JPH09222309A - Method and device for selecting shape of of uneven shape - Google Patents
Method and device for selecting shape of of uneven shapeInfo
- Publication number
- JPH09222309A JPH09222309A JP5684096A JP5684096A JPH09222309A JP H09222309 A JPH09222309 A JP H09222309A JP 5684096 A JP5684096 A JP 5684096A JP 5684096 A JP5684096 A JP 5684096A JP H09222309 A JPH09222309 A JP H09222309A
- Authority
- JP
- Japan
- Prior art keywords
- scattered light
- shape
- uneven
- size
- measuring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、検査対象物上にあ
る凹凸状物を光学的に測定する凹凸状物形状測定方法お
よび装置に関し、とくに、異物や意図的な注入物が検査
対象物に埋め込まれた際にできるような凸状欠陥等の凹
凸状物を、大きさとともにその高さを精度よく測定する
ことが可能な凹凸状物形状測定方法および装置に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an uneven object shape measuring method and apparatus for optically measuring an uneven object on an object to be inspected. The present invention relates to a concavo-convex object shape measuring method and apparatus capable of accurately measuring the size and height of a concavo-convex object such as a convex defect when embedded.
【０００２】[0002]
【従来の技術】検査対象物の凹凸状物測定においては、
凹凸状物の平面的な大きさもさることながら、凹凸状物
の高さを精度よく測定することが望まれる場合が多い。
例えば液晶基板においては、カラーフィルタと基板は微
小間隔をもって対向配置されるため、凸状（突起状）欠
陥は、電極間のショート等につながるおそれがあり、あ
る高さ以上の凹凸状物の検出は極めて重要な検査項目と
なる。2. Description of the Related Art In measuring unevenness of an inspection object,
In many cases, it is desired to accurately measure the height of the uneven material as well as the planar size of the uneven material.
For example, in a liquid crystal substrate, since the color filter and the substrate are arranged to face each other with a minute gap, a convex (projection) defect may lead to a short circuit between electrodes or the like. Is an extremely important inspection item.
【０００３】凹凸状物を検出、測定する方法として、光
学的な手法が各種知られており、代表的な手法として次
のＡ、Ｂが知られている。Various optical methods are known as methods for detecting and measuring irregularities, and the following methods A and B are known as typical methods.
【０００４】〈手法Ａ〉図１に示すように、凹凸状物２
を有する検査対象物１に光を照射し、検査対象物１から
の散乱光を、たとえば集光レンズ３を通して単一の受光
面４を有するカメラ５で測定する。測定される散乱光の
強度は、例えば図２に示すような分布をもち、予め定め
られたあるスライスレベル６以上の受光光量（散乱光強
度）を示す部分が凹凸状物として測定される。この手法
では、凹凸状物の大きさは、散乱光強度と凹凸状物の大
きさがある比例関係にあるとして、スライスレベルを超
えた部分の総散乱光強度で判定するしかない。<Method A> As shown in FIG.
The inspection object 1 having the above is irradiated with light, and the scattered light from the inspection object 1 is measured by the camera 5 having the single light receiving surface 4 through the condenser lens 3, for example. The intensity of scattered light to be measured has a distribution as shown in FIG. 2, for example, and a portion showing a received light amount (scattered light intensity) at a predetermined slice level 6 or higher is measured as an uneven material. In this method, the size of the uneven material is determined by the total scattered light intensity of the portion exceeding the slice level, assuming that the scattered light intensity and the size of the uneven material have a proportional relationship.
【０００５】〈手法Ｂ〉図３に示すように、アレイ状に
複数の画素をもつ受光面７を有するカメラ８で散乱光を
測定する手法である。この手法では、図４に示すよう
に、あるスライスレベル９以上の受光光量で凹凸状物を
測定し、その部分の画素数で凹凸状物の大きさ（凹凸状
物サイズ）を判定できる。<Method B> As shown in FIG. 3, this is a method of measuring scattered light with a camera 8 having a light receiving surface 7 having a plurality of pixels in an array. With this method, as shown in FIG. 4, the unevenness is measured with a received light amount of a certain slice level 9 or higher, and the size of the unevenness (size of the unevenness) can be determined by the number of pixels in that portion.
【０００６】[0006]
【発明が解決しようとする課題】ところが、上記のよう
な従来の凹凸状物測定方法には、以下のような問題があ
る。図５の（ａ）、（ｂ）に示すように、同じ高さの凹
凸状物１１、１２（図示例では凸状欠陥）であっても、
凹凸状物１１、１２の大きさに比べて照射光の照射面積
が大きい場合には、凹凸状物の大きさ（とくに平面的な
大きさ）、形状が異なると総散乱光量は異なる。逆に、
図６の（ａ）、（ｂ）に示すように、凹凸状物１３、１
４（図示例では凸状欠陥）の高さが異なっても総散乱光
量は等しくなることもある。したがって、スライスレベ
ルを超えた部分の総散乱光量（強度）で凹凸状物の大き
さを測定する前記手法Ａでは、凹凸状物の高さを判定す
ることはできない。また、前記手法Ｂにおいても、凹凸
状物の底面積あるいは底面形状は測定することができて
も、やはり高さを判定することはできない。However, the conventional method for measuring unevenness as described above has the following problems. As shown in FIGS. 5 (a) and 5 (b), even the concavo-convex objects 11 and 12 (convex defects in the illustrated example) having the same height,
When the irradiation area of the irradiation light is larger than the size of the uneven objects 11 and 12, the total scattered light amount differs depending on the size (particularly the planar size) and shape of the uneven object. vice versa,
As shown in (a) and (b) of FIG.
Even if the heights of 4 (convex defects in the illustrated example) are different, the total amount of scattered light may be the same. Therefore, it is not possible to determine the height of the unevenness by the above-mentioned method A in which the size of the unevenness is measured by the total scattered light amount (intensity) of the portion exceeding the slice level. Further, also in the method B, even if the bottom area or bottom shape of the uneven material can be measured, the height cannot be determined.
【０００７】そこで本発明の課題は、上記のような事情
に鑑み、基本的には前記手法Ｂを前提として、検査対象
物からの散乱光により凹凸状物を測定するに際し、凹凸
状物の平面的な大きさのみならずその高さについても精
度よく測定できるようにすることにある。In view of the above-mentioned circumstances, the object of the present invention is to basically measure the uneven surface of the uneven material by measuring the uneven material by the scattered light from the inspection object, based on the method B. The objective is to be able to accurately measure not only the size but also its height.
【０００８】[0008]
【課題を解決するための手段】上記課題を解決するため
に、本発明の凹凸状物検出方法は、検査対象物上に該検
査対象物の基準面に対し凸および／または凹状に形成さ
れた凹凸状物を光学的に測定する凹凸状物形状測定方法
であって、前記検査対象物に光を照射し、該検査対象物
からの散乱光を受光して該散乱光の強度分布を二次元的
に検出し、該散乱光の強度分布が予め定められた散乱光
強度のスライスレベルを超えるときに形成される閉ルー
プの形状から凹凸状物の底面の大きさを測定するととも
に、該閉ループ内における散乱光強度の積分値から凹凸
状物の体積または側面の大きさを測定することを特徴と
する方法からなる。In order to solve the above-mentioned problems, the uneven object detecting method of the present invention is formed on the inspection object in a convex and / or concave shape with respect to the reference surface of the inspection object. An uneven object shape measuring method for optically measuring an uneven object, comprising irradiating light to the inspection object, receiving scattered light from the inspection object, and receiving a two-dimensional intensity distribution of the scattered light. Detected, the intensity distribution of the scattered light to measure the size of the bottom surface of the uneven article from the shape of the closed loop formed when the slice level of the scattered light intensity is predetermined, in the closed loop The method is characterized by measuring the volume or the size of the side surface of an uneven material from the integrated value of the scattered light intensity.
【０００９】上記方法においては、凹凸状物の形状を円
錐等の立体と仮定し、前記凹凸状物の底面の大きさを前
記立体の底面積に相当する値とするとともに、前記凹凸
状物の体積を前記立体の体積に相当する値、もしくは、
側面の大きさを前記立体の側面積に相当する値とし、両
値から前記立体の高さを算出して凹凸状物の高さとする
ことができる。In the above method, the shape of the uneven object is assumed to be a solid such as a cone, the size of the bottom surface of the uneven object is set to a value corresponding to the bottom area of the solid object, and the uneven object is A value corresponding to the volume of the solid, or
The size of the side surface may be a value corresponding to the side area of the solid body, and the height of the solid body may be calculated from the two values to obtain the height of the uneven material.
【００１０】また、本発明に係る凹凸状物検出装置は、
検査対象物に光を照射する照光手段と、該検査対象物か
らの散乱光を最終的に二次元の散乱光強度分布の形で受
光可能な受光手段とを備え、検査対象物上に該検査対象
物の基準面に対し凸および／または凹状に形成された凹
凸状物を光学的に測定する凹凸状物形状測定装置であっ
て、前記散乱光強度分布が予め定められた散乱光強度の
スライスレベルを超えるときに形成される閉ループの形
状を測定する手段と、該閉ループ内における散乱光強度
の積分値を演算する手段とを備えたことを特徴とするも
のからなる。The uneven object detecting device according to the present invention is
The inspection means is provided with an illuminating means for irradiating the inspection object with light and a light receiving means capable of finally receiving scattered light from the inspection object in the form of a two-dimensional scattered light intensity distribution. A concave-convex object shape measuring device for optically measuring an uneven object formed in a convex and / or concave shape with respect to a reference surface of an object, wherein the scattered light intensity distribution is a slice of a predetermined scattered light intensity. And a means for measuring the shape of the closed loop formed when the level is exceeded, and a means for calculating the integrated value of the scattered light intensity in the closed loop.
【００１１】上記装置においては、前記閉ループ形状測
定手段からの情報と、前記散乱光強度積分値演算手段か
らの情報から、凹凸状物の形状を円錐等の立体と仮定し
た際の該凹凸状物の高さを算出する手段を備えることに
より、前述の方法により凹凸状物の高さについても測定
できる。In the above-mentioned apparatus, when the shape of the uneven object is assumed to be a solid such as a cone based on the information from the closed loop shape measuring means and the information from the scattered light intensity integral value calculating means, the uneven object is obtained. By providing a means for calculating the height of the unevenness, the height of the uneven material can be measured by the method described above.
【００１２】上記受光手段は、検査対象物からの散乱光
を二次元的に受光するセンサを備えたものとすることも
でき、ラインセンサ等の一次元センサでも構成可能であ
る。例えば、前記受光手段が、検査対象物から散乱光を
受光するラインセンサを備えたカメラと、該カメラと検
査対象物とを所定方向に相対移動させる相対移動手段と
を有しているものとすることができる。The light receiving means may be provided with a sensor for receiving the scattered light from the inspection object in a two-dimensional manner, and may be constituted by a one-dimensional sensor such as a line sensor. For example, it is assumed that the light receiving unit has a camera including a line sensor that receives scattered light from the inspection target and a relative movement unit that relatively moves the camera and the inspection target in a predetermined direction. be able to.
【００１３】以下に、本発明に係る凹凸状物形状測定方
法の測定原理を、図面を参照して説明する。本発明は、
前述したように、基本的には前述の手法Ｂを前提とす
る。図７に示すように、検査対象物からの散乱光の強度
の分布において、予め設定した散乱光強度のスライスレ
ベル２１を超える部分について、その画素数をサイズ、
散乱光強度の積分値である総散乱光量をパワーと呼ぶこ
とにする。The measuring principle of the uneven object shape measuring method according to the present invention will be described below with reference to the drawings. The present invention
As described above, the above method B is basically premised. As shown in FIG. 7, in the distribution of the intensity of scattered light from the inspection object, the number of pixels of a portion of the intensity of scattered light that exceeds the slice level 21 is set to the size,
The total amount of scattered light, which is the integrated value of scattered light intensity, is called power.
【００１４】本発明は、凹凸状物からの散乱光量が凹凸
状物の高さと相関があることを利用し、パワーおよびサ
イズから高さを算出する手法である。すなわち、上記総
散乱光量（パワー）は、例えば凸状に突出した欠陥の体
積あるいは側面積と相関があり、体積あるいは側面積が
大きい程パワーも大きくなる。また、上記サイズは、凹
凸状物の底面積と相関があり、サイズが大きい程底面積
も大きい。さらに、凹凸状物を立体に近似すると、上記
体積あるいは側面積は底面積と高さの関数であるから、
底面積に相当する値と体積あるいは側面積に相当する値
が求まれば、高さを算出できることになる。The present invention is a method of calculating the height from the power and size by utilizing the fact that the amount of scattered light from the uneven material correlates with the height of the uneven material. That is, the total scattered light amount (power) has a correlation with, for example, the volume or side area of a defect protruding in a convex shape, and the larger the volume or side area, the larger the power. Further, the above size has a correlation with the bottom area of the uneven material, and the larger the size, the larger the bottom area. Furthermore, when the uneven object is approximated to a solid, the above-mentioned volume or side area is a function of the bottom area and the height,
If the value corresponding to the bottom area and the value corresponding to the volume or the side area are obtained, the height can be calculated.
【００１５】例えば、図８に示すように凹凸状物を円錐
モデル２２に近似し、上記サイズから得られる凹凸状物
の底面形状をそれと同一面積をもつ円に補完し、上記パ
ワーと相関する凹凸状物の体積を円錐の体積、あるいは
上記パワーと相関する表面積を円錐の側面積に補完する
と、その円錐モデル２２の高さを算出でき、それを凹凸
状物の高さとすることができる。For example, as shown in FIG. 8, the unevenness is approximated to a conical model 22, and the bottom shape of the unevenness obtained from the above size is complemented by a circle having the same area as that of the unevenness to correlate with the power. By supplementing the volume of the conical material with the volume of the conical material or the surface area of the conical material with the side surface area of the conical material, the height of the conical model 22 can be calculated and used as the height of the concavo-convex material.
【００１６】上記円錐モデルとパワーおよびサイズとの
関係は次式のような関係がある。 （パワー）＝ｆ（体積） ・・・（１） ＝ｇ（側面積） ・・・（２） （サイズ）＝ｈ（底面積） ・・・（３） ｆ、ｇ、ｈは（ ）内を変数とした関数である。例え
ば、パワーが体積と比例関係にあり、かつ、サイズが底
面積と比例関係にある場合は、 （パワー）＝ａ×（体積）＝ａπｒ2 ｈ ・・・（４） （サイズ）＝ｂ×（底面積）＝ｂπｒ2 ・・・（５） と表すことができ、（パワー）÷（サイズ）により底面
の円の半径ｒが消去されて、高さｈを求めることができ
る。ここで、ａ、ｂは検査基準により定まる定数であ
る。また、パワーが側面積と比例関係にある場合には、 （パワー）＝ｃ×（側面積）＝ｃ・πｒ（ｒ2 ＋ｈ2 ）1/2 ・・・（６） と表すことができ、（５）、（６）式から底面の円の半
径ｒを消去して、高さｈを求めることができる。ここ
で、ｃは検査基準により定まる定数である。なお、ｆ、
ｇ、ｈの関数は、ここで例示したような比例関係（原点
を通る一次式）に限らず、一般的な一次式、高次式、指
数関数、対数関数、その他の関数となる可能性もある。The relationship between the conical model and the power and size is as follows. (Power) = f (volume) ... (1) = g (side area) ... (2) (size) = h (bottom area) ... (3) f, g, and h are in () Is a function with a variable. For example, when power is proportional to volume and size is proportional to bottom area, (power) = a × (volume) = aπr 2 h (4) (size) = b × It can be expressed as (bottom area) = bπr 2 (5), and the radius r of the bottom circle is erased by (power) ÷ (size), and the height h can be obtained. Here, a and b are constants determined by the inspection standard. When the power is proportional to the side area, (power) = c × (side area) = c · πr (r 2 + h 2 ) 1/2 (6) The height h can be obtained by eliminating the radius r of the circle on the bottom surface from the equations (5) and (6). Here, c is a constant determined by the inspection standard. Note that f,
The functions of g and h are not limited to the proportional relationships (linear expressions passing through the origin) as illustrated here, but may be general linear expressions, higher-order expressions, exponential functions, logarithmic functions, and other functions. is there.
【００１７】立体モデルとしては、上記円錐モデルに限
らず、四角錐モデル、円柱モデル、四角柱モデル、円錐
台モデル、四角錐台モデル等も適用可能である。検査対
象物や頻度の高い欠陥（凹凸状物）の形状に応じてモデ
ル形状を決定すればよい。The three-dimensional model is not limited to the above-mentioned conical model, but a quadrangular pyramid model, a cylindrical model, a quadrangular prism model, a truncated cone model, a quadrangular truncated pyramid model and the like can be applied. The model shape may be determined according to the shape of the inspection object or the defect (concavo-convex object) having a high frequency.
【００１８】また、上記説明は、検査対象物の基準面か
ら凸状に突出した欠陥について行ったが、凹状にへこん
だ欠陥に対しても、その部分で総散乱光が増加すること
から本発明方法が同様に適用可能である。この場合、凹
凸状物の深さを測定することになる。Further, although the above description has been made with respect to a defect protruding in a convex shape from the reference surface of the object to be inspected, the present invention is also applicable to a defect dented in a concave shape because the total scattered light increases at that portion. The method is applicable as well. In this case, the depth of the uneven material is measured.
【００１９】[0019]
【発明の実施の形態】以下に、本発明の実施の形態につ
いて、図面を参照して説明する。図９は、本発明の一実
施態様に係る凹凸状物形状測定装置の概略構成を、図１
０は、図９のカメラで検査対象物からの散乱光を検出す
る様子を平面的に示したものである。Embodiments of the present invention will be described below with reference to the drawings. FIG. 9 shows a schematic configuration of an uneven object shape measuring apparatus according to one embodiment of the present invention.
0 is a plane view showing how the camera of FIG. 9 detects scattered light from the inspection object.
【００２０】図９において、検査対象物としての基板３
１上には、異物３２が埋めこまれて、基板３１の基準面
３１ａに対し上方に凸状に突出した突起欠陥３３（凹凸
状物）が形成されている。基板３１の上方（本実施態様
では斜め上方）には、基板３１に向けて光（例えばレー
ザ光）を照射する照光手段３４が設けられており、基板
３１からの散乱光が上方に設けられたカメラ３５で撮像
される。カメラ３５は、本実施態様ではラインセンサ３
６を有しており、図１０に示したようにラインセンサ３
６における各画素にて凹凸状物３３からの散乱光の強度
が測定される。In FIG. 9, a substrate 3 as an inspection object
A foreign matter 32 is embedded on the surface 1 and a protrusion defect 33 (an uneven material) is formed so as to protrude upward with respect to the reference surface 31 a of the substrate 31. Above the substrate 31 (obliquely above in this embodiment), an illuminating means 34 for irradiating the substrate 31 with light (for example, laser light) is provided, and scattered light from the substrate 31 is provided above. The image is taken by the camera 35. The camera 35 is the line sensor 3 in this embodiment.
6 and has the line sensor 3 as shown in FIG.
The intensity of the scattered light from the uneven material 33 is measured at each pixel in 6.
【００２１】基板３１は、ラインセンサ３６の走査方向
Ｙと直交する方向Ｘに、カメラ３５に対して相対移動さ
れる。基板３１は移動テーブル３７上に装着固定され、
テーブル３７がスクリュ３８を介してモータ３９によっ
てＸ方向に移動される。基板３１側ではなくカメラ３５
側を移動するようにしてもよい。The substrate 31 is moved relative to the camera 35 in a direction X orthogonal to the scanning direction Y of the line sensor 36. The substrate 31 is mounted and fixed on the moving table 37,
The table 37 is moved in the X direction by the motor 39 via the screw 38. The camera 35 instead of the substrate 31 side
The side may be moved.
【００２２】また、ラインセンサ等の一次元センサでは
なく、二次元センサを配し、図示したような相対移動機
構をなくすことも可能である。It is also possible to dispose a two-dimensional sensor instead of a one-dimensional sensor such as a line sensor and eliminate the relative movement mechanism as shown in the figure.
【００２３】図９の装置で測定した、ある瞬間における
凹凸状物測定状態は、例えば図１１に示すようになる。
すなわち、ラインセンサ３６によって基板３１からの散
乱光の強度の分布が測定され、予め定められた散乱光強
度のスライスレベル４０を超える領域が欠陥（凹凸状
物）として認識、検出される。この領域４１は、基板３
１とカメラ３５との相対移動によって、図１２に示すよ
うな、時間的に積算した状態の閉ループの領域４２とし
て測定される。FIG. 11 shows, for example, the state of measuring irregularities at a certain moment measured by the apparatus of FIG.
That is, the distribution of the intensity of scattered light from the substrate 31 is measured by the line sensor 36, and a region having a predetermined scattered light intensity exceeding the slice level 40 is recognized and detected as a defect (uneven object). This area 41 is the substrate 3
By the relative movement between the camera 1 and the camera 35, it is measured as a closed-loop region 42 in a time-integrated state as shown in FIG.
【００２４】この領域４２における、上記スライスレベ
レル４０を超えた総画素数が前述のサイズ値となり、そ
の領域４２の総受光光量、つまり散乱光強度の積分値が
前述のパワー値となる。そして、図１２に示した領域４
２の形状から、突起欠陥３３（凹凸状物）の平面形状を
認識でき総画素数から平面的な大きさを把握できる。The total number of pixels in the area 42 exceeding the slice level 40 is the size value described above, and the total received light amount of the area 42, that is, the integrated value of the scattered light intensity is the power value described above. Then, the area 4 shown in FIG.
From the shape of No. 2, the planar shape of the protrusion defect 33 (uneven object) can be recognized and the planar size can be grasped from the total number of pixels.
【００２５】また、前述の測定原理によって、演算処理
装置５０により、上記サイズ値を凹凸状物の立体モデル
の底面積相関成分とし、上記パワー値を該立体モデルの
体積相関成分あるいは側面積相関成分として、欠陥３３
（凹凸状物）の高さが算出される。According to the above-described measurement principle, the arithmetic processing unit 50 uses the size value as the bottom area correlation component of the three-dimensional model of the uneven body, and the power value as the volume correlation component or side area correlation component of the three-dimensional model. As a defect 33
The height of the (uneven object) is calculated.
【００２６】[0026]
【発明の効果】以上説明したように、本発明の凹凸状物
形状測定方法および装置によれば、検査対象物からの散
乱光により凹凸状物の大きさを光学的に測定するに際
し、凹凸状物の平面的な大きさのみならずその高さにつ
いても精度よく検出できるようになる。したがって、液
晶表示装置用のカラーフィルタ等、凹凸状物の高さを非
接触状態で精度よく検出、測定することが要求されるも
のの検査工程に用いて最適な方法および装置を提供でき
る。As described above, according to the uneven object shape measuring method and apparatus of the present invention, the uneven shape is optically measured when the size of the uneven object is optically measured by the scattered light from the inspection object. It becomes possible to accurately detect not only the planar size of an object but also its height. Therefore, it is possible to provide the optimum method and apparatus for use in the inspection process of those that require accurate detection and measurement of the height of the uneven object such as a color filter for a liquid crystal display device in a non-contact state.
【図１】従来の光学的凹凸状物測定方法を示す説明図で
ある。FIG. 1 is an explanatory diagram showing a conventional optical unevenness measuring method.
【図２】図１の方法における散乱光強度と位置との平面
図である。FIG. 2 is a plan view of scattered light intensity and position in the method of FIG.
【図３】従来の別の光学的凹凸状物測定方法を示す説明
図である。FIG. 3 is an explanatory diagram showing another conventional method for measuring an optical uneven material.
【図４】図３の方法における散乱光強度と画素との関係
図である。FIG. 4 is a relationship diagram between scattered light intensity and pixels in the method of FIG.
【図５】同じ高さで異なる散乱光量の凹凸状物の概略側
面図である。FIG. 5 is a schematic side view of an uneven material having the same height and different scattered light amounts.
【図６】同じ散乱光量で異なる高さの凹凸状物の概略側
面図である。FIG. 6 is a schematic side view of an uneven object having the same scattered light amount but different heights.
【図７】本発明の測定原理を説明するための散乱光強度
と画素との関係図である。FIG. 7 is a relational diagram between scattered light intensity and pixels for explaining the measurement principle of the present invention.
【図８】凹凸状物の高さを算出する際の円錐立体モデル
の斜視図である。FIG. 8 is a perspective view of a conical three-dimensional model when calculating the height of an uneven object.
【図９】本発明の一実施態様に係る凹凸状物形状測定装
置の概略構成図である。FIG. 9 is a schematic configuration diagram of an uneven object shape measuring apparatus according to an embodiment of the present invention.
【図１０】図９の装置におけるカメラでの撮像状態を示
す概略平面図である。10 is a schematic plan view showing an image pickup state by a camera in the apparatus of FIG.
【図１１】図９の装置における、ラインセンサによる凹
凸状物測定の様子を併せて示した、散乱光強度と画素位
置との関係図である。FIG. 11 is a relational diagram between scattered light intensity and pixel position, which also shows how unevenness is measured by a line sensor in the apparatus of FIG.
【図１２】図９の装置で測定された凹凸状物の平面形状
を示す、画素マトリックス上の平面図である。12 is a plan view on a pixel matrix showing a planar shape of an uneven object measured by the device of FIG.
２１ スライスレベル ２２ 円錐モデル ３１ 検査対象物としての基板 ３１ａ 基準面 ３２ 異物 ３３ 凹凸状物（欠陥） ３４ 照光手段 ３５ カメラ ３６ ラインセンサ ３７ 移動テーブル ３８ スクリュ ３９ モータ ４０ スライスレベル ４１、４２ 領域 ５０ 演算処理装置 21 Slice Level 22 Cone Model 31 Substrate as Inspection Object 31a Reference Surface 32 Foreign Material 33 Concavo-convex Object (Defect) 34 Illuminating Means 35 Camera 36 Line Sensor 37 Moving Table 38 Screw 39 Motor 40 Slice Level 41, 42 Area 50 Calculation Processing apparatus
Claims (5)
対し凸および／または凹状に形成された凹凸状物を光学
的に測定する凹凸状物形状測定方法であって、前記検査
対象物に光を照射し、該検査対象物からの散乱光を受光
して該散乱光の強度分布を二次元的に検出し、該散乱光
の強度分布が予め定められた散乱光強度のスライスレベ
ルを超えるときに形成される閉ループの形状から凹凸状
物の底面の大きさを測定するとともに、該閉ループ内に
おける散乱光強度の積分値から凹凸状物の体積または側
面の大きさを測定することを特徴とする凹凸状物形状測
定方法。1. A concavo-convex shape measuring method for optically measuring a concavo-convex object formed on a test object in a convex and / or concave shape with respect to a reference surface of the test object, wherein the test object is The object is irradiated with light, the scattered light from the inspection object is received, and the intensity distribution of the scattered light is two-dimensionally detected, and the intensity distribution of the scattered light is a slice level of a predetermined scattered light intensity. It is possible to measure the size of the bottom surface of the uneven material from the shape of the closed loop formed when the value exceeds, and to measure the size of the volume or the side surface of the uneven material from the integrated value of the scattered light intensity in the closed loop. Characteristic method for measuring the shape of irregularities.
し、前記凹凸状物の底面の大きさを前記立体の底面積に
相当する値とするとともに、前記凹凸状物の体積を前記
立体の体積に相当する値、もしくは、側面の大きさを前
記立体の側面積に相当する値とし、両値から前記立体の
高さを算出して凹凸状物の高さとする、請求項１の凹凸
状物形状測定方法。2. Assuming that the shape of the unevenness is a solid such as a cone, the size of the bottom surface of the unevenness is set to a value corresponding to the bottom area of the solid, and the volume of the unevenness is defined as The value corresponding to the volume of the solid body or the size of the side surface is set to the value corresponding to the side area of the solid body, and the height of the solid body is calculated from both values to be the height of the uneven article. Method for measuring the shape of irregularities.
該検査対象物からの散乱光を最終的に二次元の散乱光強
度分布の形で受光可能な受光手段とを備え、検査対象物
上に該検査対象物の基準面に対し凸および／または凹状
に形成された凹凸状物を光学的に測定する凹凸状物形状
測定装置であって、前記散乱光強度分布が予め定められ
た散乱光強度のスライスレベルを超えるときに形成され
る閉ループの形状を測定する手段と、該閉ループ内にお
ける散乱光強度の積分値を演算する手段とを備えたこと
を特徴とする凹凸状物形状測定装置。3. Illuminating means for irradiating the inspection object with light,
A light receiving means capable of finally receiving scattered light from the inspection object in the form of a two-dimensional scattered light intensity distribution, and having a convex and / or concave shape on the inspection object with respect to the reference plane of the inspection object. An uneven shape measuring device for optically measuring the uneven shape formed in, wherein the scattered light intensity distribution has a shape of a closed loop formed when the predetermined scattered light intensity exceeds a slice level. A concavo-convex shape measuring device comprising: a means for measuring and a means for calculating an integrated value of scattered light intensity in the closed loop.
と、前記散乱光強度積分値演算手段からの情報から、凹
凸状物の形状を円錐等の立体と仮定した際の該凹凸状物
の高さを算出する手段を備えている、請求項３の凹凸状
物形状測定装置。4. The height of the uneven object when the shape of the uneven object is assumed to be a solid such as a cone based on the information from the closed loop shape measuring means and the information from the scattered light intensity integral value calculating means. The concavo-convex object shape measuring apparatus according to claim 3, further comprising:
を受光するラインセンサを備えたカメラと、該カメラと
検査対象物とを所定方向に相対移動させる相対移動手段
とを有している、請求項３または４の凹凸状物形状測定
装置。5. The light receiving means includes a camera having a line sensor for receiving scattered light from the inspection object, and relative movement means for relatively moving the camera and the inspection object in a predetermined direction. The uneven shape measuring device according to claim 3 or 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP05684096A JP3523408B2 (en) | 1996-02-19 | 1996-02-19 | Method and apparatus for measuring shape of uneven object |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP05684096A JP3523408B2 (en) | 1996-02-19 | 1996-02-19 | Method and apparatus for measuring shape of uneven object |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH09222309A true JPH09222309A (en) | 1997-08-26 |
| JP3523408B2 JP3523408B2 (en) | 2004-04-26 |
Family
ID=13038608
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP05684096A Expired - Lifetime JP3523408B2 (en) | 1996-02-19 | 1996-02-19 | Method and apparatus for measuring shape of uneven object |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3523408B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008018591A1 (en) * | 2006-08-10 | 2008-02-14 | I-Pulse Kabushiki Kaisha | Inspecting apparatus, and inspecting method |
| JP2012019224A (en) * | 1998-06-25 | 2012-01-26 | Applied Materials Inc | Wafer defect classification |
| JP2013083628A (en) * | 2011-09-27 | 2013-05-09 | Shibaura Mechatronics Corp | Apparatus and method for inspecting pasted panel-like body |
| WO2013139061A1 (en) * | 2012-03-21 | 2013-09-26 | 深圳市华星光电技术有限公司 | Substrate detection method and device |
-
1996
- 1996-02-19 JP JP05684096A patent/JP3523408B2/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012019224A (en) * | 1998-06-25 | 2012-01-26 | Applied Materials Inc | Wafer defect classification |
| WO2008018591A1 (en) * | 2006-08-10 | 2008-02-14 | I-Pulse Kabushiki Kaisha | Inspecting apparatus, and inspecting method |
| JP2013083628A (en) * | 2011-09-27 | 2013-05-09 | Shibaura Mechatronics Corp | Apparatus and method for inspecting pasted panel-like body |
| WO2013139061A1 (en) * | 2012-03-21 | 2013-09-26 | 深圳市华星光电技术有限公司 | Substrate detection method and device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3523408B2 (en) | 2004-04-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7430047B2 (en) | Small container fluid dynamics to produce optimized inspection conditions | |
| EP0244781B1 (en) | Method and apparatus of using a two beam interference microscope for inspection of integrated circuits and the like | |
| JP4246438B2 (en) | Lens inspection | |
| US5790247A (en) | Technique for determining defect positions in three dimensions in a transparent structure | |
| US4223346A (en) | Automatic defect detecting inspection apparatus | |
| FI94551C (en) | Method and apparatus for monitoring the surface profile of a moving workpiece | |
| JPH03267745A (en) | Surface property detecting method | |
| JP3036049B2 (en) | Particle aggregation pattern determination method | |
| US4498776A (en) | Electro-optical method and apparatus for measuring the fit of adjacent surfaces | |
| CN101907490B (en) | Method for measuring small facula intensity distribution based on two-dimension subdivision method | |
| JPH0711490B2 (en) | Defect detection method and device for transparent object | |
| JP2947513B1 (en) | Pattern inspection equipment | |
| JP3523408B2 (en) | Method and apparatus for measuring shape of uneven object | |
| JPH0373831A (en) | Device for inspecting defect | |
| WO2021118838A1 (en) | Laser based inclusion detection system and methods | |
| JP3368512B2 (en) | Defect inspection method for transparent sheet-like molded product | |
| JP2000018922A (en) | Apparatus for thickness defect inspection and its inspection method | |
| EP1209443A1 (en) | Method and apparatus for direct image pick-up of granular speck patterns | |
| JPH06281593A (en) | Method and apparatus for inspecting surface | |
| JP2002139455A (en) | Apparatus and method for inspection | |
| JPS6259913A (en) | Observing device for skin surface shape | |
| JP3280401B2 (en) | Defect inspection device and defect inspection method | |
| JP3141470B2 (en) | Three-dimensional shape detection method and apparatus | |
| JP2006003168A (en) | Measurement method for surface shape and device therefor | |
| JPH09210660A (en) | Image pick-up inspection system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20040113 |
|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20040206 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20040206 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080220 Year of fee payment: 4 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090220 Year of fee payment: 5 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090220 Year of fee payment: 5 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100220 Year of fee payment: 6 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100220 Year of fee payment: 6 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110220 Year of fee payment: 7 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120220 Year of fee payment: 8 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120220 Year of fee payment: 8 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130220 Year of fee payment: 9 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130220 Year of fee payment: 9 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140220 Year of fee payment: 10 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |