JPH089271A - Fixing device for solid-state image pickup element - Google Patents

Abstract

PURPOSE:To simply and stably fix an inexpensive solid-state image pickup element to its holder by pressing and fixing the outer circumference edges opposed to each other onto the taper surface of the holder at the surface side of the pickup element. CONSTITUTION:A fixing screw 15 which is put into a screw hole 141 of a clamper 14 applied in parallel to the rear surface 124 of a solid-state image pickup element main body 120 is screwed into a screw hole 135 of a holder 13 and clamped. Then the main body 120 is pressed in parallel toward the rear surface 133 of the holder 13 by the clamper 14 and fixed there from the direction of an arrow (a). At the same time. the horizontal and vertical pairs of outer circumference edges 125 and 126 are pressed and fixed in parallel to the horizontal and vertical pairs of taper surfaces 135 and 136 from the direction of an arrow (a) on the side of the surface 121 of the main body 120. Thus the main body 120 can be stably positioned and firmly fixed to the holder 13 in both X and Y directions by the forces in both directions.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solid-state image pickup device fixing device for fixing a solid-state image pickup device such as a CCD image sensor suitable for a multi-plate video camera to a holder.

[0002]

2. Description of the Related Art Conventionally, in a three-plate video camera 1 shown in FIG. 10, an optical lens 3 is provided on the front surface of a video camera body 2.
, And the image pickup device 4 connected on the optical axis F at the back of the optical lens 3 is incorporated in the video camera body 2.

The image pickup device 4 has an optical prism 5 arranged on the optical axis F, and three optical axes f ₁ , f ₂ for R, G, B branched from the optical axis F of the optical prism 5. , F ₃
It is composed of three solid-state image pickup devices 6 which are CCD image sensors mounted at right angles.
The color image signal captured by the optical lens 3 is
One solid-state image sensor 6 is configured to separate into three color signals of R, G, and B.

When the three solid-state image pickup devices 6 are mounted on the _three optical axes f ₁ , f ₂ and f ₃ of the optical prism 5, the three solid-state image pickup devices 6 are made of sheet metal 3 in advance.
Fix in one holder 7. Then, the three holders 7 are attached in parallel to the three holder mounting frames 8 made of sheet metal, which are integrally coupled on the _three optical axes f ₁ , f ₂ , and f _{3 of} the optical prism 5. Optical axes f ₁ and f
After the registration of the three solid-state image pickup devices 6 with respect to ₂ and f ₃ , respectively, the three holders 7 are fixed to the three holder mounting frames 8 by soldering or the like.

The conventional solid-state image pickup device 6 and the fixing device for fixing the solid-state image pickup device 6 to the holder 7 are constructed as shown in FIGS. 11 and 12.

First, the solid-state image pickup device 6 is a surface 6 of a rectangular and flat solid-state image pickup device main body 60 molded from synthetic resin.
A rectangular light receiving surface 62 is formed in the central portion on one side, and a plurality of leads 63 mounted in parallel along both upper and lower sides of the solid-state imaging device body 60 are projected to the back surface 64 side.

In the solid-state image pickup device main body 60, a pair of left and right screw fastening margins 6 having a lateral width W ₁ are provided on both left and right sides of the light receiving surface 62.
5 are provided, and a pair of left and right screw insertion holes 66 and a positioning hole 67 are formed in these screw fastening margins 65.

Therefore, in the conventional solid-state image pickup device 6, the lateral width W ₂ of the outer diameter dimension of the solid-state image pickup device main body 60 is 3 in particular.
The size was as large as 1 mm and the height H ₁ was 20.2 mm, which was large and expensive.

Then, in the center of the holder 7 made of sheet metal,
A rectangular window hole 70 facing the light receiving surface 62 of the solid-state imaging device 6 is formed, and a pair of left and right screw holes 71 screwed on the left and right sides of the window hole 70 are attached at right angles to the back surface 72 side. A pair of left and right positioning pins 73 are provided. In addition, a total of four mounting pieces 74 for mounting to the holder mounting frame 8 are formed in a pair in parallel with the front surface 76 on the left and right sides of the holder 7, and the back surface is formed on the left and right sides and the upper and lower sides of the holder 7. A total of four bent pieces 75 bent at a right angle to the 72 side are integrally formed.

The solid-state image sensor 6 is inserted into the pair of left-right positioning pins 73 of the holder 7 through the pair of left-right positioning holes 67, and the left-right pair of screw insertion holes 66 of the solid-state image sensor 6 are inserted from the rear surface 64 side. The pair of setscrews 9 are screwed into the pair of left and right screw holes 71 of the holder 7 so as to be fastened.
Was screwed on.

Then, on the surface 76 of the holder 7 to which the solid-state image pickup device 6 is screwed in this way, a total of 4 on both left and right sides.
As shown in FIG. 12 (B), one mounting piece 74 is applied in parallel to a total of four mounting pieces 80 on both left and right sides of the holder mounting frame 8 that is integrally coupled to the optical prism 5. After the center O of the light-receiving surface 62 of the solid-state image sensor 6 is aligned so that the optical axes f ₁ , f ₂ , and f ₃ of the optical prism 5 are aligned with each other, a total of four attachment pieces 74 of the holder 7 are held. It is completely fixed to the four mounting pieces 80 of the mounting frame 8 by soldering 10 or the like.

[0012]

However, in such a conventional fixing device for a solid-state image pickup device, a pair of left and right screw fastening margins 65 for screwing the solid-state image pickup device 6 to the holder 7 are used.
Must be formed on the left and right sides of the solid-state image sensor 60, the solid-state image sensor 6 is large and expensive.

Further, in the structure in which the solid-state image pickup device 6 is directly fastened to the holder 7 by the pair of left and right setscrews 9, strong concentrated stress is locally applied to the solid-state image pickup device main body 60 when the setscrew 9 is fastened. There is a problem that the solid-state image sensor body 60 made of synthetic resin is easily damaged (partially chipped).

A method of adhering the solid-state image pickup device 6 to the holder 7 may be considered. However, the adhering work is poor in workability as compared with the screw fixing work, and the registration shift of the solid-state image pickup device due to aging may be considered. However, when it is necessary to disassemble once for some reason during assembly, there is a problem that it is very inconvenient.

The present invention has been made to solve the above-mentioned problems, and a small-sized and low-priced solid-state image pickup device having no screw fastening margin is very stably and easily fixed to a holder. An object of the present invention is to provide a solid-state image sensor that can be used.

[0016]

A fixing device for a solid-state image sensor according to the present invention for achieving the above object comprises at least a pair of outer peripheral edges opposed to each other on the front surface side of the solid-state image sensor. A taper surface is formed on the holder, and the solid-state imaging device is pressed from the back side by a clamper screwed to the holder, and at least a pair of outer peripheral edges on the front side of the solid-state imaging device are set to the at least one pair of the holder. It is fixed by crimping to the tapered surface of.

[0017]

In the solid-state image pickup device fixing device of the present invention constructed as described above, the solid-state image pickup device is pressed from the back side by the clamper screwed to the holder so that the front side of the solid-state image pickup device faces each other. The at least one pair of outer peripheral edges are fixed to the at least one pair of tapered surfaces formed on the holder by pressure bonding.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a solid-state image pickup device fixing device to which the present invention is applied will be described below with reference to FIGS. It should be noted that the same structural parts as those in FIGS. 10 to 12 are denoted by the same reference numerals to omit redundant description.

[Description of First Embodiment] First, a first embodiment of the apparatus for fixing the solid-state image pickup device will be described with reference to FIGS.

[Description of Solid-State Imaging Device] First, the solid-state imaging device 12, which is the CCD image sensor used in this embodiment, is small and inexpensive.

That is, in the solid-state image pickup device 12, a rectangular light-receiving surface 62 is formed in the central portion on the surface 121 side of the rectangular flat-shaped solid-state image pickup device main body 120 molded of synthetic resin.
A plurality of leads 123 attached along both the upper and lower sides of the solid-state imaging device body 120 are projected to the back surface 124 side.

However, the solid-state image pickup device main body 120 is not provided with a pair of left and right screw fastening margins 65 having a lateral width W ₁ seen in the conventional solid-state image pickup device 6 shown in FIGS. 11 and 12.

Therefore, the outer diameter of the solid-state image pickup device main body 120 has a lateral width W ₃ of 18 mm and a height H ₂ of 15.1.
The size is small and the price is low.

[Description of Holder] Next, the holder 13 made of sheet metal is the conventional holder 7 shown in FIGS. 11 and 12.
Similarly, the rectangular window hole 130, a total of four mounting pieces 13
One or a total of four bent pieces 132 are formed. However, the holder 13 includes a pair of left and right positioning pins 7 as seen in the conventional holder 7 shown in FIGS. 11 and 12.
3, the holder 13 is a small solid-state image sensor 12
It is formed in a small size to match the outer diameter of the.

On the back surface 133 side of the holder 13, a rectangular concave portion 134 is formed on the outer periphery of the window hole 130, and a pair of left and right forming a substantially pyramidal hole on the outer periphery of the concave portion 134. Vertical and parallel tapered surface 135
And a pair of horizontal and parallel tapered surfaces 136 are formed. Then, on each of the left and right sides of the recess 134 of the holder 13, a pair of left and right screws, that is, a total of four tapped screw holes 137 are formed. Note that the four tapered surfaces 135 and 136 in total are the surface 12 of the solid-state imaging device body 120.
A pair of left and right vertical and outer peripheral edges 125 on one side
And a pair of upper and lower horizontal and parallel outer peripheral edges 126 face each other.

[Description of Clamper] Next, the clamper 14 made of sheet metal, synthetic resin or the like is used for the fixing device of the solid-state image pickup device.

The clamper 14 has a horizontal cross-section formed in a substantially U shape, and a pair of flanges 1 are provided at both left and right ends.
40 is formed in a pair. The left and right flanges 140 have a total of four screw holes 135 in the holder 13.
Left and right pairs facing each other, a total of four screw insertion holes 141
Are formed.

[Explanation of Method for Fixing Solid-State Imaging Device to Holder] When fixing the solid-state imaging device 12 to the holder 13, first, as shown in FIGS.
The pair of left and right outer peripheral edges 125 and 126 on the front surface 121 side of the solid-state imaging device main body 120 of No. 2 are applied parallel to the pair of left and right tapered surfaces 135 and 136 formed on the back surface 133 of the holder 13. The tapered surface 13 is placed in the substantially pyramidal hole formed by the tapered surfaces 135 and 136.
5, the solid-state imaging device main body 120 is stably seated (positioned) at right angles to the respective optical axes f ₁ , f ₂ , f ₃ .

Next, the clamper 14 is applied parallel to the back surface 124 of the solid-state image pickup device main body 120, and the clamper 14 is inserted into the four screw insertion holes 141 in total.
4 setscrews 15 in the holder 13 for a total of 4 screw holes 13
5, and the clamper 14 presses the solid-state image sensor main body 120 toward the back surface 133 side of the holder 13 in parallel from the optical axis f ₁ , f ₂ , f ₃ direction arrow a direction. To fix.

At this time, the surface 1 of the solid-state image sensor body 120
A pair of left and right outer edges 12 and a pair of upper and lower outer edges 12 on the 21 side
5, 126 are pressed in parallel to the pair of left and right tapered surfaces 135, 136 of the holder 13 from the direction of the arrow a, so that the tapered surfaces 135, 136 form the left and right X directions and the vertical Y direction. Due to the resultant force, the solid-state imaging device body 120 is extremely stably positioned and fixed to the holder 13 in a completely immovable state in the X direction and the Y direction.

As described above, according to this solid-state image sensor fixing device for fixing the solid-state image sensor 12 to the holder 13 by the clamper 14 screwed to the holder 13, the registration of the solid-state image sensor 12 to the optical prism 5 is performed. Can be kept extremely stable, and the registration shift of the solid-state imaging device 12 due to aging does not occur at all.

The work of screwing the clamper 14 to the holder 13 has better workability than the work of adhering, and the work of fixing the solid-state image pickup device 12 to the holder 13 can be performed easily, and at the time of assembling. Even if it is necessary to disassemble once for some reason, the set screw 15 can be removed, and the clamper 14 and the solid-state image sensor 12 can be easily disassembled and reassembled, which is very convenient.

At this time, as shown in FIGS. 4 and 5, the positions near the left and right outer peripheral edges 127 and the pair of upper and lower outer peripheral edges 128 (see FIG. 1) on the back surface 124 side of the solid-state image pickup device main body 120 are set. If a stepped partial pressing portion 139 and a plurality of projecting partial pressing portions 140 that can be pressed partially in the direction of the arrow a are formed on the clamper 14, the surface 121 of the solid-state image sensor body 120 is formed. The pressing force F in the arrow a direction can be applied only to the positions near the pair of left and right outer peripheral edges 125 and the pair of upper and lower outer peripheral edges 126.

Therefore, the arrow a is displayed on the solid-state image sensor body 120.
It is difficult to generate stress other than compressive force in the direction, and clamper 1
Even if the solid-state image sensor main body 120 is strongly tightened to the holder 13 in the direction of arrow a in 4, the solid-state image sensor main body 120 is not unnecessarily applied, the solid-state image sensor main body 120 is less likely to be damaged, and safety is improved. .

Then, after the solid-state image pickup device 12 is screwed to the holder 13 in this manner, (B) in FIG.
Similarly to the conventional example shown in FIG. 1, a total of four mounting pieces 131 on both the left and right sides on the front surface 138 side of the holder 13 are integrally coupled to the optical prism 5, and the holder mounting frame 8 is integrally formed.
It is applied in parallel to a total of four mounting pieces 80 on both the left and right sides of. Then, the center O of the light receiving surface 122 of the solid-state imaging device 12
Are aligned so that they coincide with the respective optical axes f ₁ , f ₂ and f ₃ of the optical prism 5, and then a total of 4 of the holder 13 is obtained.
A total of 4 mounting pieces 131 for holder mounting frame 8
It is completely fixed to one attachment piece 80 by soldering 10 or the like.

According to this fixing device for a solid-state image pickup device, a total of four tapered surfaces 135, 13 of the holder 13 are provided.
6 does not necessarily have to be formed along the entire circumference of the total four outer peripheral edges 125, 126 of the solid-state imaging device body 120, and only the four corners of the outer peripheral edges 125, 126 are opposed to each other. You may form. Further, only at least one of the pair of left and right tapered surfaces 135 or the pair of upper and lower tapered surfaces 136 is formed on the holder 13, and the pair of left and right outer peripheral edges 1 of the solid-state imaging device body 120 is formed.
25 or at least one of the pair of upper and lower outer peripheral edges 126 may be fixed by crimping with the clamper 14 in the direction of arrow a.

[Explanation of Second Embodiment] Next, referring to FIG. 6, a second embodiment of the fixing device for the solid-state image pickup device will be explained.

In the second embodiment, the solid-state image sensor main body 1
A pair of left and right parallel tapered surfaces 144 that press a pair of right and left outer peripheral edges 127 on the back surface 124 side of the clamper 20 are formed on the clamper 14, and the front surface 121 of the solid-state imaging device body 120 is formed.
And a pair of left and right outer peripheral edges 125 and 12 on the back surface 124.
7 is formed by the pair of left and right tapered surfaces 125 of the holder 13 and the pair of left and right tapered surfaces 127 of the clamper 14, and the front surface 121 side and the back surface 12 of the solid-state imaging device body 120.
The solid-state imaging device main body 120 has symmetry in the compression direction so as to be sandwiched and fixed in the directions of the arrows a and b from both sides.

According to the second embodiment, basically, no stress other than the compressive force in the directions of the arrows a and b is generated in the solid-state image pickup device main body 120, and the front surface 121 and the back surface of the solid-state image pickup device main body 120. Since the positioning force with respect to the holder 13 can be generated at both the position 124 and the holder 124, the solid-state image sensor body 120 can be more stably held by the holder 13 even if the clamping force of the solid-state image sensor body 120 by the clamper 14 is relatively weak. It can be positioned and fixed.

At this time, as shown in FIG. 7, a pair of left and right outer peripheral edges 125, 1 of the solid-state image pickup device main body 120.
By forming a chamfered surface 129 such as a C surface or an R surface on 27, it is possible to improve the sitting of the solid-state image sensor body 120 with respect to the pair of left and right tapered surfaces 135 and 136 of the holder 13, A pair of left and right outer peripheral edges 12 of the solid-state image pickup device main body 120 when the image pickup device main body 120 is fastened by the clamper 14 and fixed to the holder 13.
It is possible to prevent damage such as chipping of 5, 127.

[Description of Third Embodiment] Next, a third embodiment will be described with reference to FIG.

In the third embodiment, the solid-state image sensor main body 1
A pair of upper and lower surface-side tapered surfaces 13 opposed to a pair of upper and lower surface-side outer peripheral edges 126 on the surface 121 side of
6 is formed in the holder 13, and a pair of left and right rear surface side outer peripheral edges 12 on the rear surface 124 side of the solid-state imaging device body 120.
A pair of left and right back surface-side tapered surfaces 144 facing each other are formed on the clamper 14, and a pair of upper and lower front surface-side tapered surfaces 136 and a pair of left and right back surface-side tapered surfaces 144 which are perpendicular to each other are used to form the solid-state image sensor body 120. A pair of upper and lower front surface side outer peripheral edges 126 and a pair of left and right rear surface side outer peripheral edges 127 of the front surface 12 of the solid-state imaging device body 120.
It is sandwiched and fixed from both sides of the 1 side and the back surface 124 side.

Also in the third embodiment, the positioning force of the solid-state image pickup device main body 120, which is almost the same as that in the second embodiment, can be obtained very effectively.

As a method of processing the tapered surfaces 135, 136 and 144 on the holder 13 or the clamper 14, the cutting processing shown in FIG. 9A and the processing shown in FIG.
Various kinds of processing such as press working shown in (C) can be adopted. Further, the angle θ of the tapered surfaces 135 and 136 can be set arbitrarily.

Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments and various modifications can be made based on the technical idea of the present invention.

[0046]

The fixing device for a solid-state image pickup device of the present invention constructed as described above has the following effects.

According to a first aspect of the present invention, at least one pair of outer peripheral edges opposed to each other on the front surface side of the solid-state image sensor is formed on the holder by pressing the solid-state image sensor from the back surface side with a clamper screwed to the holder. Since it is crimped and fixed to the taper surface of, the compact, low-priced solid-state image sensor with no screw fastening margin is extremely stable in the holder by the screwing method regardless of the bonding method, and Can be easily fixed.

According to the first aspect of the present invention, the solid-state image sensor can be positioned and fixed very stably by the tapered surface formed on the holder, so that the registration of the solid-state image sensor with respect to the optical prism can be kept extremely stable. There is no misregistration of the solid-state image sensor due to aging.

Since the solid-state image pickup device is screwed to the holder by the clamper regardless of the bonding method, the solid-state image pickup device should be disassembled for some reason during assembly. It is very convenient because it can be easily disassembled and reassembled.

According to a second aspect of the present invention, a pair of pairs of the solid-state image pickup device, which face each other on the front surface side, a pair of faces facing a total of four outer peripheral edges, and a total of four taper faces are formed on the holder, and are screwed to the holder. Since the solid-state image sensor is pressed from the back side by a clamper, and a total of four outer peripheral edges on the front side of the solid-state image sensor are pressure-bonded and fixed to a total of four tapered surfaces of the holder, Thus, the solid-state image sensor can be fixed very stably in the left-right direction and the vertical direction in a completely immovable state.

According to a third aspect of the present invention, a partial pressing portion for applying a pressing force from the back surface side of the solid-state image pickup device is provided at a position near the outer peripheral edge on the front surface side of the solid-state image pickup device which is pressure-bonded to the tapered surface of the holder. Since it is formed on the clamper, when the solid-state image sensor is pressed and fixed to the holder by the clamper, stress other than compressive force is unlikely to be generated in the solid-state image sensor, and the solid-state image sensor can be safely fixed without being damaged. .

According to a fourth aspect of the present invention, at least a pair of tapered surfaces opposed to at least a pair of outer peripheral edges on both front and back surfaces of the solid-state image pickup element are formed on both the holder and the clamper, and the clamper is screwed to the holder. Since the at least one pair of tapered surfaces sandwiches and fixes at least the pair of outer peripheral edges on the front and back sides of the solid-state imaging device from both sides of the front and back, the positioning force of the solid-state imaging device with respect to the holder is further increased.

According to a fifth aspect of the present invention, the front surface side taper surfaces opposed to the pair of front surface side outer peripheral edges facing each other on the front surface side of the solid-state imaging device are formed in the holder, and the back surface side of the solid-state imaging device is opposed to each other. A pair of back surface side taper surfaces opposed to a pair of back surface side outer peripheral edges orthogonal to the pair of front surface side outer peripheral edges are formed on the clamper, and the clamper is screwed to the holder, and each pair of front surface side Since the pair of front side outer peripheral edge and the back side outer peripheral edge of the solid-state imaging device are sandwiched and fixed from the front and back sides by the tapered surface and the back surface-side tapered surface, the solid-state imaging element is fixed to the holder in the horizontal direction and the vertical direction. The positioning force is very effectively obtained.

According to a sixth aspect of the present invention, since the outer peripheral edge facing the tapered surface of the solid-state image sensor is chamfered,
When the solid-state image pickup device is pressed and fixed to the holder by the clamper, damage such as chipping of the outer peripheral edge of the solid-state image pickup device can be prevented, and safety is further improved.

[Brief description of drawings]

FIG. 1 is an exploded perspective view illustrating a first embodiment of a solid-state image sensor fixing device to which the present invention is applied.

FIG. 2 is a rear view of the first embodiment as viewed from the clamper side.

FIG. 3 is a horizontal sectional plan view of the first embodiment of the above.

FIG. 4 is a horizontal cross-sectional plan view showing a modified example of the clamper of the above-described first embodiment.

FIG. 5 is a horizontal cross-sectional plan view showing another modified example of the clamper of the first embodiment.

FIG. 6 is a horizontal cross-sectional plan view illustrating a second embodiment of the solid-state image sensor fixing device of the present invention.

FIG. 7 is a horizontal cross-sectional plan view showing a modified example of the solid-state imaging device body of the second embodiment.

FIG. 8 is a schematic perspective view illustrating a third embodiment of the fixing device for a solid-state image pickup device according to the present invention.

FIG. 9 is a partial cross-sectional view showing an example of processing the tapered surface of the fixing device for a solid-state image sensor according to the present invention.

FIG. 10 is a partially cutaway schematic side view of a three-plate video camera.

FIG. 11 is an exploded perspective view illustrating a conventional fixing device for a solid-state image sensor.

FIG. 12 is a rear view and a partially cutaway plan view illustrating a conventional fixing device for a solid-state image sensor.

[Explanation of symbols]

1 3 Plate Video Camera 4 Imaging Device 5 Optical Prism 8 Holder Mounting Frame 12 Solid-state Imaging Device 120 Solid-state Imaging Device Body 121 Surface of Solid-state Imaging Device Body 122 Light-receiving Surface of Solid-state Imaging Device Body 123 Lead of Solid-state Imaging Device Body 124 Solid-state Imaging Back side of device body 125, 126 Outer peripheral edge on front side of solid-state image sensor body 127, 128 Outer peripheral edge on back side of solid-state image sensor body 129 Chamfered surface of solid-state image sensor body 13 Holder 130 Holder window hole 131 Holder attachment piece 133 Rear surface of holder 134 Recessed portion of holder 135, 136 Tapered surface of holder 137 Screw hole of holder 138 Surface of holder 14 Clamper 140 Flange of clamper 141 Screw insertion hole of clamper 142, 143 Partial pressing portion of clamper 14 Clamper of the tapered surface 15 set screw

Claims (6)

[Claims] 1. A back surface of the solid-state image sensor is formed by forming at least a pair of tapered surfaces facing at least a pair of outer peripheral edges facing each other on the front surface side of the solid-state image sensor in a holder, and a clamper screwed to the holder. A fixing device for a solid-state image pickup device, characterized in that at least a pair of outer peripheral edges on the front surface side of the solid-state image pickup device are pressed and fixed to the at least one pair of tapered surfaces of the holder. 2. A clamper, in which each pair of pairs facing each other on the front surface side of the solid-state image pickup element, each pair of facing four outer peripheral edges, and a total of four tapered surfaces are formed on the holder, and screwed to the holder. The solid-state imaging device is pressed from the back side with a total of four outer peripheral edges on the front side of the solid-state imaging device to be pressed and fixed to a total of four tapered surfaces of the holder. Fixing device. 3. A partial pressing portion for applying a pressing force from the back surface side of the solid-state image pickup device to the clamper in the vicinity of an outer peripheral edge on the front surface side of the solid-state image pickup device which is pressure-bonded to the tapered surface of the holder. The solid-state image sensor fixing device according to claim 1 or 2, which is formed. 4. A solid-state image pickup device, wherein at least a pair of tapered surfaces facing at least a pair of outer peripheral edges on both front and back surfaces are formed on both a holder and a clamper, and the clamper is screwed to the holder, A fixing device for a solid-state image pickup device, characterized in that at least a pair of tapered surfaces sandwiches and fixes at least a pair of outer peripheral edges on both front and back sides of the solid-state image pickup device from both front and back sides. 5. A holder is formed with front surface side taper surfaces opposed to a pair of front surface side outer peripheral edges opposed to each other on the front surface side of the solid-state image pickup element, and opposed to each other on the rear surface side of the solid-state image pickup element. A pair of back surface side taper surfaces opposed to the pair of back surface side outer circumference edges orthogonal to the front surface side outer peripheral edge are formed on the clamper, and the clamper is screwed to the holder to form the pair of front surface side tapered surfaces. A fixing device for a solid-state image pickup device, characterized in that the pair of front-side outer peripheral edges and the back-side outer peripheral edge of the solid-state image pickup device are sandwiched and fixed from both front and back sides by a backside taper surface. 6. The solid-state image pickup device according to claim 1, wherein an outer peripheral edge facing the tapered surface is chamfered. Fixing device for solid-state image sensor.