JPH09123183A - Molding machine - Google Patents

Abstract

PROBLEM TO BE SOLVED: To eliminate peeping of a narrow space between both the molds by an operator or the insertion of a hand mirror by making it possible to observe the opposed surfaces of the upper and lower molds by the mirror by telescopically operating a cleaner and to prevent the occurrence of molding failure due to the miss by safely and effectively confirming the propriety of cleaning by the operator. SOLUTION: In a transfer molding machine 10 having a cleaner 30 for cleaning while telescopically operating between the mating surfaces of upper and lower molds 11, 12 in the open state, arms 41 are telescopically mounted at the right and left sidewalls of the frame 31 of the cleaner 30, a mirror 40 for observing the mating surfaces is installed between the ends of both the arms, and rotatably supported by a supporting shaft 44.

Description

Detailed Description of the Invention

[0001]

FIELD OF THE INVENTION The present invention relates to molding technology, and in particular to
The present invention relates to a technique related to cleaning of a molding die, for example, a technique effectively applied to a transfer molding device used for molding a resin sealing body of a resin sealing package in manufacturing a semiconductor device.

[0002]

2. Description of the Related Art A general semiconductor device has a resin-sealed package. This resin-sealed package includes a resin-sealed body and a plurality of outer leads protruding from the side surface of the resin-sealed body to the outside. The resin-sealed body has an integrated circuit including a semiconductor element formed therein. A semiconductor pellet (hereinafter referred to as a pellet) and an inner lead electrically connected to the pellet are resin-sealed. Each outer lead is integrally connected to each inner lead, and the integrated circuit of the pellet is electrically pulled out to the outside of the resin sealing body via each inner lead.

Conventionally, a resin molding of a semiconductor device has been molded by a transfer molding device. That is,
The transfer molding apparatus includes an upper mold and a lower mold in which cavities for molding a resin sealing body are formed on mating surfaces of the cavities and the dies are clamped together by a cylinder device. The work of this transfer molding apparatus is configured by mechanically and electrically connecting pellets to a lead frame in which a group of inner leads and outer leads are integrally supported by a frame. A resin material (hereinafter, referred to as a resin) as a molding material is passed through a runner and a gate in a state where a lead frame which is a work is arranged on the mating surface of the upper mold and the lower mold and the pellets are inserted into the cavity. By filling the inside of the cavity with the plunger, the resin sealing body is molded in a state in which the lead frame is inserted by the cavity.

In such a transfer molding apparatus, the upper mold and the lower mold are removed in order to remove a mold release agent, resin residue, etc. at the time of molding the cavity formed on the mating surfaces of the upper mold and the lower mold. There is a cleaner that cleans the mating surfaces of. That is, the cleaner is moved back and forth between the upper mold and the lower mold with the upper mold and the lower mold being opened, and the mating surfaces of the upper mold and the lower mold are rubbed by rubbing the cavity with a brush while blowing air. It is configured to be cleaned.

If the transfer molding apparatus having this cleaner is insufficiently cleaned by the cleaner, the residual slags of the upper mold and the lower mold are gradually accumulated and enlarged, and the enlarged residual shavings are accidentally dropped, resulting in lead. It causes dents on the frame and deformation of the inner leads. Therefore, a regular cleaning operation using a cleaning resin has been conventionally performed.

As an example of describing such a transfer molding apparatus, there are "Electronic Materials November 1994 Special Issue" P118 to P124 issued by Industrial Research Institute Co., Ltd. November 25, 1994.

[0007]

However, in the above-described transfer molding apparatus, a part of the cleaning resin used for the regular cleaning work remains in the upper mold and the lower mold and is accidentally dropped, so that the lead frame is removed. There is a problem that it may cause a dent and a deformation defect of the inner lead. Therefore, conventionally, after the periodical cleaning work is performed, the operator looks into the mating surfaces of the upper mold and the lower mold, or visually observes by using a hand mirror, so that the cleaning resin does not remain. Work to confirm whether or not is being carried out.

However, since this confirmation work is carried out in a narrow space between the upper mold and the lower mold, and in a space heated to a high temperature, it is difficult to observe, work efficiency and work environment are poor, and it is overlooked. There is a high probability that defects will occur.

An object of the present invention is to provide a molding apparatus capable of safely and reliably carrying out confirmation work after cleaning.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0011]

The outline of a typical invention among the inventions disclosed in the present application is as follows.

That is, the invention is characterized in that a mirror for observing the facing surfaces of the molds is attached in the advancing and retreating direction of the cleaner for cleaning while advancing and retracting between the two molds in a state where the pair of molds that open and close each other are opened.

[0013]

According to the above-mentioned means, by operating the cleaner, the facing surface of the desired mold can be observed by the mirror, so that the operator can look into the narrow space between the two molds or insert the hand mirror. You don't have to. Therefore, the operator can safely and surely check the cleanliness of the mold,
It is possible to prevent the occurrence of defective molding due to oversight.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows a transfer molding apparatus according to an embodiment of the present invention, (a) is a side view,
(B) is a front view. FIG. 2 shows a usage state of the cleaner, (a) is a partially cut side view, and (b) is a partially cut front view. 3A and 3B show a usage state of the cleaning resin, wherein FIG. 3A is a partially cut side view and FIG. 3B is a partially cut front view.

In the present embodiment, the molding apparatus according to the present invention is configured as a transfer molding apparatus used for molding a resin encapsulation body of a resin encapsulation package in manufacturing a semiconductor device. Includes a pair of upper and lower molds, in which cavities for molding the resin sealing body are formed on their mating surfaces and clamped together by a cylinder device. The work (not shown) of this transfer molding apparatus is configured by mechanically and electrically connecting pellets to a lead frame in which inner lead and outer lead groups are integrally supported by a frame. Then, in a state where the lead frame that is the work is arranged on the mating surface of the upper mold and the lower mold and the pellets are inserted into the cavity, the resin is filled into the cavity by the plunger through the runner and the gate, The resin sealing body is molded by the cavity with the lead frame inserted.

In the present embodiment, the transfer molding apparatus 10 is provided with a mold opening / closing device 20 including a cylinder device and the like, and a plurality of guide pillars 2 are provided on the mold opening / closing device 20.
1 is erected vertically. A lower die support plate 22 is fitted in an intermediate portion of the guide pillar 21 so as to be movable up and down, and the lower die support plate 22 is supported by a piston rod 20a of a die opening / closing device 20. On the upper surface of the lower die support plate 22, the lower die 12 is arranged and supported upward.

As shown in FIG. 3, the lower mold 12 is provided with a cull 16 disposed at a position facing the pot 14 of the upper mold 11 and is recessed, and a plurality of runners 17 are provided in the lower mold 12. It is arranged so that it can be connected to each and is buried. The other end of each runner 17 is connected to a lower mold cavity recess 13b via a gate 18, and each lower mold cavity recess 13b is connected to each upper mold cavity recess 13a formed in the upper mold 11. A plurality of cavities 13 are formed in cooperation with each other. In addition, on the mating surface of the lower die 12, a relief recess 19 is a rectangle slightly larger than the outer shape of the lead frame (not shown) so that the relief recess 19 can escape the thickness of the lead frame, which is a work, and is approximately equal to the thickness thereof. It is submerged at a certain depth.

An upper die support plate 23 is horizontally bridged and fixed to the upper end of each guide pillar 21.
A plurality of guide posts 24 are vertically erected on the upper surface of 3. A cylinder device support plate 25 is horizontally bridged and fixed to an upper end portion of each guide post 24, and a cylinder device 26 is fixed to a central portion of the cylinder device support plate 25. The plunger 15 is attached to the piston rod 27 protruding downward from the cylinder device 26. A pot 14 is opened vertically in the upper mold 11 at a position facing the plunger 15. Upper mold 11
An upper mold cavity recess 13a is formed on the lower surface of the.

This transfer molding apparatus 10 has an upper mold 11
And a cleaner 3 for cleaning the mating surface of the lower mold 12
0, and the cleaner 30 is supported by a supporting device and a driving device (both not shown), and the upper mold 11 and the lower mold 1
It is configured to move back and forth between the mating surfaces in the front-back direction in a state in which 2 is open. As shown in FIG. 2, the machine frame 31 of the cleaner 30 that moves forward and backward is formed in a rectangular box shape with upper and lower surfaces opened, and the machine frame 31 is rotated by a rotation drive device (not shown). The rotating shaft 32 is horizontally mounted in the left-right direction. A brush 33 in which a large number of brushes are bundled in a columnar shape is mounted on the outer periphery of the rotary shaft 32. The machine frame 31 of the brush 33 has an upper mold 11 and a lower mold 1.
It is configured to rub the mating surfaces of the upper mold 11 and the lower mold 12 by the rotation of the rotary shaft 32 as the space between the two molds moves in the front-back direction. In addition, an air supply passage 34 connected to a compressor (not shown) is provided inside the rotary shaft 32 in the axial direction, and the air supply passage 34 is provided on the outer periphery of the rotary shaft 32. By injecting air from the air outlet 35, cleaning of the brush 33 is assisted. A suction path (not shown) is connected to the machine casing 31 to prevent dust and the like blown up by the air outlet 35 from scattering outside the machine casing 31.

Further, a mirror 40 for observing the mating surfaces of the upper mold 11 and the lower mold 12 is attached to the cleaner 30 so as to be movable back and forth with respect to the cleaner 30 and at an inclination angle with respect to the moving direction of the cleaner 30. It is installed so that it can be changed. That is, the machine frame 31 of the cleaner 30 has a pair of arms 4
1, 41 are respectively arranged on the left and right side walls so as to horizontally project forward. Both arms 41, 41 are screwed with bolts 43 into long holes 42 formed at their base ends in the longitudinal direction. By doing so, the position in the front-rear direction is adjusted. A mirror 4 is provided between the front ends of both arms 41, 41.
0 is rotatably supported on a center line by a support shaft 44 and is horizontally mounted, and the tilt angle of the mirror 40 is adjusted by rotating the mirror 40 about the support shaft 44. . The mirror 40 is made of a metal plate, glass, etc.
It is formed in a rectangular flat plate shape having a size capable of displaying the entire width of the mating surfaces of 1 and the lower mold 12.

Next, the cleaning operation of the transfer molding apparatus and the confirmation operation thereof will be described. First, when the mating surfaces of the upper mold 11 and the lower mold 12 are cleaned by the cleaner 30, as shown in FIG. 2, when the upper mold 11 and the lower mold 12 are opened, the cleaner 30 moves the upper mold. It is moved back and forth between 11 and the lower mold 12. During the forward / backward movement of the cleaner 30, the rotary shaft 32 is rotated and the mating surfaces of the upper mold 11 and the lower mold 12 are rubbed by the brushes 33, so that the release agent and the residual residue of the resin adhering to the mating surfaces rub against each other. Be dropped. The dust that has been scraped off is blown away by the air 36 blown out from the air blowout port 35, and is immediately sucked and removed from the suction port. The cleaning of the mating surfaces of the upper mold 11 and the lower mold 12 with the cleaner 30 is usually performed for each molding operation (so-called shot).

However, even if the cleaning by the cleaner 30 is carried out for each shot, the mold release agent and the residue may remain in the fine corners of the cavity 13. Therefore, the periodical cleaning work using the cleaning resin is carried out. To be done. When the cleaning work with this cleaning resin is carried out, as shown in FIG. 3, the cleaning work 28 is set in the lower mold 12 with the pellet part housed in the cavity recess 13b thereof. . Then, the mold opening / closing device 20 is operated to clamp the upper mold 11 and the lower mold 12. In this mold clamped state, the cleaning work 28 is sandwiched between the upper mold 11 and the lower mold 12, and the pellet portion of the cleaning work 28 is accommodated in the cavity 13.

Next, the cleaning resin is sent from the pot 14 to the runner 17 by the plunger 15, and is filled in each cavity 13 from the gate 18. After the cleaning resin is filled in the cavities 13, the cleaning resin is cured by a thermal crosslinking reaction, so that molded products 29 made of the cleaning resin are molded in the cavities 13, the runners 17 and the pots 14, respectively. It will be in a state of being.

Thereafter, the lower mold 12 is opened by the mold opening / closing device 20.
Is lowered and the upper mold 11 and the lower mold 12 are opened. Along with this mold opening, a molded product 29 made of a cleaning resin is released from the upper mold 11 and the lower mold 12 together with the cleaning work 28 by ejector pins (not shown). In this manner, the molded product 29 made of the cleaning resin released from the mold is in a state where the fine residue and the like of the cavity 13 that cannot be removed by the cleaning by the cleaner 30 are attached and removed. The lower die 12 is relatively cleaned.

If the cleaning resin used in the above regular cleaning work adheres to the air vents of the upper mold 11 and the lower mold 12, molding failure of the resin encapsulant may occur, or
If the cleaning resin residue is accidentally dropped,
This may cause dents on the lead frame or deformation of the inner leads. For this reason, the operator visually observes the mating surfaces of the upper mold 11 and the lower mold 12 after the periodic cleaning work is performed, and Work is carried out to confirm whether there is any resin left. The upper mold 11
Also, it is desirable that the confirmation work of the cleaning result of the mating surface of the lower die 12 is performed after the cleaning work for each shot by the cleaner 30 as long as the operation efficiency of the transfer molding apparatus is not deteriorated.

When performing the cleaning result confirmation work, as shown in FIG. 1, the upper mold 11 and the lower mold 12 are kept open by the mold opening / closing device 20, and the cleaner 30 is moved upward. The open space of the mold 11 and the lower mold 12 is directly faced. Further, the operator directly faces the mirror 40 mounted on the front surface of the cleaner 30 and monitors the mating surface of the upper mold 11 or the lower mold 12 projected on the mirror 40. Subsequently, when the cleaner 30 is gradually advanced into the open space of the upper mold 11 and the lower mold 12, the entire width of the mating surface of the upper mold 11 or the lower mold 12 is gradually projected over the entire length, so that the operator The situation is monitored and the adequacy of the cleaning result is judged.

At this time, when it becomes difficult to judge the suitability due to the movement of the mirror 40, the movement of the cleaner 30 is appropriately stopped. In addition, the mirror 40 for the cleaner 30
If the mating surface is difficult to see due to the position of, the position of the mirror 40 is adjusted by expanding and contracting the left and right arms 41, 41. Further, when the mating surface is difficult to see due to the tilt angle of the upper mold 11 and the lower mold 12 with respect to the mating surface, the tilt angle of the mirror 40 with respect to the left and right arms 41, 41 is adjusted.

After the confirmation work of the mating surface of one of the upper die 11 and the lower die 12 is completed, the inclination angle of the mirror 40 is changed and adjusted to confirm the other mating surface of the other cleaner 30. It is carried out by advancing and retreating.
Particularly, since the mating surface of the upper mold 11 is in a state of looking down from below without the mirror 40, it is desirable to perform a careful confirmation work with the mirror 40.

When the above-mentioned confirmation work by the mirror 40 is completed, the cleaner 30 is returned to a predetermined standby position and is ready for the next cleaning work. If a defective cleaning result is found, cleaning with the cleaner 30, cleaning with a cleaning resin, and manual cleaning by an operator are appropriately performed.

According to the above embodiment, the following effects can be obtained. (1) By attaching a mirror for observing the mating surfaces of the upper mold and the lower mold in the forward / backward direction of the cleaner of the transfer molding device, the operator can check the mating surfaces of the upper mold and the lower mold after cleaning. Since it is not necessary to insert a face, a hand mirror, etc. in the space between the mold and the lower mold, the confirmation work can be performed safely and accurately without being affected by the narrow space and temperature of the upper mold and the lower mold. It is possible to prevent the fine slag left in the upper mold and the lower mold from being overlooked.

(2) By the above (1), the accuracy of the confirmation work of the cleaning results for the mating surfaces of the upper mold and the lower mold can be improved, so that the defective molding of the resin encapsulant due to the poor cleaning can be avoided. Occurrence can be prevented, and the quality and reliability of the transfer molding device can be improved.

(3) By mounting the mirror so that it can move back and forth with respect to the cleaner, the mirror can be moved back and forth to adjust the position of the mirror when the mating surface is difficult to see due to the position of the mirror with respect to the cleaner. Moreover, it is possible to more surely prevent the fine slag remaining in the lower mold from being overlooked.

(4) By making the tilt angle of the mirror adjustable, the tilt angle of the mirror can be adjusted when the mating surface is difficult to see due to the tilt angle with respect to the mating surfaces of the upper mold and the lower mold. It is possible to more surely prevent the fine residue left over from the mold and the lower mold from being overlooked.

Although the invention made by the present inventor has been specifically described based on the embodiments, the present invention is not limited to the embodiments and various modifications can be made without departing from the scope of the invention. Needless to say.

For example, the position adjustment and the tilt angle adjustment of the mirror with respect to the cleaner are not limited to be performed by a manual operation, but may be automatically performed by a remote operation.

The mirror is not limited to be configured to observe both the upper die mating surface and the lower die mating surface.
It may be configured so that only the mating surface of the upper mold, which is hard to see, can be observed.

In the above description, the case where the invention made by the present inventor is mainly applied to the transfer molding apparatus for molding the resin sealing body of the semiconductor device which is the background field of application has been described, but the invention is not limited thereto. However, the present invention can be applied to general molding apparatuses such as an extrusion molding apparatus having a pair of molds, an injection molding apparatus, and a press molding apparatus having a pair of male and female molds.

[0038]

The effects obtained by typical aspects of the invention disclosed in the present application will be briefly described as follows.

By mounting a mirror for observing the facing surface of the mold in the forward and backward direction of the cleaner of the molding apparatus, the operator can put a face or face in the space between the facing surfaces of the mold during confirmation work after cleaning the facing surface of the mold. Since it is not necessary to insert a hand mirror, etc., it is possible to carry out confirmation work safely and accurately, it is possible to prevent overlooking of fine slag left in the mold, and to prevent molding defects due to poor cleaning. Therefore, the quality and reliability of the molding apparatus can be improved.

[Brief description of the drawings]

FIG. 1 shows a transfer molding apparatus according to an embodiment of the present invention, in which (a) is a side view and (b) is a front view.

2A and 2B show a usage state of the cleaner, in which FIG. 2A is a partially cut side view and FIG. 2B is a partially cut front view.

3A and 3B show a usage state of a cleaning resin, wherein FIG. 3A is a partially cut side view and FIG. 3B is a partially cut front view.

[Explanation of symbols]

10 ... Transfer molding device (molding device), 11 ... Upper mold, 12 ... Lower mold, 13 ... Cavity, 13a ... Upper mold cavity recess, 13b ... Lower mold cavity recess, 14
... pot, 15 ... plunger, 16 ... cull, 17 ... runner, 18 ... gate, 19 ... escape recess, 20 ... mold opening / closing device, 20a ... piston rod, 21 ... guide pillar, 2
2 ... Lower mold support plate, 23 ... Upper mold support plate, 24 ... Guide post, 25 ... Cylinder device support plate, 26 ... Cylinder device,
27 ... Piston rod, 28 ... Cleaning work, 29 ... Molded product, 30 ... Cleaner, 31 ... Machine frame, 32 ... Rotating shaft, 3
3 ... Brush, 34 ... Air supply path, 35 ... Air outlet, 3
6 ... Air, 40 ... Mirror, 41 ... Arm, 42 ... Long hole, 43
… Bolts, 44… spindles.

Claims (3)

[Claims] 1. A molding apparatus comprising a pair of molds which are opened and closed with each other, and a cleaner which cleans the molds while advancing and retracting between the molds in an open state. A molding apparatus, which is equipped with a mirror for observing the opposite surface. 2. The molding apparatus according to claim 1, wherein the mirror is attached to a cleaner so as to be movable back and forth. 3. The molding apparatus according to claim 1, wherein the mirror is configured to be able to change an inclination angle with respect to the facing surface of the mold.