JP3355543B2 - Method of manufacturing ballpoint pen set - Google Patents

Method of manufacturing ballpoint pen set

Info

Publication number
JP3355543B2
JP3355543B2 JP06916096A JP6916096A JP3355543B2 JP 3355543 B2 JP3355543 B2 JP 3355543B2 JP 06916096 A JP06916096 A JP 06916096A JP 6916096 A JP6916096 A JP 6916096A JP 3355543 B2 JP3355543 B2 JP 3355543B2
Authority
JP
Japan
Prior art keywords
tip
ballpoint pen
pen tip
ball
ink guide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP06916096A
Other languages
Japanese (ja)
Other versions
JPH09234986A (en
Inventor
正幸 川崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pentel Co Ltd
Original Assignee
Pentel Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pentel Co Ltd filed Critical Pentel Co Ltd
Priority to JP06916096A priority Critical patent/JP3355543B2/en
Publication of JPH09234986A publication Critical patent/JPH09234986A/en
Application granted granted Critical
Publication of JP3355543B2 publication Critical patent/JP3355543B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、筆記部材としての
ボールを先端に抱持してなるボールペンチップを中孔前
部に突出固定したチップホルダーとボールペンチップ内
へインキを誘導する繊維集束体製のインキ誘導芯とを超
音波溶着により固着して、ボールペンチップとチップホ
ルダーとインキ誘導芯とからなるボールペン先セットを
製造する方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip holder having a ballpoint pen tip holding a ball as a writing member at the tip thereof and protruding and fixed at a front portion of a bore, and a fiber bundle for guiding ink into the ballpoint pen tip. The present invention relates to a method for manufacturing a ballpoint pen tip set including a ballpoint pen tip, a chip holder, and an ink guide core by fixing the ink guide core to the ink guide core by ultrasonic welding.

【0002】[0002]

【従来の技術】従来、インキタンクに収容するインキを
ボールペンチップ内に誘導する部材としてアクリル繊
維、ポリエステル繊維等の繊維集束体をインキ誘導芯と
して使用したものが知られている。ここで、インキ誘導
芯は、ペン先であるボールペンチップとの位置関係が厳
しく管理されるべきものであり、インキ誘導芯とボール
ペンチップとの間に空間が存するようなしてしまうと、
ペン先に対してのインキ接続不良を招き、筆跡のかすれ
等の不良が発生することになり、また、反対にインキ誘
導芯があまり強くボールペンチップ内に押さえ付けられ
た場合は、繊維内の空間率が局部的に減少してインキが
通過し難くなり、結局はペン先へのインキ接続不良から
筆跡かすれが発生するものであった。以上より、インキ
誘導芯とチップホルダーとを溶着して位置決め固定し、
ボールペンチップとインキ誘導芯との位置関係を良好に
なすとともに、振動、衝撃等で良好な位置関係が損なわ
れないようなす試みがなされている。
2. Description of the Related Art Heretofore, as a member for guiding ink contained in an ink tank into a ballpoint pen tip, a member using a fiber bundle of acrylic fiber, polyester fiber or the like as an ink guiding core has been known. Here, the position of the ink guide wick with respect to the ballpoint pen tip, which is the pen tip, should be strictly controlled, and if there is a space between the ink guide wick and the ballpoint pen tip,
This leads to poor ink connection to the pen tip, resulting in defects such as blurred handwriting. Conversely, if the ink guide core is pressed too strongly into the ballpoint pen tip, the space in the fiber The rate was locally reduced, making it difficult for ink to pass through, and eventually the handwriting was blurred due to poor ink connection to the pen tip. From the above, the ink guide core and the tip holder are welded and positioned and fixed,
Attempts have been made to make the positional relationship between the ballpoint pen tip and the ink guide core good and not to impair the good positional relationship due to vibration, impact or the like.

【0003】溶着方法としては、先端を細くした熱コテ
を使って、チップホルダーの後部とチップホルダーの内
孔に挿入されたインキ誘導芯との間にコテを指し込み両
部材を同時に溶かし固着させる、所謂熱溶着方法や、超
音波のホーンの先端を熱コテの先端と同様に細くして、
チップ内の微妙な加工を壊さない為にペン先を他部材と
非接触状にした上で、超音波を発振させながらチップホ
ルダーとチップホルダー及びボールペンチップの内孔に
挿入されたインキ誘導芯に超音波のホ−ンを押し当て
て、両部材を同時に溶かして固着させる、所謂超音波溶
着方法が知られている。
[0003] As a welding method, a thermal iron having a thin tip is used to point the iron between the rear portion of the chip holder and the ink guide core inserted into the inner hole of the chip holder, thereby melting and fixing both members simultaneously. , The so-called heat welding method, or making the tip of the ultrasonic horn thinner like the tip of the heat iron,
In order not to break the delicate processing inside the tip, the tip of the pen is kept in non-contact with other members, and while oscillating ultrasonic waves, the tip holder and the ink guide core inserted into the tip holder and the inner hole of the ballpoint pen tip There is known a so-called ultrasonic welding method in which an ultrasonic horn is pressed to melt and fix both members simultaneously.

【0004】[0004]

【発明が解決しようとする課題】熱コテ使用する熱溶着
方法では、熱コテの温度が外気の環境などの変化に影響
されやすく、常に一定に保持することが極めて難しい。
よって、溶着強度が均一な加工が難しく、溶着強度不足
となり易いという問題があった。溶着強度不足とならな
いように、熱コテの温度を高くしたり、溶着時間を長く
すると、樹脂等の溶け出す量が多くなり、軸筒などの他
の部材との接続関係に悪影響をおよぼしたり、インキ誘
導芯やボールペンチップの中孔等のインキ通路に悪影響
を及ぼす危険性もあり、更には外観上もきたなくなると
いう問題があった。
In the heat welding method using a hot iron, the temperature of the hot iron is easily affected by changes in the environment of the outside air and it is extremely difficult to keep the temperature constantly constant.
Therefore, there is a problem that it is difficult to perform processing with uniform welding strength, and the welding strength tends to be insufficient. If the temperature of the hot iron is raised or the welding time is lengthened so that the welding strength does not become insufficient, the amount of resin or the like that melts out increases, adversely affecting the connection relationship with other members such as the barrel, There is a risk that the ink path such as the ink guide core and the bore of the ballpoint pen tip may be adversely affected, and furthermore, the appearance becomes messy.

【0005】また、超音波溶着方法を採用した場合、そ
の超音波振動を溶着を施したい部分のみに付与すること
はできない。つまり、超音波振動はチップホルダーと接
続されているボールペンチップへも伝えられ、筆記部材
としてのボールを抱持しているボール室内の微妙な形状
を破壊することがあった。ボールペンチップ先端を他部
材と非接触状態とすることによって、超音波振動が伝達
される影響を多少抑制することができるが、ボールを抜
け落ち防止している先端小口部に超音波振動が伝わると
この小口部が拡開してしまったり、ボール自体に外側へ
の力が付与され、ボール外れ現象が発生し易くなるとい
う問題があった。超音波振動をボール外れ現象が発生し
ない程度に調節して、例えば超音波振動付与時間を短く
して、溶着を行なった場合には、所望の溶着強度が得ら
れず、製品とした場合の落下による衝撃や輸送時の振動
等によってインキ誘導芯とボールペンチップとの位置関
係が変化してしまい、筆跡かすれ等の不良が発生すると
いう問題があった。
When the ultrasonic welding method is employed, the ultrasonic vibration cannot be applied only to a portion to be welded. That is, the ultrasonic vibration is also transmitted to the ballpoint pen tip connected to the chip holder, and sometimes destroys a delicate shape in the ball chamber holding the ball as a writing member. By making the tip of the ballpoint pen tip out of contact with other members, the effect of transmitting ultrasonic vibration can be suppressed somewhat.However, when ultrasonic vibration is transmitted to the tip end that prevents the ball from falling off, There has been a problem that the fore-edge portion expands or an outward force is applied to the ball itself, so that a ball detachment phenomenon easily occurs. When welding is performed by adjusting the ultrasonic vibration to such an extent that the ball does not come off, for example, by shortening the ultrasonic vibration application time, the desired welding strength cannot be obtained, and the product is dropped. There is a problem that the positional relationship between the ink guide core and the ballpoint pen tip changes due to the impact due to the vibration, the vibration at the time of transportation, and the like, and defects such as handwriting blur occur.

【0006】[0006]

【課題を解決するための手段】即ち、本発明は、筆記部
材としてのボールを先端に抱持してなるボールペンチッ
プを中孔前部に突出固定したチップホルダーとボールペ
ンチップ内へインキを誘導する繊維集束体製のインキ誘
導芯とを超音波溶着により固着するボールペン先セット
の製造方法において、前記チップホルダーと前記インキ
誘導芯とに超音波を付与する際、前記ボールペンチップ
先端を弾性部材に当接させることを特徴としたボールペ
ン先セットの製造方法を要旨とする。
That is, according to the present invention, ink is guided into a ball-point pen tip and a chip holder having a ball-point pen tip holding a ball as a writing member at the front end thereof, which is fixed at a front portion of a bore. In a method of manufacturing a ballpoint pen tip set for fixing an ink guide core made of a fiber bundle by ultrasonic welding, when applying ultrasonic waves to the tip holder and the ink guide core, the tip of the ballpoint pen tip is applied to an elastic member. The gist of the present invention is a method of manufacturing a ballpoint pen tip set characterized by being brought into contact with a ballpoint pen set.

【0007】[0007]

【実施例】以下、図面に基づき実施例について説明す
る。図1に、ボールペンチップ1とチップホルダー2と
インキ誘導芯3とよりなるボールペン先セットに超音波
を付与する工程を示す模式図を示す。ステンレス製のボ
−ルペンチップ1をポリアセタ−ル樹脂製のチップホル
ダー2の中孔2aに圧入して先端突出した状態で固定
し、次いで、ボールペンチップ1内部にまで達するよう
にチップホルダー2の中孔2aよりポリエステル繊維の
集束体であるインキ誘導芯3を挿入、ボールペンチップ
1、チップホルダー2、インキ誘導芯3とからなるボー
ルペン先セットを仮取り付けする。
An embodiment will be described below with reference to the drawings. FIG. 1 is a schematic diagram showing a process of applying ultrasonic waves to a ballpoint pen tip set including a ballpoint pen tip 1, a tip holder 2, and an ink guide core 3. A ball-point pen tip 1 made of stainless steel is pressed into a hole 2a of a chip holder 2 made of polyacetal resin and fixed in a state where the tip protrudes, and then the hole of the chip holder 2 is extended to the inside of the ball-point pen tip 1. An ink guide core 3 which is a bundle of polyester fibers is inserted from 2a, and a ballpoint pen tip set including a ballpoint pen tip 1, a chip holder 2, and an ink guide core 3 is temporarily attached.

【0008】仮取り付けされたボールペン先セットを位
置決めの為のステンレス製のチップホルダー受け治具4
に設置し、インキ誘導芯とチップホルダーとの接触不良
を抑制するために、100〜500gの力でインキ誘導
芯の後部をスプリング5で押圧する。次に、チップホル
ダー2は、周囲からステンレス製の固定治具6により治
具内に揺動しないよう固定し、更に、ボールペンチップ
1の先端を厚さ3mm、硬度80゜のNBR板製のボー
ルペンチップ受け治具7に当接させる。最後に、超音波
溶着機9(超音波工業(株)製:USWP−200Z2
8S型)と接続した超音波振動を付与するホ−ン8(先
端部径;1.2mm)をチップホルダー2に当接させ、
出力200W、周波数28KHZの超音波振動を付与す
る。超音波振動によりチップホルダー2を溶かしながら
ホーン8を突き刺していき、ホーン8がインキ誘導芯3
にまで達して溶着を完了させる。
A stainless steel chip holder receiving jig 4 for positioning the temporarily attached ballpoint pen tip set
The spring 5 presses the rear part of the ink guide core with a force of 100 to 500 g in order to suppress poor contact between the ink guide core and the chip holder. Next, the tip holder 2 is fixed to the jig from the surroundings by a stainless fixing jig 6 so as not to swing, and the tip of the ballpoint pen tip 1 is made of an NBR plate ball pen having a thickness of 3 mm and a hardness of 80 °. It is brought into contact with the chip receiving jig 7. Finally, an ultrasonic welding machine 9 (USWP-200Z2 manufactured by Ultrasonic Industry Co., Ltd.)
A horn 8 (tip diameter: 1.2 mm) for applying ultrasonic vibration connected to the tip holder 2 is connected to the tip holder 2.
Ultrasonic vibration with an output of 200 W and a frequency of 28 KHZ is applied. The horn 8 is pierced while melting the tip holder 2 by ultrasonic vibration, and the horn 8 is
To complete the welding.

【0009】比較のため、超音波振動を付与する時間を
変化させて試験を行った。また、チップホルダー受け治
具4や固定治具6の材質を替えた場合の試験を行った。
For comparison, a test was conducted by changing the time for applying the ultrasonic vibration. In addition, a test was performed when the material of the chip holder receiving jig 4 and the fixing jig 6 was changed.

【0010】更に、比較例として、固定治具6を使用し
ない場合及びボールペンチップ受け治具7をボールペン
チップ先端に当接させない場合の試験及び熱溶着方法に
よる試験も行った。各試験に使用したサンプルを(表
1)に示す。
Further, as a comparative example, a test in which the fixing jig 6 was not used, a test in which the ball-point pen tip receiving jig 7 was not brought into contact with the tip of the ball-point pen, and a test by a heat welding method were also performed. The samples used in each test are shown in (Table 1).

【0011】[0011]

【表1】 [Table 1]

【0012】試験1 上記の実施例及び比較例各100サンプルについて目視
でボールの有無を調べた。
Test 1 The presence or absence of a ball was visually inspected for 100 samples of each of the above-mentioned Examples and Comparative Examples.

【0013】試験2 溶着強度はインキ誘導芯をプッシュプルゲージ(イマダ
社製、0〜5Kgf測定用)でひっぱり抜け強度を測定
し、溶着強度の安定性について比較した(最大値及び最
小値)。
Test 2 The welding strength was determined by measuring the pull-out strength of the ink guide core with a push-pull gauge (Imada Co., Ltd., 0-5 kgf measurement) and comparing the stability of the welding strength (maximum value and minimum value).

【0014】試験3 各実施例、比較例の100サンプルを筆記具に組み立て
筆記試験機にて筆記させ、筆跡のかすれが発生した本数
を数えた。
Test 3 100 samples of each of the examples and comparative examples were assembled into a writing instrument and written with a writing tester, and the number of blurred handwritings was counted.

【0015】試験4 上記の実施例及び比較例各100サンプルについてコン
クリート床の1mの高さから上向けで落下させた後のイ
ンキ誘導芯とチップホルダーとの接触状態を調べた。以
上、試験1〜試験4の結果を(表2)、(表3)に示
す。
Test 4 The contact state between the ink guide core and the chip holder after dropping upward from a height of 1 m of the concrete floor was examined for 100 samples of each of the above Examples and Comparative Examples. The results of Tests 1 to 4 are shown in (Table 2) and (Table 3).

【0016】[0016]

【表2】 [Table 2]

【0017】[0017]

【表3】 [Table 3]

【0018】[0018]

【発明の効果】以上に示したとおり、本発明のボールペ
ン先セットの製造方法によれば、超音波溶着時にボール
が外れることもなく、しかも均一で安定した強度の高い
溶着物を得ることができる。
As described above, according to the method for manufacturing a ball-point pen tip set of the present invention, a uniform, stable and high-strength welded product can be obtained without the ball coming off during ultrasonic welding. .

【図面の簡単な説明】[Brief description of the drawings]

【図1】超音波を付与する工程を示す模式図。FIG. 1 is a schematic view showing a step of applying ultrasonic waves.

【符号の説明】[Explanation of symbols]

1 ボールペンチップ 2 チップホルダー 2a 中孔 3 インキ誘導芯 4 チップホルダー受け治具 5 スプリング 6 固定治具 7 ボールペンチップ受け治具 8 ホーン DESCRIPTION OF SYMBOLS 1 Ball-point pen tip 2 Tip holder 2a Medium hole 3 Ink guide core 4 Tip holder receiving jig 5 Spring 6 Fixing jig 7 Ballpoint pen tip receiving jig 8 Horn

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 筆記部材としてのボールを先端に抱持し
てなるボールペンチップを中孔前部に突出固定したチッ
プホルダーとボールペンチップ内へインキを誘導する繊
維集束体製のインキ誘導芯とを超音波溶着により固着す
るボールペン先セットの製造方法において、前記チップ
ホルダーと前記インキ誘導芯とに超音波を付与する際、
前記ボールペンチップ先端を弾性部材に当接させること
を特徴としたボールペン先セットの製造方法。
1. A tip holder having a ball-point pen tip holding a ball as a writing member at a tip thereof and fixed at a front portion of a bore, and an ink guide core made of a fiber bundle for guiding ink into the ball-point tip. In the method of manufacturing a ballpoint pen tip set fixed by ultrasonic welding, when applying ultrasonic waves to the chip holder and the ink guide core,
A method of manufacturing a ballpoint pen tip set, wherein the tip of the ballpoint pen tip is brought into contact with an elastic member.
JP06916096A 1996-02-29 1996-02-29 Method of manufacturing ballpoint pen set Expired - Fee Related JP3355543B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP06916096A JP3355543B2 (en) 1996-02-29 1996-02-29 Method of manufacturing ballpoint pen set

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP06916096A JP3355543B2 (en) 1996-02-29 1996-02-29 Method of manufacturing ballpoint pen set

Publications (2)

Publication Number Publication Date
JPH09234986A JPH09234986A (en) 1997-09-09
JP3355543B2 true JP3355543B2 (en) 2002-12-09

Family

ID=13394676

Family Applications (1)

Application Number Title Priority Date Filing Date
JP06916096A Expired - Fee Related JP3355543B2 (en) 1996-02-29 1996-02-29 Method of manufacturing ballpoint pen set

Country Status (1)

Country Link
JP (1) JP3355543B2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5187079B2 (en) * 2008-08-27 2013-04-24 ぺんてる株式会社 Ballpoint pen manufacturing method
CN107627759B (en) * 2017-11-06 2019-03-15 余灵楚 A kind of pen core apparatus for automatic change
CN111055105A (en) * 2020-01-02 2020-04-24 温州大学 Water diversion core assembly device for water-based ball pen point

Also Published As

Publication number Publication date
JPH09234986A (en) 1997-09-09

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