JPH09229916A - Defect position estimating device - Google Patents
Defect position estimating deviceInfo
- Publication number
- JPH09229916A JPH09229916A JP8034879A JP3487996A JPH09229916A JP H09229916 A JPH09229916 A JP H09229916A JP 8034879 A JP8034879 A JP 8034879A JP 3487996 A JP3487996 A JP 3487996A JP H09229916 A JPH09229916 A JP H09229916A
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- JP
- Japan
- Prior art keywords
- ultrasonic
- defect
- probes
- receiver
- subject
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
Abstract
Description
【０００１】[0001]
【従来の技術】図５に、２つの探触子を用いる場合の従
来の欠陥位置推定装置の構成図を示す。従来の技術で
は、−方の超音波探触子を超音波パルサ１５１にのみ接
続し超音波の送信専用として用い、他方を超音波レシー
バ３０１にのみ接続し超音波の受信専用として用いてい
る。2. Description of the Related Art FIG. 5 is a block diagram of a conventional defect position estimating device when two probes are used. In the conventional technique, the minus ultrasonic probe is connected only to the ultrasonic pulser 151 and is used only for transmitting ultrasonic waves, and the other ultrasonic probe is connected only to the ultrasonic receiver 301 and is used only for receiving ultrasonic waves.
【０００２】まず、超音波パルサ１５１によって、一方
の超音波探触子１０１から被検体５０２に超音波を与え
る。被検体中を伝わって、割れや空隙等で反射した超音
波エコーは、他方の超音波探触子１０２によって受信さ
れ、超音波レシーバ３０１に入る。First, the ultrasonic pulser 151 applies ultrasonic waves to the subject 502 from one ultrasonic probe 101. The ultrasonic echoes that have propagated through the subject and are reflected by cracks or voids are received by the other ultrasonic probe 102 and enter the ultrasonic receiver 301.
【０００３】超音波レシーバ３０１では、受信された超
音波エコーを増幅したり、周波数帯域でフィルタをかけ
たりし、信号波形を整形する。超音波レシーバ３０１で
整形された受信信号は、超音波パルサ１５１の送信パル
スに同期した同期信号を基準に、結果表示装置４０６で
表示される。The ultrasonic receiver 301 shapes the signal waveform by amplifying the received ultrasonic echo or applying a filter in the frequency band. The reception signal shaped by the ultrasonic receiver 301 is displayed on the result display device 406 based on the synchronization signal synchronized with the transmission pulse of the ultrasonic pulser 151.
【０００４】そのため、従来の装置では、検査員が、表
示された波形信号を見て、その信号レベルの大きさによ
り欠陥等の反射源の有無を判定し、超音波の送信後にそ
の大きな信号レベルの信号が受信される時間と、各超音
波探触子の位置関係により欠陥の位置を推定している。Therefore, in the conventional apparatus, the inspector looks at the displayed waveform signal and determines the presence or absence of a reflection source such as a defect based on the magnitude of the signal level, and after the ultrasonic wave is transmitted, the large signal level is detected. The position of the defect is estimated based on the time when the signal is received and the positional relationship between the ultrasonic probes.
【０００５】従って、表示された超音波探傷波形信号
に、何らかのエコーが見られた場合、各超音波探触子の
位置と受信エコーが得られる時間とによって計算される
欠陥位置と、超音波探触子の持つ指向性を考慮して、お
およその位置を推定することができる。Therefore, when any echo is seen in the displayed ultrasonic flaw detection waveform signal, the defect position calculated by the position of each ultrasonic probe and the time when the received echo is obtained, and the ultrasonic detection The approximate position can be estimated in consideration of the directivity of the tentacle.
【０００６】[0006]
【発明が解決しようとする課題】しかしながら、前述の
ように構成された探傷装置では、欠陥の位置は、送信探
触子から超音波が発せられ受信探触子に受信されるまで
の時間と、各探触子の位置関係より求めることになるた
め、その時間と位置関係を満たす超音波の被検体内での
伝搬経路は複数存在する。However, in the flaw detection apparatus constructed as described above, the position of the defect is determined by the time taken for the ultrasonic wave to be emitted from the transmitting probe and to be received by the receiving probe. Since it is obtained from the positional relationship between the probes, there are a plurality of ultrasonic wave propagation paths within the subject that satisfy the time and positional relationship.
【０００７】そのため、他に超音波探触子の指向性を考
慮し、伝搬経路を絞ることも行うが、それでも複数の経
路が残る。従って、被検体の欠陥の位置はおおよその範
囲でしか特定することができない。Therefore, in consideration of the directivity of the ultrasonic probe, the propagation path is narrowed down, but a plurality of paths remain. Therefore, the position of the defect of the subject can be specified only in an approximate range.
【０００８】被検体の形状が複雑で、特に欠陥の発生が
予想される箇所の近傍に、コーナや突起といった形状変
化がある場合、被検体の欠陥による反射信号なのか、被
検体の形状に起因する信号なのかを、区別することは非
常に困難であった。If the shape of the object is complicated and there is a change in shape such as a corner or a protrusion especially near the place where a defect is expected to occur, it may be the reflected signal due to the defect of the object or the shape of the object. It was very difficult to distinguish whether or not it was a signal to do.
【０００９】また、被検体の形状変化については、製品
の許容寸法誤差内で、ばらつきをもつため、−概に形状
変化からの反射信号を特定することは困難である。従っ
て、−度反射信号が得られた場合、被検体の欠陥か否か
を判定するため、他の検査手法で検査する等の対処も必
要であった。Further, regarding the shape change of the subject, since there is variation within the allowable dimensional error of the product, it is difficult to roughly specify the reflection signal from the shape change. Therefore, when a minus-degree reflection signal is obtained, it is necessary to take measures such as inspecting with another inspection method in order to determine whether or not the subject is defective.
【００１０】このため、精度良く被検体の欠陥の位置を
推定し、被検体の形状による反射信号と、被検体の欠陥
による反射信号の区別が、容易に行うことができる装置
が必要になっていた。本発明はこれらの問題を解決する
ことができる装置を提供することを目的とする。For this reason, there is a need for an apparatus that can accurately estimate the position of a defect in a subject and distinguish between a reflection signal due to the shape of the subject and a reflection signal due to the defect in the subject. It was An object of the present invention is to provide a device that can solve these problems.
【００１１】[0011]
（第１の手段）本発明に係る欠陥位置推定装置は、
（Ａ）２つ以上の超音波探触子と、（Ｂ）超音波パルサ
・レシーバと、（Ｃ）超音波レシーバと、（Ｄ）時間検
出回路と、（Ｅ）被検体形状入力装置と、（Ｆ）超音波
探触子を動かすと同時に各超音波探触子の位置が検出で
きるスキャナと、（Ｇ）欠陥位置演算処理回路と、
（Ｈ）欠陥位置演算処理回路の演算結果を表示する欠陥
表示装置を具備し、（Ｉ）前記探触子のうちの少なくと
もーつの探触子に、超音波パルサ・レシーバを接続し、
（Ｊ）その他の探触子には超音波レシーバのみを接続
し、（Ｋ）前記時間検出回路は、各々の超音波レシーバ
にー定レベル以上の受信信号の得られる時間を計測し、
（Ｌ）前記被検体形状入力装置は被検体の形状を入力
し、（Ｍ）前記スキャナは超音波探触子を動かすと同時
に各超音波探触子の位置を検出し、（Ｎ）前記欠陥位置
演算処理回路は時間検出回路と被検体形状入力装置の出
力データから、欠陥位置を演算処理することを特徴とす
る。(First Means) The defect position estimating device according to the present invention is
(A) Two or more ultrasonic probes, (B) ultrasonic pulser / receiver, (C) ultrasonic receiver, (D) time detection circuit, (E) object shape input device, (F) A scanner capable of detecting the position of each ultrasonic probe while moving the ultrasonic probe, and (G) a defect position calculation processing circuit,
(H) A defect display device for displaying the calculation result of the defect position calculation processing circuit is provided, and (I) an ultrasonic pulser / receiver is connected to at least one of the probes,
(J) Only the ultrasonic receiver is connected to the other probes, and (K) the time detection circuit measures the time at which a reception signal of a certain level or more is obtained at each ultrasonic receiver,
(L) The object shape input device inputs the shape of the object, (M) the scanner moves the ultrasonic probes and simultaneously detects the position of each ultrasonic probe, and (N) the defect. The position calculation processing circuit is characterized in that it calculates a defect position from the output data of the time detection circuit and the object shape input device.
【００１２】従って、つぎのように作用する。前述のよ
うに構成された欠陥位置推定装置では、−つの送信用超
音波探触子に対し、送信用に用いる超音波探触子を含め
複数の受信用の超音波探触子を持つことになる。Therefore, it operates as follows. In the defect position estimating device configured as described above, -for one transmitting ultrasonic probe, having a plurality of receiving ultrasonic probes including the ultrasonic probe used for transmitting Become.
【００１３】そのため、送信探触子から被検体中を伝わ
り各々の受信探触子へ戻ってくる超音波の経路は、それ
ぞれ異なった経路となる。そこで、それぞれの超音波探
触子に超音波レシーバを持たせ、受信される信号が−定
レベル以上の場合、それぞれ受信信号の還ってきた時間
を時間検出回路により検出し、複数の受信探触子と送信
探触子の位置関係をスキャナで検出することにより、一
組の送受信探触子の組合せだけでなく、複数の受信探触
子の数だけ欠陥の位置の推定条件が求められる。Therefore, the paths of the ultrasonic waves transmitted from the transmitting probe to the receiving probe and returning to the receiving probes are different from each other. Therefore, each ultrasonic probe is provided with an ultrasonic receiver, and when the received signal is above a certain level, the time when each received signal returns is detected by the time detection circuit, and a plurality of receiving probes are detected. By detecting the positional relationship between the child and the transmitting probe by the scanner, not only the combination of one set of transmitting and receiving probes but also the estimation condition of the position of the defect corresponding to the number of the plurality of receiving probes can be obtained.
【００１４】従って、これらの被検体の欠陥位置の推定
条件をもとに、被検体の欠陥位置の推定を欠陥位置演算
処理回路によって行い、合せて、欠陥体形状入力装置に
入力された形状データから、推定された被検体の欠陥位
置と被検体の形状変化の位置を比較することにより、被
検体の欠陥の位置を推定することができる。Therefore, based on these conditions for estimating the defect position of the object, the defect position calculation processing circuit estimates the defect position of the object, and in addition, the shape data input to the defect shape input device. From this, by comparing the estimated defect position of the object and the position of the shape change of the object, the position of the defect of the object can be estimated.
【００１５】被検体の欠陥の位置推定は、複数の受信探
触子までの経路と伝搬時間のデータを同時に満たす条件
に絞り込むことにより、より精度良く欠陥位置の推定を
行うことが可能となり、その推定計算された被検体の欠
陥の位置と、被検体の形状データとを比較することによ
り、被検体の形状変化による信号と、被検体の欠陥から
の反射による信号とを、容易に区別することができる。
従って、被検体の欠陥からの受信信号のみに基づいて演
算し、その被検体の欠陥の位置の推定結果を欠陥表示装
置により表示することができる。In the position estimation of the defect of the object to be inspected, the defect position can be more accurately estimated by narrowing down the conditions to simultaneously satisfy the data of the paths to the plurality of receiving probes and the propagation time. By comparing the position of the estimated defect of the object and the shape data of the object, it is possible to easily distinguish the signal due to the shape change of the object and the signal due to the reflection from the object defect. You can
Therefore, it is possible to perform the calculation based on only the received signal from the defect of the object and display the estimation result of the position of the defect of the object by the defect display device.
【００１６】[0016]
（第１の実施の形態）本発明の第１の実施の形態を図１
〜図４に示す。図１は、本発明の第１の実施の形態に係
る装置の構成のブロック図、図２は、本発明の第１の実
施の形態に係る装置による超音波の経路を示す図、図３
は、本発明の第１の実施の形態に係る装置による被検体
の形状変化及び被検体の欠陥からの超音波の反射経路の
説明図、図４は、本発明の第１の実施の形態に係る装置
による被検体の形状変化及び被検体の欠陥からの超音波
の反射経路の展開図である。(First Embodiment) FIG. 1 shows a first embodiment of the present invention.
4 to FIG. FIG. 1 is a block diagram of a configuration of a device according to a first embodiment of the present invention, FIG. 2 is a diagram showing paths of ultrasonic waves by the device according to the first embodiment of the present invention, and FIG.
FIG. 4 is an explanatory view of a shape change of a subject and a reflection path of ultrasonic waves from a defect of the subject by the apparatus according to the first embodiment of the present invention, and FIG. 4 shows a first embodiment of the present invention. FIG. 3 is a development view of a change path of an object and a reflection path of ultrasonic waves from a defect of the object by the apparatus.
【００１７】図１に示すように、本発明に係る装置は、
２つの超音波探触子１０１と１０２を持ち、それぞれに
超音波パルサ・レシーバ２０１と超音波レシーバのみ３
０１が接続されている。As shown in FIG. 1, the device according to the present invention comprises:
It has two ultrasonic probes 101 and 102, and each has only an ultrasonic pulser / receiver 201 and an ultrasonic receiver.
01 is connected.
【００１８】そして、それらの超音波レシーバ３０１に
受信さる受信信号を、超音波パルサ・レシーバ２０１の
パルサ信号に同期して時間計測を行う時間検出回路４０
１と、４０２により、一定の信号レベル以上に達した受
信信号の到達時間を測定する。Then, the time detection circuit 40 for measuring the time of the received signals received by the ultrasonic receivers 301 in synchronization with the pulser signals of the ultrasonic pulser / receiver 201.
1 and 402 measure the arrival time of a received signal that has reached a certain signal level or higher.
【００１９】２つの超音波探触子の探触子位置は、スキ
ャナ５０１等により検出されるとともに、場合によって
は、スキャナ５０１により移動させることができる。ま
た、被検体の板厚や大きさや、形状変化のある位置や寸
法については、被検体形状入力装置４０４により、入力
しておく。The probe positions of the two ultrasonic probes can be detected by the scanner 501 or the like and, in some cases, moved by the scanner 501. Further, the plate thickness and size of the subject, and the position and the dimension where the shape changes are input by the subject shape input device 404.
【００２０】この被検体形状入力装置４０４について
は、計算機による設計データ等の流用も可能である。そ
れぞれの時間検出回路４０１と、４０２によって得られ
た受信信号の到達時間、即ち、被検体中の伝搬時間と、
各々の超音波探触子位置から、超音波の被検体中の伝搬
経路は、図２に示すように、（Ａ）送受信用の第１超音
波探触子１０１から送信され、第１超音波探触子１０１
に戻る経路（パス１）と，（Ｂ）第１超音波探触子１０
１から送信され、第２超音波探触子１０２に伝わる経路
（パス２）の２種類となる。With respect to the object shape input device 404, it is possible to use design data by a computer. Each time detection circuit 401, the arrival time of the received signal obtained by 402, that is, the propagation time in the subject,
From each ultrasonic probe position, the propagation path of the ultrasonic wave in the subject is transmitted from the first ultrasonic probe 101 for transmission / reception (A) as shown in FIG. Probe 101
(Path 1) to return to the first ultrasonic probe 10
There are two types of paths (path 2) transmitted from the first ultrasonic probe 102 and transmitted to the second ultrasonic probe 102.
【００２１】各々の超音波探触子位置と、被検体形状入
力装置より得られる被検体の形状から、被検体の欠陥の
位置を、欠陥位置演算処理回路４０３によって計算す
る。被検体の欠陥の推定方法のー例を、図３に示す。図
３は、（ａ）被検体の形状変化からの反射信号の場合
と、（ｂ）被検体の欠陥からの反射信号の場合につき、
パス２の場合について示したものである。The defect position calculation processing circuit 403 calculates the position of the defect of the object from each ultrasonic probe position and the shape of the object obtained from the object shape input device. FIG. 3 shows an example of the method of estimating the defect of the subject. FIG. 3 shows (a) the case of a reflection signal from the shape change of the subject and (b) the case of a reflection signal from the defect of the subject.
This shows the case of pass 2.
【００２２】被検体の形状データから、超音波の伝搬経
路において被検体の内面もしくは外面で反射する部分
を、その面で折り返すことで、図４のように等価的に展
開できる。From the shape data of the subject, the portion reflected on the inner surface or the outer surface of the subject in the propagation path of the ultrasonic wave is folded back at that surface, so that it can be equivalently developed as shown in FIG.
【００２３】この展開図から、伝搬時間（＝パスの長
さ）と各々の超音波探触子の位置関係を満たす受信信号
の信号源を求める。同様に、パスｌについても、条件を
満たす受信信号の信号源を求め、それらを同時に満たす
部分が，受信信号の信号源（＝反射源）の位置となる。From this development view, the signal source of the received signal satisfying the propagation time (= path length) and the positional relationship of each ultrasonic probe is obtained. Similarly, for the path l, the signal source of the received signal that satisfies the condition is obtained, and the portion that simultaneously satisfies them is the position of the signal source (= reflector) of the received signal.
【００２４】これにより、特定された受信信号の反射源
の位置と、先の被検体の形状入力装置に入力された形状
変化の位置と比較し、−致しなければ被検体の欠陥と判
断し、その反射源の位置を被検体の欠陥の位置として推
定した結果を出力する。求められた被検体の欠陥の推定
位置は、欠陥表示装置４０５によって表示出力される。Thus, the position of the specified reflection source of the received signal is compared with the position of the shape change input to the shape input device of the subject, and if not, it is determined that the subject is defective, The result of estimating the position of the reflection source as the position of the defect of the subject is output. The obtained estimated position of the defect of the subject is displayed and output by the defect display device 405.
【００２５】[0025]
【発明の効果】本発明に係る欠陥位置推定装置は、前述
のように構成されているので、次に述べるような効果を
奏する。 （１）被検体の欠陥の位置が、精度良く推定できる。 （２）被検体の欠陥からの反射と、被検体の形状変化に
よる反射信号を区別することができる。Since the defect position estimating apparatus according to the present invention is configured as described above, it has the following effects. (1) The position of the defect of the subject can be accurately estimated. (2) It is possible to distinguish the reflection from the defect of the subject and the reflection signal due to the shape change of the subject.
【図１】本発明の第１の実施の形態に係る装置構成のブ
ロック図。FIG. 1 is a block diagram of a device configuration according to a first embodiment of the present invention.
【図２】本発明の第１の実施の形態に係る装置による超
音波の経路を示す図。FIG. 2 is a diagram showing a path of ultrasonic waves by the device according to the first embodiment of the present invention.
【図３】本発明の第１の実施の形態に係る装置による被
検体の形状変化及び被検体の欠陥からの超音波の反射経
路の説明図。FIG. 3 is an explanatory diagram of a shape change of a subject and a reflection path of ultrasonic waves from a defect of the subject by the apparatus according to the first embodiment of the present invention.
【図４】本発明の第１の実施の形態に係る装置による被
検体の形状変化及び被検体の欠陥からの超音波の反射経
路の展開図。FIG. 4 is a development view of a change path of a subject and a reflection path of ultrasonic waves from a defect of the subject by the apparatus according to the first embodiment of the present invention.
【図５】従来の装置の構成を示すブロック図。FIG. 5 is a block diagram showing a configuration of a conventional device.
１０１…第１超音波探触子、 １０２…第２超音波探触子、 １５１…超音波パルサ、 ２０１…超音波パルサ・レシーバ、 ３０１…超音波レシーバ、 ４０１…第１時間検出回路、 ４０２…第２時間検出回路、 ４０３…欠陥位置演算処理回路、 ４０４…被検体形状入力装置、 ４０５…欠陥表示装置、 ４０６…結果表示装置（波形表示）、 ５０１…スキャナ、 ５０２…被検体、 ５０３…被検体の欠陥。 101 ... 1st ultrasonic probe, 102 ... 2nd ultrasonic probe, 151 ... Ultrasonic pulser, 201 ... Ultrasonic pulser receiver, 301 ... Ultrasonic receiver, 401 ... 1st time detection circuit, 402 ... Second time detection circuit, 403 ... Defect position calculation processing circuit, 404 ... Object shape input device, 405 ... Defect display device, 406 ... Result display device (waveform display), 501 ... Scanner, 502 ... Object, 503 ... Object Specimen defect.
Claims (1)
１０２、…）と、（Ｂ）超音波パルサ・レシーバ（２０
１）と、（Ｃ）超音波レシーバ（３０１）と、（Ｄ）時
間検出回路（４０１、４０２、…）と、（Ｅ）被検体形
状入力装置（４０４）と、（Ｆ）超音波探触子を動かす
と同時に各超音波探触子の位置が検出できるスキャナ
（５０１）と、（Ｇ）欠陥位置演算処理回路（４０３）
と、（Ｈ）欠陥位置演算処理回路（４０３）の演算結果
を表示する欠陥表示装置（４０５）を具備し、（Ｉ）前
記探触子のうちの少なくともーつの探触子に、超音波パ
ルサ・レシーバ（２０１）を接続し、（Ｊ）その他の探
触子には超音波レシーバ（３０１）のみを接続し、
（Ｋ）前記時間検出回路（４０１、４０２、…）は、各
々の超音波レシーバにー定レベル以上の受信信号の得ら
れる時間を計測し、（Ｌ）前記被検体形状入力装置（４
０４）は、被検体（５０２）の形状を入力し、（Ｍ）前
記スキャナ（５０１）は超音波探触子を動かすと同時に
各超音波探触子の位置を検出し、（Ｎ）前記欠陥位置演
算処理回路（４０３）は、時間検出回路（４０１、４０
２、…）と被検体形状入力装置（４０４）の出力データ
から、欠陥位置を演算処理することを特徴とする欠陥位
置推定装置。1. (A) Two or more ultrasonic probes (101,
102, ...) and (B) ultrasonic pulser / receiver (20
1), (C) ultrasonic receiver (301), (D) time detection circuit (401, 402, ...), (E) object shape input device (404), and (F) ultrasonic probe A scanner (501) capable of detecting the position of each ultrasonic probe at the same time as moving the child, and (G) defect position calculation processing circuit (403).
And (H) a defect display device (405) for displaying a calculation result of the defect position calculation processing circuit (403), and (I) at least one of the probes has an ultrasonic pulser. -Connect the receiver (201), and connect only the ultrasonic receiver (301) to the (J) other probe,
(K) The time detection circuits (401, 402, ...) Measure the time at which a reception signal of a constant level or higher is obtained in each ultrasonic receiver, and (L) the subject shape input device (4).
04) inputs the shape of the subject (502), (M) the scanner (501) moves the ultrasonic probes and simultaneously detects the position of each ultrasonic probe, and (N) the defect. The position calculation processing circuit (403) includes a time detection circuit (401, 40
2, ...) and the output data of the object shape input device (404), the defect position estimating device is characterized in that the defect position is arithmetically processed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP03487996A JP3207740B2 (en) | 1996-02-22 | 1996-02-22 | Defect position estimation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP03487996A JP3207740B2 (en) | 1996-02-22 | 1996-02-22 | Defect position estimation device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH09229916A true JPH09229916A (en) | 1997-09-05 |
| JP3207740B2 JP3207740B2 (en) | 2001-09-10 |
Family
ID=12426437
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP03487996A Expired - Fee Related JP3207740B2 (en) | 1996-02-22 | 1996-02-22 | Defect position estimation device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3207740B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008039622A (en) * | 2006-08-08 | 2008-02-21 | Hitachi Ltd | Ultrasonic inspection method and device of reactor pressure vessel |
-
1996
- 1996-02-22 JP JP03487996A patent/JP3207740B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008039622A (en) * | 2006-08-08 | 2008-02-21 | Hitachi Ltd | Ultrasonic inspection method and device of reactor pressure vessel |
| US7693251B2 (en) | 2006-08-08 | 2010-04-06 | Hitachi-Ge Nuclear Energy, Ltd. | Method and apparatus for ultrasonic inspection of reactor pressure vessel |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3207740B2 (en) | 2001-09-10 |
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