JPH09129935A - Light emitting diode and light emitting diode lamp - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the heat radiating property of a light emitting element so as to prevent the deterioration of the light emitting output of the element by forming a translucent material so that the thickness of the material becomes thinner on at least one side of a radiating surface side which is the upper surface side of leads and a reflecting surface side which is the lower surface side of the leads. SOLUTION: The thin section 13a of a translucent material 13 is formed by shaving off a radiating surface 15 on the side from which lead 12a are led out. When a heat radiating plate 16 is fitted to the thin section 13a, the plate 16 can be brought closer to a light emitting element 11 which generates heat and the leads 12a to which the heat generated from the element 11 is transmitted. Therefore, the heat generated from the element 11 can be radiated sufficiently and the deterioration of the light emitting output of the element 11 can be prevented. The other leads 12b can also prevent the deterioration of the light emitting output of the element 11, because the leads 12a also sufficiently radiate the heat in the same way as the leads 12a do.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a light emitting diode,
In particular, the present invention relates to a light emitting diode used as a light source for reading and a light source for erasing related to OA equipment.

[0002]

2. Description of the Related Art A conventional light emitting diode lamp will be described with reference to the drawings. 12 is a schematic front view of a conventional light emitting diode lamp, FIG. 13 is a schematic sectional view of the light emitting diode lamp shown in FIG.
FIG. 3 is a schematic sectional view of the light emitting diode lamp shown in FIG.

A conventional light emitting diode lamp 7 is shown in FIG.
As shown in FIG. 14, a plurality of light emitting elements 71 arranged in a line with the light emitting surfaces facing the same direction, and the light emitting elements 71 provided so as to correspond to each of the plurality of light emitting elements 71.
Of a plurality of leads 72a, 72b for supplying electric power to the
A light-transmissive material 73, a cylindrical reflecting surface 74 having a central axis in the arrangement direction of the plurality of light emitting elements 71, and a radiation surface 75 provided on the back side of the plurality of light emitting elements 71. .
Each light emitting element 71 is mounted on the corresponding lead 72a via a conductive adhesive (not shown). Further, each light emitting element 71 is electrically connected to the corresponding lead 72b by a wire (not shown). As shown in FIG. 12, the plurality of pairs of leads 72a and 72b are alternately drawn out toward both side surfaces of the light transmissive material 73. The plurality of light emitting elements 71 and the tips of the plurality of pairs of leads 72a and 72b are integrally sealed with a light transmissive material 73. The reflecting surface 74 and the emitting surface 75 are formed on the surface of the light transmissive material 73.

A conventional light emitting diode lamp 7 having the above structure
Emits a substantially total luminous flux of the light emitted from the plurality of light emitting elements 71 at the columnar reflecting surface 74 and radiates it forward from the emitting surface 75. According to the conventional light emitting diode lamp 7 having the above-described configuration, the light emitting direction is controlled by the columnar reflecting surface 74, so that the light emitted by the light emitting element is spot-shaped (here, a line having a narrow line width). The light-collecting efficiency can be improved when the light is condensed in the shape of. Therefore, a high irradiation light quantity density can be obtained. A so-called lens-type light-emitting diode lamp that controls the emission direction of light with a lens surface provided on the light-emitting surface side of the light-emitting element can also collect light emitted from the light-emitting element in a spot shape. The efficiency is low, and thus a high irradiation light density cannot be obtained.

[0005]

However, in the conventional light emitting diode lamp 7 having the above-described structure, the heat generated from the plurality of light emitting elements 71 arranged in a row causes the light emitting output of each light emitting element 71 to decrease, There is a problem that the life is shortened. Further, in the conventional light emitting diode lamp 7 having the above configuration, there is a problem that a part of the light reflected by the reflecting surface 74 is blocked by the plurality of leads 72a, 72b, and the irradiation light amount density becomes uneven. Therefore, it is difficult to use the conventional light emitting diode lamp 7 having the above-mentioned configuration as a reading light source for OA equipment.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a light emitting diode and a light emitting diode lamp which have good heat dissipation, no reduction in light emission output, and good life characteristics. Is. It is another object of the present invention to provide a light emitting diode having less unevenness in the irradiation light amount density and a light emitting diode lamp most suitable as a linear light source.

[0007]

In order to achieve the above object, a light emitting diode according to the present invention is a light emitting element, a lead for supplying electric power to the light emitting element, a part of the lead and the light emitting element. The element is sealed and a reflecting surface for reflecting the light emitted by the light emitting element is formed on the side facing the light emitting surface of the light emitting element, and is reflected by the reflecting surface on the back side of the light emitting element. A light-transmitting material having a radiation surface for radiating light to the outside, wherein the light-transmitting material is at least one of a radiation surface side which is an upper surface side of the lead and a reflection surface side which is a lower surface side. Is formed to have a thin shape.

The light emitting diode according to the invention of claim 2 is
The invention according to claim 1 is characterized in that the lead-out direction is one direction. According to a third aspect of the present invention, in the light emitting diode according to the first or second aspect, the heat dissipation plate is attached so as to come into contact with the thin-walled portion of the light transmissive material. It is a feature.

According to a fourth aspect of the present invention, there is provided a light emitting diode lamp comprising a plurality of light emitting elements arranged in a line, a plurality of leads for supplying electric power to the light emitting element, a part of the leads and the light emitting element. A sealing surface is formed on the side facing the light emitting surface of the light emitting element so as to reflect the light emitted by the light emitting element, and the reflection surface is reflected on the back side of the light emitting element. A light-transmitting material formed with a radiation surface for radiating light to the outside, the light-transmitting material being at least one of the radiation surface side being the upper surface side and the reflection surface side being the lower surface side of the lead. One of them is formed to be thin and the lead-out direction is one direction.

According to a fifth aspect of the present invention, in the light emitting diode lamp according to the fourth aspect of the invention, the heat dissipation plate is attached so as to abut on the thin-walled portion of the light transmissive material. It is characterized by that. A light emitting diode lamp according to a sixth aspect of the present invention is the light emitting diode lamp according to the fourth or fifth aspect, wherein the light-transmissive material on the reflection surface side that is the lower surface side of the lead is formed in a thin shape, and It is characterized in that the step portion between the thin portion and the thin portion is formed into a mirror surface.

A light emitting diode according to a seventh aspect of the invention is
When viewed from the front, a concave reflecting surface having a shape in which nearly half is cut out, a light emitting element arranged so that a light emitting surface faces the concave reflecting surface, and the light emitting element has a tip portion. Mounted on the, the lead drawn out in the notched direction of the concave reflection surface, the emission surface arranged on the back side of the light emitting element, the light emitting element and the tip of the lead. It is characterized in that it is provided with a light-transmissive material that is sealed and is filled between the concave reflection surface and the emission surface.

A light emitting diode according to the invention of claim 8 is
The invention according to claim 7 is characterized in that a heat radiating plate is attached to the extracted lead through an electrically insulating member. A light emitting diode according to a ninth aspect of the present invention is the light emitting diode according to the seventh aspect, wherein the light transmissive material on the reflection surface side which is the lower surface side of the lead is formed in a thin shape.
In addition, the stepped portion between the reflection surface and the thin-walled portion is formed into a mirror surface.

According to a tenth aspect of the present invention, in a light emitting diode lamp, when viewed from the front, the light emitting surface and the columnar reflecting surface having a shape in which nearly half is cut out along the central axis in the longitudinal direction. A plurality of light emitting elements arranged so as to face the columnar reflecting surface, and the light emitting elements are mounted on the tip end, and are drawn out in the cutout direction of the columnar reflecting surface. A plurality of leads, a radiation surface arranged on the back surface side of the light emitting element, and a sealing between the light emitting element and the tip of the lead, and between the columnar reflecting surface and the radiation surface. And a light-transmissive material filled therein.

According to an eleventh aspect of the present invention, in the light emitting diode lamp according to the tenth aspect of the invention, a heat radiating plate is attached to the lead out through an electrically insulating member. . A light emitting diode lamp according to a twelfth aspect of the present invention is the light emitting diode lamp according to the tenth aspect or the eleventh aspect of the present invention, wherein the light transmissive material has a mirror-shaped side surface on the side from which the lead is drawn out. It is what

[0015]

The function that the upper surface side of the lead is formed to be thin means that only the light-transmissive material on the upper surface in the vicinity of the lead is partially thinned, so that the side where the lead is pulled out is almost the same. This is meant to include forming the entire light-emitting diode such that approximately half of the light-emitting diode is thin when viewed from the front. Further, in order to form the light-transmitting material on the upper surface side of the lead to be thin, the light-transmitting material may be formed to be thin after forming the reflecting surface. You may form so that it may become thin shape when forming. A reflective surface may or may not be formed on the thin portion.

The same applies to "the lead is formed so that the lower surface side is thin". The reflecting surface means that the cross-sectional shape is formed in a concave shape such as a parabolic shape or an elliptical shape, and includes a concave reflecting surface and a columnar reflecting surface.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a first embodiment of the present invention will be described with reference to the drawings. 1 is a schematic front view of a light emitting diode lamp according to a first embodiment of the present invention, FIG.
1 is a schematic cross-sectional view of the light emitting diode lamp shown in FIG. 1 taken along the line CC, and FIG. 3 is D of the light emitting diode lamp shown in FIG.
FIG. 6 is a schematic cross-sectional view taken in the direction of the arrow D.

The light emitting diode lamp 1 of the first embodiment
As shown in FIGS. 1 to 3, the plurality of light emitting elements 11 arranged in a line with the light emitting surface facing the same direction, and the light emitting elements provided so as to correspond to each of the plurality of light emitting elements 11. A plurality of pairs of leads 12a, 1 for supplying electric power to 11
2b, a light-transmissive material 13, a cylindrical reflecting surface 14 having a central axis in the arrangement direction of the plurality of light emitting elements 11, a radiation surface 15 provided on the back side of the plurality of light emitting elements 11, A heat dissipation plate 16 such as a heat sink having a thickness of about 3 mm.

Each light emitting element 11 has a corresponding lead 12a.
It is placed on top of it with a conductive adhesive (not shown).
Further, each light emitting element 11 is electrically connected to the corresponding lead 12b by a wire (not shown). As shown in FIG. 1, the plurality of pairs of leads 12a and 12b are in the same side surface direction of the light transmissive material 13 (rightward direction in FIG. 1).
Have been pulled out. The plurality of light emitting elements 11 and a part of the plurality of leads 12a, 12b are made of the light transmissive material 1
It is integrally sealed by 3. The reflecting surface 14 and the emitting surface 15 are formed on the surface of the light transmissive material 13. Further, as shown in FIG. 2, the light transmissive material 13 is formed with a thin portion 13a by scraping off the side of the radiation surface 15 from which the leads 12a and 12b are pulled out. The thickness of the thin portion 13a (the thickness between the surface of the light transmissive material 13 and the upper surfaces of the leads 12a and 12b) is about 0.1.
It is 0.2 mm. The heat dissipation plate 16 is attached on the thin portion 13a. The shape of the heat dissipation plate 16 is not limited to that shown in FIGS.

In the light emitting diode 1 having the above structure, the light emitted from the plurality of light emitting elements 11 is reflected by the reflection surface 14 having a columnar shape and is emitted forward from the emission surface 15. According to the first embodiment of the present invention, the emission direction of light is controlled by the reflecting surface 14 having a columnar shape, so that the light emitted by the light emitting element is spot-shaped (here, linear with a narrow line width). When the light is focused on, the light collection efficiency can be increased. Therefore, a high irradiation light quantity density can be obtained. A lens-type light-emitting diode lamp that controls the emission direction of light with a lens surface provided on the light-emitting surface side of the light-emitting element can also collect light emitted from the light-emitting element in a spot shape, but the light-collecting efficiency is low and high. Irradiation light quantity density cannot be obtained.

Further, according to the first embodiment of the present invention, the thin portion 13 of the light transmissive material 13 is formed by scraping off the side of the radiation surface 15 from which the leads 12a and 12b are pulled out.
By forming a and mounting the heat sink 16 on the thin portion 13a, the light emitting element 11 using the heat sink 16 as a heat source is formed.
In addition, the leads 12a and 12b to which the heat of the light emitting element 11 is transferred can be brought close to each other. Thereby, the heat generated by the light emitting element 11 can be sufficiently dissipated, the light emission output of the light emitting element 11 can be prevented from being lowered by the heat, and the life of the light emitting element 11 can be extended. Light-transmissive material 13
Is an insulating material, so that even if the heat dissipation plate 16 is a conductive material, problems such as electrical shorting of the leads 12a and 12b do not occur.

Further, according to the first embodiment of the present invention,
While pulling out the plurality of pairs of leads 12a and 12b in one direction (rightward in FIG. 1), the leads 12 on the radiation surface 15
Since the side from which a and 12b are pulled out is scraped off and the heat dissipation plate 16 is attached thereto, light is emitted to the outside from the side from which the leads 12a and 12b of the light transmissive material 13 are pulled out. Not done. Therefore, it is possible to prevent unevenness in the irradiation light amount density, and thus it can be used as a reading light source related to OA equipment, for example. In addition, the width of the leads 12a and 12b can be increased without affecting the irradiation light amount density,
This can improve the thermal conductivity of the leads 12a and 12b.

Next, a second embodiment of the present invention will be described with reference to the drawings. FIG. 4 is a schematic front view of a light emitting diode lamp according to a second embodiment of the present invention, and FIG. 5 is a schematic sectional view of the light emitting diode lamp shown in FIG. The schematic sectional view of the light emitting diode lamp shown in FIG. 4 taken in the direction of arrow F-F is the same as the schematic sectional view of the first embodiment shown in FIG. Further, in the second embodiment, those having the same functions as those of the first embodiment are designated by the same reference numerals or corresponding reference numerals,
A detailed description thereof will be omitted.

The light emitting diode lamp 2 according to the second embodiment differs from that according to the first embodiment in that, as shown in FIGS. 4 and 5, the heat dissipation plate 16 is attached to the reflecting surface 1 of the light transmissive material 13.
It was installed on the 4 side. The light transmissive material 13 includes
As shown in FIG. 5, the leads 12 a, 12 b of the reflecting surface 14
The thin-walled part 1
3b is formed, and the heat sink 1 is formed on the thin portion 13b.
6 is attached.

In the light emitting diode lamp 2 having the above structure, the light emitted from the plurality of light emitting elements 11 is reflected by the reflection surface 14 having a columnar shape and is emitted forward from the emission surface 15. According to the second embodiment of the present invention, the thin portion 13b of the light transmissive material 13 is formed by scraping off the side of the reflecting surface 14 from which the leads 12a and 12b are drawn out, and on the thin portion 13b. By attaching the heat dissipation plate 16, the heat dissipation plate 16 can be brought close to the light emitting element 11 serving as a heat source and the leads 12a and 12b through which the heat of the light emitting element 11 is transmitted. Thereby, the heat generated by the light emitting element 11 can be sufficiently dissipated, the light emission output of the light emitting element 11 can be prevented from being lowered by the heat, and the life of the light emitting element 11 can be extended.

According to the second embodiment of the present invention, a plurality of leads 12a, 12b are pulled out in one direction (rightward in FIG. 1), and at the same time, the leads 12a,
Since the heat radiation plate 16 is attached to the side from which the lead 12b is pulled out, the light is not emitted to the outside from the side from which the leads 12a and 12b of the light transmissive material 13 are pulled out. Therefore, it is possible to prevent unevenness in the irradiation light amount density. Other effects are the same as those of the first embodiment.

In the second embodiment of the present invention, the side surface of the thin portion 13b, that is, the reflecting surface 14 and the thin portion 13b.
You may make it form the 2nd reflective surface in the step part 13c formed between and. Thereby, the light emitted from the light emitting element 11 and reaching the step portion 13c can be reflected and radiated to the outside through the reflecting surface 14, so that the light amount of the light emitting diode lamp can be increased.

Further, in FIG. 2 showing the first embodiment and FIG. 5 showing the second embodiment, the heat dissipation plate 16 is formed up to a position excluding the vicinity of the tips of the leads on which the light emitting elements are mounted. However, the heat dissipation plate 16 may be formed up to the position near the tip of the lead. Next, a third embodiment of the present invention will be described with reference to the drawings.

FIG. 6 is a schematic front view of a light emitting diode lamp according to a third embodiment of the present invention, and FIG. 7 is a schematic sectional view of the light emitting diode lamp shown in FIG.
The schematic sectional view of the light emitting diode lamp shown in FIG. 6 taken in the direction of arrow HH is the same as the schematic sectional view of the first embodiment shown in FIG. Further, in the third embodiment, components having the same functions as those of the first embodiment are designated by the same reference numerals or corresponding reference numerals, and detailed description thereof will be omitted.

The light emitting diode lamp 3 of the third embodiment is different from that of the first embodiment in that as shown in FIGS. 6 and 7, the leads 12a and 12b of the light transmissive material 13 are used.
The lead 1 by cutting off the side from which
2a and 12b are sealed with a light-transmissive material 13 at their tips, and the insulating member 1 is provided on the exposed portions of the plurality of leads 12a and 12b.
That is, the heat radiation plate 16 is attached via the 7. The cylindrical reflecting surface 14 and the emitting surface 15 have a shape in which nearly half of the reflecting surface 14 and the emitting surface 15 are cut out along the central axis in the longitudinal direction when viewed from the front. Further, the light emitting element 11 is arranged such that its light emitting surface faces the top of the reflecting surface 14 having a columnar shape. In the example shown in FIGS. 6 and 7, the heat dissipation plate 16 is attached to the reflection surface 14 side, but the heat dissipation plate 1 is attached to the radiation surface 15 side.
6 may be attached. Also, the lead 12
Instead of interposing the insulating member 17 between the a and 12b and the heat dissipation plate 16, the surface of the leads 12a and 12b or the heat dissipation plate 16 may be subjected to insulation processing.

In the light emitting diode lamp 3 having the above structure, the light emitted by the plurality of light emitting elements 11 is reflected by the reflecting surface 14 having a columnar shape and then radiated forward from the emitting surface 15. According to the third embodiment of the present invention, the reflection surface 14 in the form of a pillar is shaped such that approximately half is cut away along the central axis in the longitudinal direction when viewed from the front, and the tips of the leads 12a, 12b are formed. And a plurality of pairs of leads 12a,
By attaching the heat dissipation plate 16 to the exposed portion of 12b via the insulating member 17, the light emitting element 11 serving as a heat source for the heat dissipation plate 16 and the leads 12a, 12 through which the heat of the light emitting element 11 is transmitted.
It can be close to b. Thereby, the light emitting element 1
1 sufficiently dissipates the heat generated by 1
It is possible to prevent a decrease in the light emission output of, and to extend the life of the light emitting element 11.

Further, according to the third embodiment of the present invention, when the reflection surface 14 in the form of a pillar is cut from the front surface thereof, approximately half is cut out along the central axis in the longitudinal direction, and the lead is formed. By extracting 12a and 12b from the cutout direction of the reflecting surface 14, the light reflected by the reflecting surface 14 can be emitted to the outside without being blocked by the leads 12a and 12b. As a result, it is possible to prevent unevenness in the irradiation light amount density. Other effects are the same as those of the first embodiment.

Incidentally, in the third embodiment of the present invention, the stepped portion 13d of the portion where the light transmitting material 13 is cut out.
Alternatively, the second reflecting surface may be formed. Thereby, the light emitted from the light emitting element 11 and reaching the step portion 13d can be reflected and radiated to the outside through the reflecting surface 14, so that the light amount of the light emitting diode lamp can be increased. Further, in FIG. 7, since the light emitting element needs to be filled with the light transmissive material 13, the heat dissipation plate 16 needs to be kept at a position other than the vicinity of the tip of the lead on which the light emitting element is mounted. is there.

Next, a fourth embodiment of the present invention will be described with reference to the drawings. FIG. 8 is a schematic front view of a light emitting diode according to a fourth embodiment of the present invention, and FIG. 9 is a schematic cross sectional view of the light emitting diode shown in FIG. As shown in FIG. 8 and FIG. 9, the light emitting diode 4 of the fourth embodiment includes a light emitting element 41, a pair of leads 42a and 42b for supplying electric power to the light emitting element 41, a light transmissive material 43, and a light emitting material 43. A straight surface that passes through the center of the element 41 and is axisymmetric and has a concave reflecting surface 44 that has a center axis of a line that is perpendicular to the light emitting surface of the light emitting element 41 and a radiation surface 45 provided on the back side of the light emitting element 41.
And a heat dissipation plate 46 such as a heat sink having a thickness of about 3 mm.

The light emitting element 41 is mounted on the lead 42a via a conductive adhesive (not shown), and a wire (not shown).
Is electrically connected to the lead 42b. As shown in FIG. 8, the leads 42a and 42b are made of the light-transmissive material 4
3 toward the side surface 3 in the same direction (downward direction in FIG. 8). The light emitting element 11 and a part of the leads 42a and 42b are integrally sealed with a light transmissive material 43. The reflecting surface 44 and the emitting surface 45 are formed on the surface of the light transmissive material 43. In addition, the light transmissive material 43 includes
As shown in FIG. 9, the leads 42a and 42b of the radiation surface 45 are formed.
The thin part 4 by scraping off the side from which
3a is formed, and the heat dissipation plate 4 is formed on the thin portion 43a.
6 is attached. The shape of the heat dissipation plate 46 is not limited to that shown in FIGS. 8 and 9.

In the light emitting diode 4 having the above-described structure, substantially the entire luminous flux of the light emitted by the light emitting element 41 is reflected by the axisymmetric reflecting surface 44 and is emitted forward from the emitting surface 45. According to the fourth embodiment of the present invention, the emission direction of light is controlled by the axisymmetric reflecting surface 44, so that the light emitted from the light emitting element is condensed into a spot shape (here, a small circle shape). At times, the light collection efficiency can be increased. Therefore, a high irradiation light quantity density can be obtained.

Further, according to the fourth embodiment of the present invention, the thin portion 43 of the light transmissive material 43 is formed by scraping off the side of the radiation surface 45 from which the leads 42a and 42b are drawn out.
By forming a and mounting the heat dissipation plate 46 on the thin portion 43a, the light emitting element 41 that uses the heat dissipation plate 46 as a heat source.
In addition, the leads 42a and 42b through which the heat of the light emitting element 41 is transmitted can be brought close to each other. This makes it possible to sufficiently dissipate the heat generated by the light emitting element 41, prevent the light emitting output of the light emitting element 41 from being lowered by the heat, and extend the life of the light emitting element 41. The present embodiment is most suitable for a large power consumption device such as an infrared light emitting diode used for a remote controller or the like.

Further, according to the fourth embodiment of the present invention,
The leads 42a and 42b are pulled out in one direction, and the side of the radiation surface 45 from which the leads 42a and 42b are pulled out is scraped off. , 42b is not radiated to the outside from the side where it is pulled out.
Therefore, it is possible to prevent the unevenness of the irradiation light amount density due to the leads 42a and 42b. Further, the widths of the leads 42a and 42b can be widened without affecting the irradiation light quantity density, and thus the thermal conductivity of the leads 42a and 42b can be improved.

In the fourth embodiment of the present invention, the heat dissipation plate 4
6 has been described as being attached to the radiation surface 45 side, but the present invention is not limited to this. For example, as in the second embodiment shown in FIGS. 4 and 5, the side of the reflecting surface 44 from which the leads 42a and 42b are drawn may be shaved off, and the heat dissipation plate 46 may be attached thereto. Further, similar to the third embodiment shown in FIGS. 6 and 7, the reflection surface 44 has a shape in which approximately half is cut out when viewed from the front, and the heat dissipation plate 46 is provided on the exposed leads 42a and 42b. It may be attached.

Also, in the fourth embodiment, the two leads 4
2A and 42b are drawn in one direction (downward in FIG. 8), the present invention is not limited to this, and one of the two leads 42a and 42b is the same as in FIG. It may be pulled out in the direction. Further, a plurality of light-emitting diodes which are the left and right ends (K portion in FIG. 8) of the fourth embodiment are cut, and a plurality of the light-emitting diodes are arranged in a line so that the cut portions contact each other. It may be used as a linear light source.

The present invention is not limited to the above-described embodiments, but various modifications can be made within the scope of the gist thereof. For example, in each of the above-described embodiments, the case where the heat dissipation plate is attached has been described, but the present invention is not limited to this. Even if the heat sink is not attached, by reducing the thickness of the light-transmitting material near the light emitting element and the lead, the heat generated by the light emitting element is sufficiently radiated, and the light emission output of the light emitting element is generated by the heat. It is possible to prevent the deterioration and to extend the life of the light emitting device.

Further, it is not necessary to form the thin portion on the entire surface of the light-transmitting material on the emitting surface side and / or the reflecting surface side on which the leads are drawn out. For example, like the light emitting diode 4a shown in FIGS. 10 and 11, the leads 42a, 42 are provided on the radiation surface 45 side of the light transmissive material 43.
The thin portion 43b may be formed only in the portion located above b. In addition, in FIG. 10 and FIG.
Instead of forming the thin-walled portion 43b, the thin-walled portion may be formed only on the portion of the light-transmissive material 43 that is located below the leads 42a and 42b on the reflective surface 44 side.

[0043]

As described above, according to the first aspect of the present invention, according to the above-mentioned structure, one of the radiation surface side which is the upper surface side and the reflection surface side which is the lower surface side of the lead of the light transmissive material. By forming at least one of the thin-walled, it is possible to sufficiently dissipate the heat generated by the light-emitting element, thereby preventing the emission output of the light-emitting element from decreasing due to heat, Further, it is possible to provide a light emitting diode capable of extending the life of the light emitting element.

According to the invention described in claim 4, at least one of the radiation surface side which is the upper surface side and the reflection surface side which is the lower surface side of the lead of the light transmissive material is thin-walled by the above construction. With this structure, the heat generated by the light emitting element can be sufficiently dissipated, which can prevent the light emitting output of the light emitting element from being lowered by heat, and also prolong the life of the light emitting element. It is possible to provide a light emitting diode lamp capable of

According to the invention described in claim 7, with the above construction, the lead is drawn out in the direction in which the concave reflecting surface is cut out, so that the light is externally emitted from the side where the lead is drawn out. Therefore, in addition to the effect of the invention described in claim 1, it is possible to provide a light emitting diode capable of preventing the unevenness of the irradiation light quantity density. According to the invention of claim 10, with the above configuration, the plurality of leads are drawn out in the notched direction of the columnar reflection surface, so that from the side where the plurality of leads are drawn, Therefore, in addition to the effect of the invention described in claim 4, it is possible to provide a light emitting diode lamp capable of preventing unevenness of the irradiation light quantity density.

[Brief description of the drawings]

FIG. 1 is a schematic front view of a light emitting diode lamp according to a first embodiment of the present invention.

FIG. 2 is a schematic sectional view of the light emitting diode lamp shown in FIG.

3 is a schematic sectional view of the light emitting diode lamp shown in FIG.

FIG. 4 is a schematic front view of a light emitting diode lamp according to a second embodiment of the present invention.

5 is a schematic sectional view of the light emitting diode lamp shown in FIG.

FIG. 6 is a schematic front view of a light emitting diode lamp according to a third embodiment of the present invention.

7 is a schematic sectional view of the light emitting diode lamp shown in FIG.

FIG. 8 is a schematic front view of a light emitting diode lamp according to a fourth embodiment of the present invention.

9 is a schematic sectional view of the light emitting diode lamp shown in FIG.

FIG. 10 is a schematic front view of a light emitting diode which is a modified example of the fourth embodiment of the present invention.

11 is a schematic cross-sectional view of the light emitting diode shown in FIG.

FIG. 12 is a schematic front view of a conventional light emitting diode lamp.

FIG. 13 is an AA of the light emitting diode lamp shown in FIG.
It is a schematic sectional drawing in the arrow direction.

14 is a sectional view taken along line BB of the light emitting diode lamp shown in FIG.
It is a schematic sectional drawing in the arrow direction.

[Explanation of symbols]

 1,2,3 Light emitting diode lamp 4,4a Light emitting diode 11,41 Light emitting element 12a, 12b, 42a, 42b Lead 13,43 Light transmissive material 13a, 13b, 43a, 43b Thin portion 13c, 13d Step portion 14, 44 Reflective surface 15,45 Radiating surface 16,46 Heat sink 17 Insulation member

Claims (12)

[Claims] 1. A light emitting element, a lead for supplying electric power to the light emitting element, a part of the lead and the light emitting element are sealed, and the light emitting element is provided on a side facing a light emitting surface of the light emitting element. A light-transmitting material having a reflecting surface for reflecting the light emitted by the light emitting element, and a radiation surface for radiating the light reflected by the reflecting surface to the outside on the back side of the light emitting element. The light-transmitting material is formed so that at least one of a radiation surface side which is an upper surface side and a reflection surface side which is a lower surface side of the lead has a thin shape. 2. The light emitting diode according to claim 1, wherein the lead-out direction is one direction. 3. The light emitting diode according to claim 1, wherein a heat radiating plate is attached so as to come into contact with a thin-walled portion of the light transmissive material. 4. A plurality of light emitting elements arranged in a line, a plurality of leads for supplying electric power to the light emitting elements, a part of the leads and the light emitting element are sealed, and the light emitting element emits light. A columnar reflecting surface that reflects the light emitted by the light emitting element is formed on the side facing the surface, and a radiation surface that radiates the light reflected by the reflecting surface to the outside is formed on the back side of the light emitting element. The light-transmitting material is formed such that at least one of the radiation surface side, which is the upper surface side of the lead, and the reflection surface side, which is the lower surface side, is thin. The light emitting diode lamp is characterized in that the lead-out direction is one direction. 5. The light emitting diode lamp according to claim 4, wherein a heat radiating plate is attached so as to come into contact with a thin-walled portion of the light transmissive material. 6. The light transmissive material on the reflection surface side, which is the lower surface side of the lead, is formed in a thin shape, and the step portion between the reflection surface and the thin portion is formed in a mirror surface shape. It is formed, The light emitting diode lamp of Claim 4 or 5 characterized by the above-mentioned. 7. A concave reflecting surface having a shape in which nearly half is cut out when viewed from the front, a light emitting element arranged such that a light emitting surface faces the concave reflecting surface, The light emitting element is mounted on the tip portion, the lead is drawn out in the cutout direction of the concave reflecting surface, the emitting surface is disposed on the back side of the light emitting element, the light emitting element and the lead. And a light-transmissive material filled between the concave reflection surface and the radiation surface, the light-emitting diode being sealed. 8. A heat dissipation plate is attached to the extracted lead via an electrically insulating member.
A light-emitting diode as described. 9. The light-transmissive material on the reflection surface side, which is the lower surface side of the lead, is formed in a thin shape, and the step portion between the reflection surface and the thin portion is formed in a mirror surface shape. The light emitting diode according to claim 7, wherein the light emitting diode is formed. 10. A cylindrical reflecting surface having a shape in which approximately half is cut away along a central axis in the longitudinal direction when viewed from the front, and a light emitting surface faces the cylindrical reflecting surface. A plurality of light-emitting elements arranged in such a manner that the light-emitting element is mounted on the tip portion, a plurality of leads that are drawn out in the cutout direction of the columnar reflecting surface, and the back surface of the light-emitting element A light-transmitting material filled between the emission surface arranged on the side, the light-emitting element and the tip of the lead, and between the reflection surface and the emission surface in the form of a pillar. A light-emitting diode lamp, comprising: 11. The light emitting diode lamp according to claim 10, wherein a heat radiating plate is attached to the lead out through an electrically insulating member. 12. The light emitting diode lamp according to claim 10, wherein the light transmissive material has a mirror-shaped side surface on the side from which the lead is drawn out.