JPH09114007A - Linear light source and its fixing method and light source device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To efficiently absorb heat by making it possible to surely absorb the heat quantity from a resistor and preventing the transfer of heat energy to light emitting elements. SOLUTION: The light emitting elements 62, 63, 64 are arranged along one end on the short side on a substrate 59 and the resistor 90 is arranged at the other end on the short side. A heat sink 92 is stuck to the rear surface side of this substrate 59 and plays the role of absorbing the heat generated from the resistor 90 and releasing the heat. This heat sink is stuck only to the rear surface corresponding to the position where the resistor 90 is mounted. Namely, the heat sink is not stuck to the rear surface corresponding to the positions where the light emitting elements 62, 63, 64 are mounted. The reason thereof lies in that there is a large difference between the calorific value of the resistor 90 and the calorific value of the light emitting elements 62, 62, 64 and that the heat absorbed from the resistor 90 is released reversedly to the light emitting elements 62, 63, 64.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is used for irradiating the surface of an original while moving it relative to the original, and for forming an image of the reflected light or the transmitted light on a photoconductor or a photodetector. The present invention relates to a linear light source in which linearly arranged on a substrate at a predetermined interval and arranged so as to be orthogonal to the document conveying direction, a fixing method thereof, and a light source device.

[0002]

2. Description of the Related Art Generally, an image recording apparatus for irradiating a document image with light and forming an image of transmitted light or reflected light on a photosensitive material using a lens system to form an image according to the original image on the photosensitive material. For this, a white light source such as a halogen lamp is used. Further, in the image recording apparatus, using a long light source, the original image and the light source are relatively moved to change the irradiation position of the light from the light source, and the light reflected or transmitted at each irradiation position is sequentially coupled to the photosensitive material. So-called slit exposure is performed to form an image. It should be noted that an image reading device can be obtained by arranging a light receiving element instead of the photosensitive material in the same configuration as described above.

By the way, when a white light source such as a halogen lamp is used as a light source for exposing a color image, it is necessary to use a filter for color correction. On the other hand, for the purpose of downsizing the light source device, for example, an LED (Light Emitting Diode) that emits red (R), green (G), and blue (B) colors.
Is proposed as a light source (for example, Japanese Patent Application No. 6-149609). The LED emits light having a wavelength corresponding to the crystal material by applying a predetermined bias voltage to the crystal material in the light emitting element.
The power consumption and heat generation are small, and the blinking response is good.

In an exposure apparatus using an LED as a light source,
When using a three LED array that arranges a large number of light emitting elements and emits red, green and blue lights separately,
There may be a case where a plurality of LEDs of each color are arranged on a book array in a predetermined order.

In any case, when LEDs are arranged in a line to form a line light source, a plurality of (for example, 5) LEs are used.
One resistor is connected in series to D (1 unit), and the light amount can be adjusted by selecting this resistor. For example, when 100 LEDs are arranged, 25 units are required.

Both the LED and the resistor are arranged on a substrate, and a heat sink (metal plate such as aluminum) is attached to the substrate.

For example, if a current of 20 mA is applied to each of the above units and a resistance of 68 Ω is added, the power per unit is 0.272 W, and the total power is 6.8 W.

On the other hand, aluminum (heat sink) is
Its external dimensions are 3 x 10 x 100 mm, so the volume is 3
It becomes cm ³ . From the specific gravity of aluminum (2.7 g / cm ³ ), the weight is 8.1 g, and if the total specific heat amount is calculated based on the specific heat of aluminum (0.9 J / gk), it is 8.1 g × 0.9 J / g = 7.3 J / k Becomes

Therefore, for example, the aluminum heat sink when the LED is turned on for 5 seconds is 6.8w × 5sec / 7.3J / K = 4.
It becomes 6 and rises by about 5 ° C. When this temperature rise is applied to the LED, wavelength shift and fluctuation of the received light amount occur.

[0010]

In consideration of the above facts, the present invention can reliably absorb the amount of heat from the resistor, prevent the transfer of heat energy to the light emitting element, and efficiently absorb the heat. It is an object to obtain a linear light source that can be performed, a fixing method thereof, and a light source device.

[0011]

The invention according to claim 1 is a linear light source in which a plurality of light emitting elements are linearly arranged at a predetermined interval on a substrate, and absorbs heat generated on the substrate. ,
In addition, a heat sink that radiates heat is arranged on the back surface side of the substrate in a region excluding the region corresponding to the light emitting element on the substrate and the vicinity thereof.

According to the first aspect of the invention, when the heat sink absorbs and radiates the heat energy due to the light emission of the linearly arranged light emitting elements,
In order to prevent heat from being transferred from the heat sink to the light emitting element, it was arranged on the back surface side of the substrate in a region except the region corresponding to the light emitting element and its vicinity. Therefore, the light emitting element does not cause a wavelength shift or a light amount variation due to heat, and stable light can be output.

According to a second aspect of the present invention, in the linear light source fixing method for fixing the linear light source according to the first aspect to a predetermined position, a bracket is attached to the heat sink and fixed to the predetermined position via the bracket. It is characterized by doing.

According to the second aspect of the invention, the heat accumulated in the heat sink is released by natural heat dissipation.
By attaching this heat sink to the bracket,
The heat conduction allows rapid recovery of heat from the heat sink itself.

The third aspect of the present invention is used for irradiating the surface of the original while moving relative to the original, and for forming an image of the reflected light or the transmitted light on the photoconductor or the photodetector, and a plurality of light emission. A light source device in which elements are linearly arranged on a substrate at a predetermined interval and arranged so as to be orthogonal to a conveyance direction of the original, the light source device being provided on the substrate and adjusting light amounts of the plurality of light emitting elements. A resistor connected in series for each predetermined number of light emitting elements, and a heat sink provided on the back side of the mounting surface of the light emitting element and the resistor on the substrate, for absorbing and releasing heat generated on the substrate, It is characterized in that the heating is arranged in a region of the substrate excluding the light emitting element and the periphery of the back surface.

According to the third aspect of the invention, the heat sink absorbs the heat generated from the resistor and radiates the heat.
No heat is accumulated on the substrate. By the way, since the light emitting element also generates heat, conventionally, a heat sink is also arranged at a position corresponding to the light emitting element (on the back surface side of the surface on which the light emitting element is mounted). However, since the resistance generates a large amount of heat, the light emitting element is heated on the contrary, which causes a wavelength variation and a light reception amount variation. Therefore, in the invention according to the first aspect, the heat sink is arranged in the region of the substrate excluding the light emitting element and the periphery of the back surface side. With this, the amount of heat from the resistor can be reliably absorbed, transfer of heat energy to the light emitting element can be prevented, and heat can be efficiently absorbed.

According to a fourth aspect of the present invention, the light emitting element and the resistor are separately arranged on both end sides of the substrate, and the light emitting element is mounted on a surface facing the original, The resistor is attached to a surface parallel to a surface along a line connecting the light emitting element and the document.

According to the invention of claim 4, the light emitting element and the resistor are separated as much as possible, so that the temperature of the light emitting element does not rise due to the heat generated by the resistor. Further, since the light emitting element is arranged on the surface facing the original, and the resistance is attached to the surface at 90 ° to the surface, that is, the surface along the line connecting the light emitting element and the original, the resistance radiates from the resistance. It does not directly receive the heat generated by.

According to a fifth aspect of the present invention, the light emitting element and the resistor are separately arranged on both end sides of the substrate, and the light emitting element and the resistor are along a line connecting the light emitting element and the document. It is characterized in that it is mounted on a surface parallel to the curved surface and the optical axis of the light emitting element is bent by a mirror to deflect it toward the original.

According to the invention of claim 5, claim 4
Since the light emitting element and the resistor are separated as much as possible,
The heat generated by the resistance does not raise the temperature of the light emitting element. Further, according to the fifth aspect, the light emitting element and the resistor are arranged on the same plane (the surface along the line connecting the light emitting element and the document), so that the conventional substrate can be used as it is. Further, the maximum light emitting direction (front side) of the light emitting element is directed toward the original by a mirror, and this mirror serves as a shielding plate for blocking heat from the resistor, so that heat from the resistor is not directly received. .

[0021]

BEST MODE FOR CARRYING OUT THE INVENTION

(First Embodiment) FIG. 1 shows an image recording apparatus according to a first embodiment of the present invention.

At the center of the base 10 of the image recording apparatus,
A stage 12 is provided. The stage 12 has a flat plate shape and is arranged parallel to the apparatus installation surface.
The stage 12 has a three-layer structure in which a heating plate is interposed between an aluminum plate on the upper surface side and a stainless steel plate on the lower surface side, and by energizing the heating plate, the entire upper surface of the stage 12 is , Can be heated to 80 ° C.

A first roller 20 is provided below the front end side of the stage 12 (right end side in FIG. 1).
A heat-developable photosensitive material 22 (hereinafter referred to as photosensitive material 22) as a photosensitive material is wound into and housed in a roll. The photosensitive material 22 is composed of photosensitive silver halide, a binder, a dye-providing substance, and a reducing agent on a support, and when it is pulled out from the first roller 20 and held on the stage 12, it is exposed to light. The side faces upward.

Below the stage 12, a second roller 24 is provided near the first roller 20. Second
The photosensitive material 22 that is drawn from the first roller 20 and that is wound around the stage 12 from the front end to the rear end (the left end in FIG. 1) is wound around the roller 24.

A nip roller 26 is disposed between the front end of the stage 12 and the first roller 20.
6 is rotationally driven in the direction of arrow A and the second roller 24 is rotationally driven in the direction of arrow B, the photosensitive material 22
Is pulled out from the first roller 20 as the first roller 20 rotates in the direction of arrow C, and moves on the stage 12 in the direction of arrow D (from the front end to the rear end of the stage 12).
It is pulled by the second roller 24 and wound up. On the contrary, when the first roller 20 is rotationally driven in the direction opposite to the arrow C and the nip roller 26 is rotationally driven in the direction opposite to the arrow A, the photosensitive material 22 moves on the stage 12 opposite to the arrow D. Is moved in the direction of arrow E, and is rewound from the second roller 24 to the first roller 20 as the second roller 24 rotates in the direction opposite to the arrow B.

A document table 32 is mounted on the upper surface 11 of the base above the stage 12 so as to face the stage 12.
The document table 32 is formed of a transparent plate, and a document 34 is placed and held on the document table 32.

An exposure unit 38, a coating unit 40, and a superposition unit 42 are respectively provided on the side portions of the stage 12, and the units 38, 40, and 42 are provided between the original table 32 and the stage 12, respectively. 12
It has a moving mechanism that can reciprocate along the front-back direction.

The exposure unit 38 includes a light source 44 and a SELFOC lens (lens array) 46.

As shown in FIGS. 2-4, the light source 44
Are three colors, such as R (red), G (green), and B.
An LED array 66 is provided in which (blue) light emitting elements 62, 63, 64 of 0.3 mm square are arranged linearly along the longitudinal direction at one end of the substrate 59 in the short side direction. This LE
In the D array 66, the light emitting elements 62, 63, 64 are alternately arranged at predetermined intervals, and the light emitting elements 62, 6
Electrodes are provided on both sides of the substrate 59 so as to sandwich the electrodes 3 and 64. In the present embodiment, the light emitting elements 62, 63,
64 is a repeat of R-G-B-G, and R: G: B.
100 light emitting elements are linearly arranged at a ratio of = 1: 2: 1.

In these LED arrays 66, since the light emitting elements 62, 63, 64 are arranged linearly, electrodes can be provided on both sides, and a large number of light emitting elements 62, 63, 64 are arranged at a narrow pitch. Can be placed.

As shown in FIG. 3, the light emitting elements 62, 6
As for 3 and 64, 5 pieces of the same color are connected in series, and these 5 pieces are made into one unit, and the resistors 90 are respectively connected in series.

The resistor 90 is for adjusting the amount of light of the light emitting elements 62, 63, 64 connected in series, whereby the linear light emitting elements 62, 63, 64 are adjusted.
The light amount distribution of the whole is controlled substantially uniformly.

By the way, as shown in FIG. 4A, on the substrate 59, the light emitting elements 62, 63, 64 are arranged along one end portion on the short side, as described above. The resistor 90 is arranged at the other end of the short side. In this embodiment, the size of the substrate is 30 mm × 100 mm, and the thickness t is about 1 mm. In this case, the light emitting elements 62, 63,
The pitch dimension L between the resistor 64 and the resistor 90 is 5 mm, preferably 7
It is desirable that they are separated by mm or more.

This dimension varies depending on the thickness of the substrate 59, and may be L / t <5 mm. In addition,
This numerical value is effective when the thermal conductivity K _A of the substrate 59 is 10 W / mK or more (K _A <10 W / mK).

Light emitting elements 62, 63, 6 on the substrate 59
A heat sink 92 is attached to the back surface side of the surface on which the resistor 4 and the resistor 90 are attached. This heat sink 92
Is made of aluminum and has a plate shape. The heat sink 92 absorbs heat generated from the resistor 90,
It also has a role of radiating heat, and is attached only to the back surface corresponding to the mounting position of the resistor 90. That is, on the back surface corresponding to the mounting positions of the light emitting elements 62, 63, 64,
Not attached (see FIG. 4A).

This is because the amount of heat generated by the resistor 90 and the light emitting element 6
There is a large difference between the heat generation amounts of 2, 63, and 64, and the resistance 90
This is because the heat absorbed by the element may be radiated to the light emitting elements 62, 63 and 64. The outer dimensions of the heat sink 92 are 20 × 100 mm, and the wall thickness is 3 mm. Here, as shown in FIG. 4B, there is no problem in independently providing the heat sink 92A on the back surface side of the substrate 59 corresponding to the light emitting elements 62, 63, 64.

The light from the LED array 44 is directed toward the original 34, and the irradiation light is parallel to the original 34 and perpendicular to the moving direction of the exposure unit 38 (the front-back direction of the stage 12), as shown in FIG. It is made to be a straight line along the front and back directions of the paper. The irradiation light is reflected by the original 34, and the reflected light is reflected by the SELFOC lens 46.
It is exposed in slit form. As the exposure unit 38 advances from the standby position toward the stop position, the original 34
Image is sequentially scanned and exposed on the photosensitive material 22.

The coating unit 40 includes a tank (container) 52.
Is provided with a sponge (applying portion) 54 at the bottom. The tank 52 is in the form of a long rectangular box parallel to the photosensitive material 22 and perpendicular to the front-back direction of the stage 12, and is sealed.
A transfer aid (image forming solvent) such as water 58 is enclosed in the tank 52. The sponge 54 is fixed to the outer surface (lower surface of the lid) of the lid 56, and the lid 56 has a communication port 60 communicating with the sponge 54. The water in the tank 52 is absorbed and held by the sponge 54 through the communication port 60. The sponge 54 is pressed against and brought into contact with the photosensitive material 22 by the urging force. When the sponge 54 contacts the photosensitive material 22,
The water absorbed and held by the sponge 54 flows out to the photosensitive material 22.

Water is sequentially applied to the photosensitive material 22 by advancing the coating unit 40 while the sponge 54 is in contact with the photosensitive material 22.

The superposing unit 42 is provided with a magazine 76. In the magazine 76, the image receiving material 78 is cut into a predetermined length, stacked and accommodated in parallel with the stage 12. One surface of the image receiving material 78 is an image forming surface, and the image forming surface is coated with a dye fixing material having a mordant. When the image receiving material 78 is accommodated, the image forming surface faces upward. It An endless belt 80 is wound around rollers 82 and 84 below the magazine 76. The roller 8 on the stage 12 side at the standby position of the stacking unit 42
A guide portion 81 is provided on the outer periphery of the No. 4.

As the stacking unit 42 advances, the endless belt 80 reaches the stage 12, and the endless belt 80
2 corresponds to the forward movement of the stacking unit and travels clockwise in FIG. As the endless belt 80 travels, the image receiving material 78 in the magazine 76 is pulled out from the magazine 76 by the guide portion 81, the image receiving material 78 is inverted, and the leading end of the image receiving material 78 comes into contact with the photosensitive material 22, and thereafter. As the superposition unit 42 moves, the image-receiving material 78 becomes an endless belt 80.
And the photosensitive material 22 so as to be sandwiched between the photosensitive material 22 and the photosensitive material 22.
Overlaid with 2.

The water 58 applied to the photosensitive material 22 is swollen by the photosensitive material 22. The polymerization unit 42 moves forward at a distance from the coating unit 40 so as to secure the time required for this swelling. After swelling, water 58 on the photosensitive material 22
Is squeezed. This squeezing may be performed by a roller (not shown), but it can also be performed by utilizing the rigidity of the image receiving material 78 with the superposition of the superposition unit 42. The rigidity contributes to high adhesion between the image receiving material 78 and the photosensitive material 22.

The stage 12 is heated by the heating plate as described above, and in the heated state, the above-mentioned exposure, coating and polymerization are performed, and water is heated for coating. That is, the water 58 is heated in the process of flowing out from the sponge 54 to the photosensitive material 22, and the discharged water after coating is also heated.

Further, by the heating of the stage 12, the heat development transfer is carried out in a state where the image receiving material 78 and the photosensitive material 22 are superposed on each other. That is, the movable dye of the photosensitive material 22 is released, and at the same time, the dye is transferred to the dye fixing layer of the image receiving material 78, and an image is obtained on the image receiving material 78.

After the thermal development transfer, the photosensitive material 22 moves in the direction of arrow D for a predetermined length and is discharged together with the image receiving material 22 from the rear end of the stage 12 to the outside of the stage 12.

A drive motor is provided on the base 10 on the front side of the front end of the stage 12, and the drive motor includes an exposure unit 38, a coating unit 40, and a superposition unit 42 via gears and the like. Drive to move.

The operation of this embodiment will be described below.
First, the overall operation of this device including the units 38, 40, 42, etc. will be described.

First, the photosensitive material 22 is conveyed, and is drawn and held on the stage 12 by a predetermined length.

Next, when the exposure unit 38 advances from the standby position to the stop position and enters the image area 48 of the photosensitive material 22, the light source 44 starts emitting light, and continues to emit light in the image area 48. The image of the original 34 on the original table 32 is scanned and exposed on the photosensitive material 22.

When the exposure unit 38 passes the image area 48 and enters the front image area 50, the light source 44 stops emitting light. After that, the light source 44 does not emit light, and the exposure unit 38 advances to the stop position and stops there.

When the exposure unit 38 enters the front image area past the image area 48 and the light source 44 ceases to emit light,
The coating unit 40 starts moving forward.

The coating unit 40 is initially in the raised position and separated from the photosensitive material. The coating unit 40 enters the stage 12, and the sponge 54 descends and comes into contact with the photosensitive material 22 while it is stopped.

After the contact, the coating unit 40 resumes the advance, and when the sponge 54 reaches the rear region 50 in the contact state, the sponge 54 separates from the photosensitive material 22 to stop the contact with the photosensitive material 22. Then, the coating unit 40
Moves to a stop and stops there.

The polymerizing unit 42 starts advancing when the coating unit 40 temporarily stops its advancing due to contact of the sponge 54 with the photosensitive material 22. Along with this, the image receiving material 78 is superposed on the photosensitive material 22. When the polymerization is completed, the polymerization unit 42 reaches the stop position and stops there.

At this time, the image receiving material 78 is superposed on the photosensitive material 22 while squeezing the water applied by the applying unit 40.

When the superposition unit 42 is stopped at the stop position, it is left as it is for a predetermined time, and thermal development transfer is performed.

After the thermal development transfer, the photosensitive material 22 is conveyed by being pulled by the second roller 24 by a predetermined length, and is discharged from the rear end of the stage 12 to the outside of the stage 12 together with the image receiving material 78.

Along with this discharging, the image receiving material 78 is peeled off from the photosensitive material 22, passes over the peeling roller 86 on the rear side of the rear end of the stage 12, and is discharged to the discharging tray on the rear side of the peeling roller 86. Collected in 88. On the other hand, in the photosensitive material 22, the portion which has been subjected to the thermal development transfer is turned upside down so as to be positioned between the rear end of the stage 12 and the second roller 24.

The heat-development-transferred portion located between the second roller 24 and the rear end of the stage 12 has the coating surface facing downward, whereby the water 58 drops without remaining on the photosensitive material 22. Therefore, when the photosensitive material 22 described later is rewound and the portion subjected to the thermal development transfer returns to the stage 12, the influence of water remaining on the photosensitive material 22 is avoided.

After that, the exposure unit 38, the coating unit 40, and the superposition unit 42 retreat from the stopping position to the standby position with the superposition unit 42 at the head, and prepare for the next exposure, coating, and superposition.

Next, the photosensitive material 22 is rewound by a predetermined length on the first roller 20. As a result, the image area 48 which has already been exposed and which has been subjected to the heat development transfer is located on the stage 12.

On the common stage 12, exposure of the photosensitive material 22, application of water, polymerization of the image receiving material 78, and thermal development transfer to the image receiving material 78 are performed, and an image is obtained on the image receiving material 78.

Here, in the first embodiment, the light emitting elements 62, 63, 64 and the resistor are arranged as far apart as possible on the substrate 59, so that the heat generated from the resistor 90 is minimally affected. Can be suppressed to Moreover, the heat sink 92 attached to the back surface of the substrate 59 is provided only on the surface corresponding to the resistor 90, and is not provided on the back surface side corresponding to the light emitting elements 62, 63, 64. As a result, the heat absorbed from the resistor 90 is reversed from the heat sink 92 to the light emitting elements 62, 6
The emission to the light emitting elements 62 and 6 is eliminated.
It is possible to prevent the wavelength shift and the variation of the light emission amount due to the temperature increase of 3 and 64.

(Second Embodiment) The second embodiment of the present invention will be described below. The same components as those of the first embodiment are designated by the same reference numerals and the description of the components will be omitted. The feature of the second embodiment is the structure of the light source 44 of the exposure unit 38.

As shown in FIG. 5, in the light source 44, the corners of the heat sink 92 are cut obliquely, and the cutting angle of this cutting surface is the substrate 59 by making this cutting surface vertical. Surface (light emitting elements 62, 63, 64
And the mounting surface of the resistor 90) is oriented toward the document, and the optical axes of the light emitting elements 62, 63, 64 are set to coincide with the document reading position.

The substrate 59 is held by attaching the cut surface to the vertical portion of the metal bracket 94 bent in an approximately L shape. The horizontal portion of the metal bracket 94 is fixed to the horizontal portion of the device, whereby the heat absorbed by the heat sink 92 is transmitted to the metal bracket 94 and further to the device frame or the like. The heat dissipation effect of the heat sink 92 can be increased, and the heat generated by the resistor 90 can be efficiently absorbed.

(Third Embodiment) The third embodiment of the present invention will be described below. The same components as those of the first embodiment are designated by the same reference numerals and the description of the components will be omitted. The feature of the third embodiment lies in the shape of the substrate 59 and the mounting positions of the light emitting elements 62, 63, 64 and the resistor 90.

As shown in FIG. 6, the substrate 59 has one end along the short side (end on the side where the light emitting elements 62, 63, 64 are attached) bent substantially at a right angle. For this reason,
Only the bent end is directed toward the document, and the side to which the resistor 90 is attached is turned in a direction of about 90 ° with respect to this.

As shown in FIG. 6, in the third embodiment, the upper surface of the heat sink 92 is cut obliquely (approximately 45 °), and this cut surface is in close contact with the back surface side of the resistance mounting surface. Has been fixed. The light source 44 is held by fixing the heat sink 92 with the L-shaped metal bracket 94.

With this structure, of the heat generated from the resistor 90, the heat released directly to the outside air is
It becomes difficult for the light to be transmitted to the light emitting elements 62, 63, 64, and the heat shielding effect of the light emitting elements 62, 63, 64 can be further improved. The metal bracket 9 from the heat sink 92
The heat radiation through 4 is the same as that in the second embodiment.

(Fourth Embodiment) The third embodiment of the present invention will be described below. The same components as those of the first embodiment are designated by the same reference numerals and the description of the components will be omitted. The feature of the fourth embodiment lies in the shape of the substrate 59 and the mounting positions of the light emitting elements 62, 63, 64 and the resistor 90.

As shown in FIG. 7, in the fourth embodiment, the thickness of the substrate 59 is enlarged, and the light emitting elements 62, 63, 64 are provided on the end face of the substrate 59 facing the original. ing. As a result, the same effect as that of the third embodiment can be obtained.

(Fifth Embodiment) The fifth embodiment of the present invention will be described below. The same components as those of the first embodiment are designated by the same reference numerals and the description of the components will be omitted. The features of the fifth embodiment are the shape of the substrate 59 and the mounting positions of the light emitting elements 62, 63, 64 and the resistor 90.

As shown in FIG. 8, in the fifth embodiment, the substrate 59 is the same as before (first embodiment), and the surface of the substrate 59 is approximately 9 from the position facing the original.
It is fixed by a metal bracket 94 via a heat sink 92 so as to face the direction of 0 °. The light emitting elements 62, 63, 64 are attached to one end of the surface of the substrate 59 on the short side, and the resistor 90 is attached to the other end. Further, on the surface of the substrate 59, a mirror 96 corresponding to the light emitting elements 62, 63, 64 is approximately 45 ° with respect to the surface of the substrate 59.
The light emitting elements 62, 63, 64 and the resistor 90 are shielded from each other. The reflecting surface of the mirror is directed toward the light emitting elements 62, 63, 64, and therefore the light output from the light emitting elements 62, 63, 64 is
It is reflected by the mirror 96 and guided to the document reading position.

Since the mirror 96 shields the light emitting elements 62, 63, 64 and the resistor 90 in this manner, the resistor 9
The light emitting elements 62, 63, 64 can be protected from the heat generated from zero.

In the third to fifth embodiments described above, the substrate 59 does not hit the manuscript table due to the device configuration,
Since it can correspond to the empty space in the device,
The device can be made compact.

(Sixth Embodiment) The sixth embodiment of the present invention will be described below. The same components as those of the first embodiment are designated by the same reference numerals and the description of the components will be omitted. The feature of the sixth embodiment is that a high-brightness reflective L
I used ED. First, this high-brightness reflective LE
D will be described.

Conventionally, a resin lens type is generally used as an LED, and a chip which is a light emitting source is embedded in a cannonball type or rectangular block type resin lens, and an anode and a cathode terminal are projected from a bottom portion of the resin lens. It has a different structure.

On the other hand, in recent years, LEDs called high-brightness reflective LEDs have been developed. This high brightness reflective LED
Has a chip embedded in the center of a thin resin (eg, epoxy resin) molded product.

The chip has a structure in which electrodes are provided on the front and back surfaces, respectively, and lead wires are directly or directly connected through a gold wire. Opposing surfaces of the resin molded product are a plane emission surface and a parabolic reflection surface, respectively, and a reflecting mirror is attached to the reflection surface. The chip is arranged at the focal position of the reflecting surface, and as a result, the light emitted from the chip is reflected by the reflecting surface to become parallel light, which is output from the parabolic surface.
Since most of the light output from the chip is once received by the reflecting surface and output, the resin lens mold L
The light extraction efficiency can be improved by 2 to 5 times as compared with ED, and it can be sufficiently used as a light source for exposure. Hereinafter, the LEDs applied in the sixth embodiment will be referred to as high brightness light emitting elements 62H, 63H, 64H.

As shown in FIG. 9, the substrate 59 is bent at a substantially right angle along the short side. A heat sink 92 is attached to the back side of the substrate 59 corresponding to the resistor 90,
The board 59 is fastened together with screws 98 and nuts 99.

High brightness light emitting elements 62H, 63H, 64H
Is attached to the front end of the substrate 59 which has a parabolic surface halved and is bent and directed toward the original. The chip 100 is at the tip of the substrate 59 and at the focal point of the parabolic surface, and the light reflected from the parabolic surface becomes parallel light, so that no lens is required.

The high brightness light emitting elements 62H, 63H, 64
By applying H, a sufficient amount of light can be secured and the light source 44 can be downsized. Further, since the substrate 59 is bent, the heat radiated from the resistor 90 is hard to be transmitted to the light emitting elements 62H, 63H, 64H, and the space problem can be solved (interference between the original table 32 and the substrate 59 can be prevented. .).

In the above six embodiments, the light source device of the present invention is applied as the light source of the image recording device for recording the original image on the photosensitive material 22.
It is also applicable as a light source of an image reading device that reads with an image sensor or the like.

[0085]

As described above, the linear light source, the method for fixing the same, and the light source device according to the present invention can surely absorb the amount of heat from the resistor and prevent the transfer of heat energy to the light emitting element. It has an excellent effect that heat can be absorbed efficiently.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram of an exposure apparatus according to a first embodiment of the present invention.

FIG. 2 is a plan view of the LED array of the light source according to the first embodiment.

FIG. 3 is a circuit diagram of the LED array according to the first embodiment.

FIG. 4 is an enlarged view of the light source and its periphery according to the first embodiment.

FIG. 5 is an enlarged view of a light source and its periphery according to a second embodiment.

FIG. 6 is an enlarged view of a light source and its surroundings according to a third embodiment.

FIG. 7 is an enlarged view of a light source and its surroundings according to a fourth embodiment.

FIG. 8 is an enlarged view of a light source and its periphery according to a fifth embodiment.

FIG. 9 is an enlarged view of a light source and its periphery according to a sixth embodiment.

[Explanation of symbols]

 22 Photosensitive Material 44 Light Source 59 Substrate 62, 63, 64 Light Emitting Element 66 LED Array 78 Image Receiving Material 90 Resistor 92 Heat Sink

Claims (5)

[Claims] 1. A linear light source in which a plurality of light emitting elements are linearly arranged at a predetermined interval on a substrate, and a heat sink for absorbing and radiating heat generated on the substrate is provided on the back surface side of the substrate. A linear light source, wherein the linear light source is arranged in a region other than a region corresponding to the light emitting element on the substrate and the vicinity thereof. 2. The linear light source fixing method for fixing the linear light source according to claim 1 at a predetermined position, wherein a bracket is attached to the heat sink and is fixed at a predetermined position via the bracket. Light source fixing method. 3. A plurality of light emitting elements are provided on a substrate in a predetermined number, which is used for irradiating the surface of the document while moving relative to the document and for forming an image of the reflected light or the transmitted light on the photoconductor or the photoreceiver. A light source device arranged linearly at intervals and arranged so as to be orthogonal to a relative movement direction of the document, the light source device being provided on the substrate, and having a predetermined number for adjusting light amounts of the plurality of light emitting elements. A resistor connected in series for each light emitting element connected in series, and a heat sink provided on the back surface side of the mounting surface of the light emitting element and the resistor on the substrate, for absorbing and radiating heat generated on the substrate, A light source device, wherein the heating is disposed in a region excluding a region on the back surface side of the substrate corresponding to the light emitting element on the substrate and the vicinity thereof. 4. The light emitting element and the resistor are separately arranged on both end sides of the substrate, and the light emitting element is attached to a surface facing the original, and the resistor is connected to the original and the original. The light source device according to claim 3, wherein the light source device is attached to a surface parallel to a surface along a line connecting the two. 5. The light emitting element and the resistor are arranged separately on both end sides of the substrate, and the light emitting element and the resistor are parallel to a plane along a line connecting the light emitting element and the document. 4. The light source device according to claim 3, wherein the light source device is attached, and the optical axis of the light emitting element is bent by a mirror to deflect toward the original.