in the liquid by bubbling by jetting air. On the other hand, in the second embodiment, as shown in FIG. 20, instead of bubbling, cleaning is performed with a jet water flow. In this case, for example, a plurality of nozzles 192 for spraying the cleaning liquid from four directions are provided on the outer periphery of the wafer 22a in the preliminary cleaning tank 42. The wafer 22a is arranged above the surface of the cleaning liquid in the preliminary cleaning tank 42. The cleaning liquid sprayed from the nozzle 192 is used by circulating the cleaning liquid in the tank 42. Other configurations are the same as those of the first embodiment, and those having the same structure are denoted by the same reference numerals and the description thereof will be omitted. This allows
Efficient cleaning can be done in a short time.

Next, a third embodiment of the present invention will be described with reference to FIG.

In the first embodiment, the separating / accommodating device 28 is used.
The separation roller 109 in No. 2 was formed of foam rubber or foam resin. On the other hand, in the third embodiment, as shown in FIG. 21, the separation roller 109 includes the inner layer 193 and the thin outer layer 1 surrounding the inner layer 193.
And 94. The inner layer 193 is made of foam rubber or foam resin. The outer layer 194 is made of solid rubber and has a thickness of, for example, about 1 to 2 mm.

In other words, the separating roller 109 of the second embodiment has the flexible inner layer 193 and the relatively hard outer layer 194 surrounding the inner layer 193. The inner layer 193 may be an air chamber. The separation roller 109 as described above has sufficient elasticity, is excellent in abrasion resistance, and has little change in the friction coefficient of the surface over time.

When the separating roller 109 is formed of only foam rubber or foam resin, the moving force is surely imparted to the wafer 22a due to the frictional resistance with the wafer 22a. However, with use, the surface of the separation roller 109 is clogged with dirt substances, and the friction coefficient of the surface of the roller 109 gradually decreases. Moreover, the foam material is easily worn.

On the other hand, the surface of the separating roller 109 of the third embodiment is solid rubber, so that it is more excellent in abrasion resistance than the foam material, and the coefficient of friction does not change over time. Moreover, the separation roller 109 has an inner layer 193.
It also guarantees sufficient elasticity. Therefore, the separation of the wafer 22a is always performed stably. In addition, the frequency of exchanging the separation roller 109 is low, and the workability is improved.

Next, a fourth embodiment of the present invention will be described with reference to FIG.

As shown in FIG. 22, in the fourth embodiment, two jet nozzles 196 for jetting water upward are provided at the lower inside of the shooter 111 in the separation / accommodation device 28. The water jetted from the jet nozzle 196 is
It is jetted up through a gap between the shooter 111 and the laminated wafer 22a. As shown by the chain double-dashed line in FIG. 22, when the uppermost wafer 22a is separated and transferred to the upper surface of the shooter 111, the wafer 22a is separated by the shooter 11a.
It is slightly lifted by the water sprayed from between 1 and the laminated wafer 22a. As a result, the adhesion between the uppermost wafer 22a and the wafer 22a immediately below it is weakened. Therefore, the separating operation of the wafer 22a becomes smooth and further promoted. The sprayed water flows on the shooter 111 in the transport direction. Note that the number of the ejection ports 196 is not necessarily two, and may be one or three or more.

[0172]

Since the present invention is constructed as described above, it has the following effects.

A large number of sliced wafers are cleaned by the cleaning means while being stuck to the support plate and gathered in a columnar shape, and then separated from the support plate by the separation means. Further, the peeled wafers are then transported to the separating / accommodating means, separated one by one by the separating / accommodating means, and accommodated in the container. Therefore, the cleaning and peeling of the wafer, and further, the respective processing operations such as separation and accommodation in the container,
It can be carried out continuously and efficiently. Further, since the cleaning of the wafer is performed prior to the accommodation in the container, the wafer can be cleaned reliably and in a short time. Moreover, the container is not contaminated by the cutting chips and the abrasive grains adhering to the wafer. Further, it is possible to prevent the wafer from being scratched by chips or abrasive grains in the process of being stored in the container.

[Brief description of drawings]

FIG. 1 is a schematic front view showing a processing system according to a first embodiment of the present invention.

FIG. 2 is a schematic plan view of the processing system.

FIG. 3 is a perspective view showing first to fourth steps of the processing system.

FIG. 4 is a perspective view showing fifth to eighth steps of the processing system.

FIG. 5 is a piping diagram showing a first step of the processing system.

FIG. 6 is a piping diagram showing a second step of the processing system.

FIG. 7 is a piping diagram showing a third step of the processing system.

FIG. 8 is a piping diagram showing a fourth step of the processing system.

FIG. 9 is a piping diagram showing a fifth step and a sixth step of the processing system.

FIG. 10 is a piping diagram showing a seventh step of the processing system.

FIG. 11 is a piping diagram showing an eighth step of the processing system.

FIG. 12 is a vertical cross-sectional view of a first cassette used in the processing system.

FIG. 13 is a sectional view taken along line 13-13 in FIG. 12;

FIG. 14 is a perspective view showing a configuration of a fourth step of the processing system.

FIG. 15 is a front view showing the configuration of a second transfer device of the processing system.

16 is a cross-sectional view taken along line 16-16 of FIG.

FIG. 17 is a front view showing the operation of the second transport device.

FIG. 18A is a perspective view showing a work before cutting, and FIG. 18B is a perspective view showing the work after cutting.

FIG. 19 is a schematic side view of a wire saw.

FIG. 20 is a piping diagram showing a first step in the second embodiment of the present invention.

FIG. 21 is an enlarged cross-sectional view showing a separation roller according to a third embodiment of the present invention.

FIG. 22 is a partial perspective view showing a separation / accommodation device according to a fourth embodiment of the present invention.

[Explanation of symbols]

21 ... Preliminary cleaning device (preliminary cleaning means), 22 ... Work,
22a ... Wafer, 23 ... Support plate, 23c ... Adhesive, 24
... cleaning device (cleaning means), 24a ... rough cleaning device (first cleaning device), 24b ... additional cleaning device (second cleaning device), 2
6 ... 1st cassette as a support tool, 27 ... Peeling device (peeling means), 28 ... Separation accommodating device (separation accommodating means), 29
... second cassette as container, 30 ... precision cleaning device (final cleaning means), 30a ... first cleaning device, 30b ... second cleaning device, 30c ... third cleaning device, 31 ... drying device (drying device), 34 ... first transfer device (transfer device; first transfer device), 35 ... second transfer device (transfer device; posture changing device), 36 ... cassette transfer device (transfer device), 37 ... cassette loading device (transfer device) , 38 ... Third transfer device (transfer device; transfer device), 40 ... Control device (control device), 42 ... Cleaning tank, 47 ... Air nozzle (bubble generating device), 51 ... Ultrasonic sensor (measurement device), 55 ... holding rod (holding means) 57 ... screw rod (holding means), 59 ... regulating plate (holding means; regulating member), 60 ... supporting member (holding means), 64 ... injection nozzle (injecting means), 71 ... second Cleaning tank, 78 ... Ultrasonic generator (Ultrasonic Raw means), 109 ...
Separation rollers, 113, 122 ... Cleaning tanks, 118, 127
... Ultrasonic oscillator (ultrasonic generating means), 192 ... Nozzle,
193 ... Inner layer, 194 ... Outer layer, 196 ... Jet nozzle.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Noboru Katsumata 1 Himetoyama Technical Center Co., Ltd., Yokosuka City, Kanagawa Prefecture (72) Inventor Toyokazu Harada 1 Hime Toyama Technical Center, Yokosuka City, Kanagawa Prefecture 72) Inventor Shunzo Yoshida 1 Shinmeicho, Yokosuka City, Kanagawa Prefecture Hihira Toyama Technology Center Co., Ltd.

Claims (34)

[Claims] 1. A system for processing a large number of wafers formed by slicing a columnar work adhered to a supporting plate with an adhesive, wherein the wafer is still adhered to the supporting plate. A cleaning means for cleaning the wafer, a peeling means for peeling the cleaned wafer from the support plate in a state where the wafers are gathered in a columnar shape, and a transporting means for transporting the wafer at least from the cleaning means to the peeling means. Characteristic wafer processing system. 2. The first cleaning means roughly cleans the wafer to roughly remove dirt adhering to the wafer.
The wafer processing system according to claim 1, further comprising: a cleaning device; and a second cleaning device that cleans the wafer after the rough cleaning so as to almost completely remove contaminants attached to the wafer. 3. The wafer processing system according to claim 2, wherein the first cleaning apparatus includes a spraying unit that sprays hot water onto the wafer. 4. The wafer processing system according to claim 2, wherein the stripping unit also serves as a second cleaning device. 5. The peeling means comprises a cleaning tank for storing a heated liquid, the wafer being immersed together with the support plate in the liquid in the cleaning tank, and an ultra-cleaning tank disposed in the cleaning tank. The sound wave generating means and the ultrasonic waves generated by the ultrasonic wave generating means swell the adhesive between the support plate and the wafer in order to remove the dirt adhering to the wafer and separate the wafer from the support plate. 5. The wafer processing system of claim 4, further comprising melting. 6. A preliminary cleaning means for cleaning the wafer prior to cleaning the wafer by the cleaning means, and the transfer means for transferring the wafer from the preliminary cleaning means to the cleaning means. 6. The wafer processing system according to claim 1, wherein the wafer processing system is a wafer processing system. 7. The wafer processing system according to claim 6, wherein the preliminary cleaning means includes a cleaning tank for storing a liquid, and the wafer is immersed in the liquid in the cleaning tank. 8. The pre-cleaning means comprises bubble generating means for generating bubbles in the liquid in the cleaning tank.
The wafer processing system described in 1 .. 9. The pre-cleaning means comprises a plurality of nozzles for jetting a jet water stream onto the wafer.
The wafer processing system described in 1 .. 10. A separating / accommodating means for separating the wafers in a columnar state into a container by separating them one by one, and the transferring means transfers the wafers from the peeling means to the separating / accommodating means. The wafer processing system according to claim 1, wherein the wafer processing system is a wafer processing system. 11. A final cleaning means for finally cleaning the wafer accommodated in the container by the separating and accommodating means while the container is still accommodated in the container, and the transferring means finalizes the container accommodating the wafer from the separating and accommodating means. The wafer processing system according to claim 10, further comprising transporting the wafer to a cleaning unit. 12. The wafer processing system according to claim 11, wherein the final cleaning means is provided with a plurality of cleaning devices so as to perform the cleaning process of the wafer and the container a plurality of times. 13. The wafer processing system according to claim 11, wherein the final cleaning unit includes a cleaning tank that stores hot water, and the wafer is cleaned together with the container while being immersed in the warm water in the cleaning tank. 14. The final cleaning means comprises an ultrasonic wave generating means arranged in a cleaning tank, and the wafer and the container are cleaned by ultrasonic waves generated by the ultrasonic wave generating means.
The wafer processing system described in 1 .. 15. The wafer processing system according to claim 13, wherein the transfer unit pulls the wafer cleaned by the final cleaning unit together with the container out of the warm water. 16. A drying means for drying the wafer cleaned by the final cleaning means together with a container, and the transfer means for lifting the container containing the wafer from the final cleaning means and transferring it to the drying means. 16. The wafer processing system according to claim 15, wherein: 17. A portable support tool for supporting a wafer attached to a support plate; cleaning means for cleaning the wafer while the wafer is supported by the support tool; and peeling means for the wafer. Peeling from the support plate while being supported by the support tool.
6. The wafer processing system according to any one of 5 above. 18. The wafer processing system according to claim 17, wherein the support tool has a holding means for holding the posture of the wafer after being peeled off from the support plate. 19. The wafer processing system according to claim 18, wherein the holding means has a pair of restricting members for sandwiching the group of wafers from both end surfaces thereof in order to prevent the stacked wafers from falling down. 20. The wafer processing system according to claim 19, wherein the holding means further has an adjusting means for adjusting a distance between the both regulating members according to a dimension between both end faces of the group of wafers. 21. The wafer processing system according to claim 20, further comprising measuring means for measuring a dimension between both end surfaces of the group of wafers. 22. The wafer processing system according to claim 21, wherein said measuring means includes either an ultrasonic sensor or a laser length measuring device. 23. Separation and accommodating means for separating the wafers in a columnar state one by one and accommodating them in a container, and said support means for supporting the wafer, cleaning means, peeling means, and separation accommodating means. 18. The wafer processing system according to claim 17, further comprising a first transfer unit configured to transfer between the wafers. 24. The separating / accommodating means separates the stacked wafers one by one from the uppermost one so that the axes thereof extend substantially vertically. 24. The wafer processing system according to claim 23, further comprising attitude changing means for changing the attitude of the support member carried into the separating and accommodating means so that the axis of the group of wafers therein extends in a substantially vertical direction. 25. The wafer processing system according to claim 10, wherein the transfer means has a carry-in / carry-out means for carrying in an empty container into the separating / accommodating means and carrying out a container accommodating a wafer from the separating / accommodating means. 26. The wafer processing system according to claim 10, wherein the separation / accommodation means separates the wafers one by one by a water flow. 27. The wafer processing system according to claim 26, wherein the separation / accommodation means includes a separation roller that comes into contact with the wafer to be separated and applies a moving force in the separation direction. 28. The wafer processing system of claim 27, wherein the separating roller comprises an elastic inner layer and a relatively hard outer layer surrounding the inner layer. 29. The wafer processing system according to claim 26, wherein the separation / accommodation means includes a jet nozzle for jetting the wafer which is in the course of separation movement and floating the wafer by a water flow. 30. The wafer processing system according to claim 1, further comprising a control unit that controls the operations of the cleaning unit, the peeling unit, and the transfer unit according to a predetermined control program. 31. The wafer processing system according to claim 10, further comprising control means for controlling the operations of the cleaning means, the peeling means, the separating / accommodating means, and the carrying means in accordance with a predetermined control program. 32. The wafer processing system according to claim 11, further comprising control means for controlling the operations of the cleaning means, the peeling means, the separating and accommodating means, the final cleaning means and the transfer means in accordance with a predetermined control program. 33. The wafer according to claim 16, further comprising control means for controlling the operations of the cleaning means, the peeling means, the separating and accommodating means, the final cleaning means, the drying means and the carrying means according to a predetermined control program. Processing system. 34. A system for processing a large number of wafers formed by slicing a columnar work adhered to a supporting plate with an adhesive, wherein the wafer is still adhered to the supporting plate. Cleaning station for cleaning the wafer, a peeling station for peeling the cleaned wafers from the support plate in a state where the wafers are gathered in a column shape, and the wafers gathered in the column shape are separated one by one into a container. A wafer processing system having a separate storage station for storing.