JPH09148719A - Manufacture of printed board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the occurrence itself of foreign matters, such as glass fibers, etc., during the course of the manufacturing process of a printed board by executing a process for coating the end face of the board with a liquid insulating resin before a parts mounting process. SOLUTION: In a first process, a partitioned printed board 6 containing mounting substrates 9 is obtained by coating the end face of the board 6 with a liquid insulating resin 10. In a second process, the mounting substrates 9 are cut off from the board 6 at the front end positions of connecting sections 8. However, cut faces are exposed on the end faces of the cut substrates 9 on the front end sides of the connecting sections 8. In a third process, therefore, the end faces are coated with the liquid insulating resin 10. When the end faces are coated with the resin 10, foreign matters, such as glass fibers, etc., exciting on the end faces and cut faces of the substrates 9 are not scattered to the outside, but sealed up with the resin 10.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a printed circuit board on which a liquid crystal display device or the like is mounted.

[0002]

2. Description of the Related Art Conventionally, a liquid crystal display device, for example, a liquid crystal display device having a structure in which liquid crystal is sandwiched between a pair of glass plates serving as a display surface and fixed with a frame, and other parts are mounted. In the printed circuit board, as shown in FIG. 3, after the liquid crystal display element 2 and other components 3 are mounted on the printed circuit board 1, dusts and the like scattered on the printed circuit board 1 with the air shower 4 are removed. It is assembled by a manufacturing method including a step of removing the foreign matter 5.

[0003]

However, when assembled by such a manufacturing method, in recent years, high-density mounting has advanced, and due to repeated vibrations when mounting components, foreign matter such as glass fiber mainly contained in the substrate material. There is a problem that 5 are scattered from the end face of the board, and they gather on the surface of the printed board 1 and sneak in between the parts 3. These foreign matters 5 are mounted on the part 3 by the air shower 4 as described above. Even if it is attempted to be removed, it cannot be removed completely, and this is later attached to the glass plate (display surface) of the liquid crystal display element 2 due to the influence of static electricity or the like, thereby impairing the display quality and deteriorating the assembly quality of other substrates. There was a point.

The present invention has been made to solve the above-mentioned conventional problems, and an object of the present invention is to provide a method of manufacturing a printed circuit board which can prevent the generation of foreign substances such as glass fibers.

[0005]

In the method of manufacturing a printed circuit board according to the present invention, a step of coating a liquid insulating resin on the end face of the board is provided before the step of mounting a component including a liquid crystal display element.

According to the present invention, the insulating resin coated on the end face of the substrate can effectively prevent the generation of foreign matters such as glass fibers, and solve the problems caused by these foreign matters.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings. 1A and 1B each show a split-type printed circuit board to which the method for manufacturing a printed-circuit board according to an embodiment of the present invention is applied. FIG. 1A is a plan view of the whole split-type printed circuit board before mounting components. (b) is the same side view,
2 (a) is a plan view of the mounting board after component division and before component mounting, FIG. 2 (b) is a side view thereof, and FIG. 2 (c) is a step of coating a liquid insulating resin on the cut surface of the board. It is a side view of the mounting substrate after.

In FIG. 1, reference numeral 6 denotes a split type printed circuit board made of insulating resin, glass fiber or the like, and a mounting board 9 is continuously provided in the center of the printed circuit board through a split groove 7 and a connecting portion 8.
The mounting substrate 9 is divided by cutting the connecting portion 8. Reference numeral 10 denotes an insulating resin coated on the board end surface of the split type printed circuit board 6 including the mounting board 9. Reference numeral 11 denotes an insulating resin existing on the board end surface, a foreign material such as glass fiber, which is hardened by the insulating resin 10. Shows the state.

Next, to explain the manufacturing method, first,
As a first step, the liquid crystal insulating resin 10 is coated on the substrate end surface of the split type printed circuit board 6 including the mounting substrate 9 to obtain the split type printed circuit board 6 shown in FIG. In the next step, the divided printed circuit board 6 is cut at the tip of the connecting portion 8 to obtain a mounting board 9 shown in FIGS. 2 (a) and 2 (b). The shape of the tip position on the side of the mounting substrate 9 is such that the cut surface 12 shown in FIGS. 2 (a) and 2 (b) is exposed. As a next step, the entire surface of the cut surface 12 is coated with the liquid insulating resin 10 similar to the above, and then, as shown in FIG.
The surface is covered as shown in. Subsequent manufacturing steps as a board are carried out by a normal printed board manufacturing step starting from mounting of components.

In this way, foreign matter such as glass fibers existing on the end face of the substrate and the cut surface is hardened by the insulating resin and is not scattered to the outside.

[0011]

As described above, according to the present invention, it is possible to prevent the scattering of foreign matters such as glass fiber by coating the end surface of the substrate with the liquid insulating resin before the step of mounting the components including the liquid crystal display element. The harmful effects due to the foreign matter such as the foreign matter adhering to the display surface of the liquid crystal display element can be eliminated, and high assembly precision can be obtained, and the visual inspection and inspection work of the substrate can be advantageously reduced.

[Brief description of the drawings]

FIG. 1 is a plan view and a side view of a split type printed circuit board to which a method for manufacturing a printed circuit board according to the present invention is applied.

2A and 2B are a plan view and a side view of a mounting board to which the method for manufacturing a printed board according to the present invention is applied.

FIG. 3 is a side view showing a step of removing foreign matter by an air shower of a mounting board in a conventional method for manufacturing a printed board.

[Explanation of symbols]

6 ... Divided type printed circuit board, 7 ... Dividing groove, 8 ... Coupling part, 9 ... Mounting board, 10 ... Insulating resin, 11 ... Foreign matter,
12 ... cut surface.

Claims (2)

[Claims] 1. A method of manufacturing a printed circuit board, comprising a step of coating a liquid insulating resin on the end surface of the board before the component mounting step. 2. A step of coating a liquid insulating resin on an end face of a split type printed circuit board in which mounting boards are connected in series via a connecting section, a step of cutting the mounting board from the connecting section and dividing the same. And a step of coating the cut surface of the connecting portion of the mounting board with a liquid insulating resin before the component mounting step.