JPH09197974A - Plate type image forming device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain the device provided with an image formation part protecting means without spoiling the thinness and lightness of the device by providing the image formation part protecting means so that a gap is formed between a body at the periphery and an image formation part when the device is fallen. SOLUTION: This device consists of the image formation part 1, the image formation part protecting means 2, and a rotary fitting part 3. The rotary fitting part 3 controls the rotating direction by using a one-way clutch. Further, the rotary fitting part 3 is provided with a means which predetermines the limit of the angle of rotation of the image formation part protecting means 2, and also provided with a means which fixes a rotation part and a means which controls the maximum angle of rotation. Then when the flat plate type image formation device slants, the image formation part protecting means 2 always faces the perpendicular direction according to the tilt. Consequently, the image formation part protecting means 2 prevents the flat plate type forming device from completely being fallen even if slanting, and the gap is formed between the image formation part 1 and the body 5 at the periphery, so that the image formation part 1 is protected.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flat panel image forming apparatus, and more particularly to a flat panel image forming apparatus using a surface conduction electron-emitting device.

[0002]

2. Description of the Related Art Conventionally, as an image forming apparatus, an image forming apparatus using a cathode ray tube has prevailed, and a flat plate type image forming apparatus using an electron-emitting device and a flat plate type image forming apparatus using plasma discharge are used. Flat plate type image forming apparatuses using liquid crystals have become widespread.

The flat plate type image forming apparatus is characterized in that the apparatus is thin and lightweight. Such flat plate image forming apparatuses include a wall-mounted type, a table-mounted type, a floor-mounted type, etc., in terms of installation surface. On the other hand, as an image forming apparatus using a cathode ray tube, a stationary type installed on a dedicated rack or a table is well known.

In the case of a tabletop installation type, a floor installation type, or a stationary type, the image forming apparatus may fall or drop due to an unexpected external force such as shock or vibration. Examples of external force include vibration caused by an earthquake and impact caused by careless handling by the user. Therefore, it is necessary for the image forming apparatus to take measures for avoiding danger of falling or falling. Conventionally, when the flat panel image forming apparatus falls over due to an external force, it may be damaged by hitting an object having a convex portion placed around it. In the case of a large-sized image forming apparatus, since the weight is large, the impact at the time of collision is large and the damage cannot be ignored.

FIG. 16 shows an example of a conventional flat plate type image forming apparatus. In the figure, 201 is an image forming unit and 202
Is a leg portion, and 203 is a built-in weight. As a fall-prevention measure for a desktop-installed or floor-installed image forming apparatus, the size of the legs (202) is increased or a heavy member is used so that the installation balance is improved.
Means such as installing a built-in weight (203) on the leg (202) to stabilize it have been taken.

Next, a conventional technique for the electron-emitting device will be described. Conventionally, two types of electron-emitting devices are known, that is, a thermoelectron-emitting device and a cold cathode electron-emitting device.
The cold cathode electron-emitting device includes a field emission type (hereinafter referred to as “FE type”).
That. ), Metal / insulating layer / metal type (hereinafter “MIM type”)
That. ), And a surface conduction electron-emitting device type. F
Examples of E type are WP Dyke & WWDoran, "Field Emissi
on ", Advance in Electron Physics, 8.89 (1956) or C.
A.Spindt "Physical Properties of thin-film field e
mission cathodes with molybdenium cones ", J.Appl.Ph
The one disclosed in ys., 47, 5248 (1976) is known. As an example of the MIM type, CAMead, "Operation of T
unnel-Emission Devices ", J.Appl.Phys., 32,646 (1961)
And the like are known. Examples of the surface conduction electron-emitting device type include MIElinson, Radio Eng. Electr
on Phys., 10.1290 (1965) and the like.

In the surface conduction electron-emitting device, electrons are emitted by passing a current through a small area thin film formed on a substrate in parallel with the film surface. As the surface conduction electron-emitting device, one using a SnO ₂ thin film by the above-mentioned Erinson, one using an Au thin film (G. Dittmer, Thin Solid Film) is used.
ms, 9,317 (1972)), In ₂ O ₃ / SnO ₂ thin film (M. Hartwell and CGFonstad, IEEE Trans.ED Conf., 5
19 (1975)), by carbon thin film (Hiraki Araki et al.,
Vacuum, Vol. 26, No. 1, p. 22 (1983)) and the like are reported.

FIG. 17 shows a typical example of these surface conduction electron-emitting devices, which is described in the above-mentioned M. The element structure of Hartwell is shown typically. In the figure, 301 is a substrate,
Reference numeral 302 denotes a conductive thin film made of metal oxide or the like formed by sputtering in an H-shaped pattern. An electron emitting portion (303) is formed on the conductive thin film (302) by an energization process called energization forming described later. The interval La in the figure is set to 0.5 to 1 mm and Wa is set to about 0.1 mm.

Conventionally, in these surface conduction electron-emitting devices, it is general that the electron-emitting portion is formed in advance by conducting a current called an energization forming process on the conductive thin film (302) before emitting electrons. The energization forming is an electron in which a direct current voltage or a very slow rising voltage is applied to both ends of the conductive thin film to locally destroy, deform or alter the conductive thin film to make it an electrically high resistance state. Forming the emitting portion. Such an electron emitting portion is composed of a crack or the like formed in a part of the conductive thin film, and electrons are emitted from the vicinity of the crack or the like. In the surface conduction electron-emitting device that has been subjected to the energization forming process, a voltage is applied to the conductive thin film and a current is passed through the device, so that electrons are emitted from the electron-emitting portion.

Since the surface conduction electron-emitting device described above has a simple structure and is easy to manufacture, it has an advantage that a large number of devices can be arrayed over a large area. Therefore, applied research on charged beam sources, display devices, and the like, which make use of this feature, has been conducted. As an example in which a large number of surface-conduction type electron-emitting devices are formed in an array, a ladder-type electron source described later, that is, surface-conduction type electron-emitting devices are arranged in parallel, and both ends of each arranged device are wired ( An electron source in which a large number of connected element rows are arranged by common wiring) (Japanese Patent Application Laid-Open No. 64-031332, Japanese Patent Application Laid-Open No. 1-28) can be mentioned.
3749, JP-A-2-257552, etc.).

In recent years, particularly in image forming apparatuses such as display devices, flat panel display devices using liquid crystal have become popular in place of CRTs. However, since it is not a self-luminous type, there is a problem that it must be equipped with a backlight, and thus development of a self-luminous display device has been desired. The self-luminous display device is an image forming device that is a display device in which a plurality of surface conduction electron-emitting devices are arranged in an electron source and a phosphor that emits visible light by electrons emitted from the electron source is combined. (For example, USP5066
883).

[0012]

In the above-mentioned conventional image forming apparatus, in order to prevent a fall, the legs are lengthened and a heavy member (built-in weight) is arranged on the legs to achieve a good balance. I am dealing with it.

However, when such means is used, the thinness of the flat plate type image forming apparatus, which is a product feature, cannot be utilized. In addition, when the weight of the leg portion is increased, the workability is reduced due to the weight of the leg portion when the place is moved. Furthermore, even with the conventional means, it is difficult to avoid falling or dropping due to the unexpected external force.

Therefore, an object of the present invention is to provide a flat plate type image forming apparatus provided with an image forming portion protecting means without impairing the thinness and lightness of the flat plate type image forming apparatus.

[0015]

Means for Solving the Problems The present inventor has made various studies in order to achieve the above object, and as a result, completed the present invention.

A first aspect of the present invention relates to a flat plate type image forming apparatus characterized in that an image forming portion protecting means is provided so that a gap is formed between an object around the image forming portion and the image forming portion at the time of a fall. .

According to a second aspect of the present invention, the image forming portion protecting means has a rotation center so that the image forming portion protecting means operates in the falling direction and can support the flat plate type image forming apparatus at the time of falling.
The present invention relates to a flat plate image forming apparatus according to the first aspect of the present invention, which is provided on at least one side surface, front surface, or upper surface of the flat plate image forming apparatus.

A third aspect of the present invention is that the image forming portion protecting means is fixed to a maximum angle within a preset angle with respect to one or a plurality of shakes of the flat panel image forming apparatus. The present invention relates to a flat panel image forming apparatus.

A fourth aspect of the present invention relates to the flat image forming apparatus according to the second or third aspect of the present invention, wherein the image forming portion protecting means is provided with a slip preventing means.

A fifth aspect of the present invention relates to the flat plate type image forming apparatus according to the second, third or fourth aspect of the present invention, wherein the image forming portion protecting means is provided with a shock absorbing means.

According to a sixth aspect of the present invention, the image forming portion protecting means is a plate-like means provided on at least one side surface, front surface or upper surface of the flat plate image forming apparatus. Regarding

A seventh aspect of the present invention relates to the flat type image forming apparatus of the first aspect, wherein the image forming portion protecting means is a string-like means for connecting a fixed object around the flat type image forming apparatus.

According to an eighth aspect of the present invention, the display panel includes a rear plate having an electron-emitting device, a face plate provided with a member to be irradiated which is arranged to face the rear plate and receives electrons emitted from the electron-emitting device, And a flat plate image forming apparatus according to any one of the first to seventh inventions, which is constituted by a support frame disposed between the peripheral portions of the rear plate and the face plate.

A ninth aspect of the present invention relates to the flat plate type image forming apparatus according to the eighth aspect, wherein the electron-emitting device is a surface conduction electron-emitting device.

[0025]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the drawings.

FIG. 1A is a schematic perspective view of a flat plate type image forming apparatus according to the first embodiment of the present invention. In the figure, 1 is an image forming portion, 2 is an image forming portion protecting means (arranged on both sides of a flat plate type image forming apparatus), and 3 is a rotary mounting portion. The flat plate image forming apparatus in the figure is a flat plate image forming apparatus using a surface conduction electron-emitting device.

A one-way clutch was used for the rotation mounting portion (3) to control the rotation direction. Further, means (not shown) for predetermining the limit of the rotation angle of the image forming portion protection means (2) is provided on the rotary mounting portion (3), and means for fixing the rotation portion and means for controlling the maximum rotation angle are also provided. There is.

Next, the function of the present invention will be described with reference to FIG. In the figure, 4 is an installation surface and 5 is a surrounding object.

FIG. 2A shows a state in which the flat plate type image forming apparatus is installed on the installation surface (4). FIG. 2B shows a state in which the flat panel image forming apparatus is tilted due to an impact or the like. Due to the rotation attachment part (3) capable of controlling the rotation direction described above, the angle φ between the image forming part protection means (2) and the surface of the image forming part and the angle θ between the image forming part surface and the vertical line are almost equal to each other. Will be equal. In addition, in the state where the flat-panel image forming apparatus swings back and forth a plurality of times and falls,
Among them, the largest angle θ and angle φ match.
FIG. 2C shows a state in which the flat plate type image forming apparatus has fallen down and the image forming portion protecting means (2) is functioning. Due to the image forming unit protection means (2), the flat plate type image forming apparatus does not completely fall over, and a gap is formed between the image forming unit (1) and the surrounding object (5). 1) is protected.

As described above, when the flat plate type image forming apparatus of the present invention is tilted, the image forming portion protecting means (2) is always provided.
However, depending on the inclination, it comes to face the vertical direction. When it is known in advance that the flat panel image forming apparatus will shake, such as when moving the flat panel image forming apparatus, the rotary mounting portion (3) is fixed and the image forming portion protection means (2) is not moved. You may do it.

Further, the image forming portion protecting means (2) in the above-mentioned embodiment has a spring (2) as shown in FIG. 1 (b).
4) the tip portion (23) and the image forming portion protection means main body (2)
It is desirable that it is built in between 1) and the structure so that the impact at the time of falling can be absorbed. Further, it is desirable to provide a non-slip means such as rubber (25) at the tip of the image forming portion protection means (2). With such a structure, the shock and vibration at the time of falling are absorbed by the above-mentioned shock absorbing means provided with the spring (24). In addition, rubber (2
5) also absorbs the shock and prevents side slip after a fall.

In addition to the above construction, it is desirable that the tip of the image forming portion protection means (2) has a rounded shape so as to be safe even if it is hit by the people around it.

It is important that the image forming portion protecting means (2) in the first embodiment is oriented in the direction of gravity regardless of the shaking of the flat plate type image forming apparatus. For that purpose, it is preferable that the center of gravity of the image forming portion protection means (2) is slightly below the center of rotation (rotary mounting portion (3)). Numerically, it is desirable that the center of gravity of the image forming unit protection unit be located below the center of rotation within one fifth of the total length of the image forming unit protection unit. With such a configuration, whenever the flat-plate image forming apparatus is tilted, the image forming portion protection unit is in the most tilted state and is oriented in the vertical direction.

In the present embodiment, an example in which the image forming portion protecting means (2) protects the image forming portion (1) has been shown. However, the direction in which the image forming portion easily falls is on the back side opposite to the image forming portion (1). Alternatively, when there is an object to be protected from a shock due to contact on the back side thereof, the image forming unit protection means (2) may be structured to operate on the back side.

Although the one-way clutch is used for the rotary mounting portion (3) shown in the present embodiment, the present invention is not limited to this, and it is possible to control the rotational direction with the same performance. If they do, the same effect can be obtained.

Next, a second embodiment of the flat plate type image forming apparatus of the present invention will be described with reference to FIG. In the figure, 1
Is an image forming unit, 6a is an image forming unit protecting means when stored, 6a
b is a protection means for the image forming portion after the operation, 7 is a rotary mounting portion, 8
Is a hooking portion for fixing the image forming portion protecting means during storage, 9 is a hooking stopper for receiving the hooking portion, and 10 is a storage space for storing the image forming portion protecting means. During normal use, the image forming unit protection means is
0) (position 6a), and the hook portion (8) is hooked and fixed on the hook stopper (9) (position 6b).

The image forming portion protecting means of this embodiment is attached to the main body of the flat plate type image forming apparatus by a rotation attaching portion (7) having a rotation center as an axis. This rotating mount (7)
Although not shown in the figure, as in the first embodiment, means for fixing the image forming portion protection means (6a) to the position 6b in the drawing is provided. Further, it is also possible to fix the image forming portion protection means so that it does not operate during movement. In this embodiment, a one-way clutch can be used for the rotary mounting portion (7).

The function of the second embodiment will be described below. When an external force is applied to the flat plate type image forming apparatus to cause a shake on the image display surface (front surface) side, the hook portion (8) comes off the hook stopper (9), and the image forming portion protection means (6a) quickly stores space. It is separated from (10) and stopped and fixed at the position 6b. As a result, the flat plate image forming apparatus is supported by the image forming unit protection unit in a half-overturned state, a gap is formed between the image forming unit and surrounding objects (not shown), and the image forming unit (1) is protected.

As in the first embodiment, such an image forming portion protecting means may be provided with a shock absorbing means, a slip preventing means and the like. Further, in order to speed up the operation, it is desirable to adjust the center of gravity of the image forming section protecting means to the tip side rather than one fifth of the total length by providing a balancer at the tip of the image forming section protecting means.

In this embodiment, the number of image forming portion protecting means is not limited, and a plurality of means may be used if necessary.

Next, a third embodiment of the flat plate type image forming apparatus of the present invention will be described with reference to FIG. In the figure, 1
Is an image forming portion, and 11 is an image forming portion protecting plate.

The image forming portion protection plate (11) may be removable. In this case, the image forming section protection plate is attached to both side surfaces of the flat plate type image forming apparatus when the plate type image forming apparatus is installed (the attaching section is not shown).

The function of the flat plate type image forming apparatus is that when an external force is applied to the flat plate type image forming apparatus and the front side shakes and falls, the image forming section protection plate (11) supports it in a half-overturned state. Thus, a gap is formed between the image forming unit (1) and a surrounding object (not shown), and the image forming unit (1) is protected.

Next, a fourth embodiment of the flat panel image forming apparatus of the present invention will be described with reference to FIG. In the figure, 1
Is an image forming unit, 12 is a wall, 13 is a wire that connects the wall and the flat plate image forming apparatus, 14 is a stopper that connects the wall and the wire, and 15 is a stopper that connects the flat plate image forming apparatus and the wire , 16 are length adjusting means for adjusting the length of the wire.

When installing the flat plate type image forming apparatus,
Wires (13) and fasteners (14, 15) are used to connect the flat panel image forming apparatus to the wall (12). that time,
The length of the wire (13) is adjusted by the length adjusting means (16). The length of the wire should be adjusted so that it will not fall over completely when the flat panel image forming apparatus falls over.

The wall (12) may be a fixed object that can support the flat plate type image forming apparatus, and may be, for example, a floor, a pillar, or an installation object having an appropriate weight. Also, the wire (13) is not limited to this, but may be any string-like one that is flexible and has sufficient tensile strength. For example, a piano wire or rope may be used.

The function of the flat plate type image forming apparatus is that the flat plate type image forming apparatus is supported by the wire (13) when an external force is applied to the flat plate type image forming apparatus and the front side shakes and falls. Thus, a gap is formed between the image forming unit (1) and a surrounding object (not shown), and the image forming unit (1) is protected.

In the above first to fourth embodiments, the one using the surface conduction electron-emitting device as the flat-panel image forming apparatus is shown, but the flat-panel image using other electron-emitting devices such as a fluorescent display tube. Similar results are obtained with the forming apparatus. Further, similar results can be obtained in a flat plate type image forming apparatus such as a plasma discharge type or a liquid crystal type.
In the present invention, if the image forming apparatus is a flat plate type, the effect is exhibited regardless of the difference in the image forming section.

Hereinafter, an example using a surface conduction electron-emitting device will be described in detail as a preferred flat plate type image forming apparatus of the present invention.

The basic structure of the surface conduction electron-emitting device of the present invention is roughly classified into two types: a plane type and a vertical type. First, the planar surface conduction electron-emitting device will be described.

6A and 6B are schematic views showing the structure of the flat surface conduction electron-emitting device according to the present invention. FIG. 6A is a plan view, and FIG. 6B is A- of FIG. 6A. It is an A line sectional view. In these figures, 101 is a substrate, and 102 and 103.
Is an element electrode, 104 is a conductive thin film, and 105 is an electron emitting portion.

As the substrate (101), quartz glass, N
It is possible to use glass in which the content of impurities such as a is reduced, soda lime glass, a glass substrate on which SiO ₂ is deposited by a sputtering method, a ceramic substrate such as alumina, or the like.

As the material of the element electrodes (102, 103), a general conductive material can be used.
・ Metal or alloy such as Au ・ Mo ・ W ・ Pt ・ Ti ・ Al ・ Cu ・ Pd and Pd ・ As ・ Ag ・ Au ・ Ru
It can be selected from a printed conductor composed of a metal such as O ₂ .Pd-Ag or a metal oxide and glass, a transparent conductor such as In ₂ O ₃ —SnO _{2 and} a semiconductor material such as polysilicon.

The element electrode interval (L), the element electrode length (W), the shape of the conductive thin film, etc. are designed in consideration of the applied form. The device electrode interval (L) is preferably in the range of several thousand angstroms to several hundreds of μm, and more preferably 1 to 1 in consideration of the voltage applied between the device electrodes.
The range is 100 μm.

The device electrode length (W) is in the range of several μm to several hundreds of μm in consideration of the resistance value of the electrode and the electron emission characteristics. The film thickness (d) of the device electrodes (102, 103) is 10
It is in the range of 0 Å to 1 μm.

In addition to the structure shown in FIG. 6, a conductive thin film (104) and opposing element electrodes (102, 103) may be stacked in this order on the substrate (101).

The conductive thin film (104) is preferably a fine particle film composed of fine particles in order to obtain good electron emission characteristics. The film thickness is appropriately set in consideration of the step coverage to the device electrodes (102, 103), the resistance value between the device electrodes (102, 103), the forming conditions described later, and the like, but is usually several angstroms to several thousands. It is preferably in the range of angstrom, and more preferably in the range of 10 to 500 angstrom.
The resistance value of Rs is 10 ² to 10 ⁷ Ω. Here, Rs is a resistance R of a thin film having a thickness t, a width w and a length l.
Is a value obtained when R = Rs (l / w),
If the resistivity of the thin film material is ρ, then Rs = ρ / t.

The material forming the conductive thin film (104) is
Pd, Pt, Ru, Ag, Au, Ti, In, Cu, C
Metals such as r, Fe, Zn, Sn, Ta, W, Pb, Pd
O ・ SnO ₂・ In ₂ O ₃・ PbO ・ Sb ₂ O ₃ etc. oxides, HfB ₂・ ZrB ₂・ LaB ₆・ CeB ₆・ YB ₄・ G
Borides such as dB ₄ , TiC / ZrC / HfC / TaC /
It is appropriately selected from carbides such as SiC / WC, nitrides such as TiN / ZrN / HfN, semiconductors such as Si / Ge, and carbon.

The fine particle film described here is a film in which a plurality of fine particles are aggregated, and its fine structure has a state in which fine particles are individually dispersed and arranged, or a state in which fine particles are adjacent to each other or overlap each other (some fine particles are It also includes the case where they are aggregated to form an island structure as a whole). The particle size of the fine particles ranges from several angstroms to 1 μm,
It is preferably in the range of 10 to 200 angstrom.

The electron emitting portion (105) is made of a conductive thin film (1
It is constituted by a high-resistance crack formed in a part of 04) and depends on the film thickness, film quality and material of the conductive thin film (104) and a method such as energization forming described later. The inside of the electron emission portion (105) may contain conductive fine particles having a particle diameter of 1000 angstroms or less. The conductive fine particles contain a part or all of the elements of the material forming the conductive thin film (104). The electron emitting portion (105) and the conductive thin film (104) in the vicinity thereof may contain carbon or a carbon compound.

Next, the vertical surface conduction electron-emitting device will be described. FIG. 7 is a schematic view showing an example of a vertical surface conduction electron-emitting device according to the present invention. 106 is
It is a step forming portion that is a characteristic component of the vertical element. 7, the same parts as those shown in FIG. 6 are designated by the same reference numerals as those shown in FIG.

Substrate (101), device electrodes (102, 10)
3), the conductive thin film (104) and the electron emitting portion (105)
Can be made of the same material as in the case of the planar surface conduction electron-emitting device described above.

The step forming portion (106) can be formed by using an insulating material such as SiO ₂ by a vacuum vapor deposition method, a printing method, a sputtering method or the like. The film thickness of the step forming portion (106) corresponds to the device electrode interval (L) of the flat surface conduction electron-emitting device described above, and is in the range of several hundred angstroms to several tens of μm. This film thickness is set in consideration of the manufacturing method of the step forming portion and the voltage applied between the element electrodes, but is preferably in the range of several thousand angstroms to several μm.

The conductive thin film (104) is formed on the device electrode (10).
2, 103) and the step forming portion (106) are formed, they are then laminated on the device electrodes (102, 103). Although the electron emitting portion (105) is formed on the conductive thin film on the side surface of the step forming portion (106) in FIG. 7, it depends on the manufacturing conditions, forming conditions, etc. It is not limited to.

There are various methods for manufacturing the above-mentioned surface conduction electron-emitting device, one example of which will be described below with reference to FIG.

Step 1: The substrate (101) is thoroughly washed with a detergent, pure water, an organic solvent, etc., and a device electrode material is deposited by a vacuum deposition method, a sputtering method or the like, and then the substrate is formed using, for example, a photolithography technique. The device electrode (1
02, 103) are formed (FIG. 8A).

Step 2: An organic metal solution is applied to the substrate (101) provided with the device electrodes (102, 103) to form an organic metal thin film. As the organic metal solution, a solution of an organic metal compound containing a metal of the material of the conductive thin film as a main element is used. This organometallic thin film is heat-fired and patterned by lift-off, etching or the like to form a conductive thin film (104) (FIG. 8B). Although the coating method of the organic metal solution has been described here, the method of forming the conductive thin film is not limited to this, and the vacuum deposition method, the sputtering method, the chemical vapor deposition method, the dispersion coating method, the dipping method, and the like. Method, spinner method, etc. can also be used.

Step 3: Next, a forming process is performed.
As an example of the forming processing method, a method by an energization processing will be described. When electricity is applied between the element electrodes (102, 103) using a power source (not shown), a conductive thin film (10
An electron emitting portion (105) is formed in 4) (FIG. 8).
(C)). According to the energization forming, the conductive thin film (10
In 4), a site having a structural change such as local destruction, deformation or alteration is formed. This portion becomes the electron emitting portion (105).

FIG. 9 shows an example of the voltage waveform of energization forming. The voltage waveform is preferably a pulse waveform. For voltage application, a method of continuously applying a pulse having a constant pulse peak value (FIG. 9A) and a method of applying a voltage pulse while increasing the pulse peak value (FIG. 9B) ) There is.

In FIG. 9A, T1 and T2 are the pulse width and pulse interval of the voltage waveform, respectively. Usually T1
Is 1 microsecond to 10 milliseconds, T2 is 10 microseconds to
It is set in the range of 100 milliseconds. The peak value of the triangular wave (peak voltage during energization forming) is appropriately selected according to the form of the surface conduction electron-emitting device. Under such conditions, for example, a voltage is applied for several seconds to several tens minutes. The pulse waveform is not limited to a triangular wave, and a desired waveform such as a rectangular wave can be adopted.

T1 and T2 in FIG. 9B are the same as those in FIG.
It may be similar to that shown in (a). The peak value of the triangular wave (peak voltage during energization forming) is increased in steps of, for example, 0.1V.

The end of the energization forming process can be detected by applying a voltage that does not locally break or deform the conductive thin film (104) during the pulse interval T2 and measure the current. For example, the device current flowing by applying a voltage of about 0.1 V is measured, the resistance value is obtained, and the energization forming is terminated when a resistance of 1 M ohm or more is shown.

It is preferable to perform activation processing on the element which has been subjected to the above-mentioned forming processing. By performing the activation process, the device current If and the emission current Ie change remarkably. The activation treatment can be performed, for example, in an atmosphere containing a gas of an organic substance, by repeating application of a pulse as in the energization forming. The atmosphere in this activation treatment can be formed by using the organic gas remaining in the atmosphere when the inside of the vacuum container is evacuated using, for example, an oil diffusion pump or a rotary pump. It can also be obtained by introducing a gas of an appropriate organic substance into a sufficiently evacuated vacuum. At this time, the preferable gas pressure of the organic substance is the above-mentioned element form,
Since it varies depending on the shape of the vacuum container, the type of organic substance, etc., it is appropriately set depending on the case.

Suitable organic substances include organic hydrocarbons such as alkanes, alkenes, alkynes, aliphatic hydrocarbons, aromatic hydrocarbons, alcohols, aldehydes, ketones, amines, phenols, carboxylic acids and sulfonic acids. Acids and the like can be mentioned, and specifically, methane, ethane,
Saturated hydrocarbons represented by C _n H _{2n + 2} such as propane, unsaturated hydrocarbons represented by C _n H _2n such as ethylene and propylene, benzene, toluene, methanol, ethanol,
Formaldehyde, acetaldehyde, acetone, methyl ethyl ketone, methyl amine, ethyl amine, phenol, formic acid, acetic acid, propionic acid and the like can be used.

By such activation treatment, carbon or a carbon compound is deposited on the device from the organic substance existing in the atmosphere, and the device current If and the emission current Ie are significantly changed.

The end of the activation process is judged by the device current If.
And the emission current Ie are measured. The pulse width,
The pulse interval, pulse peak value, etc. are set appropriately.

The above-mentioned carbon or carbon compound means HO
PG (Highly Oriented PyrolyticGraphite), PG (P
Graphite such as yrolytic Graphite), GC (Glassy Carbon), etc. (HOPG is a graphite having a nearly complete crystal structure, PG is a graphite with a crystal grain of about 200 angstroms and the crystal structure is slightly disordered, and GC has 2 crystal grains.
It refers to the one in which the disorder of the crystal structure is further increased at about 0 Å. ) And amorphous carbon (amorphous carbon, and carbon containing a mixture of amorphous carbon and fine crystals of graphite). The thickness of these layers is preferably 500 angstroms or less, and more preferably 300 angstroms or less.

The electron-emitting device obtained through the above activation treatment is preferably subjected to stabilization treatment. This treatment is preferably carried out when the partial pressure of the organic substance in the vacuum container is 10 ^-8 Torr or less, preferably 10 ^-10 Torr or less. The pressure in the vacuum container is preferably 10 ^−6.5 to 10 ⁻⁷ Torr, and particularly 10 ^−8.
Torr or less is preferable. The vacuum exhaust device for exhausting the vacuum container preferably does not use oil so that the oil generated from the device does not affect the characteristics of the element. Specifically, a vacuum exhaust device such as a sorption pump and an ion pump can be used. Further, when exhausting the inside of the vacuum container, it is preferable to heat the entire vacuum container so that organic substance molecules adsorbed on the inner wall of the vacuum container or the electron-emitting device can be easily exhausted. At this time, the vacuum evacuation condition in the heated state is preferably 80 to 200 ° C. for 5 hours or more, but is not particularly limited to this condition, and various conditions such as the size and shape of the vacuum container and the configuration of the electron-emitting device. It changes with.
The partial pressure of the organic substance should be determined by measuring the partial pressure of an organic molecule having a mass number of 10 to 200 and having carbon and hydrogen as the main components by using a mass spectrometer and integrating the partial pressures. Can be obtained by

It is preferable that the atmosphere at the time of driving after the above-mentioned stabilization treatment is maintained as it is at the end of the stabilization treatment, but the present invention is not limited to this, and if the organic substance is sufficiently removed, Sufficient characteristics can be maintained even if the degree of vacuum itself is slightly lowered. By adopting such a vacuum atmosphere, the deposition of new carbon or carbon compound can be suppressed, and as a result, the device current If and the emission current Ie are stabilized.

Various arrangements of electron-emitting devices can be adopted, and typical examples are a ladder-like arrangement and a matrix arrangement.

In the ladder-like arrangement, a large number of electron-emitting devices are arranged in parallel, and each of these devices is connected at both ends to form a large number of electron-emitting device rows (hereinafter referred to as "element rows"). (Hereinafter, the direction of this element row is referred to as "row direction".), And the control electrode ("grid") arranged above these electron-emitting devices in a direction orthogonal to the wiring in these row directions (hereinafter referred to as "column direction"). Electrons emitted from the electron-emitting device are controlled and driven by the electrodes.

On the other hand, in the matrix arrangement, a plurality of electron-emitting devices are arranged in a matrix in the X and Y directions, and one of the electrodes of the plurality of electron-emitting devices arranged in the same row is commonly used for wiring in the X direction. , And the other of the electrodes of the plurality of electron-emitting devices arranged in the same column is commonly connected to the wiring in the Y direction. This is a so-called simple matrix arrangement.

First, the simple matrix arrangement type electron source substrate and the display panel provided with the electron source substrate will be described in detail below. FIG. 10 shows an electron source substrate in which a plurality of electron-emitting devices according to the present invention are arranged in a matrix. In the figure, 107 is an electron source substrate, 108 is an X-direction wiring, and 109 is a Y-direction wiring. 110 is a surface conduction electron-emitting device, and 111 is a wire connection. The surface conduction electron-emitting device (110) may be either the flat type or the vertical type described above.

The m wirings in the X direction (108) are made of a conductive metal or the like, and are configured as shown by Dx1, Dx2, ..., Dxm in the figure by using a vacuum deposition method, a printing method, a sputtering method or the like. To be done. The material, film thickness, and width of these wirings are appropriately designed. Y
Direction wiring (109) is n of Dy1, Dy2, ..., Dyn.
It is composed of a book wire and is formed in the same manner as the X-direction wire (108). These m wires in the X direction (108) and n wires in the Y direction
An interlayer insulating layer (not shown) is provided between the directional wiring (109) and electrically insulates them.

The interlayer insulating layer (not shown) is made of SiO ₂ or the like, and is formed by using a vacuum vapor deposition method, a printing method, a sputtering method or the like. For example, it is formed in a desired shape on the entire surface or a part of the substrate on which the X-direction wiring (108) is formed, and in particular, to withstand a potential difference at the intersection of the X-direction wiring (108) and the Y-direction wiring (109), The film thickness, material, manufacturing method, etc. are selected and set.

X-direction wiring (108) and Y-direction wiring (10)
9) is provided with an external terminal for each of them and is drawn out.

The pair of electrodes (not shown) constituting the surface conduction electron-emitting device (110) includes an X-direction wiring (108) and a Y-direction wiring.
Directional wiring (109) and connection (11) made of conductive metal or the like.
It is electrically connected by 1).

X-direction wiring (108) and Y-direction wiring (10)
The material forming 9), the material forming the wire connection (111), and the material forming the pair of device electrodes may be the same or different in some or all of the constituent elements. These materials can be appropriately selected from the above-mentioned materials for the device electrodes. When the material forming the element electrode and the wiring material are the same, the wiring connected to the element electrode can also be referred to as an element electrode.

A scanning signal applying means (not shown) for applying a scanning signal for selecting a row of the surface conduction electron-emitting devices (110) arranged in the X direction is connected to the X-direction wiring (108). On the other hand, the Y direction wiring (109) is connected to a modulation signal generating means (not shown) for modulating each column of the surface conduction electron-emitting devices (110) arranged in the Y direction according to an input signal. The drive voltage applied to each surface conduction electron-emitting device is supplied as a difference voltage between the scanning signal and the modulation signal applied to the device.

By configuring the above simple matrix arrangement, individual elements can be selected and driven independently.

An image forming apparatus constructed by using the electron source substrate having such a simple matrix arrangement will be described below with reference to FIGS. 11, 12 and 13. 11 is a perspective view showing an example of a display panel of the image forming apparatus.
2 is a schematic view of a fluorescent film used in the image forming apparatus.
FIG. 13 is a block diagram showing an example of a drive circuit for displaying according to an NTSC television signal.

In FIG. 11, 107 is an electron source substrate on which a plurality of electron-emitting devices are arranged, and 112 is an electron source substrate (107).
A rear plate 117 on which a glass substrate (11
On the inner surface of 4), the fluorescent film (115) and the metal back (11)
6) is formed on the face plate. Reference numeral 113 denotes a support frame, and the rear plate (112) and the face plate (117) are joined to the support frame by using frit glass or the like. Reference numeral 119 denotes an envelope, and this sealing is performed, for example, by firing in the air or nitrogen in the temperature range of 400 to 500 ° C. for 10 minutes or more.

110 is a surface conduction electron-emitting device,
Reference numerals 108 and 109 denote an X-direction wiring and a Y-direction wiring connected to a pair of device electrodes of the surface conduction electron-emitting device, respectively.

The envelope (119) is composed of the face plate (117), the support frame (113) and the rear plate (112) as described above. Rear plate (112)
Is mainly provided for the purpose of reinforcing the strength of the electron source substrate (107), so that if the electron source substrate itself has sufficient strength, a separate rear plate may not be used. That is,
The envelope (119) may be formed by directly sealing the support frame (113) to the electron source substrate (107). Further, by providing a support body (not shown) called a spacer (atmospheric pressure resistant support member) between the face plate (117) and the rear plate (112), sufficient strength against atmospheric pressure can be obtained. It is also possible to construct an envelope having the same.

FIG. 12 is a schematic diagram showing a fluorescent film. The fluorescent film can be composed of only a phosphor in the case of monochrome. In the case of color, a black member (120) called a black stripe (FIG. 12A) or a black matrix (FIG. 12B) depending on the arrangement of the phosphors.
And a phosphor (121). In the case of color display, the purpose of providing the black stripes or the black matrix is to make the color mixture between the phosphors of the three primary color phosphors inconspicuous by making them black, and to reduce the contrast due to external light reflection. It is to suppress the decrease. As a material for the black stripe, other than a material mainly containing graphite which is usually used,
This can be used if it is a material that transmits and reflects light little. As a method for applying the phosphor to the glass substrate (114), a precipitation method, a printing method, or the like can be adopted regardless of monochrome or color.

A metal back (116) is usually provided on the inner surface side of the fluorescent film (115). The purpose of providing the metal back is to improve the luminance by specularly reflecting the light on the inner surface side of the light emission of the phosphor to the face plate (117) side, and to act as an electrode for applying an electron beam acceleration voltage. That is, the phosphor is protected from damage due to collision of negative ions generated in the envelope. The metal pack can be formed by performing a smoothing process (usually called “filming”) on the inner surface of the fluorescent film after forming the fluorescent film, and then depositing Al using vacuum deposition or the like.

The face plate (117) may be provided with a transparent electrode (not shown) on the outer surface side (glass substrate side) of the fluorescent film in order to further enhance the conductivity of the fluorescent film (115).

When the above-mentioned envelope is sealed, a collar is used.
In the case of, it is necessary to associate each color phosphor with the electron-emitting device.
However, sufficient alignment is essential. Shown in Figure 11
In the case of a display panel that has been manufactured, for example, it is manufactured as follows.
It is. The envelope (119) is the same as the stabilization processing described above.
Ion pump, sorption pump while heating appropriately
Exhaust pipe not shown by an exhaust device that does not use oil such as
Exhaust through 10 ^-7Of organic materials with a vacuum degree of Torr
After making the atmosphere sufficiently small, it is sealed. Envelope (11
9) Getter treatment to maintain the degree of vacuum after sealing
May be performed. This is the sealing of the envelope (119).
Immediately before or after sealing, apply resistance heating, high frequency heating, etc.
The position of the gate located at a predetermined position (not shown) inside the envelope.
It is a process of heating the substrate to form a vapor deposition film. Getter
Usually has Ba as a main component,
For example, 10^-Five-10^-7Maintaining Torr vacuum
Can be.

Next, an example of the configuration of a drive circuit for performing television display based on an NTSC television signal in a display panel constructed by using an electron source substrate having a simple matrix arrangement will be described with reference to FIG. To do. In the figure, 122 is a display panel, 123 is a scanning circuit, and 1
24 is a control circuit, 125 is a shift register, 126 is a line memory, 127 is a synchronizing signal separation circuit, 128 is a modulation signal generator, and Vx and Va are DC voltage sources.

The display panel (122) has terminals Dox1 to Dox.
It is connected to an external electric circuit via xm, terminals Doy1 to Doyn, and high-voltage terminal Hv. The terminals Dox1 to Doxm are connected to the electron source substrate provided in the display panel, that is, m.
A scanning signal is applied to sequentially drive the surface conduction electron-emitting device groups, which are arranged in a matrix of rows and n columns, row by row (n elements). A modulation signal for controlling the output electron beam of each element of the surface conduction electron-emitting devices in one row selected by the scanning signal is applied to the terminals Doy1 to Doyn. The high voltage terminal Hv is supplied with a DC voltage of, for example, 10 K [V] from a DC voltage source Va, which is sufficient to excite the phosphor into an electron beam emitted from the surface conduction electron-emitting device. It is an accelerating voltage for applying energy.

The scanning circuit (123) has m switching elements inside (S1 to Sm in FIG. 13).
Is shown schematically in). Each switching element selects either the output voltage of the DC voltage source Vx or 0 [V] (ground level), and is electrically connected to the terminals Dox1 to Doxm of the display panel (122). Each of the switching elements S1 to Sm operates on the basis of a control signal Tscan output from the control circuit (124).
It can be configured by combining switching elements such as ET.

In the case of the present example, the DC voltage source Vx is based on the characteristics of the surface conduction electron-emitting device (electron emission threshold voltage), and the driving voltage applied to the non-scanned device emits electrons. It is set to output a constant voltage that is equal to or less than the value voltage.

The control circuit (124) has a function of matching the operation of each part so that an appropriate display is performed based on an image signal input from the outside. This control circuit uses the sync signal Tsync sent from the sync signal separation circuit (127).
Based on the above, Tscan, Tsft, and Tmry control signals are generated for each unit.

The sync signal separation circuit (127) is a circuit for separating the sync signal component and the luminance signal component from the NTSC system television signal input from the outside, and is a general frequency separation (filter) circuit or the like. Composed using. The sync signal separated by the sync signal separation circuit is composed of a vertical sync signal and a horizontal sync signal, but is illustrated here as a Tsync signal for convenience of description. The volatility signal component of the image separated from the television signal is represented as a DATA signal for convenience. This DATA signal is input to the shift register (125).

The shift register (125) is for serially / parallel converting the DATA signals serially input in time series for each line of the image, and the control sent from the control circuit (124). It operates based on the signal Tsft (that is, the control signal Tsft can be said to be the shift clock of the shift register (125)).
Data of one line of the serial / parallel converted image (corresponding to drive data for n electron-emitting devices) is Id1.
~ Idn n parallel signals as the shift register (1
25).

The line memory (126) is a storage device for storing data for one line of an image only for a required time, and a control signal Tmr sent from the control circuit (124).
The contents of Id1 to Idn are written according to y. The stored contents are output as Id'1 to Id'n and input to the modulation signal generator (128).

The modulation signal generator (128) is a signal source for appropriately driving and modulating each of the surface conduction electron-emitting devices according to each of the image data Id'1 to Id'n, and its output signal. Is a display panel (12) through terminals Doy1 to Doyn.
It is applied to the surface conduction electron-emitting device in 2).

The electron-emitting device of the present invention has the following basic characteristics with respect to the emission current Ie. That is, the electron emission has a clear threshold voltage (Vth), and the electron emission occurs only when a voltage higher than Vth is applied. For a voltage equal to or higher than the electron emission threshold value, the emission current also changes according to the change in the voltage applied to the device. From this, when a pulse-like voltage is applied to the element, for example, when a voltage lower than the electron emission threshold is applied, electron emission does not occur, but when a voltage higher than the electron emission threshold is applied. Outputs an electron beam. At that time, the intensity of the output electron beam can be controlled by changing the peak value Vm of the pulse. Further, by changing the pulse width Pw, it is possible to control the total amount of charges of the output electron beam.

Therefore, as a method of modulating the electron-emitting device according to the input signal, a voltage modulation method, a pulse width modulation method or the like can be adopted. When carrying out the voltage modulation method, the modulation signal generator (128) generates a voltage pulse of a fixed length and appropriately modulates the peak value of the pulse according to the input data. Can be used.

When implementing the pulse width modulation method,
As the modulation signal generator (128), a pulse width modulation type circuit that generates a voltage pulse having a constant crest value and appropriately modulates the width of the voltage pulse according to input data can be used.

As the shift register (125) and the line memory (126), either a digital signal type or an analog signal type can be adopted. This is because serial / parallel conversion and storage of the image signal may be performed at a predetermined speed.

When the digital signal type is used, it is necessary to convert the output signal DATA of the sync signal separation circuit (127) into a digital signal. For this, an A / D converter is provided at the output part of the sync signal separation circuit. It should be provided. In this connection,
The circuit used for the modulation signal generator (128) is slightly different depending on whether the output signal of the line memory (126) is a digital signal or an analog signal. That is, in the case of the voltage modulation method using a digital signal, for example, a D / A conversion circuit is used for the modulation signal generator (128), and an amplification circuit or the like is added if necessary. In the case of the pulse width modulation method, the modulation signal generator (128) compares, for example, a high-speed oscillator and a counter (counter) that counts the number of waves output by the oscillator with the output value of the counter and the output value of the memory. A circuit that combines comparators is used. If necessary, an amplifier for voltage-amplifying the pulse-width-modulated modulation signal output from the comparator to the drive voltage of the surface conduction electron-emitting device can be added.

In the case of the voltage modulation method using an analog signal, the modulation signal generator (128) can adopt, for example, an amplifier circuit using an operational amplifier or the like, and a level shift circuit or the like can be added if necessary. . In the case of the pulse width modulation method, for example, a voltage controlled oscillator (VCO)
Can be adopted, and an amplifier for amplifying the voltage up to the driving voltage of the surface conduction electron-emitting device can be added if necessary.

In the image forming apparatus of the present invention which can be constructed as described above, each of the electron-emitting devices has a terminal D outside the container.
Electron emission occurs by applying a voltage through ox1 to Doxm and Doy1 to Doyn. A high voltage is applied to the metal back (116) or a transparent electrode (not shown) via the high voltage terminal Hv to accelerate the electron beam. The accelerated electrons collide with the fluorescent film (115) and emit light to form an image.

The configuration of the image forming apparatus described above is an example, and various modifications can be made based on the technical idea of the present invention. As for the input signal, the NTSC system is mentioned, but the input signal is not limited to this, and PALSECA
In addition to M system, TVs with more scanning lines than this
Signal (for example, high-quality T including MUSE method)
V) method can also be adopted.

Next, the ladder-shaped electron source substrate and the display panel will be described with reference to FIGS. 14 and 15, respectively.

FIG. 14 is a schematic diagram showing an example of a ladder-shaped arrangement type electron source substrate. In the figure, 129 is an electron source substrate, and 130 is a surface conduction electron-emitting device. 13
Dx1 to Dx10 of 1 are surface conduction electron-emitting devices (13
0) is a common wiring for connecting 0). A plurality of surface conduction electron-emitting devices (130) are arranged in parallel in the X direction on the substrate. A plurality of the element rows are arranged to form an electron source substrate. By applying a drive voltage between the common wires of each element row, each element row can be driven independently. That is, a voltage equal to or higher than the electron emission threshold value is applied to the element row where the electron beam is desired to be emitted, and a voltage equal to or lower than the electron emission threshold value is applied to the element row which does not emit the electron beam.
The common wirings Dx2 to Dx9 between the element rows are, for example, Dx2 and Dx3.
It is also possible to use the same wiring for and.

FIG. 15 is a perspective view showing an example of a display panel equipped with the ladder-shaped electron source substrate. 13
2 is a grid electrode, 133 is an opening for passing electrons,
Dox1 to Doxm are terminals outside the container. G1 to Gn are terminals outside the container connected to the grid electrode (132). FIG.
5 is different from the display panel including the electron source substrate of the simple matrix arrangement type shown in FIG. 11 in that the electron source substrate (129) and the face plate (11
7) and whether or not a grid electrode (132) is provided.

The grid electrode (132) is for modulating the electron beam emitted from the surface conduction electron-emitting device, and is a striped electrode provided orthogonal to the ladder-shaped element rows. is there. Each grid electrode is provided with a circular opening (133) corresponding to each element in order to pass an electron beam.
The shape and installation position of the grid electrode are not limited to those shown in FIG. For example, a large number of through holes may be provided in the form of a mesh as openings, and the grid electrode may be provided around or near the surface conduction electron-emitting device.

The terminals outside the container (Dox1 to Doxm) and the terminals outside the grid container (G1 to Gn) are electrically connected to a control circuit (not shown).

In the image forming apparatus provided with the display panel of this example, a modulation signal for one image line is simultaneously applied to the grid electrode columns in synchronization with the sequential driving (scanning) of the element rows one column at a time. . This makes it possible to control the irradiation of each electron beam onto the phosphor and display an image by 1 line.

The flat-panel image forming apparatus of the present invention described above is used as a display device for television broadcasting, a display device such as a video conference system, a computer, etc., and an optical printer constituted by using a photosensitive drum and the like. It can also be used as an image forming apparatus or the like.

[0123]

As is apparent from the above description, according to the present invention, even if an unexpected external force or the like is applied to the flat panel image forming apparatus, the flat panel image forming apparatus is supported and stays in a half-overturned state. As a result, a gap is formed between the image forming unit and surrounding objects, so that the image forming unit can be protected. Further, the image forming portion protecting means of the present invention does not impair the thinness and lightness of the flat plate type image forming apparatus.

[Brief description of drawings]

FIG. 1 is an explanatory diagram of a flat panel image forming apparatus of the present invention.
FIG. 1A is a schematic perspective view of a flat plate type image forming apparatus according to the present invention, and FIG. 1B is a schematic sectional view of an image forming portion protection unit.

FIG. 2 is an explanatory diagram of functions of the flat panel image forming apparatus of the present invention.

FIG. 3 is a schematic perspective view of a flat plate type image forming apparatus (partially cut away) of the present invention.

FIG. 4 is a schematic perspective view of a flat panel image forming apparatus of the present invention.

FIG. 5 is a schematic perspective view of a flat panel image forming apparatus of the present invention.

FIG. 6 is an explanatory diagram of a flat surface conduction electron-emitting device according to the present invention.

FIG. 7 is an explanatory diagram of a vertical surface conduction electron-emitting device according to the present invention.

FIG. 8 is an explanatory diagram of a method of manufacturing a surface conduction electron-emitting device according to the present invention.

FIG. 9 is an explanatory diagram of voltage waveforms in an energization forming process adopted when manufacturing the surface conduction electron-emitting device according to the present invention.

FIG. 10 is an explanatory diagram (schematic diagram) of a matrix arrangement type electron source substrate in the present invention.

FIG. 11 is an explanatory diagram of a display panel of the flat panel image forming apparatus of the present invention.

FIG. 12 is an explanatory diagram (schematic diagram) of a fluorescent film used in the display panel of the flat panel image forming apparatus of the present invention.

FIG. 13 is an NTS in the flat panel image forming apparatus of the present invention.
FIG. 9 is an explanatory diagram (block diagram) of a drive circuit for performing display in accordance with a C system television signal.

FIG. 14 is an explanatory diagram (schematic diagram) of a ladder-type arrangement type electron source substrate of the present invention.

FIG. 15 is an explanatory diagram of a display panel of the flat panel image forming apparatus of the present invention.

FIG. 16 is a schematic side view of a conventional flat plate image forming apparatus.

FIG. 17 is a schematic plan view of a conventional surface conduction electron-emitting device.

[Explanation of symbols]

 1, 201 image forming part 2 image forming part protecting means 3, 7 rotation mounting part 4 installation surface 5 surrounding object 6a image forming part protecting means 6b when housed 6b image forming part protecting means after operation 8 hooking part 9 hooking stop 10 Storage space 11 Image forming part protective plate 12 Wall 13, wire 14, 15 Stopper 16 Length adjusting means 21 Image forming part protecting means main body 22 Mounting hole 23 Tip part 24 Spring 25 Rubber 101, 301 Substrate 102, 103 Element electrode 104 , 302 conductive thin films 105, 303 electron emitting portion 106 step forming portion 107, 129 electron source substrate 108 X-direction wiring 109 Y-direction wiring 110, 130 surface conduction electron-emitting device 111 connection 112 rear plate 113 support frame 114 glass substrate 115 Fluorescent film 116 Metal back 117 Face plate 118 Pressure terminal 119 Enclosure 120 Black member 121 Phosphor 122 Display panel 123 Scanning circuit 124 Control circuit 125 Shift register 126 Line memory 127 Synchronous signal separation circuit 128 Modulation signal generator Vx, Va DC voltage source 131 Common wiring 132 Grid electrode 133 Opening 202 Leg 203 Built-in weight

Claims (9)

[Claims] 1. A flat plate image forming apparatus, wherein image forming portion protection means is provided so as to form a gap between a surrounding object and the image forming portion when the apparatus falls over. 2. A side surface of a flat plate type image forming apparatus, wherein the image forming section protecting means has a rotation center so that the image forming section protecting means operates in the falling direction and can support the flat plate type image forming apparatus at the time of falling. A flat plate image forming apparatus according to claim 1, which is provided on at least one of the front surface and the upper surface. 3. The flat plate image forming apparatus according to claim 2, wherein the image forming unit protecting means is fixed to a maximum angle within a preset angle against the shaking of the flat plate image forming apparatus once or a plurality of times. apparatus. 4. The flat plate type image forming apparatus according to claim 2, wherein the image forming portion protecting means is provided with a slip preventing means. 5. The flat plate type image forming apparatus according to claim 2, wherein the image forming portion protecting means is provided with a shock absorbing means. 6. The flat plate image forming apparatus according to claim 1, wherein the image forming portion protecting means is a plate-like means provided at at least one side surface, front surface, or upper surface of the flat plate image forming apparatus. 7. The flat image forming apparatus according to claim 1, wherein the image forming portion protecting means is a string-like means for connecting a fixed object around the flat image forming apparatus to the surrounding fixed object. 8. A display panel, a rear plate provided with an electron-emitting device, a face plate provided with a member to be irradiated which is arranged to face the rear plate and receives electrons emitted from the electron-emitting device, and the rear plate. The flat plate image forming apparatus according to any one of claims 1 to 7, which is configured by a support frame disposed between a peripheral portion of the face plate and the face plate. 9. The flat panel image forming apparatus according to claim 8, wherein the electron-emitting device is a surface conduction electron-emitting device.