JPH0915444A - Formation of antireflection film of light transmission member - Google Patents

Abstract

PURPOSE: To prevent flawing and to improve production efficiency by depositing an antireflection film by evaporation on one surface of a transparent substrate, protecting the one surface with a protective cover and fixing the substrate to the front end face of a light transmission member, then peeling the protective cover to exposed the antireflection film. CONSTITUTION: The front end of a ferrule 5 is projectingly provided with a projecting part 5a from the end face and the projecting part is fixed to a sleeve 10. An optical fiber 7 consisting of a core 7a and a coating 7b is inserted into the ferrule 5 and the sleeve 10. Next, the substrate 8 is put into a vapor deposition device and a dielectric substance is deposited by evaporation in multiple layers theron to form the antireflection film 9. The protective cover 11 is affixed to the surface of the substrate 8. Further, the projecting part 5a of the ferrule 5 is provided with a slit 14 and a chip substrate 13a is fixed to the slit 14. The protective cover 11 and the substrate 8 are peeled when the front end of the ferrule 5 is immersed into a solvent and, therefore, the front end of the projecting part 5a is cut. The antireflection film 9 on the surface of the substrate 8 is thus exposed outside and the antireflection film 9 is formed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming an antireflection film in a light transmitting member such as an optical connector used as a signal transmitting means for optical communication.

[0002]

2. Description of the Related Art Conventionally, as shown in FIG. 12, an optical connector 1 for an optical semiconductor module such as a laser diode, a light emitting diode, a photodiode, etc. has a plug 4 composed of a ferrule 2 and a housing 3 at one end, and others. The ferrule simple substance 5 is connected to the end, and the optical semiconductor module 6
The single ferrule 5 is aligned and fixed to the side.

On the end face on the side of the single ferrule 5, usually, an antireflection film for preventing reflection of incident light, that is,
AR coat is applied. This is to prevent the amount of incident light from decreasing, and the AR coat is generally obtained by vapor-depositing dielectric layers.

As shown in FIGS. 13 to 14, the AR coat 9 is formed by setting the ferrules 5 with the optical fibers 7 mounted on a jig or the like in a vapor deposition apparatus and collectively putting the ferrules 5 directly on one end surface of each ferrule 5. A substrate 8 made of glass or the like, on which an AR coat 9 is applied, is cut into a predetermined size with a thin blade, and a small substrate chip formed by cutting is attached to one end surface of the ferrule 5 for optical use. It was attached with an adhesive.

[0005]

However, in the method of directly depositing the AR coat on the one end surface of the ferrule by the vapor deposition device, if the vapor deposition fails, the ferrule is cut from the optical fiber and the ferrule is removed. Since it has to be reattached to the optical fiber, it is time-consuming and costly. Further, there is a limit to the number of ferrules that can be arranged inside the vapor deposition apparatus, and a large amount of ferrules cannot be deposited at one time, so that the production efficiency cannot be improved.

Further, since the ferrule and the optical fiber are integrated into the vapor deposition apparatus, gas is generated from the coating resin or the like which protects the optical fiber, and the degree of vacuum in the vapor deposition apparatus is lowered. However, there is a problem in that it cannot be vapor-deposited at high temperature.

Further, in the work of depositing the AR coat on the substrate such as glass and then attaching it to the end face of the ferrule,
Since the substrate is minute (several millimeters in size), it is not easy to distinguish whether the surface on which the AR coat is vapor-deposited is the front or back surface of the substrate, and it is difficult for the operator to handle. Furthermore, when a large amount of adhesive (for example, optical adhesive) is applied to the bonding surface on the ferrule side of the substrate,
The adhesive may overflow and adhere to the vapor deposition side of the substrate, and the dirt may reduce the light transmission efficiency.Depending on the assembly jig for sticking the substrate, the vapor deposition side of the substrate may be scratched. There was a problem such as being lost.

As described above, A for the conventional ferrule is used.
The vapor deposition method of the R coat has a problem to be solved in terms of vapor deposition workability and attachment workability of the AR coat.

[0009]

The gist of the optical connector according to the present invention for solving the above problems is a method of forming an antireflection film on the tip surface of a light transmitting member, which is transparent. After vapor-depositing on one surface of the substrate, protecting the one surface with a protective cover, and fixing the substrate having this protective cover to the tip surface of the light transmission member, peel off the protective cover to expose the antireflection film. That is.

A method of forming an antireflection film on the tip surface of the light transmitting member, wherein the antireflection film is vapor-deposited on one surface of a transparent substrate, and a protective cover is attached to the one surface of the substrate with an adhesive. Then, the integrated substrate and protective cover are fixed to the tip surface of the light transmitting member, and then the adhesive surfaces of the substrate and the protective cover are dipped in a solvent to bring the substrate into the tip of the light transmitting member. The protective cover is peeled off to leave the antireflection film on the substrate exposed.

The adhesive for adhering the protective cover to one surface of the substrate is a soluble optical adhesive that is soluble in a solvent; the substrate with the protective cover adhered to the tip surface of the light transmitting member. To fix, the optical fiber is inserted into a slit provided by cutting the optical fiber at the tip of the ferrule of the light transmitting member, and fixed with an insoluble adhesive;
It is an opaque material that can be distinguished from the substrate.

A method of forming an antireflection film on the tip surface of a light transmitting member, wherein the antireflection film is vapor-deposited on one surface of a transparent substrate, and the substrate is opposed to the one surface having the antireflection film. Then, it is adhered by an adhesive, and the integrated both substrates are fitted and fixed in the slits provided in the connecting portion connecting the ferrules arranged opposite to each other, and then the adhesive surfaces of the both substrates are attached. Immersing in a solvent, cutting at the slit portion to separate the substrates to expose the antireflection film; and a method for forming an antireflection film on the tip surface of a light transmitting member, the method comprising: An anti-reflection film is vapor-deposited on one surface of a transparent substrate, the one surface having the anti-reflection film is opposed to each other, and the substrate is adhered with an adhesive, and the anti-reflection film is interposed between the front end surfaces of both optical fibers arranged opposite to each other. And fix both the integrated substrates to the tip surface, After the bonding surfaces of the substrate is immersed in a solvent, it is to expose the anti-reflection film was cut by the slit portion was peeled off the both substrates.

[0013]

According to the method of forming the antireflection film in the light transmitting member according to the present invention, the antireflection film is deposited on the transparent substrate,
Since the antireflection film is protected by the protective cover, scratches on the antireflection film deposited on the substrate during the work are reduced. Further, if the protective cover is an opaque body, it is easy to distinguish it from the transparent substrate, and the work efficiency is improved without the operator making a mistake in the mounting direction in the work of fixing the protection cover to the tip surface of the light transmitting member. Since the substrate on which the antireflection film is vapor-deposited is protected by a protective cover that is attached with an adhesive, the antireflection film is vapor-deposited on a large substrate, and then the antireflection film is not scratched. Both the substrate and the protective cover are finely cut with a blade, and it becomes possible to mass-produce chip-shaped substrates, which can be placed in a mass production process. Furthermore, since the adhesive for adhering the substrate and the protective cover is a soluble optical adhesive, the protective cover can be peeled off from the substrate simply by immersing it in a solvent, and with a mechanical force. Since it is not peeled off, there is no risk of scratching the antireflection film.

[0014]

Next, an embodiment according to the present invention will be described in detail with reference to the drawings. For easy understanding, portions corresponding to the conventional example will be denoted by the same reference numerals as those in the conventional example.

In the first embodiment of the present invention, as shown in FIGS. 1 to 4, first, a projection 5a having a diameter smaller than that of the main body of the ferrule 5 is projected from the end surface (see FIG. 2). . The ferrule 5 is fixed by fitting the rear end portion to the metal sleeve 10.

Then, the ferrule 5 and the sleeve 1
The optical fiber 7 including the core 7a and the coating 7b is inserted into the optical fiber 0. The projection 5a is formed with a small diameter in order to facilitate the formation of an antireflection film later, and the projection 5a may not be provided in some cases.

Next, as shown in FIG. 3A, the substrate 8 made of a transparent material such as glass that can transmit a predetermined wavelength of light.
Is placed in a vapor deposition apparatus and a dielectric is vapor-deposited in multiple layers to form an antireflection film (AR coat) 9 on one surface of the substrate 8. Less than,
One surface on the side where the antireflection film 9 is formed is the front surface of the substrate 8 and the other surface is the back surface.

Then, as shown in FIG. 3B, a protective cover 11 is attached to the surface of the substrate 8 with a soluble optical adhesive 12. The protective cover 11 is preferably an opaque metal plate or synthetic resin plate so that an operator can easily distinguish it from the transparent substrate 8. Moreover, it does not prevent that it is a material other than that.

The soluble optical adhesive 12 is soluble in water or alcohol as a solvent.
Product name: Aqua Wax (manufactured by Nikka Seiko Co., Ltd.) or its equivalent.

The master substrate 13 is formed by bonding the substrate 8 and the protective cover 11 together, which is formed by bonding with the adhesive 12. The master substrate 13 is placed on, for example, a table-like base and cut into a lattice with a thin blade. The large number of fine chip-shaped substrates is referred to as a chip substrate 13a.

Next, as shown in FIG. 4, in the projection 5a at the tip of the ferrule 5, a direction perpendicular to the direction along the axis of the ferrule 5 or slightly (about 8 °). A slit 14 having a depth that cuts the core 7a of the optical fiber 7 is provided in the inclined direction.

The width of the slit 14 is substantially the same as or slightly wider than the thickness of the chip substrate 13a.

Next, as shown in FIGS. 1A and 1B,
The chip substrate 13a is provided in the slit 14 of the ferrule 5.
Is inserted and fixed with an insoluble optical adhesive.

In this case, the protective cover 11 of the chip substrate 13a is arranged outside the ferrule 5, the substrate 8 is arranged on the ferrule 5 side, and the chip substrate 13a is inserted into the slit 14. In this arrangement, if the protective cover 11 is opaque, it is easy to distinguish it from the transparent substrate 8, so that the operator does not make an arrangement error.

Next, the tip portion of the ferrule 5 having the chip substrate 13a fixed to the protrusion 5a is treated with a solvent (for example,
Soak in water). Then, in the chip substrate 13a, the soluble optical adhesive 12 that adheres the protective cover 11 and the substrate 8 is dissolved in the solvent. The insoluble optical adhesive that fixes the chip substrate 13a to the protrusion 5a of the ferrule 5 does not dissolve in the solvent, does not undergo a chemical change, and maintains its adhesive strength.

Therefore, the optical adhesive 12 is dissolved by the solvent, and the adhesive strength thereof is deactivated after the required time has elapsed, so that the protective cover 11 and the substrate 8 can be peeled off. Therefore, a shearing force is mechanically applied to the slit 14 of the protrusion 5a by gripping the tip side with a tool to cut and separate the tip of the protrusion 5a.

This state is shown in FIGS. 1C and 1D. Since the adhesive strength of the insoluble optical adhesive is maintained, the protective cover 11 has the protrusion 5a.
It is separated from the substrate 8 while being fixedly attached to the small piece 5b side cut from the substrate 8, and the substrate 8 is still fixed to the protrusion 5a remaining on the ferrule 5 side.

In this way, the antireflection film 9 on the surface of the substrate 8 protected by the protective cover 11 is exposed to the outside, and the first method of forming the antireflection film in the light transmitting member according to the present invention is described. The example is complete.

According to the first embodiment described above, when the antireflection film 9 is formed on the transparent substrate 8, only the substrate 8 needs to be placed in the vapor deposition apparatus and allowed to adhere to it. 13 can be formed. Since it is not necessary to put the optical fiber 7 inserted in the ferrule 5 into the vapor deposition device, gas is not generated from the coating resin of the optical fiber 7, and the vapor deposition action is not obstructed. Further, the number of ferrules 5 to be set in the vapor deposition apparatus for vapor deposition is limited to a small number, but in the first embodiment, since the substrate 8 is put in the vapor deposition apparatus and then cut into chips, a large amount is required. It can be produced and production efficiency is improved.

In the second embodiment of the present invention, as shown in FIGS. 5 to 6, the ferrules 5 are arranged so as to face each other, and the ferrules 5 are connected by the projections 5a, and the slits 14 are provided in the projections 5a. Then, as shown in FIG. 6, the chip substrate 15a is formed by adhering the substrates 8 on which the antireflection film 9 is vapor-deposited to each other on one surface on the antireflection film 9 side with a soluble optical adhesive 12. Cut and form.

The chip substrate 15a is attached to the slit 14
And fix it with an insoluble optical adhesive. And
Similar to the first embodiment, the protrusion 5a is dipped in a solvent and further cut at the slit 14 portion. By doing so, an optical transmission member having two antireflection films at a time can be efficiently produced.

As shown in FIG. 7, the third embodiment of the present invention relates to a modification on the ferrule side, in which a slit 14a is provided in an optical fiber array 16 in which a large number of optical fibers 7 are collectively fixed. Then, for each optical fiber 7, the chip substrate 13a formed in the first embodiment is attached to the slit 14a.
If it is inserted in and fixed to the antireflection film 9 as in the first embodiment.
It is possible to form a light transmission member having

The fourth embodiment of the present invention relates to a modification of the ferrule 5, in which the ferrule 5 has a conical tip end as shown in FIG. Since the protrusion 5a of the ferrule 5 in the first embodiment is a cylindrical protrusion, it has a conical shape, which facilitates the manufacture of the ferrule.

The fifth embodiment of the present invention is shown in FIG.
As shown in (b), the ferrule 5 includes an outer cylinder 17 made of stainless steel and a middle cylinder 1 made of zirconia or alumina.
Even if it is formed by two parts of 8, the middle cylinder 1
8 is provided with a slit, and the chip substrate 13a is provided in the slit.
Alternatively, the chip substrate 15a can be inserted and fixed to expose the antireflection film 9 of the substrate 8 to the outside in the same manner as in the above-described embodiments.

The sixth embodiment of the present invention relates to a modified example of the substrate 8 in which the antireflection film 9 is vapor-deposited on one surface as shown in FIG. Instead, it may be formed by inclining one surface.

In this way, when the antireflection film 9 is vapor-deposited on one surface of the substrate 8 on the inclined side, when the substrate 8 is fixed to the slit, the antireflection film 9 is formed on the optical fiber 7.
Will be inclined with respect to the axial direction of the core 7a. Therefore, it is not necessary to incline the slit from the direction orthogonal to the core 7a, and the slit can be easily formed to improve workability.

In the seventh embodiment of the present invention, as shown in FIG. 11, the optical fibers 7 and 7 are arranged so as to face the second embodiment (see FIG. 5), and the chip substrate 15a (second The same method as in the embodiment) is sandwiched in between, and the core 7a of the optical fiber 7 is directly fixed to the tip surface of the core 7a.

In order to fix the chip substrate 15a to the tip surface of the core 7a, as shown in FIGS.
Place the core 7a of the optical fiber 7 on the mold block 19,
The chip substrate 15a is set in the central recess and fixed with an insoluble optical adhesive. After that, the chip substrate 15a is immersed in a solvent to remove the chip substrate 15a.
The antireflection film 9 is exposed to the outside by separating the substrates 8 of 8a.

In addition, although not shown, as another embodiment of the present invention, in addition to depositing the antireflection film 9 on the substrate 8, a filter or a light attenuating film is deposited or attached to the substrate 8. Even in such a case, the antireflection film 9 is only replaced in the above embodiment, and the light transmitting member having the filter or the light transmitting member having the light attenuating film is formed by the same method. is there. Furthermore, the method of the present invention can also be applied to a case where another optical device is used instead of the light transmitting member and a vapor deposition film is provided on the other optical device via a substrate.

[0040]

As described above, the method of forming the antireflection film in the light transmitting member according to the present invention is a method of forming the antireflection film on the tip surface of the light transmitting member. A transparent substrate is vapor-deposited on one surface, the one surface is protected by a protective cover, and the substrate having this protective cover is fixed to the tip surface of the light transmitting member, and then the protective cover is peeled off to expose the antireflection film. The anti-reflection film is protected by a protective cover during the manufacturing line to prevent scratches, and it is possible to produce a large number of chip substrates by putting only the substrate in the vapor deposition device and cutting it. It has an excellent effect that it is possible to improve the production efficiency.

A method of forming an antireflection film on the front end surface of a light transmitting member, comprising depositing the antireflection film on one surface of a transparent substrate, attaching a protective cover to the one surface of the substrate with an adhesive, The substrate to which the protective cover is attached is fixed to the tip surface of the light transmitting member, and then the adhesive surface between the substrate and the protective cover is immersed in a solvent to dissolve the adhesive, and the substrate is attached to the tip of the light transmitting member. Since the protective cover is peeled off to expose the antireflection film of the substrate while leaving it on the surface, it is not necessary to put the light transmitting member directly in the vapor deposition apparatus for vapor deposition, and it does not take time and light transmission. There is no gas generation due to the resin coating film of the member, and the excellent vapor deposition property on the substrate is improved. Furthermore, the number of light transmitting members that can be put in the vapor deposition apparatus is limited, and this is solved by the present invention, and there is an excellent effect that mass production is possible.

The adhesive for adhering the protective cover to one side of the substrate is a soluble optical adhesive which is soluble in a solvent, so that one side of the vapor-deposited substrate can be protected in advance by the protective cover, and at the same time, it is optional. It sometimes has an excellent effect that the protective cover can be easily peeled off with a solvent.

Since the protective cover is made of an opaque material that can be distinguished from the substrate, it is possible to remove the flaws when the chip substrate is fixed to the light transmitting member by the operator and to improve the working efficiency. .

A method of forming an antireflection film on the front end surface of a light transmitting member, comprising depositing the antireflection film on one surface of a transparent substrate, the substrate having the one surface having the antireflection film facing each other. Stick with an adhesive, and fix the integrated boards by inserting them into a slit provided in the connecting part that connects the ferrules that are arranged opposite to each other, and then bond the adhesive surfaces of the two boards with a solvent. If the substrate is soaked and cut at the slit portion to separate the two substrates to expose the antireflection film, the antireflection film can be formed on two light transmitting members at a time, resulting in high work efficiency. It has an excellent effect of improving.

[Brief description of the drawings]

FIG. 1 is each an explanatory view according to a first embodiment of the present invention,
(A) is a side view, (B) is a vertical cross-sectional view, (C) is a vertical cross-sectional view in a state in which a protrusion is cut, and (D) is a side view.

FIG. 2 is a side view (a) according to the first embodiment of the present invention,
It is a longitudinal cross-sectional view (b).

FIG. 3 is an explanatory diagram illustrating a method for forming a master substrate according to the first embodiment of the present invention.

FIG. 4 is a longitudinal sectional view (a), a partial external view (b), and a side view (c) of a ferrule having slits according to the first embodiment of the present invention.

FIG. 5 is a vertical sectional view according to a second embodiment of the present invention.

FIG. 6 is an explanatory diagram of a method for forming a master substrate according to the second embodiment of the present invention.

FIG. 7 is a perspective view of an optical fiber array according to a third embodiment of the present invention.

FIG. 8 is a vertical cross-sectional view of the distal end portion of the ferrule according to the fourth embodiment of the present invention.

9 (a) and 9 (b) are vertical cross-sectional views of the ferrule according to the fifth embodiment of the present invention.

FIG. 10 is a perspective view (A) of a substrate according to a sixth embodiment of the present invention, and a front view (B) of a state in which the substrate is fixed to the front end surface of the ferrule.

FIG. 11 is a perspective view of a state where a chip substrate is fixed to an optical fiber according to the seventh embodiment of the present invention (a), an explanation of a state where the optical fiber is placed on a V block and the chip substrate is fixed between them. It is a figure (b) and a side view (c).

FIG. 12 is a front view (a) of an optical connector according to a conventional example,
It is explanatory drawing (b) of the use condition.

FIG. 13 is a perspective view of a ferrule having an antireflection film according to the conventional example.

FIG. 14 is a perspective view of a ferrule having an antireflection film according to the conventional example.

[Explanation of symbols]

 5 ferrule, 5a protrusion, 7 optical fiber, 8 substrate, 9 antireflection film, 11 protective cover, 12 soluble optical adhesive, 13,15 master substrate, 13a, 15a chip substrate, 14 slit, 17 outer cylinder, 18 middle cylinder, 19 V type block.

Claims (7)

[Claims] 1. A method for forming an antireflection film on the tip surface of a light transmitting member, comprising depositing the antireflection film on one surface of a transparent substrate, protecting the one surface with a protective cover, and applying the protective cover. A method for forming an antireflection film in a light transmission member, comprising: fixing the substrate having the same to the front end surface of the light transmission member, and then peeling off the protective cover to expose the antireflection film. 2. A method of forming an antireflection film on a tip surface of a light transmitting member, comprising depositing the antireflection film on one surface of a transparent substrate and attaching a protective cover to the one surface of the substrate with an adhesive. Then, the substrate to which the protective cover is attached is fixed to the tip surface of the light transmitting member, and then the adhesive surface between the substrate and the protective cover is dipped in a solvent to attach the substrate to the tip surface of the light transmitting member. The protective cover is peeled off to expose the antireflection film of the substrate, and the antireflection film in the light transmitting member is formed. 3. The antireflection of the light transmitting member according to claim 2, wherein the adhesive for adhering the protective cover to one surface of the substrate is a soluble optical adhesive that is soluble in a solvent. Method of forming a film. 4. The substrate to which the protective cover is attached is fixed to the front end surface of the light transmitting member by inserting an optical fiber into the slit provided at the front end of the ferrule of the light transmitting member, and inserting the optical fiber into the slit. The method for forming an antireflection film in a light transmitting member according to claim 2 or 3, characterized in that it is fixed with an insoluble adhesive. 5. The method for forming an antireflection film in a light transmitting member according to claim 1, wherein the protective cover is an opaque body that can be distinguished from the substrate. 6. A method for forming an antireflection film on a tip surface of a light transmitting member, the antireflection film being vapor-deposited on one surface of a transparent substrate, the one surface having the antireflection film being opposed to the other surface. Then, it is adhered with an adhesive, and the integrated both substrates are fitted and fixed in the slits provided in the connecting portion that connects the ferrules arranged opposite to each other, and then the adhesive surfaces of the both substrates are attached. A method for forming an antireflection film in a light transmission member, comprising immersing in a solvent, cutting at the slit portion to separate the both substrates, and exposing the antireflection film. 7. A method for forming an antireflection film on a tip surface of a light transmitting member, comprising depositing the antireflection film on one surface of a transparent substrate, and facing the one surface having the antireflection film. Then, the two substrates are adhered with an adhesive, and the two integrated substrates are fixed to the front end faces by interposing the front end faces of both optical fibers arranged opposite to each other. A method for forming an antireflection film in a light transmission member, comprising immersing in a solvent, cutting at the slit portion to separate the both substrates, and exposing the antireflection film.