JPH09115946A - Package and semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a package for mounting a number of types of semiconductor chips and an inexpensive semiconductor device. SOLUTION: A package has a package body 2 where a semiconductor chip 1 is mounted in flip-chip connection and a plurality of metal bump connection parts 8 which are provided radially on the mounting surface of the semiconductor chip 1 of the above package body 2 and are connected to each pad 7 of the semiconductor chip 1 via a metal bump 3. Further, the semiconductor chip 1 with a different pad pitch can be mounted.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a package and a semiconductor device, and more particularly to improvement of a flip-chip mounted package.

[0002]

2. Description of the Related Art FIG. 4 (b) is a sectional view of a conventional flip-chip mounted semiconductor device. 1 is a semiconductor chip,
2 is the package body. FIG. 4A is a plan view of the connection surface of the semiconductor chip 1, and FIG. 4C is a plan view of the connection surface of the package body 2.

The semiconductor chip 1 is flip-chip mounted on the package body 2 through the metal bump connecting portions 6 on the package body 2, the metal bumps 3 (formed of solder or gold, for example) and the pads 7 of the semiconductor chip 1 in this order. It is implemented. Furthermore, the space between the semiconductor chip 1 and the package body 2 is sealed with a sealing material (for example, epoxy or polyimide) 4. On the surface opposite to the surface of the package body 2 having the metal bump connection portion 6, an external lead conductor 5 electrically connected to the semiconductor chip 1 and connected to, for example, a signal line of a substrate (not shown) is provided. The package body 2 is made of, for example, alumina, aluminum nitride, or glass ceramic.

The metal bump connecting portion 6 of the package body 2 and the pad 7 of the semiconductor chip 1 are provided and connected in the same positional relationship. This metal bump connecting portion 6,
The surfaces of 7 and the external lead-out conductor 5 are solder-plated or metal-plated.

However, in the above structure, the metal bump connecting portion 6 provided on the package body 2 is
It has the same positional relationship as the pads 7 of only the semiconductor chips 1 of the kind. That is, it is impossible to mount the semiconductor chip having the other layout of the metal bump connection portion on the package. Therefore, the same number of types of packages as the types of semiconductor chips to be mounted are required, which causes a problem of increased manufacturing cost.

[0006]

As described above, there has been a problem that the types of conventional packages increase and the manufacturing cost increases. An object of the present invention is to provide a package in which various types of semiconductor chips can be mounted and a low-cost semiconductor device.

[0007]

In order to solve the above problems and achieve the object, the following measures have been taken in the package and semiconductor device of the present invention. (1) According to the package of the present invention described in claim 1, a package body in which a semiconductor chip is mounted by flip chip connection, and a semiconductor chip of the package body, which is radially extended on a mounting surface of the semiconductor chip. A plurality of metal bump connecting portions each connected to the pad via a metal bump are provided. Furthermore, it is possible to mount semiconductor chips having different pad pitches.

In the above-mentioned package of the present invention, the metal bump connecting portions are radially extended, and the pads,
Since semiconductor chips having different pitches are flip-chip connected to one type of package, the package is generalized and the cost of the package is reduced.

Further, as described in claim 2, in the plurality of metal bump connecting portions, the width in the direction perpendicular to the radial diameter becomes narrower toward the inner side. In the package of the present invention, since the pitch and the width of the metal bump connecting portions are narrow inside the mounting surface of the semiconductor chip of the package body, it is possible to arrange the metal bump connecting portions at a high density, and therefore, The structure is suitable for packages with a large number of metal bump connection parts.

According to a third aspect of the present invention, there is provided a package body in which semiconductor chips are mounted by flip chip connection, and a plurality of types having different pad pitches on the semiconductor chip mounting surface of the package body. A plurality of stages of metal bump connecting portions arranged corresponding to the respective pads of the semiconductor chip and connected to the respective pads of the semiconductor chip via the metal bumps are provided. Further, by selecting the metal bump connection portion of the stage corresponding to the pad pitch of the semiconductor chip, semiconductor chips having different pad pitches can be mounted.

In the above-described package of the present invention, semiconductor chips having different pad pitches are flip-chip mounted on one type of package to make the package versatile, so that the cost of the package is reduced. Moreover, the arrangement of the semiconductor chips is flexible. Further, the material of the metal bump connection portion can be saved, and thus the cost can be further reduced.

According to the fourth aspect of the invention, the metal bump connection portions of the plurality of stages are arranged radially on the mounting surface of the semiconductor chip of the package body, and the pitch becomes narrower toward the inner stage.

In the package of the present invention described above, since the pitch of the metal bump connection portions becomes narrower inside the mounting surface of the semiconductor chip of the package body, it is possible to arrange the metal bump connection portions at a high density. The structure is suitable for a package having a large number of metal bump connection parts.

According to the fifth aspect of the present invention, the size of the metal bump connecting portion having a plurality of steps is reduced toward the inner step. In the above-mentioned package of the present invention, the size of the metal bump connection part becomes smaller and the pitch becomes narrower inside the mounting surface of the semiconductor chip of the package body, so that the metal bump connection part can be arranged at a high density. Therefore, the structure is suitable for a package having a large number of metal bump connection portions. (2) A semiconductor device according to a sixth aspect of the present invention is a semiconductor device, a package body on which the semiconductor chip is mounted by flip chip connection, and a semiconductor chip mounting surface of the package body that extends radially. , A plurality of metal bump connecting portions connected to the respective pads of the semiconductor chip via metal bumps. Further, at least a sealing member for sealing the vicinity of the mounting surface of the semiconductor chip and the package, and a back surface of the mounting surface of the semiconductor chip in the package body, each electrically connected to the plurality of metal bump connection portion. And a conductor for external extraction connected thereto. Further, the semiconductor chip is
It is mounted at the extended position of the metal bump connection portion according to the pad pitch.

In the above semiconductor device of the present invention, the metal bump connecting portions are radially extended, and
Semiconductor chips having different pitches are flip-chip connected to one type of package. Therefore, since the versatile and low-cost package is used, the productivity of the semiconductor device is improved and the cost is reduced.

Further, as described in claim 7, in the plurality of metal bump connecting portions, the width in the direction perpendicular to the radial diameter becomes narrower toward the inner side. In the above semiconductor device of the present invention, since the pitch and width of the metal bump connection portions become narrower inside the mounting surface of the semiconductor chip of the package body, it is possible to dispose the metal bump connection portions at a high density. It is suitable for mounting a semiconductor chip having a large number of metal bump connection portions.

According to another aspect of the semiconductor device of the present invention, a semiconductor chip, a package body on which the semiconductor chip is mounted by flip chip connection, and a pad on the mounting surface of the semiconductor chip of the package body. A plurality of stages of metal bump connecting portions arranged corresponding to the pads of a plurality of types of semiconductor chips having different pitches and connected to the pads of the semiconductor chip via metal bumps are provided. Further, a sealing member for sealing at least the mounting surface vicinity of the semiconductor chip and the package,
The package body is provided with a conductor for external extraction, which is provided on the back surface of the mounting surface of the semiconductor chip and is electrically connected to each of the plurality of metal bump connection portions. Further, the semiconductor chip is mounted by selecting metal bump connecting portions in stages corresponding to the pad pitch.

In the semiconductor device of the present invention, semiconductor chips having different pitches of the metal bump connecting portions are flip-chip mounted in one type of package, and the package is generalized to reduce its cost. The productivity of the semiconductor device using the package is improved and the cost is reduced. Moreover, the arrangement of the semiconductor chips is flexible. Further, the material of the metal bump connection portion can be saved, and thus the cost can be reduced.

Further, as described in claim 9, in the metal bump connecting portions of the plurality of steps, the metal bump connecting portions are radially arranged on the mounting surface of the semiconductor chip of the package body, and the pitch becomes narrower toward the inner step. There is.

In the above semiconductor device of the present invention, since the pitch of the metal bump connection portions becomes narrower inside the mounting surface of the semiconductor chip of the package body, it is possible to arrange the high density metal bump connection portions. Therefore, it is suitable for mounting a semiconductor chip having a large number of metal bump connection portions.

Further, as described in claim 10, the size of the metal bump connecting portion having a plurality of steps is reduced toward the inner step. In the semiconductor device of the present invention, since the size and pitch of the metal bump connection portions are narrowed inside the mounting surface of the semiconductor chip of the package body, it is possible to arrange the high-density metal bump connection portions, It is suitable for mounting a semiconductor chip having a large number of metal bump connection portions.

[0022]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. The same parts as those in FIG. 4 are designated by the same reference numerals, and only different parts will be described. (First Embodiment) FIG. 1A is a plan view showing a package according to the first embodiment of the present invention. FIG.
1B and 1C are a plan view of the connection surface of the semiconductor chips 1a and 1b and a cross-sectional view when the semiconductor chips 1a and 1b are mounted in the package shown in FIG. It is a thing.

As shown in FIG. 1A, a metal bump connecting portion 8 is formed on the package body 2 and extends radially from the center of the package body 2. The metal bump connection portion 8 has a trapezoidal shape. The trapezoid is elongated toward the center of the radial arrangement and is narrower on the center side and wider on the opposite side. The shape of the metal bump connecting portion 8 is a parallelogram, a strip, a fan, a rectangle,
The shape may be an ellipse or an irregular shape. The center of the radial arrangement may not be the center of the package body 2.
The width of the metal bump connecting portion 8 may be constant.

As shown in FIG. 1B, a relatively large semiconductor chip 1a is flip-chip mounted on the package body 2. Comparing the vicinity of the periphery on the surface of the package main body 2 with the inside thereof, the pitch and width of the metal bump connecting portions 8 near the periphery are wide, and therefore the pads 7 provided on the relatively large semiconductor chip 1a are compared. The position will be the same.

On the other hand, as shown in FIG. 1C, the positions of the pads 7 of the relatively small semiconductor chip 1b coincide with the inner metal bump connection portions 8 having a narrow pitch and a narrow width. Therefore, as in the case of FIG. 1B, the relatively small semiconductor chip 1b is flip-chip mounted on the package body 2.

In the first embodiment, since many types of semiconductor chips 1 having different pad pitches can be flip-chip mounted in one type of package, the package can be generalized and the cost can be reduced. In addition, the productivity of the semiconductor device using the package is improved and the cost is reduced. Further, since the metal bump connecting portions 8 are radially extended, it is possible to correspond to a square or rectangular semiconductor chip 1 having an arbitrary size. Also, the metal bump connecting portion 8
Since the width of the radial arrangement is narrower on the center side of the radial arrangement, it is possible to arrange the metal bump connecting portions 8 at a high density, and thus it is suitable for mounting the semiconductor chips on the high density pads 7. There is. Further, it is possible to easily deal with the arrangement of many pads 7 such as when the pads 7 are provided not only in the periphery of the semiconductor chips 1a and 1b but also inside. (Second Embodiment) FIGS. 2 and 3 are views showing the configuration of the second embodiment of the present invention. The same parts as those in the first embodiment are designated by the same reference numerals, and only different parts will be described. 2A is a plan view of the connection surface of the package of the second embodiment, and FIG. 2B is an enlarged view of a part 10 thereof. FIG. 3 (a) shows the packages 2, 9a, 9
FIG. 3B is a cross-sectional view when the semiconductor chip 1 is flip-chip mounted on b, 9c, 5 and 12, and FIG. 3B is a plan view of FIG. 3A viewed from above.

As shown in FIG. 2A, the innermost first
The stepped metal bump connecting portion 9a, the second step metallic bump connecting portion 9b, and the outermost third step metallic bump connecting portion 9c are arranged radially in that order from the center of the semiconductor chip 1. Each of the metal bump connection parts 9a, 9b, 9
c is divided by the insulating coat 11. The pitch gradually increases from the inner metal bump connecting portion 9a to the outer metal bump connecting portion 9c. In addition, the size increases in that order. Therefore, the semiconductor chips 1 having the pads 7 of three different pitches are mounted.

As shown in FIG. 2B, the metal bump connecting portions 9a, 9b, 9c are arranged such that the metal bump connecting portions 8 of the first embodiment are arranged from the center of the radial arrangement to the periphery. The layout is divided into three parts in the opposite direction. That is, the metal bump connecting portions 9a, 9b and 9c are arranged on a straight line passing through the center of one radial arrangement. The arrangement of the metal bump connecting portions 9a, 9b and 9c does not have to be along the straight line and may be deviated. Further, the area of the metal bump connecting portion may be gradually increased from the inner metal bump connecting portion 9a to the outer metal bump connecting portion 9c.

As shown in FIG. 3A, the semiconductor chip 1
Are flip-chip mounted on the packages 2, 9a, 9b, 9c, 5 and 12. The position of the pad 7 of the semiconductor chip 1 is aligned with the position of the metal bump connecting portion 9c of the third stage. The connection of the respective metal bump connection portions 9c and 7 is performed by a heat treatment using solder. After the connection of the semiconductor chip 1, the gap between the semiconductor chip 1 and the package body 2 is filled with a sealing material (for example, a thermosetting epoxy resin, epoxy, polyimide) and is open and cured. still,
For the purpose of increasing the strength, the entire surface of the proximity surface between the semiconductor chip 1 and the package body 2 is filled with a sealing material,
And the package body 2 are cured and sealed.

In the case of FIG. 3 (a), the external lead-out conductor 5 connected to the metal bump connecting portions 9a, 9b, 9c of the package is provided on the surface of the package body opposite to the surface having the metal bump connecting portions. ing. After the sealing material is hardened, the high melting point solder balls 12 are connected to the external extraction pads 5 by soldering. The high melting point solder balls 12 are connected to, for example, wiring of a substrate (not shown). In the case of a signal terminal, the metal bump connecting portions 9a, 9b, 9c correspond to the external lead conductor 5 in a one-to-one correspondence. In the case of power and ground terminals, a large number of bump connecting portions 9a, 9b, 9c correspond to a small number or one pad 5 for extracting an external signal.

Incidentally, the metal bump connecting portion 9a of the package,
The shapes of 9b and 9c are not limited to the quadrangular shape in FIG. 2B, but may be rectangular, trapezoidal, circular, strip-shaped, oval, or fan-shaped. The fan shape or the trapezoidal shape is preferable as the bump connection portions 9a, 9b, 9c because the fan shape or the trapezoidal shape becomes narrower on the inner side and wider on the outer side where the distance to the adjacent bump connecting portions 9a, 9b, 9c is smaller.

The radial centers of the metal bump connecting portions 9a, 9b, 9c do not have to coincide with each other. For example, when the semiconductor chip 1 is always arranged in one corner instead of the center of the package, the metal bump connecting portions 9a, 9b, 9c are directed toward the one corner.
The radial centers of each of them are in that order larger toward the corner. Also, the metal bump connecting portion 9a of the package,
The arrangement of 9b and 9c is arranged in a square shape along the contour of the package body 2, but the arrangement is not limited to this arrangement, and may be arranged according to the pad 7 of the semiconductor chip 1.

In the second embodiment, similar to the first embodiment, the cost of the package is reduced and the productivity of the semiconductor device using the package is improved. Further, since the metal bump connecting portions 9a, 9b, 9c of a plurality of stages are provided corresponding to the respective pads 7 of the plurality of types of semiconductor chips 1 having different pitches of the pads 7, the semiconductor chip 1 can be flexibly arranged easily. It will be possible. Further, the materials of the metal bump connecting portions 9a, 9b, 9c of the package, the plating material and the material of the conductor 5 for external extraction are reduced, and the cost of the package can be further reduced. This is particularly noticeable when using gold. Also, a plurality of metal bump connecting portions 9a, 9
b and 9c are smaller in size and the pitch of the pads 7 is narrower toward the inner side of the mounting surface of the semiconductor chip 1 of the package body 2, so that the high density metal bump connecting portions 9a and 9b, 9c can be arranged, and
The structure is suitable when the number of metal bump connecting portions 9a, 9b, 9c is large. In addition, the metal bump connection portion 8 of the package,
The positions of 9a, 9b, 9c and the position of the conductor 5 for external extraction need not be the same corresponding positions (plane symmetry).

[0034]

[Examples] Experimental examples will be described. The size of the package body 2 is 21 mm × 21 mm, and the material is alumina. The wiring material is tungsten. The metal bump connecting portions 9a, 9b, 9c on the package body 2 are made of nickel 1.0 to 1.5.
The surface is plated with 0.2 μm of gold. Further, the pitch of the first-stage metal bump connecting portions 9a is 1
00 μm, the pitch of the second-stage metal bump connecting portion 9b is 1
50 μm, the pitch of the third-stage metal bump connecting portions 9c is 2
It is 00 μm. As shown in FIG. 3 (a),
The pad pitch of the semiconductor chip 1 mounted on the packages 2, 9a, 9b, 9c, 5 and 12 is 200 μm.
The size is 17.5 mm × 17.5 mm.
Therefore, the pads 7 of the semiconductor chip 1 and the metal bump connecting portions 9c of the package have the same pitch, and their positions match each other. The connection between the pad 7 of the semiconductor chip 1 and the metal bump connection portion 9c of the package is 63Sn / 3.
Using eutectic solder of 7Pb composition as the metal bump 3,
It is carried out by heating in a N ₂ atmosphere at 230 ° C. At this time, the composition of the high melting point solder ball 12 is 90 Pb / 10S.
n, the size is Φ 0.7 mm. 63Sn / 3
Using eutectic solder of 7Pb composition, 1mm pitch 324
This high melting point solder ball is attached to the external extraction conductor 5 at a certain place.

[0035]

As described above, according to the present invention, it is possible to provide a package in which various kinds of semiconductor chips can be mounted and a low-cost semiconductor device.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating a package and a semiconductor device according to a first embodiment of the present invention.

FIG. 2 is a diagram illustrating a package and a semiconductor device according to a second embodiment of the present invention.

FIG. 3 is a diagram illustrating a package and a semiconductor device according to a second embodiment of the present invention.

FIG. 4 is a view showing an example of a conventional package and semiconductor device.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Semiconductor chip, 2 ... Package main body, 3 ... Metal bump, 4 ... Sealing member, 5 ... External extraction conductor of package main body, 7 ... Semiconductor chip pad, 8, 9a, 9b, 9c
… Metal bump connection part of package body, 11… Insulating coat.

Claims (10)

[Claims] 1. A package body on which a semiconductor chip is mounted by flip-chip connection, and a package body extending radially on a mounting surface of the semiconductor chip of the package body and connected to respective pads of the semiconductor chip via metal bumps. A package characterized in that it has a plurality of metal bump connection parts that enable the mounting of semiconductor chips with different pad pitches. 2. The package according to claim 1, wherein the plurality of metal bump connecting portions are formed so that a width thereof in a direction perpendicular to a radial diameter thereof becomes narrower toward an inner side. 3. A package body on which a semiconductor chip is mounted by flip chip connection, and a semiconductor chip mounting surface of the package body, which is arranged corresponding to each pad of a plurality of types of semiconductor chips having different pad pitches. , A plurality of metal bump connection portions connected to the respective pads of the semiconductor chip via the metal bumps, and by selecting the metal bump connection portions of the semiconductor chips according to the pad pitch, A package characterized by being able to mount semiconductor chips with different pitches. 4. The metal bump connecting portions of a plurality of steps are arranged radially on a mounting surface of a semiconductor chip of the package body, and the pitch is formed narrower toward an inner step. The package described in 2. 5. The package according to claim 4, wherein the plurality of metal bump connecting portions are formed such that their sizes decrease toward the inner layers. 6. A semiconductor chip, a package body on which the semiconductor chip is mounted by flip chip connection, and a metal bump which is radially extended on a mounting surface of the semiconductor chip of the package body and is provided on each pad of the semiconductor chip. A plurality of metal bump connection parts connected via, a sealing member for sealing at least the mounting surface vicinity of the semiconductor chip and the package, and provided on the back surface of the mounting surface of the semiconductor chip in the package body, And an external lead conductor electrically connected to the plurality of metal bump connection portions, respectively, wherein the semiconductor chip is mounted at an extended position of the metal bump connection portion according to a pad pitch. A semiconductor device characterized by the above. 7. The semiconductor device according to claim 6, wherein the plurality of metal bump connecting portions are formed so that a width thereof in a direction perpendicular to a radial diameter thereof becomes narrower toward an inner side. 8. A semiconductor chip, a package body on which the semiconductor chip is mounted by flip-chip connection, and a semiconductor chip mounting surface of the package body on each pad of a plurality of types of semiconductor chips having different pad pitches. A plurality of stages of metal bump connecting portions which are arranged correspondingly and are connected to the respective pads of the semiconductor chip via metal bumps, and a sealing member for sealing at least the mounting surface vicinity of the semiconductor chip and the package. An external extraction conductor that is provided on the back surface of the mounting surface of the semiconductor chip in the package body and that is electrically connected to each of the plurality of metal bump connection portions. A semiconductor device, characterized in that it is mounted by selecting metal bump connection portions in different stages. 9. The method according to claim 8, wherein the plurality of metal bump connecting portions are radially arranged on the mounting surface of the semiconductor chip of the package body, and the pitch becomes narrower toward the inner step. Semiconductor device. 10. The semiconductor device according to claim 9, wherein the plurality of metal bump connection portions are reduced in size toward the inner layer.