JPH09181215A - Semiconductor device, manufacture and packaging thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a small-sized and highly integrated semiconductor device which allows easy and reliable packaging test. SOLUTION: A semiconductor device comprises at least a packaging main body 4 having a wiring board 2 with external terminals 6 on a surface, an overlap portion 5 having a wiring board on which an electronic part including at least a semiconductor chip is mounted, and at least a fold portion 3 having the flexible wiring board 2 which electrically and mechanically connects the packaging main body 4 and the overlap portion 5 which are of the same type or different types of material. The overlap portion 5 is folded at the fold portion 3 and laid on the predetermined packaging main body 4. The packaging main body 4, the fold portion 3 and the wiring board 2 of the overlap portion 5 comprise flexible material (resin film) which can be integrated and can be transparent. The packaging main body 4 also has external terminals within its region overlapped with the electronic-part mounting region of the overlap portion 5. The overlap portion 5 is fixed to the packaging main body 4 with fixing means (adhesive). The mounting region of the semiconductor chip (electronic part) is covered with a seal member 7.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mount type semiconductor device, a method for manufacturing the same and a method for mounting the same.

[0002]

2. Description of the Related Art As a sealing (package) form of a semiconductor device such as an IC or LSI, there are hermetic sealing, non-hermetic sealing and the like.
Further, there are a lead insertion type and a surface mounting type depending on the mounting form of the semiconductor device.

For example, SIP (Single Inline Packag)
e), ZIP (Zigzag Inline Package), PGA (Pin Gr
id Array) is a lead insertion type package in which leads are inserted into the insertion holes of the board, and SOP (Small Outline L-Le
aded Package), SOJ (Small Outline J-Leaded Pac
kage), QFP (Quad Flat Package), QFJ (QuadFl)
at J-Leaded Package), BGA (Ball Grid Array),
HGA (Hall Grid Array) is a surface mount type package.

The SOP and SOJ have a structure in which lead pins (leads) are provided in two directions of a package in which an IC chip is sealed, and the QFP and QFJ have a structure in which lead pins are provided in four directions of the package.

The PGA and BGA have a structure in which a plurality of rows of pin grids and ball grids are provided on the lower surface of the package, and the HGA has a through-hole grid penetrating the substrate.

The HGA is described in "Nikkei Electronics," issued by Nikkei BP, April 24, 1995 (No. 634),
P20. The other packaging technology is described in "VLSI Packaging Technology (above)" issued by the same company, May 15, 1993, P76 to P84.

[0007]

[Problems to be Solved by the Invention] Conventional SOP, SO
In surface mounting type semiconductor devices represented by QFP such as J, QFP, QFJ, leads (external terminals) are provided around the package.
Because of the protrusion, when a semiconductor device is mounted on a mounting board, a mounting portion (solder mounting portion) formed by solder can be easily visually observed, and there is an advantage that the quality of mounting can be easily visually determined.

However, in recent years, as a result of higher density, higher integration and higher functionality of semiconductor devices, the number of signal pins (leads) increases and the pin pitch (lead pitch) tends to narrow. For this reason, a so-called solder bridge in which the solder connecting the land of the wiring board and the lead is connected adjacent to each other is generated, which easily causes a short circuit defect, and makes solder mounting difficult.

In order to prevent such defects such as solder bridges, the lead pitch may be increased.
If the lead pitch is increased, the package becomes larger.

On the other hand, the BGA type semiconductor device has a structure (ball grid) in which bump electrodes (ball electrodes) are arranged in a plurality of rows as external terminals instead of signal pins (leads) on the lower surface of the wiring board. Terminal pitch is QFP
In comparison with surface mount semiconductor devices such as the above, it can be widely used, solder bridges are less likely to occur, and the size of the package can be reduced.

In particular, in the case where the ball electrode is arranged on the wiring board portion directly below the semiconductor chip, the package can be downsized to substantially the same size as the semiconductor chip, so that the semiconductor device can be downsized and the mounting area can be greatly reduced. Available (Nikkei BP's "Nikkei Electronics" January 16, 1995 issue, No.62
6, P76-P86).

However, in this structure, the wiring board interferes,
Since the soldering state cannot be visually inspected, there was concern about the connection reliability of the ball electrode.

Therefore, the wiring board is formed of a transparent material,
What can confirm the soldering condition of the ball electrode through the board (“Nikkei Microdevice” issued by Nikkei BP, 1994 10
An HGA has been developed that can visually inspect the state of solder wicking by using a through-hole that penetrates the board or a board instead of a signal pin.

However, the semiconductor device having these two structures is
Since the structure was developed for the purpose of visually checking the soldering state during mounting, the ball electrode and the through hole cannot be provided directly below the semiconductor chip, and the package becomes much larger than the semiconductor chip.

An object of the present invention is to provide a small-sized semiconductor device in which the mounting state at the time of mounting can be visually observed, a manufacturing method thereof, and a mounting method thereof.

Another object of the present invention is to provide a small-sized semiconductor device in which a mounting state at the time of mounting can be visually observed and which has a high degree of integration, a manufacturing method thereof, and a mounting method thereof.

The above and other objects and novel features of the present invention will be apparent from the description of the present specification and the accompanying drawings.

[0018]

The following is a brief description of an outline of typical inventions disclosed in the present application.

(Semiconductor Device) (1) At least one mounting main body portion including a wiring board having external terminals provided on one surface, and one overlapping portion including a wiring board on which an electronic component including at least a semiconductor chip is mounted, A mounting body portion and at least one folding portion made of a flexible wiring board that electrically and mechanically connects the same kind or different kinds of the overlapping portion, and the overlapping portion is folded at the folding portion. It is returned and stacked on a predetermined mounting main body portion or overlapping portion. In one example, the mounting main body portion, the folding portion 3, and the overlapping portion 5 are each one. Further, the wiring board of the mounting main body portion, the folded-back portion and the overlapping portion is formed of a flexible body (resin film) which is integral and transparent. External terminals are also provided in the mounting body portion area where the electronic component mounting areas of the overlapping portion overlap. The overlapping portion is fixed to the mounting main body by fixing means such as an adhesive or an adhesive tape.
The mounting area of the semiconductor chip is covered with a sealing body.

(2) In the structure of the above-mentioned means (1), a plurality of overlapping portions are stacked on the mounting body portion by folding back the folding portion connected to the mounting body portion.

(3) In the configuration of the above-mentioned means (2), the mounting main body portion and the wiring board of the overlapping portion are formed of a non-flexible body.

(4) In the structure of the above-mentioned means (1), the external terminal is formed by the inner wall of the through hole penetrating the wiring board and the conductor layer provided on the edge thereof.

(5) In the structure of the means (1), there is provided a folded shape defining means for defining a radius of curvature of the folded portion when the folded portion is folded back.

(Manufacturing Method of Semiconductor Device) (6) From a wiring board having at least one mounting main body made of a wiring board having a pedestal on one surface of which external terminals are provided, and an area for mounting electronic components including at least a semiconductor chip. And at least one folding portion made of a flexible wiring board that electrically and mechanically connects the same type or different types among the mounting body portion and the overlapping portion. A step of preparing a wiring board having a configuration in which the overlapping part is folded back at the folding part and stacked on a predetermined mounting main body part or the overlapping part; mounting of an electronic component including a semiconductor chip on the overlapping part and an electrode; A step of electrically connecting the wiring, a step of covering the electronic component mounting area with a sealing body, a step of forming a solder bump electrode on a pedestal of the mounting main body section, and cutting an unnecessary portion of the wiring board. Disconnecting and removing,
And folding the predetermined folded-back portion to stack the overlapping portion on the predetermined mounting main body portion. In one example, the wiring board forming the mounting body portion, the folded portion, and the overlapping portion is made of one transparent resin film (wiring frame), and the mounting body portion, the folding portion, and the overlapping portion are each one. . Further, when stacking the overlapping portion on the mounting main body portion, the overlapping portion is temporarily fixed with an adhesive or an adhesive tape.

(7) In the structure of the above-mentioned means (6), the external terminals provided on the mounting body are the inner wall of the through hole provided on the wiring board forming the mounting body and the conductor layer (HGA) provided on the edge thereof. Structure) and.

(Semiconductor Device Mounting Method) (8) At least one mounting body made of a transparent wiring board having external terminals provided on one surface, and one wiring board having an electronic component including at least a semiconductor chip mounted thereon. A superposed portion, and at least one folded portion formed of a flexible wiring board that electrically and mechanically connects the same or different types of the mounting main body portion and the superposed portion, and the superposed portion is A method of mounting on a mounting board a semiconductor device which is folded back at the folding section and stacked on a predetermined mounting body section or overlapping section, wherein external terminals of the mounting body section are stacked on lands of the mounting board. After heating to fix the external terminal to the land, the connection state of the external terminal is inspected (visual inspection) through the transparent wiring board of the mounting main body, and then it is placed on the mounting main body fixed to the mounting board. The overlapping parts are overlapped. When stacking the overlapping portion on the mounting main body portion, the overlapping portion is fixed with an adhesive or an adhesive tape. In one example, the wiring board that forms the mounting main body portion, the folded portion, and the overlapping portion is made of one transparent flexible resin film, and the mounting main body portion, the folding portion, and the overlapping portion are each one.

(9) A wiring board which is composed of a wiring board and whose external terminals include at least one mounting body formed of an inner wall of the through hole and a conductor layer provided on the edge thereof, and an electronic component including at least a semiconductor chip. And one at least one folded portion made of a flexible wiring board that electrically and mechanically connects the same type or different types of the mounting body portion and the overlapping portion, A method of mounting a semiconductor device, wherein the overlapping portion is folded back at the folding portion and stacked on a predetermined mounting main body portion or the overlapping portion on a mounting substrate, wherein the mounting main body portion of the mounting main body portion is mounted on a land of the mounting substrate. After stacking the external terminals, melt the bonding material provided in advance on the lands or the external terminals to connect the external terminals to the lands, and then suck up into the through holes of the mounting body. The presence or absence of the bonding material was examined the connection state of the external terminals (visual inspection), and then overlaying the superposed portions on the mounting board in a fixed mounting body portion on. After melting the bonding material and connecting the external terminal to the land,
A probe pin is applied to the bonding material sucked up in the through hole of the mounting body to perform an electrical characteristic inspection. When stacking the overlapping portion on the mounting main body portion, the overlapping portion is fixed with an adhesive or an adhesive tape. In one example, the wiring board that forms the mounting main body portion, the folded portion, and the overlapping portion is made of one transparent flexible resin film, and the mounting main body portion, the folding portion, and the overlapping portion are each one.

(Semiconductor Device) According to the above-mentioned means (1), (a) the semiconductor device can be freely folded at the folding portion, and the overlapping portion is stacked on the mounting main body portion as necessary. In addition, since the wiring board (flexible wiring board) is a transparent body, the external terminals on the back surface of the wiring board can be visually observed when the overlapping portion is not overlapped with the mounting main body portion.

(B) In the semiconductor device, the external terminals on the back surface of the wiring board can be visually inspected through the wiring board at any time by opening the overlapping portion. Therefore, the solder mounting state of the external terminals can be visually inspected even after the semiconductor device is mounted on the mounting board. Therefore, the wiring board of the mounting main body can be provided with external terminals even in a portion where the semiconductor chip and the like overlap each other, and the semiconductor device can be miniaturized and the pin count can be increased.

(C) The semiconductor device has a structure in which the folded portion can be freely folded and the superposed portion is stacked on the mounting main body portion as needed. However, the superposed portion is mounted as necessary. Since it can be fixed including temporary fixing with an adhesive or an adhesive tape, the handling of the semiconductor device is improved.

(D) In the semiconductor device, when the bump electrodes are formed on the lower surface of the mounting body 4 by soldering, after forming the bump electrodes, only the mounting body is soaked in a chemical, and the overlapping portion on which the semiconductor chip is mounted is exposed to the chemical. Since the bump electrodes can be formed by using solder that uses a solder flux without using the non-cleaning type solder, which is expensive and does not cost much, it is possible to reduce the manufacturing cost of the semiconductor device.

According to the above-mentioned means (2), since a plurality of overlapping portions can be stacked on the mounting main body portion, further high integration can be achieved in addition to the effect of the constitution of the above-mentioned means (1).

According to the above-mentioned means (3), the wiring board of the mounting main body portion and the overlapping portion is a non-flexible body, but the folding back for electrically and mechanically connecting the mounting main body portion and the overlapping portion. Since the part is formed of the flexible wiring board, the effect of the configuration of the means (1) can be obtained.

According to the above-mentioned means (4), since the external terminal provided in the mounting main body is formed by the inner wall of the through hole penetrating the wiring board and the conductor layer provided at the edge thereof, Since it is possible to observe the presence of solder (bonding material) sucked into the through-holes, external terminals can be placed in the area of the mounting body where semiconductor chips etc. are stacked,
It is possible to reduce the size of semiconductor devices and increase the number of pins.

According to the above-mentioned means (5), the folded-back shape of the semiconductor device is provided in the folded-back portion, and when the folded-back portion is folded back, the folded-back portion is bent with a small radius of curvature so that a great stress is applied to the folded-back portion. Since it is prevented from occurring, the folding portion does not deteriorate even if the folding portion repeatedly performs the folding operation.

(Manufacturing Method of Semiconductor Device) According to the above-mentioned means (6), a wiring board (wiring frame) formed mainly of a transparent resin film is used, and a semiconductor device manufacturing technique by a lead frame established conventionally is used. Since the manufacturing can be performed in the same manner as described above, a high quality BGA type semiconductor device having a folded and superposed structure can be manufactured with high productivity.

According to the above means (7), a wiring board (wiring frame) formed mainly of a transparent resin film
Since manufacturing can be performed in the same manner as in the semiconductor device manufacturing technology using a lead frame which has been established conventionally, it is possible to manufacture a high quality HGA type semiconductor device having a folded and superposed structure with high productivity.

(Semiconductor Device Mounting Method) According to the means (8), (a) the wiring board (flexible wiring board) of the mounting main body portion on which the external terminals are provided is a transparent body. When the external terminals are superposed on the lands of the mounting board, the degree of overlap between the lands and the external terminals can be visually observed, so that the alignment can be accurately and easily performed.

(B) Since the wiring board (flexible wiring board) of the mounting main body portion on which the external terminals are provided is a transparent body, the soldering state of the external terminals and the lands can be visually inspected. The quality inspection can be facilitated and the mounting reliability can be improved.

(C) Since the superposed portion on which the semiconductor chip of the semiconductor device is mounted may be superposed on the mounting main body portion on which the external terminals are arranged after mounting, the mounting main body portion includes the entire area including the central portion. Since the external terminals can be arranged on the semiconductor device, the semiconductor device can be downsized, and the mounting area can be reduced.

According to the means (9), (a) mounting is performed by visually confirming whether or not the bonding material for connecting the external terminal and the land is sucked up in the through hole of the mounting body. Since it can be performed, the quality inspection of mounting becomes accurate and easy.

(B) After mounting, apply a probe pin to the bonding material sucked up in the through hole and apply in-circuit
It is possible to perform an electrical characteristic inspection such as a test.

(C) Since the superposed portion on which the semiconductor chip of the semiconductor device is mounted may be superposed on the mounting main body portion on which the external terminals are arranged after mounting, the mounting main body portion includes the entire area including the central portion. Since the external terminals can be arranged on the semiconductor device, the semiconductor device can be downsized, and the mounting area can be reduced.

[0044]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In all the drawings for describing the embodiments of the present invention, components having the same functions are denoted by the same reference numerals, and their repeated description will be omitted.

(Embodiment 1) FIGS. 1 to 6 are views showing a semiconductor device according to an embodiment (Embodiment 1) of the present invention.
1 is a perspective view showing the external appearance of a semiconductor device, FIG. 2 is a schematic perspective view of a semiconductor device in which a superposed portion is in a half-opened state, FIG. 3 is a front view of the semiconductor device, and FIG. 4 is a schematic diagram of the semiconductor device in a developed state. FIG. 5 is a schematic bottom view showing a state in which a part of the sealing body is removed in the semiconductor device in a developed state, and FIG. 6 is an enlarged cross-sectional view showing a part of the semiconductor device in a developed state.

The semiconductor device according to the first embodiment is a surface-mounting type semiconductor device, and has a grid array structure in which bump-shaped external terminals are arranged in a plurality of rows in a grid pattern on the lower surface, which is similar to the conventional BGA type semiconductor device. Has become.

In the semiconductor device 1 of the first embodiment, as shown in FIGS. 1 and 2 in appearance, a flexible wiring board (wiring board) 2 is folded back at an intermediate folding portion 3. It has a structure. The lower part of the stacked ones forms the mounting main body 4, and a plurality of external terminals 6 formed of solder are provided in a grid array on the lower surface thereof. In addition, a superposed portion 5 is formed on the upper portion, and a sealing body 7 encapsulating a semiconductor chip or the like is provided on the upper surface.

The flexible wiring board (flexible wiring board) 2 is
As shown in FIGS. 4 to 6, an insulating transparent (light-transmitting) resin film 8, a wiring 10 having a desired pattern formed on the back surface of the resin film 8, and the wiring 10 partially covered. It is composed of an insulating protective film 13. The resin film 8 is formed of, for example, a polyimide film. The wiring 10 is formed of a transparent film made of a compound of tin oxide and antimony oxide. The wiring 10 is formed by depositing a compound of tin oxide and antimony oxide on the surface of a polyimide film and then etching it into a desired pattern. The protective film 13 is made of polyimide resin.

The wiring 10 is formed from the mounting body 4 to the folded portion 3
And extends over the overlapping portion 5. In the overlapping portion 5, the tip of the wiring 10 extends in the vicinity of the semiconductor chip 12 fixed to the flexible wiring board 2 with an adhesive 11. Further, in the mounting main body 4, an external terminal 6 made of a solder bump electrode is fixed to a tip portion of the wiring 10.
4 and 5, the wiring 10 is extended from a part of the external terminals 6 and the wiring 10 is not extended from the external terminals 6 of other parts, but in reality, the wiring 10 is extended from all the external terminals 6.
Extend toward the superimposing portion 5 (hereinafter, the same applies to the same drawings).

The semiconductor chip 12 is fixed to the flexible wiring board 2 via the adhesive 11 as described above. In addition, the electrodes of the semiconductor chip 12 and the semiconductor chip 12
The tip portion of the wiring 10 close to the
Are electrically connected by

A rectangular resin flow stop frame 15 made of insulating plastic is fixed to the flexible wiring board 2 via an insulating adhesive 16 so as to surround the semiconductor chip 12. The resin flow stop frame 15 is filled with an insulating resin 17 with a predetermined thickness to form the sealing body 7. The sealing body 7 seals the semiconductor chip 12 and the wires 14.

In the first embodiment, the mounting body 4
The stacking portion 5 to be stacked on the mounting body portion 4 may be simply stacked on the mounting body portion 4. However, in order to prevent the stacking portion 5 from moving during handling, it is temporarily fixed to the mounting body portion 4 with an adhesive tape or an adhesive. It is better to let it (fixing means).

Further, the semiconductor device 1 of the first embodiment is stored in a state in which the overlapping portion 5 is opened and the mounting body portion 4, the folding portion 3, and the overlapping portion 5 are developed on the same plane as shown in FIG. You can also do it.

In the semiconductor device 1 of the first embodiment,
The flexible wiring board 2 is formed of a transparent body. Therefore, as shown in FIGS. 2 and 3, when the overlapping portion 5 is opened around the folded-back portion 3 and the overlapping portion 5 is removed from the mounting main body portion 4, the flexible wiring board 2 is flexible. Wiring board 2
The external terminal 6 provided on the back surface of the can be visually observed. In FIG. 2, the state of the external terminals 6 that can be visually seen through the flexible wiring board 2 is shown by hatching (hereinafter, the hatched wiring 10 portion in the plan view and the bottom view indicates the external terminals 6).

Next, a method of manufacturing the semiconductor device 1 according to the first embodiment will be described.

7 to 12 are views relating to the method for manufacturing the semiconductor device of the first embodiment. FIG. 7 is a schematic plan view of a wiring frame used for manufacturing, and FIG. 8 is a resin flow stop frame fixed. 9 is a schematic plan view showing the formed wiring frame, FIG. 9 is a schematic plan view showing a state where a semiconductor chip is fixed to the wiring frame, FIG. 10 is a schematic plan view showing a wiring frame to which wire bonding is performed, and FIG. 11 is a seal. FIG. 12 is a schematic plan view showing a wiring frame on which a stopper is formed, and FIG. 12 is a schematic plan view showing a wiring frame on which external terminals are formed.

First, the wiring frame 20 is prepared. The wiring frame 20 is a wiring board in which wiring is formed on a flexible transparent polyimide film, and the unit pattern is as shown in FIG.
As shown in FIG.
The flexible wiring board portion 21 includes a frame portion 22 having a rectangular frame shape extending outside and a suspension portion 23 connecting the frame portion 22 and the wiring frame 20. The hanging portions 23 are provided at four corners of the flexible wiring board portion 21 and at the centers of a pair of long sides of the flexible wiring board portion 21, respectively.
The pattern of the wiring frame 20 is formed by punching a polyimide film with a press. If necessary, guide holes and positioning holes may be provided along the edge of the frame portion 22. Further, in manufacturing, the wiring frame 20 may be in the form of multiple frames or a tape.

In the flexible wiring board portion 21, the central portion is the folding portion 3, the left side rectangular portion is the mounting body portion 4, and the right side rectangular portion is the overlapping portion 5. The folded-back portion 3 part is suspended by the suspension portion 23.

Wirings 10 are provided on the flexible wiring board portion 21, as shown in FIG. This wiring 10
Is formed by vapor-depositing a compound of tin oxide and antimony oxide on the surface of an insulating resin film 8, for example, a polyimide film 8, and then etching it into a desired pattern. The wiring 10 reaches the overlapping portion 5 from the mounting body portion 4 through the folding portion 3.

The rectangular portion at the center of the superposed portion 5 becomes a semiconductor chip mounting area, but the tip of the wiring 10 has a pattern in which the tip faces the semiconductor chip mounting area. In addition, in the mounting body 4, the tip of the wiring 10 forms a pedestal 24 for the bump electrode, which is circular. These pedestals 24 are arranged in a grid array.

Further, in the wiring 10, a portion except the tip portion and the pedestal 24 desired in the semiconductor chip mounting region is covered with an insulating protective film 13 made of a polyimide resin (see FIGS. 6, 6 and 6). The protective film 13 is omitted except for FIG. 27).

Next, as shown in FIG. 8, the resin flow stop frame 15 is fixed to the overlapping portion 5 of the flexible wiring board portion 21 of the wiring frame 20 with the adhesive 16 (see FIG. 6). That is, the resin flow stop frame 1 made of insulating plastic is formed on the resin film 8 so as to surround the semiconductor chip mounting area.
5 is fixed. The tip portion of the wiring 10 extends inside the resin flow stop frame 15. The resin flow stop frame 15
Has a function of preventing melted resin from flowing out at the time of resin sealing performed later.

Next, as shown in FIG. 9, the semiconductor chip 12 is fixed to the central semiconductor chip mounting region of the overlapping portion 5 with the adhesive 11 (see FIG. 6). In this case, the semiconductor chip 12 may be fixed to the resin film 8 using an adhesive tape.

Next, as shown in FIG. 10, wire bonding is performed to connect the electrode (not shown) of the semiconductor chip 12 and the tip of the wiring 10 adjacent to the semiconductor chip 12 with a conductive wire 14 (FIG. 6).

Next, as shown in FIG. 11, the resin 17 is filled on the resin film 8 in the resin flow stop frame 15 and cured to form the sealing body 7. As a result, the semiconductor chip 12, the wires 14, and the wiring 10 and the like in the resin flow stop frame 15 are sealed with the sealing body 7 (see FIG. 6).

Next, as shown in FIG. 12, a solder ball is placed on the pedestal 24 at the tip of the mounting body 4 side of the wiring 10 and melted to form the external terminal 6 to be a bump electrode (see FIG. 6). ).

Next, in the wiring frame 20,
The hanging portion 23 is cut along the edge of the rectangular flexible wiring board portion 21, and is composed of the flexible wiring board 2 as shown in FIG. 4, and includes the mounting body portion 4, the folding portion 3, and the overlapping portion 5. The semiconductor device 1 is manufactured.

As shown in FIG. 3, the semiconductor device 1 according to the first embodiment opens the overlapping portion 5 and mounts the mounting body portion 4, the folding portion 3, and the folding portion 3.
The overlapping portion 5 may be stored in a state of being developed on the same plane, or, as shown in FIG. 1, the overlapping portion 5 may be folded back at the folding portion 3 and stored in a state of being stacked on the mounting main body portion 4. May be. If the semiconductor devices 1 are stored in a stacked state and the disposition of the overlapping portion 5 from the mounting body portion 4 is disliked, the overlapping portion 5 may be attached to the mounting body portion 4 with an adhesive tape (weak adhesive tape) or It is advisable to temporarily fix it with an adhesive (weakly adhesive).

Next, mounting of the semiconductor device 1 according to the first embodiment will be described. 13 to 15 show the first embodiment.
FIG. 13 is a view showing a mounted state of the semiconductor device, FIG. 13 is a schematic view showing a mounted start state of the semiconductor device, FIG. 14 is a front view showing the semiconductor device in a state in which a superposed portion is partially inverted after soldering, FIG. 15 is a front view of the semiconductor device showing a state where the superposed portion is superposed on the mounting main body portion after soldering.

The semiconductor device 1 according to the first embodiment is mounted on the mounting substrate 3
13, the semiconductor device 1 is expanded and the external terminals 6 of the mounting body 4 are overlapped on the lands (wiring) 31 of the mounting substrate 30 to temporarily mount the external terminals 6 as shown in FIG. The external terminal 6 can be fixed to the land 31 by heating and melting (solder reflow processing).

Since the flexible wiring board 2 is a transparent body, the land 31 and the external terminals 6 can be visually observed through the flexible wiring board 2 in the positioning work for accurately stacking the external terminals 6 on the lands 31. Therefore, it can be performed easily and accurately. Further, since the quality inspection of the connection between the land 31 and the external terminal 6 after the solder reflow process can be visually confirmed through the flexible wiring board 2, the quality inspection of the mounting is easy and reliable.

When the soldering condition is poor or when a defective phenomenon such as a solder bridge occurs, the mounted semiconductor device 1 is removed and a new semiconductor device 1 is mounted again.

FIG. 2 shows a state in which the external terminals 6 on the back surface of the flexible wiring board 2 can be viewed through the transparent flexible wiring board 2. In the figure, only the external terminal 6 is hatched and shown as a perspective image.

Next, as shown in FIGS. 14 and 15, the superposition section 5 is inverted as indicated by the arrow, and the superposition section 5 is superposed on the mounting main body section 4. At this time, the overlapping portion 5 is fixed to the mounting body portion 4 using an adhesive or an adhesive tape. This fixing may be fixed so that the overlapping portion 5 can be separated from the mounting main body portion 4 if necessary. In this case, since the overlapping portion 5 can be peeled off from the mounting body portion 4, the soldering state of the land 31 and the external terminal 6 can be confirmed as necessary.

The semiconductor device 1 according to the first embodiment has a structure in which the overlapping portion 5 is folded back by the folding portion 3 and overlapped on the mounting body portion 4 having the external terminals 6 on the lower surface, and the mounting body portion 4 Since the portion connected to the folded-back portion 3 and the overlapping portion 5 is formed of the transparent flexible wiring board 2, the rear surface of the flexible wiring substrate 2 is not overlapped with the mounting body portion 4. The external terminal 6 can be visually observed.

Therefore, even when the semiconductor device 1 is mounted on the mounting board, the external terminals 6 on the rear surface of the flexible wiring board 2 are passed through the flexible wiring board 2 without the overlapping portion 5 overlapping the mounting body 4. Since the soldering state can be visually observed,
It is possible to easily and accurately inspect the quality of soldering.

Further, the superposing section 5 on which the semiconductor chip is mounted
Can be placed on the mounting body 4 on which the external terminals 6 are mounted after mounting, so that the external terminals 6 can be arranged in the entire mounting body 4 including the central portion, and the semiconductor device 1 can be compact. And the mounting area can be reduced.

That is, in the conventional surface mount type conductor device,
The board is made transparent so that the soldering status (mounting status) of the external terminals can be visually checked, and the quality of soldering (mounting) is checked from the sucked up status of the solder by using the mounting part as a through hole. Even if there is, the external terminal cannot be provided on the substrate portion to which the semiconductor chip is attached. However, in the semiconductor device of the first embodiment, the external terminal 6 is also provided on the mounting body portion 4 corresponding to the mounting portion of the semiconductor chip. Therefore, the semiconductor device 1 can be downsized and the number of pins can be increased.

In the semiconductor device 1 of the first embodiment, when the bump electrodes are formed on the lower surface of the mounting body 4 by soldering, only the mounting body 4 is dipped in a chemical after the bump electrodes are formed, and the semiconductor chip is mounted. Since the overlapping portion 5 is structured so as not to be soaked in a chemical, the bump electrode can be formed by using the solder that uses the solder flux, so that the manufacturing cost of the semiconductor device 1 can be reduced.

That is, in the case of the conventional BGA type semiconductor device in which the external terminals are provided on the lower surface of the wiring board, when the external terminals (bump electrodes) on the lower surface of the wiring board are cleaned with chemicals to remove the solder flux, the wiring Since the chemicals easily adhere to the package portion on the upper surface of the substrate and chemical cleaning cannot be performed, it is unavoidable to use a non-cleaning type solder that does not use solder flux, which increases the cost of forming bump electrodes. However, in the semiconductor device 1 according to the first embodiment, the overlapping portion 5 is clamped, and only the mounting main body portion 4 on which the external terminals 6 (bump electrodes) are formed is immersed in the chemical to perform the solder flux cleaning and removing process. You can

In the method of manufacturing the semiconductor device according to the first embodiment, the wiring board (wiring frame 20) formed mainly of the transparent polyimide film (resin film) 8 is used, and the semiconductor device is manufactured by the conventionally established lead frame. Since the manufacturing can be performed in the same manner as the technology, it is possible to manufacture a high quality BGA type semiconductor device having a folded and superposed structure with high productivity.

Further, the manufactured semiconductor device 1 is a semiconductor device having excellent handleability because the overlapping portion 5 is temporarily fixed to the external terminal 6 with an adhesive or an adhesive tape.

In the method of mounting the semiconductor device 1 of the first embodiment, since the wiring board (flexible wiring board) 2 of the mounting body 4 on which the external terminal 6 is provided is a transparent body, the external terminal When the 6 is overlaid on the land 31 of the mounting substrate 30, the degree of overlap between the land 31 and the external terminal 6 can be visually observed, so that the alignment can be accurately and easily performed.

In the method of mounting the semiconductor device 1 according to the first embodiment, since the wiring board (flexible wiring board) 2 of the mounting body 4 on which the external terminal 6 is provided is a transparent body, the external terminal Since the soldering state of the 6 and the land 31 can be visually inspected, the quality of the mounting can be easily inspected and
The reliability of implementation can be improved.

In the mounting of the semiconductor device 1 of the first embodiment, the superposition section 5 on which the semiconductor chip of the semiconductor device 1 is mounted is mounted.
Can be placed on the mounting body 4 on which the external terminals 6 are mounted after mounting, so that the external terminals 6 can be arranged in the entire mounting body 4 including the central portion, so that the semiconductor device 1 is small. Therefore, the mounting area can be reduced.

It should be noted that the semiconductor device 1 of Embodiment 1 does not necessarily have a structure in which the superposing portion 5 is stacked on the mounting main body portion 4 at the time of mounting. That is, as shown in FIG. 14, the overlapping portion 5 may be upright upward. In this case, the overlapping portion 5 needs to be supported by a support (holder) or the like. In such a mounting structure, the soldering state of the external terminals 6 can always be visually confirmed through the flexible wiring board 2, and since the front and back surfaces of the overlapping portion 5 are in contact with the atmosphere, the heat dissipation effect is high. Become.

(Second Embodiment) FIGS. 16 and 17 are views relating to a semiconductor device according to another embodiment (second embodiment) of the present invention. FIG. 16 is a perspective view of the semiconductor device, and FIG. 17 is a developed state. 3 is a schematic bottom view of the semiconductor device of FIG.

The semiconductor device 1 according to the second embodiment has the superposition section 5
It has a fixing means capable of removably fixing it to the mounting body 4. That is, as shown in FIG. 17, the fitting female portions 36 having the fitting holes 35 are formed on both sides of the mounting body portion 4 so as to project, and both sides of the overlapping portion 5 corresponding to these fitting female portions 36 are formed. A protrusion 37 that is inserted and fitted in the fitting hole 35 is formed in advance.

Then, as shown in FIG. 16, the overlapping portion 5 is folded back at the folding portion 3 and the overlapping portion 5 is overlapped on the mounting main body portion 4, and then the fitting female portion 36 is pulled and bent to form a protrusion. 37 is inserted and fitted in the fitting hole 35. As a result, the overlapping portion 5 is fixed to the mounting body portion 4, and even if the overlapping portion 5 moves, the overlapping portion 5 does not come off from the mounting body portion 4, and the handleability is improved.

(Embodiment 3) FIGS. 18 and 19 are views relating to a semiconductor device according to another embodiment (embodiment 3) of the present invention. FIG. 18 is a schematic front view of the semiconductor device, and FIG. It is a typical front view of the semiconductor device in a developed state.

The semiconductor device 1 according to the third embodiment has the folding portion 3
In order to relieve the stress applied to the fold-back portion, the fold-back shape defining means is provided to increase the curvature radius of the fold-back portion 3.

That is, in the first embodiment, the wiring 10
The external terminal 6, the semiconductor chip 12, and the like are formed on the same surface of the flexible wiring board 2, and the overlapping portion 5 is formed.
When the components are folded back and stacked on the mounting body 4, the portion of the flexible wiring board 2 of the mounting overlapping portion 5 comes into direct contact with the portion of the flexible wiring board 2 of the mounting body 4, and the folding portion 3
Has a smaller radius of curvature, and a large force acts on the folded portion 3.

Therefore, in the semiconductor device 1 of the third embodiment, as shown in FIG. 19, the external terminals 6 are formed on one surface side of the flexible wiring board 2 and the other surface side of the flexible wiring board 2 is formed. In this structure, the semiconductor chip 12, the sealing body 7 covering the semiconductor chip 12, and the resin flow stop frame 15 are formed. Although not shown, the wiring 10 is provided on both surfaces of the flexible wiring board 2. The wiring 10 on the front and back is
The flexible wiring board 2 is electrically connected through a conductor filled in a through hole provided in the flexible wiring board 2.

As shown in FIG. 18, the semiconductor device 1 of the third embodiment has the flexible wiring board of the mounting body 4 when the overlapping portion 5 is folded back at the folding portion 3 and overlapped with the mounting body 4. Since the sealing body 7 (resin flow stop frame 15) is placed on the two portions, and the flexible wiring board 2 portion of the overlapping portion 5 is located thereon,
The radius of curvature of the folded-back portion 3 formed of the flexible wiring board 2 becomes large, a large force does not act on the folded-back portion 3, and the overlapping portion 5 is brought into close contact with the mounting body portion 4 without being partially lifted. Further, even if the overlapping portion 5 is repeatedly folded back, the folded portion 3 does not deteriorate.

As in the semiconductor device 1 of the first embodiment, the semiconductor device 1 of the third embodiment allows the external terminals 6 to be visually inspected through the flexible wiring board 2, and the number of pins and the size can be reduced. Further, in manufacturing, the bump electrode can be formed by using the solder using the solder flux, so that the manufacturing cost can be reduced.

(Fourth Embodiment) FIGS. 20 and 21 are views relating to a semiconductor device according to another embodiment (fourth embodiment) of the present invention. FIG. 20 is a schematic front view of the semiconductor device, and FIG. It is a typical front view of the semiconductor device in a developed state.

The semiconductor device 1 according to the fourth embodiment has a structure in which the folded shape defining means is provided so that the radius of curvature of the folded portion 3 can be kept constant, in other words, the folded portion 3
The fold-back portion 3 is less likely to be damaged by repeated fold-backs without making the radius of curvature of the above-mentioned smaller than necessary.

In the semiconductor device 1 of Embodiment 4, as shown in FIG. 21, a columnar bending holding mandrel 40 is fixed to the folded-back portion 3 with an adhesive.

Therefore, as shown in FIG. 20, when the overlapping portion 5 is folded back at the folding portion 3 and overlapped with the mounting body portion 4,
The folded-back portion 3 is not folded back with a radius of curvature smaller than the thickness of the bending-holding mandrel 40, and excessive stress is not generated in the folded-back portion 3 due to the radius of curvature which is too small. Therefore, even if the overlapping portion 5 is repeatedly folded back at the folding portion 3, the deterioration of the folding portion 3 can be prevented.

Further, when the overlapping portion 5 is folded back, by bending the folding portion 3 along the bending holding mandrel 40, the external shape of the semiconductor device 1 is always constant, the external appearance is stable, and the commercialability is improved.

In addition, including the case of the semiconductor device of the third embodiment, if the end of the resin flow stop frame 15 on the side of the turn-back portion 3 is formed in an arc shape, the turn-back portion 3 is turned over of the resin flow stop frame 15. It can be folded back along the shape of the end on the part 3 side.

In the semiconductor device 1 of the fourth embodiment, the external terminals 6 can be seen through the flexible wiring board 2 as in the semiconductor device 1 of the first embodiment, and the number of pins and the size can be reduced. Further, in manufacturing, the bump electrode can be formed by using the solder using the solder flux, so that the manufacturing cost can be reduced.

(Embodiment 5) FIGS. 22 to 24 are views relating to a semiconductor device which is another embodiment (embodiment 5) of the present invention, and FIG. 22 is a perspective view showing the appearance of the semiconductor device,
23 is a schematic front view of the semiconductor device, and FIG. 24 is a schematic front view of the semiconductor device in a developed state.

The semiconductor device 1 according to the fifth embodiment is downsized.
It is a structure for high integration, and has a sealing body 7 (resin flow stop frame 15) in which a semiconductor chip is incorporated in the overlapping portion 5 of the flexible wiring board 2 and a mounting main body portion of the flexible wiring board 2. 4, a sealing body 7 (resin flow stop frame 15) incorporating a semiconductor chip is also arranged on the surface opposite to the surface on which the external terminals 6 are provided. As a result, the semiconductor device 1 can be highly integrated, have a large number of pins, and can be made compact.

In the unfolded semiconductor device 1 shown in FIG. 24, the overlapping portion 5 is folded back by the folding portion 3 and stacked on the mounting body portion 4 to obtain the semiconductor device 1 as shown in FIGS. 23 and 22. In the present embodiment, the mounting body 4
In the overlapping portion 5, the sealing body 7 is provided on the same surface of the flexible wiring board 2, and when the overlapping portion 5 is folded back, the sealing body 7 of the overlapping portion 5 is placed on the sealing body 7 of the mounting body portion 4. And the folded portion 3 has a structure in which the folded portions overlap each other (folded shape defining means).
The radius of curvature of becomes large.

The semiconductor device 1 of the fourth embodiment can be multi-pinned and miniaturized as in the semiconductor device 1 of the first embodiment.
Further, in manufacturing, the bump electrode can be formed by using the solder using the solder flux, so that the manufacturing cost can be reduced.

(Sixth Embodiment) FIGS. 25 to 28 are views relating to a semiconductor device according to another embodiment (sixth embodiment) of the present invention, and FIG. 25 shows a semiconductor device in which the overlapping portion is in a half-opened state. 26 is a schematic front view of the semiconductor device, FIG. 27 is an enlarged cross-sectional view showing a part of the semiconductor device in a developed state, and FIG. 28 is a partially enlarged cross-sectional view showing a soldering state in the mounted state of the semiconductor device. It is a figure.

The semiconductor device 1 of the sixth embodiment is the same as the semiconductor device 1 of the first embodiment, except that the soldering mounting portion (external terminal 6) has the HGA structure.

That is, as shown in FIGS. 25 and 27, the mounting body 4 of the transparent flexible wiring board 2 is provided with through holes 50 in a grid array and these through holes 50 are provided. A conductor layer 51 is provided on the inner peripheral surface and the edge thereof. The conductor layer 51 becomes the external terminal 6. Therefore, each conductor layer 51 is connected to the wiring 10
Is electrically connected to In the embodiment, the conductor layer 51 and the wiring 10 are formed separately, but they may be formed at the same time to have an integrated structure.

The semiconductor device 1 according to the sixth embodiment is mounted on the mounting substrate 3
In the case of mounting on 0, the external terminals 6 on the lower surface of the mounting body 4 of the semiconductor device 1 are positioned and overlapped with the lands 31 of the mounting substrate 30, and then the solder bumps previously provided on the lands 31 are reflowed. . The melted solder is the conductor layer 51.
The surface of the through hole 50
It goes inside and rises, and reaches the upper surface side of the through hole 50. The solder bump may be provided on the land 31 of the mounting substrate 30 instead of being provided on the conductor layer 51.

As a result, the land 31 of the mounting board 30 is
Then, whether or not the external terminals 6 of the mounting body 4 are connected by the solder 53 can be accurately determined by visually confirming whether or not the solder 53 is sucked up into the through hole 50. Further, since the flexible wiring board 2 of the semiconductor device 1 of the sixth embodiment is a transparent body, the soldering state can be visually inspected through the flexible wiring board 2.

The solder bumps may be formed on the conductor layer 51 side.

In the state where the semiconductor device 1 of the sixth embodiment is mounted on the mounting substrate 30, the soldered portion penetrates the flexible wiring substrate 2 and is exposed. That is, since the soldered portion is exposed as the solder 53 filled in the through hole 50, the probe pin can be applied to the exposed solder 53. Therefore, an electrical characteristic test such as an in-circuit test, which cannot be performed by the conventional BGA type semiconductor device, can be performed.

Since the through hole 50 has a structure in which the superposed portion 5 in which the semiconductor chips are incorporated in the mounting body portion 4 is stacked after mounting, the mounting body portion 4 has a through hole regardless of the position of the semiconductor chip. Since the holes 50, that is, the external terminals 6 can be arranged, the external terminals 6 can also be arranged in the central portion of the mounting body 4. As a result, the semiconductor device 1 can be downsized and the mounting area can be reduced.

In the semiconductor device 1 of the sixth embodiment, the external terminals 6 can be visually observed through the flexible wiring board 2 as in the semiconductor device 1 of the first embodiment, and the number of pins and the size can be reduced.

In the semiconductor device 1 of the sixth embodiment, the flexible wiring board 2 need not be a transparent body. That is, the external terminal 6 of the semiconductor device 1 and the land 31 of the mounting substrate 30.
With respect to the soldering state of the flexible wiring board 2 of the mounting body 4, it can be visually inspected whether the solder 53 has been sucked up into the through hole 50 provided in the mounting body 4 of the semiconductor device 1. Even if the part is opaque, there is no particular problem. That is, the through hole 5 is formed in the entire mounting body portion 4.
Since the external terminal 6 can be formed by providing 0, the semiconductor device 1 can be downsized. Moreover, since the external terminals 6 are arranged in a grid array, a large number of pins can be achieved. Also, the solder 53 sucked up in the through hole 50.
It is possible to inspect electrical characteristics such as an in-circuit test by applying a probe pin to the. Further, when the solder bumps are formed on the conductor layer 51 of the mounting body 4, the external terminals 6 (solder bumps) can be cleaned without immersing the sealing body 7 or the like in a chemical as in the case of the first embodiment. Since it can be performed, the solder bump can be formed by the solder using the solder flux, and the manufacturing cost of the semiconductor device 1 can be reduced.

(Embodiment 7) FIGS. 29 to 31 are views relating to a semiconductor device according to another embodiment (embodiment 7) of the present invention, and FIG. 29 is a perspective view showing the appearance of the semiconductor device,
30 is a schematic front view of the semiconductor device, and FIG. 31 is a schematic plan view of the semiconductor device in a developed state.

In the semiconductor device 1 of the seventh embodiment, the external terminal 6 portion is formed by the through hole 50 and the conductor layer 51.
This is an example of a GA structure, and is a structure in which through holes 50 are arranged in the peripheral portion of the mounting body 4. This Embodiment 7
The semiconductor device 1 has a structure in which the sealing body 7 (resin flow stop frame 15) is arranged in the central portion of the upper surface of the mounting body 4. Although not shown, a semiconductor chip is arranged inside the sealing body 7, and the electrodes and wirings of the semiconductor chip are electrically connected via wires. The semiconductor chips are mounted on the mounting body 4 and the superposing portion 5, respectively, so that high integration is achieved.

Since the through hole 50 cannot be provided in the area where the resin flow stop frame 15 and the sealing body 7 are arranged, the through hole 50 is provided outside the resin flow stop frame 15 in the area of the mounting body 4. It is provided. Therefore, in the semiconductor device 1 of the seventh embodiment, as shown in FIGS. 29 to 31, the mounting body portion 4 is larger than the overlapping portion 5.

In the seventh embodiment, the flexible wiring board 2
May be transparent or opaque. In the case of a transparent body, since the external terminals 6 can be viewed through the flexible wiring board 2, there is an advantage that the soldering state can be viewed during mounting.

The semiconductor device 1 of the seventh embodiment can be downsized and have a large number of pins, like the semiconductor device 1 of the first embodiment and the semiconductor device 1 of the sixth embodiment. Furthermore, through hole 50
It is also possible to perform an electrical characteristic test such as an in-circuit test by applying a probe pin to the sucked solder 53 inside.

(Embodiment 8) FIGS. 32 and 33 are views relating to a semiconductor device according to another embodiment (Embodiment 8) of the present invention. FIG. 32 is a perspective view showing the appearance of the semiconductor device, and FIG. FIG. 6B is a bottom view showing a state in which the sealing bodies of the respective overlapping portions are partially removed in the semiconductor device in the expanded state.

The semiconductor device 1 of the eighth embodiment shows an example in which a plurality of overlapping portions 5 are stacked on the mounting body portion 4. Further, a large number of semiconductor chips are incorporated to achieve high integration and increase in memory capacity. It is intended to be multifunctional.

In the semiconductor device 1 of the eighth embodiment, the flexible wiring substrate 2 (resin film 8 such as polyimide film) made of a transparent material has a cross-shaped pattern. Then, the cross-shaped left side rectangular portion 55 is used as the mounting body portion 4,
The right side rectangular portion 56, the upper side rectangular portion 57, the lower side rectangular portion 58, and the central rectangular portion 59 at the center portion of the cross are overlapped with the overlapping portion 5.
And The central rectangular portion 59 and the surrounding left rectangular portion 5
5, right rectangular portion 56, upper rectangular portion 57, lower rectangular portion 58
Are connected to a predetermined pattern by wiring 10.

The folding part 3 is provided between the central rectangular part 59 and the left rectangular part 55, the right rectangular part 56, the upper rectangular part 57, and the lower rectangular part 58. A central rectangular portion 59 and a right rectangular portion 5 are provided on the main body portion 4.
6, the upper rectangular portion 57 and the lower rectangular portion 58 can be stacked.

External terminals 6 made of solder bump electrodes are arranged in a grid array on the left rectangular portion 55.

The semiconductor chip 12 is fixed to the flexible wiring board 2 of each overlapping portion 5 of the right rectangular portion 56, the upper rectangular portion 57, the lower rectangular portion 58, and the central rectangular portion 59, and the semiconductor chips 12 are fixed to the flexible wiring substrate 2. The electrode of the chip 12 and the wiring 10 are electrically connected by a conductive wire 14. Further, the resin flow stop frame 15 is fixed to the flexible wiring board 2 of the right rectangular portion 56, the upper rectangular portion 57, the lower rectangular portion 58, and the central rectangular portion 59 so as to surround the semiconductor chip 12, the wire 14, and the like. ing. A semiconductor chip 12 is provided in each resin flow stop frame 15.
The resin 17 is filled so as to cover the wires 14, the wires 14, etc., and the sealing body 7 is formed.

FIG. 33 shows the semiconductor device 1 in the expanded state according to the eighth embodiment. In the semiconductor device 1 in such a developed state, the superposing section 5 is sequentially stacked on the mounting body section 4,
It is used as the semiconductor device 1 having the appearance as shown in FIG.

The semiconductor device 1 according to the eighth embodiment can be stored in the unfolded state as shown in FIG. 33 or in the assembled state as shown in FIG. In the case of the assembled state as shown in FIG. 32, it is desirable that the overlapping portion 5 stacked on the mounting body portion 4 does not move in consideration of damage or the like. That is, in the state of FIG. 32, for example, the mounting body 4 directly stacked on the mounting body 4 is temporarily fixed with an adhesive or an adhesive tape, and then stacked on the overlapping portion 5 temporarily fixed to the mounting body 4. The overlapping portions 5 to be formed are sequentially temporarily fixed with an adhesive or an adhesive tape.

As a result, when the semiconductor device 1 is handled, the overlapping portion 5 does not shift and the shape of the semiconductor device 1 in the assembled state does not collapse.

The semiconductor device 1 according to the eighth embodiment includes the superposing section 5.
However, as in the case of the semiconductor device 1 of the first embodiment, since the flexible wiring board 2 of the mounting body 4 is a transparent body, the external terminals 6 are mounted through the flexible wiring board 2 after mounting.
The soldering state of can be visually inspected.

Like the semiconductor device 1 of the first embodiment, the semiconductor device 1 of the eighth embodiment can be downsized and have a large number of pins, and further high integration can be achieved.

As in the semiconductor device 1 of the first embodiment, the semiconductor device 1 of the eighth embodiment can reduce the manufacturing cost because the bump electrodes can be formed by using the solder using the solder flux in the manufacturing process. Can be achieved.

In the eighth embodiment, the wiring 10 is provided only on one surface side of the flexible wiring board 2. However, the wiring 10 is provided on both surfaces of the flexible wiring board 2 and the wirings 10 on the front and back surfaces are provided. A structure may be used in which the conductors filled in the through holes are electrically connected. In addition, the external terminal is a HG that uses a through hole.
It may be an A structure.

Although the invention made by the present inventor has been specifically described based on the embodiments, the present invention is not limited to the above embodiments, and various modifications can be made without departing from the scope of the invention. Needless to say, for example, although the wiring 10 is formed of a transparent conductor in the above-described embodiment, it may be formed of a non-transparent metal film. For example, the wiring may be formed by etching a copper foil attached to a polyimide film into a desired pattern. Even in this case, it is possible to inspect the solderability of the mounted external terminal 6 through the transparent flexible wiring board 2 and between the wirings 10.

Although the semiconductor device 1 is entirely formed of a flexible wiring board, at least only the folding portion 3 can be folded back, and the mounting body portion 4 and the superposing portion 5 are flexible ( It does not have to be a non-flexible body. For example, the superposition unit 5
Is formed of a normal non-flexible wiring board, and the mounting body 4
The wiring may be formed on glass by a conductive transparent film (transparent film made of a compound of tin oxide and antimony oxide).

In the above-mentioned embodiment, the method of fixing the resin flow stop frame made of plastic is adopted as the frame for preventing the resin from flowing out. However, by printing the insulating ink directly on the flexible wiring substrate. You may form. Also,
The sealing body 7 may be formed directly on the resin film 8 by transfer molding without using a frame.

In the above-mentioned embodiment, the semiconductor chip and the wiring are connected by the wire, but the semiconductor chip may be connected face down by the flip chip or by using the beam lead.

In the above-described embodiment, the superimposing part is mounted with a single semiconductor chip, but mounting with a plurality of semiconductor chips and passive components such as chip resistors and chip capacitors, that is, a hybrid integrated circuit ( Hybrid I
C) It may be configured.

In the above-mentioned embodiment, the external terminal is the bump electrode that protrudes, but a lead may be implanted.

In the above-mentioned embodiment, the wiring of the desired pattern is formed on the back surface of the resin film, but the wiring may be formed on both surfaces of the resin film, or the wiring is covered with an insulator to form a multilayer wiring structure. Good. In these cases,
The upper and lower wiring layers are connected by through holes. A conductor layer is provided on the inner peripheral surface of the through hole and its edge.

In the above embodiment, only the package is taken up, but it is also possible to attach a heat radiation fin on the top or sandwich a heat radiation plate to take measures against heat.

The present invention can be applied to a manufacturing technique and a mounting technique of a semiconductor device having a structure in which an external terminal is provided at least on the lower surface of the mounting main body, and the overlapping portions are sequentially stacked on the mounting main body.

In each of the above-mentioned embodiments, the mounting main body 4 having the external terminals is one, but the mounting main body 4 may be plural. That is, in the semiconductor device 1 that has the flexible wiring substrate 2 extending in multiple directions and has a plurality of mounting body portions 4 and overlapping portions 5, the folding portion 3 is provided in front of the mounting body portion 4 and the overlapping portion 5 and repeated. The mounting main body portion 4 and the overlapping portion 5 may be extended. In this case, a plurality of mounting body parts 4 may be mounted on a flat mounting board, or the mounting body parts 4 may be mounted on each surface of a mounting board having a plurality of different surfaces, and The extending overlapping portion 5 may be folded back at the folding portion 3 to be stacked on each mounting body portion 4, or may be placed in an expanded state, or mounted in an upright state. In this case, not only the semiconductor device 1 can be downsized and multifunctional, but also the mounting area can be reduced in mounting.
Effective utilization of the mounting space can be achieved. Also, the semiconductor device 1 can be mounted on a component mounted on a mounting board. Further, the overlapping portions may be manufactured individually and connected at the folded portions to form the embodiment. In that case,
The yield can be improved because only non-defective products can be modularized after each test.

[0145]

The effects obtained by the representative ones of the inventions disclosed in the present application will be briefly described as follows.

(1) The semiconductor device has a structure in which the folded portion can be freely folded, and the overlapping portion is stacked on the mounting main body portion as necessary, and the wiring board (flexible wiring board) is provided. Since it is a transparent body, the external terminals on the back surface of the wiring board can be visually observed when the overlapping portion is not overlapped with the mounting main body portion. Therefore, when the external terminals of the semiconductor device are superposed on the lands of the mounting board, the degree of overlap between the lands and the external terminals can be visually observed, and the alignment can be accurately and easily performed. Further, since the soldering state of the external terminal and the land can be visually inspected after the mounting, the quality of the mounting can be easily inspected and the reliability of the mounting can be improved.

(2) Since the semiconductor device allows the external terminals on the back surface of the wiring board to be visually inspected through the wiring board at any time by opening the overlapping portion, the solder mounting state of the external terminals can be visually inspected even after the semiconductor device is mounted on the mounting board. Therefore, the wiring board of the mounting main body can be provided with external terminals even in a portion where the semiconductor chip and the like overlap each other, and the semiconductor device can be miniaturized and the number of pins can be increased. Therefore, the mounting area can be reduced by downsizing the semiconductor device.

(3) High integration can be achieved in a structure in which a plurality of overlapping portions are sequentially stacked on the mounting main body portion.

(4) The semiconductor device has a structure in which the folded portion can be freely folded back, and the overlapping portion is stacked on the mounting body portion as needed. Since it can be fixed including temporary fixing with an adhesive or an adhesive tape, the handling of the semiconductor device is improved.

(5) In the semiconductor device, when the bump electrodes are formed on the lower surface of the mounting body by soldering, after the bump electrodes are formed, only the mounting body is soaked in the chemical, and the overlapping portion on which the semiconductor chip is mounted is soaked in the chemical. Since the bump electrodes can be formed by using solder that uses solder flux without using non-cleaning type solder that is expensive, it is possible to reduce the manufacturing cost of the semiconductor device.

(6) Since a wiring board formed mainly of a transparent resin film can be manufactured in the same manner as the semiconductor device manufacturing technology using a lead frame established conventionally,
It is possible to manufacture a high quality semiconductor device having a folded and superposed structure with high productivity.

[Brief description of the drawings]

FIG. 1 is a perspective view showing the external appearance of a semiconductor device according to an embodiment (Embodiment 1) of the present invention.

FIG. 2 is a schematic perspective view of the semiconductor device according to the first embodiment with a superposed portion in a half-opened state.

FIG. 3 is a front view showing the semiconductor device in a developed state according to the first embodiment.

FIG. 4 is a schematic bottom view showing a developed state of the semiconductor device of the first embodiment.

FIG. 5 is a schematic bottom view showing a state in which a part of the sealing body is removed in the unfolded semiconductor device of the first embodiment.

FIG. 6 is an enlarged cross-sectional view of a part of the semiconductor device in a developed state according to the first embodiment.

FIG. 7 is a schematic plan view of a wiring frame used for manufacturing the semiconductor device of the first embodiment.

FIG. 8 is a schematic plan view showing a state in which a resin flow stop frame is fixed to a wiring frame in the manufacture of the semiconductor device of the first embodiment.

FIG. 9 is a schematic plan view showing a state in which a semiconductor chip is fixed to a wiring frame in manufacturing the semiconductor device of the first embodiment.

FIG. 10 is a schematic plan view showing a wiring frame to which wire bonding is applied in manufacturing the semiconductor device of the first embodiment.

FIG. 11 is a schematic plan view showing a wiring frame in which a sealing body is formed in the manufacturing of the semiconductor device of the first embodiment.

FIG. 12 is a schematic plan view showing a wiring frame in which external terminals are formed in the manufacturing of the semiconductor device of the first embodiment.

FIG. 13 is a schematic diagram showing a mounting start state of the semiconductor device of the first embodiment.

FIG. 14 is a view showing mounting of the semiconductor device of the first embodiment,
It is a front view which shows the state which turned over the superimposition part halfway after soldering.

FIG. 15 is a view showing mounting of the semiconductor device of the first embodiment,
It is a front view which shows the state which overlapped the superposition part after soldering on the mounting main body part.

FIG. 16 is a perspective view of a semiconductor device according to another embodiment (Embodiment 2) of the present invention.

FIG. 17 is a schematic bottom view of the semiconductor device in a developed state according to the second embodiment.

FIG. 18 is a front view of a semiconductor device according to another embodiment (Embodiment 3) of the present invention.

FIG. 19 is a front view of the semiconductor device according to the third embodiment in a developed state.

FIG. 20 is a front view of a semiconductor device according to another embodiment (Embodiment 4) of the present invention.

FIG. 21 is a front view of the semiconductor device according to the fourth embodiment in a developed state.

FIG. 22 is a perspective view showing the outer appearance of a semiconductor device according to another embodiment (embodiment 5) of the present invention.

FIG. 23 is a front view showing the semiconductor device of the fifth embodiment.

FIG. 24 is a front view of the semiconductor device in a developed state according to the fifth embodiment.

FIG. 25 is a perspective view of a semiconductor device according to another embodiment (Embodiment 6) of the present invention in which the overlapping portion is in a half-opened state.

FIG. 26 is a front view showing the semiconductor device of the sixth embodiment.

FIG. 27 is an enlarged cross-sectional view showing a part of the semiconductor device in a developed state according to the sixth embodiment.

FIG. 28 is a partial enlarged cross-sectional view showing a soldered state of the semiconductor device of the sixth embodiment in a mounted state.

FIG. 29 is a perspective view showing the outer appearance of a semiconductor device according to another embodiment (Embodiment 7) of the present invention.

FIG. 30 is a front view showing the semiconductor device of the seventh embodiment.

FIG. 31 is a schematic plan view showing a semiconductor device in a developed state according to the seventh embodiment.

FIG. 32 is a perspective view showing the external appearance of a semiconductor device according to another embodiment (Embodiment 8) of the present invention.

FIG. 33 is a schematic bottom view showing a state in which the sealing body of each overlapping portion is partially removed in the semiconductor device in the developed state of the eighth embodiment.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Semiconductor device, 2 ... Flexible wiring board, 3 ... Folding part, 4
... mounting main body part, 5 ... superposed part, 6 ... external terminal, 7 ... sealing body, 8 ... resin film (polyimide film), 10 ...
Wiring, 11 ... Adhesive agent, 12 ... Semiconductor chip, 13 ... Protective film, 14 ... Wire, 15 ... Resin flow stop frame, 16 ... Adhesive agent, 17 ... Resin, 20 ... Wiring frame, 21 ... Flexible wiring board part , 22 ... Frame part, 23 ... Hanging part, 24 ... Pedestal, 30 ... Mounting board, 31 ... Land, 35 ... Fitting hole, 3
6 ... Fitting female part, 37 ... Protrusion, 40 ... Bending holding mandrel, 50
... Through hole, 51 ... Conductor layer, 53 ... Solder, 55 ... Left side rectangular part, 56 ... Right side rectangular part, 57 ... Upper side rectangular part, 58
... Lower rectangular part, 59 ... Central rectangular part.

Claims (17)

[Claims] 1. An at least one mounting main body made of a wiring board having external terminals provided on one surface, one superposed portion made of a wiring board mounting an electronic component including at least a semiconductor chip, the mounting main body and the At least one folding portion formed of a flexible wiring board that electrically and mechanically connects the same kind or different kinds of the overlapping portions, and the overlapping portion is folded back at the folding portion and has a predetermined length. A semiconductor device, which is configured to be stacked on the mounting main body part or the superimposing part. 2. The semiconductor device according to claim 1, wherein the wiring board of the mounting main body portion, the folded-back portion and the overlapping portion is formed of an integrated flexible body. 3. The wiring board of the mounting main body and the wiring board of the overlapping portion are formed of a non-flexible body.
13. The semiconductor device according to claim 1. 4. The semiconductor device according to claim 1, wherein an external terminal is also provided in a mounting body portion region where the electronic component mounting region of the overlapping portion overlaps. . 5. The semiconductor device according to claim 1, wherein the wiring board of the mounting main body is a transparent body through which external terminals on the lower surface of the wiring board can be visually observed. 6. The external terminal is formed by an inner wall of a through hole penetrating the wiring board and a conductor layer provided on an edge thereof. Semiconductor device. 7. The semiconductor device according to claim 1, further comprising a folded shape defining means that defines a radius of curvature when the folded portion is folded. 8. The semiconductor device according to claim 1, wherein the overlapping portion is fixed to the mounting main body by fixing means. 9. The semiconductor device according to claim 1, wherein the mounting area of the electronic component is covered with a sealing body. 10. An at least one mounting main body part made of a wiring board having a pedestal on one surface of which an external terminal is provided, and one overlapping part made of a wiring board having an area for mounting an electronic component including at least a semiconductor chip, At least one mounting main body portion and at least one folding portion formed of a flexible wiring board that electrically and mechanically connects the same kind or different kinds of the overlapping portion, the overlapping portion being the folding portion. A step of preparing a wiring board that is folded back and stacked on a predetermined mounting body portion or a superposed portion; a step of mounting an electronic component including a semiconductor chip on the superposed portion and electrically connecting electrodes and wiring A step of covering the electronic component mounting area with a sealing body, a step of forming a solder bump electrode on a pedestal of the mounting body, a step of cutting and removing an unnecessary portion of the wiring board, and a predetermined folding step. And a step of folding back the parts and stacking the overlapping parts on a predetermined mounting main body part. 11. The method of manufacturing a semiconductor device according to claim 10, wherein the wiring board that forms the mounting main body portion, the folded portion, and the overlapping portion is made of one transparent resin film. 12. The method of manufacturing a semiconductor device according to claim 10, wherein, when stacking the superposed portion on the mounting main body portion, the superposed portion is temporarily fixed with an adhesive or an adhesive tape. 13. A mounting main body part made of a transparent wiring board having external terminals provided on one surface, one superposed part made of a wiring board mounting an electronic component including at least a semiconductor chip, and the mounting main body part. And at least one folding portion formed of a flexible wiring board that electrically and mechanically connects the same kind or different kinds of the overlapping portions, and the overlapping portion is folded back at the folding portion. A method of mounting a semiconductor device to be stacked on a predetermined mounting main body portion or a superposed portion on a mounting substrate, wherein the external terminal of the mounting main body portion is overlaid on a land of the mounting substrate to heat the external terminal. After being fixed to the land, the connection state of the external terminals is inspected through the transparent wiring board of the mounting main body, and then the superposing section is superposed on the mounting main body fixed to the mounting board. How to install the device. 14. The method of mounting a semiconductor device according to claim 13, wherein, when stacking the overlapping portion on the mounting body portion, the overlapping portion is fixed with an adhesive or an adhesive tape. 15. A wiring board which comprises a wiring board and whose external terminals include at least one mounting body formed of an inner wall of a through hole and a conductor layer provided on an edge thereof, and a wiring board on which an electronic component including at least a semiconductor chip is mounted. And one at least folding portion formed of a flexible wiring board that electrically and mechanically connects the same type or different types of the mounting body portion and the overlapping portion, The superposition section is a method of mounting a semiconductor device that is folded back at the folding section and stacked on a predetermined mounting main body section or the superposition section onto a mounting board, wherein the mounting main body section is externally mounted on the land of the mounting board. After stacking the terminals, the bonding material provided in advance on the land or the external terminal was melted to connect the external terminal to the land, and then sucked into the through hole of the mounting body. A method for mounting a semiconductor device, comprising: inspecting a connection state of external terminals depending on the presence or absence of a bonding material, and then stacking the overlapping portion on a mounting main body portion fixed to the mounting substrate. 16. The electrical characteristics test is performed by melting the bonding material and connecting the external terminal of the through hole portion to the land, and then applying a probe pin to the bonding material sucked into the through hole. Claim 15
A method for mounting a semiconductor device as described above. 17. The method of mounting a semiconductor device according to claim 15, wherein, when stacking the superposed portion on the mounting main body portion, the superposed portion is fixed with an adhesive or an adhesive tape.