JPH0886831A - Board for burn-in test - Google Patents

Abstract

PURPOSE: To enable burn-in testing of multiple kinds of semiconductor devices to be conducted through a connection altering work of a wire member separated from a substrate by mounting an electrical part to be tested on the substrate and connecting one end of the wire member composed separately from the substrate a to a part side contact section. CONSTITUTION: An electric part to be tested is mounted on a substrate 1, one ends of wire members 25 and 26 composed separately from the substrate 1 is connected to a part side contact part 20 and the other ends of the wire members 25 an 26 are connected to any ones of a plurality of contact parts 21 and 22 on the side of a contact plug according to the part to be tested and the contact plug of the substrate 1 is connected to a contact plug of a burn-in tester. The substrate 1 is arranged in a heating tank of the tester and the electric part to be tested is placed in a high temperature environment accompanying heating operation of the heating tank to supply electric test conditions such as voltage, current and signals to the electric part to be tested according to the type of the electric part to be tested through the contact plug of the substrate 1 from the contact plug of the burn-in tester. Thus, a burn-in testing of the electric part to be tested is performed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a burn-in test board used when performing burn-in tests on various electric parts.

[0002]

2. Description of the Related Art As various electric parts for performing a burn-in test, there are a semiconductor device such as an IC package or a mold box type electric part such as a DC / DC converter.

The burn-in test in the reliability test of a semiconductor device has a dependency between operating time and stress in order to remove a semiconductor device having an inherent defect from the manufactured semiconductor devices or due to manufacturing variations. This is a type of screening test performed to remove a semiconductor device, and is most suitable for detecting imperfections on the surface of a semiconductor element in a semiconductor device, structural defects inside the semiconductor element, connection failures of wirings, and the like. In this burn-in test, a semiconductor device as an electric component to be tested is placed in a high temperature environment, and a power supply voltage of a rating or higher and an electrical test condition such as a current and a signal close to an actual operation are applied to the semiconductor device,
This is a test in which temperature stress and voltage stress are applied to a semiconductor device. For information on how to perform this burn-in test, refer to the STD of the US Military Standards and Specifications (MIL).
In the screening rules for the test method and procedure for microelectronics in -883, it is described that the burn-in test is performed while adding 125 ° C for 240 hours in class A, and the burn-in test is performed in class B while adding 125 ° C for 160 hours. .

FIG. 13 is a perspective view showing the appearance of a conventional burn-in test board used in a burn-in test.
In FIG. 13, the burn-in test board includes a board 1 formed of a printed board in a substantially rectangular shape. A handle 2 is provided at one end of the substrate 1, and a connector 3 is provided at the other end of the substrate 1 located on the opposite side of the handle 2. The connector 3 has a plurality of terminals 3a such as a power supply terminal, a ground terminal, and a signal terminal. The plurality of terminals 3a are pattern wirings formed of a conductive foil in a portion which constitutes the contact plug 3 of the substrate 1 in a shape such as a strip shape which is predetermined by a printing plate making technique or the like. The IC socket 4 and the control mounting component 5 are provided on one plate surface of the substrate 1.
Multiple are assembled. The control mounting component 5 is, for example, a resistor or a capacitor. Each IC socket 4 has one accommodating portion 4a and a pin 4b that constitutes a plurality of terminals. By inserting the pin 4b into a through hole (not shown) formed in the substrate 1 and connecting the IC socket 4a, the IC socket 4 4 is assembled to the substrate 1. When the IC socket 4 is assembled to the substrate 1, the pins 4b are formed of a conductive foil provided along the substrate 1 so as to form a predetermined wiring route by a printing plate making technique or the like. The terminals 3 a of the connector 3 are individually connected via the pattern wiring, and the housing 4 a is provided on the substrate 1. By detachably mounting the semiconductor device 6 as the test target electric component for performing the burn-in test in the housing portion 4a of the IC socket 4, the pins 6a constituting the plurality of leads of the semiconductor device 6 are connected to the IC socket 4 by the pins 6a. It is individually connected to the plurality of pins 4b. That is, the semiconductor device 6 serves as the housing portion 4 a of the substrate 1.
The pins 6a of the semiconductor device 6 are individually connected to the plurality of terminals 3a of the connector 3 via the pins 4b of the IC socket 4, the through holes (not shown), and the pattern wiring (not shown).

Therefore, in order to perform a burn-in test with the conventional burn-in test board shown in FIG.
By mounting the semiconductor device 6 in the housing portion 4a of the substrate 1, the pins 6a of the semiconductor device 6 are brought into contact with the pins 4b of the IC socket 4 and the contact between the pins 6a and 4b is maintained. Then, the handle 2 of the substrate 1 is gripped, the substrate 1 is transported to a burn-in test device (not shown), and the plug 3 of the substrate 1 is inserted into a plug (not shown) of the burn-in test device to be male-female coupled to obtain a semiconductor device. The mounted burn-in test board 6 is placed in a heating tank (not shown) of the burn-in test apparatus. Subsequently, the heating tank of the burn-in test apparatus is heated to create a high temperature environment of a predetermined temperature required for the burn-in test of the semiconductor device 6 in the heating tank.
While heating the substrate, the board 1
Electrical test conditions such as a predetermined voltage, current or signal are applied to the semiconductor device 6 via the plug 3. At this time, the amount of current supplied to the semiconductor device 6 is controlled by the resistance as the control mounting component 5, and noise is absorbed by the capacitor as the control mounting component 5. After this state is continued for a predetermined time such as 160 hours, the burn-in test board is taken out of the heating tank, and the plug 3 of the substrate 1 is pulled out from the plug of the burn-in test apparatus. Then, the characteristics of the semiconductor device 6 are checked to determine whether the semiconductor device 6 is good or bad. In recent years, a monitor burn-in system has also been put into practice, in which the characteristics of the semiconductor device 6 are checked and the quality is judged in the heating tank of the burn-in test device while applying heating and electrical test conditions to the semiconductor device 6.

By the way, as shown in FIG. 14, there are types of semiconductor devices that are classified based on the relationships such as the number of pins, pin arrangement, and pin function. The semiconductor device 6A shown in FIG. 14A has the same width but a different length L due to the change in the number of pins. The semiconductor device 6B shown in FIG. 14B has the same number of pins and the same length. However, the width D varies depending on the pin arrangement. Although the semiconductor device 6C shown in FIG. 14C and the semiconductor device 6D shown in FIG. 14D have the same number of pins and pin arrangement, the pin function set for each pin is different. In the semiconductor device 6C shown in FIG.
The 8th pin 4b-18 is determined as a power supply pin for connecting to the power supply Vcc, the 9th pin 4b-9 is determined as a ground pin for connecting to the ground GND, and the other pins are supplied with a signal. It is determined to be a signal pin. In the semiconductor device 6D shown in FIG. 14D, the 12th pin 4b
-12 is determined as a power supply pin, the third pin 4b-3 is determined as a ground pin, and the other pins are determined as signal pins. That is, since the plurality of pins of the semiconductor device and the pins of the IC socket correspond in number and arrangement, the semiconductor device 6A shown in FIG.
The IC socket is different from that of the semiconductor device 6B shown in FIG. 6B, and as a result, the design of the burn-in test board needs to be changed. In addition, the semiconductor device 6C shown in FIG.
Although the same socket can be used in the semiconductor device 6D shown in FIG. 14D and the pin function is different, it is necessary to change the design of the burn-in test board.

A change in design of the burn-in test board depending on the number of pins, pin arrangement, and pin function in this semiconductor device will be described with reference to FIG. This Figure 1
5 shows the static burn-in system as an example. In the static burn-in method, the power supply pins and ground pins of the semiconductor device are connected to the power supply pattern wiring by conductive wires, and the signal pins of the semiconductor device are connected to the power supply pattern wiring and the ground pattern via pull-up resistors. This is a method of screening the device. Specifically, FIG. 15A is a plan view showing a part of a burn-in test board for performing a burn-in test on a semiconductor device having nine pins along two opposing sides. In FIG. 1A, the substrate 1 includes socket through holes 7 arranged in two rows at right and left sides, resistor through holes 8 respectively arranged outside the socket through holes 7, and resistor through holes 8. The ground pattern wiring 9 and the power supply pattern wiring 10 are provided so as to extend along the outside of each of the holes 8. The IC socket 4A has nine pins 4b along two opposite sides. When this pin 4b is described by giving a number, it is assumed that the number is given in order from the uppermost pin on the right side in the clockwise direction. This I
In the C socket 4A, the 18th pin 4b-18 is determined to be the power supply pin and the 9th pin 4b-9 is determined to be the ground pin, based on the functional configuration of the pins of the semiconductor device mounted in the housing portion (not shown). Therefore, in the board 1, the socket through hole 7 into which the 18th pin 4b-18 of the IC socket 4A is inserted is connected to the power pattern wiring 10 by the relay pattern wiring 11, and the 9th pin 4b- of the IC socket 4A- The socket through hole 7 into which 9 is inserted is connected to the ground pattern wiring 9 by a relay pattern wiring 12 different from the above. Therefore, as shown in FIG.
Pin 4b of C socket 4A through socket for through hole 7
No. 18 pin 4b-1 by assembling the IC socket 4A to the substrate 1 by inserting it into
The power supply pin 8 is connected to the power supply pattern wiring 10 by the relay pattern wiring 11, and the ground pin as the 9th pin 4b-9 is connected to the ground pattern wiring 9 by the relay pattern wiring 12. A module resistor 13 as a pull-up resistor is installed on the through hole 8 for resistance, and this module resistor 13 becomes a power pin of the IC socket 4A through a relay pattern wiring (not shown) connected to the through hole 8 for resistance. No. 18 pin 4b-18 and ground pin 9
The pins 4b other than the numbered pins 4b-9 are connected to the power supply pattern wiring 9 and the ground pattern wiring 10 according to preset test specifications. In FIG. 15B, the pin facing distance is the same as in FIG.
FIG. 11 is a plan view showing a part of a burn-in test board for performing a burn-in test on a semiconductor device in which the number of pins is different from that in FIG. In this figure, the distances between the socket through holes 7 facing each other are the same as those in figure a, but the relay pattern wirings 11A and 12A are used.
The position of is different. IC socket 4B has 1 on each of the two opposite sides.
Five pins 4b are arranged in rows along two sides. In the case of giving a number to this pin 4b for explanation, the procedure is the same as that of FIG. This IC socket 4B has a functional configuration of pins of a semiconductor device mounted in a housing portion (not shown)
Pin No. 4b-30 is determined to be the power pin, Pin No. 4b-30
b-15 is defined as the ground pin. Therefore, in the board 1, the 30th pin 4b-3 of the IC socket 4B
The socket through hole 7 into which 0 is inserted is connected to the power supply pattern wiring 10 by the relay pattern wiring 11A, and I
The socket through hole 7 into which the 9th pin 4b-15 of the C socket 4B is inserted is connected to the ground pattern wiring 9 by a relay pattern wiring 12A different from the above. Therefore, as shown in FIG.
By inserting b into the through hole 7 for socket and connecting with high temperature solder, and assembling the IC socket 4B to the board 1, the power source pin as the 30th pin 4b-30 is the power source pattern wiring at the relay pattern wiring 11A. The ground pin as the 15th pin 4b-15 is connected to the ground pattern wiring 9 by the relay pattern wiring 12A. A module resistor 13A as a pull-up resistor is installed on the through hole 8 for resistance, and the module resistor 13A is connected to the through hole 8 for resistance through a relay pattern wiring (not shown) to supply the power pin 4 of the IC socket 4B.
Pins other than b-30 and the ground pin 4b-15 are connected to the power supply pattern wiring 10 and the ground pattern wiring 9 in accordance with preset test specifications. Figure 15c is
FIG. 11 is a plan view showing a part of a burn-in test board for performing a burn-in test on semiconductor devices having the same number of pins and pin arrangement as those in FIG. In this c diagram, the positions of the relay pattern wirings 11B and 12B are a.
Different from the figure. That is, in the IC socket 4C, the 12th pin 4b-12 is determined to be the power supply pin because of the pin function of the semiconductor device mounted in the housing portion (not shown), and the 3rd pin 4b-
3 is determined to be the ground pin. Therefore, by inserting the pin 4b of the IC socket 4C into the through hole 7 for socket and connecting with high temperature solder, and by assembling the IC socket 4C to the substrate 1, the power pin as the 12th pin 4b-12 is a relay pattern. The wiring 11B is connected to the power supply pattern wiring 10, and the ground pin as the third pin 4b-3 is connected to the ground pattern wiring 9 by the relay pattern wiring 12B. The module resistor 13 installed on the resistor through hole 8 is not connected to the 12th pin 4b-12 and the 3rd pin 4b-3 of the IC socket 4C via a relay pattern wiring (not shown) connected to the resistor through hole 8. Are connected to the power supply pattern wiring 10 and the ground pattern wiring 9 according to preset test specifications. Although the number of pins and the pin function are the same as those in the a diagram in the d diagram of FIG. 15,
FIG. 6 is a plan view showing a part of a burn-in test board for performing a burn-in test on semiconductor devices having different pin arrangements.
In this d diagram, the facing interval of the socket through holes 7 is different from that in the a diagram. That is, from the width of the semiconductor device mounted in the IC socket 4D, the facing interval of the socket through holes 7 is wider than that in FIG. In addition, in FIG.
Although a single IC socket 4A to 4D is shown in the figures a to d, a plurality of IC sockets 4A to 4D can be arranged in tandem.

[0008]

As described above, as shown in FIG.
As shown in FIGS. 15A to 15C, the burn-in test board has different types depending on the number of pins, the pin arrangement, and the pin function of the semiconductor devices.
As shown in the figure, the relay pattern wiring 11, 11A, 11
The positions of B, 12, 12A, and 12B are different, or the positions of the ground pattern wiring 9 and the power supply pattern wiring 10 are different as shown in FIG. As a result, when the types of semiconductor devices differ depending on the number of pins, the pin arrangement, and the pin function, the conventional burn-in test board shown in FIG. 13 has the IC socket 4 mounted on the substrate 1 as described above.
Since the pins 4b are connected to the terminals 3a of the connector 3 by the power supply pattern wiring, the ground pattern wiring, and the relay pattern wiring, respectively, the design must be changed and remade. However, in order to recreate the burn-in test board, it is necessary to recreate it from the basic elements of burn-in test board manufacturing, such as the drawings and board films used for printing and plate making technology, which poses the problem of enormous stress, time, and cost. It was

The present invention has been made in order to solve the above problems, and its purpose is to change the connection of a wiring member separate from the substrate without inviting remaking by a printing plate making technique or the like. The burn-in test can be performed on a plurality of types of semiconductor devices.

[0010]

According to a first aspect of the present invention, there is provided a burn-in test board in which a plurality of boards on which electrical components to be tested are mounted are arranged on a component side contact portion and are spaced apart from the contact portion. And a contact part on the plug side of
The component side contact part can be connected to one end of a wiring member configured separately from the substrate and is connected to the terminal of the electric component under test by pattern wiring, and the plurality of plug side contact parts have the other end of the wiring member. It can be connected and is connected to the plug of the board with a pattern wiring different from the above and for power supply.
While having different electrical roles such as for grounding, by connecting one end of the wiring member to the component side contact portion, and by connecting the other end of this wiring member to any of the plurality of plug side contact portions, The electrical test condition to be supplied to the test target electrical component is configured to be switched according to the type of the test target electrical component.

In the burn-in test board according to the second aspect of the present invention, the board according to the first aspect of the present invention is configured such that the plurality of terminals of the electrical component under test are individually arranged according to the type of the electrical component under test. It has a plurality of rows of terminal portions for connecting relative to each other, and the terminal portions of each of these plurality of rows connect pattern wiring extending in a direction crossing the plurality of rows corresponding to each terminal of the electrical component under test, and the pattern wiring While each of the extended ends has a component-side contact portion in a row arrangement, outside the row of the component-side contact portion, a plurality of plugging sides having different electrical roles such as power supply and ground The contact portion is provided corresponding to each component side contact portion corresponding to the terminal of the electrical component to be tested.

In the burn-in test board according to a third aspect of the present invention, the board according to the first aspect of the present invention is such that each of the plurality of terminals of the electrical component under test is individually arranged according to the type of the electrical component under test. The terminal portion for connection has a grid-like arrangement, and the terminal portion for each grid-like arrangement connects the pattern wirings extending in the direction crossing the corresponding rows and columns corresponding to the terminals of the electrical component under test, and connecting the pattern wirings. The extended ends each have a component side contact portion arranged in a row, and a plurality of plug side contacts having different electrical roles such as power supply and grounding are provided outside the row of the component side contact portion. While the parts are arranged concentrically and in a similar shape, the parts are provided so as to correspond to each of the component-side contact parts corresponding to the terminals of the electrical component to be tested.

According to a fourth aspect of the present invention, in the burn-in test board according to the first aspect of the invention, the board according to the first aspect of the present invention individually provides a plurality of terminals of the electrical component under test according to the type of the electrical component under test. The terminal portion for connection has a grid-like arrangement, and the terminal portion for each grid-like arrangement connects the pattern wirings extending in the direction crossing the corresponding rows and columns corresponding to the terminals of the electrical component under test, and connecting the pattern wirings. Each of the extended ends has component-side contact portions arranged in a row, and outside the row of the component-side contact portions, a plurality of patterns having different electrical roles such as for power supply and grounding are provided at predetermined intervals. Wirings are formed in a plurality of rows in a concentric and similar rectangular shape, and the plug-side contact portion is paired with the terminal of the electrical component under test in each of these plurality of concentric pattern wirings. Together provided corresponding to each part contacting portions which is obtained by a configuration in which four corners of the pattern wiring of a plurality of rows concentric similar figures are separated.

A burn-in test board according to a fifth aspect of the present invention is the burn-in test board according to any one of the first to fourth aspects, wherein the component-side contact portion is formed as a through hole.

In a burn-in test board according to a sixth aspect of the present invention, the contact portion on the plug side in any one of the first to fourth aspects is formed as a through hole.

A burn-in test board according to a seventh aspect of the present invention is such that the component-side contact portion of any of the first to fourth aspects is a male or female connector.

A burn-in test board according to an eighth aspect of the present invention is the burn-in test board according to any one of the first to fourth aspects of the present invention, wherein the plug-side contact portion is a male or female connector. .

[0018]

In the burn-in test board according to the first aspect of the present invention, the electrical component to be tested is mounted on the board, and one end of the wiring member formed separately from the board is connected to the component-side contact portion. After connecting the end to one of the contact parts on the plug side depending on the type of electrical component under test,
While connecting the plug of the substrate to the plug of the burn-in test device, this substrate is placed in the heating tank of the burn-in test device, and the above-mentioned electrical components to be tested are placed in a high temperature environment associated with the heating operation of this heating tank, From the plug of the burn-in test equipment to the electrical component under test through the plug of the board,
A burn-in test is performed on an electrical component to be tested by supplying electrical test conditions such as signals according to the type of the electrical component to be tested.

The burn-in test board of the second invention is
Since the board has a plurality of rows of test-target electrical component connecting terminals, a component-side contact portion, and a plurality of plug-side contact portions spaced apart from each other, one end of the wiring member is connected to the component-side contact portion. By connecting the other end of the wiring member to one of the multiple plug-side contact parts according to the type of test target component, burn-in test can be appropriately performed on multiple types of test target components with different pin numbers and pin functions. .

The burn-in test board of the third invention is
Since the board has a grid-shaped arrangement of the test-target electrical component connection terminals, the component-side contact portion surrounding the test-target electrical component, and a plurality of plug-side contact portions, one end of the wiring member is connected to the component-side contact portion, and this wiring member is connected. By connecting the other end to one of a plurality of plug-side contacts depending on the type of the test target component, a burn-in test can be appropriately performed on a semiconductor device having a large number of pins.

The burn-in test board of the fourth invention is
Since the plurality of pattern wirings for providing the plug-side contact portion are separated at the four corners, the set of elements surrounded by the pattern wirings are arranged vertically and horizontally while being close to each other by utilizing the empty portions at the four corners. By doing so, IC to one substrate 1
The mounting density of sockets is increased.

The burn-in test board of the fifth invention is
Since the component side contact part is a through hole,
By inserting one end of the wiring member into the through hole and joining it with high-temperature solder or the like, the connection between the one end of the wiring member and the component side contact portion is secured.

The burn-in test board of the sixth invention is
Since the contact part on the plug side is a through hole,
The other end of the wiring member is inserted into the through hole and joined by high-temperature solder or the like to secure the connection between the other end of the wiring member and the contact side contact portion.

The burn-in test board of the seventh invention is
Since the component side contact part is a male or female connector, a female or male connector is provided at one end of the wiring member, and one end of the wiring member is formed by the male and female coupling between the wiring member side and the component side contact part connector. To secure the connection with the component side contact part.

The burn-in test board of the eighth invention is
Since the plug-side contact part is a male or female connector, a female or male connector is provided at the other end of the wiring member, and wiring is performed by male-female coupling between the wiring member side and the plug-side contact part connector. The connection between the other end of the member and the contact portion on the plug side is secured.

[0026]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, each embodiment of the present invention will be described with reference to FIGS.
The static burn-in method will be described as an example, using the same reference numerals as those used in the conventional example. Example 1 (corresponding to claim 1, claim 2, claim 5, claim 6). FIG. 1 is a schematic view showing a part of the burn-in test board of Example 1 in plan view, and FIGS. 2 and 3 show a state in which a wiring member separate from the board of the burn-in test board of Example 1 is connected. FIG.

In FIG. 1, a substrate 1 is provided with through holes 7, 7A, 7B, 7C, 7 for sockets as terminal portions for connecting test target electric parts, which are arranged in rows at a predetermined interval on the left and right.
D, component-side contact portion 20, ground pattern wiring 9, power supply pattern wiring 10, and plug-side contact portions 21, 2
2 The through holes 7 for sockets and the component-side contact portions 20 arranged in a column on the right side of the socket form a set that is connected to each other by the relay pattern wiring 23 in a direction traversing the column, that is, in the lateral direction, and along the column. They are independent of each other in the vertical direction. in short,
The relay pattern wiring 23 connected to the socket through hole 7 in the right column extends rightward and outward from the accommodating portion 4a (see FIG. 13) of the IC socket 4A shown by the alternate long and short dash line, and the extended end of the relay pattern wiring 23. A component side contact portion 20 is provided in each of the portions. Further, the through holes 7A to 7D for sockets on the left side column and the component side contact portions 20 arranged on the left side thereof are connected to each other by a relay pattern wiring 24 different from the above in the direction traversing the vertical direction, that is, the horizontal direction. Together with the group,
They are independent of each other in the vertical direction along the column. In short, the relay pattern wiring 24 for connecting the through holes 7A to 7D for sockets on the left column is the IC socket 4A.
The component-side contact portion 20 is provided on each of the extended end portions of the relay pattern wiring 24 that extends outward in the left lateral direction from the housing portion 4a (see FIG. 13) of the. These component-side contact portions 20 are through holes to which one ends of wiring members 25 and 26 such as conductive wires and resistors that are formed separately from the substrate 1 can be connected. The grounding pattern wiring 9 and the power supply pattern wiring 10 are arranged on the right and left outer sides of the component side contact portion 20 at predetermined intervals in rows, and the plug side contact portions 21 and 22 are provided. Plug side contact part 21 located on the ground pattern wiring 9 and plug side contact part 2 located on the power supply pattern wiring 10.
2 is a through hole to which the other ends of the wiring members 25 and 26 can be connected. These plug-side contacts 2
The positions of 1 and 22 oppose the component-side contact portion 20 in the lateral direction, and as a result, IC sockets 4A, 4 to be described later are provided.
DIP mounted on B and 4D for burn-in test
There is a one-to-one correspondence between terminals and positions of a semiconductor device called (Dual Inline Package). Also,
The distance from the component-side contact portion 20 in the left-right column to the plug-side contact portion 21 on the ground pattern wiring 9 is the same dimension L1. The distance to the plug contact side contact portion 22 is the same dimension L2 (L1 <L2).

The IC socket 4 shown by the alternate long and short dash line in FIG.
A has nine pins 4b along two opposite sides. The IC socket 4A is assembled to the substrate 1 by inserting the pin 4b into the socket through holes 7 and 7A and connecting with high temperature solder. This I
In the state where the C socket 4A is assembled to the substrate 1, the pins 4b in the right column are individually connected to the component side contact portions 20 in the right column by the socket through holes 7 and the relay pattern wirings 23, respectively. Pin 4
b is individually connected to each of the component side contact portions 20 in the left column by the socket through hole 7A and the relay pattern wiring 24. The IC indicated by the chain double-dashed line in FIG. 1 above
The socket 4B has 15 pins 4b along two opposite sides. The IC socket 4B is assembled to the substrate 1 by inserting the pins 4b into the socket through holes 7 and 7A and connecting them with high temperature solder. When the IC socket 4B is assembled to the substrate 1, the pins 4b are the through holes 7 for the socket,
7A and the relay pattern wirings 23 and 24 are individually connected to the component-side contact portions 20. The IC socket 4D shown by the dotted line in FIG. 1 has nine pins 4b along two opposite sides. The IC socket 4D is assembled to the board 1 by inserting the pins 4b into the socket through holes 7 and 7C and connecting them with high temperature solder. This IC socket 4D is the substrate 1
In the assembled state, the pin 4b has the socket through holes 7, 7C and the relay pattern wirings 23, 2
4 are individually connected to the component side contact portions 20.

Next, a burn-in test using the burn-in test board of Example 1 will be described. The burn-in test board according to the first embodiment is, for example, an IC socket using socket through holes 7 and 7A depending on the type of a semiconductor device 6 (see FIG. 13) as a test target electric component to be subjected to a burn-in test. A plurality of IC sockets, such as an IC socket using the through holes 7 and 7B, an IC socket using the socket through holes 7 and 7C, and an IC socket using the socket through holes 7 and 7D, are configured to be assembled. ing. Therefore, for simplification of description, it is assumed that the substrate 1 is assembled with the IC socket 4A shown in phantom in FIG. 1 that uses the through holes 7 and 7A for sockets. When performing the burn-in test, the semiconductor device 6 is mounted in the housing portion 4a (see FIG. 13) of the IC socket 4A of the substrate 1 and the semiconductor device 6 is mounted.
One end of the wiring members 25 and 26 is connected to the IC socket 4 according to the preset test specifications according to the types classified based on the relations such as the number of pins, the pin arrangement, and the pin function.
Connect to each component side contact part 20 corresponding to A,
The other ends of the wiring members 25 and 26 are connected to either the plug-side contact portion 21 on the ground pattern wiring 9 or the plug-side contact portion 22 on the power pattern wiring 10. The connection of the wiring members 25 and 26 to the component side contact portion 20 and the plug side contact portions 21 and 22 will be described in detail with reference to FIGS. 2 and 3. 2A is a schematic plan view showing a state in which one component-side contact portion 20 is connected to the plug-side contact portion 21 on the ground pattern wiring 9 by the wiring member 25 (from FIG. 1 is omitted). 2 is a sectional view including the substrate 1 corresponding to the line AA shown in FIG. 2A, and the wiring member 25 is composed of conductive wires 25A such as jumper wires. The conductive wire 25A is formed in a U shape, and one piece that connects the two pieces facing each other has an insulating coating 25a, and the two pieces facing each other form the through hole and the plug side contact which constitute the component side contact portion 20. It is in a state of being inserted into a through hole which constitutes the portion 21 and connected with the high temperature solder 27. 2 is a sectional view including the substrate 1 corresponding to the line AA shown in FIG. 2A, and the wiring member 25 is composed of a resistor 25B. The resistor 25B has lead wires 25 extending from both ends.
One of the b's was bent in a U shape, and the lead wire 25b facing the U-shape was inserted into the through hole forming the component side contact part 20 and the through hole forming the plug side contact part 21 and connected with the high temperature solder 27. It is in a state. FIG. 3A is a schematic plan view showing a state in which one component side contact portion 20 is connected to the plug side contact portion 22 on the power supply pattern wiring 10 by the wiring member 26 (from FIG. 1 is omitted). B in FIG.
The drawing is a cross-sectional view including the substrate 1 corresponding to line AA shown in FIG. A, in which the wiring member 26 is composed of a conductive wire 26A. The conductive wire 26A is formed in a U-shape, and one piece that connects two pieces facing each other has an insulating coating 26a, and the two pieces facing each other form a through hole and a plug side contact which constitute the component side contact portion 20. It is in a state in which it is inserted into the through hole forming the portion 22 and is connected with the high temperature solder 27. FIG. 3C is a sectional view including the substrate 1 corresponding to the line AA shown in FIG.
6B. In the resistor 26B, one of the lead wires 26b extending from both ends is bent in a U-shape, and the lead wire 26b which faces the resistor body 26B forms a through hole forming the component side contact portion 20 and a through hole forming the plug side contact portion 22. It is in a state of being inserted and connected with the high temperature solder 27. That is, the component-side contact portion 20 connected to the pin assigned to the power supply pin among the pins 4b of the IC socket 4A shown in FIG. 1 uses the conductive wire 26A as shown in FIG. The component-side contact portion 20 connected to the plug-side contact portion 22 on the connector 10 and connected to the pin assigned to the ground pin among the pins 4b of the IC socket 4A has a conductive wire as shown in FIG. 25A is used to connect to the plug-side contact portion 21 on the ground pattern wiring 9, and the pin 4 of the IC socket 4A is connected.
The component side contact portion 20 connected to the pin assigned to the signal pin of b is provided with the power source pattern wiring 10 or the ground by using the resistors 25B and 26B as shown in FIG. 2c and FIG. 3c. It is connected to one of the contact side contacts 22 on the pattern wiring 9. Therefore, according to the first embodiment, the power supply pattern wiring 10 is formed by the wiring members 25 and 26 such as conductive wires and resistors for each pin of the semiconductor device 6 mounted on the substrate 1 via the IC socket 4A.
Alternatively, the wiring can be switched to the ground pattern wiring 9.
Subsequently, the plug 3 of the substrate 1 on which the semiconductor device 6 is mounted
(Refer to FIG. 13) is male and female connected to the plug of the burn-in test device, the burn-in test board is placed in the heating tank of the burn-in test device, and the burn-in test of the semiconductor device 6 is required in the heating tank of the burn-in test device. While the semiconductor device 6 is heated by creating a high temperature environment of a predetermined temperature, electrical test conditions such as voltage, current or signal are supplied from the plug of the burn-in test device to the plug 3 of the substrate 1. This plug 3
Electrical test conditions supplied to the power supply pattern wiring 1
0, plug side contact part 22, wiring members 25 and 26, component side contact part 20, relay pattern wirings 23 and 24,
The voltage is applied to the semiconductor device 6 by a circuit formed by the contact-side contact portion 21 and the ground pattern wiring 9. At this time, the power supply pin of the semiconductor device 6 becomes the power supply potential, the ground pin of the semiconductor device 6 becomes the ground potential, and the signal pin of the semiconductor device 6 is supplied with the amount of current controlled by the resistors 25B and 26B. A tech burn-in method burn-in test is performed.

In short, in the first embodiment, a plurality of types of IC sockets are assembled to the substrate 1 through the plurality of rows of socket through holes 7, 7A to 7D, and the substrate 1 is provided with wiring members 25 and 26. The component-side contact portion 20 whose one end can be connected and the other end of the wiring members 25 and 26 which can be connected and have a plurality of plug-side contact portions 21 and 22 which have different electrical roles such as for power supply and grounding are arranged separately. Because of the configuration, one end of the wiring members 25 and 26 is connected to the component side contact portion 20, and the other end of the wiring members 25 and 26 is electrically connected to the electrical contact according to the preset test specifications depending on the type of the semiconductor device 6. By connecting to any one of the plurality of contact-side contact portions 21 and 22 having different functions, the number of pins and the number of pins can be reduced without recreating the burn-in test board by printing plate making technology. Placement and pin functions can appropriately burn-in test a plurality of different types of semiconductor devices. This point particularly corresponds to claim 2.

In the first embodiment, the component side contact portion 2
Since 0 is configured as a through hole, as shown in FIGS. 2 and 3, conductive wires 25A, 26 such as jumper wires are provided.
By inserting one end of A or one end of the resistors 25B and 26B into the through hole and joining them with the high temperature solder 27 or the like, the component side contact portion 20 and the wiring member 25,
The connection with one end of 26 can be maintained. In addition, it is not necessary to provide a special coupling means at one end of the conductive wires 25A and 26A such as jumper wires or the lead ends of the resistors 25B and 26B, and the component side contact portion 20 and the wiring member 25,
The connection structure with one end of 26 can be constructed very easily. This point particularly corresponds to claim 5.

In the first embodiment, the plug-side contact portion 2
Since the Nos. 1 and 22 are configured as through holes, as shown in FIGS. 2 and 3, the conductive wire 25 such as a jumper wire is used.
By inserting the other end of A, 26A or the other end of resistors 25B, 26B into the through hole and joining them with high-temperature solder 27 or the like, the plug-side contact parts 21, 22 and wiring members 25, 26 The connection with the end can be secured. In addition, it is not necessary to provide a special coupling means on the other ends of the conductive wires 25A and 26A such as jumper wires or the lead ends of the resistors 25B and 26B, and the plug contact side contact portion 21,
The connection structure between 22 and the other ends of the wiring members 25 and 26 can be constructed extremely easily. This point particularly corresponds to claim 6.

In the first embodiment, the component side contact portion 2
0 and the plug-side contacts 21 and 22 are arranged in a row at a predetermined interval from each other, so that the conductive wires 25A and 26A and the resistors 25B and 26B are formed in a predetermined shape such as the U-shape shown in FIGS. 2 and 3. The component side contact portion 20 of the wiring members 25, 26 is selected and inserted into the through hole as the component side contact portion 20 and the through hole as the plug contact side contact portions 21, 22 for connection. And the connection portions 21 and 22 on the plug side can be easily connected. This point particularly corresponds to claim 2. In this case, although the wiring members 25 and 26 can be manually connected, the conductive wire 25 formed in a predetermined shape is used.
A, 26A and resistors 25B, 2 formed in a predetermined shape
6B can be automatically supplied and connected according to the test specifications set in advance depending on the type of the semiconductor device 6, and as a result, the connection work of the wiring members 25 and 26 can be automated.

In the first embodiment, as shown in FIG. 1, the distances from the component side contact portions 20 in the left and right side rows to the plug contact side contact portions 21 on the ground pattern wiring 9 are formed to have the same dimension L1. Since the distance from the component side contact portion 20 in the side row to the plug side contact portion 22 on the power supply pattern wiring 10 is formed to have the same dimension L2,
If the conductive wires 25A, 26A and the resistors 25B, 26B are formed in two kinds each having a predetermined shape as shown in FIGS. 2 and 3, the wiring work can be performed, and the conductive wires 25A, 26
The number of types of predetermined formation of A and the resistors 25B and 26B is small, which is economical. In addition, the conductive lines 25A and 26A have the same size L1 and the same size L2.
Also, it becomes easy to connect the resistors 25B and 26B while automatically supplying the resistors 25B and 26B according to the preset test specifications depending on the type of the semiconductor device 6, and as a result, it is easy to automate the wiring work of the wiring members 25 and 26. Can be carried out.

Further, in the first embodiment, the socket through holes 7B to 7D are provided in addition to the socket through holes 7 and 7A facing each other on the substrate 1, but the socket through holes 7B to 7D are deleted from the substrate 1. It is also possible to do so. In this case, IC sockets of the type having the same facing distance and different numbers of pins are assembled to the board 1, and the board-side component-side contact portion 20 and the wiring member 25 to which one ends of the wiring members 25 and 26 can be connected. , 26 are connectable to each other, and a plurality of plug-side contact parts 21 and 22 having different electrical roles such as for power supply and grounding are arranged apart from each other. , 26
Is connected to one end of the wiring member 25, and the other end of each of the wiring members 25 and 26 is connected to one of the plurality of plug-side contact portions 21 and 22 having different electrical roles depending on the test specifications preset depending on the type of the semiconductor device 6. By connecting to, it is possible to properly carry out a burn-in test on a plurality of types of semiconductor devices having different pin numbers and pin functions without recreating a burn-in test board by a printing plate making technique or the like. This point particularly corresponds to claim 1. In addition, in this case,
The relay pattern wiring 24 is shortened similarly to the relay pattern wiring 23, and the component side contact portion 20 provided on the relay pattern wiring 24, the ground pattern wiring 9 on the relay pattern wiring 24 side, the power source pattern wiring 10, and the plug side contact. The parts 21 and 22 are arranged close to the socket through hole 7A, and the socket contact parts 7 and 7A, the relay pattern wirings 23 and 24, the component side contact part 20, the ground pattern wiring 9, the power supply pattern wiring 10 and the plug side contact. It is possible to arrange the parts 21 and 22 symmetrically.

Embodiment 2 (corresponding to claim 1, claim 3, claim 5, claim 6). 4 is a plan view showing a part of the burn-in test board of Example 2, FIG. 5 is a schematic view showing a part of the pattern wiring in FIG. 4, and FIG. 6 is an A- line shown in FIG.
It is sectional drawing which follows the A line. As shown in FIG. 4, the burn-in test board of Example 2 was a PGA (Pin G).
rid Array), PLCC (Plastic L)
eadlessChip Crlier), QFJ (Q
uadrange Flat Jtype Lead
It is characterized in that it can be applied to a semiconductor device having a large number of pins such as a package). That is, the through holes 7E for sockets are formed in the substrate 1 in a grid pattern at predetermined intervals in the left, right, up and down directions. Although a part of the socket through hole 7E is not shown in FIG. 4, the socket through hole 7E is a semiconductor device having a maximum pin number for performing a burn-in test on the burn-in test board of the second embodiment. The IC socket 4E for mounting is provided at the intersection of a vertical row and a horizontal row, which are parallel to each other, in the entire rectangular frame drawn by an imaginary line showing the outer shape of the IC socket 4E. Further, the dotted-lined rectangular frame shows the outer shape of the IC socket 4F which is slightly smaller than the IC socket 4E, and the dashed-dotted rectangular frame shows the outer shape of the IC socket 4G which is slightly smaller than the IC socket 4F. The substrate 1 includes the component side contact portion 20 surrounding the rectangular frame of the outer shape of the IC socket 4E and the ground pattern wiring 9A.
And the power supply pattern wiring 10A and the contact portion 2 on the plug side
It has a plurality of sets 30A and 30B composed of 1 and 22. Plug side contact part 2 for each of a plurality of sets 30A, 30B
Although not shown in FIG. 4, the plug-side contact portions 21 and 22 are not shown in FIG. 4, the component-side contact portion 2 is located on the ground pattern wiring 9A and the power supply pattern wiring 10A.
The position 0 and the position are provided so as to face each other. The component side contact portion 20 has a through hole 7E for socket as shown in FIG.
Are connected by relay pattern wirings 31 and 32. That is, the socket through hole 7E located between the phantom line rectangular frame and the dotted line rectangular frame is connected to the component side contact portion 20 in the inner set 30A of the plurality of sets 30A and 30B by the relay pattern wiring 31. It The socket through holes 7E located between the dotted rectangular frame and the dashed-dotted rectangular frame are connected by the relay pattern wiring 32 to the component side contact portion 20 in the outer one set 30B in a plurality of sets. Further, as shown in FIG. 5, the distances from the component side contact portions 20 in the left and right side rows and the upper and lower side rows of the plurality of sets 30A and 30B to the plug side contact portions 21 on the ground pattern wiring 9A are the same dimension L3. Cage, multiple sets 30A, 30
The distances from the component side contact portions 20 in the left and right side rows and the upper and lower side rows of B to the plug side contact portions 22 on the power supply pattern wiring 10A are the same dimension L4 (L3.
> L4). Since the relay pattern wiring 32 intersects with the ground pattern wiring 9A and the power supply pattern wiring 10A in the one set 30A on the inner side in plan view, the relay pattern wiring 32 is formed in the middle portion of the substrate 1 as shown in FIG. The ground pattern wiring 9A and the power supply pattern wiring 10A in the set are electrically separated from each other. That is, the substrate 1 according to the second embodiment has a multi-layer structure.

In the second embodiment, in order to perform the burn-in test, for example, according to the type of the semiconductor device 6 (see FIG. 13) as the test target electric component to be subjected to the burn-in test,
One type of a plurality of IC sockets, such as the IC sockets 4E to 4G, is assembled by inserting the pin 4b (see FIG. 13) of the IC socket into the socket through hole 7E and connecting with high temperature solder. In this state, the semiconductor device 6 (see FIG. 13) is mounted in the housing portion 4a (see FIG. 13) of the IC socket of the substrate 1 and is classified according to the number of pins in the semiconductor device 6, the pin arrangement, and the pin function. According to the test specifications preset according to the type, one end of the wiring members 25 and 26 is connected to the component side contact portions 20 respectively, and the other end of the wiring members 25 and 26 is connected to the ground pattern wiring 9A on the plug side. It is connected to either the contact portion 21 or the contact side contact portion 22 on the power supply pattern wiring 10A. Then, the plug 3 of the substrate 1 (see FIG. 13) is male and female coupled to the plug of the burn-in test apparatus, the burn-in test board is placed in the heating tank of the burn-in test apparatus, and the burn-in test apparatus is set in the heating tank of the burn-in test apparatus. The static burn-in method is performed by creating an environment of high temperature and heating the semiconductor device 6 while supplying electrical test conditions such as voltage, current or signal from the plug of the burn-in test device to the plug 3 of the substrate 1. Burn-in test will be conducted.

In short, in the second embodiment, the substrate 1 has the through holes 7E for sockets in a grid pattern, and the component side contact portions 20 and the plug contact side contact portions 21, 22 are provided so as to surround the socket through holes 7E. Therefore, one kind of a plurality of IC sockets such as the IC sockets 4E to 4G is assembled to the substrate 1 through the through hole for socket 7E, and the wiring member 25, 26 to the component side contact portion 20
By connecting to the contact-side contact portions 21 and 22 on the plug-in side, the burn-in test of a semiconductor device having a large number of pins such as PGA, PLCC, and QFJ can be easily performed without recreating the burn-in test board by a printing plate making technique or the like.

In the second embodiment, as shown in FIG. 5, a plurality of socket through-holes 7E located between the imaginary line rectangular frame and the dotted line rectangular frame are provided inside 30A, 30B. Is connected to the component side contact portion 20 in the wiring pattern 31 by the relay pattern wiring 31 and is located between the rectangular frame of the dotted line and the rectangular frame of the alternate long and short dash is the socket side through hole 7E. The through-holes 7E for sockets arranged in a grid pattern such that they are connected to the parts 20 by the relay pattern wirings 32 are independent of each other, and the relay pattern wirings 31, 32 are provided on the component side contact portions 20 of the plurality of sets 30A, 30B. Since they are connected, electrical test conditions such as power supply voltage, current amount, and ground can be appropriately applied to each of the outer and inner pins of the semiconductor device having a large number.

In the second embodiment, the parts side contact part 20 and the plug side contacts 21 and 22 are formed as through holes, and have the same size L3 or the same size L4. Of course, it has the same advantages as the first example.

Example 3 (corresponding to claim 1, claim 4, claim 5, claim 6). FIG. 7 is a plan view showing a part of the burn-in test board of the third embodiment, and FIGS. 8 and 9 are operation explanatory views of the third embodiment. As shown in FIG. 7, the burn-in test board according to the third embodiment can be applied to a semiconductor device having a large number of pins such as PLCC and QFJ similar to that of the above-mentioned second embodiment. The feature is that the packaging density can be increased. That is, in FIG. 7, the plug pattern wiring 9B having the component side contact part 20 and the plug side contact parts 21, 22.
And the power supply pattern 10B are separated at four corners. Further, the through holes 7E for sockets are roughly arranged in a grid pattern at right and left and up and down at predetermined intervals, but microscopically, for sockets located between the rectangular frame of virtual lines and the rectangular frame of dotted lines. For sockets, such as the position of the through hole 7E and the position of the through hole 7E for the socket located between the rectangular frame of the dotted line and the rectangular frame of the one-dot chain line, for the socket Through hole 7E
Are circumferentially offset from each other. For example, the socket through hole 7E located between the phantom line rectangular frame and the dotted line rectangular frame is on a straight line passing between the socket through hole 7E located between the dotted line rectangular frame and the dashed-dotted rectangular frame. Is located in.

In the third embodiment, in order to perform the burn-in test, for example, the IC socket 4 is used as in the second embodiment.
In a state where one type of a plurality of IC sockets such as E to 4G is mounted on the substrate 1, the semiconductor device is mounted in the housing portion of the IC socket of the substrate 1, and the number of pins, the pin arrangement, the pin function, etc. in the semiconductor device. According to the test specifications set in advance according to the types classified from the relationship of the above, one end of the wiring members 25 and 26 is connected to the component side contact portion 2
The other end of each of the wiring members 25 and 26 is connected to either the contact plug side contact portion 21 on the ground pattern wiring 9B or the plug contact side contact portion 22 on the power supply pattern wiring 10B. Then, the plug 3 of the substrate 1 (see FIG. 13) is male and female coupled to the plug of the burn-in test apparatus, the burn-in test board is placed in the heating tank of the burn-in test apparatus, and the burn-in test apparatus is set in the heating tank of the burn-in test apparatus. A high temperature environment is created to heat the semiconductor device, while electrical test conditions such as voltage, current or signal are supplied from the plug of the burn-in test device to the plug 3 of the substrate 1 to achieve the static burn-in method. Burn-in test is conducted.

In short, in the third embodiment, the component side contact portion 20 and the plug contact side contact portions 21 and 22 surround the socket through hole 7E, so that the IC through socket 7E is mounted on the substrate 1 through the socket through hole 7E. 4E-4
Assembling one type of a plurality of IC sockets such as G, and wiring members 25, 2 according to the type of the assembled IC socket.
6 is a component side contact part 20 and a plug side contact part 2
By connecting to PLCs 1 and 22, PLCC can be used without remaking the burn-in test board by printing plate making technology.
Also, a burn-in test of a semiconductor device having a large number of pins such as QFJ can be easily performed.

In the third embodiment, the plug pattern wiring 9B is used.
Since the power supply pattern wiring 10B and the power supply pattern wiring 10B are separated at four corners, the plug pattern wiring 9B surrounded by virtual lines in FIG.
, The power supply pattern wiring 10B, the contact side contact portion 21,
As shown in FIG. 8, an element set 33 composed of the reference numeral 22, the component side contact portion 20, and the socket through hole 7E is used as the plug pattern wiring 9B and the power supply pattern wiring 10 described above.
B can be arranged vertically and horizontally while being close to each other by utilizing the cavities 34 at the four corners separated from each other. As a result, when a large number of IC sockets are installed on one board 1, Higher packaging density.

In the third embodiment, as shown in FIG. 7, the socket through hole 7E located between the phantom line rectangular frame and the dotted line rectangular frame is located between the dotted line rectangular frame and the dashed line rectangular frame. The through holes 7E for sockets are displaced from each other in the circumferential direction at portions where their positions in the inner and outer directions are close to each other so that they are located on a straight line passing between the through holes 7E for sockets located at. Therefore, as shown in FIG. 9, the distance between the socket through holes 7E in the portion where the positions in the inside and outside directions are close to each other is arranged in a grid pattern with straight lines where the socket through holes 7E cross left and right and up and down at a predetermined interval. The inner and outer socket through holes 7E can be arranged close to each other in the left-right and up-down directions while maintaining the same distance as in the case of the above. That is, in FIG. 9, the straight line distance in the left-right direction between adjacent ones in which the through holes 7E for sockets are displaced from each other in the circumferential direction as in the third embodiment is set to H1, and the through holes 7E for sockets are predetermined to the left, right, up and down. Let H2 be the straight line distance in the left-right direction between adjacent adjoining lines arranged in a grid pattern with straight lines intersecting each other at intervals, H1 <H
There is a relationship of 2. As a result, according to this Example 3,
It is possible to increase the mounting density of the IC sockets on the substrate 1 while ensuring the strength of the substrate 1 between the adjacent socket through holes 7E.

Example 4 (Claims 1, 5 and 6)
Corresponding to). FIG. 10 is a plan view showing a part of the burn-in test board of the fourth embodiment. As shown in FIG. 10, the burn-in test board according to the third embodiment replaces the semiconductor device with a mold box type electric part such as a DC / DC converter as a burn-in test target electric part. That is, in FIG. 10, the outer shape of the burn-in test target electric component 4H is indicated by a virtual line in the portion of the substrate 1 in which the mold box type electric component is accommodated, and in the accommodating portion of the substrate 1 on which the electric component 4H is mounted, Through holes 7F for inserting pins (not shown) of the same electric component 4H and connecting them with high temperature solder are formed, and the board 1 on the two outer sides facing each other of this accommodating portion is directed from the component side to the outer side. The contact portion 20, the negative power supply pattern wiring 35, the ground pattern wiring 9C, and the positive power supply pattern wiring 10C are arranged in a row with a predetermined distance therebetween. To each through hole 7F, a relay pattern wiring 36 extending along the front and back of the substrate 1 is connected to the outside of the portion where the electrical component 4H is arranged, and the extension side end of each relay pattern wiring 36 has a component side. The contact portions 20 are provided in the left-right direction with a predetermined gap therebetween. These component side contact portions 20 are through holes to which one ends of wiring members 25, 26, 37 such as conductive wires and resistors which are formed separately from the substrate 1 can be connected. In addition, the plug-side contact part 3 is attached to the negative power supply pattern wiring 34, the ground pattern wiring 9C, and the positive power supply pattern wiring 10C which are arranged on the upper and lower outer sides of the component side contact part 20 at predetermined intervals.
8, 21, 22 are provided. These plug contact side contact portions 38, 21, 22 are through holes in which the other ends of the wiring members 25, 26 can be connected while the positions thereof face the component side contact portion 20 in the vertical direction.

Therefore, in the fourth embodiment, in order to perform the burn-in test, the pins of the mold box type electric component 4H are inserted into the through holes 7F of the substrate 1 and connected by high-temperature soldering, and the electric component 4H is connected to the substrate. The wiring members 25 and 2 according to the test specifications set in advance according to the types classified according to the relationship such as the number of pins, the pin arrangement, and the pin function in the electrical component 4H.
One end of 6, 37 is connected to the component side contact portion 20, and the other end of the wiring members 25, 26, 37 is connected to the ground pattern wiring 9C.
Upper plug side 21 and power supply pattern wiring 10C
It is connected to either the upper plug-side contact portion 22 or the negative plug-side contact portion 38 on the negative electric pattern wiring 35. Then, the plug 3 of the substrate 1 (see FIG. 13) is male and female coupled to the plug of the burn-in test apparatus, the burn-in test board is placed in the heating tank of the burn-in test apparatus, and the burn-in test apparatus is set in the heating tank of the burn-in test apparatus. A high temperature environment is created to heat the electric components, while electrical test conditions such as voltage, current or signal are supplied from the plug of the burn-in tester to the plug 3 of the substrate 1 to achieve the static burn-in method. Burn-in tests can be performed.

Example 5 (corresponding to claims 7 and 8).
FIG. 11 is a perspective view showing the appearance of part of the burn-in test board of the fifth embodiment. As shown in FIG. 11, in the burn-in test board according to the fifth embodiment, the component side contact portion and the plug side contact portion are provided with the female connectors 40A, 40.
B, 40C, male connectors 41A, 41B are provided at both ends of the wiring members 25, 26, and one male connector 41A is provided.
Is inserted into the female connector 40A serving as a component side contact portion, and the other male connector 41B is inserted into one of the female connectors 40B and 40C serving as a plurality of plug side contact portions on the electrical pattern wiring 10 and the ground pattern wiring 9. The feature is that it is inserted. Specifically, the female connectors 40A to 40C are inserted into through holes formed in the substrate 1 and the electric pattern wiring 10 or the ground pattern wiring 9 and soldered at high temperature.
A ring-shaped contact piece 42 defining a contact hole is provided on the upper portion of the substrate 40C projecting from the substrate 1, and the contact piece 42 is provided with a slot 43 for contacting the male connectors 41A and 41B by restoring elasticity.

Therefore, according to the fifth embodiment, when the male connectors 41A and 41B are inserted into the contact holes in the contact pieces 42 of the female connectors 40A to 40C, the male connector 4 is inserted.
1A, 41B push the contact piece 42 outwards against the elasticity, and the contact piece 42 stores the restoring elasticity.
Due to this restoring elasticity, the contact piece 42 causes the male connector 41A, 41
The female connector 40A is kept in contact with the female connector 40B by male and female coupling.
-40C can ensure contact with male connectors 41A and 41B. As a result, in connecting work to the component side contact portion and the plug side contact portion of the wiring components 25 and 26, the male connectors 41A and 41B are connected to the female connectors 40A to 4A.
Since the male connectors 41A and 41B are held in contact with the female connectors 40A to 40C by the restoring elasticity only by inserting the connector into the 0C, high temperature soldering work is not required during the contact work, and the contact work is extremely easy. The contact can be secured. In addition, the signal wiring can be easily switched.

Example 6 (corresponding to claims 7 and 8).
FIG. 12 is a perspective view showing the appearance of part of the burn-in test board of the sixth embodiment. As shown in FIG. 12, in the burn-in test board of the sixth embodiment, the component side contact portion and the plug side contact portion have male connectors 44A, 44.
B and 44C, female connectors 45A and 45B are provided at both ends of the wiring members 25 and 26, and one female connector 45A is provided.
Is externally fitted and inserted into the male connector 44A as a component side contact portion, and the other female connector 45B is used as a female connector 44B or 44C as a plurality of plug side contact portions on the electric pattern wiring 10 and the ground pattern wiring 9. It is characterized in that it is fitted on the crab. Specifically, the male connectors 44A to 44C are inserted into through holes formed in the substrate 1 and the electric pattern wiring 10 or the ground pattern wiring 9 and soldered at high temperature. Female connector 4
A ring-shaped contact piece 46 for partitioning a contact hole is provided in a lower portion protruding from the wiring members 25 and 26 of 4A to 44C, and the contact piece 46 is a slot 47 for contacting the male connectors 45A and 45B by restoring elasticity. Equipped with.

Therefore, according to the sixth embodiment, as in the fifth embodiment, when the contact holes in the contact pieces 46 of the female connectors 45A and 45B are externally fitted and inserted into the male connectors 44A to 44C, the male connectors 44A to 44C. 44C is contact piece 46
The contact piece 46 stores the restoring elasticity by pushing it outwards slightly against the elasticity, and this restoring elasticity causes the contact piece 4 to move.
6 holds the contact with the male connectors 44A to 44C, and the female connectors 45A and 45B can ensure the contact with the male connectors 44A to 44C by the male and female coupling. As a result, the female connectors 45A, 4A and 4B are used in the work of connecting the wiring parts 25, 26 to the component-side contact portion and the plug-side contact portion.
By simply inserting 5B into the male connectors 44A to 44C, the female connectors 45A and 45B are held in contact with the male connectors 44A to 44C while being elastically restored, so that the contacting work does not require high temperature soldering work. The contact work can be performed extremely easily and the contact can be secured. In addition, the signal wiring can be easily switched.

In the above Examples 1 to 4, SOJ (Small Outline Jt) is used as the test object part.
type Lead Package), SOP (Sma
llOutline Package), ZIP (Zi
gzag InlinePackage) and SIP
A semiconductor device such as (Single Inline Package) is also applicable.

Further, although the static burn-in method has been illustrated and described in the first to sixth embodiments, by providing a required number of signal pattern wirings on the substrate 1 and providing the contact side portions on the signal pattern wirings. Of course, the dynamic burn-in method can also be implemented.

[0054]

As described above, according to the first aspect of the present invention, the component side contact portion and the plurality of plug side contact portions are provided separately from each other on the substrate, and the component side contact portion is separated from the substrate. Since one end of the configured wiring member is connected and the other end of this wiring member is connected to one of the multiple contact parts on the plug side depending on the type of electrical component under test, burn-in is performed using printing platemaking technology. A plurality of types of semiconductor devices having different numbers of pins and different pin functions can be properly burn-in tested without recreating a test board.

According to the second aspect of the present invention, the board is provided with a plurality of rows of the terminals for connecting the electrical component to be tested, the component side contact portion, and the plurality of plug side contact portions spaced apart from the terminal portion, and the component side contact portion is provided. Since one end of the wiring member is connected to the other end, and the other end of the wiring member is connected to any of the plurality of plug-side contact parts according to the type of the test target component, a plurality of pins having different pin numbers and different pin functions are connected. There is an effect that a burn-in test can be appropriately performed on various types of test target components.

According to the third aspect of the present invention, the board is provided with the terminal portion for connecting the electric component to be tested, which is arranged in a grid pattern, the component side contact portion and a plurality of plug side contact portions surrounding the terminal portion, and wiring is provided in the component side contact portion. Since one end of the member is connected and the other end of the wiring member is connected to any of a plurality of plug-side contact parts according to the type of the test target component, a burn-in test of a semiconductor device with a large number of pins is performed. The effect is that you can.

According to the fourth aspect of the invention, since the plurality of pattern wirings for providing the contact side portion are separated at the four corners, the set of elements surrounded by the pattern wirings is formed at the four corners. By arranging them in the vertical and horizontal directions while making them close to each other by utilizing the empty portions, there is an effect that the mounting density of the IC sockets on one substrate 1 can be increased.

According to the fifth aspect of the invention, since the contact portion on the component side is formed as a through hole, one end of the wiring member is inserted into the through hole and joined by high temperature solder or the like, so that the one end of the wiring member and the component side are joined. Not only can the connection with the contact portion be secured, but it is not necessary to provide a special coupling means at one end of the wiring member, and the connection structure between the component-side contact portion and the one end of the wiring member can be configured very simply.

According to the sixth aspect of the invention, since the contact portion on the contact side is formed as a through hole, the other end of the wiring member is inserted into the through hole and joined by high temperature solder or the like. The connection structure between the component side contact part and the other end of the wiring member is extremely simple because not only the connection between the contact side and the plug side contact part can be secured, but there is no need to provide a special coupling means at the other end of the wiring member. The effect is that you can do it.

According to the seventh aspect of the invention, since the component side contact portion is formed as a male or female connector, a female or male connector is provided at one end of the wiring member, and the connector on the wiring member side and the component side contact portion is provided. There is an effect that the connection between one end of the wiring member and the component side contact portion can be secured by the male and female coupling with.

According to the eighth aspect of the invention, since the plug-side contact portion is formed as a male or female connector, a female or male connector is provided at the other end of the wiring member, and the wiring member side and the plug-side contact are provided. There is an effect that the connection between the other end of the wiring member and the plug-side contact portion can be secured by the male and female connection with the connector of the portion.

[Brief description of drawings]

FIG. 1 is a schematic view showing a part of a burn-in test board of Example 1 in a plan view.

FIG. 2 is a diagram showing a state in which a wiring member separate from the substrate of the burn-in test board of Example 1 is connected.

FIG. 3 is a diagram showing a state in which a wiring member separate from the substrate of the burn-in test board of Example 1 is connected.

FIG. 4 is a plan view showing a part of a burn-in test board of Example 2.

5 is a schematic diagram showing a part of the pattern wiring in FIG.

6 is a cross-sectional view taken along the line AA shown in FIG.

FIG. 7 is a plan view showing a part of the burn-in test board of Example 3;

FIG. 8 is an explanatory view of the operation of the third embodiment.

FIG. 9 is an explanatory view of the operation of the third embodiment.

FIG. 10 is a plan view showing a part of the burn-in test board of Example 4.

FIG. 11 is a perspective view showing the external appearance of part of the burn-in test board of Example 5;

FIG. 12 is a perspective view showing the external appearance of part of the burn-in test board of Example 6;

FIG. 13 is a configuration diagram showing an appearance of a conventional burn-in test board.

FIG. 14 is an explanatory diagram of types of semiconductor devices as test target components.

FIG. 15 is an explanatory diagram of a design change of a conventional burn-in test board.

[Explanation of symbols]

1 substrate, 3 plugs, 4, 4A-4G IC socket,
4H electrical component (electrical component to be tested), 6 semiconductor device (electrical component to be tested) 7, 7A to 7E Through hole for socket (terminal portion for electrical component to be tested), 7F through hole (terminal for electrical component to be tested) Part), 9, 9
A to 9C Ground pattern wiring (pattern wiring) 10,
10A, 10B power supply pattern wiring (pattern wiring),
10C positive power supply pattern wiring (pattern wiring), 20
Component side contact part 21, 22, 38 Plug side contact part, 23, 24, 31, 32, 36 Relay pattern wiring (pattern wiring), 25, 26 Wiring member, 35
Negative power supply pattern wiring (pattern wiring), 40A to 40
C, 45A, 45B female connector, 41A, 41B, 4
4A-44C male connector.

Claims (8)

[Claims] 1. An electric component to be tested is mounted on a board, the plug of the board is connected to the plug of a burn-in test apparatus, and the board is placed in a heating tank of the burn-in test apparatus. Place the above-mentioned electrical parts to be tested in a high temperature environment associated with the heating operation, and apply voltage / current to the electrical parts to be tested from the plug of the burn-in test equipment through the plug of the board.
In a burn-in test board that performs a burn-in test of the electrical component under test by supplying electrical test conditions such as signals, one end of a wiring member formed separately from the board can be connected to the above board And the component-side contact portion that is connected to the terminal of the electrical component to be tested by the pattern wiring, and the other end of the wiring member can be connected and is connected to the plug of the substrate by a pattern wiring different from the above. A plurality of plug-side contact parts that have different electrical roles such as for power supply and grounding are arranged separately, and one end of the wiring member is connected to the component-side contact part, and the other end of the wiring member is connected. By connecting to any one of the plurality of plug-side contact parts, the electrical test conditions supplied to the electrical component to be tested can be switched according to the type of the electrical component to be tested. Burn-in test board characterized by the following. 2. The board according to claim 1 is provided with a terminal portion for individually connecting each of a plurality of terminals of the electric component under test according to the type of the electric component under test. A plurality of rows are provided, and a pattern wiring extending in a direction crossing the plurality of rows corresponding to each terminal of the electric component under test is connected to the terminal portion of each of the plurality of rows, and a component side contact portion is arranged at each extended end portion of the pattern wiring. While being arranged so as to be arranged, a plurality of plug-side contacts, which have different electrical roles such as for power supply and ground, correspond to the terminals of the above-mentioned electrical component under test on the outside of the row of component-side contact components. Burn-in test board characterized by being provided for each contact on the component side. 3. The board according to claim 1 is provided with terminal portions in a grid pattern for individually connecting a plurality of terminals of the electrical component under test according to the type of the electrical component under test. , Connect the pattern wiring that extends in the direction crossing the vertical and horizontal rows corresponding to each terminal of the electrical component under test to the terminal portion of each grid arrangement, and connect the component side contact portion to the extension end of this pattern wiring in the grid shape. While arranging so as to surround the terminal part, while arranging a plurality of plug-side contact parts that have different electrical roles such as for power supply and grounding on the outside of this row of component-side contact parts, concentrically and in similar shapes, A burn-in test board, characterized in that it is provided corresponding to each component side contact portion corresponding to the terminal of the electrical component to be tested. 4. The board according to claim 1 is provided with terminal portions in a grid shape for individually connecting a plurality of terminals of the electrical component under test according to the type of the electrical component under test. , Connect the pattern wiring that extends in the direction crossing the vertical and horizontal rows corresponding to each terminal of the electrical component under test to the terminal portion of each grid arrangement, and connect the component side contact portion to the extension end of this pattern wiring in the grid shape. While being provided so as to surround the terminal part, a plurality of pattern wirings having different electrical roles such as for power supply and grounding are provided outside the row of the component-side contact portion at predetermined intervals to form a concentric and similar rectangular shape. In each of these multiple-row concentric pattern wiring patterns, a contacting side contact part is provided for each component side contact part corresponding to the terminal of the electrical component under test. A burn-in test board characterized by separating the four corners of each of the multiple-row concentric pattern wiring patterns. 5. A burn-in test board, wherein the component side contact portion according to any one of claims 1 to 4 is formed as a through hole. 6. A burn-in test board, wherein the plug-side contact portion according to any one of claims 1 to 4 is formed as a through hole. 7. A burn-in test board, characterized in that the component-side contact portion according to any one of claims 1 to 4 is configured as a male or female connector. 8. A burn-in test board, wherein the plug-side contact portion according to any one of claims 1 to 4 is configured as a male or female connector.