JPH09104101A - Squeegee for printing circuit - Google Patents

Squeegee for printing circuit

Info

Publication number
JPH09104101A
JPH09104101A JP26408495A JP26408495A JPH09104101A JP H09104101 A JPH09104101 A JP H09104101A JP 26408495 A JP26408495 A JP 26408495A JP 26408495 A JP26408495 A JP 26408495A JP H09104101 A JPH09104101 A JP H09104101A
Authority
JP
Japan
Prior art keywords
squeegee
printing
soft
hard
embosses
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP26408495A
Other languages
Japanese (ja)
Inventor
Yuuji Maezono
祐司 前薗
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP26408495A priority Critical patent/JPH09104101A/en
Publication of JPH09104101A publication Critical patent/JPH09104101A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Screen Printers (AREA)

Abstract

PROBLEM TO BE SOLVED: To perform printing with high accuracy regardless of a mask apperture part by providing a soft squeegee corresponding to the embossed part of a printing circuit and a hard squeegee having a specific angle on the printing surface for continuity printing other than the embossed part and holding both squeegees at the same time to perform printing by one sliding operation. SOLUTION: When cream solder 2 is printed, since an embossed part 6 issues from a mask surface 7 by about 1.5mm, the printing before and after embosses and the periphery of embosses is performed by a pointed soft squeegee 4. Printing is applied to the printing part other than the periphery of embosses in the same way by a flat notched hard squeegee 5 having an angle of about 60 deg. by the same sliding operation of the squeegee holder 3. By this one sliding, a printing method of high quality is applied even to the opening part other than the embosses part. In a squeegee advance direction, that is, in a sliding direction, the soft squeegee is provided before and the hard squeegee is provided behind.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】この発明は、情報機器、通信
機器等に用いられる電子機器プリント基板の製作時のク
リームはんだ等の印刷用スキージに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a squeegee for printing cream solder or the like when manufacturing a printed circuit board for electronic equipment used for information equipment, communication equipment and the like.

【０００２】[0002]

【従来の技術】電子機器の小形化にともなって、電子部
品のプリント基板表面への実装に際し、スクリーン印刷
等を用いてクリームはんだを塗布する方法の改善が行わ
れている。この場合にマスクを用いてスキージでプリン
ト基板表面に押し付ける方法が一般的である。更に、高
密度化が進むとプリント基板にエンボス部分を含むケー
スもある。図４は、エンボスマスクメーカ技術資料に記
載された従来のエンボスマスク印刷方法である。図にお
いて、１はエンボスマスク、２はクリームはんだ、３は
スキージ・ホルダ、４は剣先スキージ・ゴムである。2. Description of the Related Art With the miniaturization of electronic devices, a method of applying cream solder using screen printing or the like when mounting electronic components on the surface of a printed circuit board has been improved. In this case, it is common to use a mask to press the surface of the printed board with a squeegee. Further, as the density is further increased, the printed circuit board may include an embossed portion. FIG. 4 shows a conventional emboss mask printing method described in an emboss mask maker technical data. In the figure, 1 is an embossed mask, 2 is cream solder, 3 is a squeegee holder, and 4 is a squeegee tip rubber.

【０００３】次に、動作について説明する。硬度の低
い、いわゆるソフト・スキージを使用して、クリームは
んだをエンボスマスク周囲の印刷パターンにクリームは
んだを印刷する。エンボス部分の突起を逃げるために、
ソフト・スキージの材質が必要であるが、そうするとプ
リント基板のその他の平坦な部分に対しては、押し付け
圧力が低下しがちとなる。なお、エンボス部分を含まな
いプリント基板に対してのスキージ機構としては、例え
ば、特公昭５９−５１７６０号によれば、印刷面に対し
て傾けた構造を開示しているが、このままではエンボス
部分を持つプリント基板に対しては適用ができない。Next, the operation will be described. A so-called soft squeegee having a low hardness is used to print the cream solder on the printed pattern around the embossing mask. To escape the protrusion of the embossed part,
A soft squeegee material is required, which tends to reduce the pressure on other flat areas of the printed circuit board. As a squeegee mechanism for a printed circuit board that does not include an embossed portion, for example, Japanese Patent Publication No. 59-51760 discloses a structure tilted with respect to the printing surface. It cannot be applied to the own printed circuit board.

【０００４】[0004]

【発明が解決しようとする課題】従来のエンボス部分を
含んだプリント基板に対するクリームはんだのスキージ
機構は、以上のように構成されているので、硬度の低
い、いわゆるソフト・スキージで全面を摺動するので、
マスク開口部が小さい部分や、逆に開口面積が広い部分
に対するはんだの印刷品質が悪化するという課題があっ
た。Since the conventional squeegee mechanism of cream solder for a printed circuit board including an embossed portion is constructed as described above, a so-called soft squeegee having a low hardness slides over the entire surface. So
There is a problem that the print quality of the solder is deteriorated in a portion where the mask opening is small and, conversely, a portion where the opening area is wide.

【０００５】この発明は、上記の課題を解消するために
なされたもので、エンボス部分を含むプリント基板に対
しても、マスク開口面に関わらず高品質の印刷回路用ス
キージを得ることを目的とする。The present invention has been made to solve the above problems, and an object thereof is to obtain a high quality printed circuit squeegee for a printed circuit board including an embossed portion regardless of the mask opening surface. To do.

【０００６】[0006]

【課題を解決するための手段】この発明に係る印刷回路
用スキージは、印刷回路のエンボス部分に対応したソフ
ト・スキージと、このエンボス部分以外の導通印刷用の
ハード・スキージと、これらソフト・スキージとハード
・スキージとを同時に保持し、１摺動動作で印刷を行う
スキージ・ホルダを備えた。A printed circuit squeegee according to the present invention includes a soft squeegee corresponding to an embossed portion of a printed circuit, a hard squeegee for conductive printing other than the embossed portion, and these soft squeegees. And a hard squeegee are held at the same time, and a squeegee holder for printing with one sliding operation is provided.

【０００７】また基本構成に加えて、ハード・スキージ
は、印刷面に対して大略６０度の角度を持たせた。In addition to the basic structure, the hard squeegee has an angle of about 60 degrees with respect to the printing surface.

【０００８】[0008]

【発明の実施の形態】BEST MODE FOR CARRYING OUT THE INVENTION

実施の形態１．以下、この発明の実施の形態を図につい
て説明する。図１は、本実施の形態におけるスキージの
側断面と正面の構造図で、図２は、その斜視図である。
図１及び図２において、１はエンボスマスク、２はクリ
ームはんだ、３は剣先及び平形スキージの両方を保持す
るスキージ・ホルダ、４は剣先のソフト・スキージ、５
はエンボス部を切り欠いた平形のハード・スキージであ
る。平形のハード・スキージは、この実施の形態では、
基板の摺動方向に対して６０度であるが、０度から９０
度の範囲で選べる。また、その材質は、ウレタン製で、
硬度は８０度にしてある。Embodiment 1 FIG. Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a side sectional view and a front structural view of a squeegee according to the present embodiment, and FIG. 2 is a perspective view thereof.
In FIGS. 1 and 2, 1 is an embossed mask, 2 is cream solder, 3 is a squeegee holder that holds both a sword tip and a flat squeegee, 4 is a soft squeegee at the sword tip, 5
Is a flat hard squeegee with the embossed part cut away. In this embodiment, the flat hard squeegee is
It is 60 degrees with respect to the sliding direction of the board, but from 0 degrees to 90 degrees
You can choose within a range of degrees. Also, the material is urethane,
The hardness is 80 degrees.

【０００９】次に、上記構成の印刷回路用スキージの動
作を説明する。印刷パターンのあるエンボスマスクのク
リームはんだ印刷において、クリームはんだを印刷する
場合、エンボス部がマスク面から１．５ｍｍ程度出てい
るので、剣先のソフト・スキージ４によってエンボス前
後及びエンボス周囲の印刷を実施する。スキージ・ホル
ダ３により同一の摺動動作で、平形の切り欠きハード・
スキージ５によって、エンボス周囲以外の印刷部を従来
と同様に行う。この１回の摺動で、エンボス部分以外の
開口部に対しても、従来と同様の高品質な印刷方法が得
られる。本実施の形態では、スキージ進行方向、つま
り、摺動方向に対してソフト・スキージが前に、ハード
・スキージが後になるように構成してあり、この構成が
有効である。また、ソフト・スキージ幅よりもハード・
スキージの切り欠き幅を狭くしてあり、この構成も開口
部のはんだ印刷の高品質化に有効である。Next, the operation of the squeegee for a printed circuit having the above structure will be described. In cream solder printing of an embossed mask with a print pattern, when printing cream solder, the embossed portion is projected about 1.5 mm from the mask surface, so printing is performed before and after embossing and around the embossed area with the soft squeegee 4 on the sword tip. To do. Squeegee holder 3 has the same sliding motion, and has a flat cutout hardware.
With the squeegee 5, the printing portion other than around the embossing is performed in the same manner as in the conventional case. With this one-time sliding, the same high-quality printing method as the conventional one can be obtained even for the opening other than the embossed portion. In the present embodiment, the squeegee is arranged so that the soft squeegee comes to the front and the hard squeegee comes to the rear in the sliding direction, which is effective. Also, harder than soft squeegee width
The squeegee has a narrow cutout width, and this configuration is also effective in improving the quality of solder printing in the opening.

【００１０】[0010]

【発明の効果】以上のように、この発明によれば、スキ
ージ・ホルダでソフト・スキージとハード・スキージを
取り付けたので、１工程でエンボス部前後及び周囲の印
刷部を高品質に印刷できる効果がある。As described above, according to the present invention, since the soft squeegee and the hard squeegee are attached by the squeegee holder, it is possible to print high quality on the embossed part and the surrounding printed part in one step. There is.

【図面の簡単な説明】[Brief description of the drawings]

【図１】 この発明の実施の形態１における印刷回路用
スキージの構成を示す図である。FIG. 1 is a diagram showing a configuration of a squeegee for a printed circuit according to a first embodiment of the present invention.

【図２】 この発明の実施の形態１における印刷回路用
スキージの斜視図である。FIG. 2 is a perspective view of a squeegee for a printed circuit according to the first embodiment of the present invention.

【図３】 従来のスキージの構成を示す図である。FIG. 3 is a diagram showing a configuration of a conventional squeegee.

【図４】 従来のスキージの斜視図である。FIG. 4 is a perspective view of a conventional squeegee.

【符号の説明】[Explanation of symbols]

１ エンボスマスク、２ クリームはんだ、３ スキー
ジ・ホルダ、４ 剣先ソフト・スキージ、５ 平形切り
欠きハード・スキージ、６ エンボス部。1 emboss mask, 2 cream solder, 3 squeegee holder, 4 sword tip soft squeegee, 5 flat cutout hard squeegee, 6 embossed parts.

Claims (2)

【特許請求の範囲】[Claims] 【請求項１】 印刷回路のエンボス部分に対応したソフ
ト・スキージと、 上記エンボス部分以外の導通印刷用のハード・スキージ
と、 上記ソフト・スキージとハード・スキージとを同時に保
持し、１摺動動作で印刷を行うスキージ・ホルダを備え
た印刷回路用スキージ。1. A soft squeegee corresponding to an embossed portion of a printed circuit, a hard squeegee for conductive printing other than the embossed portion, the soft squeegee and the hard squeegee are simultaneously held, and one sliding operation is performed. A squeegee for printed circuits that has a squeegee holder for printing with. 【請求項２】 ハード・スキージは、印刷面に対して大
略６０度の角度を持たせたことを特徴とする請求項記載
の印刷回路用スキージ。2. The squeegee for a printed circuit according to claim 1, wherein the hard squeegee has an angle of about 60 degrees with respect to the printing surface.
JP26408495A 1995-10-12 1995-10-12 Squeegee for printing circuit Pending JPH09104101A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP26408495A JPH09104101A (en) 1995-10-12 1995-10-12 Squeegee for printing circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26408495A JPH09104101A (en) 1995-10-12 1995-10-12 Squeegee for printing circuit

Publications (1)

Publication Number Publication Date
JPH09104101A true JPH09104101A (en) 1997-04-22

Family

ID=17398301

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26408495A Pending JPH09104101A (en) 1995-10-12 1995-10-12 Squeegee for printing circuit

Country Status (1)

Country Link
JP (1) JPH09104101A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002280173A (en) * 2001-03-21 2002-09-27 Tdk Corp Manufacturing method for composite substrate, and composite substrate and el element provided thereby

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002280173A (en) * 2001-03-21 2002-09-27 Tdk Corp Manufacturing method for composite substrate, and composite substrate and el element provided thereby
JP4669621B2 (en) * 2001-03-21 2011-04-13 アイファイヤー アイピー コーポレイション Manufacturing method of composite substrate, composite substrate obtained by this manufacturing method, EL element

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