JPH09102686A - Manufacture of pin fin type heat sink - Google Patents

Manufacture of pin fin type heat sink

Info

Publication number
JPH09102686A
JPH09102686A JP25858095A JP25858095A JPH09102686A JP H09102686 A JPH09102686 A JP H09102686A JP 25858095 A JP25858095 A JP 25858095A JP 25858095 A JP25858095 A JP 25858095A JP H09102686 A JPH09102686 A JP H09102686A
Authority
JP
Japan
Prior art keywords
solder
heat sink
extruded shape
type heat
pin fin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP25858095A
Other languages
Japanese (ja)
Inventor
Shiro Matsumoto
史朗 松本
Hiroshi Ikami
浩 井神
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Aluminium Co Ltd
Original Assignee
Nippon Aluminium Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Aluminium Co Ltd filed Critical Nippon Aluminium Co Ltd
Priority to JP25858095A priority Critical patent/JPH09102686A/en
Publication of JPH09102686A publication Critical patent/JPH09102686A/en
Pending legal-status Critical Current

Links

Landscapes

  • Details Of Heat-Exchange And Heat-Transfer (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method for producing a pin fin type heat sink, which comprises pin fins and a base plate in one united member, simply and reliably at a low production cost regardless of small size or large size. SOLUTION: A plurality of extruded sections 4 having ribs 42 are overlapped at equal intervals, gap portions formed by the adjoining extruded sections 4 and the ribs 42 are dipped in melted solder 5, and above mentioned gaps are densely filled up with solder 5 by applying ultrasonic vibration thereby mutually bonding the extruded sections and forming a jointed body 29 comprising the base plate 2 and fin portions 30. The fin portion 30 of the jointed body 20 is cut from its tip edge at equal intervals in a direction orthogonal to a width direction W of the extruded sections 4 with a cutter 100 thereby making a structure made of a number of pin fins.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、ピンフィンとベー
スプレートとが一体の部材で構成されているピンフィン
型ヒートシンクを製造する方法に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a pin fin type heat sink in which a pin fin and a base plate are integrally formed.

【0002】[0002]

【従来技術及びその課題】図17に示すような、ベース
プレート2とピンフィン3とが一体の部材で構成されて
いるピンフィン型ヒートシンクは、従来、鍛造又は切削
加工により製造されていた。
2. Description of the Related Art A pin fin type heat sink in which a base plate 2 and a pin fin 3 are integrally formed as shown in FIG. 17 is conventionally manufactured by forging or cutting.

【0003】しかしながら、鍛造により製造する場合
は、生産コストが高くなるという欠点があった。即ち、
例えば、径が100mm、ピンフィンの長さが10mm
のヒートシンクは、金型を用いて一般的に製造される
が、非常に高い費用を要していた。また、ピンフィンの
長さが10mmを超えるヒートシンクを製造する場合に
は、用いる金型の寿命が急激に短くなり、生産性が悪か
った。また、径が100mmを超えるヒートシンクを製
造する場合には、金型や周辺工具に要する費用が著しく
高かった。
However, in the case of manufacturing by forging, there is a drawback that the production cost becomes high. That is,
For example, the diameter is 100mm and the pin fin length is 10mm.
Heatsinks, although commonly manufactured using molds, were very expensive. Further, in the case of manufacturing a heat sink in which the length of the pin fin exceeds 10 mm, the life of the die used is drastically shortened, resulting in poor productivity. Further, in the case of manufacturing a heat sink having a diameter of more than 100 mm, the cost required for the mold and peripheral tools was extremely high.

【0004】一方、生産コストが高くなるのを防止する
ために、小型のヒートシンクを製作した後、溶接等で接
合して大型化することが試みられたが、歪みのない高級
な溶接となるため、この場合でも大幅なコスト高となっ
た。
On the other hand, in order to prevent the production cost from increasing, it has been attempted to manufacture a small heat sink and then join it by welding or the like to increase the size, but this is a high-grade welding without distortion. , Even in this case, the cost was significantly high.

【0005】また、切削加工により製造する場合は、完
全なアルミブロックからの削り出しとなるため、死量が
多く、不経済であり、また、切断のピッチが密である場
合には特に切粉の排出が困難であり、目詰まり等の問題
が生じていた。
In the case of manufacturing by cutting, since it is carved out from a complete aluminum block, there is a large amount of dead, it is uneconomical, and especially when the cutting pitch is dense, chips are produced. Was difficult to discharge, and problems such as clogging occurred.

【0006】本発明は、小型、大型を問わず、低い生産
コストで、簡単且つ確実に、ピンフィンとベースプレー
トとが一体の部材で構成されているピンフィン型ヒート
シンクを製造する方法を提供することを目的とする。
SUMMARY OF THE INVENTION It is an object of the present invention to provide a method for manufacturing a pin fin type heat sink in which a pin fin and a base plate are integrally formed with each other at low production cost regardless of whether they are small or large. And

【0007】[0007]

【課題を解決するための手段】上記目的を達成するため
に、本発明は、ピンフィンとベースプレートとが一体の
部材で構成されているピンフィン型ヒートシンクを製造
する方法において、厚み方向にリブを有する所定形状の
板状の押出形材を、リブを介して等間隔に複数個重ね合
わせ、この重ね合わせ体における隣り合う押出形材とリ
ブとによって構成される隙間の部分を、溶融はんだ中又
は溶融ろう材中に浸漬し、超音波振動を加えることによ
って上記隙間に上記はんだ又はろう材を密に充填させて
押出形材を相互に接合して、押出形材の上記はんだ又は
ろう材による接合部分と上記はんだ又はろう材とで構成
されたベースプレートと、押出形材の他の部分で構成さ
れたフィン部とからなる接合体を形成し、この接合体の
フィン部を、その先端縁から、押出形材の幅方向に対し
て直角方向に等間隔置きに切削することによって、多数
のピンフィンからなる構造としたことを特徴としてい
る。
In order to achieve the above object, the present invention is a method for manufacturing a pin fin type heat sink in which a pin fin and a base plate are integrally formed, and a predetermined rib having a thickness direction is provided. A plurality of plate-shaped extruded shape members are superposed at equal intervals via ribs, and the portion of the gap formed by the adjacent extruded shape members and ribs in this superposed body is melted or soldered in a molten solder. The solder or brazing material is soaked in the gap that the solder or the brazing material is densely filled in the gap by joining the extruded shape with each other, and the extruded shape is joined with the solder or the brazing material. A base plate composed of the solder or brazing material and a fin part composed of the other part of the extruded shape is formed, and the fin part of the joint is From the edge, by cutting every regular intervals in the direction perpendicular to the width direction of the extruded profile, it is characterized in that it has a structure containing a plurality of pin fins.

【0008】[0008]

【発明の実施の形態】図1は本発明の製造方法によって
得られるピンフィン型ヒートシンクの斜視部分図、図2
は図1のII矢視全図、図3は図1のIII 矢視全図、図4
は図1のIV矢視全図である。このピンフィン型ヒートシ
ンク1は、ベースプレート2と多数のピンフィン3とが
一体となったものであり、図5に示すアルミニウム製の
押出形材4を構成部材としている。5はアルミニウム部
材用はんだであり、例えば95%Zn−5%Alが用い
られる。
1 is a perspective partial view of a pin fin type heat sink obtained by the manufacturing method of the present invention, FIG.
1 is a complete view taken along the line II in FIG. 1, FIG. 3 is a complete view taken along the line III in FIG.
FIG. 4 is a complete view taken along the line IV in FIG. The pin fin type heat sink 1 has a base plate 2 and a large number of pin fins 3 integrated with each other, and has an aluminum extruded shape member 4 shown in FIG. 5 as a constituent member. Reference numeral 5 is a solder for aluminum members, and for example, 95% Zn-5% Al is used.

【0009】図5に示すように、押出形材4は、板状の
ものであり、1枚の薄板で構成されており、本体41の
下部の片面に、所定の高さだけ突出した1個のリブ42
が形成されてなるものである。
As shown in FIG. 5, the extruded shape member 4 is in the form of a plate, is composed of one thin plate, and is formed on one surface of the lower portion of the main body 41 by a predetermined height. Rib 42
Are formed.

【0010】次に、ヒートシンク1の製造方法について
説明する。まず、複数個の押出形材4を、リブ42を一
方向に向けて平行に並べて、リブ42を隣りの押出形材
4のリブ42のない側の面41aに当接させて、即ち図
6に示すように重ね合わせ、重ね合わせ体10を構成す
る。なお、必要ならば、適当な治具を用いて重ね合わせ
体10を支持する。図7は重ね合わせ体10の斜視部分
図である。
Next, a method of manufacturing the heat sink 1 will be described. First, a plurality of extruded shape members 4 are arranged in parallel so that the ribs 42 are oriented in one direction, and the ribs 42 are brought into contact with the surface 41a of the adjacent extruded shape members 4 on the side not having the ribs 42, that is, in FIG. As shown in FIG. If necessary, the superposed body 10 is supported by using an appropriate jig. FIG. 7 is a partial perspective view of the superposed body 10.

【0011】次に、この重ね合わせ体10の隙間6を、
図8に示すように、浴7中の溶融はんだ5中に浸漬さ
せ、その状態で、重ね合わせ体10又は浴7に超音波振
動を加える。重ね合わせ体10を浸漬させただけでは、
押出形材4の表面に酸化皮膜ができているために溶融は
んだ5がはじかれ、また、溶融はんだ5の表面張力のた
めに隙間6内に行き渡らず、従って、図9に示すよう
に、溶融はんだ5は隙間6中に十分には入り込まない。
しかし、超音波振動を加えているので、酸化皮膜が破壊
され、このため、押出形材4の表面と溶融はんだ5との
濡れが良くなり、また、溶融はんだ5が振動するために
表面張力が弱くなり、従って、図10に示すように、溶
融はんだ5は隙間6中の隅々まで十分に入り込んでい
く。
Next, the gap 6 of the superposed body 10 is
As shown in FIG. 8, it is immersed in the molten solder 5 in the bath 7, and in that state, ultrasonic vibration is applied to the superposed body 10 or the bath 7. Just immersing the superposed body 10
The molten solder 5 is repelled due to the oxide film formed on the surface of the extruded shape member 4, and the molten solder 5 does not reach the gap 6 due to the surface tension of the molten solder 5. Therefore, as shown in FIG. The solder 5 does not sufficiently enter the gap 6.
However, since the ultrasonic vibration is applied, the oxide film is destroyed, which improves the wettability between the surface of the extruded shape member 4 and the molten solder 5, and the molten solder 5 vibrates, so that the surface tension is increased. It becomes weak, and therefore, as shown in FIG. 10, the molten solder 5 sufficiently penetrates into every corner of the gap 6.

【0012】隙間6中にはんだ5が充填されると、重ね
合わせ体10を溶融はんだ5中から引き上げ、図11に
示すようにはんだ5の隙間6からはみ出している部分5
aを機械加工により削り取る。これにより、図12に示
す接合体20が得られる。接合体20は、ベースプレー
ト2と、ピンフィン3が形成されるフィン部30とから
なっている。
When the solder 5 is filled in the gap 6, the superposed body 10 is pulled up from the molten solder 5, and the portion 5 protruding from the gap 6 of the solder 5 as shown in FIG.
A is machined away. As a result, the joined body 20 shown in FIG. 12 is obtained. The bonded body 20 includes a base plate 2 and a fin portion 30 on which the pin fins 3 are formed.

【0013】そして、接合体20のフィン部30を、図
13及び図13のXIV矢視全図である図14に示すよう
に、カッター100を用いて、フィン部30の先端縁か
ら、押出形材4の幅方向Wに対して直角方向に、切削す
る。切削は、図15に示すように、リブ42の上面の位
置まで行なう。カッター100は、複数の同じ厚みの回
転刃101が等間隔Dで並設され一体化されて構成され
ている。これにより、フィン部30は多数のピンフィン
3に分割され、図1に示すようなピンフィン型ヒートシ
ンク1が得られる。ピンフィン3の幅はカッター100
の間隔Dに等しくなっている。
Then, the fin portion 30 of the joined body 20 is extruded from the tip edge of the fin portion 30 by using a cutter 100 as shown in FIG. Cutting is performed in a direction perpendicular to the width direction W of the material 4. The cutting is performed up to the position of the upper surface of the rib 42, as shown in FIG. The cutter 100 is configured by arranging a plurality of rotary blades 101 having the same thickness side by side at equal intervals D and integrating them. As a result, the fin portion 30 is divided into a large number of pin fins 3, and the pin fin type heat sink 1 as shown in FIG. 1 is obtained. The width of the pin fin 3 is the cutter 100.
Is equal to the distance D.

【0014】上記方法は、所定形状の押出形材4を、複
数個重ね合わせ、溶融はんだ5中に浸漬させて隙間6に
はんだ5を充填することによって相互に接合し、カッタ
ー100によって切削するだけであるので、非常に簡単
且つ確実であり、生産性が高い。しかも、高価な金型を
用いる必要がないので、安価に実施できる。従って、上
記方法によれば、低い生産コストで、ヒートシンク1が
得られる。
In the above method, a plurality of extruded shape members 4 having a predetermined shape are superposed on each other, immersed in the molten solder 5 to fill the gap 6 with the solder 5 so as to bond them to each other, and then cut by the cutter 100. Therefore, it is very easy and reliable and highly productive. Moreover, since it is not necessary to use an expensive mold, the cost can be reduced. Therefore, according to the above method, the heat sink 1 can be obtained at a low production cost.

【0015】また、上記方法では、隙間6へのはんだ5
の充填を超音波振動を加えて行なうので、はんだ5は隙
間6中の隅々まで十分に入り込み、押出形材4相互の接
合は支障なく行なわれる。
Further, in the above method, the solder 5 in the gap 6 is
Since the filling is carried out by applying ultrasonic vibration, the solder 5 sufficiently penetrates into every corner of the gap 6, and the extruded shape members 4 are joined to each other without any trouble.

【0016】そして、上記方法により得られた図1に示
すヒートシンク1は、押出形材4相互が、隙間6中の隅
々まで十分に入り込んだはんだ5によって接合されてい
るので、強固なものとなる。しかも、所定形状の押出形
材4が複数個重ね合わされ相互に接合されているだけで
あり、また、ピンフィン3とベースプレート2とが一体
となっているので、構成も簡素である。
The heat sink 1 shown in FIG. 1 obtained by the above method is strong because the extruded shape members 4 are joined to each other by the solder 5 which has sufficiently penetrated into every corner of the gap 6. Become. Moreover, a plurality of extruded shape members 4 having a predetermined shape are simply overlapped and joined to each other, and the pin fin 3 and the base plate 2 are integrated, so that the structure is simple.

【0017】なお、押出形材4としては、図16に示す
ような、リブ42の先端面に溝42aが形成されたもの
を用いてもよい。これによれば、図10に示すように、
はんだ5を隙間6内へ侵入させる際に、隙間6内の空気
を溝42aを通して隙間61側へ排出させながら、はん
だ5を隙間6内へ侵入させることができるので、はんだ
5を隙間6内の隅々まで十分に侵入させることができ、
はんだ5により充分な接合強度で接合された接合体20
を得ることができる。
As the extruded shape member 4, a rib 42 having a groove 42a formed on the tip surface thereof as shown in FIG. 16 may be used. According to this, as shown in FIG.
When the solder 5 is introduced into the gap 6, the solder 5 can be introduced into the gap 6 while discharging the air in the gap 6 to the gap 61 side through the groove 42a. I can fully infiltrate every corner,
Joined body 20 joined with solder 5 with sufficient joining strength
Can be obtained.

【0018】また、はんだの代わりにろう材を用いても
よい。
A brazing material may be used instead of the solder.

【0019】[0019]

【発明の効果】以上のように、本発明のピンフィン型ヒ
ートシンクの製造方法は、厚み方向にリブ42を有する
所定形状の板状の押出形材4を、リブ42を介して等間
隔に複数個重ね合わせ、この重ね合わせ体10における
隣り合う押出形材4とリブ42とによって構成される隙
間6の部分を、溶融はんだ5中又は溶融ろう材中に浸漬
し、超音波振動を加えることによって隙間6にはんだ5
又はろう材を密に充填させて押出形材4を相互に接合
し、この接合体20のフィン部30をカッター100に
より切削するので、非常に簡単且つ確実であり、生産性
高く実施できる。しかも、高価な金型を用いる必要がな
いので、安価に実施できる。従って、上記方法によれ
ば、低い生産コストで、ヒートシンク1を得ることがで
きる。更に、押出形材4相互の接合を支障なく行なうこ
とができる。
As described above, according to the method of manufacturing a pin fin type heat sink of the present invention, a plurality of plate-shaped extruded shapes 4 having a predetermined shape having ribs 42 in the thickness direction are equally spaced through the ribs 42. The portions of the gap 6 formed by the extruded shape members 4 and the ribs 42 adjacent to each other in the overlapped body 10 are immersed in the molten solder 5 or the molten brazing material, and ultrasonic vibration is applied to form the gap. 6 to solder 5
Alternatively, the extruded shape members 4 are densely filled with each other and the extruded shape members 4 are joined to each other, and the fin portion 30 of the joined body 20 is cut by the cutter 100, which is very simple and reliable, and can be performed with high productivity. Moreover, since it is not necessary to use an expensive mold, the cost can be reduced. Therefore, according to the above method, the heat sink 1 can be obtained at a low production cost. Further, the extruded shape members 4 can be joined to each other without any trouble.

【図面の簡単な説明】[Brief description of the drawings]

【図1】 本発明の製造方法により得られたピンフィン
型ヒートシンクを示す斜視部分図である。
FIG. 1 is a perspective partial view showing a pin fin type heat sink obtained by a manufacturing method of the present invention.

【図2】 図1のII矢視全図である。FIG. 2 is a complete view taken along the line II in FIG.

【図3】 図1のIII 矢視全図である。FIG. 3 is a full view taken along the arrow III in FIG.

【図4】 図1のIV矢視全図である。FIG. 4 is a complete view taken along the line IV of FIG.

【図5】 図1のヒートシンクの構成部材である押出形
材を示す斜視図である。
5 is a perspective view showing an extruded shape member which is a constituent member of the heat sink of FIG. 1. FIG.

【図6】 図1のヒートシンクを製造する一工程を示す
側面図であり、重ね合わせ体を示す。
FIG. 6 is a side view showing one process of manufacturing the heat sink of FIG. 1, showing a superposed body.

【図7】 図6の重ね合わせ体の斜視部分図である。7 is a perspective partial view of the superposed body of FIG.

【図8】 図6の工程に続く工程を示す一部断面側面図
である。
8 is a partial cross-sectional side view showing a step that follows the step of FIG.

【図9】 図8の工程において超音波振動を加えない場
合の状態を示す拡大部分図である。
9 is an enlarged partial view showing a state where ultrasonic vibration is not applied in the step of FIG.

【図10】 図8の工程における一状態を示す拡大部分
図である。
FIG. 10 is an enlarged partial view showing one state in the process of FIG.

【図11】 図8の工程終了後の状態を示す拡大部分図
である。
FIG. 11 is an enlarged partial view showing a state after the process of FIG. 8 is completed.

【図12】 図8の工程を経て得られた接合体を示す側
面図である。
FIG. 12 is a side view showing a joined body obtained through the process of FIG.

【図13】 接合体を切削する工程の開始時を示す斜視
部分図である。
FIG. 13 is a partial perspective view showing the start of the step of cutting the bonded body.

【図14】 図13のXIV矢視全図である。14 is a complete view taken along the arrow XIV in FIG.

【図15】 接合体を切削する工程の途中を示す斜視部
分図である。
FIG. 15 is a perspective partial view showing the middle of the step of cutting the bonded body.

【図16】 別の例の押出形材からなる接合体を示す斜
視部分図である。
FIG. 16 is a perspective partial view showing a joined body made of an extruded profile of another example.

【図17】 従来のピンフィン型ヒートシンクの斜視全
図である。
FIG. 17 is an overall perspective view of a conventional pin fin type heat sink.

【符号の説明】[Explanation of symbols]

1 ピンフィン型ヒートシンク 2 ベースプレート 3 ピンフィン 4 押出形材 5 はんだ 42 リブ 1 pin fin type heat sink 2 base plate 3 pin fin 4 extruded profile 5 solder 42 rib

─────────────────────────────────────────────────────
────────────────────────────────────────────────── ───

【手続補正書】[Procedure amendment]

【提出日】平成7年11月9日[Submission date] November 9, 1995

【手続補正1】[Procedure amendment 1]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0003[Correction target item name] 0003

【補正方法】変更[Correction method] Change

【補正内容】[Correction contents]

【0003】しかしながら、鍛造により多品種少ロット
製造する場合は、高い金型費用のため生産コストが高く
なるという欠点があった。
However, in the case of manufacturing a large variety of small lots by forging, there is a drawback that the production cost becomes high due to the high die cost.

【手続補正2】[Procedure amendment 2]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0004[Correction target item name] 0004

【補正方法】削除[Correction method] Deleted

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 ピンフィンとベースプレートとが一体の
部材で構成されているピンフィン型ヒートシンクを製造
する方法において、 厚み方向にリブを有する所定形状の板状の押出形材を、
リブを介して等間隔に複数個重ね合わせ、 この重ね合わせ体における隣り合う押出形材とリブとに
よって構成される隙間の部分を、溶融はんだ中又は溶融
ろう材中に浸漬し、超音波振動を加えることによって上
記隙間に上記はんだ又はろう材を密に充填させて押出形
材を相互に接合して、押出形材の上記はんだ又はろう材
による接合部分と上記はんだ又はろう材とで構成された
ベースプレートと、押出形材の他の部分で構成されたフ
ィン部とからなる接合体を形成し、 この接合体のフィン部を、その先端縁から、押出形材の
幅方向に対して直角方向に等間隔置きに切削することに
よって、多数のピンフィンからなる構造としたことを特
徴とするピンフィン型ヒートシンクの製造方法。
1. A method for manufacturing a pin fin type heat sink in which a pin fin and a base plate are integrally formed, wherein a plate-shaped extruded shape member having a rib in a thickness direction is formed,
Plural pieces are superposed at equal intervals via ribs, and the portion of the gap formed by the adjacent extruded shape members and ribs in this superposed body is immersed in molten solder or molten brazing material, and ultrasonic vibration is applied. By adding the solder or brazing material densely to the gap by joining and joining the extruded shape members to each other, the joint portion of the extruded shape member by the solder or brazing material and the solder or brazing material A joined body is formed from the base plate and the fin portion composed of the other part of the extruded shape, and the fin portion of this joined body is formed in a direction perpendicular to the width direction of the extruded shape from its tip edge. A method for manufacturing a pin fin type heat sink, characterized by having a structure composed of a large number of pin fins by cutting at equal intervals.
JP25858095A 1995-10-05 1995-10-05 Manufacture of pin fin type heat sink Pending JPH09102686A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP25858095A JPH09102686A (en) 1995-10-05 1995-10-05 Manufacture of pin fin type heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25858095A JPH09102686A (en) 1995-10-05 1995-10-05 Manufacture of pin fin type heat sink

Publications (1)

Publication Number Publication Date
JPH09102686A true JPH09102686A (en) 1997-04-15

Family

ID=17322234

Family Applications (1)

Application Number Title Priority Date Filing Date
JP25858095A Pending JPH09102686A (en) 1995-10-05 1995-10-05 Manufacture of pin fin type heat sink

Country Status (1)

Country Link
JP (1) JPH09102686A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020015261A (en) * 2001-03-26 2002-02-27 이종만 Method of fin insert injection molding for Heat sink
KR101039872B1 (en) * 2009-03-06 2011-06-09 김영기 Manufacturing method of heat block, and heat block manufacturied by the method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02127970A (en) * 1988-11-04 1990-05-16 Nippon Alum Mfg Co Ltd Manufacture of heat sink
JPH0340460A (en) * 1989-07-07 1991-02-21 Nippon Alum Mfg Co Ltd Heat sink and manufacture thereof
JPH05283878A (en) * 1992-03-30 1993-10-29 Sumitomo Metal Ind Ltd Heat sink cooling fan excellent in heat radiation property, and its manufacture
JPH06216551A (en) * 1992-11-19 1994-08-05 Nippon Alum Co Ltd Heat sink and its manufacture

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02127970A (en) * 1988-11-04 1990-05-16 Nippon Alum Mfg Co Ltd Manufacture of heat sink
JPH0340460A (en) * 1989-07-07 1991-02-21 Nippon Alum Mfg Co Ltd Heat sink and manufacture thereof
JPH05283878A (en) * 1992-03-30 1993-10-29 Sumitomo Metal Ind Ltd Heat sink cooling fan excellent in heat radiation property, and its manufacture
JPH06216551A (en) * 1992-11-19 1994-08-05 Nippon Alum Co Ltd Heat sink and its manufacture

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020015261A (en) * 2001-03-26 2002-02-27 이종만 Method of fin insert injection molding for Heat sink
KR101039872B1 (en) * 2009-03-06 2011-06-09 김영기 Manufacturing method of heat block, and heat block manufacturied by the method

Similar Documents

Publication Publication Date Title
US6622375B1 (en) Method for producing a fuse element
US4373895A (en) Extrusion die and method for producing extrusion die for forming a honeycomb structure
US4354820A (en) Extrusion die and method for producing extrusion die for forming a honeycomb structure
JPH1174296A (en) Manufacture of semiconductor package
JPS58122808A (en) Manufacture of monolith extruding die
JPH0378212B2 (en)
JPH06326141A (en) Base material for semiconductor-chip bonding and solder material for semiconductor-chip bonding as well as manufacture of solder material for semiconductor-chip bonding
EP0503072B1 (en) Semiconductor device and its manufacturing process
JP2000326318A (en) Die for molding honeycomb structural body and manufacture thereof
JPH11346004A (en) Package structure and manufacturing method of chip type semiconductor
JPH09102686A (en) Manufacture of pin fin type heat sink
JPS6051405B2 (en) Manufacturing method of die for extrusion molding of honeycomb structure
US20040150133A1 (en) Honeycomb extrusion dies
JP4649172B2 (en) Manufacturing method of stem for semiconductor package
CN105090898A (en) LED (light-emitting diode) light source lamp filament support and manufacturing method of LED light source lamp filament
CN1043173C (en) Semiconductor diode consisting of groove form casing component and packaging method
JP3708871B2 (en) Semiconductor package assembly
WO2006100917A1 (en) Light emitting element reflector, manufacturing method thereof, and light emitting device using the reflector
JPH06216551A (en) Heat sink and its manufacture
JPH10303355A (en) Semiconductor device
TWI670160B (en) Micro component and molding method thereof
JP3566812B2 (en) Method for manufacturing semiconductor device
US20030054591A1 (en) Semiconductor device, and method of manufacturing the semiconductor device
JPH09223706A (en) Manufacture of semiconductor and its manufacturing equipment
JP4740404B2 (en) Manufacturing method of ceramic connecting substrate