JPH09145741A - Probing card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To surely bring the electrode pads of a wafer to be inspected into contact with the terminals of a probing card following the difference of elevation between the pads and the inclination of the wafer by rotating the pressing member of the card around a hard ball provided at the center of the rear surface of the card. SOLUTION: When a stage carrying a semiconductor wafer W to be inspected on its surface is raised, the wafer W pushes up a pressing member 4 against spring force of a plate spring 6 and comes into contact with a membrane (probing card) 1. When the wafer W is parallel to the card 1, the difference of elevation between the electrode pads P is absorbed by an elastic plate on the surface of the member 4 and the pads P surely come into contact with the contact bumps 1A of the card 1. When the wafer W is inclined against the card 1, the pad P on the higher (left) side first comes into contact with the left-side bump 1A and pushes up the left side of the member 4 against the spring 6. However, since the member 4 rotates around a hard ball 5 and makes the contacting surface of the card 1 coincident with the inclination of the wafer W, the bumps 1A surely comes into contact with the pads P and the wafer W can be inspected stably and surely.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a probing card.

[0002]

2. Description of the Related Art In a semiconductor process step, a semiconductor wafer on which a large number of chips have been manufactured is hung as it is on a probe device to electrically inspect the chips.
Based on this inspection result, defective chips are screened. The probing card attached to the probe device has, for example, a plurality of probe needles corresponding to the electrode pads of the chip formed on the semiconductor wafer, and each probe needle is brought into direct contact with the electrode pad to detect the signal from the tester. It is used for giving and receiving.

However, since the pitch between the electrode pads has become narrower, for example, on the order of several tens of μm due to the high integration of chips, it is necessary to manufacture a probing card having a probe needle adapted to the narrowed electrode pads. Is getting harder and harder. In addition, since the diameter of semiconductor wafers is increasing, the number of chips formed on semiconductor wafers is increasing. Since the probing method of inspecting each individual chip of such a semiconductor wafer is inefficient in inspection, a probing method of simultaneously inspecting a plurality of chips in one inspection has been adopted. However, in the case of the conventional probing card, it is difficult to attach the probe needles at a narrow pitch, and it is extremely difficult to arrange the probe needles so as to simultaneously contact the electrode pads of the plurality of chips. .

Therefore, as a probing card for solving such a problem, a plurality of contact bumps are provided on a film member having a predetermined pattern wiring in, for example, Japanese Patent Application Laid-Open Nos. 2-126159 and 2-163664. So-called membrane type probing cards have been proposed. In the test probe described in the former publication, the film attached to the annular moving base has its peripheral edge supported by a support, and a leaf spring is installed between the support and the annular moving base. A cushion is attached to the back surface of the film, and the contact pressure is controlled by the cushion to absorb the height difference of the electrode pad. In this probing card, when the film comes into contact with the test wafer during the test of the test wafer, the film moves integrally with the annular moving base in the vertical direction against the elastic force of the leaf spring, and each contact bump causes the electrode pad to move. Each of them is elastically contacted with each other to perform a predetermined test. On the other hand, the probe device described in the latter publication is configured to include a test probe configured according to the former probing card except that a rotary plate that follows the inclination of the test wafer is provided on the back surface of the film. In this test probe, when the test wafer and the film are not parallel to each other during the test, the rotating plate rotates and the film gradually becomes parallel to the test wafer so that both elastically contact with each other to perform a predetermined test. .

[0005]

However, in the case of a conventional probing card having a rotary plate attached, even if the test portion of the semiconductor wafer has a slight inclination, the rotary plate follows the inclination to form a film. It is possible to secure the parallel state of the test part, but since the rotating plate and the membrane are fixed via the cushion when making the parallel state,
When the rotating plate rotates, tensile stress is applied to the film from the peripheral edge of the rotating plate, and it is difficult to obtain smooth rotation of the rotating plate, which may reduce the reliability of the test.

Further, in the case of the conventional membrane type probing card, since the membrane and the annular moving base are merely elastically supported by the leaf spring, the amount of protrusion of the membrane to the test wafer side is previously determined. Since the set value is uniquely determined, there is a problem that the overhang amount cannot be adjusted according to the probe device, and the probe device can be mounted only on a specific probe device.

The present invention has been made in order to solve the above problems, and even in an integrated circuit with a high degree of integration in which the pitch between the electrode pads of the object to be inspected is narrowed, the height difference of the electrode pads and the object to be inspected With the aim of providing a membrane type probing card that has excellent followability to the inclination of, the terminal can surely contact the corresponding electrode pad, can perform highly reliable inspection quickly, and has a small number of parts. There is. Another object of the present invention is to provide a membrane type probing card which can easily adjust and change the contact pressure of the terminal in addition to the above object. Furthermore, another object of the present invention is to provide a membrane type probing card which can be mounted on various probe devices and has improved versatility.

[0008]

A probing card according to a first aspect of the present invention comprises a film member having a terminal formed on its surface, the terminal electrically contacting an electrode of an object to be inspected. In a membrane type probing card that exchanges electrical signals between the two to perform electrical inspection of the inspected object,
A support member that supports the peripheral portion of the film member and has a recess in the center, a pressing member that is disposed in the recess of the support member and presses the film member from the back side, and the pressing member,
A leaf spring that gives elasticity through a hard ball arranged on the back surface of the center, and an accommodating body that stores the spring force of the leaf spring by accumulating it and is opposed to the pressing member in the recess. It is characterized by having and.

Further, a probing card according to a second aspect of the present invention is provided with a film member having a terminal formed on the surface thereof, which electrically contacts an electrode of the object to be inspected, and an electric signal is provided between the terminal and the electrode. In a membrane-type probing card that transmits and receives to perform an electrical inspection of an object to be inspected, a support that supports the peripheral portion of the membrane member and has a recess in the center, and is disposed in the recess of the support. A pressing member that presses the film member from the back surface side, and a leaf spring that applies elasticity to the pressing member via a hard ball arranged on the central back surface thereof,
A plurality of strips for accommodating and storing the spring force of the leaf spring and for accommodating the spring force of the leaf spring and for accommodating the pressing member, and for accommodating the spring force in the accommodating body. The present invention is characterized in that a groove portion is provided, a pair of left and right groove portions corresponding to the elasticity to be applied to the film member accommodates round bars, and the leaf springs are received by both round bars.

Further, a probing card according to a third aspect of the present invention is provided with a film member having a terminal formed on the surface for electrically contacting the electrode of the device under test, and an electric signal is provided between the terminal and the electrode. In a membrane-type probing card that transmits and receives to perform an electrical inspection of an object to be inspected, a support that supports the peripheral portion of the membrane member and has a recess in the center, and is disposed in the recess of the support. A pressing member that presses the film member from the back surface side, and a leaf spring that applies elasticity to the pressing member via a hard ball arranged on the central back surface thereof,
A storage body which stores the spring force of the plate spring and stores the spring force in the recess facing the pressing member; and a screw hole provided in the center of the recess of the support and the storage It is characterized in that a screw member for pressing the body from the back surface is attached to the screw hole.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described below based on the embodiments shown in FIGS. As shown in FIG. 1, the probing card of the present embodiment is a film member having a plurality of terminals corresponding to the electrode pads P of a chip formed on the surface of a device under test (for example, a semiconductor wafer W) (hereinafter referred to as “membrane 1 ), A support 2 that supports the membrane 1, and a printed wiring board 3 that is electrically connected to the outer peripheral edge of the membrane 1 supported by the support 2, and is of a membrane type. It is configured as a probing card.

The membrane 1 is a thin film made of synthetic resin such as polyimide resin or silicon resin, and the terminals of the membrane 1 are formed on the surface of the membrane 1. The terminals are formed as contact bumps 1A made of, for example, gold or gold alloy in accordance with the arrangement of the electrode pads P. The membrane 1 includes, for example, a type that inspects a large number of chips on the semiconductor wafer 1 one by one, and a type that simultaneously inspects a plurality of chips. The membrane 1 of the type that inspects one chip may have the contact bumps 1A formed in accordance with the number and arrangement of the electrode pads P for inspection, and the membrane 1 that inspects a plurality of chips has an array of chips to be inspected at the same time. The contact bump 1A may be formed according to the electrode pad P in the region. Wirings having a predetermined pattern are formed on the membrane 1 by a wiring material such as copper or copper alloy, and the contact bumps 1A are formed on these pattern wirings (not shown) through the through holes of the membrane 1 or the like. It is connected.

The support 2 is formed of a metal such as stainless steel or aluminum into a rectangular shape.
Further, a concave portion 2A is formed in the center of the lower surface and a flange portion 2B is formed above the concave portion 2A. Also,
At the center of the printed wiring board 3, a through hole 3A having a diameter smaller than that of the flange portion 2B, into which the support 2 is fitted, is formed. Therefore, the membrane 1 covers the concave portion 2A of the support body 2, and the outer peripheral edge portion is sandwiched between the flange portion 2B of the support body 2 and the through hole 3A of the printed wiring board 3. The connection terminals on the outer peripheral edge of the membrane 1 are electrically connected to the connection terminals of the printed wiring board 3 at the sandwiched portion. Wiring is formed on the printed circuit board 3 in a predetermined pattern by a wiring material such as copper, and is connected to a pogo pin (not shown) of a connection ring of the probe device via connection terminals arranged on the outer peripheral edge of the wiring. ing. As a result, the contact bumps 1A of the membrane 1 are electrically connected to the test head of the probe device so that the semiconductor wafer 1 can be subjected to a predetermined electrical test.

An elastic force applying mechanism for applying an elastic force to the membrane 1 covering the recess 2A of the support 2 is housed. For example, as shown in FIG. 2, this elasticity imparting mechanism includes a rectangular pressing member 4 that presses the membrane 1 from the back surface, a hard ball 5 attached to the center of the pressing member 4, and a substantially spherical surface center with the hard ball 5. A rectangular leaf spring 6 that is in point contact with a pair of round bars (hereinafter, referred to as “parallel pins 7”) that are in parallel with each other and that are parallel to each other on the inner sides of the two opposite sides of the leaf spring 6. , And a housing 8 for housing these parallel pins 7, 7 and the leaf spring 6. And
A gap is formed between the pressing member 4 and the storage body 8 so that the both 4 and 8 do not come into contact with each other during the inspection.

The pressing member 4 is made of, for example, the same material as that of the support 2 and has a rectangular shape so as to fit into the recess 2A of the support 2. And
An elastic plate 4A made of, for example, silicon rubber, which is elastic and slippery, is formed on the surface (contact surface with the membrane 1) of the pressing member 4, and the membrane 1 is pressed from the back surface via the elastic plate 4A. is there. A recess 4B is formed in the center of the back surface of the pressing member 4, and the hard ball 5 described above is attached to the recess 4B. The hard spheres 5 are formed of a material having a high hardness, such as ceramics and rubies, which has excellent wear resistance. The leaf spring 6 is formed of a corrosion resistant material such as stainless steel.

FIG. 3 is a perspective view showing the storage body 8, in which the storage body 8 is turned upside down and the surface facing the pressing member 4 is shown as the upper side. As shown in the figure,
On the side of the storage body 8 facing the pressing member 4, the parallel pin 7,
A plurality of grooves 8A into which 7 is fitted are formed in a rack shape. The parallel pins 7 and 7 are housed in the groove portions 8A and 8A of the housing body 8 at symmetrical positions, and the leaf springs 6 are arranged on the groove portions 8A and 8A.

Therefore, as shown in FIG. 1, when the parallel pins 7 and 7 are housed in the groove portions 8A and 8A on the outside of the housing body 8, respectively, the interval for supporting the leaf springs 6 is widened, whereby the leaf springs are supported. The elastic force of 6 is weakened. Further, the parallel pins 7, 7 are provided in the groove portions 8A, 8A inside the storage body 8.
In the case of housing the plate spring 6, the interval for supporting the plate spring 6 is narrowed, so that the elastic force of the plate spring 6 is strengthened. As a result, the elastic force applied to the membrane 1, that is, the contact pressure of the contact bump 1A with respect to the electrode pad P depending on the storage location of the parallel pin 7 with respect to the storage body 8 can be appropriately adjusted and changed.

Further, as shown in FIG. 1, a screw hole 2D is formed in the center of the recess 2A of the support member 4, and the screw hole 2D is formed.
A screw 10 is attached to the. The screw 10 is capable of protruding inwardly from the bottom surface of the recess 2A, and the amount of protrusion of the membrane 1 from the support 2 can be adjusted appropriately by adjusting the degree of protrusion thereof.

Next, the operation of inspecting the semiconductor wafer W using the probe device (not shown) equipped with the probing card of this embodiment will be described. Place a predetermined semiconductor wafer W on the mounting table of the probe device,
The mounting table is moved in the X and Y directions to position the mounting table below the probing card. Further, after the mounting table is rotated in the θ direction to complete the alignment of the semiconductor wafer W with the probing card, the mounting table is raised with respect to the probing card. Then, when the mounting table is overdriven, the semiconductor wafer W contacts the probing card in a state where the pressing member 4 is pushed upward against the spring force of the plate spring 6.

At this time, if the inspection portion of the semiconductor wafer W is parallel to the probing card as shown by the solid line in FIG. 1, even if there is a difference in height between the electrode pads P of the semiconductor wafer W, the elastic plate is formed. The height difference is absorbed by 4A, and the electrode pads P are surely brought into electrical contact with the contact bumps 1A of the probing card to perform an electrical inspection. At this time, even if the pitch between the electrode pads P is as narrow as several tens of μm, the contact bump 1A is not deformed back and forth and left and right unlike the probe needle, so that a stable inspection can be performed.

When the semiconductor wafer W is inclined as shown by the one-dot chain line in FIG. 1, the semiconductor wafer W is
Approaches the contact surface of the horizontal membrane 1 in an inclined state, and the left electrode pad P first starts to contact the contact bump 1A on the left side of the horizontal contact surface of the membrane 1. When the semiconductor wafer W further rises as it is, it tries to push up against the left side of the pressing member 4 via the membrane 1 in the already contacted portion against the spring force of the leaf spring 6. At this time, the pressing member 4 rotates clockwise around the hard sphere 5 due to the force, and tries to make the contact surface of the membrane 1 coincide with the inclination of the semiconductor wafer W. When the pressing member 4 rotates, the pressing member 4 rotates while sliding on the back surface of the membrane 1 via the elastic plate 4A, and the contact surface of the membrane 1 matches the inclination of the semiconductor wafer W. As a result, the contact bumps 1A on the contact surface come into contact with the electrode pads P of the semiconductor wafer W, and the electrical inspection can be reliably performed.

When the contact pressure is adjusted before the semiconductor wafer W is inspected, or when the elasticity of the membrane 1 is changed in accordance with another semiconductor wafer W after the inspection,
By storing the parallel pin 7 in the outer groove portion 8A or the inner groove portion 8A of the storage body 8, the contact pressure can be weakened or strengthened. Further, when adjusting the amount of protrusion of the pressing member 4 according to the probe device, the amount of protrusion can be freely adjusted by the screw 10 attached to the support 2.

As described above, according to this embodiment, the support 2 that supports the peripheral portion of the membrane 1 and has the recess 2A at the center, and the support 1 that is disposed in the recess 2A of the support 2 and has the membrane 1 A pressing member 4 for pressing from the back surface side, a leaf spring 6 that gives the pressing member 4 an elastic force via a hard ball 5 arranged on the central back surface thereof, and a spring force of the leaf spring 6 is stored and stored. In addition, since the holding member 4 is provided so as to face the pressing member 4 and is disposed in the recess 2A, even if the semiconductor wafer W is inclined, the pressing member 4 is centered on the hard ball 5 in accordance with the inclination. Contact bump 1A
Can be reliably contacted with the electrode pad P of the semiconductor wafer W for highly reliable inspection, and the number of parts can be reduced, so that the probing card can be manufactured at low cost.

Further, according to the present embodiment, the housing 8 is provided with the groove portion 8A capable of adjusting the spring force, and the parallel pin 7 is provided to the pair of left and right groove portions 8A, 8A corresponding to the elasticity to be applied to the membrane 1. 7 are housed respectively, and the leaf springs 6 are received by the parallel pins 7 and 7.
The spring force of the leaf spring 6 can be adjusted and the contact pressure of the contact bump 1A can be easily adjusted and changed simply by selecting the storage location.

Furthermore, according to the present embodiment, since the screw hole 2D is provided in the center of the recess 4A of the support 4, and the screw member 9 for pressing the housing 8 from the rear surface is attached to the screw hole 2D, the type of probe device is different. The amount of protrusion of the pressing member 4 can be appropriately adjusted according to the above, and the pressing member 4 can be mounted on various probe devices, and versatility can be enhanced.

The present embodiment is not limited to the above embodiment. The probing card of the present invention, a support that supports the peripheral edge of the membrane member and has a recess in the center,
A pressing member which is arranged in the recess of the support and presses the film member from the back surface side, a leaf spring which gives elasticity to the pressing member via a hard ball which is placed on the central back surface, and the leaf spring. It may be configured so as to store the spring force of 1) and store it, and to include the storage body that is disposed in the recess so as to face the pressing member.

[0027]

According to the first aspect of the present invention, even in a highly integrated circuit having a narrow pitch between the electrode pads of the object to be inspected, the height difference of the electrode pads and the object to be inspected It is possible to provide a membrane-type probing card that has excellent followability with respect to the inclination of, the terminal reliably contacts the corresponding electrode pad, can perform a highly reliable inspection quickly, and has a small number of parts.

According to a second aspect of the present invention, there is provided a membrane type probing card according to the first aspect, wherein the contact pressure of the terminal can be easily adjusted and changed. Is intended.

Furthermore, according to the invention of claim 3 of the present invention, in the invention of claim 1, there is provided a membrane-type probing card which can be mounted on various probe devices and has improved versatility. be able to.

[Brief description of the drawings]

FIG. 1 is an enlarged sectional view showing a main part of a probing card of the present invention.

FIG. 2 is an exploded perspective view showing an elasticity imparting mechanism used in the probing card shown in FIG.

FIG. 3 is a perspective view showing a housing of the probing card shown in FIG.

[Explanation of symbols]

 1 Membrane (Membrane Member) 1A Contact Bump (Terminal) 2 Support 2A Recess 2D Screw Hole 4 Holding Member 5 Hard Ball 6 Leaf Spring 7 Parallel Pin (Round Bar) 8 Housing 8A Groove 10 Screw W Semiconductor Wafer (Inspected) P electrode pad

Claims (3)

[Claims] 1. A film member, the surface of which is provided with a terminal that is in electrical contact with an electrode of an object to be inspected, exchanges an electric signal between the terminal and the electrode to electrically inspect the object to be inspected. In a membrane-type probing card, a support member that supports the peripheral portion of the membrane member and has a recess in the center, and a pressing member that is disposed in the recess of the support member and presses the film member from the back surface side, A leaf spring that gives elasticity to the pressing member via a hard ball arranged on the center back surface,
A probing card, comprising: a storage body that stores the spring force of the plate spring and stores the spring force, and stores the spring force so as to face the pressing member. 2. A film member, the surface of which is provided with a terminal that is in electrical contact with an electrode of an object to be inspected, and an electric signal is exchanged between the terminal and the electrode to electrically inspect the object to be inspected. In a membrane-type probing card, a support member that supports the peripheral portion of the membrane member and has a recess in the center, and a pressing member that is disposed in the recess of the support member and presses the film member from the back surface side, A leaf spring that gives elasticity to the pressing member via a hard ball arranged on the center back surface,
A plurality of strips for accommodating and storing the spring force of the leaf spring and for accommodating the spring force of the leaf spring and for accommodating the pressing member, and for accommodating the spring force in the accommodating body. A probing card characterized in that a groove is provided, a pair of left and right grooves corresponding to the elasticity to be imparted to the film member accommodates round bars respectively, and the leaf springs are received by both round bars. 3. A film member, the surface of which is provided with a terminal that electrically contacts an electrode of the device under test, and an electrical signal is transmitted and received between the terminal and the electrode to electrically test the device under test. In a membrane-type probing card, a support member that supports the peripheral portion of the membrane member and has a recess in the center, and a pressing member that is disposed in the recess of the support member and presses the film member from the back surface side, A leaf spring that gives elasticity to the pressing member via a hard ball arranged on the center back surface,
A storage body which stores the spring force of the plate spring and stores the spring force in the recess facing the pressing member; and a screw hole provided in the center of the recess of the support and the storage A probing card in which a screw member for pressing the body from the back side is attached to the screw hole.