JPH09223867A - Manufacture of circuit board assembly - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce a manufacturing man-hour by applying cream solder to the body of a circuit board material, temporarily securing electronic component thereon, and operating a push-up means with the relative positions of a shielding case and the frame of the circuit board material maintained. SOLUTION: A circuit board consists of a body 11 and a frame 12. Cream solder is applied to the body of the circuit board. The lead terminals 31 of an electronic component with leads are inserted into the lead terminal insertion holes formed in the body of the circuit board material to temporarily secure the electronic part with leads on the body of the circuit board material. The circuit board material is guided by positioning pins as a first positioning means, and is placed on a first jig 5. A shielding case 4 is guided by a frame-like jig 7 as a second positioning means, and is positioned above the circuit board material. This reduces the number of manufacturing process steps, manufacturing equipment and the space for the manufacturing line, and enhances reliability.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a circuit board assembly including a circuit board on which electronic components are mounted and a shield case, such as a tuner for a television receiver.

[0002]

2. Description of the Related Art A circuit board assembly including a circuit board on which electronic components are mounted and a shield case, such as a tuner for a television receiver, is conventionally manufactured through at least three reflow soldering steps. There were many.

That is, a circuit board material in which a main body portion and a frame body portion are detachably integrated by pushback, V-cut, perforation, etc. is prepared, and the main body portion of the circuit board material has a surface such as a chip component. After the reflow soldering of the mounted component (first soldering) and then the reflow soldering of the leaded component such as the air core coil (second soldering), the main body of the circuit board material is attached. It was removed from the frame and manually placed in a shield case, and then reflow soldering (third soldering) between the substrate and the case was performed. However, the above 3
A soldering method using a robot or the like may be adopted for the soldering for the second time.

Conventionally, the biggest reason why soldering is divided into three times as described above is to insert a circuit board in a state where electronic components are temporarily fixed with cream solder into a shield case. , It was very difficult.

That is, there is a problem in that when a circuit board in which electronic components are temporarily fixed with cream solder is inserted into the shield case, a hand or a jig touches the temporarily fixed components or cream solder.

On the other hand, as shown in FIG.
Using the circuit board material 1 in which the frame body portion 12 and the frame body portion 12 are integrated via the thin connecting portion 16, the circuit board body portion to which the cream solder is applied and the electronic component is temporarily fixed is attached to the frame body portion. It is possible to insert it into the shield case as it is, but in this case it is necessary to provide the shield case with a notch slit or the like for inserting the connecting part, and with the miniaturization of the tuner device etc., the shield case There is a problem in terms of strength and shield effect.

[0007]

SUMMARY OF THE INVENTION The present invention is a method of manufacturing a circuit board assembly including a circuit board on which electronic components are mounted and a shield case, thereby reducing the number of manufacturing steps by reducing the number of reflow soldering steps. The purpose is.

[0008]

A method of manufacturing a circuit board assembly according to the present invention is a method of manufacturing a circuit board assembly including a circuit board on which electronic components are mounted and a shield case. Applying cream solder to the main body portion of the circuit board material having the above and temporarily fixing the electronic component, and the circuit board material according to the first positioning means.
Is placed on the jig, the shield case is arranged above the circuit board material according to the second positioning means, and the relative position between the shield case and the circuit board material frame is fixed and the first case is fixed. The main body of the circuit board material is separated from the frame by operating the push-up means incorporated in the jig No. 1 and is pushed into the shield case to be temporarily fixed, and then the main body of the circuit board and the shield case are separated. The assembly is subjected to reflow soldering.

In the method of manufacturing the circuit board assembly according to the preferred embodiment of the present invention, the positioning pin attached to the first jig is used as the first positioning means.

Further, in the method for manufacturing a circuit board assembly according to a preferred embodiment of the present invention, the second positioning means has a relative position with respect to the first jig according to the first positioning means. A regulated second jig is used, or a positioning claw attached to the first jig is used.

Further, in the method for manufacturing a circuit board assembly according to a preferred embodiment of the present invention, the relative arrangement of the shield case and the frame body portion of the circuit board material is fixed.
The shield case is pressed against the frame portion of the circuit board material, or the shield case is pressed against the second jig, and the second jig is pressed against the frame portion of the circuit board material. This is done by pressing.

Further, in the method for manufacturing a circuit board assembly according to a preferred embodiment of the present invention, as the pushing-up means, a portion of the circuit board material facing the cream solder application portion and the electronic component temporary fixing portion is recessed. Use a push-up board.

According to the above-described manufacturing method of the present invention, when the circuit board in which the electronic component is temporarily fixed by the cream solder is inserted into the shield case, the hand or jig touches the temporary fixed component or the cream solder. Therefore, reflow soldering between the electronic component and the circuit board and between the circuit board and the shield case can be performed at the same time.

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.

[0015]

Embodiment 1 FIGS. 1 and 2 show that a circuit board member 1 having a body portion 11 and a frame portion 12 is coated with cream solder (not shown) on the body portion, and a lead such as an air core coil is attached. The lead terminal 31 of the electronic component 3 is inserted into the lead terminal insertion hole provided in the circuit board material main body to temporarily fix the electronic component with leads to the circuit board material main body. First jig according to the positioning pin 51 as positioning means
5 is a top view (FIG. 1) and a side view showing a state in which the shield case 4 is placed above the circuit board material according to a frame-shaped jig (second jig) 7 serving as a second positioning means on the substrate 5. It is a figure (FIG. 2: However, about a circuit board material, a 1st jig | tool, and a 2nd jig) AA 'sectional drawing of FIG.

The circuit board material in this embodiment is provided with two main body portions, and the main body portion and the frame portion are integrated by a pushback structure.

Further, the chip component 2 is previously reflow-soldered on the lower surface of the circuit board material main body, and the cream solder is used not only for the temporary fixing portion between the circuit board material and the leaded component but also for the circuit board material. It is also applied to the portion to be joined with the shield case.

Further, a positioning pin as a first positioning means is attached to the first jig, and the positioning pin is a frame-shaped jig as a second positioning means and the first jig. It is also used to regulate the relative placement with.

In order to regulate the relative arrangement of the second positioning means and the first jig, the positioning pin as the first positioning means is not used, but it is attached to the first jig. Other positioning pins, positioning claws, etc. may be used.

When the shield case is pressed downward from the state shown in FIGS. 1 and 2, the frame body portion of the circuit board material is sandwiched between the shield case and the first jig, and the shield case and the circuit. The relative arrangement with the substrate material frame body portion is fixed.

Here, the structure of the frame-shaped jig is modified so that a part of the frame-shaped jig is interposed between the shield case and the circuit board material frame body portion, and the shield case is pressed against the frame-shaped jig. The relative arrangement between the shield case and the circuit board material frame body portion may be fixed by pressing the frame-shaped jig against the frame body portion of the circuit board material at the same time.

Thereafter, the push-up board 6 (see FIG. 2) as a push-up means built in the first jig is operated to separate the main body portion of the circuit board material from the frame portion by the push-back mechanism and The main body of the circuit board material is pushed into the shield case to be fitted therein, and the fitting body is reflow-soldered to complete the electronic component assembly.

The push-up board is pushed up manually or by an air cylinder mechanism, etc., and the upper surface of the push-up board has a structure in which a portion facing the cream solder application section and the electronic component temporary fixing section of the circuit board material main body is depressed Has become
It is configured to mainly push the vicinity of the pushback portion.

The fitting of the circuit board material main body portion and the shield case is made by providing minute protrusions, dowels, etc. on the inner side surface of the shield case, and the circuit board material main body portion overcoming the minute protrusions. Secure mating. Also, after pushing the main body of the circuit board material into the shield case, before removing it from the first jig or after removing it, bend the tongue piece 41 (see FIG. 2) provided on the side surface of the shield case inward. The circuit board material body may be temporarily fixed in the shield case.

When the pushback is removed from the frame portion of the circuit board material main body, there is a concern that the temporary fixed parts may come off or move due to shock, vibration, etc. The pushing-up means may be operated while pressing the pressed pin or the like against the upper surface of the circuit board material main body.

[0026]

[Embodiment 2] FIG. 3 (perspective view) shows another embodiment using a circuit board material having a pushback structure.

In this embodiment, the main body portion 11 of the circuit board material 1 is
Key-shaped punched holes 13 are formed outside the four corners (on the side of the frame body 12). Then, the first jig 5 is provided with a positioning pin 51 as a first positioning means and a positioning claw 52 as a second positioning means, and the circuit board material is attached in accordance with the positioning pin. When the positioning is performed, the positioning claws project from the punched holes of the circuit board material, and the shield case is positioned according to the positioning claws. That is, it is not necessary to use the frame-shaped jig as in the case of the first embodiment.

[0028]

Third Embodiment An embodiment using a circuit board material other than the pushback structure is shown in FIG. 4 (perspective view) and FIG. 5 (cross-sectional view).

In this embodiment, the main body portion 11 of the circuit board material 1 is
The boundary between the frame portion 12 and the frame portion 12 is constituted by a V-cut processing portion 14 and a slit processing portion 15. Further, the first jig 5 is provided with an inclined surface 53 which serves as a relief when the frame portion of the circuit board material is folded by V-cut, and is provided with the various positioning means described in the first and second embodiments. After fixing the relative arrangement of the circuit board material and the shield case according to either,
The push-up board 6 built in the first jig is pushed up, the V-cut processing portion is folded, and the circuit board material main body portion is pushed into the shield case.

In the first to third embodiments, the case where the circuit board in the state where the leaded electronic component is temporarily fixed with the cream solder is inserted into the shield case has been described, but the manufacturing method of the present invention is the chip component. This is also effective when inserting the circuit board, which is temporarily fixed with cream solder, into the shield case.

[0031]

According to the present invention, when inserting a circuit board in a state in which an electronic component is temporarily fixed with cream solder into a shield case, a hand or a jig may touch the temporarily fixed component or cream solder. Therefore, reflow soldering between the electronic component and the circuit board and between the circuit board and the shield case can be performed at the same time.

This not only reduces the number of manufacturing steps in the circuit board assembly including the circuit board and the shield case, that is, reduces the manufacturing cost, but also leads to the reduction of the manufacturing equipment and the space of the manufacturing line.

Further, it becomes easy to meet the demands for miniaturization of the circuit board, high density mounting of components, etc., and the reliability of the circuit board assembly is improved by reducing the number of heat history of electronic components mounted on the circuit board. It also leads to improvement.

[Brief description of drawings]

FIG. 1 is a plan view of a circuit board material, a shield case, and a jig showing an intermediate step of the first embodiment of the present invention.

FIG. 2 is a side view of a shield case and a sectional view of a circuit board material and a jig showing an intermediate step of the first embodiment of the present invention.

FIG. 3 is a perspective view of a circuit board material and a jig showing an intermediate step of the second embodiment of the present invention.

FIG. 4 is a perspective view of a circuit board material and a jig showing an intermediate step of the third embodiment of the present invention.

FIG. 5 is a partial cross-sectional view of a circuit board material, a shield case and a jig showing an intermediate step of the third embodiment of the present invention.

FIG. 6 is a perspective view of a circuit board material according to a conventional example.

[Explanation of symbols]

 1 Circuit board material 11 Main body of circuit board material 12 Frame body of circuit board material 13 Punch hole 14 V cut processing part 15 Slit processing part 16 Connecting part 2 Chip part 3 Leaded part 31 Lead terminal of leaded part 4 Shield Case 41 Tongue piece 5 1st jig 51 Positioning pin 52 Positioning claw 53 Inclined surface 6 Push-up board 7 Frame-shaped jig (second jig)

Claims (7)

[Claims] 1. A method of manufacturing a circuit board assembly including a circuit board on which electronic components are mounted and a shield case, wherein cream solder is applied to the main body portion of a circuit board material having a main body portion and a frame body portion. Together with the electronic component is temporarily fixed, the circuit board material is placed on the first jig according to the first positioning means, the shield case is arranged above the circuit board material according to the second positioning means, The main body portion of the circuit board material is separated from the frame body portion by operating the push-up means provided in the first jig while fixing the relative arrangement of the shield case and the circuit board material frame body portion. A circuit board assembly, characterized in that the assembly of the circuit board body and the shield case is subjected to reflow soldering after being pushed into the shield case and temporarily fixed together with the shield case. Law. 2. The method of manufacturing a circuit board assembly according to claim 1, wherein the first positioning means is a positioning means using a positioning pin attached to the first jig. 3. The second positioning means is a positioning means that uses a second jig whose relative position to the first jig is regulated according to the first positioning means. The method for manufacturing a circuit board assembly according to claim 2. 4. The method of manufacturing a circuit board assembly according to claim 2, wherein the second positioning means is a positioning means using a positioning claw attached to the first jig. 5. The fixing of the relative arrangement of the shield case and the frame body portion of the circuit board material is performed by pressing the shield case against the frame body portion of the circuit board material. Alternatively, the method of manufacturing the circuit board assembly according to the item 4. 6. The fixing of the relative arrangement of the shield case and the frame body portion of the circuit board material is performed by pressing the shield case against the second jig, and by using the second jig with the circuit board material. The method for manufacturing a circuit board assembly according to claim 3, wherein the method is performed by pressing the frame body portion against the frame body portion. 7. The pushing-up means is a pushing-up means that uses a pushing-up board in which portions of the circuit board material facing the cream solder application portion and the electronic component temporary fixing portion are recessed. Method of manufacturing circuit board assembly.