JPH09235166A - Joint structure of metal member with ceramics member and production thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a joint structure that is composed of a metal member and ceramics member with no fear of causing cracking and fracture in the ceramics member of the structure when subjected to heat cycles or kept at high temperature by reducing residual stress in the ceramics member at the time when both the members are jointed by fitting at least a part of the metal member into a fitting hole of the ceramics member. SOLUTION: This joint structure is obtained in such a way that at least a part of a metal member 12 is fitted into a fitting hole 6 of ceramics member by providing a 0.2-mm or wider gap 14 between the bottom face 12b of the metal member and the side-wall face 6c of the fitting hole 6, forming a joint section 16, in which the metal member is joined with the ceramic member 1, between the bottom face 12b of the metal member and the bottom face 6b of the fitting hole, and exposing a part of the joint section 16 in the gap 14 so as to cover the bottom face of the fitting hole.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a joint structure between a ceramic member and a metal member and a method for manufacturing the same.

[0002]

2. Description of the Related Art Aluminum nitride has properties such as high thermal conductivity, high electrical insulation, low thermal expansion, and low dielectric constant, so it is used in various applications such as substrate materials for high power semiconductor devices. Has been done. In particular, the joined body of the aluminum nitride member and the metal member has various configurations and is used for various purposes. For example, in ceramic heaters, electrostatic chucks, high-frequency electrodes, etc. used in semiconductor manufacturing equipment, aluminum nitride members and various ceramic members, aluminum nitride members and thermocouple set fittings, and aluminum nitride members. It is necessary to join between the electrode and the electrode.

Conventionally, as a method of joining a ceramic member to a metal member, a brazing material is interposed between the ceramic member and the metal member, and the brazing material is heated and melted to perform the joining. Has been. However, although many brazing materials for metals are known, all of the brazing materials have poor wettability with respect to ceramic members, particularly non-oxide ceramics. Therefore, as the brazing material for joining the non-oxide ceramic member to the metal member, etc., a brazing material containing an active metal such as titanium or zirconium is used to improve the wettability of the brazing material. Has been done. For example, “Aluminum Nitride-Metal Joining” (Yoshikuni Nakao, “Light Metal Welding”, Vol. 31, 1993).
No. 8 pages 359-365), Ag-C as a brazing material for joining aluminum nitride with copper.
Various alloys such as u-based alloys and Ag-Cu-Ti-based alloys have been tested, and a brazing material made of these alloys should contain titanium, zirconium, niobium, hafnium and vanadium as active metals. It has been known.

[0004]

The present inventor, when manufacturing a ceramics heater, an electrostatic chuck and a high frequency electrode used in a semiconductor manufacturing apparatus, forms a hole in a substrate made of aluminum nitride, silicon nitride or the like by machining. Form, expose the internal metal electrode in this hole,
It has been proposed to insert a cylindrical metal fitting into this hole and braze the tip surface of the metal fitting (Japanese Patent Application No. 7-21657).

However, as the present inventor further studied, it was found that the following problems would occur. That is, although it was successful in ensuring the prescribed bonding strength and conductivity in the initial stage, a thermal cycle test between room temperature and 600 ° C and a long-term holding test at 600 ° C were performed, and it was found that In some cases, a crack was generated around the side wall surface of the aluminum nitride substrate, or the crack propagated.

An object of the present invention is to provide a joining structure in which at least a part of a metal member is housed in a housing hole of a ceramic member and the metal member and the ceramic member are joined together.
Even if the stress remaining in the ceramic member is reduced and the joined body is subjected to a thermal cycle between high temperature and low temperature, or if it is held at high temperature for a long time, the ceramic member may be cracked or damaged. It is to lose.

[0007]

A joining structure according to the present invention joins a metal member and a ceramic member having a housing hole for housing at least a part of the metal member. It is housed in the housing hole, and a gap portion having a width of 0.2 mm or more is provided between the side wall surface of the metal member and the metal member on the bottom surface side of the metal member to join the metal member and the ceramic member. The bonding layer is formed between the bottom surface of the metal member and the bottom surface of the housing hole, and a part of the bonding layer is exposed in the gap so as to cover the bottom surface of the housing hole.

Further, in the joining structure according to the present invention, when the metal member and the ceramic member having the accommodation hole for accommodating at least a part of the metal member are joined, the metal member is accommodated in the accommodation hole. The metal member includes a main body and a tip portion projecting from the main body to the bottom surface side of the accommodation hole, and a gap portion surrounded by the tip portion, the main body, the side wall surface of the accommodation hole, and the bottom surface of the accommodation hole. Is formed,
A joining layer for joining the metal member and the ceramic member is formed between the bottom surface of the metal member and the bottom surface of the accommodation hole, and a part of the joining layer is exposed in the gap so as to cover the bottom surface of the accommodation hole. It is characterized by doing.

Further, according to the present invention, when manufacturing a joint structure of a metal member and a ceramic member having a housing hole for housing at least a part of the metal member, the metal member is housed in the housing hole. , A gap having a width of 0.2 mm or more is provided between the side wall surface of the housing hole and the metal member at least on the bottom surface side of the metal member, and the bonding material is interposed between the metal member and the bottom surface of the housing hole to bond the metal member. The bonding material is heated to form a bonding layer between the bottom surface of the metal member and the bottom surface of the accommodation hole, and a part of the bonding layer is exposed in the gap so as to cover the bottom surface.

Further, according to the present invention, in manufacturing a joint structure of a metal member and a ceramic member having a housing hole for housing at least a part of the metal member, the metal member is housed in and from the body. The metal member is accommodated from the tip end side into the accommodation hole, and the tip end and the accommodation hole are provided. The joining material is interposed between the bottom surface of the metal member and the bottom surface of the metal member, and a gap is formed by the tip portion, the main body, the side wall surface of the housing hole, and the bottom surface of the housing hole. It is characterized in that a bonding layer is formed between the bonding layer and the bottom surface of the above, and a part of this bonding layer is exposed in the gap so as to cover the bottom surface.

Hereinafter, the means for solving the problems of the present invention will be described in detail with reference to FIGS.

The inventor of the present invention first carried out an experiment for joining a metal member 2 to a ceramic member 1 having a form as shown in FIG. 1 (a). Here, a mesh electrode 5 as described later is embedded in the ceramic member 1 and is integrally sintered. A circular recess 1c is formed on the rear surface 20 side of the member 1, and an accommodation hole 6 having a substantially circular cross section is formed inside the recess 1c. In this example, prior to housing the cylindrical metal member 2 in the housing hole 6, the metal foil 4 was formed so as to cover the bottom surface 6b of the housing hole 6 and the bottom surface side portion of the side wall surface 6c. Therefore, the metal foil 4 has a horizontal portion 4a that covers the bottom surface 6b.
And a vertical portion 4b that covers the bottom surface side of the side wall surface 6c.

The bottom surface 2b of the metal member 2 and the bottom surface 6b of the receiving hole.
And were opposed to each other, and a flat plate-shaped brazing material 7 was interposed therebetween. The side wall surface 2a of the metal member 2 and the side wall surface 6 of the housing hole 6
By adopting a structure in which the bending stress applied to the metal member 2 is relieved by reducing the size t of the gap between the metal member c and c as much as possible.

By brazing in this state,
As shown in FIG. 1B, the metal member 2 and the ceramic member 1 were successfully joined by the joining layer 8. However, when a thermal cycle test or a high temperature holding test is performed after joining, cracks as indicated by 30 may occur. FIG. 2 is an enlarged view of the vicinity of the corner of the metal member 2 in this joint structure.

The present inventor has examined the reason for this,
In this process, it was noted that a part of the brazing material rises a slight gap between the metal member 2 and the side wall surface 6c of the accommodation hole. That is, during brazing, the brazing filler metal 7 has fluidity, so that the brazing filler metal flows toward the peripheral portion of the accommodation hole due to a slight load applied to the metal member 2 and the own weight of the metal member 2. At this time, the clearance between the metal member 2 and the side wall surface of the accommodation hole is made as small as possible, and is usually 0.05 mm or less. For this reason, the brazing material rises up to a position where the clearance is high. That is, 8 of the bonding layers 8
Although a is formed between the bottom surface 2b of the metal member and the bottom surface 6b of the accommodation hole, 8b is formed between the side wall surface 2a of the metal member and the side wall surface 6c of the accommodation hole.

However, at the time of cooling immediately after the brazing material, the tensile stress resulting from the difference in thermal expansion between the brazing material and the ceramic member 1 acts in the ceramic member in the lengthwise direction of the elongated bonding layer 8b. Moreover, this bonding layer 8
Since b is also strongly restrained by the metal member 2, the stress due to the difference in thermal expansion between the brazing material and the ceramic member cannot be released. Therefore, it is considered that there is residual stress in the ceramic member, which causes cracks 30 to occur in the ceramic member during thermal cycling or high temperature holding, or cracks that already exist are propagated.

In FIG. 2, a chamfering member 2c is formed on the corner member of the metal portion 2, and a radius 6a is formed on the corner portion 6a of the accommodation hole 6 for convenience of processing. Further, 11 indicates the uppermost part of the bonding layer 6c.

The present inventor further examined this joint structure,
Typically, a joint structure having a configuration as shown in FIGS. 3 (a), 3 (b) and FIG. 4 has been conceived. That is, although the main body 12f of the metal member 12 has a substantially circular shape, the front end side of the main body 12f is formed with a front end portion 12d having a small size when viewed in the width direction of the accommodation hole, that is, a small diameter. That is, a ring-shaped recess 12c is formed on the side of the tip 12d.

A metal foil 33 is formed so as to cover the bottom surface 6b of the accommodation hole 6. At this time, both ends of the metal foil 33 are covered up to the radius 6a of the accommodation hole, but the side wall surface 6 of the accommodation hole 6 is covered.
Do not form up to c. The disc-shaped brazing material 13 is arranged on the metal foil 33.

The metal member 12 is housed in the housing hole 6, and the bottom surface 12b of the tip portion 12d is opposed to the brazing material 13. By brazing in this state,
As shown in (b), the bonding layer 16 is formed between the bottom surface 12b of the metal member and the bottom surface 6b of the accommodation hole. The size t of the gap 15 between the side wall surface 12a of the main body 12f of the metal member and the side wall surface 6c of the accommodation hole is made as small as possible within a range in which the metal member 12 can be inserted.

FIG. 4 is an enlarged view of the main part of the joining structure shown in FIG. Main body 12f, tip 12d, bottom surface 6b of accommodation hole
And the side wall surface 6c forms the gap portion 14. The bonding layer 1 is provided between the bottom surface 12b of the metal member and the bottom surface 6b of the accommodation hole.
6a is formed, but as a result of the flow, a part of the brazing material flows from the bottom surface 12b of the metal member toward the gap portion 14. At this time, the bottom surface 6 of the accommodation hole is in the gap portion 14.
Since the peripheral portion of b, the radius 6a, and the side wall surface 6c are exposed, the brazing material flows in this order so as to wet the surface exposed to the accommodation hole.

At this time, the brazing material is the side wall surface 1 of the tip portion 12d.
Since it easily gets wet with respect to 2e, it slightly rises along the side wall surface 12e. As a result, the first raised portion 16b extending along the side wall surface 12e of the metal member is generated. In addition, the metal foil 33 is provided on the entire bottom surface 6b of the accommodating hole with a radius 6a.
By including so as to cover the bottom surface 6b as well, the bottom surface 6b is easily wetted by the brazing material including its peripheral portion, and as a result, the brazing material is wetted along the side wall surface 6c. Therefore, the raised portion 16d is formed by the brazing material slightly raised along the side wall surface, and the depressed portion 16c is formed between the raised portions 16b and 16d.

The bonded body having such a structure has extremely high durability against heat cycles and the like even when the same material as the bonded structure of FIGS. 1 and 2 is used, and cracks are generated inside the ceramic member 1. It turned out not to.
The reason for this is that, unlike the structure shown in FIGS.
It is considered that the bonding layer exposed in the gap portion 14 does not have a long and narrow shape tightly constrained between the ceramic member and the metal member, and the surface of the bonding layer is exposed in the gap portion 14. Therefore, even if a difference in thermal expansion occurs between the brazing material and the ceramic member, this is absorbed by the flow and deformation of the brazing material.

Moreover, by adopting a bonding layer having a depressed portion between the first raised portion and the second raised portion, stress is applied to the metal member 12 in the horizontal direction in FIG. When applied, this stress is received by the raised portions 16b and 16d, so that the joint strength against the stress in this direction is further improved. Moreover, the depressed portion 16c is provided between the raised portions 16b and 16d.
By making the bonding layer in this portion thinner, the residual stress applied to the ceramic member from the bonding layer can be reduced.

In order to obtain the advantageous effects of the present invention, the distance u between the side wall surface of the metal member and the side wall surface of the receiving hole must be 0.2 mm or more. In order to further improve the action and effect of the present invention, it is preferable to set this to 0.5 mm or more. On the other hand, when the distance is too large, the bonding layer is hard to reach the side wall surface 6c of the accommodation hole, and as a result, when the metal member is stressed in the width direction of the accommodation hole, Easy to peel off. Therefore, the distance is preferably 10 mm or less.

At this time, a constant value can be set between the side wall surface of the metal member and the side wall surface of the accommodating hole over the entire area from the joint portion to the outlet of the accommodating hole. The effect can be achieved (in this case, since the dimension of the metal member in the cross-sectional direction is constant, the tip and the gap portion 14 having a small dimension are not generated). However, in this case, since the gap between the side wall surface of the accommodation hole and the side wall surface of the metal member is large, the metal member peels off when stress is applied to the metal member in the width direction of the accommodation hole. Easier to do.

Therefore, it is preferable to provide the above-mentioned gap portion. At this time, the side wall surface 12a of the metal member 12 and the housing hole 6
By setting the distance t from the side wall surface 6c to 0.1 mm or less, when a stress is applied to the metal member in the width direction of the accommodation hole, this stress can be greatly relieved. However, if t is too small, it becomes difficult to perform the step of inserting the metal member into the accommodation hole. Therefore, t is preferably 0.02 mm or more.

The dimension s of the gap portion 14 viewed in the depth direction of the accommodation hole 6 is not particularly limited, but is preferably 0.5 to 5 mm.

In the present invention, the metal member inside the ceramic member is partially exposed by exposing a part of the metal member inside the ceramic member to join the ceramic member and the brazing material. At the same time, the metal exposed portion exposed between the ceramics can be joined to the brazing material. Thereby, the joining strength between the ceramic member and the metal member can be further improved. By adopting such a unique joining structure, a strong joining force can be obtained even if the ceramic member is hard to be wetted by the brazing material.

Here, in FIGS. 3B and 4, a part of the metal 5 inside the ceramic member is exposed on the bottom surface 6b of the accommodation hole 6 to partially form the metal exposed portion 5A. . The ceramic member 1 and the bonding layer 16a can be bonded (bonding portion 9), and the metal exposed portion 5A can also be bonded to the bonding layer 16a (bonding portion 1).
0).

In the present invention, the material of the ceramic member is not limited, but it is particularly suitable for non-oxide ceramics such as aluminum nitride, silicon nitride, silicon carbide and sialon, and further for nitride ceramics. Also,
The material of the metal member is not particularly limited, but refractory metals such as nickel, molybdenum, tungsten, platinum, rhodium and alloys thereof are particularly suitable.

The chemical composition of the brazing material is not particularly limited. However, it is preferable to use a brazing material that has good bonding strength or wettability with respect to the ceramic member itself. Particularly, in a joined body for use in exposure to a halogen-based corrosive gas, it is preferable to use a dense alumina member or an aluminum nitride member as the ceramic member. In this case, the main components are Cu and Ni. , One or more metals selected from the group consisting of Ag, Al, and
0.3-10 wt% of one or more active metals selected from the group consisting of Mg, Ti, Zr, Hf and beryllium
A brazing material containing (preferably 5% by weight or less) is preferable, but an active metal is not essential.

The content ratio of the main component is 1 based on the total weight of the brazing material.
When the amount is set to 00% by weight, it is the balance obtained by subtracting the content ratio of the active ingredient and the additive components other than the active ingredient from 100% by weight. However, the main component must be contained in an amount of 50% by weight or more, and the upper limit is 99.5% by weight.
In particular, when a brazing filler metal whose main component is Al is used, since the joining is performed at a low temperature, the thermal stress after joining becomes small. When a foil made of an active metal is used, a pure metal can be used as the brazing material.

If the amount of the active metal compounded is less than 0.3% by weight, the wettability may be deteriorated and the bonding may not be achieved. 50
If it exceeds 5% by weight, the reaction layer at the bonding interface becomes thick and cracks may occur.

As additive components other than the active metal, Si,
It is preferable to use at least one of Al, Cu and In because it does not affect the main component.

Further, if the total compounding amount of the additive components other than the active metal exceeds 50 wt%, intermetallic compounds increase and cracks may occur at the joint interface, so that 5
It is preferably 0 wt% or less. This additive component may not be contained.

An aluminum alloy braze containing 1 to 2% by weight of magnesium and 9 to 12% by weight of silicon is most preferable from the viewpoint of improving wettability.

Further, upon joining, copper, on the bottom surface of the receiving hole or on the surface of the brazing material facing the bottom surface of the receiving hole,
It is more preferable to provide a film made of one or more metals selected from the group consisting of aluminum and nickel by a method such as sputtering, vapor deposition, friction welding, plating and insertion of a metal foil. These films have the effect of improving the wettability with the brazing material. Further, in joining, on the bottom surface of the housing hole, or on the surface of the brazing material facing the bottom surface of the housing hole, a film made of one or more metals selected from the group consisting of magnesium, titanium, zirconium and hafnium, It is more preferable to provide it by a method such as sputtering, vapor deposition, friction welding, plating and insertion of a metal foil. These films have the effect of improving the reaction with the brazing material. The thickness of each of these metal films is preferably 0.5 to 5 μm.

In the embodiment in which the electrodes are embedded inside the ceramic member, a ceramic heater in which a resistance heating element is embedded in the ceramic member, a ceramic electrostatic chuck in which electrodes for electrostatic chuck are embedded in the ceramic member, and a ceramic member are embedded in the ceramic member. An active device such as a heater with an electrostatic chuck in which a resistance heating element and an electrode for electrostatic chuck are embedded, and an electrode device for high frequency generation in which a plasma generating electrode is embedded in a ceramic member can be exemplified.

Furthermore, a dummy wafer, a shadow ring,
Examples of the device include a tube for generating high frequency plasma, a dome for generating high frequency plasma, a high frequency transmission window, an infrared transmission window, a lift pin for supporting a semiconductor wafer, and a shower plate.

[0041]

EXAMPLE FIG. 5 is a sectional view showing an example in which the present invention is applied to an electrostatic chuck. Reference numeral 21 is an electrostatic chuck body made of a disk-shaped ceramic member. Such an electrostatic chuck having a high-frequency electrode is often used in a halogen-based corrosive gas atmosphere, and in such a corrosive atmosphere, aluminum nitride or dense alumina may have corrosion resistance. Because I know
The ceramic member is preferably made of aluminum nitride or dense alumina.

Reference numeral 22 is an electrode joint portion. In the vicinity of the rear surface 21b inside the main body 1, a mesh electrode or mesh 3 is formed.
1 is buried. The mesh 31 can be used as a resistance heating element or an electrostatic chuck electrode. A housing hole 26 is formed in the electrostatic chuck body 1, and the housing hole 26 is open on the back surface 21b. Reference numeral 21 is a semiconductor wafer installation surface.

A mesh 31 is formed on the bottom surface 26a of the accommodation hole 26.
Is partially exposed to form an exposed metal part.
On the tip side of the terminal 24 made of corrosion resistant metal such as nickel,
A cylindrical metal member 25 having a larger diameter than the other portions of the terminal 24 is formed. Main body 25f of the metal member 25
Has a substantially circular shape, but a front end portion 25d having a small diameter when viewed in the width direction of the accommodation hole is formed on the front end side of the main body. Tip 25
A ring-shaped recess 25c is formed on the side of d.

The metal foil 33 is formed so as to cover the bottom surface 26a of the accommodation hole. Disc-shaped brazing material 1 on the metal foil 33
Place 3.

The metal member 25 is housed in the housing hole 26, and the bottom surface 25b of the tip portion 25d is opposed to the brazing material 13. Brazing is performed in this state. Main body 25f, tip 2
5d, bottom surface 26a of the accommodation hole and side wall surface 26b of the accommodation hole
As a result, the gap portion 14 is generated. In the drawing, 25a
Is a side wall surface of the metal member 25.

Reference numeral 23 is a thermocouple junction. A storage hole 30 having a depth slightly smaller than the storage hole 26 is formed in the electrostatic chuck body 1, and the storage hole 30 is open to the back surface 21b.

A nickel cap 29 (an example of a metal member) for protecting the thermocouple is provided around the tips 28a of the pair of electrodes 28 forming the thermocouple. The male screw 28a of the electrode 28 is fitted. The outer diameter of the cap 29 is designed to be slightly smaller than the inner diameter of the accommodation hole 30. Cap 29
A tip portion 29d having a small diameter when viewed in the width direction of the accommodation hole of the cap 29 is formed on the tip side of the. A ring-shaped recess 29c is formed on the side of the tip portion 29d.

A metal foil 33 is formed so as to cover the bottom surface 30a of the accommodation hole. Disc-shaped brazing material 1 on the metal foil 33
Place 3.

The cap 29 is housed in the housing hole 30, and the bottom surface 29b of the tip portion 29d is opposed to the brazing material 13. Brazing is performed in this state. Main body 29f, tip 2
9d, bottom surface 30a of accommodation hole and side wall surface 30b of accommodation hole
As a result, the gap portion 14 is generated. In the drawing, 29a
Is a side wall surface of the cap 29.

Particularly, in No. 22, since the net-like structure is adopted as the metal exposed portion, the bonding layer has a portion contacting with the ceramics and a portion contacting with the metal exposed portion alternately in plan view. Since it is formed in the above, even stronger joint is achieved.

Hereinafter, more specific experimental results will be described. (Invention Example 1) A joined body was manufactured according to the procedure described with reference to FIGS. 3 and 4. However, as the ceramic member, an aluminum nitride substrate having a relative density of 99% or more, in which a molybdenum mesh was embedded, was used.
An accommodation hole 6 having a diameter of 5 mm (m in FIG. 3) and a depth of 8 mm was provided on the back side of the aluminum nitride substrate, and the mesh 5 was exposed on the bottom surface of the accommodation hole. The radius of curvature R of the radius 6a of the accommodation hole is 0.5 mm.

Titanium foil with a diameter of 5 mm (thickness 5 μm) 33
And diameter (r in FIG. 3) 4.5 mm, thickness 200 μ
m silver plate 13 was used. A terminal (an example of a metal member) 12 having a length of 5 mm was inserted into the accommodation hole. In the center of the terminal 12, a screw hole of M3 is machined to a depth of 2 mm so that a torque test can be performed after joining. However, in FIG. 3, u was 0.5 mm, s was 2 mm, t was 0.05 mm, and q was 4.0 mm. A female screw having a diameter of 3 mm and a depth of 3 mm was provided in the central portion of the terminal 12. While applying a load of 50g to the terminal 12, 97 in vacuum
It heat-processed at 0 degreeC and brazed.

As a result, a junction structure as shown in FIG. 4 was formed. Here, the height of the raised portions 16b and 16d from the bottom surface 6b was 0.5 mm, and no crack was observed in the aluminum nitride.

Two of these bonded bodies were used, and a thermal cycle test was carried out in vacuum for each of them. The bonded body was heated from room temperature to 600 ° C., held at 600 ° C. for 10 minutes, and lowered to room temperature as one cycle, and this was carried out for 10 cycles. Then, a torque of 6 kg / cm was applied to this bonded body, and the cross section of the bonded portion was then observed with an optical microscope. No fracture or crack occurred in the bonded portion.

Further, two of these bonded bodies were used, and a high temperature holding test was carried out in vacuum for each of them. The bonded body was heated from room temperature to 600 ° C., kept at 600 ° C. for 50 hours, and cooled to room temperature. And 6 kg / cm in this bonded body
Was applied, and then the cross section of the joint was observed with an optical microscope, but no fracture or crack occurred in the joint.

FIG. 6 shows an optical micrograph of a cross section of the joined portion of the joined body of this example. It can be seen that it has the structure described with reference to FIG.

(Invention Example 2) A joined body was manufactured in the same manner as in Invention Example 1. However, the width u of the gap was 0.2 mm. As a result, a joint structure similar to that shown in FIGS. 4 and 6 was formed. Here, the height of the raised portions 16b and 16d from the bottom surface 6b was 0.5 mm, and no crack was observed in the aluminum nitride.

Two of these joined bodies were used, and each of them was subjected to the above-mentioned thermal cycle test in vacuum. The cross section of the joint was observed with an optical microscope, but no fracture or crack occurred in the joint. Further, two of these joined bodies were used, and the above high temperature holding test was carried out in vacuum for each of them. The cross section of the joint was observed with an optical microscope, but no fracture or crack occurred in the joint.

(Invention Example 3) A joined body was manufactured in the same manner as in Invention Example 1. However, the width u of the gap was 0.8 mm. As a result, a joint structure similar to that shown in FIGS. 4 and 6 was formed. Here, the height of the raised portions 16b and 16d from the bottom surface 6b was 0.5 mm, and no crack was observed in the aluminum nitride.

Two of the bonded bodies were used, and each of them was subjected to the above-mentioned thermal cycle test in vacuum. The cross section of the joint was observed with an optical microscope, but no fracture or crack occurred in the joint. Further, two of these joined bodies were used, and the above high temperature holding test was carried out in vacuum for each of them. The cross section of the joint was observed with an optical microscope, but no fracture or crack occurred in the joint.

Comparative Example 1 A joined body was manufactured according to the procedure described with reference to FIGS. 1 and 2. However, the ceramic member 1 and the housing hole 6 were the same as in the first example of the present invention.

Titanium foil with a diameter of 5 mm (thickness 5 μm) 33
And diameter (p in FIG. 1) 4.5 mm, thickness 200 μ
m silver plate 13 was used. The metal member 2 having a length of 5 mm was inserted into the accommodation hole. 1, t is 0.05 mm
And The central part of the member 2 has a diameter of 3 mm and a depth of 3 m.
m internal thread was provided. While applying a load of 50 g to the member 2, heat treatment was performed in vacuum at 970 ° C. to perform brazing.

As a result, a junction structure as shown in FIG. 2 was formed. Here, the maximum height n from the bottom surface 6b of the bonding layer is
(See FIG. 1B) was 2 mm. An optical micrograph of a cross section of the bonded portion of the bonded body of Comparative Example 1 is shown in FIG. 7. It can be seen that it has the structure described with reference to FIG.
Further, fine cracks 30 are formed in the structure of aluminum nitride.
Was observed.

Two of these joined bodies were used, and the above-mentioned thermal cycle test was carried out for each of them. When the cross section of the joined portion was observed with an optical microscope, fracture was found in the joined portion. Further, two of these joined bodies were used, and the above-mentioned high temperature holding test was carried out for each of them. When the cross section of the joined portion was observed with an optical microscope, fracture was found in the joined portion.

Comparative Example 2 A joined body was manufactured in the same procedure as in Comparative Example 1. However, as shown in FIG. 1A, titanium foil 4 (thickness 5 μm) 4 having a diameter of 9 mm was used. As a result, a joint structure similar to that shown in FIGS. 2 and 7 was formed. Here, the maximum height n from the bottom surface 6b of the bonding layer was 4 mm. Further, a thin crack 30 was observed in the structure of aluminum nitride.

Two of these joined bodies were used, and the above-mentioned thermal cycle test was carried out for each of them. When the cross section of the joined portion was observed with an optical microscope, fracture was found in the joined portion. Further, two of these joined bodies were used, and the above-mentioned high temperature holding test was carried out for each of them. When the cross section of the joined portion was observed with an optical microscope, fracture was found in the joined portion.

Comparative Example 3 A joined body was manufactured according to the same procedure as in Comparative Example 1. However, a titanium foil (thickness 5 μm) 33 having a diameter of 5 mm was used, and the size t of the gap between the side wall surface of the terminal 2 and the side wall surface 6 c of the accommodation hole 6 was set to 0.1 mm. As a result, a joint structure similar to that shown in FIGS. 2 and 7 was formed. Here, the maximum height n from the bottom surface 6b of the bonding layer was 3 mm. Further, a thin crack 30 was observed in the structure of aluminum nitride.

Two of these joined bodies were used, and the above-mentioned thermal cycle test was carried out for each of them. When the cross section of the joined portion was observed with an optical microscope, fracture was found in the joined portion. Further, two of these joined bodies were used, and the above-mentioned high temperature holding test was carried out for each of them. When the cross section of the joined portion was observed with an optical microscope, fracture was found in the joined portion.

[0069]

As can be seen from the above, according to the present invention,
In a joining structure in which at least a part of a metal member is housed in a housing hole of a ceramic member and the metal member and the ceramic member are joined, the stress remaining in the ceramic member is reduced, and the joined body is heated between a high temperature and a low temperature. When subjected to the heat cycle of
It is possible to eliminate the possibility of cracks and damages occurring in the ceramic member.

[Brief description of drawings]

FIG. 1A is a cross-sectional view showing a stage immediately before manufacturing a joint structure according to a reference example, and FIG. 1B is a cross-sectional view showing a joint structure according to a reference example.

FIG. 2 is an enlarged cross-sectional view showing a main part of the joint structure of FIG. 1 (b).

FIG. 3A is a cross-sectional view showing a stage immediately before manufacturing a bonded structure according to an example of the present invention, and FIG. 3B is a sectional view showing a bonded structure according to an example of the present invention.

FIG. 4 is an enlarged sectional view showing a main part of the joint structure of FIG. 3 (b).

FIG. 5 is a cross-sectional view showing an embodiment in which the bonding structure of the present invention is applied to a holding structure of a ceramic electrostatic chuck.

6 is an optical micrograph showing a ceramic structure and a metal structure corresponding to the bonded structure of FIG.

FIG. 7 is an optical micrograph showing a ceramic structure and a metal structure corresponding to the joint structure of FIG.

[Explanation of reference numerals] 1 ceramic member 1c circular concave portion 4 metal foil 5, 31 mesh electrode or mesh 6, 26, 30
Housing hole 6b, 26a, 30a Bottom of housing hole
6c, 26b, 30b Side wall surface of accommodating hole 9 Joining portion between ceramic member and brazing material 10 Joining portion between exposed metal portion and brazing material 12, 25 Metal member 12
c, 25c, 29c Ring-shaped recess 12d, 25d, 29d Tip of metal member 12
e, 25a, 29a Side wall surface of metal member 12f, 2a
5f Main body of metal member 33 Metal foil 13 Disc-shaped brazing material 14 Gap portion 16, 16a Bonding layer 16b First raised portion 16c Depression portion 1
6d Second raised portion 21 Electrostatic chuck body made of disk-shaped ceramic member 22 Electrode joint 23 Thermocouple joint 29 Nickel cap for protecting thermocouple (an example of metal member) 30 Crack t Metal member The distance between the side wall surface and the side wall surface of the accommodation hole s Dimension of the gap portion viewed in the depth direction of the accommodation hole

Claims (8)

[Claims] 1. A joint structure of a metal member and a ceramic member having a housing hole for housing at least a part of the metal member, wherein the metal member is housed in the housing hole. A gap having a width of 0.2 mm or more is provided between the side wall surface of the accommodation hole and the metal member on the bottom surface side of the metal member, and the bonding layer that joins the metal member and the ceramic member is It is formed between the bottom surface of the metal member and the bottom surface of the accommodation hole, and a part of the bonding layer is exposed in the gap portion so as to cover the bottom surface of the accommodation hole, Bonding structure of metal member and ceramic member. 2. A joining structure of a metal member and a ceramic member having a housing hole for housing at least a part of the metal member, wherein the metal member is housed in the housing hole. The metal member includes a main body and a tip portion protruding from the main body to the bottom surface side of the accommodation hole, and is surrounded by the tip end portion, the main body, the side wall surface of the accommodation hole, and the bottom surface of the accommodation hole. A gap portion is formed, a joining layer for joining the metal member and the ceramic member is formed between the bottom surface of the metal member and the bottom surface of the accommodation hole, and a part of the joining layer is formed. A joint structure of a metal member and a ceramic member, which is exposed in the gap so as to cover the bottom surface of the accommodation hole. 3. The size of the gap as viewed in the width direction of the accommodation hole is 0.2 mm or less.
A joint structure between the metal member and the ceramic member as described above. 4. The bonding layer exposed in the gap is formed on a first ridge portion that is wet with respect to a side wall surface of the tip end portion of the metal member and a side wall surface of the accommodation hole of the ceramic member. 4. A second raised portion that is wet with respect to the first raised portion, and a recessed portion formed between the first raised portion and the second raised portion. Structure of the metal member and the ceramic member of the above. 5. A method for manufacturing a joint structure of a metal member and a ceramic member having a housing hole for housing at least a part of the metal member, wherein the metal member is housed in the housing hole. However, at least on the bottom surface side of the metal member, a width of 0.2 is provided between the side wall surface of the accommodation hole and the metal member.
Between the bottom surface of the metal member and the bottom surface of the accommodating hole is provided by providing a bonding material between the metal member and the bottom surface of the accommodating hole and providing a bonding material between the bottom surface of the metal member and the bottom surface of the accommodating hole. A method for manufacturing a joining structure between a metal member and a ceramic member, comprising forming a joining layer on the substrate and exposing a part of the joining layer to the gap so as to cover the bottom surface of the accommodation hole. 6. A method for manufacturing a joint structure of a metal member and a ceramic member having a housing hole for housing at least a part of the metal member, wherein the metal member comprises a body and a body. And a tip portion having a smaller dimension in the cross-sectional direction than the main body protruding toward the bottom surface side of the accommodation hole, and the metal member is accommodated from the tip end side into the accommodation hole. A joining material is interposed between the tip end portion and the bottom surface of the accommodation hole, and a gap portion is formed by the tip end portion, the main body, the side wall surface of the accommodation hole, and the bottom surface of the accommodation hole, and at least the joining material. Heating the material to form a bonding layer between the bottom surface of the metal member and the bottom surface of the accommodation hole, and exposing a part of the bonding layer to the gap so as to cover the bottom surface of the accommodation hole. Characteristic, metal member and ceramic Method for manufacturing a bonding structure of the box member. 7. The size of the gap as viewed in the width direction of the accommodation hole is 0.2 mm or less.
A method for producing a joint structure between a metal member and a ceramic member according to claim 1. 8. The method for manufacturing a joint structure between a metal member and a ceramic member according to claim 7, wherein the maximum height of the joint layer when viewed from the bottom of the accommodation hole is 1.0 mm or less. .