JPH09185835A - Optical pickup device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To efficiently dissipate heat produced from components of a movable part therefrom and to suppress an increase in a weight of the movable part as much as possible. SOLUTION: A heat conductive member 2 dissipates heat by conduction, which is produced by heat-producing components of a movable part of an optical pickup as semiconductor laser 1, photo receiving element 3, and amplifier 4, to a fixed part 60 of the optical pickup having a large thermal capacity by means of bending, without disturbing a movement of the movable part of the optical pickup, namely, without deteriorating a motion characteristic of the movable part of the optical pickup. Consequently, breakage of heat-producing parts themselves, breakage of their peripheral components due to the heat- production, etc., are avoided and an optical pickup device of a high reliability can become available.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for condensing a laser beam into a minute spot on an optical recording medium to optically reproduce information, and more particularly to an optical device in which a movable part is provided with a component that generates heat during operation. The present invention relates to a pickup device.

[0002]

2. Description of the Related Art An optical pickup used for reading a signal on a disk surface of a read-only compact disk memory (CD-ROM) or the like uses a semiconductor laser as a light emitting element and a laser beam by a condenser lens or the like. Information is read by converging a minute spot on the surface. An optical information reproducing device using such an optical pickup has problems such as miniaturization and thinning so that it can be mounted on a portable personal computer or the like.

FIG. 7 is a side view showing the structure of a conventional optical pickup device. A laser unit 80 that emits laser light is provided on the side of the optical disc 50 that faces the information recording surface.
A raising mirror 86 for guiding the laser light reflected on the surface of the optical disc 50 in a predetermined direction and an objective lens 88 for condensing the laser light on the information recording surface are arranged.

In the laser unit 80, a semiconductor laser 81 for generating and emitting laser light, and a multi-division sensor 82 for receiving the laser light reflected on the surface of the optical disk 50 and guided by the rising mirror 86 are mounted. Has been done.

An optical member 83 is fixed to the light emitting portion of the laser unit 80. The optical member 83 guides the reflected light from the three-beam generating diffraction grating 84 and the optical disk 50 to the multi-division sensor 82. The diffraction grating 85 is formed.

Next, the general operation of the optical pickup device will be described. The laser light emitted from the semiconductor laser 81 is 3
Main beam (0th order light) by the beam generation diffraction grating 84
And two secondary beams for tracking (+ 1st order light, -1
Next light), and is diffracted into.

Three beams emitted from the diffraction grating 84 for generating three beams
The beam passes through the optical member 83, is deflected by the rising mirror 86 toward the optical disc 50 by 90 °, and is then reflected by the objective lens 88.
Thus, the light is focused on the information recording surface of the optical disc 50.

Then, the reflected light of the laser light reflected by the information recording surface of the optical disk 50 reaches the optical member 83 by following an optical path substantially opposite to the outward path.

The light reaching the optical member 83 is reflected by the diffraction grating 8
5 is deflected by the diffraction of 5 and guided to the multi-division sensor 82,
It is photoelectrically converted and detected as a data signal, a focus error signal, and a tracking error signal.

By the way, in general, an optical pickup device is
A focus function that follows the surface wobbling of the optical disc 50 to focus, a coarse seek mechanism that moves at least the bobbin on which the objective lens 88 is mounted and the fixed portion near a desired data track on the information recording surface of the optical disc 50, and the optical disc 50. It is necessary to have a tracking function that allows the spot to follow the waviness of the data track caused by eccentricity.

Now, the focus function and the tracking function will be described. In FIG. 7, a lens holder 89 for fixing the objective lens 88 is supported by a supporting member 95 so as to be movable in two axial directions of a focus driving direction and a tracking driving direction.

The focus / tracking actuator 90 has a focusing coil 93 and a tracking coil 94 fixed to the lens holder 89, and magnets 92a and 92b fixed to the yoke 91.
And form a magnetic circuit.

In an ordinary optical pickup, the laser light reflected on the surface of the optical disc 50 is divided into multi-split sensors 8.
A rising mirror 86 for guiding the reflected light to the optical disc 2 and astigmatism are given to the reflected light so that the focus deviation and tracking deviation of the light focused on the optical disk 70 can be detected and imaged on the multi-division sensor 82. Optical elements etc. are required.

Therefore, the number of optical components is increased, which makes it difficult to align the optical axis and the manufacturing cost is high.

Further, as the number of optical components increases,
There has been a problem that the optical pickup cannot be downsized.

In order to solve these problems, an optical integrated device in which a condenser lens, a hologram element, a reflecting mirror, etc. are integrated, and an integrated optical pickup device using the same have been proposed.

FIG. 8 is a perspective view showing the structure of a conventional integrated optical pickup device. The pickup device includes a silicon substrate 6, and the silicon substrate 6 has a light receiving element 3
Also, an amplifier 4 for converting / amplifying the current signal photoelectrically converted by the light receiving element 3 into a voltage signal is formed by a semiconductor process or the like.

The semiconductor laser 1, which is a light emitting element, is soldered and fixed to the silicon substrate 6.

The rising mirror 7 is similarly fixed to the silicon substrate 6 and reflects the light from the semiconductor laser 1 to the optical member 10 integrally molded using an optical resin having a high light transmittance.

On the surface of the optical member 10 facing the optical disk (not shown), a condensing part 1 having a diffraction grating type lens is formed.
1 is provided.

Further, the pickup device includes an optical member 10.
And an optical system holding member 12 for holding the relative positional relationship of the silicon substrate 6 on which the semiconductor laser 1, the light receiving element 3 and the like are mounted.

In the following description, the semiconductor laser 1,
Light receiving element 3, amplifier 4, silicon substrate 6, rising mirror 7, optical member 10, condensing unit 11, and optical system holding member 12.
Is held by the rod spring 40 and the like in a movable state with respect to the fixed portion 30, and thus these members are collectively referred to as a movable portion.

This movable part is driven by a driving means (not shown) which applies electromagnetic force, and is controlled so that the optical positional relationship between the information recording track on the optical disk and the condensing part 11 is constant.

The control operation will be described below. The laser light emitted from the semiconductor laser 1 is the optical member 1.
It passes through a three-beam diffraction grating provided on the incident surface of 0,
Main beam (0th order light) and tracking sub-beam (+1
Next light, minus first light), the traveling direction is changed by the reflection part, further converted into converged light by the spherical reflection mirror of the optical member 10, diffracted by the condensing part 11, and the diffracted light is illustrated. Not focused on the surface of the optical disc.

The reflected light which is reflected on the surface of the optical disk and whose amount of reflected light is modulated in accordance with the recorded information and spreads again passes through the condensing portion 11 and enters the optical member 10 and is converged by the spherical reflecting mirror. The traveling direction is changed by the reflecting portion, and an image is formed on the light receiving element 3.

The laser light imaged on the light receiving element 3 is photoelectrically converted by the light receiving element 3 and then converted into current / current by the amplifier 4.
The voltage is converted and detected as a data signal, a focus error signal, and a tracking error signal.

The flexible cable 5 is electrically connected to the amplifier 4 by a wire bonding method or the like and transmits the amplified signal to an optical pickup control circuit (not shown).

The optical pickup device is composed of the movable portion and the fixed portion 30 as described above, and drives the focus control mechanism and the tracking control mechanism in accordance with the focus error signal and the tracking error signal to drive the optical disc. Following the surface wobbling and eccentricity of the optical disc, a minute spot narrowed to the diffraction limit is always formed on the surface of the optical disc.

In the integrated optical pickup device using this optical integrated device, the number of parts is significantly reduced, and the total height of the optical pickup device can be reduced to 5 mm or less by integrating optical parts.

[0030]

By the way, in the optical pickup device using the optical integrated device, as described above, the electric signals from the semiconductor laser 1, the light receiving device 3, and the light receiving device 3 are converted into current / voltage. The movable portion is provided with the amplifier 4 that amplifies and withstands transmission to the outside of the optical pickup, and the movable portion is thermally insulated from the outside.

Therefore, there is a possibility that the heat generated from the components forming the movable portion may cause a failure in the function of the components constituting the movable portion.

If the heat generated from these components cannot be sufficiently dissipated, (1) the semiconductor laser 1 will generate heat by itself and the junction will be damaged and oscillation will not occur.

(2) The rising mirror 7 is provided on the silicon substrate 6, and if the rising mirror 7 is deformed or displaced due to heat, the reflection direction of the light from the semiconductor laser 1 and the wavefront of the reflected light are required. It becomes impossible to satisfy the condition of, and the function as an optical pickup is deteriorated or cannot be fulfilled.

(3) Noise due to heat is also mixed in the electric signals from the light receiving element 3 and the amplifier 4, which are also installed on the silicon substrate 6, resulting in the same result as (2).

(4) Further, if the amount of heat released is smaller than the amount of heat generated, the thermal deformation will extend to the optical member 10 and the light converging portion 11, and in the worst case, the movable portion will be deformed into an irreversible state. As a result, it will be damaged. However, inconveniences such as the above will occur.

In particular, an optical component, such as a thermoplastic (for example, PMMA), which is provided integrally with the movable part, is provided.
When the size of the lens made of etc. changes, large wavefront aberration occurs, the laser beam spot cannot be narrowed down to the diffraction limit on the optical disk, and the problem that the specified performance cannot be obtained occurs. was there.

Conventionally, a heat sink or the like provided with a heat exhaust fin is generally used as a means for exhausting heat from the heat generating component. However, the movable part of the optical pickup is the minimum necessary for improving its movement characteristics. It is necessary to reduce the weight as much as possible while ensuring the rigidity of, and it is very difficult to provide a heat exhaust member such as a heat sink.

Therefore, an object of the present invention is to provide an optical pickup device capable of efficiently discharging the heat generated from the parts of the movable part to the outside of the movable part and suppressing the increase in the weight of the movable part as much as possible. .

[0039]

In the optical pickup device of the present invention, an optical pickup movable portion including a heat-generating component is supported by an optical pickup fixed portion having a large heat capacity, and the optical pickup movable portion and the optical pickup fixed portion are provided between the movable portion. Further, a heat conducting member made of a bendable material for transmitting heat generated in the movable portion of the optical pickup to the side of the fixed portion of the optical pickup is disposed. According to the present invention, the heat conducting member can transfer heat without disturbing the movement of the movable portion of the optical pickup, so that the amount of heat generated in the optical pickup can be effectively radiated.

[0040]

BEST MODE FOR CARRYING OUT THE INVENTION The invention according to claim 1 of the present invention is
An optical pickup movable part including a heat generating component, an optical pickup fixed part having a large heat capacity for supporting the optical pickup movable part, and an optical pickup provided between the optical pickup movable part and the optical pickup fixed part. And a heat conducting member made of a bendable material that transfers the heat generated in the movable portion of the optical pickup to the side of the fixed portion of the optical pickup without hindering the movement of the movable portion. As described above, the heat conduction member does not interfere with the movement of the movable portion of the optical pickup by being bent, that is, without deteriorating the motion characteristics of the movable portion of the optical pickup, so that the heat generated by the heat-generating component of the movable portion of the optical pickup is prevented. The heat can be transferred to the fixed side of the optical pickup having a large heat capacity and radiated.

According to a second aspect of the present invention, in the first aspect of the invention, at least a part of the heat conducting member is arranged in the vicinity of the installation surface of the heat generating component provided in the movable part.

According to the second aspect of the present invention, in addition to the function of the first aspect of the invention, at least a part of the heat conducting member is arranged in the vicinity of the installation surface of the heat generating component provided in the movable part. Therefore, the heat generated from the heat-generating components is immediately absorbed,
It can be transmitted, the durability against bending is improved, and the reliability is improved.

The invention according to claim 3 of the present invention is the invention according to claim 1.
Alternatively, in the invention of claim 2, the heat conducting member is made of a material having a thermal conductivity of 900 W / m · k or more.

According to the invention of claim 3 of the present invention, in addition to the function of the invention of claim 1 or 2, a material having a thermal conductivity of 900 W / m · k or more is used as the heat conducting member. Since it is used, it can efficiently transfer heat and perform efficient heat dissipation.

The invention according to claim 4 of the present invention is the invention according to claim 1.
In the invention according to any one of claims 1 to 3, the heat conducting member is a material having anisotropy in heat conductivity, and the heat conductivity in a heat transfer direction from the heat generating component to the optical pickup fixing portion. On the other hand, the installation direction of the heat-conducting member is set so that the heat conductivity in the other heat-transfer directions becomes small. As described above, according to the present invention, in addition to the effect of the invention according to any one of claims 1 to 3, the heat conducting member is a material having an anisotropic thermal conductivity, Since the installation direction of the heat conducting member is set so that the heat conductivity in the other heat transfer direction is smaller than the heat conductivity in the heat transfer direction to the optical pickup fixing part, heat transfer is concentrated on other parts. It is possible to immediately absorb and transfer the heat generated from the heat-generating component without doing so.

The invention according to claim 5 of the present invention is the invention according to claim 1.
In the invention described above, the heat generating component is configured to be sandwiched by a second heat conducting member. As described above, according to the invention, in addition to the function of the invention described in claim 1, since the heat generating component is sandwiched by the second heat conducting member, the heat generating component and the heat conducting member can be connected reliably and efficiently. Therefore, the heat generated by the heat-generating component can be dissipated more efficiently.

According to a sixth aspect of the present invention, in the fifth aspect of the invention, the second heat conducting member is formed integrally with the heat conducting member. As described above, according to the invention, in addition to the function of the invention described in claim 6, since the second heat conducting member is integrally formed with the heat conducting member, the heat transfer is performed more efficiently to dissipate the heat. I can do it.

According to a seventh aspect of the invention, in the invention according to any one of the first to sixth aspects, the heat conducting member is bent to exchange an electrical signal from the movable portion of the optical pickup to the fixed portion. Configured to integrate with possible signal conductors. As described above, according to the invention, in addition to the action of the invention described in any one of claims 1 to 6, the heat conducting member is bent to exchange an electrical signal from the movable portion of the optical pickup to the fixed portion. Since it is integrated with a possible signal conductor, the device configuration can be simplified and handling becomes easy.

According to an eighth aspect of the invention, in the seventh aspect, an insulating member between the heat conducting member and the signal conducting wire is used for fixing the heat conducting member. As described above, according to the invention, in addition to the effect of the invention described in claim 7, since the insulating member between the heat conducting member and the signal conducting wire is used for fixing the heat conducting member, the assembly is facilitated and the bending is facilitated. Durability is improved and reliability is improved.

Next, preferred embodiments of the present invention will be described with reference to the drawings. (Embodiment 1) FIG. 1 is a perspective view of an optical pickup device according to a first embodiment of the present invention.

The optical pickup device includes a semiconductor laser 1 for emitting a laser beam and a light receiving element 3 for receiving the laser beam.
And an amplifier 4 that converts an output current signal photoelectrically converted by the light receiving element 3 into an output voltage signal, amplifies and outputs the output voltage signal, and a rising mirror 7 for guiding laser light in a predetermined direction. The semiconductor laser 1, the light receiving element 3, the amplifier 4, and the rising mirror 7 are formed on the silicon substrate 6.

Further, the silicon substrate 6 is soldered to the copper plate 13 having high thermal conductivity.

A heat conducting member 2 having high flexibility and high heat conductivity is adhered to the copper plate 13, and the heat conducting member 2 is connected to a fixing portion 60 as a low temperature body having a large heat capacity. In this case, the heat conducting member 2 is preferably made of a material having a large heat conductivity and excellent flexibility, and examples thereof include those obtained by pressing and molding a thin film containing carbon as a main component. This material has a thermal conductivity of about 900 W especially in the in-plane direction.
/ M · k, which is very excellent and is suitable for the present embodiment. Thus, by using a material having a thermal conductivity of about 900 W / m · k or more, it is possible to efficiently dissipate heat.

By the way, the semiconductor laser 1 is the largest source of heat among the components shown in FIG.

More specifically, the semiconductor laser 1 applies a current of several tens to a small volume (usually about 0.01 cubic millimeter).
Approximately 100 mA is passed to oscillate / emit light.

For example, the semiconductor laser 1 having an optical output of about 30 mW requires an operating current of 85 mA at an operating voltage of 2.4V.

Therefore, the amount of heat generated per unit volume is 1
It can be 7.4 W / cubic millimeter.

Therefore, heat dissipation of the semiconductor laser 1 is an essential condition. Further, as the other heat generating component, the amplifier 4 and the light receiving element 3 can be cited, but the heat generation amount of these is considerably smaller than the heat generation amount from the semiconductor laser 1.

Next, the operation will be described. The heat generated by the operation of the semiconductor laser 1, the light receiving element 3, and the amplifier 4 is transmitted to the silicon substrate 6.

The heat conducted to the silicon substrate 6 is transmitted to the copper plate 13 via the solder layer, and the heat conducted to the copper plate 13 is further transmitted to the fixing portion 60 via the heat conducting member 2 outside the optical disk drive device. It will be radiated to.

According to the first embodiment, when observing the temperature distribution on the silicon substrate 6, there is almost no temperature gradient near the installation location of the rising mirror 7, which causes distortion of the optical parts. There is only a large temperature gradient near the semiconductor laser 1.

By radiating the heat from the components as in the first embodiment, the temperature and the temperature gradient on the silicon substrate 6 have a practically acceptable temperature gradient.

(Embodiment 2) When it is desired to further improve the reliability of the heat generating component and the components in the vicinity thereof, the generated heat is transferred by transferring the heat in the vicinity of the heat generating source or directly to the heat conducting member 2. It is possible to prevent heat diffusion to other parts by minimizing the number of members involved in and the conduction distance.

FIG. 2 shows a perspective view of the optical pickup device according to the second embodiment of the present invention. In FIG. 2, one end of the heat conducting member 22 is fixed to the component mounting surface of the silicon substrate 6 by adhesion or the like.

In the second embodiment, since one end of the heat conducting member 22 is fixed on the same surface near the semiconductor laser 1, the heat generated from the semiconductor laser 1 can be efficiently transferred.

Therefore, the temperature of the component mounting surface of the silicon substrate 6 becomes lower than that of the first embodiment described above, and the thermal gradient becomes gentler.
The thermal influence exerted on the rising mirror 7, the light receiving element 3, and the amplifier 4 as well as the peripheral itself is extremely small.

Therefore, the quality of the signal and the reliability are further improved. Further, the heat conduction member 22 is
Since a part of it is fixed to the copper plate 13, heat transfer through the silicon substrate 6 is secured and the mechanical coupling strength between the heat conducting member 22 and other members is increased.

(Third Embodiment) FIG. 3 shows a perspective view of an optical pickup device according to a third embodiment of the present invention.

In the second embodiment described above, the structure for the purpose of transferring heat only from the semiconductor laser 1 is mentioned. However, the end portion of the heat conducting member on the silicon substrate 6 is further extended,
It is more effective if the semiconductor laser 1 is sandwiched and installed so as to cover the other heat generating member with the heat conducting member 23 that is perforated so as not to interfere with the optical function of the light receiving element 3 or the like.

In this case, if the heat conductivity of the heat conduction member 23 is anisotropic, the direction A in the drawing is set to have a high heat conductivity and the direction B to have a low heat conductivity. If
By setting the heat transfer direction to the outside to be higher than that of the other heat transfer directions, it is possible to prevent heat transfer between the components through the heat transfer member 23 and realize more effective heat dissipation. is there.

(Fourth Embodiment) FIG. 4 is a perspective view of an optical pickup device according to a fourth embodiment of the present invention.

In FIG. 4, the heat conducting member 24 is a second heat conducting member made of a material typified by super graphite. The heat conducting member 24 is provided with a recess so as to sandwich the semiconductor laser 1. There is.

This concave portion is optically and electrically taken into consideration so as not to impair the function of the semiconductor laser 1, and has a structure that does not obstruct the optical path and does not electrically short the upper and lower surfaces of the laser. Needless to say.

Further, since the heat conducting member 24 has a block shape and has mechanical strength, it can be easily screwed to the copper plate 13 by punching as shown in the figure and is also advantageous for heat transfer. It can be fixed by various methods.
In this embodiment, the transferred heat is transmitted to the outside by the heat conducting member 25. Thus, it is possible to more easily obtain the means for efficiently radiating the heat generated by sandwiching the heat generating component.

(Fifth Embodiment) FIG. 5 is a perspective view of an optical pickup device according to a fifth embodiment of the present invention.

In FIG. 5, the heat conducting member 26 is formed by integrally molding the heat conducting member 25 in the fourth embodiment and the heat conducting member 24 which is the second heat conducting member. By integrally forming the heat conducting member in this way, the adhesive and other members do not intervene in the heat transfer path, and more efficient heat dissipation is possible. Even if the width of the heating portion is narrowed, heat can be radiated with higher efficiency.

Moreover, by making the width of the heat transfer portion narrower, the motion characteristics of the movable portion become better.

(Sixth Embodiment) FIG. 6 is a perspective view of an optical pickup device according to a sixth embodiment of the present invention.

In FIG. 6, the optical pickup device is provided with an electric / heat conducting member 27 in which a member called a flexible cable for exchanging a bendable electric signal between a movable portion and a fixed portion and a heat conducting member 28 are integrated. It is configured.

This electric / heat conducting member 27 is shown in FIG. 6 (b).
As shown in FIG. 1, the heat conducting member 28 is provided with the conductive wire 1 with the insulating material 29 typified by polyimide or the like having excellent flexibility interposed therebetween.
5 is integrated.

By doing so, the mechanical durability of the heat conducting member 28 is improved and the bent portion of the heat conducting member 2 which is a heat conductor and a conductor at the same time short-circuits the other electric parts. Can be prevented.

The insulating substance 29 also plays a role of closely adhering and fixing the heat conducting member 2 to the copper plate 13.

By integrating the heat conducting member and the conductive wire member in this way, it is possible to realize easy assembly and high reliability.

As described above, according to each embodiment, the heat generated by the heat generating component provided in the movable portion of the optical pickup device can be efficiently transmitted to the fixed portion side having a large heat capacity. It is possible to prevent an unnecessary temperature rise of each component on the movable part and obtain a more reliable optical pickup device.

As a result of the above, (1) the semiconductor laser 1 does not oscillate due to the damage of the junction due to the heat generated by itself, and long life and high reliability can be secured.

(2) In this embodiment, since the rising mirror 7 does not deform or shift its position,
The reflection direction of the light from the semiconductor laser 1 and the wavefront of the reflected light can satisfy the required conditions, and the function as an optical pickup can be maintained.

(3) Noise due to heat is not mixed in the electric signals from the light receiving element 3 and the amplifier 4 installed on the silicon substrate 6, and a high quality signal can be obtained.

(4) Since the amount of heat radiation can be increased with respect to the amount of heat generated, the optical member 10 and the light condensing unit 1
The deformation of No. 1 is not caused, and the reliability is improved. And so on.

[0089]

According to the first aspect of the invention, the heat conducting member does not hinder the movement of the movable portion of the optical pickup by being bent, that is, without deteriorating the movement characteristics of the movable portion of the optical pickup. Since the heat generated by the heat-generating parts of the movable part of the optical pickup can be transmitted to the side of the fixed part of the optical pickup with a large heat capacity to dissipate heat, damage to the heat-generating parts themselves and damage to peripheral parts due to heat generation is eliminated, resulting in high reliability. An optical pickup device can be obtained.

According to the invention of claim 2, in addition to the effect of the invention of claim 1, at least a part of the heat conducting member is arranged in the vicinity of the installation surface of the heat-generating component provided in the movable part. Since the heat generated from the heat-generating component can be immediately absorbed and transmitted, heat can be dissipated with higher efficiency, the reliability of the heat-generating component and other components can be improved, and the durability against bending can be improved. Reliability is also improved.

According to the invention of claim 3, in addition to the effect of the invention of claim 1 or claim 2, a material having a thermal conductivity of 900 W / m · k or more is used as the heat conducting member. Therefore, heat can be efficiently transferred and heat can be efficiently dissipated.
The reliability of the optical pickup device is improved.

According to the invention of claim 4, in addition to the function of the invention of any one of claims 1 to 3,
The heat conductive member is a material having an anisotropic heat conductivity, so that the heat conductivity in the other heat transfer direction becomes smaller than the heat conductivity in the heat transfer direction from the heat-generating component to the optical pickup fixing part. Since the installation direction of the heat conducting member is set, it is possible to immediately absorb and transfer the heat generated from the heat generating component without intensively transferring the heat to other components, and perform efficient heat dissipation,
The reliability of the optical pickup device is improved.

According to the invention of claim 5, in addition to the function of the invention of claim 1, since the heat generating component is sandwiched by the second heat conducting member, the heat generating component and the heat conducting member can be connected. This is performed reliably and efficiently, and the heat generated by the heat generating component can be radiated more efficiently, and the reliability of the optical pickup device is improved.

According to the sixth aspect of the invention, in addition to the effect of the sixth aspect of the invention, the second heat conducting member is formed integrally with the heat conducting member, so that heat transfer can be performed more efficiently. By doing so, heat can be released and the reliability of the optical pickup device is improved.

According to the invention of claim 7, in addition to the action of the invention of any one of claims 1 to 6,
Since the heat conducting member is integrated with the bendable signal conducting wire for exchanging electrical signals from the movable portion of the optical pickup to the fixed portion, the device configuration can be simplified and the handling becomes easy, and at the same time as the heat generating component. The connection with the heat conducting member is performed reliably and efficiently, the heat generated by the heat generating component can be radiated more efficiently, and the reliability of the optical pickup device is improved.

According to the invention of claim 8, in addition to the operation of the invention of claim 7, the insulating member between the heat conducting member and the signal conducting wire is used for fixing the heat conducting member, so that the assembly is easy. At the same time, the durability against bending is improved and the reliability is improved.

[Brief description of the drawings]

FIG. 1 is a perspective view of an optical pickup device according to a first embodiment of the present invention.

FIG. 2 is a perspective view of an optical pickup device according to a second embodiment of the present invention.

FIG. 3 is a perspective view of an optical pickup device according to a third embodiment of the present invention.

FIG. 4 is a perspective view of an optical pickup device according to a fourth embodiment of the present invention.

FIG. 5 is a perspective view of an optical pickup device according to a fifth embodiment of the present invention.

FIG. 6 is a perspective view of an optical pickup device according to a sixth embodiment of the present invention.

FIG. 7 is a side view showing the structure of a conventional optical pickup device.

FIG. 8 is a perspective view showing a structure of a conventional integrated optical pickup device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Semiconductor laser 2 Thermal conductive member 3 Light receiving element 4 Amplifier 6 Silicon substrate 7 Standing mirror 10 Optical member 11 Condensing part 12 Optical system holding member 13 Copper plate 15 Conductive wire 22 Thermal conductive member 23 Thermal conductive member 24 Thermal conductive member 25 Thermal Conductive member 26 Thermal conductive member 27 Electric / thermal conductive member 28 Thermal conductive member 29 Insulating material 60 Fixed part

Claims (8)

[Claims] 1. An optical pickup movable part including a heat generating component,
An optical pickup fixed part having a large heat capacity for supporting the optical pickup movable part and provided between the optical pickup movable part and the optical pickup fixed part, without interfering with the movement of the optical pickup movable part, An optical pickup device, comprising: a heat-conducting member made of a bendable material that transfers heat generated in the movable portion of the optical pickup to the side of the fixed portion of the optical pickup. 2. The optical pickup device according to claim 1, wherein at least a part of the heat conducting member is arranged near an installation surface of a heat generating component provided in the movable portion. 3. The optical pickup device according to claim 1 or 2, wherein a material having a thermal conductivity of 900 W / m · k or more is used as the heat conducting member. apparatus. 4. The optical pickup device according to any one of claims 1 to 3, wherein the heat conducting member is a material having anisotropy in heat conductivity, and the heat generating component fixes the optical pickup. An optical pickup device, wherein the installation direction of the heat conducting member is set so that the heat conductivity in the other heat transfer direction is smaller than the heat conductivity in the heat transfer direction to the portion. 5. The optical pickup device according to claim 1, wherein the heat generating component is sandwiched by a second heat conducting member. 6. The optical pickup device according to claim 5, wherein the second heat conducting member is formed integrally with the heat conducting member. 7. The optical pickup device according to claim 1, wherein the heat conductive member is a bendable signal conductor wire for exchanging an electrical signal from the movable portion of the optical pickup to a fixed portion. An optical pickup device characterized by being integrated with. 8. The optical pickup device according to claim 7, wherein an insulating member between the heat conducting member and the signal conducting wire is used for fixing the heat conducting member.