JPH09129773A - Method of manufacturing circuit board having dam frames - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of forming a circuit board having dam frames capable of mounting dam frames on the circuit board with high precision by removing the step of holding many dam frames to thereby improve productivity and by preventing misalignment of the dam frames which takes place when adopting the method. SOLUTION: A circuit board manufacturing method comprises a step of forming a dam substrate 7 by forming a dam frame 6 surrounded by an inner ring slit 4 and an outer ring slit 5 on a dam frame processing substrate 2 of a processing substrate 3 consisting of a sheet 1 having adhesive on one surface and the dam frame processing substrate 2 temporarily bonded to another surface, the step of positioning the dam frame 6 of the dam substrate 7 and a circuit board 8 within a frame of the dam frame 6 by a circuit of the circuit board 8 and press-bonding the dam frame 5 to the circuit board 8 by a press machine 10, and the step of peeling off an outer plate 11 formed by the outer ring slit 5 of the dam substrate 7 and an inner plate 12 formed by the inner ring slit 4 thereof.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a circuit board having a dam frame, and more specifically, a circuit board having a large number of independent circuits formed on an insulating plate and surrounding each circuit of the circuit board. Regarding a manufacturing method of a circuit board having a dam frame configured with a dam frame, a circuit board obtained by this manufacturing method includes, for example, an electronic component mounted on a circuit in the dam frame, and the electronic component It is used by being sealed with a resin to shield it from the outside air.

[0002]

2. Description of the Related Art An example of a conventional method for producing a circuit board having a dam frame will be described. A dam frame obtained by molding is held by a plate holding a large number of the dam frames, and a large number of independent plates are provided through the plate. There is known a method of manufacturing a circuit board having a circuit of 1) by applying pressure with an adhesive. According to this method, it took a considerable amount of time to hold a large number of dam frames on the plate, and this step was rate-determining.

[0003]

SUMMARY OF THE INVENTION In view of the above-mentioned circumstances, the object of the present invention is to eliminate the step of holding a large number of dam frames on a plate to improve the industrial productivity, and at the same time to adopt this manufacturing method. The present invention provides a method for manufacturing a circuit board having a dam frame, which allows the dam frame to be attached to the circuit board with high accuracy by eliminating the displacement of the dam frame.

[0004]

According to the method for manufacturing a circuit board provided with a dam frame according to claim 1 of the present invention, a sheet 1 having adhesiveness on one surface and a dam frame processing temporarily adhered to the other surface of the sheet 1 Dam frame of processed substrate 3 composed of substrate 2 Dam frame 6 surrounded from inside and outside by inner ring slit 4 and outer ring slit 5 is formed on processed substrate 2 to form dam substrate 7, and dam frame 6 of this dam substrate 7 and circuit board 8 and 8 are positioned in the frame of the dam frame 6 by the circuit 9 of the circuit board 8 and pressure-bonded by using the press machine 10, and further, the drain plate 11 formed by the outer ring slit 5 of the dam substrate 7 and Since a large number of dam frames 6 are temporarily adhered to the sheet 1 including the step of removing the inner discard plate 12 formed by the inner ring slits 4, the dam frame 6 is fixed to a predetermined position on the plate as before, as before. No more man-hours for aligning and holding, moreover press machine Dam frame 6 of the dam substrate 7 by using the 0
When the circuit 9 of the circuit board 8 is positioned in the frame of the dam frame 6 and pressure-bonded, the adhesive surface of the sheet 1 is temporarily fixed to the press plate of the press machine 10, so that the circuit is The board 8 does not move with respect to the circuit 9 and therefore can be attached to the circuit board 8 without displacement of the dam frame 6.

[0005]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be specifically described below with reference to the drawings.

1 to 4 show processing states of respective steps constituting a method for manufacturing a circuit board having a dam frame according to an embodiment of the present invention, and FIG. 2 is a perspective view of the processing substrate.

In FIG. 2, the processed substrate 3 is composed of a sheet 1 having adhesiveness on one surface and a dam frame processed substrate 2 temporarily adhered to the other surface of the sheet 1. The adhesiveness of the sheet 1 can be imparted by impregnating glass paper, pulp paper, or a plastic sheet with an adhesive, or can be applied. An example of a commercially available product as the sheet 1 is NO. 3 manufactured by Three M Co., which uses a rubber-based adhesive. No. 214, 3MNE (trade name), or Nitto Denko's NO. 3194
M-S, NO. 3195M-S, NO. 3198M-S
Etc. can be used. Further, the sheet 1 may be constructed by layering these onto a glass-based, pulp-based, or plastic-based sheet that is a base plate. As the dam frame processed substrate 2 temporarily attached to the other surface of the sheet 1, a laminated plate having an electrically insulating property is used. This laminated plate has, for example, a glass-based or pulp-based paper as a base material, and this base material is impregnated with a curable resin such as phenol resin, epoxy resin, unsaturated polyester resin, imide resin, vinyl ester resin, or polycarbonate resin. Plastic boards obtained by further curing prepregs are suitable, but not limited to these boards. here,
The temporary adhesion of the dam frame processed substrate 2 adhered to the sheet 1 means an adhesive state in which the dam frame processed substrate 2 can be separated from the sheet 1.

FIG. 3 is a perspective view of a dam substrate obtained by cutting the processed substrate 3 shown in FIG. 2 with a router or the like.
In the figure, this dam substrate 7 has an outer ring slit 5 extending over both surfaces and a inner ring slit 4 formed inside the outer ring slit 5 by a router on the dam frame processed substrate 2 of the processed substrate 3, and the outer ring slit 5 and the inner ring slit 4 form the outer ring slit 5 and the inner ring slit 4. A large number of enclosed dam frames 6 are arranged vertically and horizontally, and an outer drain plate 11 formed by the outer ring slit 5 of the dam substrate 7 and an inner drain plate 12 formed by the inner ring slit 4 are further provided.

Therefore, since a large number of dam frames 6 are temporarily adhered to the sheet 1, the man-hours for aligning and holding the dam frame 6 at a predetermined position on the plate as in the past are not required.

The plane shapes of the outer ring slit 5 and the inner ring slit 4 are generally rectangular as shown in the figure, but the shapes are arbitrary as a matter of design choice. The slit width of the outer ring slit 5 and the inner ring slit 4 is
The outer frame 11 and the inner frame 1 with the dam frame 6 left on the sheet 1.
It suffices to provide a gap that allows 2 to be removed from the sheet 1, and this gap has a deep relationship with the thickness of the dam frame processing substrate 3. That is, the slit width tends to increase as the thickness of the dam frame processed substrate 3 increases.

FIG. 4 is a front view showing a state in which the dam frame 6 is attached to the circuit board using the dam substrate 7 shown in FIG. 3 by using a press machine. In the figure, for example, an epoxy adhesive is applied to the surface of the dam frame 6 of the dam substrate 7 temporarily adhered to the sheet 1 to form an adhesive layer, and the adhesive layer is placed on the circuit board 8 to be pressed 14 And Here, the circuit board 8 is provided with a large number of independent circuits 9 which are formed by etching the above-mentioned laminated plate on which copper foil is stretched and are aligned vertically and horizontally. Therefore, the circuit 9 of the circuit board 8 is positioned in the frame of the dam frame 6 of the dam substrate 7 to form the body 14 to be pressed. Then, the body to be pressed 14 is placed in the press machine (10), and if necessary, heated and pressed from above and below to bond the dam frame 6 to the circuit board 8.
In this case, using the press machine 10, the dam frame 6 of the dam substrate 7
When the circuit 9 of the circuit board 8 is positioned in the frame of the dam frame 6 and pressure-bonded, the adhesive surface of the sheet 1 is temporarily fixed to the press board 13 of the press machine 10, The circuit board 8 does not move with respect to the circuit 9 and therefore can be attached to the circuit board 8 without displacement of the dam frame 6.

FIG. 1 is a perspective view of a circuit board having a dam frame which is the object of the present invention. In the figure, the circuit board provided with the dam frame through the steps so far is such that the dam frame 6 adhered to the circuit board 8 is left on the circuit board 8 and the outer discard plate 11 and the inner discard plate 12 are removed from the circuit board 8. Obtained by desorption. The circuit board provided with this dam frame is useful as a circuit board on which electronic parts are mounted by cutting along the cutting line formed between the dam frames 6 attached to each circuit 9 of the circuit board 8. Become.

[0013]

According to the method of manufacturing a circuit board having a dam frame of the present invention, the step of holding a large number of dam frames on the plate is eliminated to improve the industrial productivity, and at the same time, the dam frame generated when this manufacturing method is adopted. The dam frame can be attached to the circuit board with high accuracy by eliminating the displacement.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an example of a circuit board provided with a dam frame which is an object of the present invention.

FIG. 2 is a perspective view of a processed substrate, showing one step that constitutes a manufacturing method of a circuit board provided with a dam frame according to an embodiment of the present invention.

FIG. 3 is a perspective view of a dam substrate, showing one step that constitutes a manufacturing method of a circuit board provided with a dam frame according to an embodiment of the present invention.

FIG. 4 is a front view showing one step constituting a method of manufacturing a circuit board provided with a dam frame according to an embodiment of the present invention, showing a state in which the dam frame is attached to the circuit board by using a press machine.

[Explanation of symbols]

 1 sheet 2 dam frame processed substrate 3 processed substrate 4 inner ring slit 5 outer ring slit 6 dam frame 7 dam substrate 8 circuit board 9 circuit 10 press machine 11 outer discard plate 12 inner discard plate

Claims (1)

[Claims] 1. A dam frame processed substrate (2) of a processed substrate (3) comprising a sheet (1) having adhesiveness on one surface and a dam frame processed substrate (2) temporarily adhered to the other surface of the sheet (1). )
A dam frame (6) surrounded by the inner ring slit (4) and the outer ring slit (5) from the inside and outside is formed as a dam substrate (7), and the dam frame (6) and the circuit board (7) of the dam substrate (7) are formed. 8)
The circuit (9) of the circuit board (8) is positioned within the frame of the dam frame (6) and pressure-bonded with the press machine (10),
Furthermore, it is possible to separate the outer discard plate (11) formed of the outer ring slit (5) and the inner discard plate (12) formed of the inner ring slit (4) of the dam substrate (7) from the circuit board (8). A method of manufacturing a circuit board with a characteristic dam frame.