JPH0923050A - Surface mounting type electronic parts - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide highly reliable surface mounting type electronic parts which can be manufactured at an extremely low cost and can be reduced in height. SOLUTION: In surface mounting type parts which is obtained by bending the lead terminals 1A and 13A of electronic parts 1A, provided with an electronic parts element, a base which holds the lead terminals 12A and 13A led out from the element, and a cap 10a which airtightly seals them, so that the parts 1A can be mounted easily on the surface of a printed wiring board, the terminals 12A and 13A are bent so that each terminal has at least one ore more bends in its top view. The surface mounting type electronic parts is also provided with joint sections 12a and 13a which are brought into contact with the printed wiring board and pressed into plate-like states at the front ends of the terminals 12A and 13A.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mount type electronic component in which lead terminals are bent to simply surface mount, and is particularly used as a reference oscillation source of a communication device or a clock source of a microcomputer. The fields of application are crystal oscillators and crystal filters.

[0002]

2. Description of the Related Art With the miniaturization of electronic equipment, it is required that electronic components be small and mounted on a printed wiring board at a high density on the surface thereof. This is no exception in the field of crystal vibrating devices, and various surface mount crystal vibrating devices have been invented. Among them, there is a quartz crystal unit in which a quartz plate (piezoelectric plate) is hermetically housed in a conventional metal case by performing some contrivances, and there is a quartz crystal unit which is surface-mounted. A configuration has been invented. This actual Kaihei 4-19018
In the configuration disclosed in Japanese Patent Laid-Open Publication No. 2000-242242, a metal holder is attached to a crystal unit and the lead terminals are bent to facilitate surface mounting on a substrate to be mounted.

[0003]

DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention
In the configuration shown in No. 18, there is a problem that the height is not so low when it is mounted on a surface, and the holder itself has a relatively complicated configuration, so that it is expensive. . When the lead terminals are limited to a certain direction and size, the size in the length direction tends to be large, or the position of the electrode pad of the printed wiring board to be installed is not aligned There was a problem that it was difficult to do. Also, the electrode pads on the printed wiring board and the lead terminals are joined by a conductive joining material such as solder,
The lead terminals or the printed wiring board may be distorted due to fluctuations in ambient temperature. In such a case, the joint portion of the conductive joint material such as solder may be peeled off, and sufficient conduction may not be achieved.

The present invention has been made to solve the above problems, and an object of the present invention is to provide a surface mount type electronic component which is extremely inexpensive, can realize a low profile and is highly reliable. .

[0005]

In order to solve the above problems, a surface mount electronic component according to the present invention comprises an electronic component element and a base having at least two lead terminals extending from the electronic component element. There is an electronic component having a cap that hermetically seals these, and in a surface mount type electronic component in which the lead terminal of the electronic component is bent and simply surface-mounted, the lead terminal is at least planar. The lead portion was bent so as to have one or more bent portions as viewed, and a lead portion extending from the base and a joint portion that was in contact with the printed wiring board and was crushed into a flat plate shape were provided.

Further, a base having an electronic component element and at least two lead terminals extending from the electronic component element, a cap hermetically sealing them, a cap,
Alternatively, there is an electronic component having a ground terminal provided on the base, and a lead terminal of the electronic component, and a surface mount type electronic component that is simply surface-mounted by bending the ground terminal, the lead terminal, and The ground terminal is bent so as to have at least one bent portion at least in a plan view, and is in contact with the cap or the lead-out portion extending from the base and the printed wiring board, and is a flattened joint portion. And.

[0007]

According to the first aspect of the present invention, the lead terminal is not limited to a fixed direction and size, and the degree of freedom in design is greatly expanded. Therefore, for example, the lead terminal is not increased in the length direction of the vibrator. It is possible to increase the area of the joint portion and improve the joint strength with the printed wiring board. Also,
The bent lead-out portion of the lead terminal increases the cushioning action, so that shock resistance can be improved, and even if thermal distortion occurs, the bent portion absorbs the thermal strain and improves the reliability of the joint portion. .

According to claim 2, the lead terminal and the ground terminal are not limited to a fixed direction and size, and the degree of freedom in design is greatly expanded. Therefore, for example, the size in the length direction of the vibrator is not increased. In addition, it is possible to increase the joint area of the terminal and improve the joint strength with the printed wiring board. In addition, shock resistance is improved by increasing the buffering function of the bent terminal lead-out portion, and even if thermal distortion occurs, the bent portion absorbs the thermal strain and improves the reliability of the joint. Let

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described with reference to FIG. 1 by taking a two-terminal type crystal oscillator as an example. FIG. 1 is a plan view showing a first embodiment of the present invention. Crystal oscillator 1
A is a crystal unit main body 10A and a plurality of lead terminals 12
It consists of A and 13A. In the crystal body 10A,
Although not shown, a quartz vibration plate having a plurality of excitation electrodes is installed on the base, and is hermetically sealed by the metal case 10a. The base is provided with a flange 11 used for hermetically sealing the case. The excitation electrodes are led out from one end of the crystal unit main body by lead terminals 12A and 13A. When these lead terminals are laid flat on the substrate on which this crystal unit is mounted, they are bent toward the substrate side so that their tips contact the electrode pads of the substrate, and crushed into a flat plate shape (lead terminal bonding). The parts 12a and 13a) are also bent into an L-shape when viewed two-dimensionally. In the metal case 10a, the ground terminal 1 is provided at the end opposite to the lead terminal lead-out direction.
5A is joined, and its tip portion is bent toward the substrate side so as to come into contact with the electrode pad of the substrate, and is crushed into a flat plate shape (ground terminal joining portion 15a). Such a crystal unit is mounted on a printed wiring board (not shown),
Solder the lead terminal joint and the ground terminal joint. As a result, the crystal unit can be grounded via the ground terminal.

A second embodiment of the present invention will be described with reference to FIG. 2 by taking a two-terminal type crystal resonator as an example. FIG. 2 is a plan view showing a second embodiment of the present invention. The same components as those in the above embodiment will be described using the same numbers. The crystal unit 1B includes a crystal unit body 10A and a plurality of lead terminals 12B and 13B. Crystal unit 10A
Although not shown in the drawing, a quartz vibration plate on which a plurality of excitation electrodes are formed is installed on the base and is hermetically sealed by the metal case 10a. The base is provided with a flange 11 used for hermetically sealing the case. The excitation electrode is led out from one end of the crystal unit main body by lead terminals 12B and 13B. When these lead terminals are laid flat on the substrate on which this crystal unit is mounted, they are bent toward the substrate side so that their tips contact the electrode pads of the substrate, and crushed into a flat plate shape (lead terminal bonding). Parts 12b, 13b)
U-shape when viewed in plan (lead terminal joint is L-shaped)
It is bent. A grounding terminal 15B is joined to the end of the metal case 10a in the direction opposite to the lead terminal lead-out direction. The tip of the grounding terminal 15B is bent toward the substrate so as to contact the electrode pad of the substrate and is crushed into a flat plate (grounding). The terminal joint portion 15b) is provided, and the terminal joint portion 15b) is bent into an L shape when viewed two-dimensionally. Such a crystal oscillator is mounted on a printed wiring board (not shown), and the lead terminal tip and the ground terminal tip are soldered. This allows
The crystal unit can be grounded via the ground terminal.

The third embodiment of the present invention will be described with reference to FIG. 3 by taking a three-terminal type crystal filter as an example. FIG.
FIG. 6 is a plan view showing a third embodiment of the present invention. The crystal filter 1C includes a crystal filter body 10C, a plurality of lead terminals 12C and 13C, and a ground terminal 14C. Although not shown in the figure, the quartz vibration filter body 10C is provided with a quartz vibration plate having a plurality of excitation electrodes formed on a base, and is hermetically sealed by a metal case 10c. The base is provided with a flange 11C used for hermetically sealing the case. The excitation electrode is a lead terminal 1
2C and 13C lead out from one end of the crystal unit main body. When these lead terminals and ground terminals are laid flat on the substrate on which this crystal unit is mounted, they are bent toward the substrate side so that their tips contact the electrode pads of the substrate, and are crushed into a flat plate shape. (Lead terminal joints 12c, 13c, and ground terminal joint 14c), and is bent in a ladle shape (the lead terminal joint is U-shaped) and U-shaped when viewed two-dimensionally. A grounding terminal 15C is joined to the end of the metal case 10c in the direction opposite to the lead terminal lead-out direction, and the tip portion is bent toward the substrate side so as to contact the electrode pad of the substrate and is crushed into a flat plate shape (grounding). The terminal joint portion 15c) is provided, and the terminal joint portion 15c) is bent in a U shape when seen in a plan view. Such a crystal filter is mounted on a printed wiring board (not shown) and the lead terminal tip and the ground terminal tip are soldered. As a result, the crystal filter can be grounded via the ground terminal.

A fourth embodiment of the present invention will be described with reference to FIG. 4 by taking a two-terminal type crystal oscillator as an example. FIG. 4 is a plan view showing a fourth embodiment of the present invention. The same components as those in the above embodiment will be described using the same numbers. The crystal unit 1D includes a crystal unit body 10A and a plurality of lead terminals 12D and 13D. Crystal unit 10A
Although not shown in the drawing, a quartz vibration plate on which a plurality of excitation electrodes are formed is installed on the base and is hermetically sealed by the metal case 10a. The base is provided with a flange 11 used for hermetically sealing the case. The excitation electrode is led out from one end of the crystal unit main body by lead terminals 12D and 13D. When these lead terminals are laid flat on the substrate on which this crystal unit is mounted, they are bent toward the substrate side so that their tips contact the electrode pads of the substrate, and crushed into a flat plate shape (lead terminal bonding). Parts 12d, 13d)
It is bent in an S shape (reverse S shape) + U shape (the lead terminal joint portion is an L shape) when seen in a plan view. Metal case 1
A grounding terminal 15D is joined to the end of the lead wire 0a at a direction opposite to the lead terminal lead-out direction. 15d), and is bent in an S-shape (inverse S-shape) + U-shape (the ground terminal joint portion is L-shape) when viewed two-dimensionally. Such a crystal unit is mounted on a board (printed wiring board), and the lead terminal tip and the ground terminal tip are soldered. As a result, the crystal unit can be grounded via the ground terminal.

In the embodiments of the present invention, the L-shape, the U-shape, the ladle shape, the S-shape + U-shape, etc. have been described, but the present invention is not limited to these, and the lead terminal ( The ground terminal may be bent so as to have one or more bent portions in a plan view. The bent portion may be provided either on the lead-out portion side of the terminal or on the joint portion of the terminal, or of course on both sides. That is, the terminal (lead terminal,
By forming a particularly large number of bent portions on the side of the lead-out portion extending from the base of the (earth terminal), it is possible to further increase the cushioning action of the terminal and improve impact resistance, and even if thermal strain occurs, The bent portion absorbs thermal strain, further improving the reliability of the joint portion. By forming a particularly large number of bent portions in the joint portion of the terminal (lead terminal, ground terminal) according to the present invention, which is in contact with the printed wiring board, the joint area of the terminal is further increased and the joint strength with the printed wiring board is increased. Can be improved.

[0014]

According to the first aspect of the present invention, it is possible to improve the bonding strength with the printed wiring board, improve the shock resistance and the thermal strain absorbing property, and at the same time, it is possible to realize a low cost and a low profile. A highly mountable surface mount type electronic component can be provided.

According to claim 2, the joint strength with the printed wiring board can be improved, the impact resistance and the thermal strain absorption can be improved, and the cost is extremely low and the height can be reduced. A high surface mount electronic component can be provided.

[Brief description of drawings]

FIG. 1 is a plan view showing a first embodiment of the present invention.

FIG. 2 is a plan view showing a second embodiment of the present invention.

FIG. 3 is a plan view showing a third embodiment of the present invention.

FIG. 4 is a plan view showing a fourth embodiment of the present invention.

[Explanation of symbols]

 1A, 1B, 1D Crystal resonator 1C Crystal filter 10A Crystal resonator body 10C Crystal filter body 12A, 12B, 12C, 12D Lead terminal 13A, 13B, 13C, 13D Lead terminal 14C, 15A, 15B, 15C, 15D Ground terminal

Claims (2)

[Claims] 1. An electronic component element and a base having at least two lead terminals extending from the electronic component element,
There is an electronic component having a cap that hermetically seals these, and in a surface mount type electronic component in which the lead terminal of the electronic component is bent and simply surface-mounted, the lead terminal is at least planar. Surface mounting characterized by being bent so as to have one or more bent portions when viewed, and provided with a lead-out portion extending from the base and a joint portion that is in contact with the printed wiring board and is crushed into a flat plate shape. Mold electronic components. 2. An electronic component element and a base having at least two lead terminals extending from the electronic component element,
There is a cap for hermetically sealing these and an electronic component having a ground terminal provided on the cap or the base, and the lead terminal of the electronic component and the ground terminal are bent to be simply surface-mounted. In the surface mount type electronic component, the lead terminal and the ground terminal are bent so as to have at least one bent portion at least in a plan view, and a lead portion extending from a cap or a base and a printed wiring. A surface mount electronic component, comprising: a joint portion that is in contact with a substrate and is crushed into a flat plate shape.