JPH09222538A - Optical component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide the optical component (optical element device) which can be coupled with an optical fiber connector with high precision without being aligned. SOLUTION: A connection substrate 3 and an optical element chip 2 are provided, and the connection substrate 3 has two pin guide holes 5 for connection provided on both sides or a top surface of high flatness in parallel to the plane containing the center axes of the guide pins. The optical element chip 2 has a reverse surface of high flatness and is adhered and fixed so that the light emission point or light reception point 4 of the optical element chip 2 on the connection substrate 3 meets the corresponding light reception point or light emission point of a connected optical part.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical component such as an optical element device, and is particularly effective when applied to a semiconductor optical element device which is connected to an array type multi-core optical connector plug in a non-centered manner via guide pins. Technology.

[0002]

2. Description of the Related Art Various lasers (L
An optical element such as D) or a photodiode (PD) is used. FIG. 8 shows a schematic view of a conventional optical fiber and a device for connecting an optical element chip. In FIG. 8, 1 is an optical component including an optical element device, 2 is an optical element chip, 3 is a connection board, 9 is an optical fiber tape, 9A is an optical fiber core wire, and 1
Reference numeral 3 is an optical fiber mounting substrate.

In the conventional optical element chip connecting device, as shown in FIG. 8, the light emitting point or the light receiving point of the optical element chip 2 and the optical fiber core wire 9A of the optical fiber tape 9 are accurately aligned and fixed. Has been done. The manufacturing method is a single-core optical fiber or a plurality of optical-fiber core wires 9
A position where the optical fiber mounting board 13 formed by aligning and fixing A and the optical element chip 2 mounted on the connection board 3 are aligned in the biaxial directions (upper, lower, left, and right) by transmitting light to maximize coupling efficiency. It is manufactured by adhering and fixing with an adhesive or solder.

[0004]

SUMMARY OF THE INVENTION The present inventor has found the following problems as a result of studying the above conventional technology.

Since the optical element module of the conventional device for connecting an optical element chip is centered in two axial directions, the connection work is very troublesome and the operation becomes large.
There is a problem that the cost becomes high and it is not suitable for mass production.

An optical module for connecting with an optical component such as an optical waveguide module (Japanese Patent Application No. 7-58348) having a connection end having the same structure as the optical fiber connector has the same problem.

An object of the present invention is to provide an optical component (optical element device) which is capable of highly accurate coupling with an optical fiber connector without alignment.
Is to provide.

Another object of the present invention is to provide a technique capable of reducing the labor of connection work.

Another object of the present invention is to provide a technique capable of reducing the manufacturing cost.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[0011]

The outline of a typical invention among the inventions disclosed in the present application will be briefly described as follows.

(1) An upper surface having a connection board and an optical element chip, the connection board having a high flatness parallel to a plane passing through the central axes of two pin guide holes for connection or guide pins provided on both sides. And the optical element chip has a lower surface with high flatness, and is bonded to a position at which the light emitting point or the light receiving point of the optical element chip of the connection substrate is joined to the corresponding light receiving point or the light emitting point of the joined light portion. It is a fixed optical component.

(2) In the optical component of (1), the optical element chip is an array of a plurality of light emitting points or light receiving points arranged in the lateral direction, and is parallel to a straight line passing through the light emitting points or the light receiving points. It has a lower surface with high flatness.

(3) In the optical component according to (1) or (2), the optical element chip is a light emitting element with high heat generation,
A heat sink is fixed to the lower surface of the connection board.

(4) A connection board, an interposer board, and an optical element chip are provided, and the connection board has two guide holes or guide pins for connection on both sides, and the center axis of the guide hole or guide pin is The interposing substrate has a high-flatness upper surface having a groove portion in the center parallel to the passing plane, the intervening substrate has a high-flatness lower surface, and the optical element chip has a high-flatness upper surface. Is fixed to the lower surface of the optical component chip, and the interposing substrate is an optical component that is bonded and fixed to a position where the light emitting point or the light receiving point of the optical element chip of the connection substrate is joined to the corresponding light receiving point or the light emitting point of the optical component to be joined.

(5) In the optical component of (4), the optical element chip is an array in which a plurality of light emitting points or light receiving points are arranged side by side, and a straight line passing through the light emitting points or light receiving points of the optical element chip is formed. On the other hand, it has a parallel upper surface with high flatness.

(6) In the optical component of (4), the optical element chip is an optical element having a high heat generating property, and a heat sink is fixed to the upper surface of the interposing substrate.

According to the above-mentioned means (1), a connection board having two guide holes or guide pins is used as the board for installing the optical element chip, and it has an accurate positional relationship with the guide holes or the guide pin centers. One plane of the connection substrate is used as a reference plane, and one plane of the optical element chip having an accurate positional relationship with the emitting position or the light receiving position of the optical element chip is used as a reference plane. Is fixed by contact, so that the center of the guide hole or the guide pin of the connection board and the light emitting position or the light receiving position of the optical element chip have a fixed positional relationship via the reference surface of the connection board and the optical element chip. can do.

In the optical component of the above-mentioned (1), the above-mentioned (3) means is such that the above-mentioned optical element chip is an optical element of a heating element, and a heat absorber is provided on a surface other than the reference surface of the connection board. Since the heat sink is attached, the heat dissipation efficiency can be improved.

According to the above-mentioned means (4), the optical element chip having one plane (reference plane) which is in a precise positional relationship with the light emitting position or the light receiving position is accurately aligned with one plane (reference plane) of the substrate. Planes other than the above-mentioned planes having a positional relationship (second reference plane)
To the connection substrate having a reference surface of the connection substrate and the reference surface of the optical element chip is fixed in contact, further using an optical coupling member having a reference surface in a precise positional relationship between the guide hole and the center of the guide pin, Since the other reference surface of the substrate on which the optical element chip is fixed in contact and the reference surfaces of the optical coupling member are fixed in contact with each other, the guide hole or the guide pin center of the optical coupling member and the light emitting position of the optical element chip or The light receiving position can be made to have a fixed positional relationship via the reference planes.

That is, according to the optical component of the present invention, since the light emitting position or the light receiving position of the optical element chip and the center of the guide hole or the guide pin have an accurate positional relationship, the position of the core of the optical fiber as the connection partner is located. The optical fiber connector (existing part) having the same positional relationship with the center of the guide hole and the guide pin can be aligned without any alignment through the guide pin and can be collectively connected.

Further, the optical element device and the multi-fiber optical fiber connector can be separated and re-connected if necessary.

Further, by using the reference plane as the light emitting position or the light receiving position of the optical element chip and the position of the guide hole or the guide pin, the alignment in the uniaxial direction is eliminated and the alignment in the remaining uniaxial direction is performed. Since it can be performed, the labor of the connection work can be reduced. Thereby, the manufacturing cost can be reduced.

[0024]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will now be described in detail with reference to the drawings along with its embodiments (embodiments).

In all the drawings for explaining the embodiments, parts having the same function are designated by the same reference numerals, and the repeated description thereof will be omitted.

(Embodiment 1) FIG. 1 is a perspective view showing a schematic configuration of an optical component according to Embodiment 1 of the present invention.
FIG. 2 is a sectional view taken along the line AA ′ of FIG. 1 and 2, 1 is an optical component (for example, an optical element device), 2 is an optical element chip (for example, a semiconductor optical element chip), 3 is a connection substrate, 4 is a light emitting point or a light receiving point, and 5 is a pin guide. A hole, 6 is a reference surface which is an upper surface of the connection substrate 3 with high precision and flatness, 20 is an adhesive material for bonding the optical element chip 2 and the connection substrate 3, and 30A is a positioning marker.

As the optical element chip 2, for example, a semiconductor optical element chip is used. As the connection board 3, for example,
Metal (gold), silicon carbide, or silicon is used. As the adhesive material 20, a solder or epoxy adhesive material is used.

A pin guide hole 5 is provided at a predetermined distance from the end surface of the connection board 3. The upper surface of the connection board 3 is one plane (parallel to the plane passing through the center axis of the pin guide hole or the guide pin) in a precise positional relationship with the center of the pin guide hole 5, and this upper surface is the reference plane 6 I am trying. The distance from the reference plane 6 to the light emitting position or the light receiving position of the optical element chip 2 is constant (accurate positional relationship)
The optical element chip 2 is attached to the reference surface 6 of the connection substrate 3 with an adhesive 20 so that That is, the light emitting position or the light receiving position of the optical element chip 2 and the center of the pin guide hole 5 have a fixed positional relationship via the reference surface 6.

Next, a method for assembling and manufacturing the optical component 1 according to the first embodiment will be described.

As shown in FIGS. 1 and 2, the reference plane 6 is formed on the end surface of the connection substrate 3 made of metal, silicon carbide or the like having the reference plane 6 which is the upper surface of the highly accurate flatness.
From the above, the pin guide holes 5 are formed by machining or the like at positions having a predetermined height (accurate height relationship) and having desired intervals. A positioning marker 3 is provided on the upper surface having the reference surface 6 in advance so as to serve as a mark for the installation position of the optical element chip 2.
0A is provided.

By manufacturing the optical element chip 2 by a semiconductor manufacturing technique, the height from the lower surface of the optical element chip 2 to the light emitting point or the light receiving point 4 can be accurately controlled. Based on the position of the positioning marker 30A on the reference surface 6 of the connection board 3, the reference surface of the optical element chip 2 is attached in contact. After that, the optical element chip 2 is adhesively fixed to the contact side surface of the optical element chip 2 with the adhesive 20. In the optical component 1 thus manufactured, the light emitting point or the light receiving point 4 of the optical element chip 2 and the pin guide hole 5 have an accurate positional relationship.

The positions of the pin guide hole 5 of the optical component 1 and the light emitting point or the light receiving point 4 of the optical element chip 2 are accurately measured, and a metal mold is produced so as to have the above-mentioned positional relationship in the connector ferrule production. A plastic optical fiber connector ferrule having an optical fiber guide hole and an optical fiber hole so as to have the above-mentioned positional relationship is manufactured by a transfer mold which is a conventional MT connector manufacturing technique. An ordinary optical fiber is inserted into the optical fiber guide hole of the ferrule, and after the connection is solidified, the end face is polished to produce an optical fiber connector plug.

FIG. 3 is a perspective view for explaining the connection mechanism between the optical component and the optical fiber according to the first embodiment. 9 is an optical fiber tape, 10 is an optical fiber connector plug, 11 is a guide pin, and 12 is an optical fiber. Fiber connector (existing part).

As shown in FIG. 3, the optical component 1 and the optical fiber of the first embodiment are connected by an optical fiber connector in which an optical fiber tape 9 is attached to an optical fiber connector plug 10 having a pin guide hole 5. (Existing parts) 12
Then, the optical component 1 of the first embodiment is connected via the guide pin 11.

The optical component 1 and the optical fiber connector plug 10 produced by the above method have the same positional relationship between the pin guide hole 5 and the light emitting point or the light receiving point 4, and the guide hole of the optical fiber connector ferrule and the optical fiber. Therefore, the optical component 1 and the optical fiber connector plug 10 are aligned via the guide pin 11 with the light emitting point or the light receiving point 4 and the optical fiber in the optical fiber tape 9, and are collectively connected without alignment.

After the connection, it is held by a clamp spring used in the MT connector or the like. Further, if necessary, the optical component 1 and the optical fiber connector 12 can be separated and reconnected.

In the first embodiment, the pin guide hole 5
Although the example of the connection board 3 provided with is shown,
Similarly, in the case of an optical component (optical element device) in which the guide pin 11 is previously attached to the connection board 3 instead of the pin guide hole 5, the light emitting position or the light receiving position of the optical element chip 2 and the optical fiber tape 9 are omitted. Connected in a batch with alignment.

An embodiment of an optical component having a structure other than the optical component (optical element device) of the first embodiment will be described in the following second embodiment.
To Embodiment 6. In the optical components of those embodiments, the light emitting position or the light receiving position of the optical component and the guide hole or the center of the guide pin are in an accurate positional relationship similarly to the optical component of the first embodiment. The optical fiber of the optical connector is connected at a position without any alignment using a pin guide hole and a guide pin. The description of each embodiment below is
Only points different from the first embodiment will be described.

(Embodiment 2) An optical component (optical element device) of the present embodiment (Example 2) is the same as the optical component 1 of Embodiment 1 except that the optical element chip 2 has a plurality of light emitting points or light receiving points 4. The optical component 1 according to the first embodiment is an array arranged in the lateral direction.
It is manufactured by the same manufacturing method as. In this case, the optical fiber connector plug 10 on the other end of the connection also employs an optical fiber array plug composed of a plurality of optical fibers instead of a single core.

(Third Embodiment) FIG. 4 is a perspective view showing a schematic configuration of an optical component according to a third embodiment of the present invention.
7 is a heat sink composed of a heat absorber.

The optical component (optical element device) 1 of the third embodiment (example) is the same as the optical component 1 of the first embodiment.
In the case where the optical element chip 2 is a light emitting element having a high heat generation property, as shown in FIG. 4, a heat sink made of, for example, brass is formed on the lower surface of the connection substrate 3 of the optical component manufactured by the same method as in the first embodiment. Adhesively fix 7

In this case, accurate position adjustment is not necessary,
It suffices that the connection board 3 and the heat sink 7 come into contact with each other so that heat can be propagated.

With this structure, even if the optical element chip 2 is a heating element, the heat sink 7, which is a heat absorbing element, is attached to a surface other than the reference surface of the connection board 3, so that the heat radiation efficiency is improved. Can be improved.

(Embodiment 4) FIG. 5 is a perspective view showing a schematic structure of an embodiment (Example) 4 of the optical component of the present invention, and FIG. 6 is a sectional view taken along line BB 'in FIG. Is. 5 and 6, 3A is an interposer substrate made of metal, 6A is a reference plane parallel to a plane passing through the center axis of the pin guide hole 5 or guide pin 11 of the interposer substrate 3A, 8 is a connection substrate made of plastic, and 3B. Is a groove, 30A is a positioning marker for the optical element chip 2, and 30B is a positioning marker for the intervening substrate 3A.

As shown in FIGS. 5 and 6, the optical component (optical element device) of the present embodiment (example) 4 has a connection substrate 8
And an interposer substrate 3A and an optical element chip 2. The connection board 8 is made of plastic and has two connecting pin guide holes 5 or guide pins 11 on both sides.
A groove 3B parallel to a plane passing through the central axis of the pin guide hole 5 or the guide pin 11 is provided in the central portion. The upper surface of the connection board 8 is a highly flat surface.

The intervening substrate 3A is made of a metal plate having an upper surface (reference surface) 6A having high flatness. The optical element chip 2 has an upper surface with high flatness, and the interposing substrate 3A
Is fixed to the upper surface 6A (the optical element chip 2 is mounted on the upper surface side of the intervening substrate 3A), and the interposing substrate 3A has a light emitting point or a light receiving point of the optical element chip 2 of the plastic connection substrate 8 to be bonded light. The parts are bonded and fixed to the corresponding light receiving points or light emitting points of the component (the intervening substrate 3A is mounted with the upper surface facing downward and is bonded and fixed to the plastic connection substrate 8).

Next, a method of assembling and manufacturing the optical component 1 according to the fourth embodiment will be described.

As shown in FIG. 5, the optical element chip 2 is previously formed on the upper surface of the interposing substrate 3A made of metal, silicon carbide or the like having the reference surface 6 which is the highly accurate flat surface.
Positioning marker 30A so that it can be used as a marker for the installation position of
Is provided. First, the reference surface of the semiconductor chip 2 is attached in contact with the reference surface 6A, which is the upper surface of the interposer substrate 3A, based on the position of the positioning marker 30A.
The optical element chip 2 is adhesively fixed to the contact side surface of the optical element chip 2 or the upper surface of the interposer substrate 3A with a solder or epoxy adhesive 20.

Next, the connection board 8 made of plastic is manufactured by transfer molding which is a conventional MT connector manufacturing technique. This plastic connection board 8
Has two pin guide holes 5 for connection on both sides, and the mold is manufactured so as to have a high flatness upper surface with a groove 3B in the center parallel to the central axis of the pin guide holes 5. Plastic molding.

Further, the interposing substrate 3 with the above-mentioned optical element chip 2 is previously formed on the upper surface of the groove portion 3B having high precision flatness.
Positioning marker 30B for interposing substrate 3A is provided so as to serve as a mark for the installation position of A. After that, the reference surface 6 of the interposer substrate 3A is attached in contact with the upper surface of the groove portion 3B of the connection substrate 8 based on the position of the positioning marker 30B, and adhered to the side surface of the interposer substrate 3A and the upper surface of the groove portion 3B of the connection substrate 8. Material 2
Adhere and fix with 0 or the like.

In the fourth embodiment, the height from the lower surface of the optical element chip 2 to the light emitting point or the light receiving point 4 and the height from the central axis of the pin guide hole 5 of the connection substrate 8 to the upper surface of the groove 3B are adjusted. Thus, the position of the pin guide hole 5 and the position up to the light emitting point or the light receiving point 4 can be formed on a straight line. Since the contact with the light receiving point or the light emitting point of the connected component is stable by this method, it is suitable for the purpose of minimizing the connection loss.

(Fifth Embodiment) An optical component (optical element device) of the fifth embodiment (Example) is the same as the optical component of the fourth embodiment except that the optical element chip 2 has a plurality of light emitting points or light receiving points in the lateral direction. The optical element chip 2 is manufactured by the same manufacturing method as that of the optical component 1 according to the first embodiment, in which the optical element chip 2 is manufactured so that the straight line passing through the light emitting point or the light receiving point is parallel to the lower surface of the chip. In this case, the optical fiber connector plug 10 on the other end of the connection also employs an optical fiber array plug composed of a plurality of optical fibers instead of a single core.

(Sixth Embodiment) FIG. 7 is a perspective view showing a schematic configuration of an optical component according to a sixth embodiment of the present invention.
7 is a heat sink composed of a heat absorber. The optical component (optical element device) of the sixth embodiment (example) is the case where the optical element chip 2 is a light emitting element having a high heat generating property in the fourth or fifth embodiment, and as shown in FIG. A heat sink 7 made of brass or the like is adhered and fixed to the lower surface of the interposer substrate 3A of the optical component manufactured by the same method as in the fourth embodiment.

In this case, accurate position adjustment is not necessary,
It suffices that the intervening substrate 3A and the heat sink 7 come into contact with each other to propagate heat.

With this structure, even if the optical element chip 2 is a heating element, since the heat sink 7 which is a heat absorbing element is attached to the surface other than the reference surface of the interposing substrate 3A, the heat radiation efficiency is improved. Can be improved.

As described above, the present invention is carried out in the above-mentioned embodiment (example).
Although the present invention has been specifically described based on the above, the present invention is not limited to the above-described embodiments (examples), and it goes without saying that various modifications can be made without departing from the scope of the invention.

[0057]

The outline of the representative ones of the inventions disclosed in the present application will be briefly described as follows.

(1) Since the light emitting position or the light receiving position of the optical element chip and the pin guide hole or the central axis of the guide pin have an accurate positional relationship, the position of the core of the optical fiber as the connection partner and the pin guide hole are Optical fiber connectors (existing parts) whose central axes have the same positional relationship can be aligned with each other through guide pins without any alignment, and they can be collectively connected.
As a result, it is possible to reduce the labor of connection work.

That is, it is possible to obtain an optical component (optical element device) which can be coupled to the optical fiber connector without alignment and with high precision.

(2) It is also possible to separate and reconnect the optical component (optical element device) and the multi-fiber optical fiber connector as needed.

(3) By using the reference plane for the light emitting position or the light receiving position of the optical element chip and the position of the pin guide hole or the guide pin, alignment in the uniaxial direction is eliminated,
The alignment can be performed in the remaining one axis direction.

(4) With these, the manufacturing cost can be reduced.

[Brief description of drawings]

FIG. 1 is a perspective view showing a schematic configuration of an optical component of an embodiment (example) 1 of the present invention.

FIG. 2 is a cross-sectional view taken along line A-A 'of FIG.

FIG. 3 is a perspective view for explaining a connection mechanism between the optical component and the optical fiber according to the first embodiment.

FIG. 4 is a perspective view showing a schematic configuration of an optical component of embodiment (example) 3 of the present invention.

FIG. 5 is a perspective view showing a schematic configuration of an optical component according to Embodiment (Example) 4 of the present invention.

6 is a cross-sectional view taken along the line B-B 'of FIG.

FIG. 7 is a perspective view showing a schematic configuration of an optical component according to Embodiment (Example) 6 of the present invention.

FIG. 8 is a perspective view showing a conventional connecting device between an optical fiber and an optical element chip.

[Explanation of symbols]

1 ... Optical component (optical element device), 2 ... Optical element chip, 3
... connection board, 3A ... intervening board, 3B ... groove part, 4 ... light emitting point or light receiving point, 5 ... pin guide hole, 6 ... reference plane on connection board, 6A ... reference plane on intervening board, 7 ... heat sink, 8
… Plastic connection board, 9… Optical fiber tape, 1
0 ... Optical fiber connector plug, 11 ... Guide pin, 1
2 ... Optical fiber connector, 13 ... Optical fiber mounting substrate, 20 ... Adhesive material, 30A ... Optical element chip positioning marker, 30B ... Interposed substrate positioning marker.

Claims (6)

[Claims] 1. A connection board and an optical element chip are provided, and the connection board has an upper surface with high flatness parallel to a plane passing through the central axes of two connecting pin guide holes or guide pins provided on both sides. The optical element chip has a lower surface having a high degree of flatness, and is bonded and fixed at a position where the light emitting point or the light receiving point of the optical element chip of the connection substrate is joined to the corresponding light receiving point or the light emitting point of the light receiving portion. An optical component characterized by being manufactured. 2. The optical element chip is an array in which a plurality of light emitting points or light receiving points are arranged in a lateral direction, and has a lower surface having a high flatness parallel to a straight line passing through the light emitting points or the light receiving points. The optical component according to claim 1, wherein 3. The optical component according to claim 1 or 2, wherein the optical element chip is a light emitting element having a high heat generation property, and a heat sink is fixed to the lower surface of the connection substrate. 4. A connection board, an interposer board, and an optical element chip, wherein the connection board has two connecting guide holes or guide pins on both sides, and passes through the central axis of the guide holes or guide pins. The upper surface having a high flatness having a groove portion in the center parallel to the flat surface, the intervening substrate has a lower surface having a high flatness,
The optical element chip has an upper surface with high flatness and is fixed to the lower surface of the interposer substrate. The interposer substrate has a light emitting point or a light receiving point of the optical element chip of the connection board which corresponds to a light receiving point of the optical component to be joined. Alternatively, an optical component is characterized in that it is adhesively fixed at a position where it joins with a light emitting point. 5. The optical element chip is an array in which a plurality of light emitting points or light receiving points are arranged in the lateral direction, and an upper surface having high flatness parallel to a straight line passing through the light emitting points or light receiving points of the optical element chip is provided. The optical component according to claim 4, which has. 6. The optical component according to claim 4, wherein the optical element chip is a highly heat-generating optical element, and a heat sink is fixed to the upper surface of the interposer substrate.