JPH09116073A - Method and apparatus for demounting frame for plating of semiconductor package - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method and apparatus for demounting a frame for plating which allows the easy demounting of a lattice-like frame for plating that is installed on external connection pins for electrolytic plating and which can increase the yield. SOLUTION: A semiconductor package with a frame for plating 'a' wherein a frame for plating is set on external connection pins 'b' is mounted on an up-and-down mounting table with the frame for plating being placed downside and thereby the package is held. Then, a head 34 provided with hooks 45 to be hooked,to constituent lines of a lattice connecting pin insertion sections is moved up and down to relatively insert each hook of the head toward the semiconductor package through each lattice space of the frame for plating and hook it to each constituent line of the lattice. Then, the head is moved up and down to demount the frame for plating.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for removing a plating frame of a semiconductor package, and more particularly, to an external connection pin and an exposed conductor pattern of the semiconductor package when electrolytic plating is performed on the external connection pin. The present invention relates to a plating frame removing method and apparatus that can smoothly remove a plating frame set on a pin from the external connection pin after the electrolytic plating process and improve product yield.

[0002]

2. Description of the Related Art In a semiconductor package such as a PGA (pin grid array) substrate, an external connection pin attached to the lower surface or the upper surface of the package has good electrical continuity with an external circuit, and the surface of the pin is oxidized. In order to prevent corrosion, a conductive metal such as nickel or gold is electrolytically plated.

To perform this electrolytic plating treatment, FIG.
As shown in (b), a plating frame d made of a lattice-like elastic thin metal plate having a pin insertion hole c at a position corresponding to the external connection pin b of the semiconductor package a is used, and the pin insertion hole c is externally connected. Insert the pin b, and then the semiconductor package a
After setting the plating frame d and further clamping with a clip, it is immersed in the plating solution and energized by a plating rack. After this electrolytic plating is completed, the plating frame d set on the external connection pin b of the semiconductor package a is removed.

By the way, in order to remove the plating frame d from the external connection pin b of the semiconductor package a, normally, as shown in FIGS. 9A and 9B, the semiconductor package a is chucked from the side of the package. After holding
This is performed by inserting a metal comb-shaped detaching head f from the four directions of the package between the semiconductor package a and the plating frame d, and relatively separating the semiconductor package a and the plating frame d. ing. Generally, the comb-shaped removal head f is inserted between the semiconductor package a and the external connection pin b of the plating frame d, and then the semiconductor package a is pushed down.

[0005]

However, the above method has the following problems. That is, due to variations in the external dimensions of the semiconductor package a, variations in the pin pitch of the external connection pins b, and misalignment of the comb-teeth removal head f, the comb-teeth removal head f is removed.
May contact the side surface of the pin, causing scratches and pin bending. Therefore, it is necessary to adjust the positional deviation of the comb-teeth removal head f, etc., and the product production efficiency and the product yield are reduced. And other issues.

The present invention has been made in response to the above problems, and its object is to provide a pin holding portion having a pin insertion hole at a position corresponding to an external connection pin of a semiconductor package. Using a grid-shaped plating frame, the tip of the external connection pin is inserted into the pin insertion hole of the plating frame, the plating frame is set on the external connection pin, and the semiconductor is placed through the plating frame. After electrolytic plating is applied to the external connection pins and the exposed conductor pattern of the package, the plating frame can be smoothly removed from the external connection pins of the semiconductor package, and a plating frame removal method and device that can improve product yield are provided. To provide.

[0007]

A method for removing a plating frame for a semiconductor package according to the present invention as a means for achieving the above object is a method of removing at least two side surfaces of the semiconductor package after completion of the electrolytic plating treatment. From the corresponding lattice space of the plating frame, using a head having a hook for hooking to each lattice streak connecting adjacent pin insertion holes of the plating frame, The step of relatively inserting in the direction of the semiconductor package and hooking on each of the lattice lines, and the state where the hook of the head is hooked on each of the lattice lines of the plating frame, the head and the semiconductor package are relatively separated from each other. And a step of removing the plating frame from the external connection pin.

Further, the apparatus for removing a plating frame of a semiconductor package according to the present invention is a mounting table for mounting a semiconductor package with a plating frame in which the plating frame is set on the external connection pins with the plating frame facing down. A package holding means for holding the semiconductor package from at least two side surfaces, a head provided with hooks hooked on each grid line connecting adjacent pin insertion holes of the plating frame, and a mount for raising and lowering the mounting table. And a head elevating means for elevating and lowering the head, relatively inserting each hook of the head from each lattice space of the plating frame in the semiconductor package direction, and hooking each hook on each lattice line. Consists of.

[0009]

According to the method and apparatus for removing the plating frame of the semiconductor package of the present invention, unlike the case of using the conventional comb-teeth-shaped removal head when removing the plating frame from the external connection pin. Since the semiconductor package is held, the hooks of the head are relatively inserted from the corresponding lattice spaces of the plating frame in the semiconductor package direction and hooked on the lattice lines.
There is no risk that the head provided with each hook will come into contact with the external connection pin, and after the hook is hooked, the head is pulled in the direction opposite to the semiconductor package, and the head and the semiconductor package are separated from each other. By doing so, since each grid line of the plating frame is pulled uniformly, the plating frame can be smoothly removed from the external connection pin of the semiconductor package.

Therefore, according to the present invention, it is possible to reduce the risk of scratches on the side surfaces of the external connection pins of the semiconductor package and the occurrence of bending of the pins, so that the production efficiency of products and the product yield can be improved. It is possible to provide a method and device for removing the plating frame of the semiconductor package.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The preferred embodiments of the present invention will be described below with reference to the drawings. 1 to 7 show an embodiment of the present invention, FIG. 1 is a plan view of an apparatus for removing a plating frame, FIG. 2 is a schematic front view showing a main portion of FIG. 1, and FIG. 6 is a front view and a plan view of a main part of the frame removing device, FIG. 4 is a front view, a plan view and a side view of the plating frame removing head part, and FIG. 5 is an enlarged side view of a hook of the plating frame removing head part. FIG. 7 is a front view, a plan view and a side view of the plating frame mounting table, and FIG. 7 is a plating frame removal process drawing.

As described above, the semiconductor package such as the PGA ceramic package is plated on the external connection pin b and the external exposed conductor pattern (not shown) of the semiconductor package a when electrolytically plating the external connection pin b. The frame d is attached (see FIG. 8).
After the electrolytic plating process is completed, the plating frame d is removed from the external connection pin b. Here, as shown in FIG. 8, the plating frame d is formed by etching or punching a thin plate (etching plate or the like) such as a Kovar plate, a 42 alloy plate, a stainless plate, a steel plate, or a copper plate to form a grid space g or a grid. It is a frame provided with a line h and a pin insertion hole c. The pin insertion hole c is usually located at a position where the lattice lines h in the vertical and horizontal directions abut, and at a position corresponding to the external connection pin b of the semiconductor package a.

The plating frame removing device of the present embodiment is a device for continuously removing the plating frame d of the semiconductor package (hereinafter referred to as a work) w with the plating frame from the external connection pin b. Then, as shown in FIGS. 1 to 6, a work supply unit 1 that supplies the work w, a work transfer robot unit 2 that transfers the work w, a plating frame removal unit 3, and a semiconductor package discharge unit 6 , And the plating frame recovery unit 7,
It has 5 parts.

As shown in FIGS. 1 and 2, the work supply unit 1 has a belt conveyor 12 for conveying a tray 11 having a plurality of stages on which a work w is placed to a work stock position A.
Then, at the work stock position A, the lift 13 for sequentially moving the tray 11 up to a predetermined height position, and the tray 11 at the uppermost stage moved up by the lift 13 are transferred to the work transfer preparation position B. The tray transfer machine 14 and the work w in the tray 11 at the work transfer preparation position B are taken out, the work w is opened at a predetermined interval, and transferred to the work transfer position C of the work transfer robot unit 2. Work transfer machine 1
5 and the tray 11 which became empty after taking out the work w
It has an empty tray transfer machine 17 for transferring and transferring to a belt conveyor 16 that conveys the

The tray transfer machine 14 is provided with a vertically moving air cylinder and a horizontally moving air cylinder (not shown). The vertically moving air cylinder has a tray 11 which is moved to the uppermost stage by a lift 13. It is equipped with a chuck for picking up. Further, the work transfer machine 15 is provided with a vertically moving air cylinder and a horizontally moving air cylinder (not shown), takes out the work w from the tray 11 supplied by the tray transfer machine 14, and moves the work w to the left and right. The work is transferred to the work transfer position C while the space between the works w is widened by the air cylinder. Then, on the side of the work transfer position C, the work transfer robot unit 2 that transfers the work w to the plating frame removal unit 3 is located.

The work transfer robot unit 2 includes a work transfer position C of the work supply unit 1 and a plating frame removal unit 3.
And between the frame removal portion 3 for plating and the package transfer position D of the semiconductor package discharge portion 6,
It consists of a robot that turns. This robot has a rotary air actuator 21 for rotating a robot arm within a predetermined range, a chuck 22 for holding (holding) a work w or a semiconductor package a, and a vertically moving air cylinder 23 for vertically moving the chuck 22.

The plating frame removing portion 3 is the most important part of the present invention, and as shown in FIGS.
With a configuration capable of processing 6 work w, and having two lines for processing 3 work w on the table 30,
Each line includes a work mounting table 31, a mounting table elevating section 32, a package holding section 33, a head section 34,
It has a head elevating part 35. The work mounting table 31 has a large-diameter hole 36 at the center for guiding and mounting the plating frame d of the work w on the lower side, and for inserting the chucks 37 of the package holding portion 33 on the left and right. Groove 38
It is composed of a base plate provided with a and is moved up and down by the mounting table elevating part 32. The large-diameter hole 36 has a hook 45 that forms the head portion 34.
Is provided with a horizontal pedestal portion 39 that narrows in a taper shape from the upper surface side of the base plate to the central portion in the thickness direction and holds the plating frame d at the taper end portion.

The mounting table elevating part 32 is an elevating mechanism part for elevating the work mounting table 31, and has a vertically moving air cylinder 51. Vertically moving air cylinder 51
Is connected to the work mounting table 31 at the tip of the cylinder rod. The package holding portions 33 are provided on the table 30 on the left and right sides of the work mounting table 31, and hold the semiconductor package a of the work w through the groove 38 of the work mounting table 31, and a chuck 37 that moves the chuck 37 back and forth. It is made up of an air cylinder 44.

As shown in FIG. 4, the head portion 34 includes a plurality of heads 46 each having a hook 45 for hooking on each grid line h connecting the adjacent pin insertion holes c of the plating frame d, and the heads 46. Head body 4 for holding 46
7, and the hook 45 portion can be inserted into the large diameter hole 36 of the work mounting table 31. And this hook 4
As shown in FIG. 5, 5 has a shape smaller than the lattice space g of the plating frame d, and has an arc 45a having a large radius of curvature from the hook base end portion 48 to the hook tip end portion 49 thereof.
It is provided with a curved surface in which an arc 45b having a small radius of curvature is continuous, and a horizontal portion 45c continuous with this curved surface. This hook 4
A plurality of heads 46 each having 5 in one row at the upper end and in the same direction are arranged in a head body 47 in a replaceable manner, and can be raised and lowered by a head raising and lowering portion 35 attached to the lower portion of the head. Consist of the composition.

Returning to FIGS. 1 to 3, the plating frame removing section 3 is connected to the semiconductor package discharging section 6 via the workpiece transfer robot section 2. This semiconductor package discharge part 6 is a semiconductor package a in which the plating frame d has been removed by the plating frame removal part 3.
Is transferred to and discharged from the empty tray 11 conveyed by the belt conveyor 16. The semiconductor package discharging unit 6 transfers the semiconductor package a from the work mounting table 31 to the tray 11 transported by the belt conveyor 16 from the package transfer position D transferred by the work transfer robot unit 2. Machine 6
1, a lift for stacking the trays 11 on which the semiconductor packages a are placed, and a discharge belt conveyor 63 for discharging the trays 11. Here, the semiconductor package transfer machine 61 is the work transfer machine 1 in the work supply unit 1.
5, a vertical moving air cylinder and a horizontal moving air cylinder (not shown) are provided, and the semiconductor package a is moved from the package transfer position, and the space between the semiconductor packages a is adjusted by the horizontal moving air cylinder. It can be transferred to this tray 11 by narrowing it to the interval of the tray 11 conveyed by 16.

Further, the plating frame recovery section 7 is
A part for recovering the plating frame d that is removed from the work w by the plating frame removal unit 3 and is left on the work mounting table 31, and is provided with a suction cup 71 that holds the plating frame d. The air cylinder 72 and the plating frame d are attached to the frame collecting table 7
3 has a rotary actuator 74 that turns and transfers. In the present embodiment, the vertically moving air cylinder 72 and the rotary actuator 74 are provided along the table 30 in each of two lines for processing the work w.

Then, by using the plating frame removing device of the present embodiment, the plating frame d is removed from the work w.
First, in FIG. 1, the belt conveyor 12 is used to remove the plurality of trays 1 on which the works w are placed at predetermined intervals.
1 is conveyed to the work stock position A. The transported tray 11 is sequentially moved up by the lift 13, and then the tray 11 located at the uppermost stage is moved to the tray transfer machine 14.
To the work transfer preparation position B via. Next, at the work transfer preparation position B, the work w is taken out by the vertically moving air cylinder (not shown) of the work transfer machine 15, and the space between the works w is taken by the horizontally moving air cylinder (not shown). Moves to the workpiece transfer position C while being expanded. In addition, the tray 11 that has been emptied after the work w has been taken out is moved by the empty tray transfer machine 17 to the belt conveyor 16
And is transferred to the semiconductor package discharge section 6 by this belt conveyor 16.

Work w transferred to the work transfer position C
Is a work transfer robot unit 2 as shown in FIGS.
The robot is held by a robot equipped with the rotary actuator 21 and the vertically moving air cylinder 23, and moves to the work mounting table 31 of the plating frame removing section 3. This work w is in a state in which the tie bar portion i of the plating frame d straddles the pedestal portion 39 in the large diameter hole 36 of the work mounting table 31, and is in a ready state for removing the plating frame d from the work w. enter.

Next, a method for removing the plating frame d will be described with reference to FIG. First, before the work w is placed on the mounting table 31, the work mounting table 31 is moved up and down to form the mounting table elevating section 32.
To raise. Next, the work transfer robot 2 mounts the work w on the work mounting table 31 and the tie bar part i over the pedestal part 39 in the large diameter hole 36 of the work mounting table 31 with the plating frame d on the lower side. It is placed so that it will be in the closed state (see FIG. 7a).

Then, the chuck 37 of the package holding portion 33 is set in the groove 3 of the work mounting table 31 by an air cylinder.
Then, the semiconductor package a is grasped on both sides (see FIG. 7b). Then, the head raising / lowering unit 35 raises the head 46 of the head unit 34, the hook 45 provided at the upper end of the head 46 is inserted from the lattice space g of the plating frame d, and the hook lateral slide cylinder 52 causes the hook 45. Is laterally moved and hooked on the lattice line h (see FIG. 7c). Next, when the head 46 and the work mounting table 31 are lowered by the vertically moving air cylinder 51, the hook 45
Since the semiconductor package a is held by the chuck 37 when the lattice streaks h which are hooked by are pulled down, the plating frame d is connected to the external connection pin b of the semiconductor package a.
Can be removed (see FIG. 7d).

In this manner, the plating frame d is applied from the external connection pin b of the semiconductor package a of the work w, and the side surface of the external connection pin b is scratched or pin defects such as bending are caused. No, it can be removed stably. This is because the plating frame d is pulled out from the external connection pin b by hooking the hooks 45 on the grid lines h of the plating frame d.

When the plating frame d is pulled out from the external connection pin b of the semiconductor package a, the plating frame d is left on the work mounting table 31, and the semiconductor package a held by the chuck 37 is transferred to the work. The robot 2 moves to the package transfer position D. Also,
This semiconductor package a is a semiconductor package transfer machine 6
1 moves onto the tray 11 while being narrowed to the interval between the empty trays 11 conveyed by the belt conveyor 16. Then, the tray 11 on which the semiconductor package a is placed is stacked on the lift and discharged through the discharging belt conveyor 63. The plating frame d left on the work mounting table 31 includes the vertically moving air cylinder 72 of the plating frame recovery unit 7.
Frame recovery stand 7 by rotary actuator 74
3 can be collected.

As described above, the plating frame d can be continuously removed from the external connection pins of the semiconductor package a. Then, according to this embodiment, it is possible to reduce the occurrence of pin defects such as damage to the side surfaces of the external connection pins of the semiconductor package a and pin bending.

[0029]

EXAMPLE Next, in order to confirm the operation and effect of the above-described embodiment, two external connection pins are used as a semiconductor package.
About 75 PGA packages that are plated with a plating frame attached to the external connection pins
A pulling force of 500 kg is applied to the entire plating frame by using each of the plating frame removing device of the present embodiment and the plating frame removing device using the comb tooth-shaped head described in the above-mentioned prior art. In addition, it was removed. Then, the pin defect rate at that time was investigated. As a result, in the case of the conventional device, the pin defect rate of 2.5 to 4% was recognized, whereas in the device of the present embodiment, the pin defect rate of 0.2% was only recognized. I was able to confirm that. From this, according to the apparatus and method of the present embodiment, the pin defect rate can be reduced, and the plating frame can be stably removed from the external connection pin of the semiconductor package, and the product yield can be improved. Was confirmed. This is because, in the present embodiment, an average tensile force is applied to each of the external connection pins. That is, one external connection pin is hooked and removed to remove it, so 500 kg / 275 pins =
It depends on what can be done with 1.8 kg / book.

It should be noted that the present invention is not limited to the above-described embodiments, but includes configurations that can be modified and implemented within the scope without changing the gist of the present invention.

[Brief description of the drawings]

FIG. 1 is a plan view of an apparatus for removing a plating frame showing an embodiment of the present invention.

FIG. 2 is a front view of a main part of FIG. 1 showing an embodiment of the present invention.

FIG. 3 is a front view and a plan view of a main part of a plating frame removing device showing an embodiment of the present invention.

FIG. 4 is a front view, a plan view, and a side view of a plating frame removal head portion showing an embodiment of the present invention.

FIG. 5 is an enlarged side view of the hook of the plating frame removal head portion showing the embodiment of the present invention.

FIG. 6 is a front view, a plan view, and a side view of a plating frame mounting table showing an embodiment of the present invention.

FIG. 7 is a process drawing for removing a plating frame according to the embodiment of the present invention.

FIG. 8 is a side view of the semiconductor package with a plating frame and a plan view of the plating frame.

FIG. 9 is a schematic explanatory view of a conventional plating frame removing device.

[Explanation of symbols]

a: semiconductor package, b: external connection pin, c
... Pin insertion holes, d ... Plating frame, e ...
・ Chuck, f ・ ・ ・ head, g ・ ・ ・ lattice space, h ・
..Lattice lines, i ... tie bar part, j ... positioning holes, w ... work (semiconductor package with plating frame), 1 ... work supply part, 2 ... work transfer robot part 3 ... plating frame removal part, 6
... Semiconductor package ejecting section, 7 ... Plating frame collecting section, 11 ... Tray, 12 ... Belt conveyor, 13 ... Lift, 14 ... Tray transfer machine, A
... Work stock position, B ... Work transfer preparation position, C ... Work transfer position, 15 ... Work transfer machine, 16 ... Belt conveyor, 17 ... Empty tray transfer Machine, 21 ... Rotary air actuator, 22 ...
..Chucks, 23 ... Vertically moving air cylinders, 30
... Table, 31 ... Work rest, 32 ...
Mounting table elevating part, 33 ... Package holding part, 34 ...
-Head part, 35 ... Head elevating part, 36 ... Large diameter hole, 37 ... Chuck, 38 ... Groove, 39 ... Pedestal part, 45 ... Hook, 46 ... Plural Heads,
47 ... Head body, 48 ... Hook base end, 49
... Hook tip, 45a ... Arc with large radius of curvature, 45b ... Arc with small radius of curvature, 45c ...
Horizontal part continuous to curved surface, 50 ... Floating joint, 51 ... Vertical moving air cylinder, 52 ...
Hook side slide cylinder, 61 ... Semiconductor package transfer machine, 63 ... Discharge belt conveyor, 71 ...
・ Sucker, 72 ... Vertically moving air cylinder, 73 ...
Frame recovery table, 74 ... Rotary actuator

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Kazunori Yamamoto 2701-1 Iwakura, Omine-cho, Mine-shi, Yamaguchi Prefecture Sumitomo Metal Ceramics Co., Ltd. (72) Koichi Hatakeyama 2701 Iwakura, Omine-cho, Mine-shi, Yamaguchi Prefecture 1 Sumitomo Metal Ceramics Co., Ltd.

Claims (2)

[Claims] 1. A grid-shaped plating frame having a pin insertion hole having a pin insertion hole at a position corresponding to an external connection pin of a semiconductor package is used, and a tip of the external connection pin is provided in the pin insertion hole of the plating frame. After inserting, the plating frame is set on the external connection pin, and the external connection pin and the exposed conductor pattern of the semiconductor package are electrolytically plated through the plating frame, and then the plating frame is formed from the external connection pin. And a step of holding the semiconductor package from at least two side surfaces after completion of the electroplating process, and a hook hooked to each grid line connecting between adjacent pin insertion holes of the plating frame. A head is used, and each hook of the head is moved from the corresponding lattice space of the plating frame to the semiconductor package direction. A step of relatively inserting and hooking on each of the grid lines; and a state where the hook of the head is hooked on each grid line of the plating frame, the head and the semiconductor package are relatively separated from each other, and the plating is performed. And a step of removing the frame for use from the external connection pin, and a method for removing the frame for plating of the semiconductor package. 2. A lattice-shaped plating frame having a pin insertion hole having a pin insertion hole at a position corresponding to the external connection pin of the semiconductor package is used, and the tip of the external connection pin is provided in the pin insertion hole of the plating frame. After inserting, the plating frame is set on the external connection pin, and the external connection pin and the exposed conductor pattern of the semiconductor package are electrolytically plated through the plating frame, and then the plating frame is formed from the external connection pin. And a mounting table for mounting a semiconductor package with a plating frame, in which the plating frame is set on the external connection pins, with the plating frame facing down, and at least two semiconductor packages. Package holding means for holding from the side direction, and adjacent pin insertion of the plating frame A head provided with a hook hooked on each grid line connecting the parts, a mounting table elevating means for elevating the mounting table, and a head for elevating and lowering each hook of the head from each lattice space of the plating frame. An apparatus for removing a frame for plating a semiconductor package, comprising: head elevating means which is inserted relatively in the semiconductor package direction and hooks on each of the grid lines.