JPH09234986A - Manufacture of ball-point pen point set - Google Patents

Manufacture of ball-point pen point set

Info

Publication number
JPH09234986A
JPH09234986A JP8069160A JP6916096A JPH09234986A JP H09234986 A JPH09234986 A JP H09234986A JP 8069160 A JP8069160 A JP 8069160A JP 6916096 A JP6916096 A JP 6916096A JP H09234986 A JPH09234986 A JP H09234986A
Authority
JP
Japan
Prior art keywords
ball
tip
point
point pen
pen tip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8069160A
Other languages
Japanese (ja)
Other versions
JP3355543B2 (en
Inventor
Masayuki Kawasaki
正幸 川崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pentel Co Ltd
Original Assignee
Pentel Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pentel Co Ltd filed Critical Pentel Co Ltd
Priority to JP06916096A priority Critical patent/JP3355543B2/en
Publication of JPH09234986A publication Critical patent/JPH09234986A/en
Application granted granted Critical
Publication of JP3355543B2 publication Critical patent/JP3355543B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

PROBLEM TO BE SOLVED: To eliminate the possibilities that a ball is dislocated out of place and obtain a deposited product of uniform and stable strength by bringing a ball pen tip into contact with an elastic member at the time of ultrasonic deposition, in a ball-point pen point set consisting of a tip holder and an ink guide core of a fiber bundle firmly welded by ultrasonic deposition. SOLUTION: When manufacturing a ball-point pen point set, first a stainless steel ball-point pen tip 1 is pressed into the center hole 2a of a tip holder 2, then is fixed in such a state that the tip is protruded, and an ink guide core 3 is inserted from the center hole 2a to temporarily set the ball-point pen point set. Next, a fixture 4 is installed for positioning and the rear part of the ink guide core 3 is pressed by a spring. After that, the tip holder 2 is fixed into a fixture 6 for immobilization from the periphery using the fixture in such a way that the holder 2 does not rock. In addition, the point of the tip 1 is brought into contact with a fixture 7. Finally, a horn 8 connected to an ultrasonic welder, and both 2, 3 are welded under the effect of an ultrasonic vibration.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、筆記部材としての
ボールを先端に抱持してなるボールペンチップを中孔前
部に突出固定したチップホルダーとボールペンチップ内
へインキを誘導する繊維集束体製のインキ誘導芯とを超
音波溶着により固着して、ボールペンチップとチップホ
ルダーとインキ誘導芯とからなるボールペン先セットを
製造する方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a tip holder in which a ball-point pen tip, which holds a ball as a writing member at its tip, is fixed to the front part of a bore, and a fiber bundle body for guiding ink into the ball-point tip. And a method of manufacturing a ball-point pen tip set including a ball-point pen tip, a chip holder, and an ink-guide core by fixing the ink-guide core and the ink-guide core by ultrasonic welding.

【0002】[0002]

【従来の技術】従来、インキタンクに収容するインキを
ボールペンチップ内に誘導する部材としてアクリル繊
維、ポリエステル繊維等の繊維集束体をインキ誘導芯と
して使用したものが知られている。ここで、インキ誘導
芯は、ペン先であるボールペンチップとの位置関係が厳
しく管理されるべきものであり、インキ誘導芯とボール
ペンチップとの間に空間が存するようなしてしまうと、
ペン先に対してのインキ接続不良を招き、筆跡のかすれ
等の不良が発生することになり、また、反対にインキ誘
導芯があまり強くボールペンチップ内に押さえ付けられ
た場合は、繊維内の空間率が局部的に減少してインキが
通過し難くなり、結局はペン先へのインキ接続不良から
筆跡かすれが発生するものであった。以上より、インキ
誘導芯とチップホルダーとを溶着して位置決め固定し、
ボールペンチップとインキ誘導芯との位置関係を良好に
なすとともに、振動、衝撃等で良好な位置関係が損なわ
れないようなす試みがなされている。
2. Description of the Related Art Conventionally, as a member for guiding ink contained in an ink tank into a ball-point pen tip, a member using a fiber bundle such as acrylic fiber or polyester fiber as an ink guiding core is known. Here, the ink guide core is such that the positional relationship between the ink guide core and the ball-point pen tip should be strictly controlled, and if there is a space between the ink guide core and the ball-point pen tip,
If the ink guide core is too strongly pressed against the ballpoint pen tip, the space inside the fiber will be lost. The rate was locally reduced, making it difficult for ink to pass through, and in the end, poor handwriting of ink to the pen tip resulted in blurring of handwriting. From the above, the ink guide core and the chip holder are welded and positioned and fixed,
Attempts have been made to make the positional relationship between the ball-point pen tip and the ink guide core good and to prevent the good positional relationship from being impaired by vibration, impact or the like.

【0003】溶着方法としては、先端を細くした熱コテ
を使って、チップホルダーの後部とチップホルダーの内
孔に挿入されたインキ誘導芯との間にコテを指し込み両
部材を同時に溶かし固着させる、所謂熱溶着方法や、超
音波のホーンの先端を熱コテの先端と同様に細くして、
チップ内の微妙な加工を壊さない為にペン先を他部材と
非接触状にした上で、超音波を発振させながらチップホ
ルダーとチップホルダー及びボールペンチップの内孔に
挿入されたインキ誘導芯に超音波のホ−ンを押し当て
て、両部材を同時に溶かして固着させる、所謂超音波溶
着方法が知られている。
As a welding method, a thermal trowel with a thin tip is used, and the trowel is inserted between the rear part of the chip holder and the ink guide core inserted in the inner hole of the chip holder to melt and fix both members at the same time. , The so-called heat welding method, or the tip of the ultrasonic horn is made as thin as the tip of the thermal iron,
In order not to break the subtle processing in the tip, the pen tip is made non-contact with other members, and while oscillating the ultrasonic wave, the tip holder and the ink induction core inserted in the inner hole of the tip holder and the ball-point pen tip There is known a so-called ultrasonic welding method in which an ultrasonic horn is pressed to melt and fix both members at the same time.

【0004】[0004]

【発明が解決しようとする課題】熱コテ使用する熱溶着
方法では、熱コテの温度が外気の環境などの変化に影響
されやすく、常に一定に保持することが極めて難しい。
よって、溶着強度が均一な加工が難しく、溶着強度不足
となり易いという問題があった。溶着強度不足とならな
いように、熱コテの温度を高くしたり、溶着時間を長く
すると、樹脂等の溶け出す量が多くなり、軸筒などの他
の部材との接続関係に悪影響をおよぼしたり、インキ誘
導芯やボールペンチップの中孔等のインキ通路に悪影響
を及ぼす危険性もあり、更には外観上もきたなくなると
いう問題があった。
In the heat welding method using a heat iron, the temperature of the heat iron is easily affected by changes in the environment of the outside air, and it is extremely difficult to always keep the temperature constant.
Therefore, there is a problem that it is difficult to perform processing with uniform welding strength, and the welding strength tends to be insufficient. If the temperature of the heat iron is increased or the welding time is lengthened so that the welding strength does not become insufficient, the amount of resin or the like melted out increases, which may adversely affect the connection relationship with other members such as the barrel. There is a risk of adversely affecting the ink passages such as the ink guide core and the hole of the ballpoint pen tip, and there is also a problem that the appearance becomes messy.

【0005】また、超音波溶着方法を採用した場合、そ
の超音波振動を溶着を施したい部分のみに付与すること
はできない。つまり、超音波振動はチップホルダーと接
続されているボールペンチップへも伝えられ、筆記部材
としてのボールを抱持しているボール室内の微妙な形状
を破壊することがあった。ボールペンチップ先端を他部
材と非接触状態とすることによって、超音波振動が伝達
される影響を多少抑制することができるが、ボールを抜
け落ち防止している先端小口部に超音波振動が伝わると
この小口部が拡開してしまったり、ボール自体に外側へ
の力が付与され、ボール外れ現象が発生し易くなるとい
う問題があった。超音波振動をボール外れ現象が発生し
ない程度に調節して、例えば超音波振動付与時間を短く
して、溶着を行なった場合には、所望の溶着強度が得ら
れず、製品とした場合の落下による衝撃や輸送時の振動
等によってインキ誘導芯とボールペンチップとの位置関
係が変化してしまい、筆跡かすれ等の不良が発生すると
いう問題があった。
Further, when the ultrasonic welding method is adopted, the ultrasonic vibration cannot be applied only to the portion to be welded. That is, the ultrasonic vibration is also transmitted to the ball-point pen tip connected to the tip holder, and sometimes the delicate shape in the ball chamber holding the ball as the writing member is destroyed. By making the tip of the ball-point pen tip out of contact with other members, it is possible to suppress the effect of ultrasonic vibration transmission to some extent, but when ultrasonic vibration is transmitted to the tip edge part that prevents the ball from falling off, There has been a problem that the fore edge part spreads out, or an outward force is applied to the ball itself, which easily causes a ball detachment phenomenon. If the ultrasonic vibration is adjusted to such an extent that the ball detachment phenomenon does not occur, and the welding is performed by shortening the ultrasonic vibration application time, for example, the desired welding strength cannot be obtained, and the product drops when it is made into a product. There is a problem in that the positional relationship between the ink guide core and the ball-point pen tip changes due to the impact caused by vibration, vibration during transportation, etc., and defects such as handwriting scratches occur.

【0006】[0006]

【課題を解決するための手段】即ち、本発明は、筆記部
材としてのボールを先端に抱持してなるボールペンチッ
プを中孔前部に突出固定したチップホルダーとボールペ
ンチップ内へインキを誘導する繊維集束体製のインキ誘
導芯とを超音波溶着により固着するボールペン先セット
の製造方法において、前記チップホルダーと前記インキ
誘導芯とに超音波を付与する際、前記ボールペンチップ
先端を弾性部材に当接させることを特徴としたボールペ
ン先セットの製造方法を要旨とする。
That is, according to the present invention, ink is guided into a tip holder in which a ballpoint pen tip having a ball as a writing member held at its tip is fixedly projectingly fixed to the front part of a central hole and a ballpoint pen tip. In a method of manufacturing a ball-point pen tip set in which an ink guide core made of a fiber bundle is fixed by ultrasonic welding, when applying ultrasonic waves to the tip holder and the ink guide core, the tip of the ball-point pen tip touches an elastic member. The gist is a method of manufacturing a ballpoint pen tip set, which is characterized by contacting with each other.

【0007】[0007]

【実施例】以下、図面に基づき実施例について説明す
る。図1に、ボールペンチップ1とチップホルダー2と
インキ誘導芯3とよりなるボールペン先セットに超音波
を付与する工程を示す模式図を示す。ステンレス製のボ
−ルペンチップ1をポリアセタ−ル樹脂製のチップホル
ダー2の中孔2aに圧入して先端突出した状態で固定
し、次いで、ボールペンチップ1内部にまで達するよう
にチップホルダー2の中孔2aよりポリエステル繊維の
集束体であるインキ誘導芯3を挿入、ボールペンチップ
1、チップホルダー2、インキ誘導芯3とからなるボー
ルペン先セットを仮取り付けする。
An embodiment will be described below with reference to the drawings. FIG. 1 is a schematic diagram showing a process of applying ultrasonic waves to a ballpoint pen tip set including a ballpoint pen tip 1, a tip holder 2, and an ink guide core 3. The ball-point pen tip 1 made of stainless steel is press-fitted into the inner hole 2a of the tip holder 2 made of polyacetal resin and fixed with the tip protruding, and then the inner hole of the tip holder 2 so as to reach the inside of the ball-point pen tip 1. An ink induction core 3 which is a bundle of polyester fibers is inserted from 2a, and a ballpoint pen tip set including a ballpoint pen tip 1, a chip holder 2 and an ink induction core 3 is temporarily attached.

【0008】仮取り付けされたボールペン先セットを位
置決めの為のステンレス製のチップホルダー受け治具4
に設置し、インキ誘導芯とチップホルダーとの接触不良
を抑制するために、100〜500gの力でインキ誘導
芯の後部をスプリング5で押圧する。次に、チップホル
ダー2は、周囲からステンレス製の固定治具6により治
具内に揺動しないよう固定し、更に、ボールペンチップ
1の先端を厚さ3mm、硬度80゜のNBR板製のボー
ルペンチップ受け治具7に当接させる。最後に、超音波
溶着機9(超音波工業(株)製:USWP−200Z2
8S型)と接続した超音波振動を付与するホ−ン8(先
端部径;1.2mm)をチップホルダー2に当接させ、
出力200W、周波数28KHZの超音波振動を付与す
る。超音波振動によりチップホルダー2を溶かしながら
ホーン8を突き刺していき、ホーン8がインキ誘導芯3
にまで達して溶着を完了させる。
A chip holder receiving jig 4 made of stainless steel for positioning the temporarily attached ballpoint pen tip set.
In order to suppress poor contact between the ink guide core and the chip holder, the rear part of the ink guide core is pressed by the spring 5 with a force of 100 to 500 g. Next, the tip holder 2 is fixed from the surroundings by a fixing jig 6 made of stainless steel so as not to swing inside the jig, and the tip of the ballpoint pen tip 1 is made of an NBR plate ballpoint pen having a thickness of 3 mm and a hardness of 80 °. Contact the chip receiving jig 7. Finally, ultrasonic welding machine 9 (manufactured by Ultrasonic Industries Co., Ltd .: USWP-200Z2)
8S type) and a horn 8 (tip diameter; 1.2 mm) for applying ultrasonic vibration are brought into contact with the chip holder 2,
Ultrasonic vibration with an output of 200 W and a frequency of 28 KHZ is applied. The ultrasonic wave vibration causes the horn 8 to be pierced while melting the chip holder 2, and the horn 8 causes the ink guide core 3
To reach the end of welding.

【0009】比較のため、超音波振動を付与する時間を
変化させて試験を行った。また、チップホルダー受け治
具4や固定治具6の材質を替えた場合の試験を行った。
For comparison, a test was conducted by changing the time for applying ultrasonic vibration. Further, a test was carried out when the materials of the chip holder receiving jig 4 and the fixing jig 6 were changed.

【0010】更に、比較例として、固定治具6を使用し
ない場合及びボールペンチップ受け治具7をボールペン
チップ先端に当接させない場合の試験及び熱溶着方法に
よる試験も行った。各試験に使用したサンプルを(表
1)に示す。
Further, as comparative examples, a test in which the fixing jig 6 was not used and a case where the ball-point pen tip receiving jig 7 was not brought into contact with the tip of the ball-point pen tip and a test by a heat welding method were also conducted. The samples used for each test are shown in (Table 1).

【0011】[0011]

【表1】 [Table 1]

【0012】試験1 上記の実施例及び比較例各100サンプルについて目視
でボールの有無を調べた。
Test 1 The presence or absence of balls was visually inspected for 100 samples of each of the above-mentioned Examples and Comparative Examples.

【0013】試験2 溶着強度はインキ誘導芯をプッシュプルゲージ(イマダ
社製、0〜5Kgf測定用)でひっぱり抜け強度を測定
し、溶着強度の安定性について比較した(最大値及び最
小値)。
Test 2 For the welding strength, the pull-out strength of the ink induction core was measured with a push-pull gauge (made by Imada Co., 0-5 kgf measurement), and the stability of the welding strength was compared (maximum value and minimum value).

【0014】試験3 各実施例、比較例の100サンプルを筆記具に組み立て
筆記試験機にて筆記させ、筆跡のかすれが発生した本数
を数えた。
Test 3 100 samples of each Example and Comparative Example were assembled in a writing instrument and written by a writing tester, and the number of scratches of handwriting was counted.

【0015】試験4 上記の実施例及び比較例各100サンプルについてコン
クリート床の1mの高さから上向けで落下させた後のイ
ンキ誘導芯とチップホルダーとの接触状態を調べた。以
上、試験1〜試験4の結果を(表2)、(表3)に示
す。
Test 4 The contact state between the ink guide core and the chip holder after dropping 100 m from each of the above-mentioned Examples and Comparative Examples from the height of 1 m of the concrete floor was examined. The results of Test 1 to Test 4 are shown in (Table 2) and (Table 3).

【0016】[0016]

【表2】 [Table 2]

【0017】[0017]

【表3】 [Table 3]

【0018】[0018]

【発明の効果】以上に示したとおり、本発明のボールペ
ン先セットの製造方法によれば、超音波溶着時にボール
が外れることもなく、しかも均一で安定した強度の高い
溶着物を得ることができる。
As described above, according to the method of manufacturing a ballpoint nib set of the present invention, the ball does not come off during ultrasonic welding, and a uniform and stable welded material having high strength can be obtained. .

【図面の簡単な説明】[Brief description of drawings]

【図1】超音波を付与する工程を示す模式図。FIG. 1 is a schematic diagram showing a step of applying ultrasonic waves.

【符号の説明】[Explanation of symbols]

1 ボールペンチップ 2 チップホルダー 2a 中孔 3 インキ誘導芯 4 チップホルダー受け治具 5 スプリング 6 固定治具 7 ボールペンチップ受け治具 8 ホーン 1 Ballpoint Pen Tip 2 Tip Holder 2a Medium Hole 3 Ink Induction Core 4 Tip Holder Receiving Jig 5 Spring 6 Fixing Jig 7 Ballpoint Pen Tip Receiving Jig 8 Horn

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 筆記部材としてのボールを先端に抱持し
てなるボールペンチップを中孔前部に突出固定したチッ
プホルダーとボールペンチップ内へインキを誘導する繊
維集束体製のインキ誘導芯とを超音波溶着により固着す
るボールペン先セットの製造方法において、前記チップ
ホルダーと前記インキ誘導芯とに超音波を付与する際、
前記ボールペンチップ先端を弾性部材に当接させること
を特徴としたボールペン先セットの製造方法。
1. A tip holder having a ball-point pen tip, which holds a ball as a writing member at its tip, projectingly fixed to the front part of the inner hole, and an ink guide core made of a fiber bundle for guiding ink into the ball-point pen tip. In a method of manufacturing a ballpoint pen tip set that is fixed by ultrasonic welding, when applying ultrasonic waves to the tip holder and the ink induction core,
A method of manufacturing a ball-point pen tip set, wherein the tip of the ball-point pen tip is brought into contact with an elastic member.
JP06916096A 1996-02-29 1996-02-29 Method of manufacturing ballpoint pen set Expired - Fee Related JP3355543B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP06916096A JP3355543B2 (en) 1996-02-29 1996-02-29 Method of manufacturing ballpoint pen set

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP06916096A JP3355543B2 (en) 1996-02-29 1996-02-29 Method of manufacturing ballpoint pen set

Publications (2)

Publication Number Publication Date
JPH09234986A true JPH09234986A (en) 1997-09-09
JP3355543B2 JP3355543B2 (en) 2002-12-09

Family

ID=13394676

Family Applications (1)

Application Number Title Priority Date Filing Date
JP06916096A Expired - Fee Related JP3355543B2 (en) 1996-02-29 1996-02-29 Method of manufacturing ballpoint pen set

Country Status (1)

Country Link
JP (1) JP3355543B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010052240A (en) * 2008-08-27 2010-03-11 Pentel Corp Method for manufacturing ballpoint pen
CN107627759A (en) * 2017-11-06 2018-01-26 吴国秋 A kind of pen core apparatus for automatic change
CN111055105A (en) * 2020-01-02 2020-04-24 温州大学 Water diversion core assembly device for water-based ball pen point

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010052240A (en) * 2008-08-27 2010-03-11 Pentel Corp Method for manufacturing ballpoint pen
CN107627759A (en) * 2017-11-06 2018-01-26 吴国秋 A kind of pen core apparatus for automatic change
CN107627759B (en) * 2017-11-06 2019-03-15 余灵楚 A kind of pen core apparatus for automatic change
CN111055105A (en) * 2020-01-02 2020-04-24 温州大学 Water diversion core assembly device for water-based ball pen point

Also Published As

Publication number Publication date
JP3355543B2 (en) 2002-12-09

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