JPH09113579A - Inspecting device for ic test device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To inspect the wiring state of a socket board for an IC tester with good reliability by combining an IC socket, contacts, a lead wire, a common connection point, a resistor, and a switching scanning means. SOLUTION: A controller 106 controls the first contact point K1 to the on- state and the second contact point K2 to the off-state, for example, and it feeds a current to signal contacts or a power feed terminal. The current is fed to a common connection point A via a switching scanning means 101, and it flows into a resistor 102. The signal contacts are independent of each other. When the signal contact selected by a switching scanning means 105 coincides with the signal contact selected by the switching scanning means 101, a voltage is generated on the resistor 102, and this voltage is measured by a voltage measuring instrument 104. If the current and the resistance value of the resistor 102 are known, the voltage of the common connection point A and the voltage drop from a DC power source 103 to the common connection point A can be known.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an inspection apparatus for an IC testing apparatus for testing a large number of ICs at one time, for inspecting a wiring state of a portion where an IC to be tested is mounted.

[0002]

2. Description of the Related Art FIG. 2 shows a configuration of a test head of an IC test apparatus. In the figure, 1 indicates a test head, 2 indicates an interface, and 3 indicates a socket board. As shown in FIG. 3, a contact 4 is mounted on the board surface of the socket board 3, and a terminal 6 of an IC socket 5 is mounted on the contact 4 so that an IC
The socket 5 is electrically and mechanically held.
On the socket board 3, a large number of, for example, 16 or 32 or 64 IC sockets 5 are mounted. IC under test
(Not shown) is attached to the IC socket 5,
The test is performed by being electrically connected to the test head 1 through the IC socket 5.

In other words, each contact 4 of the socket board 3 is connected to the test head 1 through the wiring provided to the interface 2. Between the test head 1 and the interface 2 and between the interface 2 and the socket board 3, elastically protruding pins 7 are brought into contact with the mating electrodes by springs called pogo pins. The contact structure using the pogo pins allows the interface 2 and the socket board 3 to be freely removed, so that when changing the type of the IC under test, the socket board 3 can be removed in a short time.
Is configured to be exchangeable. In other words, since the number of terminals of the IC under test is large and the number of ICs to be tested at one time is large, the number of leads 8 passing through the interface 2 and the number of leads 9 in the test head 1 are 100.
It is about 0. For this reason, it is a difficult task to manually disconnect the wiring connection every time the socket board 3 is replaced to restore the connection.

In order to test whether the connection between the lead wires 8 and the respective contacts 4 of the socket board 3 and the connection relationship of the lead wires 8 are correctly performed, particularly in the IC test apparatus having such a structure. Conventionally, a pair of connection jigs 11 having a terminal structure that can be connected to the IC socket 5 is prepared, and the corresponding terminals of the prepared pair of connection jigs 11 are connected to each other by lead wires 12. Is mounted on the IC socket 5 to be inspected. A DC power supply 13 is connected to one of the lead wires 9 supposed to be connected to the IC socket 5 on which the connection jig 11 is mounted.
A predetermined voltage is applied to the lead wire 9 and the voltage of the lead wire 9 led out from the corresponding other IC socket 5 is measured by the voltmeter 14. The predetermined voltage is measured by the voltmeter 14 to perform the test. It is confirmed that the wiring state of the lead wire 9 in the head 1 and the lead wire 8 in the interface 2 and the connection relation between the contact 4 on the socket board 3 and the contact of the IC socket 5 are all normal. Through this inspection, the inspection of each contact of all IC sockets is completed.

[0005]

According to the conventional inspection method, if the lead wires 9 are electrically connected, it is determined that the wiring between the lead wires 9 is correctly performed. I do. However, despite the fact that the lead wires 9 and 9 should originally be connected to the contacts indicated by solid lines in FIG. 2, for example, the connection of the lead wire 9 in the test head 1 is indicated by a dotted line in FIG. Even if the connection position is wrong as shown by, this mistake cannot be detected.

A power supply contact to be connected to the power supply of each IC socket 5 is commonly connected to a wiring conductor 15 formed on the socket board 3 as shown in FIG. A power supply voltage is supplied to the power supply contact 17 of the IC socket 5 through the power supply contact 18. Therefore, when inspecting the connection of the power supply contact 17, for example, even if the portion of the wiring 18 connecting the wiring conductor 15 and the power supply contact 17 is disconnected, the power supply contact 17 is connected to the connection jig 1.
The terminals 16 and the power supply contacts 17 are electrically connected between the leads 9 and 9 to detect a disconnection of the wiring 18 because they are connected to each other by the lead wires 12 connecting each other. Can not do.

Further, the common potential contacts G ₁ , G ₂ , G ₃ (see FIG. 5) of each IC socket 5 are connected to each other on the socket board 3 and to the common potential point G ₀ . Even if the DC power source 13 is connected to the lead wire 9 connected to any of the common potential contacts G ₁ , G ₂ , and G ₃ of the IC socket 5, the other lead wire 9 is connected.
Does not generate a voltage, that is, the voltage cannot be detected by the voltage measuring device 14. At the same time, even if the wiring 19 that commonly connects the common potential contacts G ₁ , G ₂ , and G ₃ is disconnected, when the common potential contact G ₁ is inspected, this common potential contact G ₁ since lead wires 12 are connected to a common potential contact G ₁ of the other IC socket, it does not generate a voltage to lead wire 9. Therefore, there is a disadvantage that the disconnection of the wiring 19 cannot be detected.

SUMMARY OF THE INVENTION It is an object of the present invention to detect whether or not the connection status of the terminals connected in common on the socket board as well as the connection status of the contacts of each IC socket is correctly wired. An object of the present invention is to provide an inspection device for an IC test device.

[0009]

SUMMARY OF THE INVENTION According to the present invention, a socket board having a large number of contacts mounted on an insulating substrate for contacting the terminals of the IC socket and holding the IC socket is mounted, and a test is performed from each contact of the socket board. An IC under test mounted on an IC socket mounted on a socket board, and a test signal is supplied to the IC under test through the lead wire in the mounted state of the IC. In the IC test apparatus for testing the operation of the above, a DC power supply for applying a predetermined current to the lead wire led to the test head, switching scanning means for sequentially switching the lead wire connected to the DC power supply, and each IC of the socket board A connection jig having a contact for contacting the socket and holding a lead wire having one end electrically connected to the contact; And switching the scanning means having one end connected to the sequential common connection point and the other end of the lead wires connected to the Ntakuto,
A first connecting a resistor between the common connection point and the common potential point;
A contact, a second contact for applying a predetermined voltage to one end of the resistor with the first contact separating one end of the resistor from a common potential point, and a first contact for applying one end of the resistor to a common potential In the connected state, it is measured whether or not the voltage generated in this resistor is a predetermined voltage, and it is determined whether or not the wiring between the test head and the IC socket is correctly provided. Measuring whether a voltage is generated at the common connection point with the second contact applying a predetermined voltage to one end of the resistor, and determining whether each contact on the socket board is in contact with the common potential point. The inspection device of the IC test device is constituted by the voltage measuring device for determining whether or not the voltage is measured.

According to the inspection apparatus of the present invention, a current is supplied to each of the lead wires led to the test head without connecting the IC sockets in common, and the current is taken out from each contact of the IC socket. To the resistor provided in the inspection device. Since the other end of the resistor is connected to the common potential point by the first contact, the current supplied from the test head flows through the resistor if the wiring is correctly performed, and a regular voltage is generated at the resistor. . Therefore, if this voltage is measured with a voltmeter, it can be determined whether or not the wiring is correctly performed.

Further, a power supply terminal 1 is provided from the test head side.
6, when the wiring 18 between each power supply contact 17 and the wiring conductor 15 is normal, a current flows through the power supply contact 17 and this current is given to the inspection device, whereby the resistance is increased. It turns out that the correct voltage is generated in the container and the wiring of the power contact is in the correct state. Along with this, when the current applied to the power supply terminal 16 does not occur in the power supply contact of the IC socket 5, the wiring 18 for connecting the wiring conductor 15 and the power supply contact 17
It can be seen that is broken.

When the common potential contacts commonly connected to each other on the socket board 3 are not correctly connected to the common potential point, when a voltage is supplied from a DC power supply provided on the inspection apparatus side through a resistor, Since the common connection point is not dropped to the common potential, the voltage supplied from the DC power supply is generated at the common connection point. Therefore, by detecting this voltage, it can be detected that the common potential terminal is not correctly connected to the common potential on the socket board.

[0013]

FIG. 1 shows an embodiment of the present invention. In FIG. 1, parts corresponding to those in FIG. 2 are denoted by the same reference numerals. A block denoted by reference numeral 100 shown in FIG. 1 indicates an inspection apparatus according to the present invention. The inspection apparatus 100 according to the present invention includes a switching scanning unit 101 for sequentially connecting each contact of the IC socket 5 to a common connection point A, a resistor 102 having one end connected to the common connection point A, and a resistor 1.
The other end 02 connected to the common potential point G _0, also the first contact K1 which can be disconnected, the first contact K1 is resistor 1
02 is separated from the common potential point G ₀ ,
DC voltage V ₁ from DC power supply 103 to the other end of resistor 102
, A voltage measuring device 104 for measuring a voltage generated at the common connection point A, and a DC power supply 13 for supplying a DC current I ₁ to each lead wire 9 of the test head 1.

The DC power supply 13 supplies a DC current I ₁ to each lead wire 9 of the test head 1 through the switching scanning means 105. The switching scanning unit 105 and the switching scanning unit 101 move the connection position step by step in synchronization with each other by the controller 106. IC mounted on socket board 3
A connection jig 11 is connected to each of the sockets 5.
A lead wire 107 is connected to each connection jig 11, and the other end of the lead wire 107 is connected to the switching scanning means 101. Therefore, the contact of each IC socket 5 is connected to the switching scanning means 101 through the connecting jig 11 and the lead wire 107,
All the contacts of the socket 5 are selectively connected to the connection point A by the switching scanning of the switching scanning unit 101.

In response to the contact of the IC socket 5 selected by the switching scanning means 101 and connected to the common connection point A, the switching scanning means 105 on the test head 1 side receives the current I through the leads 9 and 8 from the DC power supply 13. Supply ₁ Here, the current I ₁ is directly supplied to each signal contact of the IC socket 5 through the lead wires 9 and 8, while the current I ₁ is supplied to the power contact 17 (see FIG. 4) through the power supply terminal 16. and supplies the I _1.

When inspecting the signal contact and the power contact, the controller 106 controls the first contact K
1 is turned on, and the second contact K2 is turned off. Along with this, a signal contact or power supply terminal 16
Supplying a current I ₁ in. This current I ₁ is supplied to the switching scanning means 1
01 and is supplied to the common connection point A and flows into the resistor 102. Since each signal contact is independent, if the signal contact selected by the switching scanning means 105 and the signal contact selected by the switching scanning means 101 match, a voltage is generated in the resistor 102, and this voltage is It is measured by the voltage measuring device 104. Assuming that the current I ₁ and the resistance value of the resistor 102 are known, the voltage at the common potential point A (the voltage generated at the resistor 102) and the voltage drop between the DC power supply 13 and the common connection point A are known. Can be. If this voltage drop is within the specified range, it can be determined that the wiring of the signal contact is normal. When the voltage drop exceeds the specified value, it is understood that a poor contact point exists on the way. If the switching scanning means 101 is switched at high speed while the switching scanning means 105 is kept in that state, and it is inspected whether or not a voltage is generated in another contact, the inspected signal contact circuit may contact another circuit. Can be checked.

When inspecting the circuit of the power supply contact
Is connected to the lead wire 9 connected to the power supply terminal 16 shown in FIG.
The switching scanning means 105 is connected, and the DC power
Style I ₁Supply. This current I₁Is the IC socket 5,
If output to the common connection point A via the connection jig 11,
The power contact of the IC socket 5 is properly connected to the power circuit.
You can see that they are connected. Voltage applied to power contact
If this does not occur, the wiring 18 shown in FIG.
You can see that there is some kind of miswiring.

[0018] When checking the contacts of the IC socket 5 connected to the common potential point G _0, the DC power supply 13 is disconnected from the circuit, the first contact K1 off, it switches the second contact K2 on state. In this state, the switching connection unit 101 connects the common connection point A to each contact of the IC socket connected to each common potential point. If the contacts of the IC socket 5 to be connected to the respective common connection points are correctly connected to the common potential, the potential of the common connection point A becomes zero.
DC power supply 10 when not connected to common potential point G ₀
Voltages V ₁ applied from 3 occurs, the voltage measuring instrument 104
By detecting this, a wiring defect can be determined.

[0019]

As described above, according to the present invention, a circuit to be inspected by the switching scanning means 105 is specified, and when the circuit corresponds to this circuit, a contact of the IC socket 5 is selected by the switching scanning means 101 and inspected. Therefore, there is no case where the correspondence of the circuit is changed and the inspection is performed. It can also be confirmed that the power contact is properly connected to the power supply terminal 16. Further, it can be confirmed that the contacts of the IC sockets to be connected to the common potential point are also independently and correctly connected to the common potential one by one. Therefore, according to the inspection apparatus of the present invention, there is obtained an advantage that a highly reliable inspection can be performed.

[Brief description of the drawings]

FIG. 1 is a connection diagram showing an embodiment of an inspection device of an IC test device according to the present invention.

FIG. 2 is a connection diagram for explaining a conventional technique.

FIG. 3 is a diagram for explaining a relationship between a socket board and an IC socket.

FIG. 4 is a plan view for explaining a structure of a circuit for applying a power supply voltage to a power supply terminal (contact) of an IC socket.

FIG. 5 is a plan view for explaining a connection state of a terminal (contact) to be connected to a common potential point of the IC socket to the common potential point and a conventional inspection method.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Test head of IC test 2 Interface 3 Socket board 5 IC socket 7 Pogo pin 8, 9 Lead wire 11 Connection jig 100 Inspection device 101, 105 Switching scanning means 102 Resistor 13, 103 DC power supply 104 Voltage measurement device 106 Controller K1 First 1 contact K2 2nd contact A Common connection point

Claims (1)

[Claims] 1. A socket board having a large number of IC sockets mounted on an insulating substrate, and a lead wire led out from a contact of each IC socket mounted on the socket board to a test head. An IC test apparatus for mounting an IC under test on an IC socket, applying a test signal to the IC under test through the lead wire in the mounted state of the IC, and testing the operation of the IC under test. A DC power supply for applying a predetermined current to the DC power supply, switching scanning means for sequentially switching the lead wires connected to the DC power supply, a plurality of IC sockets mounted on the socket board, and contacting each contact of the IC socket. A connecting jig having a plurality of lead wires having one end connected to the contact, the connecting jig being connected to the connecting jig; Switching scanning means for sequentially connecting the other ends of the lead wires to a common connection point; a first contact for connecting a resistor between the common connection point and a common potential point; and a first contact for connecting the resistor to the resistor. A second method of applying a predetermined voltage to one end of the separated one end while disconnecting the one end from the common potential point
In a state where the contact and the first contact connect one end of the resistor to a common potential point, it is measured whether or not the voltage generated at the resistor is a predetermined voltage, and the test head and the It is determined whether or not the wiring between the IC socket and the IC socket is correctly provided, and whether or not a voltage is generated at the common connection point with the second contact point applying a predetermined voltage to one end of the resistor. And a potential measuring device that determines whether a contact to be connected to the common potential point of the IC socket on the socket board is correctly contacting the common potential point. Characteristic IC testing equipment inspection equipment.