JPH09129047A - Forming method for transparent electroconductive pattern - Google Patents
Forming method for transparent electroconductive patternInfo
- Publication number
- JPH09129047A JPH09129047A JP7288485A JP28848595A JPH09129047A JP H09129047 A JPH09129047 A JP H09129047A JP 7288485 A JP7288485 A JP 7288485A JP 28848595 A JP28848595 A JP 28848595A JP H09129047 A JPH09129047 A JP H09129047A
- Authority
- JP
- Japan
- Prior art keywords
- transparent conductive
- adhesive
- conductive film
- pattern
- transparent electroconductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Photovoltaic Devices (AREA)
- Manufacturing Of Electric Cables (AREA)
- Liquid Crystal (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Weting (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、平面ディスプレ
イ、透明タッチパネル、太陽電池等に使用される透明電
極や混成回路基板における抵抗等として用いられる透明
導電パターンの形成方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a transparent conductive pattern used for a flat display, a transparent touch panel, a solar cell or the like, a transparent conductive pattern used as a resistance in a hybrid circuit board, or the like.
【０００２】[0002]
【従来の技術】従来、基材上への金属酸化物の薄膜より
なる透明導電パターン形成は、真空蒸着やスパッタリン
グで基材上に透明導電性の薄膜を形成し、その薄膜を塩
酸、硝酸、フッ酸等の強酸による湿式エッチングするこ
とで行っている。2. Description of the Related Art Conventionally, a transparent conductive pattern formed of a thin film of a metal oxide on a substrate is formed by forming a transparent conductive thin film on the substrate by vacuum vapor deposition or sputtering, and then forming the thin film with hydrochloric acid, nitric acid, It is performed by wet etching with a strong acid such as hydrofluoric acid.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、上記の
ように強酸を用いてエッチングする方法の場合、そのエ
ッチング液の管理や取り扱い、さらには、エッチング廃
液の処理に手間がかかるという基本的な問題点があっ
た。However, in the case of the method of etching using a strong acid as described above, there is a fundamental problem that it takes time to manage and handle the etching solution and to treat the etching waste solution. was there.
【０００４】このような湿式エッチングを行わない方法
として、特開平２−６１９１６号の発明には、透明導電
膜中にその透明導電膜を形成する金属酸化物以外の金属
を熱処理により拡散形成し、その部分を非導電性とする
ことで相対的に透明導電パターンを形成する方法が提案
されている。As a method of not performing such wet etching, in the invention of JP-A-2-61916, a metal other than the metal oxide forming the transparent conductive film is diffused and formed in the transparent conductive film by heat treatment. A method of forming a relatively transparent conductive pattern by making that portion non-conductive has been proposed.
【０００５】しかしながら上記の拡散による方法によれ
ば、拡散の制御のために高度な技術を要するとともに、
拡散が高温処理によりなされるので耐熱性でない基材は
使用できないという問題点があった。However, according to the above-mentioned diffusion method, a high technique is required to control the diffusion, and
There is a problem in that a substrate that is not heat resistant cannot be used because diffusion is performed by high temperature treatment.
【０００６】この発明は、このような実情に着目してな
されたものであって、一般的な湿式エッチングと同様に
して容易に透明導電パターンが形成できるようにするこ
とを目的とする。The present invention has been made in view of such a situation, and an object thereof is to make it possible to easily form a transparent conductive pattern similarly to general wet etching.
【０００７】[0007]
【課題を解決するための手段】この発明の請求項１記載
の発明では、金属箔面全体に透明導電膜を形成し、前記
透明導電膜面に所望の透明導電パターンに相当する接着
剤よりなるパターンを付設し、前記接着剤よりなるパタ
ーンが付設された前記透明導電膜面に基材を前記接着剤
により接着して固定し、前記金属箔をエッチングにより
除去することで前記接着剤が存在しない部分の前記透明
導電膜部分を一体に除去し、前記基材上に前記接着剤で
固定されて残った前記透明導電膜部分により透明導電パ
ターンを形成することを特徴とする。In the invention according to claim 1 of the present invention, a transparent conductive film is formed on the entire metal foil surface, and an adhesive corresponding to a desired transparent conductive pattern is formed on the transparent conductive film surface. The adhesive is not present by attaching a pattern and fixing the base material to the transparent conductive film surface provided with the pattern of the adhesive by adhering it with the adhesive and removing the metal foil by etching. A part of the transparent conductive film portion is integrally removed, and a transparent conductive pattern is formed by the transparent conductive film portion remaining on the base material after being fixed with the adhesive.
【０００８】上記構成によれば、金属箔をエッチングに
より除去することで透明導電膜の接着剤に保持されない
部分を除去し、これにより、透明導電膜を直接にエッチ
ングすることなく基材上に透明導電パターンが得られ
る。According to the above structure, the metal foil is removed by etching to remove the portion of the transparent conductive film which is not held by the adhesive, and thus the transparent conductive film is transparent on the substrate without being directly etched. A conductive pattern is obtained.
【０００９】とくに、金属箔として耐熱性のものを用
い、透明導電膜の形成をゾル・ゲル法により行う（請求
項２記載の発明）ことで、製造容易、かつ、低コストに
おいて大面積の成膜が行える。In particular, a heat-resistant metal foil is used, and the transparent conductive film is formed by the sol-gel method (invention according to claim 2), so that a large area can be formed easily at low cost. Membrane can be done.
【００１０】[0010]
【発明の実施の形態】この発明の透明導電パターンの形
成方法の各工程を順次説明する。BEST MODE FOR CARRYING OUT THE INVENTION Each step of the method for forming a transparent conductive pattern of the present invention will be sequentially described.
【００１１】［第１の工程］金属箔の表面の洗浄及び不
均一膜の除去を行う。[First Step] The surface of the metal foil is washed and the non-uniform film is removed.
【００１２】金属箔としては耐熱性を有する５０μｍ厚
のアルミニウム箔を用い、このアルミニウム箔の一面側
を固定板に固定し、アルカリ系の洗浄液であるユークリ
ーナ（ＵＡ―６８：上村工業製）５０ｇ／１で５０℃、
５分の洗浄を行ったのち、エッチング剤（ＡＺ―１０
２：上村工業製）５０ｇ／１で６０℃、１分の処理によ
りアルミニウム箔表面の上の不均―酸化膜を除去する。As the metal foil, a heat-resistant aluminum foil having a thickness of 50 μm is used. One side of the aluminum foil is fixed to a fixing plate, and 50 g of Eucleaner (UA-68: Uemura Kogyo) which is an alkaline cleaning solution. 50 degrees Celsius at 1/1
After washing for 5 minutes, the etching agent (AZ-10
(2: manufactured by Uemura Kogyo Co., Ltd.) The disproportionate-oxide film on the surface of the aluminum foil is removed by treatment at 50 g / 1 at 60 ° C. for 1 minute.
【００１３】［第２の工程］上記アルミニウム箔の洗浄
され、不均一酸化膜を除去された面に、透明導電膜を下
記に説明するゾル・ゲル法により形成する。[Second Step] A transparent conductive film is formed on the cleaned surface of the aluminum foil from which the non-uniform oxide film has been removed by the sol-gel method described below.
【００１４】透明導電膜を形成材料としてはスズドープ
酸化インジウム（ＩＴＯ）を用いる。そして、上記アル
ミニウム箔をたとえばＩｎ―（ＯＭｅ）3、Ｓｎ（ＯＥ
ｔ）4、メタノールからなる有機金属化合物溶液中に浸
漬したのち、これを一定速度で引き上げ、空気中での加
水分解させ、その後５５０℃の熱処理による焼成を行
う。そして、この浸漬、加水分解、焼成の過程を複数回
繰り返すことによって、図１に示すように、アルミニウ
ム箔１面に１μｍ厚さの透明導電膜２を形成する。 ［第３の工程］上記透明導電膜２上に接着剤３のパター
ンを形成する。Tin-doped indium oxide (ITO) is used as a material for forming the transparent conductive film. Then, the aluminum foil is applied to, for example, In- (OMe) 3 , Sn (OE
t) 4 , after being immersed in a solution of an organometallic compound consisting of methanol, the solution is pulled up at a constant rate to be hydrolyzed in air, and then baked by heat treatment at 550 ° C. Then, by repeating the steps of dipping, hydrolysis and baking a plurality of times, as shown in FIG. 1, the transparent conductive film 2 having a thickness of 1 μm is formed on the surface of the aluminum foil 1. [Third Step] A pattern of the adhesive 3 is formed on the transparent conductive film 2.
【００１５】この接着剤３のパターンは、まず、たとえ
ば熱硬化性のエポキシアクリルレート系接着剤を２００
メッシュのスクリーンにより所望のパターン形状に印刷
した後、空気中７０℃、１０分の乾燥を経た半硬化状態
で形成される。図２は透明導電膜２上に接着剤３のパタ
ーンが形成された状態を示す。First, for example, a thermosetting epoxy acrylate adhesive is used as a pattern of the adhesive 3.
After printing in a desired pattern shape with a mesh screen, it is dried in air at 70 ° C. for 10 minutes to form a semi-cured state. FIG. 2 shows a state where the pattern of the adhesive 3 is formed on the transparent conductive film 2.
【００１６】［第４の工程］上記接着剤３により透明導
電膜２をポリイミド系の基材４上に接着固定する。上記
接着剤３上に、図３に示すように、ポリイミドフィルム
からなる基材４を重ねて、圧力１０ｋｇ／ｃｍ2の圧力
をかけながら１３０℃、３０分の熱処理を経て、接着剤
３を完全硬化し透明導電膜２をアルミニウム箔１ともに
基材４上に接着固定する。[Fourth Step] The transparent conductive film 2 is adhered and fixed on the polyimide base material 4 by the adhesive 3. As shown in FIG. 3, a base material 4 made of a polyimide film is placed on the adhesive 3 and heat-treated at 130 ° C. for 30 minutes while applying a pressure of 10 kg / cm 2 to completely remove the adhesive 3. The transparent conductive film 2 is hardened and fixed together with the aluminum foil 1 on the substrate 4.
【００１７】［第５の工程］上記のアルミニウム箔１上
に透明導電膜２が形成されるとともに、その透明導電膜
２上に基材４が接着されたものにおいて、アルミニウム
箔１をＦｅＣｌ3溶液等によりエッチングして除去す
る。この除去に際して、図４に示すように、透明導電膜
２の接着剤３により固着された部分のみが基材４上に残
存し、これによりの透明導電パターン形状が基材４上に
得られる。[Fifth Step] In the case where the transparent conductive film 2 is formed on the aluminum foil 1 and the substrate 4 is adhered on the transparent conductive film 2, the aluminum foil 1 is replaced with a FeCl 3 solution. Etc. to remove by etching. At the time of this removal, as shown in FIG. 4, only the portion of the transparent conductive film 2 fixed by the adhesive 3 remains on the base material 4, and the transparent conductive pattern shape is obtained on the base material 4 by this.
【００１８】上記のように、第５の工程において、アル
ミニウム箔１をエッチングにより除去する際に透明導電
膜２の接着剤３に保持されない部分を一体に除去するこ
とで、透明導電膜２を直接にエッチングすることなく透
明導電パターンが得られるようにしている。As described above, in the fifth step, when the aluminum foil 1 is removed by etching, the portion of the transparent conductive film 2 which is not held by the adhesive 3 is integrally removed, so that the transparent conductive film 2 is directly removed. The transparent conductive pattern can be obtained without etching.
【００１９】上記の実施形態においては、耐熱性の金属
箔としてアルミニウム箔１を用いたが、表面にニッケル
メッキを施した銅箔を使用してもよく、透明導電膜２の
材料としては、アンチモンドープ酸化スズ（ＡＴＯ）
や、カドミウム―スズ酸化物や酸化亜鉛系のものを用い
ることもできる。また、接着剤３としては、エポキシ
系、ウレタン系等として多様なものが使用でき、基材４
にも表面を絶縁化した金属板、ガラスエポキシ基板、ガ
ラス、セラミックス等多様な材料が使用できる。Although the aluminum foil 1 is used as the heat-resistant metal foil in the above embodiment, a copper foil having a nickel plated surface may be used, and the material of the transparent conductive film 2 is antimony. Doped tin oxide (ATO)
Alternatively, a cadmium-tin oxide or zinc oxide-based material can be used. As the adhesive 3, various types such as epoxy type and urethane type can be used.
Also, various materials such as a metal plate whose surface is insulated, a glass epoxy substrate, glass and ceramics can be used.
【００２０】また、第２工程での透明導電膜２の形成方
法としては、スプレー法、スパッタリング法等を採用し
てもよいが、上記のようにゾル・ゲル法を採用すること
で下記のような利点が生じる。As the method of forming the transparent conductive film 2 in the second step, a spray method, a sputtering method or the like may be adopted, but by adopting the sol-gel method as described above, There are many advantages.
【００２１】すなわち、ゾル・ゲル法によれば、他の方
法におけるよりも製造容易、かつ、低コストにおいて大
面積の成膜が行える利点がある。通常、このゾル・ゲル
法によって得られる成膜はエッチングによっては除去で
きにくいが、この発明では成膜による透明導電膜２のエ
ッチングは行わないのでゾル・ゲル法が採用できて製造
効率が高められる。そして、ゾル・ゲル法を採用するに
は、上記のようにその成膜工程において５５０℃程度の
高温において焼成する必要があるので、金属箔として耐
熱性のものを用いるものである。That is, the sol-gel method has an advantage that it can be easily manufactured and can form a large-area film at a low cost as compared with other methods. Normally, the film obtained by this sol-gel method is difficult to remove by etching, but since the transparent conductive film 2 is not etched by the film formation in the present invention, the sol-gel method can be adopted and the manufacturing efficiency is improved. . Further, in order to adopt the sol-gel method, it is necessary to bake at a high temperature of about 550 ° C. in the film forming step as described above, so a heat resistant metal foil is used.
【００２２】[0022]
【発明の効果】以上の説明から明らかなように、この発
明によれば、金属箔をエッチングにより除去する際に透
明導電膜の接着剤に保持されない部分を一体に除去する
ことで、透明導電膜を直接にエッチングすることなく透
明導電パターンが得られるので、これにより、一般的な
湿式エッチングと同様にして容易に透明導電パターンが
形成できるようになる。As is apparent from the above description, according to the present invention, when the metal foil is removed by etching, the portion of the transparent conductive film which is not held by the adhesive is integrally removed, and thus the transparent conductive film is formed. Since the transparent conductive pattern can be obtained without directly etching, the transparent conductive pattern can be easily formed in the same manner as general wet etching.
【００２３】とくに、透明導電膜の形成をゾル・ゲル法
により行うことで、製造容易、かつ、低コストにおいて
大面積の成膜が行えるようになって、製造効率が高めら
れ、また、低コストにおける製造が可能となる。In particular, by forming the transparent conductive film by the sol-gel method, it is possible to easily form a film on a large area at a low cost, thereby improving the manufacturing efficiency and reducing the cost. Can be manufactured.
【図１】この発明の実施形態における第２の製造工程を
説明する図FIG. 1 is a diagram illustrating a second manufacturing process in an embodiment of the present invention.
【図２】この発明の実施形態における第３の製造工程を
説明する図FIG. 2 is a diagram illustrating a third manufacturing process in the embodiment of the present invention.
【図３】この発明の実施形態における第４の製造工程を
説明する図FIG. 3 is a diagram illustrating a fourth manufacturing process in the embodiment of the present invention.
【図４】この発明の実施形態における第５の製造工程を
説明する図FIG. 4 is a diagram illustrating a fifth manufacturing process in the embodiment of the present invention.
１ アルミニウム箔（金属箔） ２ 透明導電膜 ３ 接着剤 ４ 基材 1 Aluminum foil (metal foil) 2 Transparent conductive film 3 Adhesive 4 Base material
フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０５Ｋ 3/02 Ｈ０１Ｌ 31/04 Ｍ Continuation of front page (51) Int.Cl. 6 Identification code Office reference number FI Technical display area H05K 3/02 H01L 31/04 M
Claims (2)
接着剤よりなるパターンを付設し、 前記接着剤よりなるパターンが付設された前記透明導電
膜面に基材を前記接着剤により接着して固定し、 前記金属箔をエッチングにより除去することで前記接着
剤が存在しない部分の前記透明導電膜部分を一体に除去
し、前記基材上に前記接着剤で固定されて残った前記透
明導電膜部分により透明導電パターンを形成する、 ことを特徴とする透明導電パターンの形成方法。1. A transparent conductive film is formed on the entire metal foil surface, a pattern made of an adhesive corresponding to a desired transparent conductive pattern is provided on the transparent conductive film surface, and a pattern made of the adhesive is provided. A substrate is adhered and fixed to the transparent conductive film surface with the adhesive, and the transparent conductive film portion where the adhesive is not present is integrally removed by removing the metal foil by etching, A method of forming a transparent conductive pattern, comprising forming a transparent conductive pattern by the transparent conductive film portion which is fixed on the material with the adhesive and remains.
前記透明導電膜の形成をゾル・ゲル法により行うことを
特徴とする請求項１記載の透明導電パターンの形成方
法。2. A heat resistant metal foil is used as the metal foil,
The method for forming a transparent conductive pattern according to claim 1, wherein the transparent conductive film is formed by a sol-gel method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7288485A JPH09129047A (en) | 1995-11-07 | 1995-11-07 | Forming method for transparent electroconductive pattern |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7288485A JPH09129047A (en) | 1995-11-07 | 1995-11-07 | Forming method for transparent electroconductive pattern |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09129047A true JPH09129047A (en) | 1997-05-16 |
Family
ID=17730827
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7288485A Pending JPH09129047A (en) | 1995-11-07 | 1995-11-07 | Forming method for transparent electroconductive pattern |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH09129047A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001228317A (en) * | 2000-02-16 | 2001-08-24 | Kyodo Printing Co Ltd | Method for supporting transparent conductive film with adhesive and layer structure |
| JP2007048564A (en) * | 2005-08-09 | 2007-02-22 | Fujikura Ltd | Manufacturing method of substrate with transparent conductive film |
| US20110279387A1 (en) * | 2010-05-13 | 2011-11-17 | Samsung Electro-Mechanics Co., Ltd. | Transperent Conductive Substrate and Method of Manufacturing the same Touch Screen Using the Same |
-
1995
- 1995-11-07 JP JP7288485A patent/JPH09129047A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001228317A (en) * | 2000-02-16 | 2001-08-24 | Kyodo Printing Co Ltd | Method for supporting transparent conductive film with adhesive and layer structure |
| JP2007048564A (en) * | 2005-08-09 | 2007-02-22 | Fujikura Ltd | Manufacturing method of substrate with transparent conductive film |
| US20110279387A1 (en) * | 2010-05-13 | 2011-11-17 | Samsung Electro-Mechanics Co., Ltd. | Transperent Conductive Substrate and Method of Manufacturing the same Touch Screen Using the Same |
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