JPH09213825A - Hybrid integrated circuit device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To restrain generation of sink, improve the strength against a screwing pressure and prevent generation of cracks, by providing a recess portion falling in a substantially perpendicular direction around a screw hole on one surface corresponding to a screw hole thick portion. SOLUTION: At the center of a thick portion 31 on a surface to which a spacer is to be abutted, a recess portion H falling at substantially 90 degrees is provided around a screw hole 30. Thus, since the recess portion H is provided on a portion where sink is to be generated, generation of sink is prevented. Also, since the recess portion H falling at substantially 90 degrees is formed, the strength against a pressure applied to the surface is improved so that generation of cracks may be prevented. The plane of a case member 13 is formed in a substantially rectangular shape, and a columnar boss 33 having the screw hole 31 therein is provided on each of opposite lateral sides of the case member 13. Thus, the case member 13 may be screwed at both ends while screwing with greater tightening strength is enabled.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid integrated circuit device, and more particularly to a structure for improving the strength of a case material around a screw.

[0002]

2. Description of the Related Art Generally, a hybrid integrated circuit device has a substrate to which a semiconductor element or the like is fixed and achieves a predetermined circuit, and a case material having a box shape with the substrate. Resin is injected. For example, Japanese Patent Application No. 5-2825
No. 06 is one example, and FIGS. 3 and 4 are a plan view and a cross-sectional view thereof.

First, in order to fill resin into two regions, that is, a region 10 formed by fixing active elements such as semiconductor chips and passive elements such as resistors, and regions 11 and 12 formed by fixing leads, the injection region is divided into three regions. Is formed. Further, the lead may be provided only on one side, in which case either the region 11 or 12 becomes the region 10 and the injection region becomes two.

FIG. 5 illustrates the contact structure between the case member 13 and the hybrid integrated circuit board, which is usually called a two-piece board. Below the first substrate 14 on which the circuit elements are mounted, a second substrate 15 whose surface is coated with an insulating resin is abutted, and abutted and fixed as shown in FIG. This is provided to enhance the insulation between the hybrid integrated circuit board and the chassis or heat radiating means that abuts the second board. 6 and 7 also describe the contact structure, but the description thereof is omitted here.

Returning to FIG. 3, the portions designated by reference numerals 10, 11 and 12 are injection regions, and the case material 13 abuts the partition walls 20 and 21 that cross the first substrate 14 and the periphery of the substrate. 22, 23, 24 and 25 form three resin injection regions. Specifically, the two injection regions corresponding to the lead disposition region are divided into the partition walls 20, 22, 24, and 2.
5 and 21, 23, 24, 25, and the injection region corresponding to the arrangement region of the active element and the passive element is the partition wall 20,
It consists of 21, 24, 25.

Then, the partition wall and the resin injection space formed by the hybrid integrated circuit boards 14 and 15 are filled with silicone gel as necessary so that strain is not applied to the semiconductor element and the like, and the hatched epoxy resin is filled therewith. It is filled.

[0007]

The part shown in FIG. 4 is
FIG. 4 is a cross-sectional view taken along the line AA of FIG. 3 and illustrates the screw hole 30. As is clear from the figure, it has a thick-walled portion 31 and 31 and is like a columnar shape having a screw hole, and is formed thicker than the thickness of the case indicated by reference numeral 32. Generally, this place is called a boss.

That is, the boss 33 shown in FIG. 4 is thick in the horizontal and vertical directions. Therefore, mold with a mold,
When solidified, shrinkage of the resin causes shrinkage as indicated by the symbol S. In FIG. 3, it is a region indicated by X. Since the printed circuit board or the like is firmly fixed to the surface having the sink mark via the spacer or the like, the contact area is reduced only at the sink portion, so that the pressure applied to this surface becomes large. Further, the portion shown by the mesh in FIG. 3 is a confluence point of the resin flow called weld, and the joint portion formed by solidifying the confluence point has a weak mechanical strength, and when external pressure such as screwing is applied. However, there was a problem that cracks were likely to occur.

[0009]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems. Firstly, a surface corresponding to a thick portion of a screw hole on one surface is substantially surrounded by a screw hole. This is solved by having a recessed portion that falls at 90 degrees. The sink
The size is different depending on the molding conditions and the like, and there is a problem in appearance, but since the recessed portion is provided in the portion where the sink mark occurs, the sink mark according to the related art does not occur. Further, the sink mark described in the section of the problem is gently recessed from the periphery toward the central part thereof, and the present invention forms a recessed portion that substantially drops by 90 degrees. The principle has not been clarified, but for example, a pencil is placed at a right angle and pressure is applied from above.
I suspect that the same principle that a pencil stands upright at a right angle has the same strength as the pencil standing upright and applying pressure from above. In other words, when falling at a right angle, the strength against the pressure applied to the surface is improved, and it is hard to apply to the weak portion of the sink mark, so that the occurrence of cracks can be prevented.

Second, the plane of the case material is solved by providing substantially rectangular shapes and cylindrical bosses each having a screw hole therein on opposite sides of the case material. The case material can be screwed at both ends, and the case material can be made strong without sink marks, and the screwing can be performed with increased tightening strength. Thirdly, the problem is solved by providing a recessed portion at a place where a weld is generated around the screw hole when molding the case material on the surface corresponding to the thick portion of the screw hole on one surface. .

Since the place where the weld is generated is mechanically weak, cracks are likely to occur if the pressure is concentrated on this part during screwing. However, by recessing this portion (particularly the surface on which it concentrates), it does not come into contact with the spacer or the like when screwing, so that the pressure applied by screwing becomes difficult to apply.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIG.
This will be described with reference to FIG. 5 to 7
Shows the contact relationship between the case material and the hybrid integrated circuit board. First, the hybrid integrated circuit board will be described. That is, a conductive means is formed on the surface of the insulating-processed first substrate 14, and the conductive means may be a wiring pattern, a land, a pad, a bonding area, or the like. A semiconductor chip or a semiconductor IC is soldered to this land, and a resistance or the like is fixed to the wiring pattern by printing, or a chip resistor or a chip capacitor is fixed to the wiring pattern by soldering. It is omitted here for convenience of drawing.

The above-mentioned first substrate 14 may be a ceramic substrate, an insulating resin substrate such as a printed substrate, a metal substrate whose surface is subjected to an insulation treatment, or a glass substrate. Here, an Al metal substrate 14 whose surface is anodized and to which aluminum oxide is applied is employed, and the conductive means is applied by hot pressing via an adhesive resin layer such as polyimide.
Naturally, the semiconductor element is mainly a bare chip, and is a diode chip, a transistor chip, an LSI chip, or the like, and in addition, parts such as a resistor, a transformer, or a capacitor are mounted on the hybrid integrated circuit board as necessary.

Chip and conductive path (bonding area)
If necessary, a fine metal wire is wire-bonded to achieve a predetermined circuit. A plurality of lead connecting pads extending from the circuit are arranged on at least one side of the first substrate 14, and the leads are electrically connected to the pads. Here, as can be seen from FIG. 1, 11 and 12 correspond to the areas where the faces of the leads appear, and the leads are connected to the opposite sides. This lead is almost L-shaped.

A second substrate 15 is adhered to the lower layer of the insulating first substrate 14 in consideration of heat dissipation and dielectric breakdown due to attachment to a chassis. That is, depending on the circuit, a large current flows through the semiconductor chip, and a metal substrate is used to radiate the heat generated thereby to the outside. Also, when the chassis is directly attached to the substrate 14, there is a problem that a large voltage is applied through the substrate 14 and the internal semiconductor chip or the like is destroyed.
The second substrate 15 is formed by anodizing the l substrate and insulating it, and then applying a polyimide resin to the second substrate 15 as in the first substrate. This is because an insulating film is sandwiched between the ground wiring of the first substrate 14 and the first substrate 14, the Al substrate is exposed by etching or the like, and the substrate and the ground wiring have the same potential to eliminate the capacitance. However, when noise is applied to the chassis, noise is applied to the semiconductor chip and the like via the substrate 14 and the ground wiring.

If this destruction is not considered, the arrangement of the hybrid integrated circuit board 14 as shown in FIGS. 6 and 7 may be used. As can be seen from the boss 33 in FIG. 2, the boss 33 extends to the back surface of the substrate. That is, the second substrate 15 in FIG. 5 and the first substrate 1 in FIG.
In No. 4, the boss portion is hollowed out, and the face is exposed on the back surface and surface position of the substrate through the hollowed portion. Next, FIG.
The case member 13 will be described with reference to FIG. Here, the configuration of FIG. 5 will be described. In order to mainly fill the three regions of the semiconductor chip or the circuit element mounted region and the lead fixed region with the resin, the case member 13 is made of the first material.
Partition walls 20, 21 that cross the substrate 14 of the first substrate 1
Partition walls 22 and 23 that come into contact with the upper and lower side edges of No. 4, and the second
The box-shaped injection space of the resin is formed by the partition walls 24 and 25 that come into contact with the left and right sides of the substrate 15. First of all, partition walls 20, 21
Is for separating the mounting area of the semiconductor chip and the fixing area of the leads, and two partitions are provided because the leads extend to the left and right sides. However, if the lead is provided only on one side, one of the partition walls is omitted. Further, when the silicone gel is not filled, the epoxy resin is injected into the entire area, so that the partition walls 20 and 21 are not necessarily limited to the three or two regions.
It may be an area.

When the leads are extended to the upper and lower side surfaces, 11 and 12 are closed, and instead, the partition walls 22 and 23, which are the areas where the faces of the leads are exposed, are hollowed out. Therefore, the box-shaped resin injection space on the mounting area of the semiconductor chip is composed of the partition walls 20, 22, 24, 25, and the box-shaped resin injection space of another lead is the partition walls 21, 23, 24, 2.
Made of 5 In consideration of the strain on the element and the strain on the metal thin wire, the space above the semiconductor chip is filled with silicon gel from the front side of the paper surface, and subsequently with a solidifying resin such as polyimide. In the resin injection space of the lead, the silicone gel is omitted and only the epoxy resin is injected. As described above, the silicone gel prevents distortion of the thin metal wires or the like connected to the semiconductor chip or the like and is not always required to be injected.

Since this apparatus is mounted on an external board such as a printed board, the leads are L-shaped and exposed from the injected resin. The leads and the electrodes provided on the printed circuit board are firmly attached via the screw holes formed in the partition walls 24 and 25. Here, a heat dissipation plate or chassis may be attached to the second substrate in consideration of heat dissipation.

The portion shown in FIG. 2 is a sectional view taken along the line AA in FIG. 1, and illustrates the portion of the screw fastening hole 30. As is clear from the figure, it has thick parts 31, 31,
It is as if it had a cylindrical shape with screw holes, and was formed thicker than the thickness of the case indicated by reference numeral 32.
Generally, this place is called a boss 33. That is, FIG.
The boss 33 is thick in the horizontal and vertical directions. Therefore, when the resin is molded with a mold and solidified, shrinkage of the resin causes shrinkage as shown by symbol S in FIG.

The present invention is intended to prevent such sink marks, and is to provide a recessed portion H in the thick portion of the surface on which the spacer abuts. The thick portion 31 is between the circle of the solid line 30 showing the screw hole of FIG. 1 and the circle of the dotted line surrounding this, and this is the boss 3
3. A recessed portion that is provided so as to surround the screw hole and drops substantially 90 degrees is provided at the center of the thick portion. The shape of the recessed portion H is different between the right side and the left side, but since it is desired to draw two types at a time, it is only written, and the left side and the right side are actually the same. Further, the recessed portion may surround all.

That is, since the recessed portion is provided in the portion where the sink mark is generated, the conventional sink mark is not generated. Further, the sink mark described in the section of the problem is gently recessed from the periphery toward the central part thereof, and the present invention forms a recessed portion that substantially drops by 90 degrees. For example, it is conjectured that it is the same principle that standing at a right angle has the strength between a pencil standing at a right angle and applying pressure from above, and a pencil standing at an angle and applying pressure from above. To do. In other words, when it falls at a right angle, the strength against the pressure applied to the surface is improved, and the occurrence of cracks can be prevented.

There are two boss positions on the left and right,
I'm not particular about it. For example, one may be provided in the center of the substrate, or either one may be provided on the left or right, and the number thereof is not limited.
However, in general, in order to prevent the rotational movement of the hybrid integrated circuit device and the like, the number is two on the left and right or four on the left and right. It also has the following features. Considering the die molding, for example, the resin injection ports are provided at one or more locations in the approximate center of the right side surface (a plane perpendicular to the paper surface) of FIG. 1, here at two locations (positions indicated by E). There is. Therefore, the resin flow wraps around the left boss as shown by the arrow, and a welded portion, a weld, is generated in the vicinity of the root of the lead line of the symbol H. Due to this depression, one surface of the weld portion is depressed as shown in FIG. 2, so that no direct force is applied to this weld portion. Therefore, the weld portion and the weld portion can be removed at the surface portion, the spacer can be connected to the case in a flat manner, and the pressure applied when screwing is not applied to the recess portion, so that the crack can be prevented.

Furthermore, the present invention does not consider the sink mark at all,
It is also effective to provide a recess on the surface where welds occur. The recessed portion may be provided so as to substantially remove the portion shown by the mesh in FIG. 3 or to remove a part thereof. If a pressure is concentrated on the welded portion when screwing, cracks are likely to occur. However, by recessing this portion, it does not come into contact with the spacer or the like when screwing, so that the pressure applied by screwing is less likely to be applied.

As described above, the hybrid integrated circuit device is brought into contact with the electrodes of the printed circuit board and the terminals of the mounting partner, and moreover, the leads are inserted into the through holes of the printed circuit board. Although the leads are fixed by soldering, the screw holes are aligned with the screw holes of the printed circuit board, and screws are attached through the screw holes.

[0025]

As is clear from the above description, the first
On the surface corresponding to the thick portion of the screw hole on one surface, if a recessed portion that drops substantially 90 degrees around the screw hole is provided,
Since the recessed portion is provided in the portion where the sink mark is generated, it is possible to suppress the conventional sink mark generation. Moreover, the depression is substantially 9
Since it is dropped to 0 degree, the strength against the pressure applied to the surface is improved and it is difficult to apply to the sink mark portion having weak strength, so that the generation of cracks can be prevented.

Secondly, when the case material is formed into a substantially rectangular flat surface and cylindrical bosses having screw holes therein are provided on opposite sides of the case material, both ends of the case material are formed. It is possible to fix with a screw, and it is possible to realize a strong case material without sink marks, and it is possible to fix a screw with higher tightening strength. Thirdly, on one surface (the surface where the symbol H is shown) corresponding to the thick portion of the screw hole, a recessed portion is provided at a place where a weld occurs when the case material is molded. As a result, when the screws are screwed, they do not come into contact with the spacer or the like, so that the pressure applied by the screws is less likely to be applied. Therefore, cracks generated on the weld surface can be prevented.

[Brief description of drawings]

FIG. 1 is a plan view illustrating a case member according to an embodiment of the present invention.

FIG. 2 is a sectional view taken along line AA of FIG. 1;

FIG. 3 is a plan view illustrating a conventional case member.

FIG. 4 is a sectional view taken along line AA of FIG. 3;

FIG. 5 is a diagram illustrating a contact relationship between a hybrid integrated circuit board and a case member.

FIG. 6 is a diagram illustrating a contact relationship between a hybrid integrated circuit board and a case member.

FIG. 7 is a diagram illustrating a contact relationship between a hybrid integrated circuit board and a case member.

[Explanation of symbols]

 13 Case Material 14 First Substrate 15 Second Substrate 30 Screw Hole 31 Thick Part 33 Boss H Recess

Claims (3)

[Claims] 1. A circuit comprising a hybrid integrated circuit substrate having at least an insulating surface, a conductive pattern provided on the hybrid integrated circuit substrate, and a passive element or an active element electrically connected to the conductive pattern. An element, a lead electrically connected to a conductive pattern extending to one side of the hybrid integrated circuit board, and a case member that is in contact with and fixed to the periphery of the hybrid integrated circuit board on which the circuit element is mounted. In the hybrid integrated circuit device having, the case material has a crossover screw hole from one surface to the other surface against which the hybrid integrated circuit board abuts, and has a wall thickness all around the screw hole. And a boss formed integrally with the one surface, and a recess corresponding to the thick portion of the screw hole on one surface of the boss has a recess portion that is substantially 90 degrees down to surround the screw hole. apparatus. 2. The hybrid integrated structure according to claim 1, wherein a plane of the case member is substantially rectangular, and cylindrical bosses each having a screw hole are provided on opposite sides of the case member. Circuit device. 3. A circuit including a hybrid integrated circuit substrate having at least its surface having an insulating property, a conductive pattern provided on the hybrid integrated circuit substrate, and a passive element or an active element electrically connected to the conductive pattern. An element, a lead electrically connected to a conductive pattern extending to one side of the hybrid integrated circuit board, and a case member that is in contact with and fixed to the periphery of the hybrid integrated circuit board on which the circuit element is mounted. In the hybrid integrated circuit device having, the case material has a crossover screw hole from one surface to the other surface against which the hybrid integrated circuit board abuts, and has a wall thickness all around the screw hole. The boss is integrally formed, and a recessed portion is provided in a portion corresponding to the thick portion of the screw hole on the one surface at a place where a weld is generated around the screw hole when the case material is molded. Special And the hybrid integrated circuit device.