JPH09129484A - Method and device for manufacture of laminated ceramic electronic part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make it possible to efficiently advance the process of manufacture of a carrier film and the lamination, etc., of a ceramic green sheet when a mother laminated body, with which a plurality of chips for a laminated ceramic electronic part are taken out, is manufactured using the ceramic green sheet which is retained on the carrier film. SOLUTION: A ceramic green sheet 7, which is formed in a manner that an internal circuit element 10 is distributed on a plurality of places while a carrier film 6 is being stripped off by the guiding of a stripping roll 4, is wound on a heated take-up roll 3. The distribution pitch of the internal circuit element 10 is gradually changed taking into consideration of the increase in diameter of the wound ceramic green sheet 7. When a mother laminated body 16, provided with the ceramic green sheet 7 of prescribed number of layers, is obtained, it is removed from the take-up roll 3, extended in plane form and cut, and a plurality of chips are obtained.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for manufacturing a laminated ceramic electronic component, and more particularly, a ceramic green sheet laminated so as to form a mother laminated body for a plurality of laminated ceramic electronic components. Prepared while being held on the carrier film,
The present invention relates to a method for manufacturing a laminated ceramic electronic component, which includes a step of laminating ceramic green sheets while peeling off the carrier film from the ceramic green sheets, and a manufacturing apparatus used for carrying out this method.

[0002]

2. Description of the Related Art Electronic parts such as capacitors, filters, resistors, inductors and varistors are provided as monolithic ceramic electronic parts. When manufacturing such a laminated ceramic electronic component, a plurality of ceramic green sheets are prepared, and these ceramic green sheets are laminated to manufacture a mother laminated body. On a predetermined ceramic green sheet to be laminated, internal circuit elements of appropriate materials and patterns are formed in advance according to the function of the laminated ceramic electronic component to be obtained. The mother laminate is then cut to obtain multiple chips for individual monolithic ceramic electronic components. These chips are then fired, and external electrodes and the like are formed on the surface of the chips as necessary.

In such a monolithic ceramic electronic component, in order to realize miniaturization and high performance, the ceramic green sheet is being made thinner and multilayered. When thinning the ceramic green sheet, it is necessary to consider that the ceramic green sheet is mechanically weak, and in order to prevent its damage,
The ceramic green sheet is formed on a carrier film, and while being held by the carrier film, the ceramic green sheet is handled so as to carry out subsequent steps such as printing of internal circuit elements.

[0004]

As described above, the thin and soft ceramic green sheet is handled in some steps while being held by the carrier film, but at the latest, it is laminated and mother laminated. The carrier film must be peeled from the ceramic green sheet during the body-building stage.

Therefore, in order to produce a mother laminate, after printing the internal circuit elements, the steps of peeling the carrier film and laminating the ceramic green sheets must be repeated. In addition, the ceramic green sheets may be pressed while being heated each time they are laminated. However, as the number of layers of the ceramic green sheet increases, the number of times these steps are repeated increases, and it takes a long time to obtain a mother laminate. Although it is desired to improve the efficiency of these steps, it is not so easy to satisfy this demand because these steps cannot be performed in parallel and must be performed sequentially and intermittently.

Therefore, an object of the present invention is to provide a method and an apparatus for manufacturing a monolithic ceramic electronic component which can satisfy the above-mentioned demand for streamlining the process for manufacturing a mother laminated body.

[0007]

In order to solve the above-mentioned technical problems, a method for manufacturing a monolithic ceramic electronic component according to the present invention is held on a carrier film and has internal circuit elements formed on one main surface thereof. A ceramic green sheet prepared by removing the carrier film from the ceramic green sheet while winding the ceramic green sheet on a winding roll, and a mother laminate including a predetermined number of layers of the ceramic green sheet on the winding roll. After the body is formed, the step of removing the mother laminate from the winding roll, and obtaining the plurality of chips for individual laminated ceramic electronic components from the mother laminate,
And a step of cutting the mother laminated body.

In the present invention, preferably, the winding step is a step of heating the ceramic green sheet,
And pressing the ceramic green sheet on the winding roll. In order to solve the above-mentioned technical problems, a manufacturing apparatus for a monolithic ceramic electronic component according to the present invention supplies a ceramic green sheet that is held on a carrier film and has internal circuit elements formed on one main surface thereof. And a winding roll that rotates to wind the ceramic green sheet supplied from the supply unit, and a peeling roll that rotates while guiding to peel the carrier film from the ceramic green sheet wound on the winding roll. Is characterized by.

[0009] Preferably, the winding roll includes a heat generating element for heating the ceramic green sheet. Further, preferably, the peeling roll is arranged so as to exert a pressing action on the ceramic green sheet on the winding roll.

[0010]

In order to manufacture a mother laminate, conventionally, a ceramic green sheet on which internal circuit elements are printed is prepared in advance, and a ceramic green sheet having a predetermined size is laminated while peeling the carrier film. On the other hand, in the present invention, a ceramic green sheet on which internal circuit elements are printed is prepared in advance, and while the carrier film is being peeled off, the ceramic green sheet is wound around a winding roll to be laminated.

Therefore, according to the present invention, first, the ceramic green sheets can be continuously stacked, so that the stacking process can be performed efficiently or speedily. Therefore, it is possible to reduce the thickness and the number of layers of the ceramic green sheet, and to efficiently manufacture a miniaturized and high-performance monolithic ceramic electronic component at high speed.

As described above, in the step of winding the ceramic green sheet on the winding roll included in the manufacturing method according to the present invention, the ceramic green sheet is heated and the ceramic green sheet on the winding roll is pressed. Then, the adhesion between the respective portions of the ceramic green sheet on the winding roll is increased, and it is possible to advantageously prevent the positional deviation and the peeling between the respective portions of the ceramic green sheet in the subsequent steps.

The above-described advantages are as follows. In the manufacturing apparatus according to the present invention, the winding roll is provided with the heat generating element, and the peeling roll is arranged so as to exert a pressing action on the ceramic green sheet on the winding roll. It can be played effectively.

[0014]

1 is a front view showing a monolithic ceramic electronic component manufacturing apparatus 1 according to an embodiment of the present invention. 2 is an enlarged view of a portion II surrounded by a broken line in FIG. 1, and FIG. 3 is an enlarged view of a portion III of the same. As shown in FIG. 1, the manufacturing apparatus 1 is, roughly speaking, a supply unit 2
And a winding roll 3, a peeling roll 4, and a recovery unit 5.

As shown in FIG. 2, the supply unit 2 supplies the ceramic green sheet 7 held on the carrier film 6, so that the supply unit 2 has a long length composed of the carrier film 6 and the ceramic green sheet 7. A supply roll 9 around which the composite sheet body 8 is wound is provided. The ceramic green sheet 7 is formed by molding a ceramic slurry on the carrier film 6 by a doctor blade method or the like. The composite sheet body 8 is wound around the supply roll 9 so that the ceramic green sheet 7 is located outside.

The above-mentioned ceramic green sheet 7 includes
On the other hand, the internal circuit elements 10 are formed by printing, for example, distributed in a plurality of locations on the main surface. Internal circuit element 10
Is formed of an appropriate material and in an appropriate pattern according to the function of the monolithic ceramic electronic component to be obtained. In FIG. 2, the internal circuit element 10 is formed on the main surface facing the outside of the ceramic green sheet 7, but it may be formed on the main surface in contact with the carrier film 6.

Such a composite sheet body 8 is pulled out from the feeding section 2 as shown by an arrow 11, and then fed between the winding roll 3 and the peeling roll 4. Winding roll 3
Rotates in the direction indicated by arrow 12, and the peeling roll 4 rotates in the direction indicated by arrow 13. Of the composite sheet body 8, the ceramic green sheet 7 on which the internal circuit elements 10 are formed is located on the winding roll 3 side and is wound around the winding roll 3 as the winding roll 3 rotates.

On the other hand, the carrier film 6 is located on the side of the peeling roll 4, is guided so as to be peeled from the ceramic green sheet 7 according to the rotation of the peeling roll 4, and reaches the collecting portion 5 as shown by an arrow 14. Sent.
The recovery unit 5 includes a recovery roll 15 that winds up the used carrier film 6. The carrier film 6 thus collected may be reused. When the used carrier film 6 is simply discarded, it is not necessary to take it up on the recovery roll 15.

The winding roll 3 is provided with a heating element (not shown) for heating the ceramic green sheet 7 to a temperature of about 80 ° C., for example. Also, the peeling roll 4
Are arranged so as to exert a pressing action on the ceramic green sheet 7 on the winding roll 3. In this way, the adhesion between the layers of the laminated ceramic green sheets 7 on the winding roll 3 is enhanced.

The heat generating element is the winding roll 3
It may be provided in a place other than. Alternatively, the ceramic green sheet 7 on the winding roll 3 may be pressed by a roll other than the peeling roll 4. The distribution pitch of the internal circuit elements 10 formed on the ceramic green sheet 7 is the ceramic green sheet 7 wound on the winding roll 3.
The diameter is gradually changed in consideration of the change in the diameter of the peripheral surface. That is, even if the diameter of the peripheral surface of the ceramic green sheet 7 increases as the number of layers of the ceramic green sheet 7 on the winding roll 3 increases, as shown in FIG.
The internal circuit element 10 is arranged so that it can be aligned in the stacking direction without displacement in the circumferential direction.
The distribution pitch on the ceramic green sheet 7 is set.

In this way, after the mother laminate 16 having the predetermined number of layers of the ceramic green sheets 7 is formed on the winding roll 3, the mother laminate 16 is removed from the winding roll 3. At the time of this removal, a part of the cylindrical mother laminated body 16 is cut.
It should be noted that the mother laminated body 16 shown in FIGS.
In reality, it should be understood that the ceramic green sheet 7 has not yet reached the predetermined number of layers.

Mother laminate 1 removed as described above
6 is extended in a plane. At this time, the winding roll 3
If you choose a relatively large diameter, the mother laminate 16
Is not so distorted, and therefore, the displacement or distortion of the internal circuit element 10 is hardly generated. The planar laminated mother laminate 16 is then pressed in the laminating direction and corresponds to the position indicated by the arrow 17 in FIG. 3 in order to obtain a plurality of chips for individual laminated ceramic electronic components. It is cut at the position where you want to. These chips are then fired, and then subjected to a step of forming external electrodes and the like, if necessary, to obtain a desired monolithic ceramic electronic component.

The manufacturing apparatus 1 shown in FIG. 1 was applied to manufacture a monolithic ceramic capacitor. A ceramic green sheet 7 having a thickness of 10 μm obtained by molding the ceramic slurry on the carrier film 6 was used. While peeling off the carrier film 6, this ceramic green sheet 7
Was wound on a winding roll 3 heated to 80 ° C.
As the wrapping roll 3, one having a diameter of 600 mm is used.
Winding was performed at a winding speed of m / min. The winding speed could be increased to 12 m / min.

In the first step of winding, the ceramic green sheet 7 having no internal electrode as the internal circuit element 10 was used to form the outer layer portion having no internal electrode. Then, in the second stage, the internal circuit element 1
By using the ceramic green sheet 7 having the internal electrode as 0, the inner layer portion having the internal electrode was formed. Here, the distribution pitch of the internal electrodes formed on the ceramic green sheet 7 may be gradually changed in consideration of the change in the diameter of the peripheral surface of the ceramic green sheet 7 wound on the winding roll 3. Set. That is,
The distribution pitch of the internal electrodes is the ceramic green sheet 7
Should be increased by 2π × (thickness of the ceramic green sheet 7) for each winding of the winding roll 3. Here, such a distribution pitch is corrected so as to be changed every time the winding roll 3 rotates by 60 degrees.

Further, in the final stage, the ceramic green sheet 7 on which the internal electrode as the internal circuit element 10 is not formed is used again, and another internal electrode does not exist.
Two outer layer parts were formed. In the mother laminated body 16 thus obtained, the positional deviation of the internal electrodes was investigated, and it was found that the maximum was 60.
It was only μm, which was not inferior to the method of the prior art. In addition, the winding speed of 5 m / min described above is
It is significantly faster than the stacking speed of the prior art.

In the experimental example described above, the ceramic green sheet on which the internal electrodes are not formed, the ceramic green sheet on which the internal electrodes are formed, and the ceramic green sheet on which the internal electrodes are not formed are wound in this order on the winding roll. The green sheets were replaced, but without such replacement, in the series of ceramic green sheets, the area where internal electrodes were not formed, the area where internal electrodes were formed, and the area where internal electrodes were not formed were long in this order. Those distributed in the vertical direction may be used.

[Brief description of the drawings]

FIG. 1 is a front view showing an apparatus 1 for manufacturing a monolithic ceramic electronic component according to an embodiment of the present invention.

FIG. 2 is an enlarged view of a portion II surrounded by a broken line in FIG.

FIG. 3 is an enlarged view of a portion III surrounded by a broken line in FIG.

[Explanation of symbols]

 1 Manufacturing Equipment 2 Supply Section 3 Winding Roll 4 Peeling Roll 6 Carrier Film 7 Ceramic Green Sheet 10 Internal Circuit Element 16 Mother Laminate

Claims (5)

[Claims] 1. A ceramic green sheet held on a carrier film and having internal circuit elements formed on one main surface thereof is prepared, and the ceramic green sheet is wound while peeling the carrier film from the ceramic green sheet. Winding on a roll, after forming a mother laminate including the ceramic green sheet of a predetermined number of layers on the winding roll, the mother laminate is removed from the winding roll, individual from the mother laminate. A method of manufacturing a monolithic ceramic electronic component, comprising the steps of cutting the mother laminate to obtain a plurality of chips for the monolithic ceramic electronic component. 2. The laminated ceramic electronic component according to claim 1, wherein the winding step includes a step of heating the ceramic green sheet and a step of pressing the ceramic green sheet on the winding roll. Production method. 3. A supply section for supplying a ceramic green sheet held on a carrier film and having internal circuit elements formed on one main surface thereof, and a rotation for winding the ceramic green sheet supplied from the supply section. And a peeling roll that rotates while guiding the carrier film to peel from the ceramic green sheet wound on the winding roll. 4. The apparatus for manufacturing a monolithic ceramic electronic component according to claim 3, wherein the winding roll includes a heating element for heating the ceramic green sheet. 5. The apparatus for manufacturing a laminated ceramic electronic component according to claim 3, wherein the peeling roll is arranged so as to exert a pressing action on the ceramic green sheet on the winding roll.