JPH09139560A - Circuit board device and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To attain bumpless connection without necessitating other process and material for bump formation and using other process. SOLUTION: A recessed part 12 is formed in a part of a metal plate 11. A wiring pattern 13 is formed by a plating method. The inside of the recessed part 12 also is plated. A circuit board 14 on which the wiring pattern 13 is formed, prepreg 15, and the metal plate 11 on which the wiring pattern 13 is formed are laminated By a vacuum press method or the like, the wiring pattern 13 is transferred on the prepreg 15, and the wiring pattern 13, the prepreg 15 and the wiring board 14 are unified in a body. By using the wiring pattern 13 transferred from the recessed part 12 of the metal plate, a bump 16 is formed on the prepreg 15. A bare chip 17 is mounted on the bump 16 and electrically connected. The wiring pattern 13 is electrically connected with the wiring board 14 via a through hole 20. Hence the bump for bare chip connection is formed by the manufacturing process of a board, so that other process and other material for bumps are made unnecessary.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board device on which electronic parts are mounted and a method for manufacturing the same.

[0002]

2. Description of the Related Art In recent years, electronic devices have been reduced in size and weight, and accordingly, ICs used in these devices have been mounted in a bare chip mounting method in which a bare chip is directly mounted on a substrate. It is changing. Among them, the flip chip bonding method is considered to be further advanced because it enables higher-density mounting than other wire bonding methods and the TAB method.

FIG. 4 shows an embodiment of a conventional flip chip bonding technique. Reference numeral 41 is a bare chip on which a semiconductor integrated circuit is mounted, and a connection pad 42 and a protective layer 43 are formed on the surface thereof, and bumps 44 such as gold or solder are formed on the connection pad 42 on the bare chip 41. A plating method, a wire bonding method, or the like can be used to form the bumps 42. Then, the bare chip 41 is aligned and mounted on the wiring board 45 using a flip chip bonder or the like to obtain an electrical connection. An anisotropic conductive film, silver paste, solder or the like can be used for connection.

However, when such a method is adopted,
Another process is needed to form the bumps. Further, there is a problem in any of the forming methods. For example, in the plating method, a barrier metal is formed on the pad,
Then to form bumps by plating process,
The process becomes very complicated.

In the wire bonding method,
Since it is difficult to achieve a fine pitch of 100 μm or less and the variation in bump height is about ± 5 μm, flip-chip bonding becomes difficult in a multi-pin IC having 400 pins. Further, it is difficult to form a fine pitch in the formation by screen printing, and since a polymer type conductive paste such as a silver paste is used, the connection resistance after bonding also becomes a problem.

On the other hand, the bumps may be formed on the substrate. In this case, printing of conductive paste or formation by plating may be considered. Even in this case, another process is used for bump formation, and the same problem as above exists.

On the other hand, there is also so-called bumpless connection in which bumps are not formed, but at present, complete bumpless bonding is difficult because the connection pad 42 is recessed from the protective layer 43 of the bare chip. .

FIG. 5 shows an example of bumpless connection. 51
Is a bare chip, on the surface of which a connection pad 52 and a protective layer 53 are formed. Actually, the bonding is performed with the wiring substrate 55 with conductive particles 54 such as solder balls and resin balls plated with gold. ing. In this case, an adhesive or the like is applied to the connection pad portion, and the conductive particles 54 are arranged and fixed only on the pad portion. After all, such a method makes the process complicated.

As described above, in the conventional flip chip bonding, another process or another member is required for forming the bump, and it is becoming difficult to cope with a multi-pin / narrow-pitch IC other than the plating method. Also, the process becomes complicated in bumpless connection.

[0010]

In the conventional flip chip bonding, a separate process or member for forming bumps on a bare chip or a substrate is required, and it is difficult to cope with a fine pitch and a large number of pins other than the plating process. Is. On the other hand, bumpless connection has a drawback that the process becomes complicated.

The present invention provides a circuit board device which does not require a separate process or a separate member for bump formation, and can perform bumpless connection without using a separate process, and a manufacturing method thereof.

[0012]

In order to solve the above problems, according to the present invention, a wiring board, an insulating layer formed on the wiring board, and an insulating layer formed on the insulating layer, at least a part of which is The wiring pattern includes a wiring pattern that is embedded in the insulating layer and has a protrusion partially formed to be electrically connected to the wiring board; and an electronic component electrically connected to the protrusion formed on the wiring pattern. It is characterized by

Further, a first step of forming a wiring pattern on a metal plate partially provided with a recess so that at least a part of the wiring pattern is arranged on the recess, and an insulating layer is laminated on the wiring substrate. A second step, a third step of transferring and fixing the wiring pattern onto the insulating layer, a fourth step of electrically connecting an electronic component onto the wiring pattern, the wiring pattern and the wiring It is characterized by comprising a fifth step of electrically connecting the substrates.

A first step of forming a wiring pattern on a metal plate having a convex portion provided at least on the convex portion, and an electronic component on the wiring pattern. A second step of electrically connecting, a third step of laminating an insulating layer on a wiring board, a fourth step of transferring and fixing the wiring pattern and the electronic component on the insulating layer, It is characterized by comprising a fifth step of electrically connecting the wiring pattern and the wiring board.

Further, a first step of temporarily fixing an electronic component in a recess provided in the metal plate so that the surface of the metal plate and the surface of the electronic component are flush with each other; and the electronic component on the metal plate. A second step of forming a wiring pattern so as to be electrically connected, a third step of laminating an insulating layer on a wiring board, and a transfer and fixing of the wiring pattern and the electronic component on the insulating layer. It is characterized by comprising a fourth step and a fifth step of electrically connecting the wiring pattern and the wiring board.

By the means described above, a separate process or a separate member for forming a bump on a bare chip or a substrate is not necessary, and in bumpless connection, good connection can be obtained without requiring a separate process.

[0017]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 shows a manufacturing process of a circuit board device for explaining an embodiment of the invention. In FIG. 1A, reference numeral 11 is a metal plate for transferring a wiring pattern.
A recess 12 having a degree is formed. This recess may be conical. Subsequently, as shown in FIG. 1B, the wiring pattern 13
Are formed by a plating method. At this time, the concave portion 1 on the metal plate
Plate the inside of 2. According to this plating method, ~ 100
It is possible to form a fine pattern with a pitch of about μm.

Next, as shown in FIG. 1C, a wiring board 14 on which a wiring pattern is formed, a prepreg 15 in which glass fiber is impregnated with an epoxy resin, and a metal plate 11 on which the wiring pattern 13 is formed are laminated. . Then, as shown in FIG. 1 (d), by a vacuum press method or the like, 70 kg / cm2, 17
By applying a load of about 0 ° C. and heating, the wiring pattern 13 is transferred onto the prepreg 15, and the wiring pattern 13, the prepreg 15 and the wiring board 14 are integrated.

As a result, the bump 16 is formed on the prepreg 15 by the wiring pattern 13 transferred from the recess 12 of the metal plate. Resins such as polyester and polyimide can be used for the prepreg 15 in addition to the epoxy resin. The same effect can be obtained by forming a resin such as epoxy or polyimide without using a prepreg in which glass fiber is impregnated with a resin. Further, instead of the metal plate 11, the wiring pattern 13 may be formed on a die for vacuum pressing.

Next, as shown in FIG. 1 (e), the bare chip 17
Are mounted on the bumps 16 and electrically connected. At this time, the connection pad 18 of the bare chip is located at a position recessed from the surface of the protection layer 19 by the protection layer 19 formed on the upper surface of the bare chip, but the diameter of the bump 16 is made smaller than that of the connection pad. That is, by making the diameter of the recess of the metal plate 11 smaller than that of the connection pad, a reliable connection can be obtained. At this time, an anisotropic conductive film, a conductive paste, or the like can be used to connect the bare chip 17 and the bump 16. Besides the bare chip, any electronic component having a connection pad on the surface facing the bump 16 can be mounted.

Finally, as shown in FIG. 1F, a through hole 20 is formed to electrically connect the wiring pattern 13 and the wiring board 14 to complete the process.

In this embodiment, since the bare chip connecting bumps can be formed by the substrate manufacturing process,
No separate process or separate bump material is required.

FIG. 2 is a manufacturing process of a circuit board device for explaining a second embodiment of the present invention.

In FIG. 2A, reference numeral 21 is a metal plate for transferring a wiring pattern, and a convex portion 22 having a diameter of about 100 μm and a height of about 30 μm is formed on a part of the wiring pattern forming portion of the metal plate. This convex portion may have a conical shape.
Subsequently, as shown in FIG. 2B, the wiring pattern 23 is formed by the plating method. At this time, the projection 22 on the metal plate is also plated. As a result, the bumps 24 are formed on the wiring pattern 23. Further, according to this plating method, a fine pattern with a pitch of about 100 μm can be formed.

Next, as shown in FIG. 2C, the bare chip 2
5 is mounted on the wiring pattern 23, and the connection pads 26 of the bare chip 25 and the bumps 24 on the wiring pattern 23 are electrically connected. At this time, the bare chip connection pad 26
Is located at a position recessed from the surface of the protective layer 27 by the protective layer 27 formed on the upper surface of the bare chip, but the diameter of the bump 24 is smaller than that of the connection pad. That is, by making the diameter of the convex portion of the metal plate 21 smaller than that of the connection pad, the connection can be reliably obtained. At this time, an anisotropic conductive film, a conductive paste, or the like can be used to connect the bare chip 25 and the bump 24. Other than the bare chip, any electronic component having a connection pad on the surface facing the bump 24 can be mounted.

Next, as shown in FIG. 2D, a wiring board 28 having a wiring pattern formed thereon, a prepreg 29 made by impregnating glass fiber with an epoxy resin, and a metal plate having a bare chip 25 mounted on the wiring pattern 23. 21 is laminated. A recess or an opening may be provided in the portion of the prepreg 29 where the bare chip is located.

Then, as shown in FIG. 2 (e), the wiring pattern 23 and the bare chip 25 are transferred onto the prepreg 29 by applying a load / heat of about 70 kg / cm 2 and 170 ° C. by a vacuum pressing method or the like. The wiring pattern 23, the bare chip 25, the prepreg 29, and the wiring board 28 are integrated. For the prepreg 29, a resin such as polyester or polyimide can be used in addition to the epoxy resin. The same effect can be obtained by forming a resin such as epoxy or polyimide without using a prepreg in which glass fiber is impregnated with a resin. Further, instead of the metal plate 21, the wiring pattern 23 may be formed on a die for vacuum pressing.

Finally, as shown in FIG. 2 (f), through holes 30 are formed to electrically connect the wiring pattern 23 and the wiring board 28 to complete the process. As a result, the same effect as that of the first embodiment can be obtained.

FIG. 3 shows a manufacturing process of the circuit board device described in the third embodiment of the present invention.

In FIG. 3A, reference numeral 31 is a metal plate for transferring the wiring pattern, and a recess 32 for dropping the bare chip 33 is formed in a part of the metal plate. The outer shape and the depth of this recess are approximately the same size as the bare chip 33. Subsequently, as shown in FIG. 3B, the bare chip 33 is dropped into the recess 32 on the metal plate and temporarily fixed with an adhesive or the like. At this time, the gap formed between the bare chip 33 and the recess 32 is filled with a temporary fixing adhesive, a plating resist, or the like in order to prevent the plating liquid from seeping in and the pattern from breaking.

Next, as shown in FIG. 3C, a wiring pattern 34 is formed by a plating method. Bare chip 3 at this time
The connection pad 35 on the wiring 3 is also plated to electrically connect the wiring pattern 34 and the bare chip 33. The connection pad 35 of the bare chip is located at a position recessed from the surface of the protection layer 36 by the protection layer 36 formed on the upper surface of the bare chip. However, since the wiring pattern 34 is formed by the plating method, the bump is not formed. A bare chip connection pad and an electrical connection can be obtained. Besides the bare chip, any electronic component having a connection pad on the surface facing the bump 16 can be mounted. By this plating method, a fine pattern with a pitch of about 100 μm can be formed.

Next, as shown in FIG. 3D, a wiring board 37 having a wiring pattern formed thereon, a prepreg 38 made by impregnating glass fiber with an epoxy resin, a wiring pattern 34, and a metal plate 31 having a bare chip 33 mounted thereon are mounted. Stack.

Then, as shown in FIG. 3 (e), the wiring pattern 34 and the bare chip 33 are transferred onto the prepreg 38 by applying a load / heating of about 70 kg / cm 2, 170 ° C. by a vacuum pressing method or the like. The bare chip 33, the wiring pattern 34, the prepreg 38, and the wiring board 37 are integrated. Resins such as polyester and polyimide can be used for the prepreg 15 in addition to the epoxy resin. The same effect can be obtained by forming a resin such as epoxy or polyimide without using a prepreg in which glass fiber is impregnated with a resin. Further, instead of the metal plate 11, the wiring pattern 34 may be formed on a die for vacuum pressing.

Finally, as shown in FIG. 3 (f), through holes 39 are formed to electrically connect the wiring pattern 34 and the wiring board 37 to complete the process.

According to this embodiment, since the bare chip mounting can be performed by bumpless according to the manufacturing process of the wiring board, another process or a bump member is not required.

[0036]

As described above, according to the circuit board device and the method of manufacturing the same of the present invention, bare chip mounting can be performed without the need for another member or process for bump formation.

[Brief description of the drawings]

FIG. 1 is a structural cross-sectional view for explaining a manufacturing process of a circuit board device according to an embodiment of the present invention.

FIG. 2 is a structural cross-sectional view for explaining the manufacturing process of the circuit board device according to the second embodiment of the present invention.

FIG. 3 is a structural cross-sectional view for explaining the manufacturing process of the circuit board device according to the third embodiment of the present invention.

FIG. 4 is a structural cross-sectional view of a conventional circuit board device.

FIG. 5 is a sectional view of another structure of the conventional circuit board device.

[Explanation of symbols]

11, 21, 31 ... Metal plate, 12, 32 ... Recessed portion, 13,
23, 34 ... Wiring pattern, 14, 28, 37 ... Wiring board, 15, 29, 38 ... Prepreg, 16, 24 ... Bump, 17, 25, 33 ... Bare chip, 18, 26, 35
... Connection pads, 19, 27, 36 ... Protective layers, 20, 3
0, 39 ... through hole, 22 ... convex portion.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Kureshiba Kuma 8 Shinsugita-cho, Isogo-ku, Yokohama-shi, Kanagawa Prefecture

Claims (8)

[Claims] 1. A wiring board, an insulating layer formed on the wiring board, formed on the insulating layer, at least a part of which is embedded in the insulating layer, and a projection is formed on a part of the insulating layer. A circuit board device comprising: a wiring pattern electrically connected to a wiring board; and an electronic component electrically connected to the protrusion formed on the wiring pattern. 2. The circuit board device according to claim 1, wherein the electronic component is located on an insulating layer. 3. The circuit board device according to claim 1, wherein the electronic component is located in an insulating layer. 4. The circuit board device according to claim 1, wherein the electronic component has an electrode on a surface facing the wiring pattern. 5. A first step of forming a wiring pattern on a metal plate partially provided with a recess so that at least a part of the wiring pattern is disposed on the recess, and an insulating layer is laminated on the wiring board. A second step, and a third step of transferring and fixing the wiring pattern on the insulating layer
And the step of electrically connecting electronic components on the wiring pattern.
And a fifth step of electrically connecting the wiring pattern and the wiring board. 6. A first step of forming a wiring pattern on a metal plate partially provided with a convex portion so that at least a part thereof is arranged on the convex portion, and an electronic component is provided on the wiring pattern. Second to connect electrically
And a third step of stacking an insulating layer on the wiring board, a fourth step of transferring and fixing the wiring pattern and the electronic component on the insulating layer, and the wiring pattern and the wiring board. A method of manufacturing a circuit board device, comprising a fifth step of electrically connecting. 7. The method for manufacturing a circuit board device according to claim 6, wherein an opening or a recess is formed in a part of the insulating layer. 8. A first step of temporarily fixing an electronic component to a recess provided in a metal plate so that the surface of the metal plate and the surface of the electronic component are flush with each other; and the electronic component on the metal plate. A second step of forming a wiring pattern so as to be electrically connected, a third step of laminating an insulating layer on a wiring substrate, and a transfer and fixing of the wiring pattern and the electronic component on the insulating layer. A method of manufacturing a circuit board device, comprising a fourth step and a fifth step of electrically connecting the wiring pattern and the wiring board.