JPH09205170A - Etching correcting pattern forming apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make it possible to form accurate correction data without depending upon human experience by forming the correction margin decided by an experience fule at a first trial product by using set correction data, and reflecting the etching margin or error to the correction data for forming a seocnd trial product. SOLUTION: The etching correcting pattern forming apparatus comprises an optical microscope 32 set to a sample mounting unit 30, and an image processor 36 for processing the color video signal from a CCD camera 34. Correction margin is added to the CAD data of a product designing size pattern to form the correcting data as the principle of a resist pattern. The image data of the present article pattern etched, the CAD data and the correction data are superposed by bringing the corresponding reference points into coincidence, and collated. New correcting data for forming next resist pattern is formed by utilizing the etching margin or error. Thus, the person who has not particularly experienced can simply form the accurate etching correction pattern.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an etching correction pattern corresponding to a resist pattern used as a mask when a metal material is etched to manufacture an etching product having a fine pattern such as a lead frame. The present invention relates to an etching correction pattern creating apparatus suitable for application when creating from CAD data of a dimension pattern.

[0002]

2. Description of the Related Art ICs to be mounted as etching products
There is a lead frame used to electrically connect to the (integrated circuit) chip.

FIG. 36 shows an example of a lead frame for one chip as viewed from one side. A die pad (island) 10 for mounting a chip (not shown) is located at the center of the lead frame. The die pad 10 is supported by an outer frame 12 via a tab suspension bar 14, and an inner lead 16 is arranged around the die pad 10 with its tip close to the die pad 10, and an outer lead continuous with the inner lead 16 is provided. 18 is the above-mentioned outer frame 1 via the dam bar 20 etc.
Supported by 2. Also, the inner lead 16 has
A fixing tape 22 made of plastic is attached to prevent deformation of the leads 16. The broken line in the figure is the mold line.

Taking the lead frame as an example, an outline of the steps from etching product design to product completion is shown in FIG.
It looks like 7.

CAD of lead frame pattern design
(Computer Aided Design), first, CAD data of the same product (A) as the target product size is created in the product pattern design process of CAD1, and then the actual etching is performed in the etching correction process of CAD2. The correction allowance for the side etching, which is excessively removed from the width of the resist pattern in the process, is defined as (A) product dimension C
Addition to the AD data creates (B) working dimension CAD data as a prototype of the resist pattern, and in the next pattern manufacturing step, this working dimension CAD data is drawn by a laser plotter to create a (C) glass original plate pattern. . This original plate pattern is created for both the front and back surfaces of the lead frame.

Then, using the glass original plate as a mask, the resist coated on the metal material such as the copper plate which is the base material of the lead frame is exposed (baked),
By developing and burning (curing) (D) to form a plate-making pattern (resist pattern), etching for removing the metal material in the exposed portion is performed, and then the adhering resist is peeled off. A lead frame, or (E) product pattern is obtained.

In the manufacturing process of the lead frame,
The (E) product pattern is preferably the same as the (A) product dimension CAD data which is the design pattern. Therefore, (B) processing dimension CAD data (this is (C) glass original plate pattern, which is designed by adding a correction allowance to this (A),
The size difference between (D) the pattern having the same size as the plate-making pattern) and (E) above is large, and usually has a difference of several tens of μm.

Similarly, as another etching product to be microfabricated, there is a shadow mask for a color television. In comparison with this, the lead frame has an irregular shape and the post-process performed after the etching is complicated. It has the feature of being

Further, as a feature of the lead frame, there is a gap (space to be removed by etching) between the island 10 to which the chip is attached and the tip of the inner lead to be wire-bonded, and the etching liquid easily enters there. Although the tips of the inner leads are likely to be etched and are likely to be tapered, a sufficient tip width dimension is required for wire bonding.

As described above, the CAD data (B) for forming the plate-making pattern (D), which serves as a mask for etching a lead frame which is difficult to process, is side-etched in excess of the resist pattern as described above. It is created by performing a correction of adding a dimension corresponding to the etching allowance to the product dimension CAD data of (A) as a correction allowance.

Conventionally, based on experience, the correction allowance used for etching correction in the case of the above lead frame is, for example, uniformly set to a half of the plate thickness, and the inner lead tip and the like are locally set. I was making fine adjustments.

As described above, when the product design pattern is simple, the correction shape and the correction amount are empirically determined, so that the work of forming the etching correction pattern is considerably automated by forming a computer program. ing.

[0013]

However, if the design dimension pattern of the etching product has not been experienced yet, and the etching correction pattern (correction data) has to be created for a fine pattern having a fine pitch, the experience is required. Since the rule does not apply as it is, it becomes impossible to automate the correction work by the automation program.
Therefore, in such a case, the pattern designer creates a correction pattern by relying on past experience, based on an empirical rule, and also performs trial production of a product based on the correction pattern and pattern correction based on the trial production result. As a result of repeated trial and error, a large delay occurs before the completed correction pattern is put on the production line, and the product delivery time may be delayed, for example, by several months.

The present invention has been made to solve the above-mentioned conventional problems, and even a person who has no special experience can easily create a highly accurate etching correction pattern and automate the creation work. An object of the present invention is to provide an etching correction pattern creation device that can perform the etching correction pattern creation.

[0015]

SUMMARY OF THE INVENTION According to the present invention, means for creating correction data as a prototype of a resist pattern by adding a correction margin to CAD data of a product design dimension pattern, and a resist having the correction data as a prototype. With the pattern as a mask,
A means for inputting an image of a physical pattern created by etching, image data of the input physical pattern,
A means for matching and matching the CAD data and the correction data at the corresponding reference points, and C
A means for calculating a point on the contour of the image data of the actual pattern corresponding to the inspection point set on the AD data or the correction data, and a point on the calculated contour as a starting point on the corresponding correction data. The means for generating a vector with the inspection point as the end point, and the generated vector,
A means for translating to a position where the start point corresponds to the inspection point on the corresponding CAD data, and a means for creating new correction data for creating the next resist pattern using the end points of each vector after the parallel movement. By solving the above problem, the above problem is solved.

That is, in the present invention, the first trial product is created, for example, using the correction data in which the correction allowance determined by the empirical rule is set, and the trial product (actual pattern) is image-measured, Since the error from the actual etching allowance or the design dimension is obtained and the etching allowance or the error is reflected in the correction data for making the second prototype, it is highly accurate without depending on human experience. Since it is possible to create various correction data, it is possible to create the final correction data with one correction if it is early.

Even when the second and subsequent corrections are necessary,
Since it is only necessary to repeat the same operation, highly accurate correction data can be created without depending on human experience.

[0018]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described in detail below with reference to the drawings.

FIG. 1 shows a CA according to the first embodiment of the present invention.
It is a block diagram which shows schematic structure of D system (etching correction pattern preparation apparatus).

The CAD system is a sample (actual product)
A sample mounting device 30 for mounting a sample, an optical microscope 32 for enlarging a sample set in the mounting device 30, a CCD camera 34 for receiving an image observed by the microscope 32 and converting it into a color video signal, and the CCD An image processing device 36 for processing a color video signal from the camera 34,
A TV monitor 38 capable of color-displaying image data processed by the image processing device 36, and a raster / vector conversion function for generating CAD data from image data input from the image processing device 36 in addition to a normal drawing function. Or 2
An engineering workstation (EW) that constitutes a CAD device having the functions of superposing the above CAD data, mutual positional movement (shift) between them, and dimension measurement.
S) 40.

Further, in the above CAD system, the sample mounting device 30 includes a manual rotary stage 42 having a sample mounting portion (not shown), an XY stage 44 for moving the sample in the plane direction, and a sample in the vertical direction. The XY stage 44 and the Z stage 46 are configured to move, and the XY stage 44 and the Z stage 46 operate by receiving a command from the workstation 40 via the interface RS232C.
The Y stage controller 48 and the auto focus controller 50 are driven and controlled respectively. Further, a laser position detector is attached to the XY stage 44, and the position measurement in the XY directions is performed by a laser scale counter 52 which is also operated by a command from the workstation 40, and the measured value is fed back to the workstation 40. Then, the position measurement value of the XY stage 44 is corrected by the XY stage controller 48.

Further, the autofocus controller 5
An image signal used for autofocus is directly input to CCD 0 from the CCD camera 34, and an autofocus monitor (not shown) separately provided with an image captured through the microscope 32. It is possible to directly view the image on the TV monitor 38 from the autofocus controller 50 by using the monochrome (B /
The video signal of W) is input.

FIG. 2 shows the mounting device 30 and the optical microscope 3.
2 is a perspective view showing the appearance of the CCD camera 34 and the CCD camera 34,
The XY stage 44 shown in FIG.
An X drive motor 54 which is composed of an A stage and a Y stage 44B and is connected to the stage controller 48.
The A and Y drive motors 54B are movable in the X and Y directions, and the rotary stage 42 for mounting the sample is mounted on the Y stage 44B so that it can be manually rotated.

In addition, the X stage 44A and the Y stage 44
Scale patterns 56A and 56B each made up of a fine diffraction grating are attached to the side surface of B, and laser light is used to scale the positions of both stages 44A and 44B moved by the X drive motor 54A and Y drive motor 54B. , 56B are provided with an X position detector 58A and a Y position detector 58B for irradiating and detecting the laser scale counter 5B.
2 are connected.

Further, the Z stage 46 is arranged below the X stage 44A, and the Z stage 46 can be moved back and forth in the vertical direction by a Z drive motor 54C. It is connected to the auto focus controller 50, and the distance between the objective lens 32A of the optical microscope 32 and the sample is increased or decreased based on a control signal from the controller 50 to perform auto focus on the microscope 32. There is.

Below the Z stage 46, a transmission light source unit 60 which also serves as a support is arranged.
0 has a built-in transmissive light source (not shown) that projects light from below onto the microscope 32, and a transmissive light source switch 60A and a light amount adjusting volume 60B are attached to its side wall.

Further, an epi-illumination light source unit 62 is attached to the microscope 32, an epi-illumination light source (not shown) is built in the unit 62, and an epi-illumination light source switch 62A and a light quantity adjusting volume 62B are provided on a side wall of the unit 62. And are attached.

Therefore, when capturing the microscopic image of the sample with the CCD camera 34, it is possible to use at least one of the light source of transmission and epi-illumination.

Next, the image processing device 36 will be described with reference to FIG.
The features of the configuration and the processing function will be described. The processing device 36 has an image input / processing / binarization processing function, for example, S manufactured by Seiko Denshi Kogyo Co., Ltd.
V-2110 (trade name) can be used.

The image processing device 36 is the CCD camera 3
Each of the R (red), G (green), and B (blue) signals input from 4 can be stored for each screen, and 3 for R image, G image, and B image each surrounded by a rectangle are stored. Monochrome memory for storing one frame memory and Y (luminance) signal
One frame memory for W image and H obtained by processing the R, G, B signals by a 3 × 3 matrix operation unit
(Hue), S (saturation), and V (luminance) image data are stored in the three frame memories for each image of H, S, and V, and the R signal and B signal are processed by the image arithmetic operation unit. A total of eight frame memories of the RB difference image frame memory that stores the difference image data of both obtained as described above are provided.

The reason why such different color signals are used is as shown in the table of FIG. 4 for the actual sample (actual pattern).
Depending on the material used and the type of image required, the type of light source suitable for use and the optimum color signal may differ.

That is, there are two types of original patterns, one for the front side and the other for the back side of the lead frame. Both of them are glass dry plates (the pattern is formed on the glass plate with an opaque film), so that a black and white transmission image is obtained. The frame memory of the B / W image is the optimum plane because it can be obtained with good contrast.

Further, since the plate making pattern is a resist pattern formed on the front and back surfaces of the lead frame,
It depends on the type of metal material and the type of resist, and it is necessary to use a reflected light source to receive the reflected image.

When casein is used as the resist, since the resist has a reddish color at the stage of heating and curing after development, the 42-alloy of silver-white material is used as the optimum plane for the B image frame. Although a memory can be used, the copper (Cu) material itself has a reddish color, and the difference is not clear in the B image. Therefore, the frame memory of the V image is the optimum plane.

When a blue-based dry film is used as the resist, the R image is optimal for 42 alloy, but the frame memory for the RB difference image is optimal plane for copper material.

In the case of the product pattern after the etching is completed and the resist film is removed, the penetrating transmission image and the reflection images on both the front and back surfaces can be received, and the transmission image is black and white B as described above. / W when the image is a reflection image, H
(Hue) The image becomes the optimum plane.

Further, among the product patterns, when the fixing tape 22 (denoted as TP in the table) made of polyimide resin is attached to the inner lead as shown in FIG. 36, the tape is red. Since the transparency is high in the system, in order to obtain a completely transparent image where the image is not input on the tape, B
The / W image becomes the optimum plane. However, it is necessary to appropriately set a threshold value for binarization described later.

On the contrary, in order to capture a transmission image including the tape, the blue image which is opaque to the tape is suitable, so that the B image becomes the optimum plane.

Further, when only the tape portion is desired to be photographed, the H image becomes the optimum plane for the reflection image using the epi-illumination light source.

As described above, when the optimum plane to be used is selected according to the object to be captured as an image, the corresponding image signal is input from the eight frame memories to the binarization processing section. Binarization processing is performed on the image data input by the binarization processing unit. The threshold value set at that time can be arbitrarily set from the gradation values of 0 to 255, for example.

Morphological processing for removing black spots or white spots on the image caused by fine roughness of the surface of the actual pattern, etc., on the image data binarized by the binarization processing section. I do. However, in the case of a transmission image, such a spot does not occur, so that it is not necessary to perform it.

Whether the spot to be removed is white or black is set, a predetermined number of morphology is set, and the image is expanded / contracted the number of times to remove the spot.

Next, the binary image obtained by performing the above processing is the workstation 4 which functions as a CAD device.
The binary image is used for various processes such as collation described later. As the workstation 40, normal CAD software (for example, CAD software Medusa (trade name) of Computer Vision Corporation) operates,
For example, Sun Microsystems' Sparc Station 1
0 (brand name) can be used.

Further, in the CAD system (etching correction pattern forming apparatus) of the present embodiment, the workstation 40 is a correction which becomes a prototype of a resist pattern created by adding a correction allowance to the CAD data of the product design dimension pattern. Means for setting a plurality of inspection points on the data, sub-inspection points corresponding to the inspection points on the CAD data, and points on the contour of the physical pattern corresponding to the set inspection points. And means for generating a vector having the calculated point on the contour as the starting point and the corresponding inspection point as the end point, and the generated vector for the sub-inspection point on the CAD data to which the starting point corresponds. Next, using the means for parallel translation and the end point of each vector after translation, Means for creating a new correction data for creation, but are constructed by software.

In addition, in principle, the sub-inspection point corresponding to the inspection point is selected as the point having the shortest distance from the inspection point. Further, the point on the contour of the actual pattern corresponding to the inspection point is calculated as the point having the shortest distance from the inspection point.

Next, the operation of this embodiment will be described in detail with reference to the flowchart of FIG.

In the CAD system of this embodiment, new correction data can be automatically created according to the procedure of the flowchart of FIG. 5 described in detail below.

First, CAD data of the product design dimension pattern is created (step S1) and saved in a file, and an automatic correction program or the like is used to perform etching correction based on the empirical rule on the CAD data for trial manufacture. Correction data is created and stored in a file (step S2). This correction data is created by uniformly adding, for example, a dimension of 1/2 of the plate thickness to the CAD data. Further, at this stage, for example, one frame of correction data in which four chips are connected is created.

Next, using the correction data of one frame created in the above step S2, a resist film coated on the metal plate is subjected to imposition and drawing by the laser plotter by a required number, and exposed and developed to form a resist pattern. After the formation, the metal plate is etched to create a first prototype (step S3).

Then, the actual pattern of the created lead frame prototype is input as an image. At that time, (1) sample setting, orthogonal correction, (2) island center measurement,
(3) The AF condition and the image processing condition such as the image processing condition setting are set (step S4).

Specifically, the setting of the image processing conditions and the like is performed in steps S11 to S1 of the flowchart shown in FIG.
It can be performed according to the procedure of 6.

First, before starting a specific operation, basic setting and adjustment of system functions are performed. In particular, when the lens of the microscope 32 or the camera 34 is replaced, it is necessary to perform orthogonal adjustment of the camera 34 and the XY stage 44. This is done by manually rotating the camera mount. In this orthogonal adjustment, as shown in the monitor screen in FIG. 7, a small mark (may be a small dust) indicated by an X mark on the sample mounting portion is used as a reference point, and the range is within the range of the monitor screen. If the reference point does not deviate from the reference line (horizontal line) on the monitor when it is horizontally moved in the left and right X directions, it can be performed by setting OK.

Further, in order to provide an image measuring function, it is necessary to measure the size per pixel and the screen feed pitch. This is one screen size (512 ×
In measuring the stage feed value corresponding to 480 pixels), specifically, FIG.
As shown in, the reference points indicated by X are moved to four points on the reference line at positions of ¼ and 3/4 in both the X direction and the Y direction on the screen, and the X direction at that time, The stage moving distance in the Y direction is determined by the laser scale counter 5
It is possible to measure with high accuracy by using the count value of 2. In this case, the size per pixel is Xs /
256, Ys / 240, and the screen feed pitches in the X and Y directions are calculated as 2Xs and 2Ys.
For the measurement of the above dimensions and pitch, the feeding pitch by the XY stage drive motor (step motor), for example, 1 μm may be used without using the laser scale counter.

On the premise that the above preparation operation is completed, the sample setting is performed in step S11 of FIG. Specifically, as shown in FIG. 2, the sample (lead frame) is placed at a predetermined position on the rotary stage 42.
While wearing the, while watching the image of the sample taken by the operator from the camera 34 displayed on the monitor 38,
The rotary stage 42 is operated to perform orthogonal adjustment of the sample.

If the monitor screen displaying the horizontal edge of the sample input by the CCD camera 34 whose orthogonal adjustment with the XY stage 44 has already been completed is as shown in FIG. When the rotary stage 42 is manually rotated to a position where the above-mentioned edge does not deviate from the horizontal reference line even when largely moved in the X-axis direction,
The orthogonal adjustment between the sample and the XY stage 44 is performed.

Then, in step S12, the light source to be used is selected and the light amount thereof is adjusted. That is, the transmission light source or the epi-illumination light source is selected by turning on either the switch 60A or the switch 62A. The desired light source is selected, and the light amount is adjusted by the light amount volume of 60B or 62B so that the brightness signal falls within the specified range by looking at the monitor of the autofocus device. In some cases, both light sources can be used at the same time.

Next, in step S13, the orthogonality of the sample is measured in order to make a more accurate correction based on the measured value. Here, similarly to the island center measurement performed in the next step 14, the coordinates of two points which are considered to be horizontal and two points which are considered to be vertical are measured.

FIG. 10 shows the above two measurement points H1 and H.
2, V1, V2 and the field of view of the CCD camera 34 at the time of capturing the image of each point, and the shaded portion corresponds to the frame (actual). Here, two horizontal points H1 and H
The point on the edge of the frame is set to 2 and the vertical two points V
1 and V2, points on the edge of the vertical groove provided to promote etching are used. In this step, it is premised that the orthogonality of the material is already adjusted as much as possible by operating the rotary stage or the like in step S11. That is, the edge that was seen near the center of the field of view at the point H1 is seen almost at the center when the stage is moved in the horizontal direction and the field of view is moved to the point H2. Keep it down. Although it corrects, it is not preferable that the orthogonality deviates from the field of view.

The coordinates of the above four points measured under the above conditions are H1 (X _H1 , Y _H1 ), H2 (X _H2 , Y _H2 ) V1 (X _V1 , Y _V1 ), V2 (X _V2 , Y _V2 ) and the coordinates of the center of the island to be calculated next are (Xc,
Yc), the measurement coordinates (x, y) of the point represented by P in FIG. 10 are obtained as (x ', y') corrected by the following equations (1) and (2).

X ′ = − {(X _V2 −X _V1 ) / (Y _V2 −Y _V1 )} × (y−Yc) + x (1) y ′ = − {(Y _H2 −Y _H1 ) / (X _H2− X _H1 )} × (x−Xc) + y ... (2)

After the measurement for orthogonal correction in step S13 is finished, the island center is designated in step S14, the AF condition is set in step S15, and step S16.
Then, the image processing condition setting is executed.

In steps S14 to S16, a menu is selected on the menu screen displayed on the monitor screen (each can also be displayed on the same screen as a window) as schematically shown in FIGS. 11 to 13, for example. It is executed by

First, in step S4, the center of the island (die pad) captured as an image is designated (origin calculation) using the origin calculation function of the apparatus of this embodiment.

In this embodiment, the island 10 is shown in FIG.
And the monitor screen on the right side thereof, the point P _{T at} the upper end of the island 10 and the point P _B at the lower end of the island 10 should be input so as to coincide with the center of the camera input screen in the Y-axis direction. According to the respective Y coordinate values Y _T , Y
_B is calculated, and by inputting the point P _L on the left end and the point P _R on the right end at the center of the screen in the X direction, the X coordinate values X _L and X _R are calculated. ing. Therefore, from the coordinate values of the edge positions corresponding to the boundaries of these four black and white areas (the black parts are indicated by diagonal lines),
Coordinates of the center of the island (Xc, Y
c) is calculated by the following equation.

Xc = (X _R + X _L ) / 2, Yc = (Y _T + Y _B ) / 2 (3)

Since the CAD system of this embodiment has an edge detection function and is capable of automatically recognizing an edge, the edges of the black and white boundaries on the left, right, top, and bottom are determined as described above, the X coordinate, the Y coordinate on the screen. Even if it does not match the center of the coordinates, simply capture each edge part in the screen, the coordinate value of each edge is detected, the calculation is automatically executed by the above formula,
Similar center designations can be made. By specifying the center of the island of the input image in this way, the center of the island of the design pattern of the CAD data can be aligned with the center of the island, so that the overlay display can be accurately performed.

Normally, the lead frame for one chip is basically symmetrically designed with the center of the island as the origin, so CAD data is described (designed) with the center of the island as the origin, or Since the coordinates are clearly shown in the data, by making the origin calculated by the above-mentioned method coincide with the center of the island of the CAD data on the CAD device, the dimensional difference is large, for example, the processing size pattern and the etching pattern, It becomes possible to perform accurate alignment automatically.

The sample orthogonality measured in the above step S13 and the information about the center of the island on the image designated in S14 are stored in the setting file XY.

Then, in step S15, conditions for autofocus (AF) are set. Here, the mode is selected and the limit value is set. In this mode, one reference point (position) is determined in the Z-axis direction applied to a flat sample, and the 2WAY method in which the Z stage 46 is finely moved vertically to focus on the reference point, and a surface with large unevenness is used. Z stage 4 up to a predetermined lower position beyond the focal point to be applied
From the state where 6 is lowered, the stage 46 is gradually raised to bring the sample closer to the lens and focus 1 WAY
There is a system and selection of a lens to be used from objective lenses (five types in this embodiment).

The limit is an approach limit distance set to prevent a collision between the lens and the sample during autofocus. In addition, here, 1 WAY is used for the product sample with severe unevenness as the mode, and 2 W when it is not.
Select AY, use a 20x objective lens as a lens to capture with a resolution of 1 μm / 1 pixel, and use a focus parameter setting file for that. 2 mm from the origin as the limit value, the maximum value of the focus working distance is 1 limit. Set a normal default value such as "/ 2". The conditions set in this step are stored in the setting file AF.

When the 2WAY method is selected as the AF mode, the edge portion (flat portion) of the sample is made to enter the screen, and the autofocus is activated or the Z stage 46 is manually moved to determine the focus origin. (Z coordinate value of the reference point) is also set. The autofocus is executed by moving the Z stage 46 up and down slightly with reference to this position as described above.

In the next step S16, conditions for image processing are set. The content is different from that shown in FIG.
Select the input plane to use from the eight types of image frame memory shown in, set the binarization threshold when creating a binary image, and remove unnecessary white or black points from the image data. It is a morphological condition. The conditions set in this step are stored in the setting file SV.

Next, returning to FIG. 5, the inspection points are marked (step S5). This is claim 3.
This corresponds to the process of setting the inspection points specified in.
Hereinafter, the reference point for calculating the corresponding point on the contour of the image data of the actual pattern will be described as the inspection point, and the point set corresponding to the inspection point will be described as the sub-inspection point.

The marking of the inspection points performed in step S5 will be described with reference to FIG. This figure 1
5A shows one inner lead of the lead frame, the inside is CAD data of the product design dimension, and the outside is correction data created by uniformly adding a predetermined correction allowance according to an empirical rule.

In this example, a plurality of inspection points are set by marking on the correction data read from the file. This inspection point is each original vertex data (coordinate data set when creating the correction data) marked with reference symbols A to D in the figure, and other point data set based on these vertex data. Composed of and. Specifically, as illustrated in groups 1 and 2, for example, image processing areas defined by one field of view of the CCD camera 34 are grouped as a unit, and the line segment areas are equally divided within the group. By doing so, it is automatically set.

Further, here, the sub inspection point corresponding to the above inspection point on the correction data is set on the CAD data read from the file. This sub-inspection point is each point of the shortest distance from each original vertex data set at the time of design, which is marked with A'to D'in the figure, and the corresponding inspection point (excluding the vertex data) in principle. And the point data set as 1: 1. However, at the corners, as shown in FIG. 16A, this principle does not hold, so as shown in FIG. 16B, the interpolation points are set at unequal intervals (for example, 1/2 of the uniform case). Set.

As described above, the setting of the interpolation points at the non-uniform intervals with respect to the corners has the same positional relationship with the CAD data as in the case of FIG. 16 like the correction data of the holes shown in FIG. In the opposite case, the inspection points on the correction data are similarly processed. The correction data in which the inspection points and the sub inspection points are set as described above and the CAD data are stored in the inspection point file PNT.

In step S5, after the marking of the inspection points and the sub-inspection points is completed, the actual pattern of the prototype in which the image is input is made to coincide with the CAD data and the correction data with the center of the island as the origin, and they are overlaid. The collation is performed, and in this state, the etching allowance is automatically measured and the correction pattern is automatically generated, and the finished correction pattern is saved in a file and used as the correction data for the next etching (steps S6 and S7).

Next, a CAD device (workstation 4
0), the generation of the correction pattern and the finishing process in steps S6 and S7 will be described in detail with reference to the flowcharts shown in FIGS.

First, in step S21, the data and the like stored by the above operation are read from the above-mentioned setting files XY, AF, SV and the like.

The contents of each setting file read here will be exemplified below. File XY-Sample orthogonality information (horizontal 2 points, vertical 2 points) -Position of four sides of island (center of island) File SV-Input color plane number-Binarization threshold-Morphology direction and number of times (+: white to black, -: Black to white) File AF (normal fixed) -Perform field of view or select fixed focus-AF mode (2 modes for each of 5 lens types (1 or 2W)
AY)) ・ Soft limit value (Z stage upper and lower limits)

The morphology of the contents of the file SV
In the direction +, the black point is removed from the white image, and-is the white point removed from the black image. Also, in the contents of the file AF, "execute view field unit" is applied to a sample having minute unevenness such as a lead frame by executing autofocus every time an image is captured, and fixed focus is applied to the glass original plate. Applies to those with high flatness. The soft limit value is the same as the limit value set in step 5, and is the upper limit value of the Z stage movement set by the operator to prevent the sample from colliding with the lens, or the lower limit value to prevent it from lowering more than necessary. is there.

Next, the inspection point file PNT
The data for one desired group is read from (step 22). FIG. 20 is a CAD screen displaying only the correction data thus read in which the inspection points have been set in step S5, and P1 and P2 in the drawing indicate the inner lead tips on the correction data. here,
It is shown that the inspection points for one group indicated by the numbers 1, 2, ... N are set on the lead tip portion P2. Note that the CAD data and the sub-inspection points above it are omitted in this figure.

Next, the center of gravity is calculated by arithmetically averaging the inspection points 1 to n (step S23).
In the following description, x and y are CAD coordinate systems with the center of the island as the origin, X and Y are stage coordinate systems on the XY stage, and U and V are the horizontal and vertical directions of the visual field of the camera. The dimensions u and v respectively represent the visual field coordinate system with the origin of the visual field center of the camera.

First, the coordinates (x ₁ , y ₁ ) and (x ₂ , y) of the inspection points 1 to n set in the CAD coordinate system are set.
₂ ), (x ₃ , y ₃ ), ... (x _n , y _n ) The center of gravity (x _G , y _G ) of the inspection location is calculated by the following equations (4) and (5).

X _G = (x ₁ + x ₂ + x ₃ ... + x _n ) / 4 (4) y _G = (y ₁ + y ₂ + y ₃ ... + y _n ) / 4 (5)

When the calculation of the center of gravity in step S23 is completed, in step S24, the XY stage controller 48 moves the XY stage 44 in response to a command from the workstation to move the camera 34 to the center of gravity (x _G , y _G ). Match the visual field centers. At that time, the actually measured position (corresponding to the X and Y coordinate values) actually measured by the laser scale counter 52 is fed back to the workstation 40 and read (step 24).

Then, in step S25, autofocus is performed by the autofocus controller 50 at the camera setting position based on a command from the workstation 40.

Thereafter, a command is issued from the workstation 40 to the image processing device 36 (SV), and the image processing device 3
6 is activated, an image frame is input from the CCD camera 34 to the processing device 36, binarization is performed on the input raster image, and morphology processing is performed to remove unnecessary points from the image. The image processing I for generating is executed (step S26).

FIG. 21 shows an actual pattern in which an image is input with the center of the field of view coinciding with the center of gravity (x _G , y _G ) and the field of view of the camera is U × V. The stage movement coordinates (X, Y) corresponding to the center of the visual field at this time are given by the following equation (6) using the island center coordinates (Xc, Yc).

X = Xc + x _G , Y = Yc + y _G (6)

Next, inspection points 1 to 1 of the CAD coordinate system
The coordinates of n are converted into a visual field coordinate system set with the visual field center of the camera as the origin (step S27). The coordinates of the visual field coordinate system of each of the inspection points 1 to n are (u ₁ ,
v ₁ ), (u ₂ , v ₂ ), (u ₃ , v ₃ ), ...
_Let (u _n , v _n ). Although a description is omitted here for the sake of convenience, the same conversion process is performed on the sub-inspection points set on the CAD data.

In the actual coordinate conversion, if an error occurs when the stage is moved, the correction is also performed at the same time. That is, after the stage is moved, the coordinates are precisely measured by the laser scale counter 52 and the orthogonal correction is performed. As a result, as shown in FIG.
Center coordinates (X, Y) on the stage shown in equation (6)
Is actually (X ', Y'), the coordinates (x ₁ , y ₁ ) of the inspection point 1 in the CAD coordinate system are the following (7), (8) in the visual field coordinate system. It is possible to correct at the same time by converting by the formula. Note that M is the number of pixels in the horizontal direction of the camera 34, N is the number of pixels in the vertical direction, and here, M = 512, N = 480, V = 496 mm, V =
It is 464 mm.

U ₁ = (M / U) {x ₁ −x _G − (X′−X)} + M / 2 (7) v ₁ = − (N / V) {y ₁ −y _G − (Y ′ -Y)} + N / 2 (8) (Y axis upside down)

(U ₂ , v ₂ ), (u ₃ , v ₃ ), ...
The coordinates of (u _n , v _n ) can be obtained by the same equations as the above equations (7) and (8).

Note that the Y-axis upside-down in the above equation (8) is generally the same as the CAD system even though the upper side is the origin in the pixel system in a camera.
In the coordinate system, the bottom is for the origin, so in the Y-axis direction −
This means that the image is multiplied by 1 and inverted.

Next, in step 28, the image processing II is executed. Here, a closed region (3 in FIG. 21) corresponding to the lead portion is selected from the binary image created in step 26.
21) is calculated, the center of gravity is calculated for each closed region, and only the closed region (non-hole portion of the actual pattern) having the center of gravity closest to the center of the field of view is selected, thereby making a part in FIG. The physical patterns above and below where is displayed are removed, and contour extraction is executed only for the selected central closed region. FIG. 23 shows the contour of the closed region thus extracted.

The center of gravity of the closed area is calculated as an average value of all black dots forming the closed area by using the center of gravity calculation processor of the image processing device 36. However, if the contour line is obtained, it may be obtained as an average of points on the line.

Then, in step S29, the image processing III
Then, the corresponding point on the closed region of the inspection point and the extreme distance is calculated. That is, 1'-n 'on the contour where the distance from the n points 1 to n of the visual field coordinate system corresponding to the inspection point on the correction data is the minimum is obtained as corresponding points, and each coordinate is (u ₁ ', v ₁ ′), (u ₂ ′, v ₂ ′), (u ₃ ′,
v ₃ ′), ..., (u _n ′, v _n ′). This calculation can be automatically performed by image processing.

Next, the coordinates of the corresponding points 1'to n '
Is converted from the visual field coordinate system to the CAD coordinate system (step
30). This inverse transformation is (u₁', V₁′)
(X₁′, Y₁′)
The following (9), which corresponds to a modified version of the expressions (7) and (8),
It can be performed by the equation (10). Other (u_Two', V
_Two′) 〜 (U_n', V_n′) Is also inversely transformed by the same formula,
Respond (x_Two′, Y_Two′) 〜 (X _n′, Y_n′) Each seat
You can ask for the mark.

X ₁ ′ = (U / M) (u ₁ ′ −M / 2) + x _G + X′−X−Xc (9) y ₁ ′ = (V / N) (N / 2−v ₁ ′) ) + Y _G + Y'-Y-Yc ... (10)

Then, vector calculation is performed in the CAD coordinate system,
The correction points are calculated, and the correction data corresponding to the correction pattern as shown in FIG. 24 is created (step S3).
1).

Here, the features of the present embodiment in the processes of steps S29 to S31 will be described in more detail with reference to FIGS. That is, in FIG. 25, the actual pattern of the prototype is shown for the tip of the inner lead,
As shown in the enlarged view of the state in which the correction data and the CAD data are collated (the marker of the sub inspection point on the CAD data is omitted), the contour of the actual pattern corresponding to the inspection point set on the correction data Find the points above. The corresponding point on the contour is automatically calculated as the point with the shortest distance from the inspection point as described above. Next, a vector whose starting point is the calculated point on the contour and whose ending point is the corresponding inspection point is generated. This vector corresponds to the etching cost.

Then, the generated vector is placed at a position where its starting point coincides with the sub-inspection point on the CAD data.
Move in parallel. This will be specifically described with reference to FIG. 26 conceptually showing the case of one vector.

If one inspection point on the preset correction data is X and the point on the contour corresponding to the X is P, a vector having P as a start point and X as an end point is generated, Then, the vector PX is moved in parallel to the position where the starting point P coincides with the sub-inspection point C on the CAD data set in advance corresponding to the inspection point X,
Let vector CX '.

Generation of such a vector and parallel movement are executed for all the inspection points in one group, and an etching correction pattern is created using the end points of each vector after parallel movement.

FIG. 27 shows 1 created by making the above corrections.
FIG. 26 is a diagram conceptually showing new correction data (corrected correction pattern) for a group, corresponding to FIG. 25.
The pattern formed by sequentially connecting the end points of the translated vectors corresponds to the corrected correction data. The above operation may be performed only on the difficult pattern portion, and the empirical rule may be applied to the simple pattern portion in the same manner as in the conventional technique to combine the two.

The new correction data for one group thus created is stored in the file (step S32),
If the processing has not been completed for all the necessary groups, the process moves to the next group and steps S22 to S3 are performed.
The same operation as in 2 is executed, and when the processing is completed for all the groups, all the data is integrated on the CAD, the correction pattern is finished, and the completed correction data is stored in the file as the next correction data (step S33). , S3
4).

If it is judged from the etching allowance calculated for the second prototype etched using the correction data created as described above, that the target actual pattern is obtained within the tolerance, Is supplied to the lead frame manufacturing line as the final correction data. on the other hand,
If it is out of the tolerance, new correction data corrected again is automatically generated, another trial is made with the correction data, and the same operation is repeated.

According to this embodiment described in detail above, the etching allowance is automatically measured from the prototype processed by etching using the correction pattern (correction data) created on the basis of the empirical rule, and the etching allowance is compared with the correction pattern. By providing the correction value as the correction instruction information and reflecting the actually measured value, it is possible to create an appropriate correction pattern from the second time onward.

Therefore, since the etching processing of the second and subsequent prototypes can be performed using the correction pattern based on the objective data, trial and error will not be repeated and the delivery delay can be prevented.

Further, even an inexperienced pattern designer can create correction data for the second and subsequent times with the accuracy of an expert. In addition, XY caused by the etching line
Since unpredictable errors such as etching bias and unevenness in the direction can be corrected, highly accurate correction exceeding the empirical rule can be automatically performed.

Further, when the pattern designer devises a new correction pattern, if there is a record of creating correction data for the same type of shape, it can be used as reference data, so that it is also possible to design a new pattern based on empirical rules. It can be applied.

Next, a second embodiment according to the present invention will be described.

This embodiment is a specific example according to claim 4, in which a sub-inspection point is not set, and the generated vector has its start point passing through the inspection point corresponding to the point on the contour. It is substantially the same as the first embodiment except that the straight line is moved in parallel to the position where the straight line intersects with the CAD data (inspection point).

In the present embodiment, FIG.
As shown in, the inspection points are set only in the correction data. Similar to the case of FIG. 25, when a point on the contour corresponding to the inspection point is obtained, as shown in FIG. 28 corresponding to FIG. 26, the intersection point N between the vector PX and the CAD data is set as a new inspection point. As the intersection point N
Then, the vector is translated in parallel to a position where the starting point P coincides with the vector NX ', and the ending point X'of the vector is used as correction data. In FIG. 28, for convenience,
The vector PX and the vector NX 'are shown displaced from each other. FIG. 29 is a diagram corresponding to FIG. 27, showing the results of performing this operation on all the inspection points shown in FIG. 25.

Next, a third embodiment according to the present invention will be described.

The present embodiment is another specific example according to claim 3, and contrary to the first embodiment, a plurality of inspection points for one group are provided on the CAD data and the inspection data is provided on the correction data. A sub-inspection point corresponding to each point is set by a point marker, and a vector on the calculated contour as a starting point and a sub-inspection point on the correction data corresponding to the inspection point as an end point is generated. The vector is substantially the same as that of the first embodiment except that the vector is moved in parallel to the position where the starting point coincides with the inspection point.

In this embodiment, as shown in FIG. 30, an inspection point is set on CAD data, and a point on the contour having the shortest distance corresponding to the inspection point is calculated. This is because the etching error, which is the difference between the design pattern and the actual product, is obtained.

Next, a vector having a point on the contour as a starting point and a corresponding sub-inspection point (not shown in the figure) set on the correction data as an ending point is generated,
This vector is moved in parallel to a position where its start point coincides with the inspection point on the CAD data, and the end point of the vector at that time is used as new correction data.

This is shown in FIG. 3 for one inspection point.
1 will be described in detail, the preset C
A point P on the contour which is the shortest distance from the inspection point C on the AD data is calculated. Then, a vector having the point P as the starting point and the sub-inspection point X on the correction data set in advance corresponding to the inspection point C as the end point is generated.
After that, the vector PX is moved in parallel to a position where the starting point P coincides with the inspection point, and the vector CX ′ is set, and the ending point X ′ is set as new correction data.

FIG. 32 conceptually shows the result of performing the same operation on all the inspection points in FIG.
Thus, the pattern in which the end points of the translated vectors are connected by a straight line corresponds to the new correction data.

Next, a fourth embodiment according to the present invention will be described.

This embodiment is another specific example according to claim 4, in which a sub-inspection point is not set on the correction data, and C
A vector is generated whose start point is a point on the contour corresponding to the inspection point set on the AD data and whose end point is a point (inspection point) at which a straight line passing through the point on the contour and the inspection point intersects the correction data. The vector is substantially the same as that of the third embodiment except that the starting point of the vector is moved in parallel to the position on the CAD data that matches the inspection point.

In this embodiment, as in the case of FIG. 30, when points on the contour corresponding to inspection points are obtained, points P and C are set as shown in FIG. 33 corresponding to FIG. An intersection N between the passing straight line and the correction data is obtained as a new inspection point, and a vector having P as a start point and N as an end point is generated. Next, this vector PN is translated to a position where its starting point P coincides with the inspection point C to become a vector CX ', and the end point X'of this vector is used as new correction data. FIG. 34 is a diagram corresponding to FIG. 32, showing the result of performing this operation on all the inspection points.

Although the present invention has been specifically described above, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the invention.

For example, although the point on the contour corresponding to the inspection point is obtained as the point with the shortest distance, the straight line passing through the inspection point may be obtained as a point orthogonal to the contour.

Further, the inspection points are not limited to the method of equally dividing and setting for each group, and as shown in FIG. 35, the set pitch is changed even in the grouped range. A fine pitch may be used, a large pitch may be used for a completely flat portion, and in some cases, inspection points may not be set. In this case, the set innermost points may be connected to each other.

[0129]

As described above, according to the present invention,
Even a person with no special experience can easily create a highly accurate etching correction pattern and automate the creation work.

[Brief description of drawings]

FIG. 1 is a block diagram showing a schematic configuration of a CAD system according to a first embodiment of the present invention.

FIG. 2 is a CAD system sample mounting device, a microscope,
Oblique view showing a CCD camera

FIG. 3 is a block diagram showing a frame memory and a processing function of the image processing device of the CAD system.

FIG. 4 is a diagram showing an optimum input plane for each sample.

FIG. 5 is a flowchart showing an outline of the operation of the embodiment.

FIG. 6 is a flowchart showing a processing procedure for setting image processing conditions.

FIG. 7 is an explanatory diagram showing a monitor screen at the time of orthogonal adjustment of the camera and the XY stage.

FIG. 8 is an explanatory diagram showing a monitor screen when a dimension per pixel and a screen feed pitch are calculated.

FIG. 9 is an explanatory diagram showing a monitor screen at the time of orthogonal adjustment of the sample and the XY stage.

FIG. 10 is an explanatory diagram showing an orthogonal correction method for a sample.

FIG. 11 is an explanatory diagram illustrating a CAD system menu screen.

FIG. 12 is another explanatory diagram illustrating the menu screen of the CAD system.

FIG. 13 is still another explanatory diagram illustrating the menu screen of the CAD system.

FIG. 14 is an explanatory diagram showing an example of a method of designating the center of an island.

FIG. 15 is an explanatory diagram showing a method of marking inspection points.

FIG. 16 is an explanatory diagram showing a method of marking a corner inspection point.

FIG. 17 is another explanatory diagram showing the method of marking the inspection points at the corners.

FIG. 18 is a flowchart showing the procedure for creating the second correction data.

FIG. 19 is another flowchart showing the procedure for creating the second correction data.

FIG. 20 is an explanatory diagram showing a method for setting inspection points.

FIG. 21 is an explanatory diagram showing a state where an image of a target portion is input.

FIG. 22 is an explanatory diagram showing a method of converting a CAD coordinate system into a visual field coordinate system.

FIG. 23 is an explanatory diagram showing a method of selecting a closed region and determining a shortest distance point.

FIG. 24 is an explanatory diagram showing a state in which a correction pattern corresponding to new correction data is generated.

FIG. 25 is an explanatory diagram showing the measurement principle of etching allowance.

FIG. 26 is an explanatory view schematically showing a method of generating correction data according to the first embodiment.

FIG. 27 is an explanatory diagram showing correction data created according to the first embodiment.

FIG. 28 is an explanatory view schematically showing a method of generating correction data according to the second embodiment.

FIG. 29 is an explanatory diagram showing correction data created according to the second embodiment.

FIG. 30 is an explanatory diagram showing a method for measuring an etching error.

FIG. 31 is an explanatory view schematically showing a method of generating correction data according to the third embodiment.

FIG. 32 is an explanatory diagram showing correction data created according to the third embodiment.

FIG. 33 is an explanatory diagram schematically showing a method of generating correction data according to the fourth embodiment.

FIG. 34 is an explanatory diagram showing correction data created according to the fourth embodiment.

FIG. 35 is an explanatory diagram showing a modification of inspection point setting.

FIG. 36 is an explanatory diagram showing an example of a lead frame.

FIG. 37 is an explanatory view conceptually showing the manufacturing process of the lead frame.

[Explanation of symbols]

 30 ... Sample mounting device 32 ... Optical microscope 34 ... CCD camera 36 ... Image processing device 38 ... TV monitor 40 ... Workstation (EWS) 42 ... Rotation stage 44 ... XY stage 44A ... X stage 44B ... Y stage 46 ... Z stage 48 ... XY stage controller 50 ... Auto focus controller 52 ... Laser scale counter 54A ... X drive motor 54B ... Y drive motor 54C ... Z drive motor 56A, 56B ... Scale pattern 58A ... X position detector 58B ... Y position detector 60 ... Transmission Light source unit 60A ... Transmissive light source switch 60B ... Light intensity adjustment volume 62 ... Epi-illumination light source unit 62A ... Epi-illumination light switch 62B ... Light intensity adjustment volume

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Teruaki Iinuma 1-1-1, Ichigaya-Kagacho, Shinjuku-ku, Tokyo Dai Nippon Printing Co., Ltd. (72) Inventor Masataka Yamaji 1-chome, Ichigaya-Kagacho, Shinjuku-ku, Tokyo No. 1 within Dai Nippon Printing Co., Ltd. (72) Inventor Satoshi Watanabe 1-1-1 Ichigayaka-cho, Shinjuku-ku, Tokyo Within Dai Nippon Printing Co., Ltd.

Claims (6)

[Claims] 1. A means for creating correction data as a prototype of a resist pattern by adding a correction margin to CAD data of a product design dimension pattern, and an etching process using a resist pattern as a prototype of the correction data as a mask. Means for inputting an image of the physical pattern created by the above, means for collating the image data of the input physical pattern, the CAD data and the correction data by superimposing them by matching the corresponding reference points. And means for calculating a point on the contour of the image data of the actual pattern corresponding to the inspection point set on the CAD data or the correction data, and the correction point corresponding to the calculated point on the contour as a starting point. A means for generating a vector whose end point is the inspection point above, and an inspection point on the CAD data whose start point corresponds to the generated vector. And a means for making parallel correction at a position corresponding to the current position and a means for making new correction data for making the next resist pattern by using the end point of each vector after the parallel movement. Etching correction pattern creating device. 2. The etching correction pattern according to claim 1, wherein the inspection point on the CAD data or the correction data is at least one of each original vertex data and point data set with reference to them. Creation device. 3. The inspection point on the CAD data and the inspection point on the correction data according to claim 1, at least the original vertex data and the point data set in one-to-one correspondence with the original vertex data. An etching correction pattern creating apparatus characterized by being one side. 4. The straight line according to claim 1 or 2, wherein one of the inspection points on the CAD data or the correction data passes through the other inspection point and a point on the contour calculated corresponding thereto. An etching correction pattern creation device characterized by being point data calculated as points intersecting the same correction data or the same CAD data. 5. The etching according to claim 3, wherein the inspection point set in correspondence with one-to-one is selected as a point having the shortest distance from the other inspection point in principle. Correction pattern creation device. 6. The point on the contour of the physical pattern corresponding to the inspection point according to claim 1,
An etching correction pattern creating apparatus, wherein a point having the shortest distance from the inspection point or a straight line passing through the inspection point is calculated as a point orthogonal to the contour.