JPH09229388A - Air conditioning piping system - Google Patents

Air conditioning piping system

Info

Publication number
JPH09229388A
JPH09229388A JP3515096A JP3515096A JPH09229388A JP H09229388 A JPH09229388 A JP H09229388A JP 3515096 A JP3515096 A JP 3515096A JP 3515096 A JP3515096 A JP 3515096A JP H09229388 A JPH09229388 A JP H09229388A
Authority
JP
Japan
Prior art keywords
hot water
air conditioning
heat medium
fluid
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3515096A
Other languages
Japanese (ja)
Inventor
Kiyoo Kobayashi
清男 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NIPPON YUUKI KK
Original Assignee
NIPPON YUUKI KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NIPPON YUUKI KK filed Critical NIPPON YUUKI KK
Priority to JP3515096A priority Critical patent/JPH09229388A/en
Publication of JPH09229388A publication Critical patent/JPH09229388A/en
Pending legal-status Critical Current

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  • Steam Or Hot-Water Central Heating Systems (AREA)

Abstract

PROBLEM TO BE SOLVED: To lower the capacity of equipment of a fluid force feeder such as hot water pump in air conditioning equipment. SOLUTION: An air conditioning piping system is provided with an air conditioning heat source B, a piping circuit of a heat medium fluid to circulate a heat medium for air conditioning of the air conditioning heat source through air conditioning equipment 10 and a fluid force feed pump P to feed the heat medium fluid under pressure. A loop piping circuit closed in substance is formed totally. A fluid pressure of a heat medium supply pipeline 20 for linking the air conditioning equipment to a delivery port of the pump is set to a positive pressure and the fluid pressure of a heat medium return pipeline 30 for linking the air conditioning equipment to a suction port of the pump to a negative pressure. Thus, the fluid of the heat medium return pipeline is supplied by a suction vacuum of the pump.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、空調配管システム
に関するものであり、より詳細には、空調配管内の流体
の負圧(大気圧以下の圧力)を有効利用することによ
り、温水ポンプ等の流体圧送装置の設備容量を低減する
ことができる空調配管システムに関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an air conditioning pipe system, and more particularly, to a hot water pump or the like by effectively utilizing the negative pressure (pressure below atmospheric pressure) of the fluid in the air conditioning pipe. The present invention relates to an air conditioning piping system capable of reducing the equipment capacity of a fluid pumping device.

【0002】[0002]

【従来の技術】一般に、建築物等の冷房装置又は暖房装
置を構成する空調機器は、冷水又は温水等の空調用熱媒
体を供給する熱媒体配管に連結され、熱媒体配管は、チ
ラー又はボイラー等の冷熱源又は加熱源に連結される。
配管は、熱源において冷却又は加熱された熱媒体流体を
空調機器に循環するループ配管経路又は環配管経路を形
成する。この種の配管における熱媒体流体の流量は、各
空調領域に配置された冷房装置又は暖房装置の冷房負荷
又は暖房負荷に基づいて設計され、配管の管径は、流量
及び管路抵抗、更には、冷水又は温水ポンプ等の圧送装
置の容量又は能力に基づいて、実質的に決定される。こ
の種の空調配管システムにおいて、流体圧送装置を構成
するポンプの能力は、所要の熱媒体流体を配管回路全体
に循環可能なポンプの全吐出量及び全揚程により決定さ
れる。ポンプの吐出量は一般に、空調条件および対象空
調領域の冷房負荷又は暖房負荷に基づいて設定され、ポ
ンプの揚程は一般に、配管回路全体の正圧を確保し、循
環回路の末端、即ち、ポンプの吸引口において正(プラ
ス)の吐出流体圧力(大気圧以上の圧力)を形成するよ
うに設定される。
2. Description of the Related Art Generally, an air conditioner which constitutes a cooling device or a heating device of a building or the like is connected to a heat medium pipe for supplying a heat medium for air conditioning such as cold water or hot water, and the heat medium pipe is a chiller or a boiler. Is connected to a cold heat source or a heat source.
The piping forms a loop piping path or a ring piping path for circulating the heat medium fluid cooled or heated in the heat source to the air conditioner. The flow rate of the heat medium fluid in this type of piping is designed based on the cooling load or the heating load of the cooling device or the heating device arranged in each air conditioning region, and the pipe diameter of the pipe is the flow rate and the pipe resistance, and further It is substantially determined based on the capacity or capacity of a pumping device such as a cold water or hot water pump. In this type of air conditioning piping system, the capacity of the pump that constitutes the fluid pumping device is determined by the total discharge amount and total head of the pump that can circulate the required heat medium fluid throughout the piping circuit. The discharge amount of the pump is generally set based on the air conditioning conditions and the cooling load or heating load of the target air conditioning area, and the pump head generally secures a positive pressure in the entire piping circuit, and the end of the circulation circuit, that is, the pump The suction port is set to form a positive (plus) discharge fluid pressure (pressure equal to or higher than atmospheric pressure).

【0003】[0003]

【発明が解決しようとする課題】しかしながら、このよ
うな従来の設計手法による熱媒体流体の循環回路では、
対象空調領域が大規模化し、或いは、冷房負荷又は暖房
負荷が増大するにつれて、ポンプ能力が極めて高く設定
されることから、ポンプが大容量化又は大型化してしま
う。このようなポンプの大容量化又は大型化は、建築設
備の工事費を高額化するばかりでなく、空調設備の電気
容量及び電力消費量を大きく増大させるために、空調設
備の維持管理費を大幅に増大させてしまう。本発明は、
かかる事情に鑑みてなされたものであり、その目的とす
るところは、空調設備における温水ポンプ等の流体圧送
装置の設備容量を低減することができる空調配管システ
ムを提供することにある。
However, in the circulation circuit of the heat medium fluid by such a conventional design method,
As the target air conditioning area becomes large in scale, or the cooling load or the heating load increases, the pump capacity is set to be extremely high, so that the pump becomes large in capacity or large in size. Such an increase in capacity or size of the pump not only increases the construction cost of the building equipment, but also significantly increases the electric capacity and power consumption of the air conditioning equipment. Will be increased to. The present invention
The present invention has been made in view of such circumstances, and an object thereof is to provide an air conditioning piping system capable of reducing the equipment capacity of a fluid pumping device such as a hot water pump in an air conditioning equipment.

【0004】[0004]

【課題を解決するための手段及び作用】本発明は、上記
目的を達成すべく、空調熱源と、該空調熱源の空調用熱
媒体を空調機器に循環する熱媒体流体の配管回路と、前
記熱媒体配管に熱媒体流体を圧送する流体圧送ポンプと
を備え、実質的に密閉したループ配管回路を全体的に形
成する空調配管システムおいて、前記空調機器と前記ポ
ンプの吐出口とを連結する熱媒体供給管路の流体圧力を
正圧に設定し、前記空調機器と前記ポンプの吸引口とを
連結する熱媒体リターン管路の流体圧力を負圧に設定
し、前記熱媒体リターン管路の流体を前記ポンプの吸引
負圧により給送するようにしたことを特徴とする空調配
管システムを提供する。本発明の上記構成によれば、流
体圧送ポンプを備えたループ型の密閉配管系は、大気圧
以上の流体圧力が作用する熱媒体供給管路と、大気圧未
満の流体圧力が作用する熱媒体リターン管路とを備え
る。リターン管路内の流体は、流体圧送ポンプの吸引口
又はサクションポートの負圧により流体圧送ポンプに吸
引される。即ち、熱媒体循環回路の流体は、流体圧送ポ
ンプの正圧により回路を循環するだけでなく、流体圧送
ポンプが形成する負圧下にリターン管路内を流れ、流体
圧送ポンプに吸引される。従って、本発明の空調配管シ
ステムでは、流体圧送ポンプの押出し圧力のみにより流
体をポンプ吸引口に圧送する従来の設計と異なり、流体
圧送ポンプの負圧(吸引圧力)を有効利用して配管系の
熱媒体流体を循環させるので、流体圧送ポンプの能力を
軽減することができる。
In order to achieve the above object, the present invention provides an air conditioning heat source, a piping circuit of a heat medium fluid for circulating an air conditioning heat medium of the air conditioning heat source to an air conditioner, and the heat generating device. In an air conditioning piping system that includes a fluid pressure pump that pumps a heat medium fluid to the medium piping, and that forms a substantially closed loop piping circuit as a whole, heat that connects the air conditioning equipment and the discharge port of the pump. The fluid pressure of the medium supply pipeline is set to a positive pressure, the fluid pressure of the heat medium return pipeline connecting the air conditioner and the suction port of the pump is set to a negative pressure, and the fluid of the heat medium return pipeline is set. Is supplied by the suction negative pressure of the pump. According to the above configuration of the present invention, the loop-type closed piping system including the fluid pressure pump includes the heat medium supply pipeline on which the fluid pressure above atmospheric pressure acts and the heat medium on which the fluid pressure below atmospheric pressure acts. And a return line. The fluid in the return conduit is sucked into the fluid pressure pump by the negative pressure of the suction port or suction port of the fluid pressure pump. That is, the fluid in the heat medium circulation circuit not only circulates in the circuit by the positive pressure of the fluid pressure pump, but also flows in the return pipe line under the negative pressure formed by the fluid pressure pump and is sucked by the fluid pressure pump. Therefore, in the air-conditioning piping system of the present invention, unlike the conventional design in which the fluid is pumped to the pump suction port only by the pushing pressure of the fluid pressure pump, the negative pressure (suction pressure) of the fluid pressure pump is effectively used to control the piping system. Since the heat carrier fluid is circulated, the capacity of the fluid pressure pump can be reduced.

【0005】また、殊に小径管又は細い管を使用した放
熱器又は熱交換器等を含む配管システムにおいて、全体
的に正圧の流体圧力を利用して熱媒体液等の流体を十分
に循環させることは実際には困難であるが、負圧の流体
圧力を利用した上記構成の配管システムによれば、小径
管又は細管を含む配管システムに対して、所要量の流量
の流体を比較的円滑に循環することができる。しかも、
配管システムを構成する管路には、比較的低圧の流体圧
力が作用するにすぎないので、管材又は管壁等に対する
圧力又は負荷を低減し、配管システム構成部材の損傷又
は劣化を防止することが可能となる。
Further, particularly in a piping system including a radiator or a heat exchanger using a small-diameter pipe or a thin pipe, a fluid such as a heat medium liquid is satisfactorily circulated by utilizing a positive fluid pressure as a whole. Although it is actually difficult to do so, the piping system having the above-described configuration that uses a negative fluid pressure allows a required amount of fluid to flow relatively smoothly with respect to a piping system including a small diameter pipe or a thin pipe. Can be cycled to. Moreover,
Since a relatively low pressure fluid pressure acts only on the pipelines that make up the piping system, it is possible to reduce the pressure or load on the pipe material or the pipe wall, etc., and prevent damage or deterioration of the piping system constituent members. It will be possible.

【0006】[0006]

【発明の実施の形態】本発明の好適な実施形態によれ
ば、上記空調熱源が温水熱源であり、上記熱媒体流体が
温水又は高温熱媒体液(以下、温水という)であり、上
記温水熱源は、上記熱媒体リターン管路に介装され、温
水補給手段が、該リターン管路に連結される。本発明に
従って比較的小容量に設計された流体圧送ポンプは、温
水熱源の温水を円滑に上記ループ型密閉配管回路に循環
させる。本発明の或る好適な実施形態において、上記空
調機器は、間隔を隔てて並列に配置された複数の管路の
集合体からなる管路集合体をセルフレベリング材に埋設
することにより施工された床暖房装置である。上記管路
集合体は、上記管路間に延在し且つ隣接する管路同士を
相互連結する基板を備え、該管路集合体は、床基盤上に
敷設され、セルフレベリング材により被覆される。管路
集合体の第1端は、前記熱媒体供給管路に連結され、該
管路集合体の第2端は、上記熱媒体リターン管路に連結
され、熱媒体供給管路の正圧は、管路集合体において負
圧に転換し、負の流体圧力が該管路集合体の第2端に形
成される。本発明の好ましい実施形態において、上記ポ
ンプの吸引口又はサクションポートは、所望により温水
供給ヘッダーを介して、温水ボイラー等の温水加熱コイ
ルの流出口に連結される。流体圧送ポンプの吸引側に介
装された温水加熱コイルは、ポンプの吸引圧力により負
圧下にポンプに吸引される。かかる構成によれば、一般
に正圧管路において比較的大きな管路抵抗として作用す
る温水加熱コイル等を負圧管路部分に配置し、これによ
り、循環配管回路全体の管路抵抗を効果的に軽減するこ
とができる。
According to a preferred embodiment of the present invention, the air conditioning heat source is a hot water heat source, the heat medium fluid is hot water or a high temperature heat medium liquid (hereinafter referred to as hot water), and the hot water heat source is Is interposed in the heat medium return pipe, and the hot water supply means is connected to the return pipe. The fluid pressure pump designed to have a relatively small capacity according to the present invention smoothly circulates the hot water of the hot water heat source through the loop type closed piping circuit. In a preferred embodiment of the present invention, the air conditioner is constructed by embedding a conduit assembly, which is an assembly of a plurality of conduits arranged in parallel at a distance, in a self-leveling material. It is a floor heating system. The conduit assembly includes a substrate extending between the conduits and interconnecting adjacent conduits. The conduit assembly is laid on a floor base and covered with a self-leveling material. . The first end of the conduit assembly is connected to the heat medium supply conduit, the second end of the conduit assembly is connected to the heat medium return conduit, and the positive pressure of the heat medium supply conduit is , Convert to negative pressure in the conduit assembly and a negative fluid pressure is formed at the second end of the conduit assembly. In a preferred embodiment of the invention, the suction port or suction port of the pump is optionally connected via a hot water supply header to the outlet of a hot water heating coil such as a hot water boiler. The hot water heating coil provided on the suction side of the fluid pressure pump is sucked by the pump under negative pressure due to the suction pressure of the pump. According to this configuration, the hot water heating coil or the like, which generally acts as a relatively large conduit resistance in the positive pressure conduit, is arranged in the negative pressure conduit portion, thereby effectively reducing the conduit resistance of the entire circulation piping circuit. be able to.

【0007】好ましくは、温水配管システム全体の温水
循環量を自動的に補償する温水循環量調整手段が、温水
還流ヘッダー又は温水加熱コイルに連結される。かかる
構成によれば、温水循環量調整手段がリターン管路部分
にて補給水を迅速且つ円滑に供給することができるの
で、負圧の過剰作用による温水加熱コイルの損傷又は破
損等を未然に回避することができる。なお、本発明の配
管システムは、密閉式又は半密閉式の配管系のみなら
ず、設計に応じて一般的設計の空調配管システムに対し
ても適用し得る。また、本発明の上記構成は、比較的高
温の熱媒体液を循環する温水配管のみならず、冷水配管
等を含む配管システムに対しても適用することができ
る。
Preferably, the hot water circulation amount adjusting means for automatically compensating the hot water circulation amount of the entire hot water piping system is connected to the hot water reflux header or the hot water heating coil. According to such a configuration, the hot water circulation amount adjusting means can quickly and smoothly supply the makeup water in the return pipe portion, so that the hot water heating coil is prevented from being damaged or damaged due to the excessive action of the negative pressure. can do. The piping system of the present invention can be applied not only to a closed or semi-closed piping system but also to an air conditioning piping system of a general design depending on the design. Further, the above configuration of the present invention can be applied not only to hot water pipes that circulate a relatively high-temperature heat medium liquid, but also to piping systems including cold water pipes and the like.

【0008】[0008]

【実施例】以下、添付図面を参照して、本発明の好適な
実施例について詳細に説明する。図1は、本発明の実施
例に係る空調配管システムが適用される温水床暖房装置
の概略断面図であり、図2は、図1に示す管路集合体の
斜視図及び部分拡大断面図である。温水循環方式の床暖
房装置1は、コンクリート床スラブ等の床基板2上に配
置された温水配管の管路集合体10と、管路集合体10
を被覆する床下地材3とから構成される。管路集合体1
0は、図2に示す如く、幅員方向に所定の間隔を隔てて
配置された6本の管路12a乃至12fと、管路12の
間に延在し且つ隣接する管路12同士を相互連結する基
板14とから構成された全体的に長尺シート状の成形品
である。管路集合体10の各管路12は、図2(B)に
示す如く、実質的に円形断面形状を有する管体であり、
流体を圧送又は連通可能な流体通路13を中心部に備え
る。各管路12は、接線方向に延びる基板14によって
相互連結される。例えば、各管路12の相互間隔は、1
5乃至40mm程度に設定され、各管路12の外径及び内
径は夫々、10乃至15mmおよび5乃至10mm程度に夫
々設計される。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 is a schematic sectional view of a hot water floor heating apparatus to which an air conditioning piping system according to an embodiment of the present invention is applied, and FIG. 2 is a perspective view and a partially enlarged sectional view of the pipeline assembly shown in FIG. is there. The floor heating device 1 of the hot water circulation system includes a pipeline assembly 10 of hot water piping arranged on a floor substrate 2 such as a concrete floor slab, and a pipeline assembly 10.
And the floor base material 3 that covers the. Pipe line assembly 1
As shown in FIG. 2, 0 is interconnected between the six pipelines 12a to 12f arranged at predetermined intervals in the width direction and the pipelines 12 extending between the pipelines 12 and adjacent to each other. Is a long sheet-like molded product composed of a substrate 14 for Each pipeline 12 of the pipeline assembly 10 is a pipeline having a substantially circular cross-sectional shape, as shown in FIG.
A fluid passage 13 capable of pumping or communicating a fluid is provided in the central portion. Each conduit 12 is interconnected by a tangentially extending substrate 14. For example, the mutual interval between the pipe lines 12 is 1
It is set to about 5 to 40 mm, and the outer diameter and the inner diameter of each conduit 12 are designed to be about 10 to 15 mm and about 5 to 10 mm, respectively.

【0009】管路集合体10は、合成ゴム等のゴム素
材、合成樹脂、或いは、合成ゴム及び合成樹脂の混合材
料を基材とした一体成形品からなり、好ましくは、合成
繊維又は天然繊維の短繊維強化材を混入した特殊ゴムを
母材又は主材とするハイブリッドポリマーエラストマー
を射出成形機により連続的に押出し成形してなる長尺シ
ート状の一体成形品である。管路集合体10は、比較的
容易に変形可能な弾性を有し、図2(A)に示す如く、
長尺シート状物のロールRとして巻回される。ロールR
の形態にて建築物の施工領域(施工現場)に資材搬送又
は運搬された管路集合体10は、ロールRから繰り出さ
れ、床基板2上の所定の施工部位に配置又は敷設され
る。施工において、管路12を上側に配置した状態でロ
ールRから管路集合体10を繰り出した後、例えば、カ
チオン系接着剤によって基板14の下面と床基板2の上
面とを接着し、しかる後、セメント系又はセラミック系
セルフレベリング材を流し延べ、図1に示す床下地材3
を形成する。更に、管路集合体10を埋設した床下地材
3が乾燥硬化又は安定化した後、所定の施工方法に従っ
て、Pタイル、塩ビシート又は絨毯等の床仕上材4を床
下地材3上に敷設し、図1に示す床暖房装置1の施工を
完了する。
The duct assembly 10 is made of a synthetic rubber or other rubber material, a synthetic resin, or an integrally molded product made of a mixed material of synthetic rubber and synthetic resin as a base material, and is preferably made of synthetic fiber or natural fiber. It is a long sheet-shaped integrally molded product obtained by continuously extruding a hybrid polymer elastomer containing a special rubber mixed with a short fiber reinforcing material as a base material or a main material by an injection molding machine. The conduit assembly 10 has elasticity that can be deformed relatively easily, and as shown in FIG.
It is wound as a roll R of a long sheet material. Roll R
The pipeline assembly 10 that has been transported or transported to the construction area (construction site) of the building in the above form is unrolled from the roll R, and is arranged or laid at a predetermined construction site on the floor substrate 2. In the construction, after the conduit assembly 10 is unrolled from the roll R with the conduit 12 arranged on the upper side, for example, the lower surface of the substrate 14 and the upper surface of the floor substrate 2 are bonded by a cationic adhesive, and then , A cement-based or ceramic-based self-leveling material, and a floor base material 3 shown in FIG.
To form Furthermore, after the floor base material 3 in which the duct assembly 10 is embedded is dried and hardened or stabilized, a floor finish material 4 such as a P tile, a vinyl chloride sheet or a carpet is laid on the floor base material 3 according to a predetermined construction method. Then, the construction of the floor heating system 1 shown in FIG. 1 is completed.

【0010】図3は、本発明の好適な実施例に係る温水
配管システムの配管回路図である。床暖房領域7全体に
亘って敷設された連続する管路集合体10は、温水供給
管20(実線で示す)及び温水還流管30(点線で示
す)に連結され、温水供給管20を介して管路集合体1
0に給送された温水は、温水還流管30に送出される。
ヘッダーユニット(図示せず)が各床暖房領域に配設さ
れ、各ヘッダーユニットは、往管ヘッダー及び還管ヘッ
ダーを備える。管路集合体10の第1端部10aが、往
管ヘッダーを介して、温水供給管20に連結され、管路
集合体10の第2端部10bが、還管ヘッダーを介し
て、温水還流管30に連結される。上記管路接続方式の
変形例として、管路集合体10を構成する管路12a、
12c、12eの第1端部10aを温水供給管20に連
結し、管路12a、12c、12eの第2端部10bを
温水還流管30に連結するとともに、管路12b、12
d、12fの第1端部10aを温水還流管30に連結
し、管路12b、12d、12fの第2端部10bを温
水供給管20に連結する設計を採用しても良い。かかる
管路接続方式によれば、各管路集合体10において隣接
する管路12には、互いに逆方向に温水が通水されるの
で、管路集合体10の温度分布が全体的に均一化する。
FIG. 3 is a piping circuit diagram of a hot water piping system according to a preferred embodiment of the present invention. The continuous pipe line assembly 10 laid over the entire floor heating area 7 is connected to the hot water supply pipe 20 (shown by a solid line) and the hot water return pipe 30 (shown by a dotted line), and via the hot water supply pipe 20. Pipe line assembly 1
The hot water fed to 0 is sent to the hot water return pipe 30.
A header unit (not shown) is arranged in each floor heating area, and each header unit includes a forward pipe header and a return pipe header. The first end 10a of the pipeline assembly 10 is connected to the hot water supply pipe 20 via the forward header, and the second end 10b of the pipeline assembly 10 is returned to the hot water supply via the return header. It is connected to the pipe 30. As a modified example of the above-mentioned pipeline connection system, pipelines 12a that configure the pipeline aggregate 10 are provided.
The first ends 10a of 12c and 12e are connected to the hot water supply pipe 20, the second ends 10b of the pipes 12a, 12c and 12e are connected to the hot water return pipe 30, and the pipes 12b and 12e are connected.
A design may be adopted in which the first ends 10a of d and 12f are connected to the hot water return pipe 30 and the second ends 10b of the conduits 12b, 12d, and 12f are connected to the hot water supply pipe 20. According to such a pipe connection method, hot water is passed through the pipe lines 12 adjacent to each other in the pipe line aggregates 10 in opposite directions, so that the temperature distribution of the pipe line aggregates 10 is made uniform overall. To do.

【0011】温水を各床暖房領域7に給送する各温水供
給管20は、温水ポンプPの吐出口又はデリバリーポー
トに連結され、温水ポンプPの吸引口又はサクションポ
ートは、サクション管34を介して温水供給ヘッダー2
1に連結される。他方、各床暖房領域7の温水リターン
流路を構成する各温水還流管30は、温水還流ヘッダー
31に連結される。温水還流ヘッダー31に連結された
低温水給送管32が、温水ボイラーBの温水加熱コイル
40の流入口41に接続され、温水供給ヘッダー21に
連結された高温水給送管33が、温水ボイラーBの温水
加熱コイル40の流出口42に接続される。温水ボイラ
ーBとして、例えば、ガスボイラー、電気加熱式ボイラ
ー、重油燃料式ボイラー又は石油ボイラー等が採用され
る。温水ボイラーBに代えて、ヒートポンプ吸収式冷温
水発生器等を使用することも可能である。温水配管シス
テム全体の温水循環量を自動的に補償する温水循環量調
整装置50が、温水補給管51を介して、温水還流ヘッ
ダー31に連結される。温度変化による熱媒体液(温
水)の体積変化を吸収する調整装置50は、温水還流ヘ
ッダー31内の流体圧力の低下を検出する圧力検出手段
(図示せず)を備え、該圧力検出手段が流体圧力の低下
を検出したときに、温水補給管50を介して自動的に温
水還流ヘッダー31に補給水を供給するように構成され
ている。
Each hot water supply pipe 20 for supplying hot water to each floor heating area 7 is connected to the discharge port or delivery port of the hot water pump P, and the suction port or suction port of the hot water pump P is connected via the suction pipe 34. Hot water supply header 2
Connected to 1. On the other hand, the hot water return pipes 30 forming the hot water return passages of the floor heating areas 7 are connected to the hot water return header 31. The low-temperature water feed pipe 32 connected to the hot-water recirculation header 31 is connected to the inlet 41 of the hot-water heating coil 40 of the hot-water boiler B, and the high-temperature water feed pipe 33 connected to the hot-water supply header 21 is the hot-water boiler. It is connected to the outlet 42 of the hot water heating coil 40 of B. As the hot water boiler B, for example, a gas boiler, an electric heating type boiler, a heavy oil fuel type boiler, a petroleum boiler or the like is adopted. Instead of the hot water boiler B, it is also possible to use a heat pump absorption type cold / hot water generator or the like. A hot water circulation amount adjusting device 50 that automatically compensates the hot water circulation amount of the entire hot water piping system is connected to the hot water recirculation header 31 via a hot water supply pipe 51. The adjusting device 50 that absorbs the volume change of the heat carrier liquid (warm water) due to the temperature change includes pressure detecting means (not shown) for detecting a decrease in the fluid pressure in the hot water reflux header 31, and the pressure detecting means is a fluid. When a decrease in pressure is detected, makeup water is automatically supplied to the warm water return header 31 via the warm water supply pipe 50.

【0012】温水供給管20、管路集合体10、温水還
流管30、温水還流ヘッダー31、低温水給送管32、
温水加熱コイル40、高温水給送管33、温水供給ヘッ
ダー21およびサクション管34により構成される一連
の温水循環回路は、実質的に完全に密閉した閉配管回路
又はループ配管回路を形成する。温水循環回路に接続さ
れた調整装置50は、温水水温の変化又は意図せぬ温水
の漏洩等により、温水循環回路を循環する温水容量が低
減したとき、温水供給ヘッダー31内の流体圧力の低下
を検出し、温水容量の低減を補償すべく補給水を温水循
環回路に注入する。従って、温水循環回路は、実質的に
一定の保有量の温水を循環する密閉配管系を構成する。
温水循環回路に配置される温水ポンプPの吐出能力(吐
出量及び全揚程)は、管路の摩擦損失水頭、ベンド管・
逆止弁・仕切弁・ストレーナ等の損失水頭、吸引口及び
吐出口の速度損失などの圧力損失の総計に基づいて決定
される。上記床暖房装置1の所要暖房能力は、床暖房面
積、暖房設定温度、外気温条件、蓄熱量等に基づいて設
計され、所要暖房能力に基づいて床暖房装置1に循環す
べき温水流量が決定される。一般に、床暖房装置1を構
成する管路集合体10は、上記の如く、比較的小径且つ
長い多数の管路(例えば、内径10乃至20mm、管長3
0乃至50m)を備えているので、実質的に長さに反比
例し且つ管路の差圧に比例する温水流量を所望の如く確
保するために、温水ポンプPの吐出圧力を比較的高く設
計し、温水ポンプPのサクション側の圧力を正圧(プラ
ス圧)又は陽圧に設定せざるを得ない。しかしながら、
本例の温水循環回路では、図3に実線で示す温水供給管
20の流体圧力は、正圧(プラス圧力)に設定され、流
体圧力は、管路集合体10の中間領域にて負圧(マイナ
ス圧力)又は陰圧に転換し、図3に点線で示すリターン
配管経路、即ち、温水還流管30からサクション管34
に至る配管経路の流体圧力は、負圧(マイナス圧力)に
設定される。温水ポンプPの押出側圧力は、大気圧を超
える所望の圧力、例えば、2.0kgに設定され、温水
ポンプPの吸引側圧力は、大気圧以下の所定値、例え
ば、0.7kgに設定される。このような圧力設定によ
れば、従来の配管経路で使用し得なかった負圧の流体管
系を密閉配管(温水循環回路)の還流管に適用する結果
となるが、実際には、温水が円滑に上記温水循環回路を
循環することが判明した。
Hot water supply pipe 20, conduit assembly 10, hot water return pipe 30, hot water return header 31, low temperature water supply pipe 32,
A series of hot water circulation circuits constituted by the hot water heating coil 40, the hot water supply pipe 33, the hot water supply header 21 and the suction pipe 34 form a substantially completely closed closed pipe circuit or loop pipe circuit. The adjusting device 50 connected to the hot water circulation circuit reduces the fluid pressure in the hot water supply header 31 when the volume of hot water circulating in the hot water circulation circuit is reduced due to a change in the temperature of the hot water or unintended leakage of hot water. Make-up water is injected into the hot water circulation circuit to detect and compensate for the reduction in hot water capacity. Therefore, the hot water circulation circuit constitutes a closed piping system that circulates a substantially fixed amount of hot water.
The discharge capacity (discharge amount and total head) of the warm water pump P arranged in the warm water circulation circuit is determined by the friction loss head of the pipeline, the bend pipe,
It is determined based on the total loss of head such as check valve, sluice valve, strainer, and pressure loss such as speed loss of suction port and discharge port. The required heating capacity of the floor heating apparatus 1 is designed based on the floor heating area, the heating set temperature, the outside air temperature condition, the amount of heat storage, etc., and the hot water flow rate to be circulated to the floor heating apparatus 1 is determined based on the required heating capacity. To be done. Generally, as described above, the pipeline assembly 10 constituting the floor heating system 1 has a large number of pipelines having a relatively small diameter and a long length (for example, an internal diameter of 10 to 20 mm and a pipeline length of 3).
0 to 50 m), the discharge pressure of the hot water pump P is designed to be relatively high in order to secure a desired hot water flow rate that is substantially inversely proportional to the length and proportional to the differential pressure of the pipeline. The pressure on the suction side of the hot water pump P must be set to a positive pressure (plus pressure) or a positive pressure. However,
In the hot water circulation circuit of this example, the fluid pressure of the hot water supply pipe 20 shown by the solid line in FIG. 3 is set to a positive pressure (plus pressure), and the fluid pressure is a negative pressure (in the intermediate region of the conduit assembly 10). (Negative pressure) or negative pressure, and the return pipe path shown by the dotted line in FIG. 3, that is, the hot water return pipe 30 to the suction pipe 34.
The fluid pressure of the piping path leading to the is set to a negative pressure (negative pressure). The extrusion side pressure of the hot water pump P is set to a desired pressure exceeding atmospheric pressure, for example, 2.0 kg, and the suction side pressure of the hot water pump P is set to a predetermined value below atmospheric pressure, for example, 0.7 kg. It Such a pressure setting results in applying a negative pressure fluid pipe system that could not be used in the conventional piping route to the reflux pipe of the closed pipe (hot water circulation circuit). It was found that the hot water circulation circuit smoothly circulated.

【0013】また、ボイラー等の加熱機器は、管路抵抗
が比較的大きい温水加熱コイルを内蔵することから、一
般に温水ポンプの押出し側、即ち、温水ポンプの吐出口
と床暖房装置等の熱交換装置との間に配置される。しか
しながら、本例の温水循環回路では、ホイラーBは、温
水ポンプPの吸引側、即ち、温水ポンプPの吸引口と床
暖房装置1との間に配置される。また、ボイラーBの温
水加熱コイル40の流体圧力が負圧に設定されることか
ら、ボイラーBの上流側に位置する温水還流ヘッダー3
1に対して温水循環量調整装置50を連結することが可
能となり、これにより、(補給水を正圧の流体に押し込
む形態と異なり)補給水を比較的容易に温水循環回路に
供給することができる。なお、負圧に設定された配管経
路、即ち、温水還流管30からサクション管34に至る
配管経路にエアー抜き手段を配設すると、配管経路の負
圧により大気が管路内に逆流する虞がある。従って、逆
流防止手段を備えた特殊なエアー抜きバルブを該配管経
路に設け、或いは、正圧に設定された温水供給管20に
エアー抜きバルブを配設することが望ましい。次に、以
上の如く構成された温水配管システム及び温水床暖房装
置の作動について説明する。
Further, since a heating device such as a boiler has a built-in hot water heating coil having a relatively large conduit resistance, it is generally the extruding side of the hot water pump, that is, the discharge port of the hot water pump and the heat exchange of the floor heating device. It is arranged between the device and the device. However, in the hot water circulation circuit of the present example, the wheeler B is arranged on the suction side of the hot water pump P, that is, between the suction port of the hot water pump P and the floor heating device 1. In addition, since the fluid pressure of the hot water heating coil 40 of the boiler B is set to a negative pressure, the hot water recirculation header 3 located upstream of the boiler B.
It becomes possible to connect the hot water circulation amount adjusting device 50 to 1, so that the makeup water can be supplied to the hot water circulation circuit relatively easily (unlike the mode in which the makeup water is pushed into the positive pressure fluid). it can. If the air venting means is provided in the piping path set to the negative pressure, that is, the piping path from the hot water return pipe 30 to the suction pipe 34, the negative pressure in the piping path may cause the atmospheric air to flow back into the pipeline. is there. Therefore, it is desirable to provide a special air bleed valve provided with a backflow prevention means in the piping path, or to dispose the air bleed valve in the hot water supply pipe 20 set to a positive pressure. Next, the operation of the hot water piping system and the hot water floor heating apparatus configured as described above will be described.

【0014】温水ボイラーBにて加熱された高温水は、
各温水ポンプPの吸引圧力により、高温水給送管33を
介して、温水供給ヘッダー21内に流入し、温水供給ヘ
ッダー21を介して、各温水ポンプPの吸引口に吸引さ
れる。各温水ポンプPは、吸引した高温水を温水供給管
20に圧送し、各床暖房領域7の管路集合体10に給送
する。管路集合体10の各管路12に通水された高温水
は、管路12の管壁と床下地材3との熱交換により冷却
し、温水還流管30に送出される。高温水の熱量が伝達
された床下地材3は、床仕上材4の表面温度を上昇さ
せ、床仕上材4は、床暖房作用を発揮する。管路集合体
10から各温水還流管30に送出された低温水は、温水
還流ヘッダー31に流入し、温水還流ヘッダー31にて
合流し、低温水給送管32を介して温水ボイラーBの加
熱コイル40に流入する。温水ボイラーBにおいて加熱
した高温水は、上記の如く、高温水給送管33及び温水
供給ヘッダー21を介して温水ポンプPに吸引される。
上記構成の温水配管システムを備えた床暖房装置におい
て、温水供給管20の流体圧力が正圧(プラス圧力)に
設定され、該流体圧力は、管路集合体10の中間領域に
て負圧(マイナス圧力)に転換し、温水還流管30から
サクション管34に至る配管経路の流体圧力は、負圧に
設定される。上記温水配管システムでは、このような特
殊な圧力設定により、温水が円滑に温水循環回路を循環
する。従って、上記温水配管システムによれば、温水ポ
ンプPの吐出圧を低下させ、温水ポンプPの揚程、容量
及び電力消費量等を低減することができる。
The high temperature water heated by the hot water boiler B is
Due to the suction pressure of each hot water pump P, it flows into the hot water supply header 21 through the hot water feed pipe 33, and is sucked into the suction port of each hot water pump P through the hot water supply header 21. Each hot water pump P pressure-feeds the sucked high-temperature water to the hot-water supply pipe 20, and feeds it to the pipe line assembly 10 in each floor heating area 7. The high-temperature water that has passed through each of the pipelines 12 of the pipeline assembly 10 is cooled by heat exchange between the pipe wall of the pipeline 12 and the floor base material 3, and is sent to the hot water return pipe 30. The floor base material 3 to which the heat quantity of the high-temperature water is transmitted raises the surface temperature of the floor finish material 4, and the floor finish material 4 exhibits a floor heating effect. The low-temperature water sent from the pipe line assembly 10 to each hot-water reflux pipe 30 flows into the hot-water reflux header 31, joins at the hot-water reflux header 31, and heats the hot-water boiler B via the cold-water feed pipe 32. It flows into the coil 40. The hot water heated in the hot water boiler B is sucked into the hot water pump P via the hot water feed pipe 33 and the hot water supply header 21 as described above.
In the floor heating apparatus including the hot water piping system configured as described above, the fluid pressure of the hot water supply pipe 20 is set to a positive pressure (plus pressure), and the fluid pressure is a negative pressure (in the intermediate region of the pipe assembly 10). The pressure of the fluid is changed to a negative pressure, and the fluid pressure in the pipe path from the hot water return pipe 30 to the suction pipe 34 is set to a negative pressure. In the above hot water piping system, hot water smoothly circulates in the hot water circulation circuit by such a special pressure setting. Therefore, according to the above hot water piping system, the discharge pressure of the hot water pump P can be reduced, and the head, capacity, power consumption, etc. of the hot water pump P can be reduced.

【0015】図4は、本発明の第2実施例に係る温水配
管システムの配管回路図である。各床暖房領域7に敷設
された管路集合体10の第1端10aは、温水供給管2
0(実線で示す)に連結され、温水供給管20は、温水
主管25(実線で示す)に連結される。温水主管25の
基端又は上流端は、温水ポンプPの吐出口に連結され
る。また、各床暖房領域7の管路集合体10の第2端1
0bは、温水還流管30(点線で示す)に連結され、温
水還流管20は、リターン主管35(点線で示す)に連
結される。温水リターン主管35の末端又は下流端は、
温水ボイラーBの温水加熱コイル40の流入口41に接
続される。温水加熱コイル40の流出口42は、サクシ
ョン管34を介して温水ポンプPの吸引口42に接続さ
れる。本例において、温水ボイラーBの加熱コイル40
から送出される高温水は、各温水ポンプPの吸引圧力に
より、サクション管34を介して、温水ポンプPの吸引
口に吸引される。温水ポンプPは、高温水を温水主管2
5及び各温水供給管20に圧送し、各床暖房領域7の管
路集合体10に給送する。管路集合体10の各管路12
に通水された高温水は、上記の如く、床下地材3との熱
交換作用により冷却し且つ床仕上材4を加熱し、各温水
還流管30に送出され、更に、リターン主管35を介し
て、温水ボイラーBの加熱コイル40に流入する。
FIG. 4 is a piping circuit diagram of a hot water piping system according to a second embodiment of the present invention. The first end 10a of the pipe line assembly 10 laid in each floor heating area 7 is the hot water supply pipe 2
0 (shown by a solid line), and the hot water supply pipe 20 is connected to a hot water main pipe 25 (shown by a solid line). The base end or upstream end of the hot water main pipe 25 is connected to the discharge port of the hot water pump P. In addition, the second end 1 of the duct assembly 10 in each floor heating area 7
0b is connected to the hot water return pipe 30 (shown by a dotted line), and the hot water return pipe 20 is connected to a return main pipe 35 (shown by a dotted line). The end or downstream end of the hot water return main pipe 35 is
It is connected to the inlet 41 of the hot water heating coil 40 of the hot water boiler B. The outlet 42 of the hot water heating coil 40 is connected to the suction port 42 of the hot water pump P via the suction pipe 34. In this example, the heating coil 40 of the hot water boiler B
The high-temperature water sent out from each of the hot water pumps P is sucked into the suction port of the hot water pump P through the suction pipe 34 by the suction pressure of each hot water pump P. The hot water pump P is for supplying hot water to the hot water main pipe 2
5 and the hot water supply pipes 20 and the pipes 10 in each floor heating area 7. Each conduit 12 of the conduit assembly 10
As described above, the high-temperature water that has been passed through is cooled by the heat exchange action with the floor base material 3, heats the floor finish material 4, is sent to each hot water return pipe 30, and is further passed through the return main pipe 35. And flows into the heating coil 40 of the hot water boiler B.

【0016】また、負圧の配管系統(点線で示す)に配
置され、従って、負圧流体を通水する温水加熱コイル4
0は、一般に設計上考慮されない負の流体圧力がコイル
管壁に作用し、しかも、水温変化等による循環温水量又
は温水容積の不足が生じたとき、加熱コイル40の負圧
が一層大きくコイル管壁に作用する。しかしながら、温
水補給装置52が、温水加熱コイル40の配管領域に連
結され、温水補給装置52は、温水配管システム全体の
温水循環量を自動調整する圧力補償弁53及び温水補給
管54を介して、温水補給装置52は、温水コイル40
に対して自動的に補給水を供給し、温水コイル40内の
流体圧力の低下を補償する。従って、負の流体圧力によ
る加熱コイル40の損傷又は破損等を確実に回避し得
る。
Further, the hot water heating coil 4 is arranged in the negative pressure piping system (shown by the dotted line), and accordingly, the negative pressure fluid is passed through.
0 indicates that when negative fluid pressure, which is not generally considered in design, acts on the coil pipe wall, and when the circulating hot water amount or hot water volume is insufficient due to changes in water temperature or the like, the negative pressure of the heating coil 40 is further increased. Acts on the wall. However, the hot water replenishing device 52 is connected to the pipe region of the hot water heating coil 40, and the hot water replenishing device 52 uses the pressure compensation valve 53 and the hot water replenishing pipe 54 that automatically adjust the hot water circulation amount of the entire hot water pipe system. The hot water supply device 52 includes the hot water coil 40.
Is automatically supplied to compensate for the drop in fluid pressure in the hot water coil 40. Therefore, the damage or breakage of the heating coil 40 due to the negative fluid pressure can be reliably avoided.

【0017】[0017]

【発明の効果】以上説明したとおり、空調設備における
温水ポンプ等の流体圧送装置の設備容量を低減すること
ができる空調配管システムを提供することができる。
As described above, it is possible to provide an air conditioning piping system capable of reducing the equipment capacity of a fluid pumping device such as a hot water pump in air conditioning equipment.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の第1実施例に係る空調配管システムが
適用される温水床暖房装置の概略断面図である。
FIG. 1 is a schematic sectional view of a hot water floor heating apparatus to which an air conditioning piping system according to a first embodiment of the present invention is applied.

【図2】図1に示す管路集合体の斜視図及び部分拡大断
面図である。
FIG. 2 is a perspective view and a partially enlarged cross-sectional view of the conduit assembly shown in FIG.

【図3】本発明の第1実施例に係る温水配管システムの
配管回路図である。
FIG. 3 is a piping circuit diagram of the hot water piping system according to the first embodiment of the present invention.

【図4】本発明の第2実施例に係る温水配管システムの
配管回路図である。
FIG. 4 is a piping circuit diagram of a hot water piping system according to a second embodiment of the present invention.

【符号の説明】[Explanation of symbols]

1 床暖房装置 2 床基板 7 床暖房領域 10 管路集合体 12 管路 13 流体通路 14 基板 20 温水供給管 21 温水供給ヘッダー 30 温水還流管 31 温水還流ヘッダー 32 低温水給送管 33 高温水給送管 34 サクション管 40 温水加熱コイル 41 流入口 42 流出口 50 温水循環量調整装置 51 温水補給管 52 温水補給装置 P 温水ポンプ B 温水ボイラー 1 Floor Heating Device 2 Floor Substrate 7 Floor Heating Area 10 Pipeline Assembly 12 Pipeline 13 Fluid Passage 14 Substrate 20 Hot Water Supply Pipe 21 Hot Water Supply Header 30 Hot Water Reflux Pipe 31 Hot Water Reflux Header 32 Low Temperature Water Supply Pipe 33 High Temperature Water Supply Sending pipe 34 Suction pipe 40 Hot water heating coil 41 Inlet 42 Outlet 50 Hot water circulation adjustment device 51 Hot water supply pipe 52 Hot water supply device P Hot water pump B Hot water boiler

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 空調熱源と、該空調熱源の空調用熱媒体
を空調機器に循環する熱媒体流体の配管回路と、前記熱
媒体配管に熱媒体流体を圧送する流体圧送ポンプとを備
え、実質的に密閉したループ配管回路を全体的に形成す
る空調配管システムおいて、 前記空調機器と前記ポンプの吐出口とを連結する熱媒体
供給管路の流体圧力を正圧に設定し、前記空調機器と前
記ポンプの吸引口とを連結する熱媒体リターン管路の流
体圧力を負圧に設定し、前記熱媒体リターン管路の流体
を前記ポンプの吸引負圧により給送するようにしたこと
を特徴とする空調配管システム。
1. An air-conditioning heat source, a heat-medium fluid piping circuit for circulating an air-conditioning heat medium of the air-conditioning heat source to air-conditioning equipment, and a fluid pressure pump for pumping the heat-medium fluid to the heat medium piping. In an air conditioning piping system that entirely forms an electrically closed loop piping circuit, the fluid pressure of a heat medium supply pipeline that connects the air conditioning equipment and the discharge port of the pump is set to a positive pressure, and the air conditioning equipment is And a suction port of the pump, the fluid pressure of the heat medium return pipeline is set to a negative pressure, and the fluid of the heat medium return pipeline is fed by the suction negative pressure of the pump. And air conditioning piping system.
【請求項2】 前記空調熱源が温水熱源であり、前記熱
媒体流体が温水であり、前記温水熱源は、前記熱媒体リ
ターン管路に介装され、温水補給手段が、前記リターン
管路に連結されたことを特徴とする請求項1に記載の空
調配管システム。
2. The air conditioning heat source is a hot water heat source, the heat medium fluid is hot water, the hot water heat source is interposed in the heat medium return conduit, and hot water supply means is connected to the return conduit. The air conditioning piping system according to claim 1, wherein the air conditioning piping system is provided.
【請求項3】 前記空調機器は、間隔を隔てて並列に配
置された複数の管路の集合体からなる管路集合体をセル
フレベリング材に埋設することにより施工された床暖房
装置であり、前記管路集合体は、前記管路の間に延在し
且つ隣接する管路同士を相互連結する基板を備え、該管
路集合体は、床基盤上に敷設され、前記セルフレベリン
グ材により被覆され、 前記管路集合体の第1端は、前記熱媒体供給管路に連結
され、該管路集合体の第2端は、前記熱媒体リターン管
路に連結され、前記熱媒体供給管路の正圧は、前記管路
集合体において負圧に転換し、負の流体圧力が該管路集
合体の第2端に形成されることを特徴とする請求項1又
は2に記載の空調配管システム。
3. The floor heating device, wherein the air conditioner is a floor heating device constructed by embedding a conduit assembly, which is an assembly of a plurality of conduits arranged in parallel at a distance, in a self-leveling material, The conduit assembly includes a substrate extending between the conduits and interconnecting adjacent conduits, the conduit assembly being laid on a floor base and covered with the self-leveling material. A first end of the conduit assembly is connected to the heat medium supply conduit, a second end of the conduit assembly is connected to the heat medium return conduit, and the heat medium supply conduit is 3. The air-conditioning pipe according to claim 1, wherein the positive pressure is converted into a negative pressure in the pipeline assembly, and a negative fluid pressure is formed at the second end of the pipeline assembly. system.
JP3515096A 1996-02-22 1996-02-22 Air conditioning piping system Pending JPH09229388A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3515096A JPH09229388A (en) 1996-02-22 1996-02-22 Air conditioning piping system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3515096A JPH09229388A (en) 1996-02-22 1996-02-22 Air conditioning piping system

Publications (1)

Publication Number Publication Date
JPH09229388A true JPH09229388A (en) 1997-09-05

Family

ID=12433879

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3515096A Pending JPH09229388A (en) 1996-02-22 1996-02-22 Air conditioning piping system

Country Status (1)

Country Link
JP (1) JPH09229388A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002349882A (en) * 2001-05-21 2002-12-04 Enaatekku Kk Heat storage electrical warm water panel heating system
JP5570618B2 (en) * 2011-01-20 2014-08-13 三菱電機株式会社 Air conditioner

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002349882A (en) * 2001-05-21 2002-12-04 Enaatekku Kk Heat storage electrical warm water panel heating system
JP5570618B2 (en) * 2011-01-20 2014-08-13 三菱電機株式会社 Air conditioner

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