JPH09126815A - Package for light emitting/receiving element and encoder employing it - Google Patents

Abstract

PROBLEM TO BE SOLVED: To mount a package on a base board with high accuracy by providing a butting face at a part of package body. SOLUTION: An abutting face 1a is provided in order to perform alignment in the vertical direction at the time of mounting a package body 1 on a board. The package body 1 is mounted with high parallelism and accuracy on a board while suppressing fluctuation of fixing position in the vertical direction using the butting face 1a. When a package 100 is used as a light emitting element package, the mounting face of a light emitting element 3 is set substantially in parallel with the butting face la of package body 1, and a scale disc is irradiated with a luminous flux from the light emitting element 3 through a projection lens 2. When a package 100 is used as a light receiving element package, the mounting face of a light receiving element 3 is set substantially in parallel with the butting face 1a of package body 1, and the light receiving element 3 receives a luminous flux condensed through a light receiving lens 2. An encoder mounts light emitting part and light receiving part each having a butting face 1a and produces a signal including displacement information.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a package for a light emitting / receiving element and an encoder using the same.

[0002]

2. Description of the Related Art Conventionally, encoders (rotary encoders, linear encoders) are often used as devices for detecting rotation information (rotation speed, rotation angle) and movement information (movement speed, movement amount) of a displacement object (moving object). Has been.
In the encoder, the luminous flux from the light source means is applied to the movable scale provided on the object to be measured, and the luminous flux passing through the movable scale of the object to be measured is received by the light receiving means via the fixed scale, whereby the displacement information of the object to be measured is obtained. Are seeking.

The light source means and the light receiving means at this time are housed as a package in one housing and mounted on a base substrate which constitutes an encoder.

FIGS. 9A, 9B and 9C are schematic views when the conventional package 91 is mounted on the base substrate 97. As shown in the figure, the package 91 is mounted such that the soldering leads 92 provided on a part thereof are in direct contact with the copper foil pattern 95 provided on the base substrate 97.

[0005]

Conventionally, when a package for a light emitting / receiving element is mounted on a base substrate,
The soldering leads provided on the package were fixed so as to be in direct contact with the copper foil pattern. Therefore, if there are variations in the size or shape of the soldering leads, for example, as shown in FIG.
As shown in (A), (B), and (C), the package 91 may be inclined and attached to the base substrate 97 in a non-parallel state.

Therefore, when the package is used as a light emitting device package, the luminous flux emitted from the package deviates from the vertical direction, and when the package is used as a light receiving device package, the mounting surface of the light receiving device is the base substrate. There is a problem in that the sensor is tilted and the signal cannot be detected correctly or accurately. Further, there is a problem that a special adjusting mechanism must be provided and adjusted each time in order to mount the package in parallel with the base substrate.

According to the present invention, when a package in which a light emitting element and / or a light receiving element and the like are housed is mounted on a base substrate, there is little variation in the mounting position in the vertical direction on the base substrate, the parallelism is good, and the mounting is highly accurate. It is an object of the present invention to provide a package for a light emitting / receiving element and an encoder using the same.

[0008]

The package for light-emitting / light-receiving element of the present invention comprises: (1-1) mounting the light-emitting element and / or the bottom surface of the housing accommodating the light-receiving element on a base substrate. It is characterized in that it is a vertical contact surface.

In particular, (1-1-1) a soldering lead for the light emitting element and / or the light receiving element is attached to a part of the casing, and the applying surface is for soldering. It is characterized in that it projects more vertically than the leads.

(1-1-2) Soldering leads for the light emitting element and / or the light receiving element are attached to a part of the housing, and the abutting surface is the soldering leads. It is characterized in that it projects more vertically than the stopper portion.

(1-1-3) The abutting surface of the casing and the mounting surface of the light emitting element and / or the light receiving element are substantially parallel to each other (1-1-4) The abutting surface is characterized in that the abutting surface is configured to abut on a dummy copper foil pattern on the base substrate.

The encoder of the present invention has the above-mentioned configuration (1-
1) or any of (1-1-1) to (1-1-4) 1
The feature is that the displacement information of the moving object is detected by using one.

(1-2) A light emitting element, a housing portion accommodating the light emitting element, and a vertical abutting surface provided at the bottom of the housing portion when mounting the housing portion. I am trying.

In particular, (1-2-1) further has a soldering lead for a light emitting element, and the abutting surface projects in the vertical direction from the position where the soldering lead is arranged. -2) Furthermore, it has a soldering lead for a light emitting element with a stopper, and the abutting surface projects vertically from the stopper position of the soldering lead. (1-2-3) The aforesaid The abutting surface and the mounting surface of the light emitting element are configured to be substantially parallel to each other.

(1-3) It has a light receiving element, a housing portion accommodating the light receiving element, and a vertical contact surface provided at the bottom of the housing portion when mounting the housing portion. I am trying.

(1-3-1) Further, it has a soldering lead for the light receiving element, and the abutting surface is projected in the vertical direction from the position where the soldering lead is arranged (1-3-2) ) Further, it has a soldering lead for a light receiving element with a stopper, and the abutting surface is projected in the vertical direction from the stopper position of the soldering lead (1-3-3) The abutting surface And a mounting surface of the light receiving element are configured to be substantially parallel to each other.

The encoder of the present invention comprises (2-1) a light emitting element, a housing portion accommodating the light emitting element, and a vertical abutting surface provided at the bottom of the housing portion when the housing portion is mounted. A light-receiving unit having a light-emitting unit having the same, a light-receiving element, a housing unit accommodating the light-receiving element, and a vertical abutting surface provided at the bottom of the housing unit when mounting the housing unit is mounted, and the light-emitting unit is mounted. It is characterized in that a signal including displacement information is obtained by receiving light from the element through a scale.

The motor provided with the encoder of the present invention is characterized by having the encoder of the constituent requirement (2-1).

[0019]

1 is a side view of essential parts of a first embodiment of a package for a light emitting / receiving element of the present invention. Figure 2
FIG. 3 is a side view of a main part and a plan view of the main part when the package 100 for the light emitting / receiving element of FIG. 1 is mounted on the base substrate 7.

In the figure, 100 is a package for a light emitting / light receiving element. Reference numeral 1 denotes a package body made of resin, ceramics or the like, which houses various elements. Reference numeral 1a is an abutting surface for performing vertical positioning when the package body 1 is mounted on a substrate. 3 is a light emitting element and / or a light receiving element. 2 is an optical component. Reference numeral 4 denotes a soldering lead, which is provided in plural on the side surface of the package body 1 and is connected to the light emitting / receiving element 3, for example. Reference numeral 7 denotes a base substrate, on the surface of which a copper foil pattern 5 for signal lines and a copper foil pattern 6 for dummy are provided. The dummy copper foil pattern 6 is actually unused, and is used to maintain good parallelism between the light emitting / light receiving element package 100 and the base substrate 7.

In this embodiment, for example, the package 1
When the light emitting device package is used as 00, the mounting surface of the light emitting device such as an LED or a semiconductor laser is arranged substantially parallel to the abutting surface 1a of the package body, and the luminous flux from the light emitting device 3 is projected by the projection lens 2 to the scale disk. Is to be irradiated. When the package 100 is used as a light receiving element package, the mounting surface of the light receiving element such as a photodiode is arranged substantially parallel to the abutting surface 1a of the package body 1, and the light receiving element collects the light beam condensed by the light receiving lens 2. To receive light.

The contact surface 1a of the package 100 of the present embodiment with the base substrate 7 projects beyond the soldering leads 4. Then, as shown in FIG. 2, when the package 100 is mounted on the base substrate 7, the contact surface 1 a protruding from the soldering lead 4 is used for the signal line copper foil pattern 5 provided on the base substrate 7 and for the dummy. The copper foil pattern 6 is surely brought into contact with the copper foil pattern 6. Package 1
00 can be mounted on the base substrate 7 so that the vertical variation is small, both are not tilted, and the light emitting element and / or the light receiving element 3 is located at a predetermined position on the base substrate 7. . In the present embodiment, instead of the dummy copper foil pattern, the signal line copper foil pattern may be intentionally widened, and the same effect can be obtained.

FIGS. 4A and 4B respectively show the light emission of the present invention.
It is a principal part side view of Embodiment 2 of the package for light-receiving elements. FIG. 5 shows a package 100 for the light emitting / receiving element of FIG.
FIG. 6 is a side view of a main part when is mounted on a base substrate 7. In the figure, the same elements as those used in the first embodiment of FIGS. 1 to 3 are designated by the same reference numerals.

In the figure, 100 is a lead insertion type package for a light emitting / light receiving element. The abutting surface 1a of the package body 1 is projected more than the soldering lead / stopper portion 4a. When mounting the package 100 on the base substrate 7, as shown in FIG. 5, the abutting surface 1a of the package body 1 contacts the copper foil pattern 5 provided on the base substrate 7 and the copper foil pattern 6 for dummy. ing. Thereby, the same effect as that of the first embodiment is obtained.

FIGS. 6 (A) and 6 (B) respectively show the emission of the present invention.
It is a principal part side view of Embodiment 3 of the package for light-receiving elements. FIG. 7 shows a package 100 for the light emitting / receiving element of FIG.
FIG. 6 is a side view of a main part when is mounted on a base substrate 7. In the figure, the same elements as those used in the second embodiment of FIG. 2 are designated by the same reference numerals.

In the figure, 100 is a lead insertion type package for a light emitting / light receiving element. Reference numeral 61 denotes a soldering lead, and in the present embodiment, it has a configuration in which the soldering lead / stopper portion 4a in Embodiment 2 of FIG. 4 is eliminated, and other configurations are the same as those of Embodiment 2 of FIG. is there. When mounting the package 100 on the base substrate 7, as shown in FIG.
As shown in, the contact surface 1a of the package body 1 contacts the copper foil pattern 5 provided on the baseline 7 and the dummy copper foil pattern 6. Thereby, the same effect as that of the first embodiment is obtained.

FIG. 8 is a cross-sectional view of essential parts when the package for light emitting / receiving elements of the present invention shown in FIG. 1 is applied to a rotary encoder.

In the figure, M is a motor and SH is the rotating shaft of the motor M. Reference numeral 81 is a rotating shaft SH of a casing that constitutes the motor M.
A ring-shaped convex fitting portion provided around the housing 82 is a housing Ha.
It is a fitting part provided in a part of. H is a rotary encoder. Ha is a housing containing each element of the rotary encoder H. D is a scale disc, and a plurality of phase-diffraction diffraction gratings (radial diffraction gratings) composed of a light-transmitting portion and a light-shielding portion in a lattice pattern or a transmissive concave-convex portion are arranged on the circumference of the disk. The individual pieces are arranged radially in a predetermined cycle. Scale disk D is motor M
Is attached to the mounting portion S of the rotating shaft SH.

Reference numeral L denotes a light emitting device package, which has the structure shown in FIG. 1 and is mounted on the base substrate 83 by the method shown in FIG. The light emitting element of the light emitting element package L is composed of, for example, an LED, a semiconductor laser, or the like, and illuminates the scale disk D with a light beam from the light emitting element. The PD is a light-receiving element package having the structure shown in FIG. 1 and mounted on the base substrate 84 by the method shown in FIG. The light receiving element package PD detects the light flux from the light emitting element package L that has passed through the diffraction grating of the scale disk D.

In this embodiment, the phase displacement signal light obtained by the light receiving element package PD is used to detect the rotational displacement information of the scale disk D (rotation axis SH) by a signal processing circuit (not shown).

In this embodiment, the light emitting element package L and the light receiving element package PD are mounted on the base substrates 83 and 84 with high precision in the predetermined height direction by the above-described structure, thereby achieving a high precision encoder. ing.

[0032]

As described above, according to the present invention, when mounting a package in which a light emitting element and / or a light receiving element is housed in a package body on a base substrate, an abutting surface is appropriately provided on a part of the package body. A package for a light-emitting / light-receiving element, which is provided, uses the contact surface, has little variation in the mounting position in the vertical direction on the base substrate, has good parallelism, and can be mounted with high accuracy. You can achieve the encoder you had.

[Brief description of the drawings]

FIG. 1 is a side view of essential parts of a first embodiment of a package for light emitting / receiving elements of the present invention.

FIG. 2 is a side view of main parts when the package of FIG. 1 is mounted on a base substrate.

FIG. 3 is a plan view of an essential part when the package of FIG. 1 is mounted on a base substrate.

FIG. 4 is a side view of essential parts of a second embodiment of a package for light emitting / receiving elements of the present invention.

FIG. 5 is a side view of main parts when the package of FIG. 4 is mounted on a base substrate.

FIG. 6 is a side view of the essential parts of Embodiment 3 of the package for a light-receiving / light-emitting element of the present invention.

FIG. 7 is a side view of main parts when the package of FIG. 6 is mounted on a base substrate.

FIG. 8 is a schematic view of a main part of an encoder having a package of the present invention.

FIG. 9 is an explanatory diagram when a conventional package is mounted on a base substrate.

[Explanation of symbols]

 100 Package for Light-Emitting / Light-Receiving Element 1 Package body 1a Attaching surface 2 Optical member 3 Light-emitting element or / and light-receiving element 4 Soldering lead 5 Copper foil pattern 6 Dummy copper foil pattern 7 Base substrate H Encoder L Light emitting element package PD photodiode package

Claims (16)

[Claims] 1. A light-emitting / light-receiving element characterized in that a bottom surface of a housing accommodating a light-emitting element and / or a light-receiving element serves as a vertical contact surface when the housing is mounted on a base substrate. package. 2. A soldering lead for the light emitting element and / or the light receiving element is attached to a part of the housing, and the abutting surface projects in a direction perpendicular to the soldering lead. The package for a light emitting / receiving element according to claim 1, wherein 3. A soldering lead for the light emitting element and / or the light receiving element is attached to a part of the housing, and the abutting surface is more vertical than a stopper portion of the soldering lead. The package for a light emitting / receiving element according to claim 1, wherein the package projects in a direction. 4. The package for a light emitting / light receiving element according to claim 1, wherein an abutting surface of the housing and a mounting surface of the light emitting element and / or the light receiving element are substantially parallel to each other. 5. The package for a light emitting / receiving element according to claim 1, wherein the abutting surface is configured to abut on a dummy copper foil pattern on a base substrate. 6. An encoder using the package for a light emitting / receiving element according to claim 1. Description: 7. A light-emitting device comprising: a light-emitting element, a housing portion accommodating the light-emitting element, and a vertical contact surface provided at the bottom of the housing portion when the housing portion is mounted. Package for device. 8. The light emitting element according to claim 7, further comprising a soldering lead for the light emitting element, wherein the abutting surface projects in a vertical direction from a position where the soldering lead is arranged. Package. 9. The soldering lead for a light emitting element having a stopper is further provided, and the abutting surface is projected in a vertical direction from a stopper position of the soldering lead. Package for light emitting devices. 10. The contact surface and the mounting surface of the light emitting element are configured to be substantially parallel to each other.
Package for light emitting devices. 11. A light receiving device comprising: a light receiving element, a housing portion accommodating the light receiving element, and a vertical abutting surface provided at the bottom of the housing portion when mounting the housing portion. Package for device. 12. The light-receiving element according to claim 11, further comprising a soldering lead for the light-receiving element, the abutting surface projecting in a vertical direction from a position where the soldering lead is arranged. Package. 13. A soldering lead for a light-receiving element having a stopper, the abutting surface projecting in a vertical direction from a stopper position of the soldering lead. Package for the light receiving element of. 14. The abutting surface and the mounting surface of the light receiving element are configured to be substantially parallel to each other.
Package for 1 light receiving element. 15. A light emitting part having a light emitting element, a housing part accommodating the light emitting element, and a vertical abutting surface provided at the bottom of the housing part when mounting the housing part, and a light receiving element, A light receiving portion having a housing portion accommodating the light receiving element and a vertical contact surface provided at the bottom of the housing portion when the housing portion is mounted is mounted,
An encoder, wherein a signal including displacement information is obtained by receiving light from the light emitting element via a scale. 16. A motor provided with the encoder of claim 15.