WO2022116454A1

WO2022116454A1 - Method for reducing discharge of gantry line tank liquid in circuit board electroplating

Info

Publication number: WO2022116454A1
Application number: PCT/CN2021/084939
Authority: WO
Inventors: 许校彬; 李宝任; 陈金星
Original assignee: 惠州市特创电子科技股份有限公司
Priority date: 2020-12-04
Filing date: 2021-04-01
Publication date: 2022-06-09
Also published as: CN112680759B; CN112680759A

Abstract

Provided in the present application is a method for reducing the discharge of a gantry line tank liquid in circuit board electroplating, comprising the steps: placing a circuit board into a medicine liquid tank to perform an immersion electroplating operation; suspending the circuit board from the medicine liquid tank, and adjusting the distance between the circuit board and the liquid level of the medicine liquid tank to a preset liquid return distance; blowing cold air to the circuit board so as to blow off residual tank liquid adhered to the circuit board, so that the residual tank liquid flows back into the medicine liquid tank; performing a lifting operation on the circuit board, and adjusting the distance between the circuit board and the liquid level of the medicine liquid tank to a preset drying distance, the preset drying distance being larger than the preset liquid return distance; and blowing hot air to the circuit board so as to dry the circuit board. By means of an air flow-assisted blowing method of blowing cold air first and then hot air, tank liquid adhered to the circuit board can be removed more cleanly, and the volatilization degree of the tank liquid can be reduced, better reducing the content of harmful substances in the air in an electroplating operation area.

Description

Method for reducing carry-out of gantry line bath fluid in circuit board electroplating

technical field

The invention relates to the technical field of printed circuit board manufacturing, in particular to a method for reducing carry-out of gantry line tank liquid in circuit board electroplating.

Background technique

The linear gantry electroplating production line uses a gantry crane to hoist electroplating parts, PLC automatic control, and accurate operation; it can be equipped with a high-precision filter to ensure the high quality of the coating. The characteristic of the linear gantry electroplating production line is that the gantry crane is used to lift the electroplating hanger. Various grooves for electroplating are arranged in parallel in a straight line or multiple straight lines, the crane moves in a straight line along the track, and one or two pairs of lifting hooks on the crane are used to lift and transport, so that the automatic line can complete the processing tasks according to the required procedures. The gantry crane has good rigidity, heavy lifting and stable operation. It is suitable for lifting workpieces in plating tanks of various sizes. For automatic lines with large plating tank lengths, this type of car body structure can be used. The running track is installed on both sides of the tank body, which has the advantages of slowing down the corrosion of the track and running and convenient inspection of electrical sensing faults; using the automatic line of large plating tank high-precision computer control, with automatic memory and storage of production process parameters, for quality inspection Advanced functions of traceability; can be equipped with vibration and swing; air stirring; PLC automatic control, accurate operation; can be equipped with high-precision filter to ensure high quality of coating; can also be equipped with high-quality rectifier to ensure the stability of electroplating.

Many processes in the circuit board industry have linear gantry lines, especially for immersion gold, immersion copper, copper plating and other processes. When one potion tank is lifted to another tank, no matter how long it stays after lifting, the tank liquid will still be taken out. Many manufacturers design the gantry crane to shake regularly when lifting to reduce the amount of tank liquid brought out. The short shaking time cannot drain the circuit board and the sub-basket well. If the shaking time is changed, the residence time of each slot will be prolonged and the efficiency will be reduced.

SUMMARY OF THE INVENTION

The purpose of the present invention is to overcome the deficiencies in the prior art, and to provide a circuit board that can make the tank liquid adhered to the circuit board be removed more cleanly when the circuit board is transported between adjacent chemical liquid tanks, and can reduce the The volatilization degree of the bath liquid can better reduce the content of harmful substances in the air of the electroplating operation area.

The purpose of this invention is to realize through the following technical solutions:

A method for reducing carry-out of gantry line tank liquid in circuit board electroplating, comprising the following steps:

Put the circuit board into the liquid medicine tank for immersion electroplating operation;

Lifting the circuit board away from the liquid medicine tank, and adjusting the distance between the circuit board and the liquid level of the liquid medicine tank to be a preset liquid return distance;

Blow out cold air to the circuit board to blow away the residual tank liquid adhering to the circuit board, so that the residual tank liquid is returned to the liquid medicine tank;

The circuit board is lifted, and the distance between the circuit board and the liquid level of the pharmaceutical tank is adjusted to be a preset drying distance, and the preset drying distance is greater than the preset liquid return distance;

Hot air is blown toward the circuit board to dry the circuit board.

In one embodiment, the temperature of the cold air is 10 degrees Celsius to 15 degrees Celsius.

In one embodiment, the temperature of the hot air is 30 degrees Celsius to 60 degrees Celsius.

In one embodiment, the operation of blowing cold air to the circuit board to blow off the residual bath liquid adhering to the circuit board specifically includes the following steps:

Separate a plurality of circuit boards in advance, so that there is a gap between every two adjacent circuit boards;

The cold air is converted into turbulent cold air, and the turbulent cold air is blown out to a plurality of the circuit boards, so as to carry out the operation of blowing off the residual bath liquid adhering to the plurality of the circuit boards.

In one embodiment, the preset liquid return distance is 0.1 to 2 meters.

In one embodiment, the preset drying distance is 2.5 meters to 5 meters.

In one embodiment, the duration of blowing cold air to the circuit board is 15 seconds to 100 seconds.

In one embodiment, the duration of blowing hot air to the circuit board is 5 seconds to 10 seconds.

The above-mentioned method for reducing the carry-out of the gantry line tank liquid in the electroplating of the circuit board, through the air-assisted blowing method of blowing cold air first and then blowing hot air, can make the circuit board transfer between adjacent liquid medicine tanks. The attached bath solution is removed more cleanly, and the volatilization degree of the bath solution can be reduced, and the content of harmful substances in the air of the electroplating operation area can be better reduced.

Description of drawings

In order to illustrate the technical solutions of the embodiments of the present invention more clearly, the following briefly introduces the accompanying drawings used in the embodiments. It should be understood that the following drawings only show some embodiments of the present invention, and therefore do not It should be regarded as a limitation of the scope, and for those of ordinary skill in the art, other related drawings can also be obtained according to these drawings without any creative effort.

1 is a schematic structural diagram of a gantry wire for circuit board electroplating in one embodiment;

2 is a schematic structural diagram of an air blade in an embodiment;

FIG. 3 is a flow chart of steps of a method for reducing carry-out of gantry line bath fluid in circuit board electroplating in one embodiment.

Detailed ways

In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the related drawings. The preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention may be embodied in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that a thorough and complete understanding of the present disclosure is provided.

It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for the purpose of illustration only and do not represent the only embodiment.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Please refer to FIG. 1 , which is a schematic structural diagram of a gantry wire 10 for circuit board electroplating in an embodiment. The gantry wire 10 for circuit board electroplating includes: a liquid medicine tank 100 , a gantry frame 200 , a hanging basket assembly 300 and an air knife spoiler assembly 400, the liquid medicine tank 100 is used to perform electroplating operation on the circuit board. Specifically, there are multiple liquid medicine tanks, including a copper sinking liquid medicine tank, a micro-etching liquid medicine tank, and a water washing liquid medicine tank, and the like. The gantry frame 200 spans the entire gantry line structure and is located directly above the plurality of said liquid medicine tanks. The hanging basket assembly 300 and the air knife spoiler assembly 400 are respectively installed on the gantry frame 200. The gantry frame 200 is used for hanging the hanging basket The assembly 300, the air knife spoiler assembly 400, and the plurality of circuit boards placed on the gondola assembly 300 pass through each of the chemical liquid tanks in sequence, so that the plurality of circuit boards placed on the gondola assembly 300 are sequentially immersed into each place. in the chemical bath to complete the entire electroplating process. When the gondola assembly 300 is lifted from the liquid medicine tank 100 by the gantry 200 , the air knife spoiler assembly 400 blows out a spoiler airflow to the plurality of circuit boards placed on the gondola assembly 300 and blows it towards each circuit board On the one hand, by blowing air flow to the surface of the circuit board, the backflow of the tank liquid remaining on the surface of the circuit board can be accelerated to drop into the liquid medicine tank; It has the characteristics of disordered airflow such as complicated internal flow direction and uneven wind speed, which can make a plurality of the circuit boards on the hanging basket assembly 300 not shake in the case of the crane, that is, the gantry frame 200, resulting in a certain degree of shaking. In this way, combined with the airflow Blowing and shaking the liquid can more effectively blow off the residual adhering bath liquid on the surface of the circuit board.

Please refer to FIG. 1 , the liquid medicine tank 100 is used for electroplating operation on the circuit board. Specifically, the liquid medicine tank is multiple, and specifically includes a copper sinking liquid medicine tank, a micro-etching liquid medicine tank, and a water washing liquid medicine tank, etc., Of course, in the entire electroplating production line, the number of copper sinking liquid tanks, the number of micro-etching liquid tanks and the number of washing liquid tanks, as well as the sorting of different liquid tanks, can be flexibly selected and set according to the actual situation. .

Referring to FIG. 1 , the gantry 200 includes a support frame 210 and a suspension member 220 . The suspension member 220 is installed on the support frame 210 , and the suspension member 220 is used to drive the gondola assembly 300 to move, so as to make the suspension member 220 move. The hanging basket assembly 300 can perform immersion and lifting operations in each of the chemical liquid tanks, so as to realize the entire electroplating process of the circuit board.

In one embodiment, the support frame is provided with a slide rail assembly, and the suspension member is slidably disposed on the slide rail assembly, so that the gondola assembly 300 can pass through in sequence more smoothly and flexibly each of the chemical liquid tanks.

Referring to FIG. 1 , the hanging basket assembly 300 includes a mother basket hanger 310 and a plurality of carrier sub-baskets 320 , the mother basket hanger 310 is disposed on the suspension member 220 , and the suspension member 220 is used to drive all the sub-baskets 320 . The mother basket hanger 310 moves toward or away from the liquid medicine tank 100 , and the carrier sub-baskets 320 are respectively placed on the mother basket hanger 310 , and the carrier sub-baskets 320 are used to hold circuit boards. In this way, when the suspension member 220 drives the mother basket hanger 310 to perform an ascending or descending operation, each circuit board placed on the carrier sub-basket 320 can be immersed in and lifted from the liquid medicine tank. operate.

Please refer to FIG. 1 , the air-knife spoiler assembly 400 includes an air-knife plate 410 , a blowing duct 420 , a beam shaft 430 and a plurality of spoiler blades 440 , the air-knife plate 410 is mounted on the suspension member 220 , Please also refer to FIG. 2 , an air cavity 411 is formed in the air knife plate 410 , an air inlet 412 is formed on the air knife plate 410 , and the air inlet 412 is respectively connected with the air cavity 411 and the blower. The pipe 420 is connected, and the air knife plate 410 is also provided with a long blowing groove 413, and the long blowing groove 413 is communicated with the air cavity 411. Specifically, the blowing pipe 420 is used to connect the blowing equipment. The air device is used to blow air into the air blowing pipe 420 , and the air blowing pipe 420 blows air into the air cavity 411 in the air knife plate 410 through the air inlet 412 and enters the air cavity 411 The inner high-pressure airflow will be blown out through the long blowing groove 413 that communicates with the air cavity 411. The length directions of the long blast grooves 413 are consistent, so that the air flow through the long blast grooves 413 is more powerful and uniform. This is because the long blast grooves 413 have relatively narrow and long tuyere, and the treatment of the air flow is more reasonable. , in this way, the tank liquid adhering to the surface of the circuit board can be blown off more effectively.

Please refer to FIG. 1 , the beam shaft 430 is installed on the mother basket hanger 310 , each of the spoiler blades 440 is sequentially rotated and arranged on the beam shaft 430 , and the long blowing groove 413 is used for The bulged airflow is blown toward the beam shaft to drive each of the spoiler blades 440 to rotate, thereby forming a spoiler airflow that blows toward each of the carrier sub-baskets. When the air flow passes through each of the spoiler blades 440, each of the spoiler blades 440 will rotate relative to the beam shaft 430, so that the straight-line direction of the bulged air long groove 413 can be made. The airflow treatment is transformed into a turbulent airflow. Compared with the airflow with a straight flow direction, the turbulent airflow has the characteristics of a disordered airflow such as complex internal flow direction and uneven wind speed, which can make a plurality of the circuit boards on the gondola assembly 300 be placed on the crane. That is, when the gantry 200 does not shake, a certain degree of shaking occurs. In this way, the combination of airflow blowing and shaking can effectively blow off the residual adhering bath liquid on the surface of the circuit board.

It should be noted that, since each of the spoiler blades 440 is sequentially rotated and arranged on the beam shaft 430, in order to ensure that each of the spoiler blades 440 rotates, every two adjacent spoilers The blades 440 will not collide with each other and affect the rotation. In one embodiment, the wind knife spoiler assembly includes a plurality of blocking sleeves, and each of the blocking sleeves is used to be fixed and sleeved on the beam shaft, respectively. And each of the blocking sleeves is correspondingly located between two adjacent spoiler blades, thus, by arranging the blocking jackets, the two adjacent spoiler blades will be isolated by the blocking jackets, In order to ensure that when each of the spoiler blades 440 rotates, there will be no problems such as collision between each adjacent two spoiler blades 440 that affect the rotation, thereby generating a more stable spoiler airflow. Further, the spoiler fan blade includes a rotating sleeve and a plurality of twisted blades, the rotating sleeve is rotatably sleeved outside the beam shaft, and each of the twisted blades is radially fixed on the rotating sleeve, so, Can generate more stable turbulent airflow.

In order to cooperate with the turbulent airflow to further enhance the shaking degree of the circuit board, to improve the efficiency of blowing off the tank liquid adhering to the surface of the circuit board, and to better protect the circuit board, in one embodiment, the carrier sub-basket It includes a hollowed-out basket body and a plurality of blocking members, each of the blocking members is arranged on the hollowed-out basket body at intervals, and a circuit board placement area is correspondingly formed between each adjacent two of the blocking members, so that the circuit board can be The circuit board placement area has a more relaxed shaking space, and the turbulent airflow can improve the shaking degree of the circuit board. One corresponding to each of the accommodating partitions, so that more circuit boards can be placed in a unit space, and at the same time, the operation of removing the residual tank liquid of the circuit boards will not be affected; further, the blocking member includes a support The inner core and the covering soft sleeve, the supporting inner core is fixedly arranged on the hollow basket body, the covering soft sleeve is covering the outside of the supporting inner core, when the circuit board shakes and is soft with the covering. When the casing is in contact, the soft covering can better protect the circuit board. In this way, it can cooperate with the turbulent airflow to further enhance the shaking degree of the circuit board, so as to improve the efficiency of blowing off the tank liquid adhering to the surface of the circuit board. At the same time, it can better protect the circuit board.

In one embodiment, the mother basket hanger includes a mother basket frame and at least two tie rods, one end of each of the rails is respectively fixed to the mother basket frame, and the other end of each of the rails is respectively connected to the In this way, the blocking of the mother basket hanger to the turbulent airflow can be further reduced, so that the turbulent airflow can better act on the residual tank liquid on the circuit board and eliminate the residual tank liquid. Effect.

In one embodiment, the air knife spoiler assembly further includes a linear air outlet knife, the linear air outlet knife is mounted on the suspension member, and the linear air outlet knife is provided with an air outlet length. The air flow from the long air outlet slot is used to be placed away from the beam axis. It can be understood that due to the turbulent airflow blowing, the residual tank liquid on the circuit board will be blown relatively dispersed. By setting the linear wind direction The air knife can quickly blow the droplets sputtered to the outer periphery into the liquid medicine tank.

In order to suppress the degree of volatilization of the residual bath liquid, to better reduce the content of harmful substances in the air of the electroplating operation area, and to rapidly dry the circuit board, in one embodiment, the gantry wire for circuit board electroplating further comprises: A cooler, a first blowing device, a heater and a second blowing device, there are two blowing pipes, and the two blowing pipes specifically include a cold air blowing pipe and a hot air blowing pipe, and the air knife There are two air inlets on the board, and the two air inlets specifically include a cold air inlet and a hot air inlet, the first blowing device is communicated with the cooler, and the cold air blowing pipes are respectively connected to the The cooler and the cold air inlet are communicated, and the first blowing device is used to blow fresh air into the cold zone, and after the fresh air is cooled by the cold zone, it passes through the cold air blast pipe And the cold air inlet enters into the air cavity of the air knife plate, and finally blows out the turbulent cold air through the long blasting groove. For example, the temperature of the turbulent cold air is 10 degrees Celsius to 15 degrees Celsius, In this way, the turbulent cold air with lower temperature can restrain the volatilization degree of the residual bath liquid, and can better reduce the content of harmful substances in the air of the electroplating operation area. It can be understood that when the residual bath liquid on the circuit board is removed to a certain extent by using the turbulent cold air, that is, when the residual bath liquid on the circuit board is less, for example, the time for blowing the turbulent cold air to the circuit board is: After 15 seconds to 100 seconds, the cold air blowing duct is closed; the second blowing device is communicated with the heater, the hot air blowing duct is respectively communicated with the heater and the hot air inlet, and the first air blower is connected to the heater and the hot air inlet. The second blowing device is used to blow fresh air into the heater. After the fresh air is cooled by the heater, it enters the In the air cavity, the turbulent hot air is finally blown out through the long blasting groove. It should be noted that the cold air blasting pipe needs to be closed before the hot air is blown in, because the residual tank liquid on the circuit board has remained at this time. There are very few. At this time, the turbulent hot air is blown in, which can quickly dry the circuit board, and the content of harmful substances in the air in the electroplating operation area is less. , but the cold air and hot air will not act on the circuit board at the same time.

This case also provides a circuit board electroplating method, which is carried out by using the gantry wire for circuit board electroplating as described in any of the above. On the other hand, compared with the straight-line airflow, the turbulent airflow has the characteristics of complicated airflow inside the airflow and uneven airflow, which can make the hanging basket assembly The above-mentioned circuit boards will shake to a certain extent when the crane, that is, the gantry frame, does not shake. In this way, combined with the turbulent airflow blowing and shaking liquid rejection, the residual adhesive tank liquid on the surface of the circuit board can be blown off more effectively. .

Compared with the prior art, the above-mentioned gantry wire for circuit board electroplating has at least the following advantages:

The above-mentioned gantry line 10 for circuit board electroplating is provided with a liquid medicine tank 100, a gantry frame 200, a hanging basket assembly 300 and an air knife spoiler assembly 400. When the hanging basket assembly 300 is lifted from the liquid medicine liquid tank 100 by the gantry frame 200, The air-knife spoiler assembly 400 blows a spoiler airflow to a plurality of circuit boards placed on the gondola assembly 300, and blows it to each circuit board. On the one hand, by blowing air to the surface of the circuit board, the surface of the circuit board can be accelerated. The residual tank liquid flows back and drips into the liquid medicine tank. On the other hand, compared with the airflow in the straight flow direction, the turbulent airflow has the characteristics of complicated airflow inside the airflow and uneven airflow, which can make the hanging basket. A plurality of the circuit boards on the assembly 300 will shake to a certain extent when the crane, that is, the gantry 200 does not shake, so that the residual adhesion grooves on the surface of the circuit boards can be more effectively blown off by combining the airflow blowing and shaking and liquid rejection. liquid.

In order to further explain the technical idea of the above-mentioned gantry wire for circuit board electroplating, this case also provides a method for reducing the carry-out of gantry wire tank liquid in circuit board electroplating. In an embodiment, please refer to FIG. 3, which is a circuit in an embodiment. The flow chart of the steps of the method for reducing the carry-out of the gantry line tank liquid in the board electroplating, and the method for reducing the carry-out of the gantry line tank liquid in the circuit board electroplating, including the following steps:

S110: Put the circuit board into the liquid medicine tank, and perform a liquid immersion electroplating operation.

In one embodiment, there are multiple chemical liquid tanks, specifically including copper sinking liquid chemical tank, micro-etching liquid chemical tank, water washing liquid chemical tank, etc. Of course, in the whole electroplating production line, the copper sinking liquid chemical tank The number, the number of micro-etching liquid tanks, the number of washing liquid tanks, and the order of different liquid tanks can be flexibly selected and set according to the actual situation; the immersion electroplating operation may specifically include copper sinking operation for circuit boards , circuit board micro-etching operation and circuit board washing operation.

S120: Lift the circuit board away from the liquid medicine tank, and adjust the distance between the circuit board and the liquid level of the liquid medicine tank to a preset liquid return distance.

By hoisting the circuit board away from the liquid medicine tank, the circuit board can be suspended, that is, the circuit board can be separated from the tank liquid in the liquid medicine tank, which is beneficial to the subsequent operation of eliminating residual tank liquid.

It can be understood that when the residual tank liquid adhering to the circuit board is blown away, by adjusting the distance between the circuit board and the liquid level of the liquid medicine tank to the preset liquid return distance, cold wind can be avoided. When the residual bath liquid is blown away, the liquid droplets of the bath liquid are excessively sputtered to the outside of the chemical liquid tank, so as to ensure that the liquid droplets of the bath liquid can return to the inside of the chemical liquid tank as soon as possible. In one embodiment, the preset liquid return distance is 0.1 to 2 meters. In this way, when the cold wind blows away the residual tank liquid, the liquid droplets of the tank liquid can be prevented from being excessively sputtered to the outside of the liquid medicine tank, so as to ensure that the tank liquid is blown away. The liquid droplets can return to the inside of the chemical liquid tank as soon as possible.

S130 : Blow out cold air to the circuit board to blow away the residual bath liquid adhering to the circuit board, so that the residual bath liquid is returned to the liquid medicine tank.

Compared with the circuit board blowing hot air to the circuit board at room temperature or at the beginning, the volatilization degree of the residual bath liquid on the surface of the circuit board will be larger, and the harmful substances generated by the volatilization of the residual bath liquid will escape into the air of the electroplating operation area. However, by blowing cold air to the circuit board, the temperature of the cold air is lower, which can effectively suppress the volatilization degree of the residual bath liquid, thereby better reducing the content of harmful substances in the air of the electroplating operation area.

In order to make the multiple circuit boards on the hanging basket assembly not shake to a certain degree in the case that the crane, that is, the gantry frame does not shake, a certain degree of shaking occurs. In this way, the combination of cold air blowing and shaking and liquid rejection can more effectively remove the residual stickiness on the surface of the circuit board. With the bath solution, in one embodiment, in the operation of blowing cold air to the circuit board, the cold air is also converted into turbulent cold air. The characteristics of disordered airflow such as complex flow direction and uneven wind speed can make the multiple circuit boards on the hanging basket assembly not shake in the case of the crane, that is, the gantry frame. It can more effectively blow off the residual adhesive bath liquid on the surface of the circuit board.

In one embodiment, the operation of blowing cold air to the circuit board to blow off the residual bath liquid adhering to the circuit board specifically includes the following steps: separating a plurality of circuit boards in advance to Leave a gap between every two adjacent circuit boards; convert the cold air into turbulent cold air, and make the turbulent cold air bulge out to a plurality of the circuit boards, so as to cool the multiple circuits. The residual bath liquid adhering to the board is blown away, so that the blown cold air can blow the surface of the circuit board more comprehensively, so as to take away the residual bath liquid adhering to the circuit board more quickly, and at the same time. , Since there is a gap between the circuit boards, when the turbulent cold wind blows the circuit boards, the circuit boards can be shaken more strongly, so as to further improve the operation of removing the residual bath liquid of the circuit boards.

S140: Lift the circuit board, and adjust the distance between the circuit board and the liquid level of the pharmaceutical tank to be a preset drying distance, where the preset drying distance is greater than the preset liquid return distance .

S150: Blow out hot air to the circuit board to dry the circuit board.

It should be noted that when the cold air is blown to the circuit board and the operation of blowing away the cold air from the residual tank liquid of the circuit board is completed, there is very little residual tank liquid on the circuit board, and the residual liquid on the circuit board is very small. It is difficult to completely remove the residual bath liquid with cold air or shaking, and it takes a long time to blow away. Through step S150, hot air is blown to the circuit board to dry the circuit board. operation, and adjust the distance between the circuit board and the liquid level of the pharmaceutical tank to a preset drying distance, and the preset drying distance is greater than the preset liquid return distance, which can make the circuit board drum The outgoing hot air is far away from the liquid medicine in the liquid medicine tank, focusing on drying the residual tank liquid left on the circuit board, so that when the circuit board is transported between adjacent liquid medicine tanks, it can make the circuit board stick. The attached bath solution is removed more cleanly, and the volatilization degree of the bath solution can be reduced, and the content of harmful substances in the air of the electroplating operation area can be better reduced. Taking a step back, even if the remaining very little residual bath liquid in this part is volatilized into the air of the electroplating operation area, it is still within the acceptable range. It improves the blow-off efficiency of the residual tank liquid, and also solves the problem of environmental protection.

In one embodiment, the temperature of the cold air is 10 degrees Celsius to 15 degrees Celsius, so that the volatilization degree of the bath solution can be reduced, and the content of harmful substances in the air of the electroplating operation area can be better reduced; further, the temperature of the hot air When the temperature is 30 degrees Celsius to 60 degrees Celsius, very little residual bath liquid on the circuit board can be quickly dried without affecting the performance of the circuit board itself; further, the preset liquid return The distance is 0.1 to 2 meters. In this way, when the cold wind blows away the residual tank liquid, the liquid droplets of the tank liquid can be prevented from being excessively sputtered to the outside of the chemical liquid tank, so as to ensure that the liquid droplets of the tank liquid can return to the chemical liquid as soon as possible. The interior of the liquid tank; further, the preset drying distance is 2.5 meters to 5 meters, so that the hot air bulging toward the circuit board is kept away from the liquid medicine in the liquid medicine tank, focusing on drying the circuit board. There is very little residual bath liquid, so that when the circuit board is transported between adjacent chemical liquid tanks, the bath liquid adhering to the circuit board can be removed more cleanly, and the volatilization degree of the bath liquid can be reduced, so that it can be better. To reduce the content of harmful substances in the air of the electroplating operation area; further, the duration of blowing cold air to the circuit board is 30 seconds to 100 seconds. It takes 95 seconds for the circuit board to come out of the copper liquid tank, 45 seconds for micro-etching the liquid tank, and 30 seconds for washing the liquid tank. In this way, the residual tank liquid can be blown away more targeted for different liquid tanks; further, to The duration of the hot air blowing out of the circuit board is 5 seconds to 10 seconds, and the corresponding hot air blowing duration is formulated for different liquid medicine tanks. 8 seconds, wash the liquid medicine tank for 5 seconds, so that the residual tank liquid drying operation can be more targeted for different liquid medicine tanks.

Compared with the prior art, the present invention has at least the following advantages:

The above-mentioned method for reducing the carry-out of the gantry line tank liquid in the electroplating of the circuit board, through the air-assisted blowing method of blowing cold air first and then blowing hot air, can make the circuit board transfer between adjacent liquid medicine tanks. The attached bath solution is removed more cleanly, and the volatilization degree of the bath solution can be reduced, which can better reduce the content of harmful substances in the air of the electroplating operation area.

The above examples only represent several embodiments of the present invention, and the descriptions thereof are specific and detailed, but should not be construed as a limitation on the scope of the invention patent. It should be pointed out that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can also be made, which all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention should be subject to the appended claims.

Claims

A method for reducing carry-out of gantry line tank liquid in circuit board electroplating, characterized in that it comprises the following steps:

Put the circuit board into the liquid medicine tank for immersion electroplating operation;

Lifting the circuit board away from the liquid medicine tank, and adjusting the distance between the circuit board and the liquid level of the liquid medicine tank to be a preset liquid return distance;

Blow out cold air to the circuit board to blow away the residual tank liquid adhering to the circuit board, so that the residual tank liquid is returned to the liquid medicine tank;

The circuit board is lifted, and the distance between the circuit board and the liquid level of the pharmaceutical tank is adjusted to be a preset drying distance, and the preset drying distance is greater than the preset liquid return distance;

Hot air is blown toward the circuit board to dry the circuit board.
[Corrected 14.05.2021 in accordance with Rule 91]
The method for reducing the carry-out of gantry line bath liquid in circuit board electroplating according to claim 1, wherein the temperature of the cold air is 10 degrees Celsius to 15 degrees Celsius.
[Corrected 14.05.2021 in accordance with Rule 91]
The method for reducing carry-out of gantry line bath liquid in circuit board electroplating according to claim 1, wherein the temperature of the hot air is 30 degrees Celsius to 60 degrees Celsius.
[Corrected 14.05.2021 in accordance with Rule 91]

The method for reducing carry-out of gantry line bath liquid in circuit board electroplating according to claim 1, wherein cold air is blown out to the circuit board to blow away the residual bath liquid adhering to the circuit board The operation includes the following steps:

Separate a plurality of circuit boards in advance, so as to leave a gap between every two adjacent circuit boards;

The cold air is converted into turbulent cold air, and the turbulent cold air is blown out to the plurality of circuit boards, so as to blow away the residual bath liquid adhering to the plurality of circuit boards.
[Corrected 14.05.2021 in accordance with Rule 91]
The method for reducing carry-out of gantry line tank liquid in circuit board electroplating according to claim 1, wherein the preset liquid return distance is 0.1 to 2 meters.
[Corrected 14.05.2021 in accordance with Rule 91]
The method for reducing carry-out of gantry line bath liquid in circuit board electroplating according to claim 5, wherein the preset drying distance is 2.5 meters to 5 meters.
The method for reducing carry-out of gantry line bath liquid in circuit board electroplating according to claim 1, wherein the duration of blowing cold air to the circuit board is 15 seconds to 100 seconds.
[Corrected 14.05.2021 in accordance with Rule 91]
The method for reducing carry-out of gantry line bath liquid in circuit board electroplating according to claim 7, wherein the duration of blowing hot air to the circuit board is 5 seconds to 10 seconds.