JPH09219600A - Preparing method of data on inspection region - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a preparing method of data on inspection region capable of preparing said data within a short time. SOLUTION: A printed board 120 is irradiated with light to detect a pad 120 formed on said board 120 by discriminating the pad 126 from the other green mask 124 and a base substance 122 according to the intensity of the reflected light of the irradiating light for collecting the data on outline from the configuration thereof so that the data on inspection region such as inspection positions (Xn, Yn) or inspection range (Lxn, Lyn) may be computed according to the data on the positions of the detected pads.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for creating inspection area information, and more particularly to inspection area information for creating inspection area information relating to an inspection position, an inspection range, etc. in a device such as a soldering inspection device or a chip mounter. Regarding how to create.

[0002]

2. Description of the Related Art For example, in a soldering inspection device for a printed circuit board, the soldering state of electronic components mounted on the printed circuit board is automatically inspected. At this time, if the entire area of the printed circuit board is to be inspected, it takes time to perform the inspection. Therefore, the area to be soldered on the printed circuit board is set as the inspection area, and information about this inspection area is input to the soldering inspection device in advance. There is a need to.

As a method of inputting the inspection area information to the soldering inspection apparatus, for example, when the printed circuit board is made by CAD or the like, the design information of the printed circuit board stored in the CAD is used as the soldering inspection apparatus. There is a method of automatic conversion input that prepares software to convert to inspection area information, converts the design information to inspection area information using this software, and inputs the converted inspection area information to the soldering inspection device. is there.

As another method, there is a manual input method in which information on each inspection area is manually input to the soldering inspection apparatus by using a printed circuit board to be inspected.

[0005]

However, the automatic conversion method using software has a problem that it takes time to create the software. In addition, dedicated software is required for each design information of printed circuit boards created by different CAD.

In the manual input method, depending on the size of the printed circuit board, the soldering points are
Since there are several thousand points per printed circuit board, there is a problem that it takes time to input. In addition, there is a possibility that an erroneous input may occur, and as a result, a defective soldering location may be overlooked.

An object of the present invention is to provide a method of creating inspection area information that can be created in a short time.

[0008]

In order to achieve the above object, the present invention provides a method for creating inspection area information of a component mounting pad provided on a substrate, the pad on the substrate and the pad Detecting the pad by distinguishing the other parts by the difference in physical properties, it is configured to calculate the inspection area information based on the information of the position of the detected pad, by such a method, The inspection area can be automatically calculated.

In the method for creating inspection area information, the silk-printed portion provided on the substrate is detected separately from other portions, and the detected area is surrounded by the silk-printed area. The included pad is distinguished from the pad for the same component, and by such a method, the allocation of the inspection reference value can be facilitated.

A method of creating inspection area information, characterized in that:

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A method of creating inspection area information for a soldering inspection apparatus according to an embodiment of the present invention will be described below with reference to FIGS. FIG. 1 is a block diagram showing a system configuration of a soldering inspection apparatus according to an embodiment of the present invention.

The soldering inspection apparatus 100 has a function of automatically inspecting a soldering state of electronic components mounted on a printed circuit board, a portion to be soldered from the printed circuit board, that is, an inspection position, an inspection range and the like. The inspection area information of can be automatically detected. Therefore, a printed circuit board on which electronic components are not mounted is set in advance in the soldering inspection apparatus 100, and inspection area information is created and stored,
By inputting the inspection standard information for each inspection area,
It is possible to create inspection information, detect the soldering state in the stored inspection area for the printed circuit board on which the electronic component is mounted, and inspect the soldering state based on the inspection standard. .

First, the structure of the soldering inspection apparatus 100 will be described. A printed circuit board is placed on the XY table 102, and the placed printed circuit board can be moved in the two-dimensional directions of the X direction and the Y direction. As a printed circuit board to be placed, during automatic inspection of the soldering state,
The printed board on which the electronic component is mounted is placed, and when the inspection area information is created, the printed board on which the electronic component is not mounted is placed. When the size of the printed circuit board to be placed is 400 mm × 500 mm, for example, the XY table can move in a two-dimensional direction over a range of 400 mm × 500 mm or more. The movement of the XY table 102 is controlled by the control unit 104 and also the control unit 104.
Sends the position information of the XY table 102 to the calculation unit 110.

A detection unit 106 for detecting the soldering state on the printed circuit board is installed on the XY table. As the detection method of the detection unit 106, there are various methods such as a laser method, a step illumination method, and an X-ray method.
Details of these will be described later. Further, as the detection method of the detection unit, any of these methods may be used. The detection unit irradiates a predetermined area of the printed board with light or X-rays, and detects the intensity of reflected light from the printed board or the intensity of X-rays transmitted through the printed board. The detected data is output to the recognition unit 108.

The recognition unit 108 recognizes the soldering state based on the reflected light intensity and X-ray intensity data input from the detection unit 106. That is, the data of the spread of the soldered solder, the height of the solder, the inclination angle of the inclined surface of the solder, and the like are obtained. The obtained recognition result is sent to the calculation unit 110.
Further, when creating the inspection area information, the recognition unit 108
Is a position for soldering, that is, a position and an outer shape of a pad on which an electronic component is mounted, based on the reflected light intensity data and the X-ray intensity data input from the detection unit 106, and the calculation unit calculates the result. Send to 110.

The operation setting unit 112 includes an XY table 102.
By setting the moving position of the
04. The control unit 104 moves the XY table 102 according to the input setting value of the position. Further, the operation setting unit 112 sets and inputs an inspection reference value for the soldering inspection, and stores it as setting data in the calculation unit 110.

The detection unit 106 is capable of simultaneous two-dimensional detection, but the range that can be detected at one time is smaller than the size of one surface of the printed circuit board, for example, 15 mm ×.
15 mm. Therefore, after moving the XY table 102 to position the placed printed circuit board at a predetermined position, the detection unit 106 detects the state of the printed circuit board in a predetermined range, and after the detection is completed, the XY table 102 is moved to, for example, ,
The detection unit 106 detects by moving in one direction by 15 mm. Movement by the XY table 102 and the detection unit 1
By repeating the detection by 06, the entire surface of the printed board can be detected.

Therefore, when the inspection area information is created, the printed board on which the electronic component is not mounted is set on the XY table 102 of the soldering inspection apparatus 100. The detection unit 106 sends the data of the reflected light intensity and the X-ray intensity based on the surface condition of the printed circuit board within the detection range to the recognition unit 108, and the recognition unit 108 determines the soldering position based on these data. That is, the position and the outer shape of the pad on which the electronic component is mounted are obtained, and the result is sent to the calculation unit 110.

The calculation section 110 recognizes the position information of the XY table 102 sent from the control section 104 and the recognition section 102.
Corresponds to the position and external shape of the pad sent from
The position and outer shape of each pad with respect to the entire surface of the printed circuit board are obtained. Based on the obtained position, inspection area information such as an inspection position and an inspection range at the time of soldering inspection is created. Details of this creating method will be described later with reference to FIG.

Further, by moving the XY table 102,
The same inspection area information is created, and when the creation of the inspection area information is completed for the entire surface of the printed circuit board, the operation setting unit 106 inputs the inspection standard for each inspection area.

As described above, the creation of the inspection area information and the input of the inspection standard for each inspection area are completed for the printed circuit board to be inspected, and the inspection information as the result is stored in the calculation unit 110. Memorized in. By performing the above-described method on different printed boards, it is possible to create inspection area information and input an inspection standard for each inspection area.

When used as a soldering inspection device,
The printed board on which the electronic components are mounted is set on the XY table 102 of the soldering inspection apparatus 100. afterwards,
The automatic inspection is started, and the calculation unit 10 causes the control unit 104 to perform XY based on the inspection area information stored in advance.
Outputs table position information. The no control 104 moves the XY table 102 to a predetermined position based on the XY table position information. The detection unit 106 sends the data of the reflected light intensity and the X-ray intensity based on the surface condition of the printed circuit board within the detection range to the recognition unit 108. The recognition unit 108 does not calculate 11
The detection data in the area specified in the inspection area information sent from 0 is processed to obtain data such as the spread of the soldered solder, the height of the solder, and the inclination angle of the inclined surface of the solder. Recognize the soldering status. The obtained recognition result is
It is sent to the calculation unit 110 for each inspection area. Calculator 110
Performs a soldering state inspection by collating a previously stored inspection standard with a recognition result for each inspection area. The XY table 102 is moved, the same soldering state inspection is performed, and the soldering state inspection is performed on the entire surface of the printed circuit board.

Next, with reference to FIG. 2, a specific structure of the detecting section will be described. FIG. 2 (A) is a sectional view showing the structure of the detection unit of the soldering inspection apparatus according to one embodiment of the present invention, and FIG. 2 (B) is a view showing the state of the detected signal.

The detector 106 comprises a laser light source 200 and light receiving sensors 202, 203 and 204. The light receiving sensor 202 is located above the center, and the light receiving sensor 20
3 is a printed circuit board 1 on four sides surrounding the light receiving sensor 202.
20. Light receiving sensors 20 arranged parallel to each other and facing each other
3A, 203B and four sensors (not shown) that face each other in a direction orthogonal to these three sensors. Further, the light receiving sensor 204 is arranged on four sides surrounding the light receiving sensor 202 so as to be orthogonal to the printed circuit board 120, and the light receiving sensors 2034 and 204B facing each other.
And four sensors of two light receiving sensors (not shown) facing each other in the direction orthogonal to these.

The laser light 210 emitted from the laser light source 200 is reflected by the Galvano mirrors 206 and 208, reflected by the beam splitter 212, and irradiated onto the printed circuit board 120 mounted on the XY table. The Galvano mirrors 206 and 208 rotate in directions orthogonal to each other. For example, the Galvano mirror 2
06 rotates in the y direction corresponding to the Y direction of the XY table, and the galvano mirror 208 rotates in the x direction corresponding to the X direction of the XY table.

Therefore, by rotating the Galvano mirrors 206 and 208, the laser light emitted from the laser light source 200 can be two-dimensionally scanned in the X and Y directions on the printed circuit board 120.

The scanning range of the Galvano mirrors 206 and 208 is, for example, 15 mm × on the printed circuit board 120.
The range is 15 mm. On the other hand, since the diameter of the laser beam 210 with which the printed circuit board 120 is irradiated is about 10 μm, a range of 15 mm × 15 mm can be detected with a resolution of 10 μm.

When the surface of the printed circuit board 120 is horizontal, the light radiated orthogonally to the surface of the printed circuit board 120 is reflected at a right angle to the printed circuit board 120, and the light is emitted from the printed circuit board 120. The reflected light of is detected by the light receiving sensor 202 at the center.

On the other hand, when the surface of the printed circuit board has an inclined surface such as solder, the light radiated orthogonally to the surface of the printed circuit board 120 is reflected while being inclined with respect to the printed circuit board 120. The reflected light from the printed circuit board 120 is detected by either the light receiving sensor 203 or the light receiving sensor 204.

When detected by the light receiving sensor 203A, the inclination angle of the inclined surface of the solder on the surface of the printed circuit board 120 is relatively gentle, and when detected by the light receiving sensor 204A, the solder on the surface of the printed circuit board 120. The inclination angle of the inclined surface is steep. Further, since the surface of the solder is not a perfect mirror surface, the reflected light has a certain spread due to the irregular light. Therefore, for example, when detected by both the light receiving sensor 203A and the light receiving sensor 204A, the inclination angle of the inclined surface of the solder on the surface of the printed circuit board 120 is intermediate between gentle and steep. In this way, the cross-sectional shape of the solder can be detected by obtaining the angles of the inclined surfaces of the solder in the inspection area at regular intervals.

Further, when obtaining the position where the printed circuit board 120 is soldered, that is, the position and the outer shape of the pad on which the electronic component is mounted, the reflected light intensity based on the surface condition of the printed circuit board within the detection range is calculated. Use the difference. The reflected light is
The light receiving sensor 203 detects the light receiving sensor 203.
Also, the light receiving sensor 204 is not used. This is because the surface of the printed circuit board 120 has not been soldered yet, so that an inclined surface is not formed.

As the structure of the printed circuit board 120, the base material 122 and the green mask 12 covering the surface of the base material 122 are used.
4 and the base material 12 at the position where the green mask 124 is opened
2, a pad 126 such as a copper foil pattern formed on
There is a silk print 128 printed on the green mask 124 to indicate the positions of electronic circuit components and the like.

The printed circuit board 120 configured as described above.
When the upper part is scanned with the laser light 210 in one direction, the intensity of the reflected light detected by the light receiving sensor 202 is as shown in FIG.
It becomes as shown in. That is, the light intensity at the green mask 124 and the base material 122 is low, and the light intensity at the pad 126 is high. The light intensity of the silk print 128 is intermediate between the two.

Therefore, based on these differences in reflected light intensity, the position where the printed circuit board 120 is soldered, that is, the position and external shape of the pad on which the electronic component is mounted can be obtained.

Further, instead of using only the output signal from the central light receiving sensor 202, in addition to the light receiving sensor 202,
It is also possible to use the four surrounding light receiving sensors 204 and obtain the average reflected light from the outputs of the five light receiving sensors.

Next, with reference to FIG. 3, a method for obtaining the position and outer shape of the pad according to the embodiment of the present invention will be described. FIG. 3 is a diagram illustrating the operation of the recognition unit in the soldering inspection apparatus according to the embodiment of the present invention.

The printed circuit board 120 is, for example, as shown in FIG.
-2) has a cross-sectional shape as shown in FIG.
That is, the printed circuit board 120 includes the base 122 and the base 12.
2, a green mask 124 covering the surface of the second mask, a pad 126 such as a copper foil pattern formed on the base material 122 at the position where the green mask 124 is opened, and the green mask 12
4 is printed on the upper surface of the printed circuit board 4 and is formed by silk printing 128 indicating the positions of electronic circuit parts.

When the laser beam 210 of the detector 106 is scanned along the line whose cross section is shown in FIG. 3A-2, at that time, the reflection from the printed circuit board 120 detected by the light receiving sensor 202 in the center is performed. The light intensity is shown in Fig. 3 (A-3).
Changes as shown in FIG.

Since the detection unit 106 can detect a predetermined two-dimensional range, the detection unit 106 to the recognition unit 10
The detection data captured in 8 is two-dimensional grayscale data as shown in FIG.

The recognition unit 108 converts the captured grayscale data into binary data. This conversion is shown in FIG.
With respect to the signal having the light intensity as shown in 3), "1" is set for a portion having a higher intensity than the predetermined slice level L1, and "0" is set for the other portions. Done.

When the signal shown in FIG. 3 (A-3) is binarized, it becomes as shown in FIG. 3 (B-2). This is the detection unit 1
As shown in FIG. 3 (B-1), the pad 1
The data is "1" for the 26 areas and "0" for the other areas.

Further, the recognition section 106 obtains the contour data of the pad area based on the binarized data. In obtaining the contour data, contour tracing is performed and the contour data shown in FIG.
In the binarized data shown in -1), search for a point where data "1" and data "0" touch, and check "1" for this touching point.
The data of 1 is set as the data “1” as it is, and the data of the other parts is set as the data “0”, whereby the shape of the outer shape 130 of the pad 126 is recognized as shown in FIG. 3C. An inspection area such as an inspection position or an inspection range is obtained based on the contour data indicating the contour of the pad. The details will be described later with reference to FIG.

In the method described above, since the data "1" at the point where the data "1" and the data "0" contact each other is used as the data "1", the obtained contour data is
It is the outer shape of the pad itself. In contrast, data ”
If the data of "0" at the point where 1 "and data" 0 "touch is data" 1 "and the other data is" 0 ", then FIG.
It is possible to obtain contour data that is slightly larger than the contour data shown in (C).

By using this contour data, the inspection range can be made slightly larger than the outer shape of the pad.
In comparison with the base material 122 on the outer periphery of the pad 126, the soldered portion can be inspected more accurately.

Further, in FIG. 3A-3, although the binarization is performed using the slice level L1, the slice level L2 is used.
3B in addition to the pad 126.
As indicated by the one-dot chain line in -1), silk printing 128
Since the data of "1" becomes the data "1", the contour data of the outer shape 132 of the silk print 128 can be obtained as shown in FIG.

The contour data of the outer shape 132 of the silk print 128 can be used when allocating the inspection reference value, and its details will be described later. Also, silk printing 128
When it is desired to obtain only the contour data of the outer shape 132, the data at the disagreement between the data sliced at the slice level L1 and the data sliced at the slice level L2 may be extracted. That is, it is only necessary to invert the data when sliced at the slice level L1 and to AND with the data when sliced at the slice level L2.

Next, a method for obtaining the inspection position and the inspection range from the contour data of the outer shape of the pad on the entire surface of the printed board will be described with reference to FIG. FIG. 4 is a diagram illustrating the function of the calculation unit in the soldering inspection apparatus according to the embodiment of the present invention.

The printed circuit board 300 to be detected has a size of 400 mm × 500 mm, for example. On the other hand, the range that can be detected at once by the detection unit is
It is as small as 15 mm x 15 mm. Therefore, the entire surface of the printed circuit board 300 to be detected is divided into a plurality of detection areas 310. In the state shown in FIG.
Although it is divided into (= 6 × 3), it is actually divided into smaller pieces.

Coordinates (0, 0) are given to the upper left reference point of the printed circuit board 300, and each detection area 310 has coordinates (X, Y) of the detection reference position located at the upper left of each detection area.
Will be represented by. The detection reference position (X, Y) is a position defined by movement by the XY table 102 shown in FIG. 1, and the XY table 102 is moved by a command from the control unit 104, and data of the XY table position at that time. Are sent to the calculation unit 110.

The detection section 106 performs detection on the detection area represented by the detection reference position (X, Y), and the data detected by the detection section 106 is recognized by the recognition section 108. For example, contour data 130-1, 130-2, and 130-3 are obtained as the contour data of the outer shape. The upper left coordinate of the contour data 130-1 is (dx
1, dy1), the inspection position (X1, Y1) for the contour data 130-1 is given by X1 = X + dx1 Y1 = Y + dy1.

As the inspection range, the pad 130-
1 is given by the length Lx1 of the long side and the length Ly1 of the short side.

Similarly, the upper left coordinate of the contour data 130-2 is (dx2, dy2) with respect to the inspection position (X2,
Y2) is given by X2 = X + dx2 Y2 = Y + dy2, and the inspection range is given by the long side length Lx2 and the short side length Ly2 of the outer shape of the pad 130-2.

That is, as a general expression, the inspection position (Xn,
Yn) is obtained by Xn = X + dxn Yn = Y + dyn.

The inspection range is obtained by (Lxn, Lyn).

Next, with reference to FIG. 5, a specific relationship between the entire area of the printed circuit board and the detection area of the detection section will be described. FIG. 5 is a diagram illustrating the function of the calculation unit in the soldering inspection apparatus according to the embodiment of the present invention.

In FIG. 5, the solid line shows the state of the surface of the printed circuit board. Silk printing 1 surrounded by a rectangle
The frames 100, 1200, 2100, and 2200 have IC101, IC102, IC201, and IC202, respectively.
Shows the mounting position of. Silk printing 1100,120
0, 2100, and 2200 are printed on the green mask 1010 that covers the surface of the printed circuit board 1000.

The IC 101 and the IC 102 are the same IC, and their outer dimensions are, for example, 40 mm × 4.
0 mm. IC201 and IC202 are respectively
The same IC, for example, its external dimensions are 20 mm x
20 mm.

Here, regarding the IC 101, the number of input / output terminals is, for example, 280, and it is assumed that 70 terminals are arranged on each of the four sides. 70 pads 110 in the green mask 1010 with a rectangular opening
1, 1102, ..., 1170 are formed. In addition, pads 1171, ..., 1240 are provided in the other openings.
70 pads of pad, pads 1241, ..., 7 of 1310
70 pads of 0 pads, pads 1311, ..., 1380 are arranged. The same applies to the IC 102. The size of the pads 1101, ..., 1380 is, for example, 1 mm on the long side and 0.2 mm on the short side, and the width of the gap between the pads is 0.3 mm.

The broken line and the alternate long and short dash line represent the detection area by the detection unit. The size of the detection area, for example,
If the size is 15 mm × 15 mm, the IC 101 is covered with nine detection areas. Representing each detection area by the coordinates of the upper left corner, (0,0), (0,1)
5), (0,30), (15,0), (15,15),
(15,30), (30,0), (30,15), (3
0, 30).

Based on the principle explained in FIG. 4, (0,
0) detection area pads 1101, 1102, 1380
It is possible to determine the inspection position and the inspection range of each pad by detecting the contours such as. In addition, other (0,1
5), (0,30), (15,0), (15,15),
(15,30), (30,0), (30,15), (3
The inspection position and the inspection range can be obtained from the pads in the detection area of 0, 30).

Similarly, for the IC 102, the inspection position and the inspection range of all pads can be obtained.

Next, regarding the IC 201, the number of input / output terminals is, for example, 120, and it is assumed that 30 terminals are arranged on each of the four sides. Green mask 1
010 has a rectangular opening, and 30 pads 2101,
2102, ..., 2130 are formed. Further, in the other openings, the pads 2131, ...
, 2190, and 30 pads of pads 2191, ..., 2220 are arranged. The same applies to the IC 202. The size of the pads 2101, ..., 2220 is, for example, 1 mm on the long side and 0.2 mm on the short side.

The broken line and the alternate long and short dash line represent the detection area by the detection unit. The size of the detection area, for example,
If the size is 15 mm × 15 mm, the IC 201 will be covered by four detection areas.

Based on the principle explained in FIG. 4, (45,
It is possible to detect the contours of the pads 2101, 2202 and the like in the detection area of 0) and obtain the inspection position and the inspection range of each pad. With respect to the detection area of (45, 15), the contours of the pads 2130, 2131, etc. can be detected, and the inspection position and the inspection range of each pad can be obtained, and a part of the contour of the pad 2320, etc. of the IC 201 can be obtained. Can be detected.

However, the pad 232 of the IC 201
Since a part of the contour of 0 covers the periphery of the inspection area, the entire contour of the pad 2320 cannot be detected. Therefore, the next detection area is not (45, 30) but (45, 29)
As described above, the calculation unit calculates a new detection area so that the entire pad 2320 is included. In calculating this new detection area, at least (4
The pad 2 detected during the detection of the detection area of
The calculation is performed so as to shift the detection area by the length of 320.

Further, the pad 2 in the detection area of (45,0)
For example, (59.9, 0) is set as a new detection area so that the pads 2160 and 2191 are completely included in the next detection area even when 160 and 2191 are around the detection area.

Further, as shown in FIG.
By using the slice level L2, the recognition unit 108
Since the silk printing 1100 can be recognized, the calculation unit 110 can determine that the inspection areas of the pads 1101, ..., 1380 are all inspection areas for the same IC. This can give the same inspection reference value when inputting the inspection reference value.

Next, the overall procedure for creating inspection area information will be described with reference to FIG. FIG. 6 is a flowchart of creating inspection area information according to an embodiment of the present invention.

In step 400, the target printed circuit board is set on the XY table 102 of the soldering inspection apparatus 100 shown in FIG.

In step 402, the operation setting section 11
Enter the inspection range from 2. As for the inspection range, as shown in FIG. 4, the position of the reference point, for example, (0, 0) is input to the printed circuit board 300, and further, the X direction and the Y direction.
This is done by entering the length of the direction.

In step 404, the control unit 104
Sends a control signal to the XY table 102 to move the printed circuit board to one detection area on the printed circuit board. For example, when moving to the detection area defined by the detection reference position (X, Y), the XY table 102 is moved to (X,
Move to position Y). Normally, as described with reference to FIG. 5, it is sequentially moved as (0,0), (15,0), (30,0).

After the movement to the detection area by the XY table 102 is completed, the position of the component mounting pad in the detection area is detected in step 406. Detection unit 106
Scans the detection area to detect the grayscale data shown in FIG. 3A-1.
1) and the procedure shown in FIG. 3C, the binarized data and the contour data are created and sent to the calculation unit 110.

In step 408, the calculation unit 110
Calculates the inspection position (Xn, Yn) and the inspection range (Lxn, Lyn) as shown in FIG.

Further, in step 410, the calculation section 110 calculates the next detection area as described in FIG. For example, as shown in FIG. 5, (0,
When the inspection position and the inspection range are calculated in the detection area of (0), there is no pad around the detection area, so the next detection area is calculated so as not to overlap the previous area, and (1
5, 0) detection area. However, (45,1
When a pad is applied around the detection area as in the case of detecting the detection area in 5), the length of the applied pad is taken into consideration and the pad applied around the detection area is within the next detection area. Is calculated as (45, 29) as the next detection area.

In step 412, the calculation unit 110
Determines whether or not all detections within the inspection range input in advance have been completed, and if all detections have not been completed, returns to step 404 to execute detection of the next detection region. . When all the detections are completed, the process proceeds to step 414.

Step 414 is a step of allocating the inspection reference value, and this step is the operation setting unit 1
It is performed by inputting the inspection reference value for each pad from 12. When step 412 is completed, FIG.
In the inspection program shown in (1), a list of inspection positions (Xn, Yn) and inspection ranges (Lxn, Lyn) is created.

The operator reads this list and
Correspondence between each inspection position and inspection range and the actual pad on the printed circuit board. Then, as shown in FIG.
For C110 pads 1101, ..., 1180,
The inspection position (Xn, Yn) is designated all at once, and the same inspection reference value is assigned.

As the inspection reference value, data such as the length and height of the solder when the solder is applied on the pad and the inclination of the inclined surface of the solder are used, and these are coded and input. .

Since the same inspection reference value is assigned to the same type of IC, the IC 101 shown in FIG.
The same inspection reference value for IC 102 and the inspection reference value for IC 102 are assigned.

Further, instead of assigning the inspection reference value,
The part number may be designated. By preparing the inspection data for each component in advance, the work of assigning the inspection reference value by the component number can be performed.

The inspection program completed by allocating the inspection reference values in this way is as shown in FIG. In the example shown here, (X1, Y1) and (X2, Y2)
, The inspection reference value C100 is assigned to (X3,
The inspection reference value Q345 is assigned to Y3), (X4, Y4) and (X5, Y5), and the inspection reference value S459 is assigned to (Xn, Yn).

As described above, the inspection area information can be automatically created, and the inspection reference value can be assigned to the inspection area information to create the inspection program.

As shown in FIG. 5, the periphery of each IC is silk-printed 1100, 1200, 2100, 2200.
3A-3, the recognition unit 108 recognizes the silk printing 1100 using the slice level L2, and the calculation unit 110 causes the pad 1101 ,. , 1140 have the same I area.
As the inspection region for C, the same inspection reference value may be automatically given, and the manual input can be simplified.

Next, another specific structure of the detecting section will be described with reference to FIG. FIG. 8A is a cross-sectional view showing the configuration of another example of the detection unit of the soldering inspection apparatus according to the embodiment of the present invention, and FIG. 8B shows the state of the detected signal. It is a figure.

The detection unit 106 'includes a light source 22 for ring illumination.
0,222,224 and CCD camera 226 are provided. The ring illumination light sources 220, 222, and 224 have different diameters and are of a step illumination type in which the height with respect to the printed circuit board 120 is changed. The CCD camera 226 is located above the center. CCD camera 2
If 26 is, for example, 500 × 500 elements and the resolution per element is 20 μm, the detection area per time is 10 mm × 10 mm.

When the surface of the printed circuit board 120 is horizontal, the light radiated perpendicularly to the surface of the printed circuit board 120 is reflected at a right angle to the printed circuit board 120, and the surface of the printed circuit board is If there is an inclined surface such as solder, the light that is radiated perpendicularly to the surface of the printed circuit board 120 is inclined and reflected with respect to the printed circuit board 120, so the reflected light from the printed circuit board 120 is reflected by the CCD camera. When detected at 226, the flat surface is detected as bright and the inclined surface is detected as dark.

Furthermore, light sources 220 and 22 for ring illumination
Nos. 2 and 224 have different diameters and different heights with respect to the printed circuit board 120. Therefore, by sequentially turning on these light sources and detecting the image at each time, the inclination angle of the soldering surface is increased. Can be detected.

Further, when obtaining the position where the printed circuit board 120 is soldered, that is, the position and the outer shape of the pad on which the electronic component is mounted, the reflected light intensity based on the surface condition of the printed circuit board within the detection range is calculated. Use the difference.

As the constitution of the printed circuit board 120, the base material 122 and the green mask 12 covering the surface of the base material 122 are used.
4 and the base material 12 at the position where the green mask 124 is opened
2, a pad 126 such as a copper foil pattern formed on
There is a silk print 128 printed on the green mask 124 to indicate the positions of electronic circuit components and the like.

The printed circuit board 120 configured as described above.
The intensity of the reflected light detected by the light receiving sensor 202 when the upper part is illuminated by the light source 220 of the ring illumination is shown in FIG.
It becomes as shown in. That is, the light intensity at the green mask 124 and the base material 122 is low, and the light intensity at the pad 126 is high. The light intensity of the silk print 128 is intermediate between the two.

Therefore, the position where the printed circuit board 120 is soldered, that is, the position and external shape of the pad on which the electronic component is mounted can be obtained based on these differences in reflected light intensity.

When obtaining the position and the outer shape of the pad on which the electronic parts are mounted, the light sources 220 and 2 of the ring illumination are used.
One of 22, 224 is used. This is because it is not necessary to detect the inclination.

The data detected by the detecting unit of this step illumination method is also binarized by using the slice level L1 or L2 in the recognizing unit in the same manner as described with reference to FIG. 3, and further the contour data is obtained. be able to.

Further, other specific structure of the detection unit will be described with reference to FIG. FIG. 9 (A) is a sectional view showing the configuration of another example of the detection unit of the soldering inspection apparatus according to the embodiment of the present invention, and FIG. 9 (B) is
It is a figure which shows the state of the detected signal.

The detection section 106 ″ is composed of an X-ray source 230 and an X-ray detector 232. The X-ray source 230 is disposed above the printed circuit board 120 and has an X-ray detector 232.
Are arranged below the printed circuit board 120. The X-rays emitted from the X-ray source 230 pass through the printed board 120 and are detected by the X-ray detector 232. The X-ray detector 232 detects the intensity of incident X-rays by converting them into light and darkness of light.

When soldering is performed on the pads 126 of the printed circuit board 120, the X-rays are absorbed by the lead contained in the solder. Therefore, the soldered area can be detected depending on the strength of the detection signal of the detector 232. Also,
Since the amount of absorption varies depending on the thickness of the solder, the thickness of the solder can be detected, and the inclined surface of the solder can be detected from the change in the thickness of the solder.

Further, when the position where the printed circuit board 120 is soldered, that is, the position and the outer shape of the pad on which the electronic component is mounted is obtained, the laser method shown in FIG. 2 and the step illumination method shown in FIG. 8 are used. Since the intensity of the reflected light is not used, the pad 126 alone cannot be identified. Therefore, a printed circuit board having solder on the surface of the pad 126 is prepared in advance by solder reflow or the like.

The printed circuit board 120 configured as described above.
The signal intensity detected by the detector 232 when the upper part is irradiated with X-rays is as shown in FIG. That is, the strength of the green mask 124 and the base material 122 is high,
The light intensity in the portion where the solder is attached on the pad 126 is small.

Therefore, based on these differences in intensity,
The position where the printed circuit board 120 is soldered, that is, the position and external shape of the pad on which the electronic component is mounted can be obtained.

The data detected by the X-ray type detecting unit can be binarized by using the slice level L1 in the recognizing unit in the same manner as described with reference to FIG. 3, and further contour data can be obtained. it can.

In this method, unlike the laser method shown in FIG. 2 and the step illumination method shown in FIG. 8, it is not possible to recognize the silk-printed portion. Therefore, a method for automatically assigning inspection reference values to the same component is used. Can not take.

In the above description, the soldering inspection apparatus has been described as an example, but the inspection area information can be similarly created for the chip mounter and the like.

According to the present embodiment, the position of the pad can be automatically detected, and the inspection area information such as the inspection position and the inspection range can be created in a short time based on the position of the pad.

The software used can be the same without changing the type of printed circuit board.

Further, since the inspection area information can be automatically created, it is possible to prevent missing of the soldering defective portion due to leakage of the inspection area.

[0106]

According to the present invention, inspection area information can be created in a short time.

[Brief description of drawings]

FIG. 1 is a block diagram showing a system configuration of a soldering inspection apparatus according to an embodiment of the present invention.

FIG. 2A is a sectional view showing a configuration of a detection unit of the soldering inspection apparatus according to the embodiment of the present invention, and FIG.
FIG. 6 is a diagram showing a state of a detected signal.

FIG. 3 is a diagram illustrating an operation of a recognition unit in the soldering inspection apparatus according to the embodiment of the present invention.

FIG. 4 is a diagram illustrating a function of a calculation unit in the soldering inspection apparatus according to the embodiment of the present invention.

FIG. 5 is a diagram illustrating a function of a calculation unit in the soldering inspection apparatus according to the embodiment of the present invention.

FIG. 6 is a flowchart of creating inspection area information according to an embodiment of the present invention.

FIG. 7 is a diagram showing an example of an inspection program created by the soldering inspection apparatus according to the embodiment of the present invention.

FIG. 8A is a cross-sectional view showing the configuration of another example of the detection unit of the soldering inspection apparatus according to the embodiment of the present invention, and FIG. 8B shows the state of the detected signal. It is a figure.

9A is a cross-sectional view showing the configuration of another example of the detection unit of the soldering inspection apparatus according to the embodiment of the present invention, and FIG. 9B shows the state of the detected signal. It is a figure.

[Explanation of symbols]

100 ... Soldering inspection device 102 ... XY table 104 ... Control part 106, 106 ', 106''... Detection part 108 ... Recognition part 110 ... Calculation part 112 ... Operation setting part 120, 300, 1000 ... Printed circuit board 122 ... Base material 124, 1010 ... Green mask 126, 1101, 1102, 1120, ..., 112
1, ... 1140, 1141, ... 1160, 1161,
..., 1180 ... Pads 128, 1100, 1200, 2100, 2200 ... Silk printing 129 ... Solder 130, 132 ... Outer shape 200 ... Laser light source 202, 204A, 204B ... Light receiving sensor 206, 208 ... Galvano mirror 212 ... Beam splitter 220, 222 , 224 ... Ring illumination 226 ... CCD camera 230 ... X-ray source 232 ... Detector 310 ... Detection area

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Emi Mio 1 Horiyamashita, Hadano City, Kanagawa Prefecture

Claims (2)

[Claims] 1. A method of creating inspection area information of a pad for mounting a component, which is provided on a substrate, wherein the pad and the other portion on the substrate are distinguished by a difference in physical property to detect the pad. Then, the inspection area information is calculated based on the detected position information of the pad. 2. The method for creating inspection area information according to claim 1, further comprising: detecting a silk-printed portion provided on the substrate separately from other portions, and enclosing the detected silk-printed portion. A method of creating inspection area information, characterized in that the above-mentioned pads included in the specified area are identified as pads for the same component.