JPH09130063A - High frequency airtight module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make the high frequency wave signal transmission property of an i/o line good. SOLUTION: In the i/o signal line of a high frequency airtight module, the microstrip line 1b whose tip is opened at one side by an open stub is arranged to transmit high frequency signals through the coupling hole 6 provided at an earth conductor 5 by laminating the fellow earth conductors 5 of two sheets of boards having earth conductors 5 on the other side, thus the connection by conductor wires or ribbons of i/o of high frequency integrated circuit boards is made needless.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-frequency hermetic module which is kept airtight for improving environmental resistance.

[0002]

2. Description of the Related Art FIG. 23 is a plan perspective view showing a conventional high frequency airtight module, and FIG. 24 is a sectional view taken along line A8-A8 of FIG.
FIG. 25 is a B8 view of FIG. 23. In these figures, 1 is a conductor frame, 2 is a ground conductor, 3 is a high frequency integrated circuit board, 4 is a bias terminal, 5 is a brazing material, 6 is a conductor wire,
7 is an airtight cover, 8 is a conductor base, 9 is an input / output feedthrough substrate, 10 is an input / output pattern, 11 is a dielectric block, 12 is a bias feedthrough substrate, 13
The bias pattern, 14 is a high frequency integrated circuit input / output terminal.

Here, the ground conductor 2 of the input / output feedthrough substrate 9 and the ground conductor 2 of the bias feedthrough substrate 12 are brazed to the conductor base 8 by the brazing material 5. Also, a dielectric block 11 is attached onto the input / output pattern 10 of the input / output feedthrough substrate 9, and the periphery thereof is surrounded by the conductor base 8 and the conductor frame 1 to form a feedthrough of a tri-plate. The bias line is also the feed-through substrate 12 for bias.
The dielectric block 11 is adhered onto the bias pattern 13 and the surroundings are surrounded by the conductor base 8 and the conductor frame 1 to form an airtight feedthrough. The feed-through pattern is connected to the high-frequency integrated circuit input / output terminal 14 and the bias terminal 4 of the high-frequency integrated circuit board 3 by the conductor wire 6, and the airtight cover 7 is brazed or welded to keep the airtightness in the module. The environment resistance of the high frequency integrated circuit board 3 is improved.

As described above, in the conventional high-frequency airtight module, the high-frequency integrated circuit board 3 and the high-frequency signal and the bias are interfaced with each other while keeping the airtightness in the module by the triplate type feedthrough. For example, when the high-frequency integrated circuit board 3 is an amplifier, the high-frequency signal input from the input / output feedthrough board 9 passes through the feedthrough of the triplate and passes through the high-frequency integrated circuit board 3
Is input to The input signal is the high frequency integrated circuit board 3
Then, the power is amplified by and passes through the feedthrough of the triplate and is output from the input / output feedthrough substrate 9.

[0005]

23, 24, and 2
In the high frequency airtight module as shown in FIG. 5, the input / output feedthrough substrate 9 and the bias feedthrough substrate 12 are used.
A high temperature baked thick film substrate is used because of its processability. The line pattern of the high temperature baked thick film substrate is generally made of a metal having a high electric resistance such as tungsten as a base and has a thickness of 7 to 7
Since the thickness is 15 μm, which is thicker than the line pattern of the thin film substrate, when the signal transmitted through the microstrip line has a high frequency, most of the current flows through the base metal having a large resistance due to the skin effect, resulting in a large loss.

Further, at high frequencies, it is necessary to reduce the substrate thickness in order to prevent the generation of higher-order modes, which inevitably reduces the pattern width of the microstrip line. Further, in the triplate line portion, the pattern width becomes narrower in order to have the same characteristic impedance as that of the microstrip line portion, so that the pattern accuracy becomes more severe. Since the pattern dimensional accuracy of the thick film is worse than that of the thin film, there is a problem in that the characteristic impedance is largely displaced due to a dimensional error.

Further, the high frequency integrated circuit board 3 and the input / output feed-through board 9 are mounted with a gap therebetween in consideration of the assembling workability and the dimensional accuracy of the board, and the high frequency signals are connected by a conductor wire or a ribbon. Therefore, there is a problem that the performance of the module is deteriorated by the inductance of these conductor wires and ribbons.

The present invention has been made to solve the above problems, and an object thereof is to improve the high frequency signal propagation characteristics of the input / output terminals of the high frequency hermetic module.

[0009]

The high-frequency hermetic module according to the first embodiment of the present invention is different from the tri-plate type feedthrough for transmitting a high-frequency signal, and the ground conductors of the microstrip line whose ends are opened by open stubs are used. A high-frequency signal is propagated by electromagnetic coupling through a coupling hole provided in the ground conductor, and an airtight module is realized without connecting the input and output of the high-frequency signal of the high-frequency integrated circuit board with a conductor wire or conductor ribbon. It was done.

Further, the high frequency hermetic module of the second embodiment is the same as the high frequency hermetic module of the first embodiment, but the input / output interface is a microstrip line having a ground terminal on the surface.

The high-frequency hermetic module of the third embodiment is the same as the high-frequency hermetic module of the first embodiment, except that the input / output interface is a coplanar line.

The high frequency airtight module of the fourth embodiment is the same as the high frequency airtight module of the first embodiment.
A rectangular waveguide is used as an input / output interface by adding a surface probe type waveguide-microstrip line converter.

Further, the high frequency airtight module of the fifth embodiment has a rectangular input / output interface by adding a waveguide-microstrip line converter using a step transformer to the high frequency airtight module of the first embodiment. It is a waveguide.

The high-frequency hermetic module of the sixth embodiment is the same as the high-frequency hermetic module of the first embodiment, in which a reinforcing frame is attached to the base substrate to improve the mechanical strength of the module.

Further, the high-frequency airtight module of the seventh embodiment is one in which the mechanical strength of the module is improved by using a reinforcing structure base substrate having a ridge for reinforcement instead of the base substrate of the first embodiment.

[0016]

BEST MODE FOR CARRYING OUT THE INVENTION

Embodiment 1 FIG. 1 is a plan view of a high frequency airtight module showing Embodiment 1 of the present invention, and FIG. 2 is A1 in FIG.
-A1 sectional view, FIG. 3 is a perspective view from the B1 direction in FIG. In the figure, 1 is a conductor frame, 2 is a ground conductor,
3 is a high frequency integrated circuit board, 4 is a bias terminal, 5 is a brazing material, 6 is a conductor wire, 7 is an airtight cover, 15 is a base board, 16 is a module input / output microstrip line, 17 is an open stub, and 18 is a coupling. A hole, 19 is a microstrip line for inputting / outputting a high frequency integrated circuit, 20 is a high frequency circuit section, and 21 is an airtight through terminal for bias.

Here, the base substrate 15 is the conductor frame 1
It is attached by brazing material 5. On the surface of the base substrate 15, the module input / output microstrip line 1 is provided.
6 and two sets of open stubs 17 connected to the module input / output microstrip line 16.
Further, the ground conductor 2 having a coupling hole 18 is provided on the back surface, and the coupling hole 18 is directly behind the connecting portion of the module input / output microstrip line 16 and the open stub 17 and is connected to the module input / output microstrip line 16 by the coupling hole 18. It is positioned so that the signal propagation direction and the longitudinal direction of the coupling hole 18 are orthogonal to each other. On the surface of the high-frequency integrated circuit board 3, the high-frequency integrated circuit input / output microstrip line 19, the open stub 17 connected to the high-frequency integrated circuit input / output microstrip line 19, the high-frequency circuit section 20, and the bias terminal 1 are provided.
1 is provided. Further, the ground conductor 2 having the coupling hole 18 is provided on the back surface. The base substrate 15 and the high-frequency integrated circuit substrate 3 are made to match the portions of the coupling holes 18 provided in the respective ground conductors 2, and the ground conductors 2 are bonded together by the brazing material 5. The bias airtight penetrating terminal 21 is embedded in the side surface of the conductor frame 1 without a gap. The bias terminal 11 and the bias airtight penetrating terminal 21 are bonded by a conductor wire 6. The airtight cover 7 is brazed or welded to the conductor frame 1 without a gap.

As a result, the module input / output microstrip line 16 and the high frequency integrated circuit input / output microstrip line 19 are connected to a high frequency signal by electromagnetic coupling due to the effect of the open stub 17 and the coupling hole 18. Module input / output microstrip line 16
The high-frequency signal input from is propagated to the high-frequency integrated circuit input / output microstrip line 19 through the coupling hole 18 and input to the high-frequency circuit section 20. On the other hand, the high-frequency signal output from the high-frequency circuit unit 20 is propagated to the high-frequency integrated circuit input / output microstrip line 19, propagates to the module input / output microstrip line 16 through the coupling hole 18, and is output. In such an airtight module, it is possible to use a thin film substrate which is excellent in pattern accuracy and has a small electric resistance of the metal underlying the pattern as a substrate forming the module. Therefore, the input / output line of the high frequency airtight module has low loss, and the performance is improved. Further, since the module input / output microstrip line 16 and the high frequency integrated circuit input / output microstrip line 19 are not connected by a conductor wire or a conductor ribbon, there is no deterioration in performance due to the inductance component of the conductor wire or the conductor ribbon. Further, since the electromagnetic coupling portion is not connected by the conductor, it is possible to cut off the direct current from the high frequency signal line.

Embodiment 2. In order to improve the high frequency characteristics when the modules are connected to each other in the first embodiment, the ground terminals are provided on both sides of the module input / output microstrip line so as to be electrically connected to the ground conductor by through holes. 5 is a plan view of the high-frequency airtight module, FIG. 5 is a cross-sectional view taken along line A2-A2 in FIG. 4, and FIG. 6 is a perspective view from the direction B2 in FIG. In the figure, 1 is a conductor frame, 2 is a ground conductor, 3 is a high frequency integrated circuit board, 4 is a bias terminal, 5 is a brazing material, 6 is a conductor wire,
7 is an airtight cover, 15 is a base substrate, 16 is a module input / output microstrip line, 17 is an open stub, 18 is a coupling hole, 19 is a high frequency integrated circuit input / output microstrip line, 20 is a high frequency circuit section, and 21 is a A bias airtight through terminal, 22 is a ground terminal, and 23 is a through hole.

Also in this case, the base substrate 15 is attached to the conductor frame 1 by the brazing material 5. Two sets of module input / output microstrip lines 16 and open stubs 17 connected to the module input / output microstrip lines 16 are provided on the surface of the base substrate 15. Further, the ground conductor 2 having a coupling hole 18 is provided on the back surface, and the coupling hole 18 is directly behind the connecting portion between the module input / output microstrip line 16 and the open stub 17, and the module input / output microstrip line 16 is provided.
Is positioned so that the signal propagation direction and the longitudinal direction of the coupling hole 18 are orthogonal to each other. On the surface of the high-frequency integrated circuit board 3, a high-frequency integrated circuit input / output microstrip line 19 and an open stub 17 connected to the high-frequency integrated circuit input / output microstrip line 19 are provided. A ground conductor 2 having a coupling hole 18 is provided on the back surface, and the coupling hole 18 is used for the module input / output microstrip line 1.
The signal propagation direction of the module input / output microstrip line 16 and the longitudinal direction of the coupling hole 18 are positioned right behind the connecting portion between the open end 6 and the open stub 17. On the surface of the high-frequency integrated circuit board 3, a high-frequency integrated circuit input / output microstrip line 19 and an open stub 1 connected to the high-frequency integrated circuit input / output microstrip line 19 are provided.
7, a high frequency circuit section 20 and a bias terminal 11 are provided. Further, the ground conductor 2 having the coupling hole 18 is provided on the back surface. The base substrate 15 and the high-frequency integrated circuit substrate 3 are made to match the portions of the coupling holes 18 provided in the respective ground conductors 2, and the ground conductors 2 are bonded together by the brazing material 5. The bias airtight through terminal 21 is the conductor frame 1
It is embedded on the side of the without gap. In addition, the conductor wire 6 is provided between the bias terminal 11 and the bias airtight through terminal 21.
Is bonded by. The airtight cover 7 is brazed or welded to the conductor frame 1 without a gap.

As a result, the module input / output microstrip line 16 and the high frequency integrated circuit input / output microstrip line 19 are connected to a high frequency signal by electromagnetic coupling due to the effect of the open stub 17 and the coupling hole 18. Module input / output microstrip line 16
The high-frequency signal input from is propagated to the high-frequency integrated circuit input / output microstrip line 19 through the coupling hole 18 and input to the high-frequency circuit section 20. On the other hand, the high-frequency signal output from the high-frequency circuit unit 20 is propagated to the high-frequency integrated circuit input / output microstrip line 19, propagates to the module input / output microstrip line 16 through the coupling hole 18, and is output. In such an airtight module, it is possible to use a thin film substrate which is excellent in pattern accuracy and has a small electric resistance of the metal underlying the pattern as a substrate forming the module. Therefore, the input / output line of the high frequency airtight module has low loss, and the performance is improved. Further, since the module input / output microstrip line 16 and the high frequency integrated circuit input / output microstrip line 19 are not connected by a conductor wire or a conductor ribbon, there is no deterioration in performance due to the inductance component of the conductor wire or the conductor ribbon. Further, since the electromagnetic coupling portion is not connected by the conductor, it is possible to cut off the direct current from the high frequency signal line.

The ground conductor 2 is provided with through holes 23 on both sides of the module input / output microstrip line 16.
Since the ground terminal 22 that is electrically connected to the module is provided, the path of the current flowing through the ground can be shortened by connecting the ground terminals 22 in the connection of the input and output of the modules. The high frequency characteristics of the part can be improved.

Embodiment 3 FIG. FIG. 7 shows an input / output interface by performing microstrip-coplanar conversion with through holes on both sides of the input / output microstrip line in order to improve the high frequency characteristics when the modules are connected in the first embodiment. A plan view of a high-frequency hermetic module using a coplanar line, FIG.
7 is a cross-sectional view taken along the line A3-A3 in FIG. 7, and FIG. 9 is a perspective view from the B3 direction in FIG. In the figure, 1 is a conductor frame, 2 is a ground conductor, 3 is a high frequency integrated circuit board, 4 is a bias terminal, 5 is a brazing material, 6 is a conductor wire, 7 is an airtight cover, 15 is a base board, and 16 is for module input / output. Microstrip line, 17 is an open stub, 18 is a coupling hole, 19 is a microstrip line for inputting / outputting a high frequency integrated circuit, 20 is a high frequency circuit section, 21 is an airtight through terminal for bias, 23 is a through hole, and 24 is a coplanar line center. The conductor, 25 is a coplanar line ground conductor.

Also in this case, the base substrate 15 is attached to the conductor frame 1 by the brazing material 5. Two sets of module input / output microstrip lines 16 and open stubs 17 connected to the module input / output microstrip lines 16 are provided on the surface of the base substrate 15. Further, the ground conductor 2 having a coupling hole 18 is provided on the back surface, and the coupling hole 18 is directly behind the connecting portion between the module input / output microstrip line 16 and the open stub 17, and the module input / output microstrip line 16 is provided.
Is positioned so that the signal propagation direction and the longitudinal direction of the coupling hole 18 are orthogonal to each other. On the surface of the high-frequency integrated circuit board 3, a high-frequency integrated circuit input / output microstrip line 19 and an open stub 17 connected to the high-frequency integrated circuit input / output microstrip line 19 are provided. A ground conductor 2 having a coupling hole 18 is provided on the back surface, and the coupling hole 18 is used for the module input / output microstrip line 1.
The signal propagation direction of the module input / output microstrip line 16 and the longitudinal direction of the coupling hole 18 are positioned right behind the connecting portion between the open end 6 and the open stub 17. On the surface of the high-frequency integrated circuit board 3, a high-frequency integrated circuit input / output microstrip line 19 and an open stub 1 connected to the high-frequency integrated circuit input / output microstrip line 19 are provided.
7, a high frequency circuit section 20 and a bias terminal 11 are provided. Further, the ground conductor 2 having the coupling hole 18 is provided on the back surface. The base substrate 15 and the high-frequency integrated circuit substrate 3 are made to match the portions of the coupling holes 18 provided in the respective ground conductors 2, and the ground conductors 2 are bonded together by the brazing material 5. The bias airtight through terminal 21 is the conductor frame 1
It is embedded on the side of the without gap. In addition, the conductor wire 6 is provided between the bias terminal 11 and the bias airtight through terminal 21.
Is bonded by. The airtight cover 7 is brazed or welded to the conductor frame 1 without a gap.

As a result, the module input / output microstrip line 16 and the high frequency integrated circuit input / output microstrip line 19 are connected to a high frequency signal by electromagnetic coupling due to the effect of the open stub 17 and the coupling hole 18. Module input / output microstrip line 16
The high-frequency signal input from is propagated to the high-frequency integrated circuit input / output microstrip line 19 through the coupling hole 18 and input to the high-frequency circuit section 20. On the other hand, the high-frequency signal output from the high-frequency circuit unit 20 is propagated to the high-frequency integrated circuit input / output microstrip line 19, propagates to the module input / output microstrip line 16 through the coupling hole 18, and is output. In such an airtight module, it is possible to use a thin film substrate which is excellent in pattern accuracy and has a small electric resistance of the metal underlying the pattern as a substrate forming the module. Therefore, the input / output line of the high frequency airtight module has low loss, and the performance is improved. Further, since the module input / output microstrip line 16 and the high frequency integrated circuit input / output microstrip line 19 are not connected by a conductor wire or a conductor ribbon, there is no deterioration in performance due to the inductance component of the conductor wire or the conductor ribbon. Further, since the electromagnetic coupling portion is not connected by the conductor, it is possible to cut off the direct current from the high frequency signal line.

The coplanar line center conductor 2 connected to the module input / output microstrip line 16
4. Coplanar line ground conductor 25 and coplanar line ground conductor 25 provided on both sides of the coplanar line center conductor 24
2 for connecting the ground conductor 2 of the base substrate 15 with the through hole 2
3 performs microstrip-coplanar conversion. Therefore, by connecting the coplanar line center conductor 24 and the coplanar line ground conductor 18 to each other in the input / output connection of the modules, an interface of the coplanar line is obtained, so that the high frequency characteristics of the connection portion between the modules can be further improved.

Embodiment 4 FIG. 10 shows the first embodiment described above.
A plan view of a high-frequency hermetic module in which the input / output interface is a rectangular waveguide by performing E-plane probe-type waveguide-microstrip conversion in the module in order to improve the high-frequency characteristics of the connection between the modules. 11 is a sectional view taken along line A4-A4 in FIG.
2 is a perspective view from the B4 direction in FIG. In the figure, 1 is a conductor frame, 2 is a ground conductor, 3 is a high frequency integrated circuit board, 4 is a bias terminal, 5 is a brazing material, 6 is a conductor wire, 7 is an airtight cover, 15 is a base board, and 16 is for module input / output. Microstrip line, 17 is an open stub, 18 is a coupling hole, 19 is a microstrip line for inputting / outputting a high frequency integrated circuit, 20 is a high frequency circuit section, 21
Is a hermetically sealed through terminal for bias, 26 is a rectangular waveguide for input and output, 27 is a waveguide-microstrip conversion substrate, 28
Is a microstrip line for a probe.

Also in this case, the base substrate 15 is attached to the conductor frame 1 by the brazing material 5. Two sets of module input / output microstrip lines 16 and open stubs 17 connected to the module input / output microstrip lines 16 are provided on the surface of the base substrate 15. Further, the ground conductor 2 having a coupling hole 18 is provided on the back surface, and the coupling hole 18 is directly behind the connecting portion between the module input / output microstrip line 16 and the open stub 17, and the module input / output microstrip line 16 is provided.
Is positioned so that the signal propagation direction and the longitudinal direction of the coupling hole 18 are orthogonal to each other. On the surface of the high-frequency integrated circuit board 3, a high-frequency integrated circuit input / output microstrip line 19 and an open stub 17 connected to the high-frequency integrated circuit input / output microstrip line 19 are provided. A ground conductor 2 having a coupling hole 18 is provided on the back surface, and the coupling hole 18 is used for the module input / output microstrip line 1.
The signal propagation direction of the module input / output microstrip line 16 and the longitudinal direction of the coupling hole 18 are positioned right behind the connecting portion between the open end 6 and the open stub 17. On the surface of the high-frequency integrated circuit board 3, a high-frequency integrated circuit input / output microstrip line 19 and an open stub 1 connected to the high-frequency integrated circuit input / output microstrip line 19 are provided.
7, a high frequency circuit section 20 and a bias terminal 11 are provided. Further, the ground conductor 2 having the coupling hole 18 is provided on the back surface. The base substrate 15 and the high-frequency integrated circuit substrate 3 are made to match the portions of the coupling holes 18 provided in the respective ground conductors 2, and the ground conductors 2 are bonded together by the brazing material 5. The bias airtight through terminal 21 is the conductor frame 1
It is embedded on the side of the without gap. In addition, the conductor wire 6 is provided between the bias terminal 11 and the bias airtight through terminal 21.
Is bonded by. The airtight cover 7 is brazed or welded to the conductor frame 1 without a gap.

As a result, the module input / output microstrip line 16 and the high frequency integrated circuit input / output microstrip line 19 are connected to a high frequency signal by electromagnetic coupling due to the effect of the open stub 17 and the coupling hole 18. Module input / output microstrip line 16
The high-frequency signal input from is propagated to the high-frequency integrated circuit input / output microstrip line 19 through the coupling hole 18 and input to the high-frequency circuit section 20. On the other hand, the high-frequency signal output from the high-frequency circuit unit 20 is propagated to the high-frequency integrated circuit input / output microstrip line 19, propagates to the module input / output microstrip line 16 through the coupling hole 18, and is output. In such an airtight module, it is possible to use a thin film substrate which is excellent in pattern accuracy and has a small electric resistance of the metal underlying the pattern as a substrate forming the module. Therefore, the input / output line of the high frequency airtight module has low loss, and the performance is improved. Further, since the module input / output microstrip line 16 and the high frequency integrated circuit input / output microstrip line 19 are not connected by a conductor wire or a conductor ribbon, there is no deterioration in performance due to the inductance component of the conductor wire or the conductor ribbon. Further, since the electromagnetic coupling portion is not connected by the conductor, it is possible to cut off the direct current from the high frequency signal line.

Further, the waveguide-microstrip conversion substrate 27 connected to the module input / output microstrip line 16 and the probe microstrip line 2 are connected.
8. The waveguide-microstrip conversion is performed by the input / output rectangular waveguide 26. Therefore, in connecting the input and output of the modules, the rectangular waveguide 26 for input and output is used.
By connecting them, a rectangular waveguide interface is provided, so that the high-frequency characteristics of the connection between the modules can be further improved.

Embodiment 5. FIG. 13 shows the first embodiment.
In order to improve the high-frequency characteristics of the connection between modules, the waveguide-microstrip conversion using the waveguide impedance transformer is performed in the module to make the input / output interface a rectangular waveguide and the high-frequency airtightness. FIG. 14 is a plan view of the module, and FIG. 14 is A5 in FIG.
-A5 sectional view, FIG. 15 is a perspective view from the B5 direction in FIG. 14, and FIG. 16 is a C5 view in FIG. In the figure, 1 is a conductor frame, 2 is a ground conductor, 3 is a high frequency integrated circuit board, 4 is a bias terminal, 5 is a brazing material, 6 is a conductor wire, 7 is an airtight cover, 15 is a base board, and 16 is for module input / output. Microstrip line, 17 is an open stub, 18 is a coupling hole, 19 is a microstrip line for inputting / outputting a high frequency integrated circuit, 20 is a high frequency circuit section, 21
Is a hermetically sealed through terminal for bias, 26 is a rectangular waveguide for input and output, and 29 is a waveguide impedance transformer.

Also in this case, the base substrate 15 is attached to the conductor frame 1 by the brazing material 5. Two sets of module input / output microstrip lines 16 and open stubs 17 connected to the module input / output microstrip lines 16 are provided on the surface of the base substrate 15. Further, the ground conductor 2 having a coupling hole 18 is provided on the back surface, and the coupling hole 18 is directly behind the connecting portion between the module input / output microstrip line 16 and the open stub 17, and the module input / output microstrip line 16 is provided.
Is positioned so that the signal propagation direction and the longitudinal direction of the coupling hole 18 are orthogonal to each other. On the surface of the high-frequency integrated circuit board 3, a high-frequency integrated circuit input / output microstrip line 19 and an open stub 17 connected to the high-frequency integrated circuit input / output microstrip line 19 are provided. A ground conductor 2 having a coupling hole 18 is provided on the back surface, and the coupling hole 18 is used for the module input / output microstrip line 1.
The signal propagation direction of the module input / output microstrip line 16 and the longitudinal direction of the coupling hole 18 are positioned right behind the connecting portion between the open end 6 and the open stub 17. On the surface of the high-frequency integrated circuit board 3, a high-frequency integrated circuit input / output microstrip line 19 and an open stub 1 connected to the high-frequency integrated circuit input / output microstrip line 19 are provided.
7, a high frequency circuit section 20 and a bias terminal 11 are provided. Further, the ground conductor 2 having the coupling hole 18 is provided on the back surface. The base substrate 15 and the high-frequency integrated circuit substrate 3 are made to match the portions of the coupling holes 18 provided in the respective ground conductors 2, and the ground conductors 2 are bonded together by the brazing material 5. The bias airtight through terminal 21 is the conductor frame 1
It is embedded on the side of the without gap. In addition, the conductor wire 6 is provided between the bias terminal 11 and the bias airtight through terminal 21.
Is bonded by. The airtight cover 7 is brazed or welded to the conductor frame 1 without a gap.

As a result, the module input / output microstrip line 16 and the high frequency integrated circuit input / output microstrip line 19 are connected to the high frequency signal by electromagnetic coupling due to the effect of the open stub 17 and the coupling hole 18. Module input / output microstrip line 16
The high-frequency signal input from is propagated to the high-frequency integrated circuit input / output microstrip line 19 through the coupling hole 18 and input to the high-frequency circuit section 20. On the other hand, the high-frequency signal output from the high-frequency circuit unit 20 is propagated to the high-frequency integrated circuit input / output microstrip line 19, propagates to the module input / output microstrip line 16 through the coupling hole 18, and is output. In such an airtight module, it is possible to use a thin film substrate which is excellent in pattern accuracy and has a small electric resistance of the metal underlying the pattern as a substrate forming the module. Therefore, the input / output line of the high frequency airtight module has low loss, and the performance is improved. Further, since the module input / output microstrip line 16 and the high frequency integrated circuit input / output microstrip line 19 are not connected by a conductor wire or a conductor ribbon, there is no deterioration in performance due to the inductance component of the conductor wire or the conductor ribbon. Further, since the electromagnetic coupling portion is not connected by the conductor, it is possible to cut off the direct current from the high frequency signal line.

Further, the waveguide impedance transformer 29 connected to the module input / output microstrip line 16 and the input / output rectangular waveguide 26 provide a broadband waveguide.
Microstrip conversion is performed. For this reason,
In the connection of the input / output of the modules, the rectangular waveguide 26 for input / output is connected to form an interface of the rectangular waveguide, so that the high-frequency characteristics of the connection portion of the modules can be further improved in a wide band.

Sixth Embodiment FIG. 17 shows the first embodiment described above.
In order to improve the mechanical strength of the module, in the surface having the module input / output microstrip line of the base substrate, an open stub connected to the input / output microstrip line and the module input / output microstrip line. 18 is a plan view of the high-frequency airtight module in which a reinforcing frame made of metal, dielectric, resin, or the like is attached so as not to cover it, FIG. 18 is a sectional view taken along line A6-A6 in FIG. 17, and FIG. 19 is B6 in FIG.
It is a perspective view from a direction. In the figure, 1 is a conductor frame, 2 is a ground conductor, 3 is a high frequency integrated circuit board, 4 is a bias terminal, 5 is a brazing material, 6 is a conductor wire, 7 is an airtight cover, 15 is a base board, and 16 is for module input / output. A microstrip line, 17 is an open stub, 18 is a coupling hole, 19 is a high frequency integrated circuit input / output microstrip line, 20 is a high frequency circuit portion, 21 is a bias airtight through terminal, and 30 is a reinforcing frame.

Also in this case, the base substrate 15 is attached to the conductor frame 1 by the brazing material 5. Two sets of module input / output microstrip lines 16 and open stubs 17 connected to the module input / output microstrip lines 16 are provided on the surface of the base substrate 15. Further, the ground conductor 2 having a coupling hole 18 is provided on the back surface, and the coupling hole 18 is directly behind the connecting portion between the module input / output microstrip line 16 and the open stub 17, and the module input / output microstrip line 16 is provided.
Is positioned so that the signal propagation direction and the longitudinal direction of the coupling hole 18 are orthogonal to each other. On the surface of the high-frequency integrated circuit board 3, a high-frequency integrated circuit input / output microstrip line 19 and an open stub 17 connected to the high-frequency integrated circuit input / output microstrip line 19 are provided. A ground conductor 2 having a coupling hole 18 is provided on the back surface, and the coupling hole 18 is used for the module input / output microstrip line 1.
The signal propagation direction of the module input / output microstrip line 16 and the longitudinal direction of the coupling hole 18 are positioned right behind the connecting portion between the open end 6 and the open stub 17. On the surface of the high-frequency integrated circuit board 3, a high-frequency integrated circuit input / output microstrip line 19 and an open stub 1 connected to the high-frequency integrated circuit input / output microstrip line 19 are provided.
7, a high frequency circuit section 20 and a bias terminal 11 are provided. Further, the ground conductor 2 having the coupling hole 18 is provided on the back surface. The base substrate 15 and the high-frequency integrated circuit substrate 3 are made to match the portions of the coupling holes 18 provided in the respective ground conductors 2, and the ground conductors 2 are bonded together by the brazing material 5. The bias airtight through terminal 21 is the conductor frame 1
It is embedded on the side of the without gap. In addition, the conductor wire 6 is provided between the bias terminal 11 and the bias airtight through terminal 21.
Is bonded by. The airtight cover 7 is brazed or welded to the conductor frame 1 without a gap.

As a result, the module input / output microstrip line 16 and the high frequency integrated circuit input / output microstrip line 19 are connected to a high frequency signal by electromagnetic coupling due to the effect of the open stub 17 and the coupling hole 18. Module input / output microstrip line 16
The high-frequency signal input from is propagated to the high-frequency integrated circuit input / output microstrip line 19 through the coupling hole 18 and input to the high-frequency circuit section 20. On the other hand, the high-frequency signal output from the high-frequency circuit unit 20 is propagated to the high-frequency integrated circuit input / output microstrip line 19, propagates to the module input / output microstrip line 16 through the coupling hole 18, and is output. In such an airtight module, it is possible to use a thin film substrate which is excellent in pattern accuracy and has a small electric resistance of the metal underlying the pattern as a substrate forming the module. Therefore, the input / output line of the high frequency airtight module has low loss, and the performance is improved. Further, since the module input / output microstrip line 16 and the high frequency integrated circuit input / output microstrip line 19 are not connected by a conductor wire or a conductor ribbon, there is no deterioration in performance due to the inductance component of the conductor wire or the conductor ribbon. Further, since the electromagnetic coupling portion is not connected by the conductor, it is possible to cut off the direct current from the high frequency signal line.

Further, the surface of the base substrate 15 having the module input / output microstrip line 16 should not be covered by the module input / output microstrip line 16 and the open stub 17 connected to the module input / output microstrip line 16. Since the reinforcing frame 30 made of metal, dielectric, resin, or the like is attached, the base substrate 15 is reinforced, and the mechanical strength of the module can be improved.

Embodiment 7. FIG. 20 shows the first embodiment.
In order to improve the mechanical strength of the module in, in place of the base substrate, a plan view of a high-frequency hermetic module using a reinforcing structure base substrate having a ridge for reinforcement on the surface having the module input / output microstrip line, 21 is a sectional view taken along line A7-A7 in FIG.
FIG. 22 is a perspective view from the B7 direction in FIG. 21. In the figure, 1 is a conductor frame, 2 is a ground conductor, 3 is a high frequency integrated circuit board, 4 is a bias terminal, 5 is a brazing material, 6 is a conductor wire, 7 is an airtight cover, 16 is a microstrip line for module input / output, and 17 Is an open stub, 18 is a coupling hole, 19 is a microstrip line for inputting / outputting a high frequency integrated circuit, 20 is a high frequency circuit section, 21 is a hermetically through terminal for bias, and 31 is a reinforcing structure base substrate.

Here, the reinforcing structure base substrate 31 is attached to the conductor frame 1 by the brazing material 5. Two sets of module input / output microstrip lines 16 and open stubs 17 connected to the module input / output microstrip lines 16 are provided on the surface of the reinforcing structure base 31. Further, the ground conductor 2 having a coupling hole 18 is provided on the back surface, and the coupling hole 18 is directly behind the connecting portion of the module input / output microstrip line 16 and the open stub 17 and is connected to the module input / output microstrip line 16 by the coupling hole 18. It is positioned so that the signal propagation direction and the longitudinal direction of the coupling hole 18 are orthogonal to each other. On the surface of the high-frequency integrated circuit board 3, a high-frequency integrated circuit input / output microstrip line 19 and an open stub 17 connected to the high-frequency integrated circuit input / output microstrip line 19 are provided. Also,
A ground conductor 2 having a coupling hole 18 is provided on the back surface, and the coupling hole 18 is provided directly behind the connecting portion of the module input / output microstrip line 16 and the open stub 17 for signal propagation of the module input / output microstrip line 16. The direction is perpendicular to the longitudinal direction of the coupling hole 18. On the surface of the high-frequency integrated circuit board 3, a high-frequency integrated circuit input / output microstrip line 19, an open stub 17 connected to the high-frequency integrated circuit input / output microstrip line 19, a high-frequency circuit section 20, and a bias terminal 11 are provided.
Is provided. Further, the ground conductor 2 having the coupling hole 18 is provided on the back surface. The reinforcing structure base substrate 31 and the high-frequency integrated circuit substrate 3 are matched with each other in the coupling holes 18 provided in the respective ground conductors 2 by the brazing material 5.
They are stuck together. Airtight through terminal 2 for bias
1 is embedded in the side surface of the conductor frame 1 without any gap. The bias terminal 11 and the bias airtight penetrating terminal 21 are bonded by a conductor wire 6.
The airtight cover 7 is brazed or welded to the conductor frame 1 without a gap.

As a result, the module input / output microstrip line 16 and the high frequency integrated circuit input / output microstrip line 19 are connected to the high frequency signal by electromagnetic coupling due to the effect of the open stub 17 and the coupling hole 18. Module input / output microstrip line 16
The high-frequency signal input from is propagated to the high-frequency integrated circuit input / output microstrip line 19 through the coupling hole 18 and input to the high-frequency circuit section 20. On the other hand, the high-frequency signal output from the high-frequency circuit unit 20 is propagated to the high-frequency integrated circuit input / output microstrip line 19, propagates to the module input / output microstrip line 16 through the coupling hole 18, and is output. In such an airtight module, it is possible to use a thin film substrate which is excellent in pattern accuracy and has a small electric resistance of the metal underlying the pattern as a substrate forming the module. Therefore, the input / output line of the high frequency airtight module has low loss, and the performance is improved. Further, since the module input / output microstrip line 16 and the high frequency integrated circuit input / output microstrip line 19 are not connected by a conductor wire or a conductor ribbon, there is no deterioration in performance due to the inductance component of the conductor wire or the conductor ribbon. Further, since the electromagnetic coupling portion is not connected by the conductor, it is possible to cut off the direct current from the high frequency signal line.

On the surface of the reinforcing structure base substrate 31 having the module input / output microstrip line 16,
Since the reinforcing ridge is provided in the module input / output microstrip line 16 and in the portion not connected to the open stub 17 connected to the module input / output microstrip line 16, the strength of the substrate is increased, and the module can be manufactured without increasing the number of components. The mechanical strength can be improved.

[0043]

As described above, in the high frequency airtight module according to the first embodiment of the present invention, the ground conductors of the microstrip line whose ends are opened by the open stub are bonded to each other through the coupling hole provided in the ground conductor. Since an airtight module is realized by propagating a high frequency signal by electromagnetic coupling, a triplate type feedthrough using a pressure film substrate is not required and the propagation characteristics of the input / output line can be improved. The microstrip line for high frequency integrated circuits and the microstrip line for high-frequency integrated circuit input / output are not connected by conductor wires or ribbons, so there is no performance deterioration due to the inductance components of the conductor wires or ribbons, and unnecessary DC components are blocked. can do.

In the high frequency airtight module of the second embodiment, the ground conductors of the microstrip line whose ends are opened by the open stub are bonded to each other and a high frequency signal is electromagnetically coupled through the coupling hole provided in the ground conductor. Since the airtight module is realized by propagating, the triplate type feedthrough using the pressure film substrate is not necessary, and the propagation characteristic of the input / output line can be improved.
Since the module input / output microstrip line and the high-frequency integrated circuit input / output microstrip line are not connected by a conductor wire or a conductor ribbon, there is no deterioration in performance due to the inductance component of the conductor wire or conductor ribbon. The components can be blocked. In the input / output interface, ground terminals are provided on both sides of the input / output microstrip line so as to be electrically connected to the ground conductor by through holes, so that the grounds of the modules can be connected to each other. The high frequency characteristics of can be improved.

Further, in the high frequency airtight module of the third embodiment, the ground conductors of the microstrip lines whose ends are opened by the open stub are adhered to each other and the high frequency signal is electromagnetically coupled through the coupling hole provided in the ground conductor. Since the airtight module is realized by propagating, the triplate type feedthrough using the pressure film substrate is not necessary, and the propagation characteristic of the input / output line can be improved.
Since the module input / output microstrip line and the high-frequency integrated circuit input / output microstrip line are not connected by a conductor wire or a conductor ribbon, there is no deterioration in performance due to the inductance component of the conductor wire or conductor ribbon. The components can be blocked. Since the input / output interface is converted from the microstrip line to the coplanar line, the high frequency characteristics of the connection between the modules can be further improved.

Further, in the high frequency airtight module of the fourth embodiment, the ground conductors of the microstrip line whose ends are opened by the open stub are adhered to each other and a high frequency signal is electromagnetically coupled through a coupling hole provided in the ground conductor. Since the airtight module is realized by propagating, the triplate type feedthrough using the pressure film substrate is not necessary, and the propagation characteristic of the input / output line can be improved.
Since the module input / output microstrip line and the high-frequency integrated circuit input / output microstrip line are not connected by a conductor wire or a conductor ribbon, there is no deterioration in performance due to the inductance component of the conductor wire or conductor ribbon. The components can be blocked. Further, since the input / output interface is converted from the microstrip line to the rectangular waveguide by the E-plane probe type waveguide-microstrip converter, the high frequency characteristics of the connection between the modules are further improved. it can.

Further, in the high frequency airtight module of the fifth embodiment, the ground conductors of the microstrip lines whose ends are opened by the open stub are adhered to each other and a high frequency signal is electromagnetically coupled through a coupling hole provided in the ground conductor. Since the airtight module is realized by propagating, the triplate type feedthrough using the pressure film substrate is not necessary, and the propagation characteristic of the input / output line can be improved.
Since the module input / output microstrip line and the high-frequency integrated circuit input / output microstrip line are not connected by a conductor wire or a conductor ribbon, there is no deterioration in performance due to the inductance component of the conductor wire or conductor ribbon. The components can be blocked. Since the input / output interface is converted from a microstrip line to a rectangular waveguide by a waveguide-microstrip converter using a waveguide impedance transformer, the high-frequency characteristics of the connection between modules are high. Can be further improved by the wide band.

Further, in the high frequency airtight module of the sixth embodiment, the ground conductors of the microstrip line whose ends are opened by the open stub are adhered to each other, and a high frequency signal is electromagnetically coupled through a coupling hole provided in the ground conductor. Since the airtight module is realized by propagating, the triplate type feedthrough using the pressure film substrate is not necessary, and the propagation characteristic of the input / output line can be improved.
Since the module input / output microstrip line and the high-frequency integrated circuit input / output microstrip line are not connected by a conductor wire or a conductor ribbon, there is no deterioration in performance due to the inductance component of the conductor wire or conductor ribbon. The components can be blocked. And because the reinforcing frame is attached to the base substrate,
The mechanical strength of the module can be improved.

Further, in the high frequency airtight module of the seventh embodiment, the ground conductors of the microstrip line whose ends are opened by the open stub are bonded to each other and a high frequency signal is electromagnetically coupled through a coupling hole provided in the ground conductor. Since the airtight module is realized by propagating, the triplate type feedthrough using the pressure film substrate is not necessary, and the propagation characteristic of the input / output line can be improved.
Since the module input / output microstrip line and the high-frequency integrated circuit input / output microstrip line are not connected by a conductor wire or a conductor ribbon, there is no deterioration in performance due to the inductance component of the conductor wire or conductor ribbon. The components can be blocked. Further, since the reinforcing structure base substrate having the ridge for reinforcement is used for the base substrate, the mechanical strength of the module can be improved without increasing the number of parts.

[Brief description of the drawings]

FIG. 1 is a plan view of a high frequency airtight module according to a first embodiment of the present invention.

FIG. 2 is a cross-sectional view taken along the line A1-A1 in FIG. 1 showing the first embodiment of the high-frequency hermetic module according to the present invention.

FIG. 3 is a perspective view from the B1 direction in FIG. 2 showing the first embodiment of the high-frequency airtight module according to the present invention.

FIG. 4 is a plan view of a high frequency airtight module according to a second embodiment of the present invention.

5 is a cross-sectional view taken along the line A2-A2 in FIG. 4 showing the second embodiment of the high-frequency airtight module according to the present invention.

FIG. 6 is a perspective view from the B2 direction in FIG. 5 showing a second embodiment of the high-frequency airtight module according to the present invention.

FIG. 7 is a plan view of a high frequency airtight module according to a third embodiment of the present invention.

FIG. 8 is a sectional view taken along the line A3-A3 in FIG. 7 showing a third embodiment of the high-frequency airtight module according to the present invention.

FIG. 9 is a perspective view from the B3 direction in FIG. 8 showing the third embodiment of the high-frequency airtight module according to the present invention.

FIG. 10 is a plan view of a high-frequency airtight module according to a fourth embodiment of the present invention.

FIG. 11 is a sectional view taken along line A4-A4 in FIG. 10 showing a fourth embodiment of the high-frequency hermetic module according to the present invention.

FIG. 12 is a perspective view from the B4 direction in FIG. 11 showing a fourth embodiment of the high-frequency hermetic module according to the present invention.

FIG. 13 is a plan view of a high frequency airtight module according to a fifth embodiment of the present invention.

FIG. 14 is a sectional view taken along line A5-A5 in FIG. 13 showing a fifth embodiment of the high-frequency airtight module according to the present invention.

FIG. 15 is a perspective view from the B5 direction in FIG. 14 showing a fifth embodiment of the high-frequency airtight module according to the present invention.

FIG. 16 is a C5 view in FIG. 13 showing a fifth embodiment of the high-frequency hermetic module according to the present invention.

FIG. 17 is a plan view of a high frequency airtight module according to a sixth embodiment of the present invention.

FIG. 18 is a sectional view taken along line A6-A6 in FIG. 17, showing a sixth embodiment of the high-frequency hermetic module according to the present invention.

FIG. 19 is a perspective view from the B6 direction in FIG. 18 showing the sixth embodiment of the high-frequency airtight module according to the present invention.

FIG. 20 is a plan view of a high frequency airtight module according to a seventh embodiment of the present invention.

FIG. 21 is a sectional view taken along the line A7-A7 in FIG. 20, showing a high frequency airtight module according to a seventh embodiment of the present invention.

22 is a perspective view from the B7 direction in FIG. 21 showing the embodiment 7 of the high-frequency airtight module according to the present invention. FIG.

FIG. 23 is a plan perspective view of a conventional high-frequency airtight module.

FIG. 24 is a view showing a conventional high-frequency hermetic module.
9 is a cross-sectional view taken along line A8-A8 in FIG.

FIG. 25 is a view showing a conventional high-frequency hermetic module.
It is a B8 view in.

[Explanation of symbols]

1 conductor frame, 2 ground conductor, 3 high frequency integrated circuit board, 4 bias terminal, 5 brazing material, 6 conductor wire,
7 airtight cover, 8 conductor base, 9 input / output feedthrough substrate, 10 input / output pattern, 11 dielectric block, 12 bias feedthrough substrate, 13 bias pattern, 14 high frequency integrated circuit input / output terminal,
15 base substrate, 16 module input / output microstrip line, 17 open stub, 18 coupling hole, 19 high frequency integrated circuit input / output microstrip line, 20 high frequency circuit part, 21 bias airtight through terminal, 22 ground terminal, 23 through Hall, 2
4 center conductor of coplanar line, 25 ground conductor of coplanar line, 26 rectangular waveguide for input / output, 27 waveguide-microstrip conversion substrate, 28 microstrip line for probe, 29 waveguide impedance transformer, 30
Reinforcement frame, 31 Reinforcement structure base substrate.

Claims (7)

[Claims] 1. A conductor frame, a base substrate made of a dielectric material or a semiconductor, a module input / output microstrip line formed on one surface of the base substrate, and a module input / output microstrip line. An open stub, a ground conductor having a coupling hole formed on the other surface of the base substrate, a high frequency integrated circuit board made of a dielectric or a semiconductor, and a high frequency provided on one surface of the high frequency integrated circuit board. An integrated circuit input / output microstrip line, an open stub connected to the high frequency integrated circuit input / output microstrip line, a high frequency circuit unit connected to the high frequency integrated circuit input / output microstrip line, and the high frequency integrated circuit A bypass provided on the same surface as the input / output microstrip line of the high frequency integrated circuit on the circuit board. An ass terminal, a ground conductor having a coupling hole formed on the other surface of the high frequency integrated circuit board, a brazing material for bonding the conductor frame and the ground conductor of the base board, the base board and the high frequency integrated circuit. A brazing material for aligning the positions of the coupling holes of the circuit board and bonding the ground conductors together, a bias airtight through terminal, and a conductor wire for connecting the bias terminal and the bias airtight through terminal of the high frequency integrated circuit board. A high-frequency airtight module, comprising: an airtight cover brazed or welded to the conductor frame. 2. A conductor frame, a base substrate made of a dielectric or a semiconductor, a module input / output microstrip line formed on one surface of the base substrate, and connected to the module input / output microstrip line. An open stub, a ground conductor having a coupling hole formed on the other surface of the base substrate, ground terminals provided on both sides of the module input / output microstrip line, the ground terminal and the ground conductor. Through holes to be connected, a high frequency integrated circuit board made of a dielectric or a semiconductor, a high frequency integrated circuit input / output microstrip line provided on one surface of the high frequency integrated circuit board, and the high frequency integrated circuit input / output microstrip line. The open stub connected to the strip line and the above-mentioned high-frequency integrated circuit input / output microstub A high frequency circuit portion connected to the trip line, a bias terminal provided in the same manner as the high frequency integrated circuit input / output microstrip line of the high frequency integrated circuit board, and formed on the other surface of the high frequency integrated circuit board. A ground conductor having a coupling hole, a brazing material for bonding the conductor frame and the ground conductor of the base substrate, and a position of the coupling holes of the base substrate and the high frequency integrated circuit substrate are aligned and the ground conductor is bonded. A brazing material to be matched, a bias airtight through terminal, a conductor wire connecting the bias terminal and the bias airtight through terminal of the high frequency integrated circuit board, and an airtight cover brazed or welded to the conductor frame. A high-frequency airtight module characterized in that 3. A conductor frame, a base substrate made of a dielectric or semiconductor, a module input / output microstrip line formed on one surface of the base substrate, and a module input / output microstrip line connected to the module input / output microstrip line. An open stub, a ground conductor having a coupling hole formed on the other surface of the base substrate, a coplanar line center conductor connected to the module input / output microstrip line, and both sides of the coplanar line center conductor. A coplanar line ground conductor provided, a through hole connecting the coplanar line ground conductor and the ground conductor, a high-frequency integrated circuit board made of a dielectric material or a semiconductor, and provided on one surface of the high-frequency integrated circuit board. High frequency integrated circuit input / output microstrip line and the above high frequency integrated circuit input / output microstrip line The open stub connected to the lip line, the high frequency circuit section connected to the high frequency integrated circuit input / output microstrip line, and the high frequency integrated circuit input / output microstrip line of the high frequency integrated circuit board are provided in the same manner. A bias terminal, a ground conductor having a coupling hole formed on the other surface of the high frequency integrated circuit board, a brazing material for bonding the conductor frame and the ground conductor of the base board, the base board and the high frequency wave. A brazing material for aligning the positions of the coupling holes of the integrated circuit board and bonding the ground conductors together, a bias airtight through terminal, and a conductor wire for connecting the bias terminal and the bias airtight through terminal of the high frequency integrated circuit board. When,
A high frequency hermetic module comprising an airtight cover brazed or welded to the conductor frame. 4. A conductor frame, an input / output rectangular waveguide provided on the conductor frame, a base substrate made of a dielectric or semiconductor, and a module input / output formed on one surface of the base substrate. A microstrip line, an open stub connected to the module input / output microstrip line, a ground conductor having a coupling hole formed on the other surface of the base substrate, and a waveguide made of a dielectric or semiconductor. A microstrip conversion substrate; a microstrip line formed on one surface of the waveguide-microstrip conversion substrate; a ground conductor formed on the other surface of the waveguide-microstrip conversion substrate; Body or semiconductor high-frequency integrated circuit board, and high-frequency integrated circuit input / output microstrip provided on one surface of the high-frequency integrated circuit board A trip line, an open stub connected to the high frequency integrated circuit input / output microstrip line, a high frequency circuit unit connected to the high frequency integrated circuit input / output microstrip line, and the high frequency integrated circuit of the high frequency integrated circuit substrate. Bias terminals provided on the same surface as the circuit input / output microstrip line, ground conductors having coupling holes formed on the other surface of the high-frequency integrated circuit board, the conductor frame, the base board, and the waveguide. A brazing material for bonding the ground conductor of the tube-microstrip conversion substrate, a brazing material for bonding the conductor frame and the ground conductor of the base substrate, and the coupling holes of the base substrate and the high-frequency integrated circuit substrate. A brazing material that aligns the positions and bonds the ground conductors together, a bias airtight through terminal, and the conductor A conductor wire connecting the microstrip line of the tube-microstrip conversion substrate and the module input / output microstrip line of the base substrate, and a conductor connecting the bias terminal and the bias airtight through terminal of the high frequency integrated circuit board. A high-frequency airtight module comprising a wire and an airtight cover brazed or welded to the conductor frame. 5. A conductor frame, an input / output rectangular waveguide provided on the dielectric frame, a waveguide impedance transformer provided on the conductor frame, and a base substrate made of a dielectric or a semiconductor. A module input / output microstrip line formed on one surface of the base substrate, an open stub connected to the module input / output microstrip line, and a coupling hole formed on the other surface of the base substrate. A high frequency integrated circuit board made of a dielectric or a semiconductor, a high frequency integrated circuit input / output microstrip line provided on one surface of the high frequency integrated circuit board, and the high frequency integrated circuit input / output micro An open stub connected to the strip line and a high frequency connected to the microstrip line for input / output of the high frequency integrated circuit. A ground wave circuit section, a bias terminal provided on the same surface of the high frequency integrated circuit board as the high frequency integrated circuit input / output microstrip line, and a coupling hole formed on the other surface of the high frequency integrated circuit board. A conductor, a brazing material for bonding the conductor frame and the ground conductor of the base substrate, and a brazing material for bonding the ground conductors by aligning the positions of the coupling holes of the base substrate and the high-frequency integrated circuit board, A bias airtight through terminal, a conductor wire for connecting the waveguide impedance transformer and the module input / output microstrip line of the base substrate, the bias terminal of the high frequency integrated circuit substrate, and the bias airtight through terminal. It consists of a conductor wire to be connected and an airtight cover brazed or welded to the conductor frame. High-frequency air-tight module to butterflies. 6. A conductor frame, a base substrate made of a dielectric or a semiconductor, a module input / output microstrip line formed on one surface of the base substrate, and connected to the module input / output microstrip line. An open stub, a ground conductor having a coupling hole formed on the other surface of the base substrate, a high frequency integrated circuit board made of a dielectric or a semiconductor, and a high frequency provided on one surface of the high frequency integrated circuit board. An integrated circuit input / output microstrip line, an open stub connected to the high frequency integrated circuit input / output microstrip line, a high frequency circuit unit connected to the high frequency integrated circuit input / output microstrip line, and the high frequency integrated circuit A bypass provided on the same surface as the input / output microstrip line of the high frequency integrated circuit on the circuit board. An ass terminal, a ground conductor having a coupling hole formed on the other surface of the high frequency integrated circuit board, a brazing material for bonding the conductor frame and the ground conductor of the base board, the base board and the high frequency integrated circuit. A brazing material for aligning the positions of the coupling holes of the circuit board and bonding the ground conductors together, a bias airtight through terminal, and a conductor wire for connecting the bias terminal and the bias airtight through terminal of the long-term high-frequency integrated circuit board. A metal attached to the surface of the base substrate having the module input / output microstrip line so as not to cover the open / stub connected to the input / output microstrip line and the module input / output microstrip line, Reinforcing frame made of dielectric or resin and brazing to the conductor frame Other high frequency hermetic module, characterized in that is constituted by an airtight cover which is welded. 7. A conductor frame, a reinforcing structure base substrate having a ridge for reinforcement on one surface and made of a dielectric or a semiconductor, and a ridge-free portion of the ridge surface of the reinforcing structure base substrate. A formed module input / output microstrip line, an open stub connected to the module input / output microstrip line, a ground conductor having a coupling hole formed on the other surface of the reinforcing structure base substrate, and a dielectric A high-frequency integrated circuit board composed of a body or a semiconductor, a high-frequency integrated circuit input / output microstrip line provided on one surface of the high-frequency integrated circuit board, and an open circuit connected to the high-frequency integrated circuit input / output microstrip line A stub, a high-frequency circuit section connected to the high-frequency integrated circuit input / output microstrip line, and the high-frequency integrated circuit. A bias terminal provided on the same surface of the high-frequency integrated circuit input / output microstrip line of the path substrate, a ground conductor having a coupling hole formed on the other surface of the high-frequency integrated circuit board, the conductor frame, and A brazing material for adhering the ground conductor of the reinforcing structure base substrate, a brazing material for adhering the bonding holes of the reinforcing structure base substrate and the high frequency integrated circuit substrate to each other, and an airtight penetration for bias. Terminals,
A high-frequency hermetic module comprising a conductor wire connecting the bias terminal of the high-frequency integrated circuit board and a bias airtight through-terminal, and an airtight cover brazed or welded to the conductor frame.