JPH0922956A - Semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor device in which a thermal stress generated at a semiconductor chip and at an electric connection part can be reduced and in which the reliability of the electric connection part is high. SOLUTION: In a semiconductor device, wiring patterns 6 and external terminals 5 which are formed on an insulating tape 4 as well as electrodes 2 at a semiconductor chip 1 are connected electrically via metal bumps 7, the insulating tape 4 is bent one or more times, and the external terminals 5 which are formed on the insulating tape 4 are installed in a range inside the face of the semiconductor chip 1.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor package which houses a semiconductor element, and more particularly to a semiconductor device which can realize high reliability of a connecting portion between a semiconductor package and a mounting board.

[0002]

2. Description of the Related Art Conventional semiconductor devices called film carriers, tape carriers, and TABs (Tape Automated Bonding) are device holes for mounting semiconductor elements on a tape made of an insulating material such as a polyimide film. , A conductive material such as copper foil is etched on the surface to form a plurality of leads, and the tip of the lead protruding into the device hole and the chip are bonded by thermocompression bonding,
Then, a chip or the like is covered with a resin by a potting technique or the like, and is resin-sealed.

An example of a document describing a tape carrier is "Nikkei Microdevice", March 1986, P128-135, published by Nikkei McGraw-Hill Co., Ltd.

Further, the first conductor portion is provided on the bonding pad of the semiconductor chip, and is resin-sealed so that only the upper surface of the first conductor portion is exposed. A miniaturized resin-encapsulated semiconductor package that is connected by means of the above is disclosed in Japanese Patent Application Laid-Open No. 5-120687.

[0005]

When the above-mentioned conventional tape carrier is used, the leads are arranged around the chip, so that the mounting area is wide and the leads are soldered, so that the lead pitch is small. There is a limit to high-density mounting due to limitations.

On the other hand, the resin-encapsulated semiconductor package disclosed in Japanese Patent Laid-Open No. 5-120687 is arranged in a ball grid array on the lower surface of the package, so that it is possible to increase the number of pins and the mounting area is small. It is suitable for high density mounting. However, thermal stress is generated in the lumped second conductor portion due to the difference in thermal expansion coefficient between the semiconductor package and the substrate due to changes in the temperature environment during mounting or use, and thus the lumped second conductor portion causes thermal fatigue damage. There is.

An object of the present invention is to provide a semiconductor device which can be mounted at a high density and which is excellent in reliability against thermal fatigue damage of an electrical connection portion.

[0008]

In order to achieve the above object, the present invention provides a semiconductor chip having electrodes, an insulating tape having an external terminal and a wiring pattern, and an electrical connection between the electrodes of the semiconductor chip and the wiring pattern. In a semiconductor device composed of connecting means, the electrodes of the semiconductor chip and the wiring patterns are electrically connected via metal bumps, the insulating tape is bent one or more times, and the external terminals provided on the insulating tape are It is provided within the range of the surface of the semiconductor chip.

In order to achieve the above-mentioned object, the back surface of the surface of the insulating tape including metal bumps for electrically connecting to the electrodes of the semiconductor chip and the back surface of the surface of the insulating tape including the external terminals are provided. The space is bonded partially or entirely with an adhesive having a low elastic modulus.

In order to achieve the above object, the circuit forming surface of the semiconductor chip or the back surface thereof is resin-sealed.

[0011]

The semiconductor device according to the present invention has the external terminals, which are means for electrically connecting with the mounting substrate, in the plane of the semiconductor chip, and the amount of thermal deformation caused by the difference in the linear expansion coefficient between the semiconductor device and the mounting substrate. Since the means for absorbing the difference is provided, high density mounting can be achieved while ensuring the reliability of the electrical connection portion.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a perspective view of a semiconductor device according to the first embodiment of the present invention. A sectional view of the first embodiment is shown in FIG.

An electrode 2 is formed on the same surface as the circuit forming surface of the semiconductor chip 1, and a main surface other than the electrode 2 is covered with an insulating protective film 3. The external terminals 5 and the wiring patterns 6 are formed on the insulating tape 4, and the electrodes 2 on the semiconductor chip 1 and the wiring patterns 6 are electrically connected via the metal bumps 7. The insulating tape 4 was bent at two places, and the external terminals 5 were provided within the area of the surface of the semiconductor chip 1.

As the insulating protection film 3, a plasma silicon nitride film, a plasma silicon oxide film, polyimide or the like is used.

A cross section of the insulating tape 4 having the external terminals 5 and the wiring patterns 6 is shown in FIG.

The wiring pattern 6 on the insulating tape 4 is generally formed by adhering a metal foil such as a copper foil on the insulating tape 4 and etching the metal foil into a desired shape. Other methods such as the use of a screen or screen printing may be used.

In order to reduce the radius of curvature of the bent portion, it is preferable to make the bent portion of the insulating tape 4 thinner than other portions. Examples of the method of reducing the thickness of the bent portion of the insulating tape 4 include a chemical method of performing selective etching and a physical method using excimer laser light. From the viewpoint of shape retention during mounting, it is preferable to secure the rigidity of the surface including the external terminals 5 by making the insulating tape 4 thicker than other portions. Although not shown in this embodiment, the wiring pattern 6 may be covered with an insulating film to prevent a short circuit.

The wiring pattern 6 is used for electrical connection with the mounting board.
The external terminal 5 formed above is used. The external terminals 5 are generally solder bumps. Examples of the solder bump forming method include a plating method, a solder ball method, a vapor deposition method, and a solder dipping method. Also, the bumps may be formed of a conductive resin. In this case, bumps are formed by transferring and supplying a conductive resin.

The electrical connection between the electrode 2 and the wiring pattern 6 is generally performed by providing a metal bump 7 on the electrode 2 or on the wiring pattern 6 or both, and by a thermocompression bonding method or a reflow method. A conductive resin may be used instead of the metal bump. As a method of forming a metal bump, a plating method,
The solder ball method, the vapor deposition method, the solder dipping method, the ultrasonic soldering method and the like can be mentioned.

Since the semiconductor device of the present invention is electrically connected to the mounting board via the insulating tape 4 having the wiring pattern 6, it is not restricted by the mounting board. Therefore, thermal stress is less likely to occur in the electrical connection parts such as the external terminals 5 and the metal bumps 7 due to changes in the temperature environment, which is useful for improving the reliability of the semiconductor device.

FIG. 4 is a sectional view of a semiconductor device according to the second embodiment of the present invention.

In the second embodiment, an adhesive 8 is used for a part or all of the bent insulating tapes for the purpose of retaining the shape of the insulating tapes 4 having the external terminals 5 and the wiring patterns 6 after the bending. To glue. As the adhesive 8, a resin-based adhesive such as an epoxy type or a polyimide type is mainly used. In order to facilitate the shear deformation of the insulating tape, it is preferable that the adhesive has a low elastic modulus. Further, in the present embodiment, since the two external tapes 5 and the insulating tape 4 having the wiring pattern 6 are used for the electrical connection, the amount of thermal deformation caused by the linear expansion coefficient of the semiconductor chip 1 and the mounting substrate is reduced. The difference is absorbed by shear deformation of the insulating tape 4 portion. When the main surface of the semiconductor chip is rectangular, it is preferable to arrange the bent portion of the insulating tape 4 parallel to the short side.

FIG. 5 is a sectional view of a semiconductor device according to the third embodiment of the present invention.

In the third embodiment, the external terminal 5 is provided at the center,
Insulation tape 4 around which the connection with the electrode 2 is arranged
Are bent and electrically connected to the electrodes 2 through the metal bumps 7. As a result, the difference in thermal deformation amount between the semiconductor chip 1 and the mounting substrate due to the difference in linear expansion coefficient between them is absorbed by the deformation of the insulating tape 4. It is also possible to cover the whole or a part of the semiconductor chip with the sealing resin 9 for the reason of improving the handling property. The resin that constitutes the sealing resin 4 includes
For example, an epoxy resin can be used, and it can be formed by potting a resin solution containing a resin.

[0026]

According to the present invention, the thermal stress generated in the semiconductor chip or the electrical connection portion due to the deformation of the insulating tape having the external terminal and the wiring pattern can be greatly reduced.

[Brief description of drawings]

FIG. 1 is a perspective view of a semiconductor device according to a first embodiment of the invention.

FIG. 2 is a sectional view of a semiconductor device according to a first embodiment of the present invention.

FIG. 3 is a cross-sectional view of an insulating tape having an external terminal and a wiring pattern used in the present invention.

FIG. 4 is a sectional view of a semiconductor device according to a second embodiment of the present invention.

FIG. 5 is a sectional view of a semiconductor device according to a second embodiment of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Semiconductor chip, 2 ... Electrode, 3 ... Insulation protective film, 4 ... Insulation tape, 5 ... External terminal, 6 ... Wiring pattern, 7 ... Metal bump, 8 ... Adhesive, 9 ... Sealing resin.

Claims (3)

[Claims] 1. A semiconductor device comprising a semiconductor chip having electrodes, an insulating tape having an external terminal and a wiring pattern, and a means for electrically connecting the electrodes of the semiconductor chip to the wiring pattern. The electrodes and the wiring pattern are electrically connected via metal bumps, the insulating tape is bent once or more, and the external terminals provided on the insulating tape are provided within a range of the surface of the semiconductor chip. A semiconductor device characterized by: 2. The elastic member between the back surface of the surface of the insulating tape including metal bumps for electrically connecting to the electrodes of the semiconductor chip and the back surface of the surface of the insulating tape including the external terminals according to claim 1. A semiconductor device that is partially or entirely bonded with an adhesive with a low rate. 3. The semiconductor device according to claim 1, wherein the circuit formation surface of the semiconductor chip or the back surface thereof is resin-sealed.