JPH09235395A - Impregnation of resin liquid and apparatus for impregnation resin liquid - Google Patents

Impregnation of resin liquid and apparatus for impregnation resin liquid

Info

Publication number
JPH09235395A
JPH09235395A JP8043447A JP4344796A JPH09235395A JP H09235395 A JPH09235395 A JP H09235395A JP 8043447 A JP8043447 A JP 8043447A JP 4344796 A JP4344796 A JP 4344796A JP H09235395 A JPH09235395 A JP H09235395A
Authority
JP
Japan
Prior art keywords
resin liquid
sheet
shaped substrate
resin
impregnation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8043447A
Other languages
Japanese (ja)
Inventor
Toshio Ishioumaru
利雄 石王丸
Takashi Yamaguchi
孝 山口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP8043447A priority Critical patent/JPH09235395A/en
Publication of JPH09235395A publication Critical patent/JPH09235395A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Moulding By Coating Moulds (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a prepreg hardly containing voids. SOLUTION: This method for impregnating a resin liquid 3 is to continuously coat one surface side of a sheetlike substrate 1 comprising a fiber material with the resin liquid 3 and impregnate the sheetlike substrate 1 with the resin liquid 3. The sheetlike substrate 1 is heated at a lower temperature than the boiling point of a solvent contained in the resin liquid 3 applied to the sheetlike substrate 1 and one surface side of the sheetlike substrate 1 kept in the heated state is coated with the resin liquid 3 and further heated at a lower temperature than the boiling point of the solvent contained in the resin liquid 3.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、繊維材よりなるシ
ート状基材の片面側に連続的に樹脂液を塗布し、シート
状基材に樹脂液を含浸する樹脂液含浸方法及び含浸装置
に関するもので、産業機器用や電子機器用等のプリント
配線用基板などの電気絶縁板、化粧板等の積層板用のプ
リプレグを製造するのに適した樹脂液含浸方法及び含浸
装置を提供するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin liquid impregnation method and an impregnation apparatus for continuously applying a resin liquid to one side of a sheet-shaped base material made of a fiber material and impregnating the sheet-shaped base material with the resin liquid. The present invention provides a resin liquid impregnation method and an impregnation apparatus suitable for producing a prepreg for an electrical insulating plate such as a printed wiring board for an industrial device or an electronic device, or a laminated plate such as a decorative plate. is there.

【0002】[0002]

【従来の技術】従来、繊維材からなるシート状基材に樹
脂液を含浸させる場合、シート状基材を樹脂液に浸漬
し、樹脂液中に通して含浸させる操作がおこなわれる
が、この時シート状基材の繊維間にある気泡が抜けず、
プリプレグ内に気泡が残存したままであるのが普通であ
るため、このプリプレグを積層して得られる積層板にボ
イドが発生していることが多い。
2. Description of the Related Art Conventionally, when a sheet-like base material made of a fibrous material is impregnated with a resin liquid, an operation of immersing the sheet-like base material in the resin liquid and passing it through the resin liquid for impregnation is performed. Air bubbles between the fibers of the sheet-shaped substrate do not escape,
Since air bubbles usually remain in the prepreg, voids are often generated in the laminated plate obtained by laminating the prepreg.

【0003】このような従来法の有する問題点を解決す
る方法として、以下のような方法が開発された。図2に
示すように繊維材よりなるシート状基材の片面側に連続
的に樹脂液を塗布し、シート状基材に樹脂液を含浸させ
る装置が代表的である。即ち、ガイドロール6aを経
て、支持台4bとコーターロール或いはドクターナイフ
等のコーター4aとよりなる塗布装置4を使用して移送
されてくるシート状基材1の片面側に樹脂液供給装置2
より樹脂液3を塗布し含浸するものである。このように
樹脂液を含浸したシート状基材は、樹脂液に使用されて
いる溶剤の沸点より低い温度で加温され、このままある
いはさらに樹脂付着量の調整を行ない、しかる後高温で
加熱乾燥させて、含浸した樹脂を半硬化状態にしたプリ
プレグとされる。
The following method has been developed as a method for solving the problems of the conventional method. As shown in FIG. 2, a typical apparatus is one in which a resin liquid is continuously applied to one side of a sheet-shaped substrate made of a fibrous material to impregnate the sheet-shaped substrate with the resin liquid. That is, the resin liquid supply device 2 is provided on one side of the sheet-like base material 1 transferred using the coating device 4 including the support 4b and the coater roll or the coater 4a such as a doctor knife through the guide roll 6a.
Further, the resin liquid 3 is applied and impregnated. The sheet-shaped base material impregnated with the resin liquid is heated at a temperature lower than the boiling point of the solvent used for the resin liquid, and the amount of the resin attached is adjusted as it is or further, and then dried by heating at a high temperature. The impregnated resin is semi-cured to obtain a prepreg.

【0004】[0004]

【発明が解決しようとする課題】しかしながら、かかる
プリプレグの製造方法では、シート状基材が薄い場合は
ボイドのない良好なプリプレグを得ることができるが、
高濃度樹脂液(樹脂含有率55重量%以上)を通常の厚
さ(180〜200μm)ないしそれ以上のシート状基
材に含浸させると基材の繊維間に気泡が残存したプリプ
レグとなるという問題点が依然として残っている。本発
明はかかる問題点を解決するため、種々の検討の結果な
されたもので、その目的とするところは、シート状基材
への樹脂液の含浸をさらに十分かつ均一に行ない得るこ
とにより、高濃度樹脂液を使用した場合でも、シート状
基材中の気泡が極めて少ないプリプレグを得ることがで
きる樹脂液含浸方法、及びこれを最適に実施する含浸装
置を提供するにある。
However, according to such a prepreg manufacturing method, when the sheet-shaped substrate is thin, a good prepreg free of voids can be obtained.
When a high-concentration resin liquid (resin content 55% by weight or more) is impregnated into a sheet-shaped substrate having a normal thickness (180 to 200 μm) or more, a prepreg in which bubbles remain between the fibers of the substrate becomes a problem. The points still remain. The present invention has been made as a result of various studies in order to solve such a problem, and the purpose thereof is to make it possible to further sufficiently and uniformly impregnate a sheet-shaped substrate with a resin liquid, It is an object of the present invention to provide a resin liquid impregnation method capable of obtaining a prepreg having extremely few bubbles in a sheet-shaped base material even when a concentrated resin liquid is used, and an impregnation apparatus for optimally implementing the method.

【0005】即ち、本発明者らは設備の短小化及び効率
化を図るために鋭意検討した結果、樹脂液を塗布するシ
ート状基材を予め加温しておくことにより、さらに好ま
しくは、樹脂液も加温しておくことにより樹脂液がシー
ト状基材の繊維間へ浸透するのに要する時間を短くする
ことができ、塗布後の加温工程の装置を短小化すること
ができることを見出したものである。
That is, the inventors of the present invention have made earnest studies to shorten the equipment and improve the efficiency. As a result, it is more preferable to preheat the sheet-shaped substrate to which the resin liquid is applied, and more preferably It has been found that by heating the liquid as well, the time required for the resin liquid to permeate between the fibers of the sheet-shaped substrate can be shortened, and the device for the heating step after coating can be shortened. It is a thing.

【0006】[0006]

【課題を解決するための手段】本発明の樹脂液含浸方法
は、繊維材よりなるシート状基材の片面側に連続的に樹
脂液を塗布し、シート状基材に樹脂液を含浸させる含浸
方法において、前記シート状基材を加温し、その状態で
シート状基材の片面側に樹脂液を塗布した後、さらに樹
脂液に使用されている溶剤の沸点より低い温度で加温す
ることを特徴とする樹脂液含浸方法、及びかかる方法を
実施するためにシート状基材を加温する装置と、シート
状基材の片面側に樹脂液を塗布する装置と、これら装置
を経由して樹脂液が含浸されたシート状基材を加温する
装置とを有することにより、樹脂液を低粘度化し、シー
ト状基材の繊維間に十分かつ均一に含浸させることがで
きる樹脂含浸装置、に関するものである。
The resin liquid impregnation method of the present invention is an impregnation in which a resin liquid is continuously applied to one side of a sheet-like base material made of a fibrous material and the sheet-like base material is impregnated with the resin liquid. In the method, the sheet-shaped substrate is heated, and in that state, the resin liquid is applied to one side of the sheet-shaped substrate, and further heated at a temperature lower than the boiling point of the solvent used for the resin liquid. A method for impregnating a resin liquid, and a device for heating a sheet-shaped base material for carrying out such a method, a device for applying a resin liquid on one side of the sheet-shaped base material, and a device for applying the resin liquid through these devices. A resin impregnating device capable of lowering the viscosity of the resin liquid and sufficiently and uniformly impregnating the fibers of the sheet-shaped substrate by having a device for heating the sheet-shaped substrate impregnated with the resin liquid. It is a thing.

【0007】本発明は、シート状基材の片面側より樹脂
液を塗布する以前に、シート状基材を加温しておき、樹
脂液がシート状基材に接した時に樹脂液を低粘度化し、
基材の繊維間に含浸するのを促進させることを第一の特
徴とする。更には、予め樹脂液を加温することにより、
樹脂液がシート状基材に供給されても、シート状基材の
温度を低下させることなく、樹脂液を低粘度に保つこと
ができる。
In the present invention, the sheet-shaped substrate is heated before the resin liquid is applied from one side of the sheet-shaped substrate, and when the resin liquid comes into contact with the sheet-shaped substrate, the resin liquid has a low viscosity. Turned into
The first feature is to promote impregnation between the fibers of the base material. Furthermore, by heating the resin liquid in advance,
Even if the resin liquid is supplied to the sheet-shaped substrate, the resin liquid can be kept at a low viscosity without lowering the temperature of the sheet-shaped substrate.

【0008】樹脂液について説明する。樹脂は通常熱硬
化性樹脂で、エポキシ樹脂、ポリイミド樹脂、及びこれ
らの変性樹脂が好ましく使用されるが、その他、熱可塑
性樹脂、天然樹脂等の樹脂も使用され、それらに限定さ
れるものではない。また、充填材、着色剤、補強材を配
合することができ、水酸化アルミニウム、シリカ、タル
ク、炭酸カルシウム等も本発明の目的に反しない範囲に
おいて、必要により配合することができる。
The resin liquid will be described. The resin is usually a thermosetting resin, and epoxy resins, polyimide resins, and modified resins thereof are preferably used, but other resins such as thermoplastic resins and natural resins are also used, and are not limited to these. . Further, a filler, a colorant, and a reinforcing material can be blended, and aluminum hydroxide, silica, talc, calcium carbonate and the like can also be blended if necessary within the range not deviating from the object of the present invention.

【0009】溶剤は種々のものが使用可能であるが、従
来のものより高沸点のものが好ましい。ただし、160
℃を越えるものについては後の加熱乾燥工程で、樹脂液
中に含まれる溶剤を気化させ、さらには必要により樹脂
を半硬化の状態にさせる為に高エネルギーが必要となる
ので好ましくない。沸点が70℃以下の溶剤については
シート状基材に塗布した後、常温下でも徐々に気化する
とともに、突沸をさけるために加温する温度を50℃以
下にしなければならないが、加温温度が低くなると樹脂
液の低粘度化も小さく、繊維材への含浸性も不十分とな
り好ましくない。従って、通常は沸点が70〜160
℃、好ましくは100〜160℃の溶剤の単独あるいは
2種以上混合したものを使用する。好ましい溶剤の具体
例としては、ジメチルホルムアミド(沸点153℃)、
メチルイソブチルケトン(沸点116℃)、キシレン
(沸点140℃)、酢酸ブチル(沸点126℃)、プロ
ピレングリコールモノメチルエーテル(沸点120℃)
等がある。
Although various solvents can be used, those having a higher boiling point than conventional ones are preferable. However, 160
Those having a temperature of more than 0 ° C. are not preferable because they require high energy in order to vaporize the solvent contained in the resin liquid and further to make the resin semi-cured in the subsequent heat drying step. For a solvent with a boiling point of 70 ° C or lower, after being applied to a sheet-shaped substrate, it must be gradually vaporized even at room temperature, and the heating temperature must be 50 ° C or lower to avoid bumping. When it becomes low, the viscosity of the resin liquid is not lowered so much and the impregnation property into the fiber material becomes insufficient, which is not preferable. Therefore, the boiling point is usually 70 to 160.
Solvents at a temperature of 100 ° C., preferably 100 to 160 ° C. are used singly or as a mixture of two or more kinds. Specific examples of preferable solvents include dimethylformamide (boiling point 153 ° C.),
Methyl isobutyl ketone (boiling point 116 ° C), xylene (boiling point 140 ° C), butyl acetate (boiling point 126 ° C), propylene glycol monomethyl ether (boiling point 120 ° C)
Etc.

【0010】樹脂液の濃度は、本発明においては、従来
法と同じ50%程度でもよいが、好ましくは55〜70
%程度とする。このように高濃度とすることにより溶剤
の量を減少させることができる。
In the present invention, the concentration of the resin liquid may be about 50%, which is the same as in the conventional method, but is preferably 55 to 70.
%. With such a high concentration, the amount of solvent can be reduced.

【0011】本発明に用いる繊維材よりなるシート状基
材としては、ガラスクロス、ガラス不繊布、ガラスペー
パー等のガラス繊維基材の他、紙、合成繊維等からなる
織布や、不織布、金属繊維、カーボン繊維からなる織布
やマット類等が挙げられ、これらの基材の原料は単独又
は混合して使用してもよい。本発明の目的である含浸性
の向上効果の点からは、含浸性のよくないガラスクロス
等の織布が好ましく使用される。
Examples of the sheet-like base material made of the fiber material used in the present invention include glass fiber base materials such as glass cloth, glass non-woven cloth and glass paper, as well as woven cloth, non-woven cloth and metal made of paper, synthetic fiber and the like. Examples thereof include woven fabrics and mats made of fibers and carbon fibers, and the raw materials for these base materials may be used alone or as a mixture. From the viewpoint of the effect of improving the impregnating property which is the object of the present invention, a woven fabric such as a glass cloth having poor impregnating property is preferably used.

【0012】次に、樹脂液をシート状基材の片面側に塗
布し含浸する時、特に高濃度樹脂液では依然として粘度
が高く基材の繊維間への浸透が不十分であるため、塗布
工程を経たシート状基材を加温することにより、樹脂液
を低粘度化させて繊維間への含浸を促進させている。こ
の時樹脂液に使用している溶剤の沸点を越える温度に加
温すると、溶剤の急激な蒸発により樹脂液の高濃度化が
起こり、樹脂液の含浸が低下するとともに、脱泡ができ
ずに樹脂中に多量の発泡が生ずることとなる。この問題
を解決するために、樹脂液が塗布されたシート状基材を
その溶剤の沸点より低い温度で加温することが必要であ
る。好ましくは溶剤の沸点より20℃以上低い温度であ
る。また、温度が低すぎても低粘度化の効果が小さいの
で、最低50℃以上であることが好ましい。
Next, when the resin liquid is applied and impregnated on one side of the sheet-shaped substrate, particularly in the case of the high-concentration resin liquid, the viscosity is still high and the permeation between the fibers of the substrate is insufficient. By heating the sheet-shaped base material that has passed through, the viscosity of the resin liquid is reduced and the impregnation between the fibers is promoted. At this time, if the temperature is higher than the boiling point of the solvent used for the resin liquid, the concentration of the resin liquid will increase due to the rapid evaporation of the solvent, impregnation of the resin liquid will decrease, and defoaming will not be possible. A large amount of foaming will occur in the resin. In order to solve this problem, it is necessary to heat the sheet-shaped substrate coated with the resin liquid at a temperature lower than the boiling point of the solvent. The temperature is preferably 20 ° C. or more lower than the boiling point of the solvent. Further, since the effect of lowering the viscosity is small even if the temperature is too low, it is preferably at least 50 ° C or higher.

【0013】シート状基材、あるいはシート状基材及び
樹脂液を予め加温する温度についても、上述と同じ理由
で樹脂液に使用している溶剤の沸点より低い温度に保つ
ことが好ましい。加温温度は、一般的には溶剤の沸点よ
り20℃以上低い温度である。また、温度が低すぎても
低粘度化の効果が小さいので、最低50℃以上であるこ
とが好ましい。好ましくは50〜120℃であり、更に
好ましくは60〜80℃である。従って、本発明におい
て、樹脂液の溶剤として沸点70〜80℃程度のものを
使用することは樹脂液の低粘度化が十分にできず好まし
いとはいえない。加温温度が高いと、樹脂液の溶剤の蒸
発が多くなることがあり、また樹脂液をシート状基材に
含浸した後に加温して含浸性を高めるための前段工程で
あるので、通常は120℃を越える必要はない。
The temperature at which the sheet-shaped substrate, or the sheet-shaped substrate and the resin liquid are preheated, is preferably kept at a temperature lower than the boiling point of the solvent used in the resin liquid for the same reason as above. The heating temperature is generally 20 ° C. or more lower than the boiling point of the solvent. Further, since the effect of lowering the viscosity is small even if the temperature is too low, it is preferably at least 50 ° C or higher. The temperature is preferably 50 to 120 ° C, more preferably 60 to 80 ° C. Therefore, in the present invention, it is not preferable to use a solvent having a boiling point of about 70 to 80 ° C. as the solvent of the resin liquid because the viscosity of the resin liquid cannot be sufficiently lowered. If the heating temperature is high, the solvent of the resin liquid may evaporate more, and since it is a pre-stage process for heating the resin liquid after impregnating the sheet-shaped base material to increase the impregnation property, it is usually It is not necessary to exceed 120 ° C.

【0014】[0014]

【発明の実施の態様】以下、本発明の工程を順次説明す
る。
BEST MODE FOR CARRYING OUT THE INVENTION The steps of the present invention will be sequentially described below.

【0015】(シート状基材加温工程)繊維材からなる
シート状基材を連続的に移送しながら加温装置により加
温し、次の樹脂液塗布工程に供される。これにより、樹
脂液を塗布した時点から樹脂液が低粘度化して、シート
状基材へ含浸するため、従来の設備よりシート状基材の
加温工程の設備を短小化でき、効率のよいプリプレグの
製造を達成することができる。
(Sheet-shaped base material heating step) The sheet-shaped base material made of a fibrous material is heated by a heating device while being continuously transferred, and is subjected to the next resin liquid coating step. This reduces the viscosity of the resin liquid when it is applied and impregnates it into the sheet-shaped base material, so that the equipment for the heating process of the sheet-shaped base material can be shortened compared to conventional equipment, and efficient prepreg Can be achieved.

【0016】(樹脂液塗布工程)高濃度樹脂液を、含浸
槽に貯溜しこれにシート状基材を浸漬するのではなく、
必要量の樹脂液をシート状基材に供給し、片面側より塗
布することにより、樹脂液からの溶剤の揮発を抑え、高
濃度樹脂液を一定の濃度、粘度に保持することが出来
る。樹脂液は、前述のように、シート状基材に塗布する
前に加温して低粘度化しておくことが、含浸性を向上さ
せるために好ましい。
(Resin Liquid Coating Step) High concentration resin liquid is not stored in the impregnation tank and the sheet-shaped substrate is immersed therein,
By supplying the required amount of the resin liquid to the sheet-shaped substrate and applying it from one side, it is possible to suppress the volatilization of the solvent from the resin liquid and to maintain the high-concentration resin liquid at a constant concentration and viscosity. As described above, it is preferable that the resin liquid is heated to have a low viscosity before being applied to the sheet-shaped substrate in order to improve the impregnation property.

【0017】(樹脂含浸シート状基材加温工程)高濃度
樹脂液を塗布されたシート状基材を加温することによ
り、樹脂液を低粘度化させ、繊維材中の空気との置換を
容易に行わせる工程である。この加温はシート状基材の
樹脂液を塗布した面の反対面側より行う方が、含浸性を
より向上させることとなる。樹脂液を塗布した面より加
温するとシート状基材より先に樹脂液の温度が上昇する
ため、樹脂液が低粘度化してもシート状基材の方が低温
のために、樹脂液の温度を高くすることができず、低粘
度化を妨げ、含浸性を低下させることとなるので好まし
くない。両面より加温してもよいが、その効果は前述の
樹脂液を塗布した面の反対面側より加温する方法よりも
少ないことは明らかである。
(Resin-impregnated sheet-shaped substrate heating step) By heating the sheet-shaped substrate coated with the high-concentration resin liquid, the viscosity of the resin liquid is reduced and the air in the fiber material is replaced. This is an easy process. If this heating is performed from the side opposite to the surface of the sheet-shaped substrate on which the resin liquid is applied, the impregnation property will be further improved. If the temperature of the resin liquid rises before the sheet-shaped substrate when heated from the surface coated with the resin liquid, the temperature of the resin liquid is low because the temperature of the sheet-shaped substrate is lower even if the viscosity of the resin liquid decreases. Cannot be increased, which hinders lowering of viscosity and lowers impregnability, which is not preferable. It is possible to heat from both sides, but it is clear that the effect is less than in the method of heating from the side opposite to the side coated with the resin liquid.

【0018】(加熱乾燥工程)この工程は好ましくは樹
脂液に使用している溶剤の沸点より高い温度で加熱乾燥
することにより樹脂液中の溶剤を気化させ、さらには必
要により樹脂を半硬化の状態にしたプリプレグを得るこ
とができる。加熱乾燥方式は従来より実施されている方
式を用いればよく、特に限定されるものではない。
(Heating and drying step) In this step, the solvent in the resin liquid is vaporized by heating and drying at a temperature higher than the boiling point of the solvent used for the resin liquid, and if necessary, the resin is semi-cured. It is possible to obtain a prepreg in a state. The heating and drying method may be a conventionally used method and is not particularly limited.

【0019】上記の方法を実施するために、本発明の樹
脂液含浸装置においては、シート状基材は、これを樹脂
液の溶剤の沸点より低い温度に加温するために、電熱、
蒸気等により加温されたプレート、ロール等の加温装置
の表面に密着して移送され、連続的にシート状基材の片
面側に樹脂供給装置から樹脂液が供給、塗布される。上
記プレート、ロール等の加温装置には、その上部にシー
ト状基材からの放熱を防止するために別に電気ヒーター
等の輻射熱を利用した加温装置を付設してもよい。
In order to carry out the above method, in the resin liquid impregnating apparatus of the present invention, the sheet-shaped substrate is heated by an electric heat in order to heat it to a temperature lower than the boiling point of the solvent of the resin liquid.
The resin solution is transferred in intimate contact with the surface of a heating device such as a plate or roll heated by steam or the like, and the resin liquid is continuously supplied and applied to one side of the sheet-shaped substrate from the resin supply device. A warming device such as an electric heater that utilizes radiant heat may be attached to the upper part of the heating device such as the plate or the roll in order to prevent heat radiation from the sheet-shaped substrate.

【0020】本発明の樹脂液含浸方法及び樹脂液含浸装
置では繊維材よりなるシート状基材を加温装置に密着さ
せて移送させることによりシート状基材を加温している
ので、樹脂液を塗布した時点から樹脂液が低粘度化し
て、シート状基材へ含浸するため、従来の設備より樹脂
液含浸シート状基材の加温装置を短小化でき、効率のよ
いプリプレグの製造を達成することができる。加えて、
樹脂液はその溶剤の沸点より低い温度に加温することに
より低粘度を安定して保つことができ、シート状基材へ
の含浸を促進することができる。シート状基材を加温す
る装置として回転したヒートロールを使用する方がシー
ト状基材を一定の温度に保持できるので好ましい。
In the resin liquid impregnating method and the resin liquid impregnating apparatus of the present invention, the sheet-shaped base material is heated by adhering the sheet-shaped base material made of a fibrous material to the heating device so that the sheet-shaped base material is heated. Since the resin liquid becomes less viscous from the time of application and is impregnated into the sheet-shaped base material, the heating device for the resin liquid-impregnated sheet-shaped base material can be shortened compared to conventional equipment, and efficient production of prepreg is achieved. can do. in addition,
By heating the resin liquid to a temperature lower than the boiling point of the solvent, a low viscosity can be stably maintained, and impregnation into the sheet-shaped substrate can be promoted. It is preferable to use a rotating heat roll as a device for heating the sheet-shaped substrate because the sheet-shaped substrate can be kept at a constant temperature.

【0021】図1は本発明の樹脂液含浸方法及び樹脂液
含浸装置の具体例を示したものであるが、本発明はかか
る具体例によって限定されるものではない。ガラスクロ
ス1を巻出し、ガイドロール6a、6bを経て加温した
ヒートロール4cとコーターロール或いはドクターナイ
フ等のコーター4aよりなる塗布装置に移送する。樹脂
液3を上部に加温装置2aを設置した樹脂液供給装置2
よりガラスクロス1上に供給し塗布する。ヒートロール
4cとコーターロール或いはドクターナイフ等のコータ
ー4aとの間には所定間隔のギヤップを設けておくとよ
い。片面側に樹脂液が塗布されたガラスクロスは直ちに
加温装置5に送られ下面側より熱風によって樹脂液の溶
剤の沸点より低い温度に加温される。その後さらに加熱
乾燥装置により加熱乾燥して、好ましくは溶剤の沸点よ
り高い温度で加熱乾燥して所望のプリプレグを得ること
ができる。
FIG. 1 shows a concrete example of the resin liquid impregnation method and the resin liquid impregnation apparatus of the present invention, but the present invention is not limited to such a concrete example. The glass cloth 1 is unwound, passed through guide rolls 6a and 6b, and transferred to a coating device including a heated heat roll 4c and a coater roll or a coater 4a such as a doctor knife. Resin liquid supply device 2 having resin liquid 3 on which a heating device 2a is installed
It is supplied on the glass cloth 1 and applied. It is advisable to provide a gap at a predetermined interval between the heat roll 4c and the coater roll or a coater 4a such as a doctor knife. The glass cloth coated with the resin liquid on one surface side is immediately sent to the heating device 5 and heated from the lower surface side to a temperature lower than the boiling point of the solvent of the resin liquid by hot air. After that, it is further heat-dried by a heat-drying device and preferably heat-dried at a temperature higher than the boiling point of the solvent to obtain a desired prepreg.

【0022】[0022]

【実施例】210g/m2 のガラスクロス1を4m/分
の速度で巻出し、ガイドロール6a、6bを経て80℃
に加温したヒートロール4cとコータロール4aよりな
る塗布装置に移送し、上部に加温装置2aを付設した樹
脂液供給装置2より下表に示す組成のエポキシ樹脂液3
をガラスクロス上に約258g/m2 の割合で供給し塗
布した。この時のヒートロール4cとコーターロール4
aとの間のギヤップは予め0.32mmに調整しておく。
片面側に樹脂液が塗布されたガラスクロスは直ちに加温
装置5に送り、下面側より雰囲気温度120℃の熱風に
よって1分間加温した。さらに溶剤の沸点より高い18
0℃で加熱乾燥して樹脂量約43重量%のプリプレグを
得た。このプリプレグ中に発生しているボイド数(5.
2mm2の面積内)を50倍顕微鏡により数えて下記に示
した。
[Example] 210 g / m 2 of glass cloth 1 was unwound at a speed of 4 m / min, passed through guide rolls 6a and 6b and heated to 80 ° C.
The epoxy resin liquid 3 having the composition shown in the table below is transferred from the resin liquid supply device 2 which is transferred to a coating device composed of a heated heat roll 4c and a coater roll 4a and which is additionally provided with a heating device 2a on the upper portion.
Was applied and coated on a glass cloth at a rate of about 258 g / m 2 . Heat roll 4c and coater roll 4 at this time
Adjust the gap between a and 0.3a in advance.
The glass cloth coated with the resin liquid on one surface side was immediately sent to the heating device 5 and heated from the lower surface side with hot air having an ambient temperature of 120 ° C. for 1 minute. 18 higher than the boiling point of the solvent
It was heated and dried at 0 ° C. to obtain a prepreg having a resin amount of about 43% by weight. Number of voids generated during this prepreg (5.
(Within an area of 2 mm 2 ) is shown below by counting with a 50 × microscope.

【0023】 <樹脂液組成> 粘調樹脂 エポキシ樹脂 153.6重量部 溶剤 ジメチルホルムアミド 98.6 (沸点153℃) 硬化剤 ジシアンジアミド 3.5 硬化促進剤 イミダゾール 0.15 樹脂液固形分 約61.5重量%<Resin Liquid Composition> Viscosity Resin Epoxy Resin 153.6 parts by weight Solvent Dimethylformamide 98.6 (boiling point 153 ° C.) Curing agent Dicyandiamide 3.5 Curing accelerator imidazole 0.15 Resin liquid solid content about 61.5 weight%

【0024】比較のために、図2に示す従来の装置を使
用した。即ち、実施例に示した装置において、加温装置
2aのない樹脂液供給装置2を使用していること、及び
塗布装置4におけるヒートロール4cの代わりに加温し
てない支持台4bを使用する以外は前記実施例と同様の
装置を使用し、同じ条件にて含浸し乾燥して樹脂量約4
3重量%のプリプレグを得た。このプリプレグ中に発生
しているボイド数(5.2mm2の面積内)を50倍顕微鏡
により数えて下表に示した。
For comparison, the conventional device shown in FIG. 2 was used. That is, in the apparatus shown in the embodiment, the resin liquid supply device 2 without the heating device 2a is used, and the unheated support base 4b is used in place of the heat roll 4c in the coating device 4. Other than that, the same apparatus as in the above-mentioned example was used, and impregnation and drying were performed under the same conditions to obtain a resin amount of about 4
3% by weight of prepreg was obtained. The number of voids (in the area of 5.2 mm 2 ) generated in this prepreg was counted by a 50 times microscope and is shown in the table below.

【0025】<プリプレグ中のボイド数> 実施例 0個 比較例 20〜30個<Number of Voids in Prepreg> 0 in Example 20 to 30 in Comparative Example

【0026】[0026]

【発明の効果】本発明の方法及び装置に従うと、シート
状基材を予め加温しておくことにより、樹脂液中の溶剤
の蒸発を抑えながら、樹脂液を低粘度に保ち、シート状
基材の繊維間に十分にかつ均一に樹脂液を含浸すること
ができる。その上に、樹脂液をシート状基材に供給した
時点から直ちにシート状基材の繊維間への含浸が始まる
ため、従来の設備より加温工程の装置を短小化できボイ
ドの極めて少ないプリプレグを得ることができる。
EFFECTS OF THE INVENTION According to the method and apparatus of the present invention, by heating the sheet-shaped substrate in advance, it is possible to prevent the solvent in the resin liquid from evaporating and to keep the resin liquid at a low viscosity. The resin liquid can be sufficiently and uniformly impregnated between the fibers of the material. Furthermore, since the impregnation between the fibers of the sheet-shaped base material starts immediately after the resin liquid is supplied to the sheet-shaped base material, the heating process equipment can be shortened compared to conventional equipment, and a prepreg with extremely few voids can be obtained. Obtainable.

【図面の簡単な説明】[Brief description of drawings]

【図1】 本発明の含浸装置の具体例を示す概略図。FIG. 1 is a schematic diagram showing a specific example of an impregnating apparatus of the present invention.

【図2】 従来の含浸装置の具体例を示す概略図。FIG. 2 is a schematic view showing a specific example of a conventional impregnation device.

【符号の説明】[Explanation of symbols]

1 シート状基材 2 樹脂液供給装置 2a 樹脂液加温装置 3 樹脂液 4 塗布装置 4a コーターロール或いはドクターナイフ 4b 支持台 4c ヒートロール 5 加温装置 6a、6b ガイドロール 1 Sheet-shaped substrate 2 Resin liquid supply device 2a Resin liquid heating device 3 Resin liquid 4 Coating device 4a Coater roll or doctor knife 4b Support 4c Heat roll 5 Heating device 6a, 6b Guide roll

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 繊維材よりなるシート状基材の片面側に
連続的に樹脂液を塗布し、シート状基材に樹脂液を含浸
させる含浸方法において、前記シート状基材を加温し、
その状態でシート状基材の片面側に樹脂液を塗布した
後、さらに樹脂液に含有されている溶剤の沸点より低い
温度で加温することを特徴とする樹脂液含浸方法。
1. In an impregnation method in which a resin liquid is continuously applied to one side of a sheet-shaped substrate made of a fibrous material and the sheet-shaped substrate is impregnated with the resin liquid, the sheet-shaped substrate is heated.
A resin liquid impregnation method, characterized in that, in that state, a resin liquid is applied to one side of a sheet-shaped base material, and then heated at a temperature lower than the boiling point of a solvent contained in the resin liquid.
【請求項2】 前記シート状基材を加温するために、静
止または回転するヒートロール或いは固定したヒートプ
レートを使用する請求項1記載の樹脂液含浸方法。
2. The resin liquid impregnation method according to claim 1, wherein a stationary or rotating heat roll or a fixed heat plate is used to heat the sheet-shaped substrate.
【請求項3】 予め加温した状態の樹脂液を前記シート
状基材に供給し塗布する請求項1記載の樹脂液含浸方
法。
3. The resin liquid impregnation method according to claim 1, wherein the resin liquid in a preheated state is supplied and applied to the sheet-shaped substrate.
【請求項4】 繊維材よりなるシート状基材を加温する
装置と、このシート状基材の片面側に樹脂液を塗布する
装置と、これら装置を経由して樹脂液が塗布されたシー
ト状基材を加温する装置とを有することを特徴とする樹
脂液含浸装置。
4. A device for heating a sheet-shaped substrate made of a fibrous material, a device for applying a resin liquid to one side of the sheet-shaped substrate, and a sheet to which the resin liquid is applied via these devices. And a device for heating the base material.
【請求項5】 樹脂液を加温した状態でシート状基材上
に供給する樹脂液供給装置を備えている請求項4記載の
樹脂液含浸装置。
5. The resin liquid impregnating apparatus according to claim 4, further comprising a resin liquid supply device that supplies the resin liquid onto the sheet-shaped base material in a heated state.
JP8043447A 1996-02-29 1996-02-29 Impregnation of resin liquid and apparatus for impregnation resin liquid Pending JPH09235395A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8043447A JPH09235395A (en) 1996-02-29 1996-02-29 Impregnation of resin liquid and apparatus for impregnation resin liquid

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8043447A JPH09235395A (en) 1996-02-29 1996-02-29 Impregnation of resin liquid and apparatus for impregnation resin liquid

Publications (1)

Publication Number Publication Date
JPH09235395A true JPH09235395A (en) 1997-09-09

Family

ID=12663966

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8043447A Pending JPH09235395A (en) 1996-02-29 1996-02-29 Impregnation of resin liquid and apparatus for impregnation resin liquid

Country Status (1)

Country Link
JP (1) JPH09235395A (en)

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