JPH091543A - Wafer recovering device for slicing machine - Google Patents

Abstract

PURPOSE: To recover a wafer by satisfactorily sucking and holding the wafer without operating an unreasonable force at the wafer by a simple structure. CONSTITUTION: The wafer recovering device recovers the wafer W quarried from a work by cutting and feeding the work to the inner peripheral edge of the blade rotatably driven. The device comprises a support member such as a sucking and mounting member 40, a sucking member for sucking the wafer W, and fixing member for so coupling the both as to be able to relatively displace the both in a work axis direction via a leaf spring 41 and fixing the relative positions of the both at arbitrary positions. The support member moves between the contact position in contact with the work end face while the sucking member relatively displaces to the support member and the retracted position for retracting from the contact position.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus provided in a slicing device for cutting a work such as a semiconductor ingot to cut out a wafer, and holding and recovering the cut out wafer.

[0002]

2. Description of the Related Art Conventionally, as a slicing device as described above, there are known a work non-rotating type which performs slicing without rotating the work and a work rotating type which performs slicing while rotating the work. Has been.
In the case of the former work non-rotating type, cutting starts from one end of the work, and the other end is cut off at the end to cut out the wafer. From there, it is gradually cut toward the center, and finally the central part is cut.

In these slicing apparatuses, in order to collect the wafer to be cut out, it is necessary to hold the wafer in advance from the stage before the completion of cutting of the wafer. Conventionally, the following measures have been taken to recover such a wafer.

A) In case of non-rotating work: A slice base made of carbon or the like extending in the work axial direction is adhered to one end of the work in advance (for example, refer to JP-A-1-182011). Then, cutting is started from the other end of the work, and after the work is completely cut, the cutting operation is temporarily stopped before the slice base is completely cut. As a result, the work body and the cut wafer are connected to each other only via the slice base. In this state,
A suction member is brought close to the side surface of the wafer leaving a minute gap, and the wafer is sucked by air suction or the like. At this time, the tensile force in the suction direction acts on the work, but since the wafer and the rest of the work are completely cut, there is almost no risk of cracks or the like occurring in the wafer. afterwards,
By restarting the cutting operation and completely cutting the slice base, the wafer can be completely separated from the work.

B) In the case of the work rotating type, the work is cut from the outer circumference toward the inner side in the radial direction. Since the work center part remains at the end, the slice base as described above cannot be used. Therefore, in Japanese Patent Laid-Open No. 58-55208, in addition to a wafer chuck for sucking a wafer, a detector for detecting the contact between the front surface of the work and the wafer chuck, and a wafer chuck when the contact is detected by the contact And a positioning control means for automatically stopping the movement of the. According to this device, the work can be collected in the following manner.

First, the wafer chuck is separated from the work to make the work free, and while rotating the work in this state, the front end of the work is cut by the blade from the outer circumference, and the diameter of the uncut portion (core) at the center of the work. The rotation of the work is temporarily stopped when is reduced to a predetermined value.

When the wafer chuck is brought close to the front surface of the work and it is detected that the wafer chuck contacts the front surface of the work, the movement of the wafer chuck is stopped.

In the above contact state, the wafer chuck is connected to a vacuum source to suck the front surface of the work.

This time, the cutting operation is restarted without rotating the work, and the core portion is cut to completely separate the wafer from the work. At this time, the cut-out wafer is held and held by the wafer chuck. This wafer is transported to a predetermined collection place.

[0010]

The above-mentioned prior art has the following problems to be solved.

In the case of A), the slice base must be adhered to the work, and after the wafer is cut out, the work of peeling the slice base from the wafer is required, which increases the cost.

In the case of B), a detector for detecting the contact between the wafer and the wafer chuck and a positioning control means for automatically stopping the movement of the wafer chuck when the contact is detected by the contact are required. However, the cost of the entire device becomes high. Even if these detectors and positioning control means are used, it is difficult to stop the wafer chuck accurately when the front surface of the workpiece and the wafer chuck start contacting each other. There is a gap between when the chuck stops and when it stops. At this time, the wafer chuck is pressed against the wafer with an unreasonable force by the amount that the stop timing of the wafer chuck is delayed from the contact completion timing, which may cause chipping or cracking at the time of separating the wafer. On the contrary, if the stop timing is too early, the contact between the wafer and the wafer chuck may be incomplete.

In view of such circumstances, the present invention has a simple structure that does not require a slice base, a contact detecting means, and a positioning means, and a suction for holding the wafer without exerting an unreasonable force on the wafer. It is an object of the present invention to provide an apparatus capable of reliably bringing a member and a wafer into close contact with each other and thereby favorably collecting the wafer.

[0014]

The present invention is provided in a slicing device for cutting a wafer from a work by moving the work relative to a slicing blade in the slicing direction, and holding the cut wafer. And a support member configured to move relative to the blade integrally with the work, and capable of relative displacement in the support member in a direction parallel to the axial direction of the work. An adsorbing member that is connected and that is switched between a state in which the wafer is adsorbed and a state in which the wafer is released, and a fixing unit that is capable of switching the relative position of the adsorbing member to the support member at a desired position and in a releasing state. The support member is moved between a contact position where the suction member can contact the wafer and a retracted position retracted in the work axis direction from this contact position. It is obtained by a drive means for (claim 1).

It is more preferable that this apparatus includes a pressing member that presses the suction member against the wafer at the contact position to bring them into close contact with each other (claim 2).

More specifically, the supporting member and the suction member are connected to each other via a plate spring which is capable of bending in the axial direction of the work, and the elastic force of the plate spring presses the suction member against the wafer. With such a configuration, a more excellent effect as described below can be obtained (claim 3).

The fixing means is fixed to either one of the suction member and the supporting member, and the other is clamped from a direction orthogonal to the axial direction of the workpiece to a releasing state. Means are preferred (claim 4).

[0018]

According to the apparatus according to the first aspect, for example, in the case of the work rotating type slicing apparatus, the wafer can be recovered without any trouble by the following procedure.

The work is set at a predetermined processing position, and the support member is moved relative to the work to retract the suction member from the work in the axial direction. The suction state is set to the non-suction state, and the fixing means is set to the release state.

The supporting member is moved relative to the work to bring the suction member into contact with the end surface of the work, and the suction member is switched to the suction state. At this time, even if there is a deviation between the position where the suction member starts to contact the workpiece end surface and the position where the suction member stops, the difference between these positions is due to the relative displacement of the suction member in the work axis direction with respect to the support member. Be absorbed,
Unreasonable force cannot be applied to the work. Moreover, by switching the suction member to the suction state in this state, the suction member can be surely brought into close contact with the work end surface.

The fixing means is switched to the fixed state, and the relative position of the suction member with respect to the support member is fixed (that is, relative displacement is prevented).

The suction member is switched to the non-suction state. As a result, the load applied from the suction member to the wafer is almost released.

While rotating the work, the work and the supporting member are integrally moved relative to the slicing blade to start cutting of the wafer. At this time,
Although some friction occurs between the stationary suction member and the rotating work, it hardly affects the slicing operation.

At the time when the slicing is almost completed (when the outer peripheral portion is sliced while leaving the center portion of the work), the rotation of the work and the relative movement with respect to the blade are stopped, and the suction member is switched to the suction state again. The work piece end face (the face corresponding to the wafer side face after cutting) is sucked and held by the suction member.

Without rotating the work, the relative movement of the work and the supporting member with respect to the blade is restarted to completely separate the wafer from the work.

The support member and the suction member are moved integrally to collect the wafer.

In the above procedure, the suction member is once separated from the work end surface when is finished,
The suction member and the end surface of the work (the surface which will be the side surface of the wafer in the future) may be brought into contact with each other again at the end of the above step.

Further, in the non-rotating work slicing device, the end face of the work may be sucked by the suction member before the cutting of the work is started.

According to the second aspect of the present invention, since the pressing member for pressing the suction member against the wafer at the contact position to bring them into close contact with each other is provided, in the above, the pressing is performed only by moving the support member to the contact position. It is possible to bring the suction member into close contact with the front surface of the work by the pressing force of the member, and therefore, the operation of switching the suction member to the suction state is unnecessary.

More specifically, according to the apparatus of claim 3, the relative displacement of the support member and the suction member in the axial direction of the work is allowed by the bending of the leaf spring connecting the support member and the suction member. At the same time, the attracting member is pressed against the wafer by the elastic force of the leaf spring.

In the apparatus according to the fourth aspect, relative displacement between the suction member and the support member is allowed while the clamp means is switched to the released state, and from this state, the clamp means works one of the members. By clamping from the direction orthogonal to the axial direction, the relative displacement is prevented (that is, the relative position of the suction member with respect to the support member is fixed).

[0032]

An embodiment of the present invention will be described with reference to the drawings.

The slicing apparatus shown in FIGS. 1 to 3 is equipped with a base 1, on which a guide rail 2 is installed. The cutting feed direction (Fig. 1
The slide table 3 is supported so as to be slidable in the depth direction of FIG. 2 (the direction of arrow A1 in FIG. 2), and a work support table 3a is erected on the slide table 3.

A headstock 4 is installed on the base 1 at a position facing the work support 3a. A main bearing 4a is provided on an upper part of the headstock 4, and a main shaft 6 is rotatably supported by the main bearing 4a, and a main shaft drive motor 8 (FIG. 2) is attached to the main shaft 6 via a belt transmission mechanism 7. The output shafts of are connected. A tension disk 9 is fixed to the tip of the main shaft 6, and the tension disk 9 is rotatably driven by a rotary drive means 5 including the main shaft 6, the belt transmission mechanism 7, and a main shaft drive motor 8. .

A blade 10 made of a donut-shaped thin plate is mounted on the peripheral edge of the tension disk 9, and an inner peripheral blade 11 made of diamond particles or the like is fixed to the inner peripheral edge of the blade 10.

A cutting and feeding means 14 is installed on the base 1. This cutting feed means 14 is used for the ball screw 1
2 and a cutting feed motor 13 that rotationally drives the ball screw 12, and the cutting feed means 14 slides the slide table 3 along the guide rail 2 in the cutting feed direction. ing.

The work support base 3a is provided with an indexing moving member 15 which is slidable in the work indexing direction (direction of arrow A2 in FIG. 1), and indexing feeding means 18 for moving the indexing moving member 15. It is provided. The indexing feed means 18 includes a ball screw 16 and a holding member drive motor 17 that rotationally drives the ball screw 16.
The indexing moving means 15 transfers the indexing moving member 15 in the work indexing direction.

A work rotary bearing 20 is installed on the index moving member 15, and a work rotary shaft 21 extending in the work indexing direction is rotatably supported by the work rotary bearing 20. The rear end (right end in FIG. 1) of the work rotation shaft 21 is connected to the output shaft of the work rotation drive motor 23 via the speed reducer 22, and the front end has a plurality of (four in the illustrated example) claws. A chuck 24 for gripping a work having 24a is fixed.

In this embodiment, a cylindrical silicon semiconductor ingot is used as the work 30 to be sliced. A gripped plate 25 is adhered to the rear end (right end in FIG. 1) of the work 30, and the gripped plate 25 is gripped by the chuck 24 so that the work 30 is parallel to the indexing direction. It is supposed to be held in. By the operation of the indexing and feeding means 18, the work 30 moves back and forth between the retracted position shown by the solid line in FIG. 1 and the cutting position (the position where the front end of the work faces the hole in the center of the blade 10) shown by the chain double-dashed line in FIG. In addition, when the work rotation drive motor 23 operates, the gripped plate 25
The work 30 is rotationally driven at a low speed integrally with the above.

In FIG. 1 and FIG. 2, 26 is a bellows-shaped cover.

On the slide table 3, a wafer collecting device 32 is installed on the side (upper side in FIG. 2) of the work support base 3a. This wafer recovery device 3
2 includes a base 34, which is installed slidably in a direction parallel to the work axis direction. A telescopic cylinder 31 is fixed to the slide table 3 in a direction parallel to the work axis direction.
1a is connected to the base 34. Therefore, the operation of the telescopic cylinder 31 causes the base 34 to slide.

Reference numeral 33 in FIGS. 2 and 3 is a guide bar.

A column 36 is erected on the base 34, and a suction attachment member 40 is attached to the upper end of the column 36 via an arm 38. The base 34 and the column 3
6, the arm 38, and the suction attachment member 40 constitute a support member in the present invention. The suction member 50 is connected to the suction mounting member 40.

The suction member 50 is formed in a plate shape extending in parallel with the end face of the work, and the suction pads 51 as shown in FIGS. 4 to 6 are arranged at the center thereof and the suction pads 52 are arranged at the four corners. ing. Air suction ports 53, 54 are provided at the centers of the suction pads 51, 52, respectively, and these air suction ports 53, 54 are connected to the air suction ports 56, 58 via air suction passages 55, 57, respectively. The air suction ports 56 and 58 are connected to an unillustrated air suction source such as an air pump.

This suction member 50 and the suction mounting member 40
Are connected to each other via a pair of front and rear leaf springs 41 arranged in the work axis direction. These leaf springs 41 are arranged parallel to each other, and one end thereof is connected to the suction attachment member 40 and the other end thereof is connected to the suction member 50 by screws 39, respectively.

Therefore, due to the bending deformation of these leaf springs 41, as shown in FIGS.
0 can be displaced relative to the suction attachment member 40 in the work axis direction. At the position where the telescopic cylinder 32 is extended and the base 34 is moved forward (the retracted position), as shown in FIG.
As shown in FIG. 6, at the position (contact position) in which the suction pads 51 and 52 are separated from the end surface of the work 30 in the cutting position to the front, and the expandable cylinder 32 is contracted to retract the support member, as shown in FIG. As shown in FIG. 7B, each suction pad 51, is attached to the end surface of the work 30 at the cutting position.
The stroke of the telescopic cylinder 32 is set so that the spring 52 comes into contact with the leaf spring 41 while being deformed (not shown in FIG. 6).

Leaf springs 45A and 45B are respectively attached to the upper and lower ends of the suction member 50 on the side close to the suction mounting member 40 (right end portions in FIGS. 4 to 9) through screws 46A and 46B, respectively. One end of is fixed. The telescopic cylinder 42 is fixed downward to the other end of the upper leaf spring 45A by a screw 47A (FIGS. 8 and 9).

The telescopic cylinder 42 has a piston 43 built therein, and an air inlet / outlet 42a is provided below the piston 43 and an air inlet / outlet 42b is provided above the piston 43. The upper end of a rod 44 extending in the vertical direction is connected to the piston 43.
Protrudes downward through a vertical through hole 40a provided in the suction mounting member 40. This rod 44
A male screw is engraved on the lower end of the
The other end of the lower leaf spring 45B is fixed by 9 and the clamp plate 48 is fixed to the other end of this leaf spring 45B by a screw 47B.

Then, as shown in FIG. 8, when air is introduced from the lower air inlet / outlet 42a into the rod-side chamber in the telescopic cylinder 42, the piston 43 rises and the telescopic cylinder 42 main body and the clamp plate 48 are moved. While the two are attracted to each other to clamp the suction mounting member 40 from above and below, as shown in FIG. 9, when air is introduced from the air inlet / outlet 42b to the head side chamber in the telescopic cylinder 42, the piston 43 The stroke of the telescopic cylinder 42 is set such that the telescopic cylinder 42 main body and the clamp plate 48 separate from each other while the leaf springs 45A and 45B are flexibly deformed to release the suction attachment member 40. .

That is, the leaf springs 45A and 45B, the telescopic cylinder 42, the clamp plate 48 and the like constitute the clamping means in the present invention. In the clamped state shown in FIG. 8, the suction attachment member 40 and the suction member 50 are provided. While relative displacement with and is blocked at any position (that is, the relative position is fixed), in the clamped state shown in FIG.
The suction attachment member 40 and the suction member 5 accompanying the deformation of the leaf spring 41
A relative displacement with respect to 0 is allowed.

Next, a slicing method for cutting out the wafer W from the work 30 and a method for recovering the cut out wafer W using the apparatus of this embodiment will be described.

By operating the indexing and feeding means 18 to set the work 30 at the cutting position shown by the chain double-dashed line in FIG. 1, the telescopic cylinder 32 is extended and the base 34 is advanced to the retracted position. Further, as shown in FIG. 7A, the suction member 50 and the work end surface are separated from each other. Further, the telescopic cylinder 42 is extended to be in the clamp released state as shown in FIG.

The telescopic cylinder 32 is contracted to make the base 34
Back to the contact position. As a result, the suction pads 51 and 52 of the suction member 50 come into contact with the front end surface of the work 30 as shown in FIGS. 6 and 7B while the leaf spring 41 is flexibly deformed (elastically deformed), and The elastic force of the plate spring 41 presses the suction pads 51, 52 against the front end surface of the work. Therefore, the elastic force of the leaf spring 41 is used to attach the suction pads 51 and 52 to the front end surface of the work 30 without applying an excessive force to the work 30 and without performing contact detection or positioning control as in the conventional case. Can be firmly adhered to.

The telescopic cylinder 42 is contracted to clamp the suction mounting member 40 from above and below with the telescopic cylinder 42 and the clamp plate 48 (FIG. 8), and the relative position between the suction mounting member 40 and the suction member 50 is fixed. .

The spindle drive motor 8 is operated to rotate the tension disk 9 and the blade 10 integrally with the spindle 6.

While rotating the work 30 by activating the work rotation drive motor 23, the work 30 and the entire wafer recovery device 32 are moved relative to the blade 10 integrally with the slide table 3 (that is, cutting feed). The cutting of the wafer W from the work 30 is started. At this time, some friction occurs between the suction member 50 that is not rotating and the workpiece 30 that is rotating, but this has little effect on the slicing operation.

At the time when the slicing is almost completed, that is, when the outer peripheral portion of the work 30 is sliced and the wafer W is substantially cut out as shown in FIG. 6, the work 30 is rotated and cut and fed. Stop once.

By connecting the air suction ports 56 and 58 to an air suction source (not shown) and sucking air from the air suction ports 53 and 54, the suction pads 51 and 52 are attached to the front end face of the work 30 (after cutting, the wafer is cut). Adsorb the side surface of W).

This time, the workpiece 30 is not rotated and only the cutting feed is restarted to cut the central portion 30a to completely separate the wafer W from the workpiece 30.

The base 34 is returned to the retracted position, and the wafer W is transferred to a predetermined recovery point by another transfer device or the like.

By repeating the above operation, the cutting of the wafer W from the work 30 and the recovery thereof can be continued.

The present invention is not limited to this embodiment, and the following modes can be taken as examples.

(1) In the above embodiment, the leaf spring 41 connecting the suction attachment member 40 and the suction member 50 is also used as a pressing member for pressing the suction pads 51 and 52 against the wafer W by its elastic force. However, instead of this, the suction attachment member 40 and the suction member 50 are connected by a link mechanism or the like so as to be relatively movable in the work axis direction, and another spring member or the like is attached as a pressing member. Good.

The wafer W can be collected without providing such a pressing member. In this case, in the stage before the slicing described above, after the base 34 is moved from the retracted position to the contact position, the suction operation is performed once to bring the suction pads 51 and 52 into close contact with the front end surface of the work. The retracting cylinder 42 may be contracted and clamped, and then the suction operation may be stopped. After that, the wafer W can be recovered in the same manner as in the above-described embodiment according to the procedure described above.

(2) In the above embodiment, the suction pads 51, 5
Work piece 3 while 2 is in contact with the front end surface of work piece 30
Although the slicing is performed by rotating 0, instead of this, the telescopic cylinder 42 is contracted so that the suction attachment member 4
After fixing the relative position between 0 and the suction member 50, the base 34 is once returned to the retracted position to separate the suction pads 51 and 52 from the front end surface of the work, and after the cutting except the work central portion 30a is completed, The base 34 may be returned to the contact position so that the suction pads 51 and 52 are brought into contact with the front end surface of the work again. However, if slicing is performed with both suction pads 51, 52 in contact with the front end surface of the work,
The chips produced by this slicing are absorbed by the suction pad 5
There is an advantage that it is possible to prevent biting between 1, 52 and the front end face of the work, and to avoid a suction failure caused by the biting.

(3) In the above embodiment, the leaf springs 45A and 45B constituting the clamp means are fixed to the suction member 50 side,
Although the suction mounting member 40 is clamped, the leaf springs 45A and 45B may be fixed to the suction mounting member 40 side and the suction member 50 may be clamped.

(4) In the above embodiment, the work rotating type slicing device is shown. However, the present invention can be applied to a work non-rotating slicing device, that is, a device for slicing a work without rotating the work. Is. In this case, it is possible to perform the recovery by the same procedure as in the above-mentioned examples, or it is possible to start the suction already from the time when the suction member 50 and the work end surface are brought into contact with each other and perform the slicing in this suction state. Is also possible. In any case, since the suction does not apply an unreasonable force to the wafer, it becomes unnecessary to adhere the slice base to the work as in the conventional case.

(5) In the above embodiment, the work 30 is moved in the cutting feed direction, but slicing can be performed by moving the tension disk 9 in the cutting feed direction instead.

[0069]

As described above, according to the present invention, the supporting member that moves relative to the work in the axial direction thereof and the suction member that sucks the wafer are connected so as to be relatively displaceable in the work axial direction, and these supporting members are also connected. Since the fixing means for appropriately fixing the relative position between the suction member and the suction member and the driving means for moving the supporting member and the suction member relative to the workpiece in the axial direction thereof, the slice base and the contact detection means are provided. Also, with a simple configuration that does not use positioning control means, the suction member can be reliably brought into close contact with the wafer to be cut without applying an unreasonable force to the wafer, and the suction member can hold the wafer well. While there is an effect that can be collected.

Since the apparatus according to the second aspect includes the pressing member that presses the suction member against the wafer at the contact position to bring them into close contact with each other, the pressing operation is performed only by moving the support member to the contact position. The pressing force of the member makes it possible to bring the suction member into close contact with the front surface of the work, and there is an effect that the operation of switching the suction member to the suction state is unnecessary for this close contact and the work efficiency can be further enhanced.

Particularly, in the apparatus according to the third aspect, since the elastic force of the leaf spring connecting the supporting member and the suction member is used to press the suction member against the wafer, it is simpler. The structure has the effect of allowing the suction member and the work to be brought into close contact with each other.

Further, in the apparatus according to the fourth aspect, there is an effect that the relative position of both members can be fixed at an arbitrary position with a simple structure in which the adsorbing member or the supporting member is clamped by the clamping means.

[Brief description of the drawings]

FIG. 1 is an overall side view of a slicing device according to an embodiment of the present invention.

FIG. 2 is an overall plan view of the slicing device.

FIG. 3 is a cross-sectional front view showing a work and a wafer recovery device which are sliced by the slicing device.

FIG. 4 is a front view of the wafer recovery device.

FIG. 5 is a plan view showing a state in which the suction member is separated from the front end face of the work in the wafer recovery device.

FIG. 6 is a plan view showing a state in which the suction member is in contact with the front end face of the work in the wafer recovery device.

7A is a sectional view taken along the line AA of FIG. 4, and FIG. 7B is a sectional plan view showing a state in which the suction member is displaced relative to the suction mounting member from the state of FIG.

8 is a cross-sectional view taken along the line BB of FIG.

9 is a sectional front view showing a state where the clamp of the suction attachment member is released from the state of FIG.

[Explanation of symbols]

 10 Blade 11 Inner Circumferential Blade 14 Cutting Feeding Means 23 Work Rotation Drive Motor 30 Work Work 31 Telescopic Cylinder (Drive Means) 32 Wafer Recovery Means 34 Base (Supporting Member) 36 Support (Supporting Member) 38 Arm (Supporting Member) 40 Adsorption Mounting Member (Supporting Member) 41 Leaf Spring 42 Expansion Cylinder (Clamping Means) 45A, 45B Leaf Spring (Clamping Means) 48 Clamping Plate (Clamping Means) 50 Adsorption Member

 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Keiji Kawaguchi 5-338 Ujinahigashi, Minami-ku, Hiroshima City Toyo Advanced Technologies Co., Ltd.

Claims (4)

[Claims] 1. A device provided in a slicing device for cutting a wafer from a work by moving the work relative to a blade for slicing in the slicing direction, and a device for holding and collecting the cut-out wafer. And a supporting member configured to move relative to the blade integrally with the work, and connected to the supporting member so as to be relatively displaceable in a direction parallel to the axial direction of the work, and suck the wafer. A suction member that is switched between a state and a release state; a fixing unit that switches the relative position of the suction member to the support member at a desired position and a release state; and the support member and the suction member. A wafer in a slicing device, characterized in that the wafer is provided with a driving means for moving the workpiece relative to the axial direction. Collection device. 2. The wafer collecting device in the slicing device according to claim 1, further comprising a pressing member that presses the suction member onto the wafer to bring them into close contact with each other. 3. The wafer collecting apparatus in the slicing apparatus according to claim 2, wherein the supporting member and the suction member are connected via a leaf spring which is bendable in the axial direction of the work, and the elastic force of the leaf spring is used. A wafer recovery device in a slicing device, wherein the suction member is pressed against the wafer. 4. The wafer collecting device in the slicing device according to claim 1, wherein the fixing means is fixed to either one of the suction member and the supporting member, and the other is the shaft of the work. A wafer recovery device in a slicing device, comprising a clamping means that can switch between a clamping state and a releasing state in a direction orthogonal to the direction.