JPH09137297A - Drying method for article to be plated and drying device therefor - Google Patents

Drying method for article to be plated and drying device therefor

Info

Publication number
JPH09137297A
JPH09137297A JP31465095A JP31465095A JPH09137297A JP H09137297 A JPH09137297 A JP H09137297A JP 31465095 A JP31465095 A JP 31465095A JP 31465095 A JP31465095 A JP 31465095A JP H09137297 A JPH09137297 A JP H09137297A
Authority
JP
Japan
Prior art keywords
plated
drying
air
hot air
articles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP31465095A
Other languages
Japanese (ja)
Other versions
JP2951581B2 (en
Inventor
Hiroto Murakami
洋人 村上
Katsumi Oi
克己 大井
Hideki Kumano
秀樹 熊野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AOI DENSHI KK
HAYAMA KOGYO KK
Original Assignee
AOI DENSHI KK
HAYAMA KOGYO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AOI DENSHI KK, HAYAMA KOGYO KK filed Critical AOI DENSHI KK
Priority to JP31465095A priority Critical patent/JP2951581B2/en
Publication of JPH09137297A publication Critical patent/JPH09137297A/en
Application granted granted Critical
Publication of JP2951581B2 publication Critical patent/JP2951581B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To provide a dehydrating and drying device which lower the sticking defect rate of articles to be plated by taking advantage of the effectiveness of a barrel solder plating method by a weakly acidic solder plating liquid. SOLUTION: The articles to be plated are subjected to barrel plating in a weakly acidic solder plating bath and, thereafter, hot air of <=70 deg.C is blown to the articles to be plated to dehydrate and dry the articles to be plated. The hot air pressure dehydrating and drying device 1 for the articles to be plated has a drying chamber 9 which houses the articles to be plated subjected to the barrel plating in the weakly acidic solder plating bath, a hot air passage 6 which blows the hot air into the drying chamber 9, a fan 3, a heater section 5 which warms the air, a cooling pipe 12 which cools and dehumidifies the high-humidity air past the drying chamber 9 and a wind path 4 which feeds the dehumidified air to the heater section 5 side by the fan 3.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、バレルメッキをした被
メッキ物の乾燥方法及びその乾燥装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and apparatus for drying a barrel-plated object to be plated.

【0002】[0002]

【従来の技術】電子部品、例えばチップ抵抗器の端子電
極に半田メッキを施す半田メッキ法として、バレルメッ
キ法が知られている。このバレルメッキ法は、プラスチ
ック等の電気絶縁物からなる多孔状のバレル内に電子部
品などの被メッキ物を収納し、陰極タンギュラーを挿入
して、このバレルをメッキ槽に浸して振動回転させるこ
とによりメッキを行う。この際、被メッキ物間の通電を
均一にするために、鉄玉からなるダミーを被メッキ物に
適当量混入する。
2. Description of the Related Art Barrel plating is known as a solder plating method for applying solder plating to the terminal electrodes of electronic parts such as chip resistors. In this barrel plating method, an object to be plated such as electronic parts is stored in a porous barrel made of an electrical insulator such as plastic, a cathode tangular is inserted, and this barrel is immersed in a plating tank and vibrated and rotated. Plating. At this time, an appropriate amount of a dummy made of iron balls is mixed into the object to be plated in order to make the current flow between the objects to be plated uniform.

【0003】そして、前記バレルメッキ法に使用する半
田メッキ液として二価錫イオン、二価鉛イオン、遊離
酸、光沢剤を成分とするPH1以下の強酸性半田メッキ
液を使用し、被メッキ物に脱脂、酸洗いなどの前処理を
施した後、ニッケルメッキ、強酸性半田メッキの各工程
を経てバレルメッキを行い、遠心脱水乾燥装置よる脱水
及び乾燥を行っていた。
As the solder plating solution used in the barrel plating method, a strongly acidic solder plating solution having a pH of 1 or less containing divalent tin ions, divalent lead ions, free acid, and a brightener is used, and an object to be plated is used. After pretreatment such as degreasing and pickling, barrel plating was performed through each step of nickel plating and strongly acidic solder plating, and dehydration and drying were performed by a centrifugal dehydration drying device.

【0004】前記遠心脱水乾燥装置による脱水乾燥方法
は、前記バレルメッキ法による被メッキ物及びダミーの
入った脱水籠を遠心脱水乾燥装置のバスケットにセット
して回転させ、その遠心力で液体を切り、前記脱水と同
時に脱水籠へ熱風(温度100〜150℃)を吹き付け
て乾燥(乾燥時間約20分)を行うものである。
In the dehydration drying method using the centrifugal dehydration drying apparatus, the dehydration basket containing the object to be plated by the barrel plating method and the dummy is set in the basket of the centrifugal dehydration drying apparatus and rotated, and the liquid is cut by the centrifugal force. At the same time as the dehydration, hot air (temperature of 100 to 150 ° C.) is blown onto the dehydration basket to perform drying (drying time of about 20 minutes).

【0005】ところで、前記強酸性半田メッキ液をバレ
ルメッキ法に使用すると、メッキ時の金属析出構造の要
因で被メッキ物どうしのくっつきが多数発生していた。
By the way, when the above strongly acidic solder plating solution is used in the barrel plating method, a large number of objects to be plated are stuck to each other due to the metal deposition structure during plating.

【0006】しかも、前記遠心脱水乾燥装置にて脱水及
び乾燥を行った被メッキ物は、メッキ工程で発生した被
メッキ物どうしのくっつきを遠心力、温度、時間によっ
て、より強固なものにし、後工程でくっつき品の選別処
理を行なわざるを得ず、選別作業工程を設けるというロ
スが発生していた。
Further, the objects to be plated that have been dehydrated and dried by the centrifugal dewatering / drying device make the sticking between the objects to be plated generated in the plating process stronger by centrifugal force, temperature and time. There was no choice but to perform a sorting process for sticking products in the process, and there was a loss of providing a sorting work process.

【0007】[0007]

【発明が解決しようとする課題】本発明は、前記問題点
に鑑み、くっつき不良の発生を低減し、弱酸性半田メッ
キ液によるバレル半田メッキ法の有効性を生かした被メ
ッキ物の乾燥方法及び乾燥装置を提案するものである。
In view of the above problems, the present invention reduces the occurrence of sticking defects and utilizes the effectiveness of the barrel solder plating method with a weakly acidic solder plating solution, and a method for drying an object to be plated. It proposes a dryer.

【0008】[0008]

【課題を解決するための手段】本発明の被メッキ物の乾
燥方法は、被メッキ物を弱酸性半田メッキ浴でバレルメ
ッキした後、前記被メッキ物に温風を吹き込んで乾燥さ
せることを特徴とする。本発明の被メッキ物の乾燥装置
は、弱酸性半田メッキ浴でバレルメッキされた被メッキ
物を収容する乾燥室と、該乾燥室に温風を吹き込む温風
通路と、ファンと、空気を暖めるヒータと、前記乾燥室
を通過した高湿度の空気を冷却して除湿する除湿手段
と、該除湿手段にて除湿された空気を前記ファンにて前
記ヒータ部側へ送り込む通風路とを備えることを特徴と
する。
The method of drying an object to be plated according to the present invention is characterized in that the object to be plated is barrel-plated in a weakly acidic solder plating bath, and then hot air is blown into the object to be dried. And The apparatus for drying an object to be plated of the present invention includes a drying chamber for accommodating an object to be plated that has been barrel-plated with a weakly acidic solder plating bath, a hot air passage for blowing hot air into the drying chamber, a fan, and warming air. A heater, a dehumidifying unit that cools and dehumidifies the high-humidity air that has passed through the drying chamber, and an air passage that sends air dehumidified by the dehumidifying unit to the heater unit side by the fan. Characterize.

【0009】[0009]

【実施例】本発明において、まず前記くっつきの不良数
を低減するために、バレルメッキに用いる半田メッキ液
として弱酸性(PH3〜5)の半田メッキ液を使用し、
被メッキ物、例えばチップ抵抗器どうしのくっつきが発
生しにくい金属析出状態のメッキ被膜を得る。前記弱酸
性のバレルメッキ液の一般的な半田メッキ液としては、
二価錫化合物、二価鉛化合物、キレート剤、電導塩で構
成されたメッキ液を使用する。
EXAMPLES In the present invention, first, in order to reduce the number of sticking defects, a weakly acidic (PH 3 to 5) solder plating solution is used as the solder plating solution used for barrel plating.
An object to be plated, for example, a plating film in a metal deposition state in which sticking of chip resistors is unlikely to occur is obtained. As a general solder plating liquid of the weakly acidic barrel plating liquid,
A plating solution composed of a divalent tin compound, a divalent lead compound, a chelating agent, and a conductive salt is used.

【0010】そして、前記弱酸性の半田メッキ液を使用
してバレルメッキ処理を被メッキ物に施した結果、メッ
キ処理の段階で前記くっつきの低減を図ることができ
た。
As a result of subjecting the object to be plated to barrel plating using the weakly acidic solder plating solution, it was possible to reduce the sticking at the stage of plating.

【0011】ところで、前記弱酸性の半田メッキ液を使
用してメッキ処理の段階でくっつきを低減できても、従
来のように前記遠心脱水乾燥装置で脱水乾燥を行うと、
半田メッキ工程で発生した被メッキ物どうしのくっつき
を遠心力、温度、時間によって、より強固なものにして
しまう。そこで、本発明においては以下のような乾燥方
法、乾燥装置を採用して、くっついた被メッキ物どうし
のくっつき度合いの進行を止め且つ半田メッキの劣化を
生じにくくさせるものである。
By the way, even if it is possible to reduce sticking at the stage of the plating process by using the weakly acidic solder plating solution, if the centrifugal dehydration drying apparatus is used for dehydration drying as in the conventional case,
The adhesion between the objects to be plated generated in the solder plating process is made stronger by centrifugal force, temperature and time. Therefore, in the present invention, the following drying method and drying apparatus are adopted to stop the progress of the degree of sticking of the adhered objects to be plated and prevent the solder plating from deteriorating.

【0012】図1は、本発明の温風圧脱水乾燥装置1の
実施例を示している。図1において、2は筐体であっ
て、該筐体2内にはリングブロア等のファン3が設けら
れており、該ファン3により暖められた空気を循環して
乾燥を行う。
FIG. 1 shows an embodiment of a hot air pressure dewatering / drying apparatus 1 of the present invention. In FIG. 1, reference numeral 2 denotes a housing, and a fan 3 such as a ring blower is provided in the housing 2, and air warmed by the fan 3 is circulated for drying.

【0013】前記ファン3から送られた空気は、通風路
4を通過してヒータ部5(3kW)にて暖められ、該暖
められた空気は通風路6を通過して温風吹出口7から、
被メッキ物8を乾燥する乾燥室9へ吹き出される。そし
て、前記乾燥室9内の温度を70℃以下、好適には約6
7℃前後になるように調節する。温度を70℃以下に設
定したのは、該温度よりも高いとメッキ表面が変化し、
くっつき度合いが増加する傾向にあるためである。
The air sent from the fan 3 passes through the ventilation passage 4 and is warmed by the heater portion 5 (3 kW). The warmed air passes through the ventilation passage 6 and from the warm air outlet 7.
The object 8 to be plated is blown out to a drying chamber 9 for drying. The temperature inside the drying chamber 9 is 70 ° C. or lower, preferably about 6 ° C.
Adjust so that the temperature is around 7 ° C. The temperature is set below 70 ° C because the plating surface changes if the temperature is higher than
This is because the degree of sticking tends to increase.

【0014】前記乾燥室9に流入した空気は、底に通風
口10を設けた乾燥籠11の中に入っている被メッキ物
8の隙間を全量通過する。この時に被メッキ物8に付着
している水分を被メッキ物8の間から押し出したり、空
気中に採り込んだりしながら高湿度の空気となり、被メ
ッキ物8間及び乾燥籠11から抜け出る。
The entire amount of the air flowing into the drying chamber 9 passes through the gap of the object 8 to be plated contained in the drying basket 11 having the ventilation port 10 at the bottom. At this time, moisture adhering to the object to be plated 8 is pushed out from between the objects to be plated 8 or taken into the air to become high-humidity air, and escapes between the objects to be plated 8 and the drying basket 11.

【0015】前記乾燥籠11から抜け出た高湿度の空気
は、15℃〜17℃の冷水が10リットル/分循環する
冷却管12を備えた冷却室13を通過し、この通過する
時に除湿された乾燥空気と水滴に分離される。そして乾
燥した空気は前記ファン3及び通風路4を経て前記ヒー
タ部5側へ戻されて再循環し、一方、前記水滴は脱水ド
レン口14から排出される。そしてこの循環を約7分間
繰り返すことで脱水籠11の中の被メッキ物8を脱水及
び乾燥する。
The high-humidity air that has escaped from the drying basket 11 passes through a cooling chamber 13 provided with a cooling pipe 12 in which cold water at 15 ° C. to 17 ° C. circulates at 10 liters / minute and is dehumidified when passing through this. Separates into dry air and water droplets. Then, the dried air is returned to the heater section 5 side through the fan 3 and the ventilation passage 4 and recirculated, while the water droplets are discharged from the dehydration drain port 14. By repeating this circulation for about 7 minutes, the object 8 to be plated in the dehydration basket 11 is dehydrated and dried.

【0016】[0016]

【発明の効果】本発明によれば、乾燥温度が低く乾燥時
間が短く且つ従来のように被メッキ物への遠心力がかか
らないため、くっついた被メッキ物どうしのくっつき度
合いの進行を止め且つ半田メッキの劣化を生じにくくさ
せる。合わせてバレルメッキ浴に弱酸性半田メッキ浴を
併用するようにしたから、その相乗効果により被メッキ
物どうしのくっつき分離前のくっつき不良率を大幅に低
減できる。実際のくっつき分離前のくっつき不良率は、
従来の強酸性半田メッキ浴及び遠心脱水乾燥装置を使用
した時に発生する不良率15.0%から本発明による不
良率0.02%へと大幅に不良率を低減することができ
た。
According to the present invention, since the drying temperature is low, the drying time is short, and the centrifugal force is not applied to the objects to be plated as in the conventional case, the progress of the degree of sticking of the objects to be adhered to each other can be prevented and the soldering Prevents deterioration of plating. Since a weak acid solder plating bath is also used in combination with the barrel plating bath, the synergistic effect can significantly reduce the sticking failure rate before the sticking and separation of the objects to be plated. The actual sticking failure rate before sticking separation is
It was possible to significantly reduce the defective rate from the defective rate of 15.0% generated when using the conventional strongly acidic solder plating bath and the centrifugal dehydration drying apparatus to the defective rate of 0.02% according to the present invention.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の温風圧脱水乾燥装置の説明図である。FIG. 1 is an explanatory view of a warm air pressure dehydration / drying apparatus of the present invention.

【符号の説明】[Explanation of symbols]

3 ファン 5 ヒータ部 8 被メッキ物 9 乾燥室 12 冷却管 13 冷却室 3 Fan 5 Heater part 8 Plated object 9 Drying room 12 Cooling tube 13 Cooling room

───────────────────────────────────────────────────── フロントページの続き (72)発明者 熊野 秀樹 香川県高松市朝日町三丁目3番5号 ハヤ マ工業株式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Hideki Kumano 3-5-3 Asahi-cho, Takamatsu-shi, Kagawa Hayama Industry Co., Ltd.

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 被メッキ物を弱酸性半田メッキ浴でバレ
ルメッキした後、前記被メッキ物に温風を吹き込んで乾
燥させることを特徴とする被メッキ物の乾燥方法。
1. A method of drying an object to be plated, which comprises barrel-plating the object to be plated with a weakly acidic solder plating bath and then blowing hot air onto the object to be dried.
【請求項2】 請求項1の被メッキ物の乾燥方法におい
て、温風の温度は70℃以下であることを特徴とする被
メッキ物の乾燥方法。
2. The method for drying an object to be plated according to claim 1, wherein the temperature of the hot air is 70 ° C. or lower.
【請求項3】 請求項1の被メッキ物の乾燥方法におい
て、被メッキ物への温風の吹き込みによって発生した高
湿度の空気を冷却して除湿し、除湿された空気を温風に
変えて再び被メッキ物に吹き込み、空気を循環させるこ
とを特徴とする被メッキ物の乾燥方法。
3. The method for drying an object to be plated according to claim 1, wherein high-humidity air generated by blowing hot air into the object to be plated is cooled to dehumidify, and the dehumidified air is changed to warm air. A method for drying an object to be plated, which comprises blowing air again into the object to be plated and circulating air.
【請求項4】 弱酸性半田メッキ浴でバレルメッキされ
た被メッキ物を収容する乾燥室と、 該乾燥室に温風を吹き込む温風通路と、ファンと、空気
を暖めるヒータ部と、前記乾燥室を通過した高湿度の空
気を冷却して除湿する除湿手段と、 該除湿手段にて除湿された空気を前記ファンにて前記ヒ
ータ部側へ送り込む通風路とを備えることを特徴とする
被メッキ物の温風圧脱水乾燥装置。
4. A drying chamber for containing an object to be plated that has been barrel-plated with a weakly acidic solder plating bath, a hot air passage for blowing hot air into the drying chamber, a fan, a heater section for warming air, and the drying. Dehumidifying means for cooling and dehumidifying high-humidity air that has passed through the chamber, and an air passage for sending the air dehumidified by the dehumidifying means to the heater section side by the fan, to be plated Warm air pressure dehydration drying equipment.
JP31465095A 1995-11-08 1995-11-08 Equipment for drying plating objects Expired - Fee Related JP2951581B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP31465095A JP2951581B2 (en) 1995-11-08 1995-11-08 Equipment for drying plating objects

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP31465095A JP2951581B2 (en) 1995-11-08 1995-11-08 Equipment for drying plating objects

Publications (2)

Publication Number Publication Date
JPH09137297A true JPH09137297A (en) 1997-05-27
JP2951581B2 JP2951581B2 (en) 1999-09-20

Family

ID=18055888

Family Applications (1)

Application Number Title Priority Date Filing Date
JP31465095A Expired - Fee Related JP2951581B2 (en) 1995-11-08 1995-11-08 Equipment for drying plating objects

Country Status (1)

Country Link
JP (1) JP2951581B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022116454A1 (en) * 2020-12-04 2022-06-09 惠州市特创电子科技股份有限公司 Method for reducing discharge of gantry line tank liquid in circuit board electroplating

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022116454A1 (en) * 2020-12-04 2022-06-09 惠州市特创电子科技股份有限公司 Method for reducing discharge of gantry line tank liquid in circuit board electroplating

Also Published As

Publication number Publication date
JP2951581B2 (en) 1999-09-20

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