JPH0886692A - Pyroelectric sensor element and production thereof - Google Patents

Pyroelectric sensor element and production thereof

Info

Publication number
JPH0886692A
JPH0886692A JP24874294A JP24874294A JPH0886692A JP H0886692 A JPH0886692 A JP H0886692A JP 24874294 A JP24874294 A JP 24874294A JP 24874294 A JP24874294 A JP 24874294A JP H0886692 A JPH0886692 A JP H0886692A
Authority
JP
Japan
Prior art keywords
metal thin
thin film
sensor element
substrate
pyroelectric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP24874294A
Other languages
Japanese (ja)
Other versions
JP2963348B2 (en
Inventor
Kazuo Nomura
和雄 野村
Shinichiro Mori
慎一郎 森
Koji Yokota
康治 横田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hokuriku Electric Industry Co Ltd
Original Assignee
Hokuriku Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hokuriku Electric Industry Co Ltd filed Critical Hokuriku Electric Industry Co Ltd
Priority to JP24874294A priority Critical patent/JP2963348B2/en
Publication of JPH0886692A publication Critical patent/JPH0886692A/en
Application granted granted Critical
Publication of JP2963348B2 publication Critical patent/JP2963348B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Abstract

PURPOSE: To produce a micro sensor element having a simple structure efficiently. CONSTITUTION: A thin metal film 7 is formed on the surface of a rectangular sensor board 6 exhibiting pyroelectric effect while leaving the marginal parts at the opposite ends on the short side of the rectangle. On the rear side of the sensor board 6, electrodes of thin metal film 8 are formed at the opposite end parts on the short side of the rectangle so that the electrodes face the thin metal film 7 formed on the surface at least partially through the sensor board 6.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】この発明は、焦電効果を利用して
赤外線を電気信号に変換する焦電センサ素子とその製造
方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pyroelectric sensor element for converting infrared rays into electric signals by utilizing the pyroelectric effect and a method for manufacturing the same.

【0002】[0002]

【従来の技術】従来、例えば焦電型赤外線センサ素子の
いわゆるデュアルタイプのものは、図8に示すように、
焦電効果のあるセラミック基板1の表面に、凹字状の電
極2をマトリクス状に蒸着し、裏面には表面の凹字状の
電極2に両端部に対応して各々電極3が蒸着され、これ
らの電極形成後に電極2毎に分割線4で分割してセンサ
素子5が形成されていた。このセンサ素子5は、約5m
m四方の正方形に形成され、受光窓を有したケース内
に、このセンサ素子からの出力信号をインピーダンス変
換するFET等とともに収容されていた。
2. Description of the Related Art Conventionally, for example, a so-called dual type of a pyroelectric infrared sensor element is shown in FIG.
The concave electrodes 2 are vapor-deposited in a matrix on the surface of the ceramic substrate 1 having a pyroelectric effect, and the electrodes 3 are vapor-deposited on the back surface so as to correspond to both ends of the concave electrodes 2 on the surface. After forming these electrodes, the sensor element 5 was formed by dividing each electrode 2 by the dividing line 4. This sensor element 5 is about 5 m
It was formed in a case having a square shape of m square and having a light receiving window, and was housed together with an FET or the like for impedance conversion of an output signal from this sensor element.

【0003】[0003]

【発明が解決しようとする課題】しかしながら、上記従
来の技術の場合、センサ素子5を形成するセラミック基
板1から効率よくセンサ素子5を形成しているとは言え
ず、センサ素子自体にも無駄なスペースがあった。従っ
て、セラミック基板1の使用効率が悪く、センサ素子の
小型化及びコストダウンの妨げとなっているものであっ
た。
However, in the case of the above conventional technique, it cannot be said that the sensor element 5 is efficiently formed from the ceramic substrate 1 forming the sensor element 5, and the sensor element itself is useless. There was space. Therefore, the use efficiency of the ceramic substrate 1 is poor, which hinders downsizing and cost reduction of the sensor element.

【0004】この発明は上記従来の技術の問題点に鑑み
て成されたもので、簡単な構成で、小型のセンサ素子を
効率よく形成することができる焦電センサ素子とその製
造方法を提供することを目的とする。
The present invention has been made in view of the above problems of the prior art, and provides a pyroelectric sensor element capable of efficiently forming a small sensor element with a simple structure and a manufacturing method thereof. The purpose is to

【0005】[0005]

【課題を解決するための手段】この発明は、焦電効果の
あるPZT等の長方形のセンサ基板表面に、長方形の短
辺側の両端部をわずかに残して金属薄膜が形成され、こ
のセンサ基板の裏面には、上記表面側の金属薄膜と一部
が上記センサ基板を挟んで対面するように、基板中央部
で分かれて、長方形の短辺側の両端部に互いに独立した
電極が金属薄膜により形成されている焦電センサ素子で
ある。
According to the present invention, a thin metal film is formed on the surface of a rectangular sensor substrate such as PZT having a pyroelectric effect, leaving both ends on the short side of the rectangle slightly left. On the back side of, the metal thin film on the front side is separated from the metal thin film on the front side by a metal thin film, and the electrodes are separated at the center of the substrate so that they face each other across the sensor substrate. The formed pyroelectric sensor element.

【0006】またこの発明は、焦電効果のある基板表面
に所定間隔でストライプ状に金属薄膜を形成し、同様に
裏面にも所定間隔でストライプ状に金属薄膜を形成し、
上記表面の金属薄膜と裏面の金属薄膜とが互いに各スト
ライプ間の隙間に対面する位置に形成され、この基板
を、上記表面側の金属薄膜の間の部分でその金属薄膜と
平行に分割し裏面側の金属薄膜を各々2分割するように
分割するとともに、この金属薄膜の長手方向と直角方向
にも上記基板を分割し、分割後の状態で上記金属薄膜の
長手方向の辺が短辺となる長方形のセンサ素子を形成す
る焦電センサ素子の製造方法である。
Further, according to the present invention, metal thin films are formed in stripes on the front surface of the substrate having a pyroelectric effect at predetermined intervals, and similarly, metal thin films are formed on the back surface in stripes at predetermined intervals.
A metal thin film on the front surface and a metal thin film on the back surface are formed at positions facing each other in the gaps between the stripes, and this substrate is divided in parallel with the metal thin film at the portion between the metal thin films on the front surface side and the back surface. The metal thin film on the side is divided into two parts, and the substrate is also divided in the direction perpendicular to the longitudinal direction of the metal thin film, and the side in the longitudinal direction of the metal thin film becomes the short side in the state after the division. It is a method of manufacturing a pyroelectric sensor element for forming a rectangular sensor element.

【0007】[0007]

【作用】この発明の焦電センサ素子とその製造方法は、
一枚の基板から効率良く焦電センサ素子を多数分割して
取ることができ、センサ素子自体も小型化するるもので
ある。
The pyroelectric sensor element and the manufacturing method thereof according to the present invention are
A large number of pyroelectric sensor elements can be efficiently obtained from a single substrate, and the sensor element itself can be miniaturized.

【0008】[0008]

【実施例】以下この発明の一実施例について図面に基づ
いて説明する。この実施例の焦電センサ素子5は、図
1、図2に示すように、PZTやPT等の強誘電たセラ
ミックスのセンサ基板6の表面に、Ni、CrやAgの
金属薄膜7が形成されている。この金属薄膜7は、図1
(A)に示すように、長方形のセンサ基板6の短辺側の
両端部を残して形成されている。また、このセンサ基板
6の裏面には、図1(B)に示すように、基板中央部を
残して、長方形の短辺側の両端部に互いに独立した電極
となる金属薄膜8が形成されている。このセンサ基板6
は、長辺と短片の比率が約2:1である。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. In the pyroelectric sensor element 5 of this embodiment, as shown in FIGS. 1 and 2, a metal thin film 7 of Ni, Cr or Ag is formed on the surface of a sensor substrate 6 made of a ferroelectric ceramic such as PZT or PT. ing. This metal thin film 7 is shown in FIG.
As shown in (A), the rectangular sensor substrate 6 is formed with both ends on the short side left. In addition, as shown in FIG. 1B, on the back surface of the sensor substrate 6, metal thin films 8 serving as electrodes independent from each other are formed at both ends of the short side of the rectangle, leaving the substrate center. There is. This sensor board 6
Has a long side to short piece ratio of about 2: 1.

【0009】この焦電センサ素子5の製造方法は、先
ず、センサ素子5を分割して多数得るためのセラミック
基板1を形成し、分極処理を施した後、このセラミック
基板1の表面側に、図3に示すマスク30を置いて、金
属薄膜7を蒸着させる。同様に裏面にも、図4に示すマ
スク32を用いて、電極材料である金属薄膜8を蒸着さ
せる。マスク30,32には、各々に金属薄膜7,8を
形成するための開口部34,36が形成され、また、位
置合わせ用の透孔38も、各々に形成されている。これ
により、所定間隔でストライプ状に金属薄膜7,8が形
成される。この金属薄膜7,8は、表面の金属薄膜7と
裏面の金属薄膜8とが互いに各ストライプ間の隙間に対
面する位置に形成される。
In the method for manufacturing the pyroelectric sensor element 5, first, the ceramic substrate 1 for dividing the sensor element 5 to obtain a large number is formed, and after polarization processing is performed, the surface side of the ceramic substrate 1 is The mask 30 shown in FIG. 3 is placed and the metal thin film 7 is vapor-deposited. Similarly, the metal thin film 8 as an electrode material is vapor-deposited on the back surface using the mask 32 shown in FIG. Openings 34 and 36 for forming the metal thin films 7 and 8 are formed in the masks 30 and 32, respectively, and a through hole 38 for alignment is also formed in each of them. As a result, the metal thin films 7 and 8 are formed in stripes at predetermined intervals. The metal thin films 7 and 8 are formed at positions where the metal thin film 7 on the front surface and the metal thin film 8 on the back surface face each other in the gap between the stripes.

【0010】この後、基板1を個々のセンサ素子5毎に
分割する。分割方法は、表面側の金属薄膜7の間の部分
でその金属薄膜7と平行に分割し、裏面側の金属薄膜8
を各々2分割するように分割する。さらに同時に、この
金属薄膜7の長手方向と直角方向にも基板1を分割し、
分割後のセンサ素子5は、図1に示すように、金属薄膜
7,8の長手方向の辺が、短辺となる長方形に形成され
る。
After that, the substrate 1 is divided into individual sensor elements 5. The dividing method is that the metal thin film 7 on the front surface side is divided in parallel with the metal thin film 7, and the metal thin film 8 on the back surface side is divided.
Is divided into two parts. At the same time, the substrate 1 is divided in the direction perpendicular to the longitudinal direction of the metal thin film 7,
As shown in FIG. 1, the divided sensor element 5 is formed in a rectangular shape in which the sides in the longitudinal direction of the metal thin films 7 and 8 are short sides.

【0011】この実施例の焦電センサ素子5は、図5、
図6に示すように、ケース体を構成する円板状の金属製
底板であるハーメチックベース10と、これを覆う円筒
状のハーメチック用金属製キャップ12内に収容され
る。キャップ12には、上面中央部に受光窓16が形成
され、この受光窓16には、赤外線入射フィルター17
が取り付けられている。
The pyroelectric sensor element 5 of this embodiment is shown in FIG.
As shown in FIG. 6, the housing is housed in a hermetic base 10 that is a disk-shaped metal bottom plate that constitutes a case body, and a cylindrical hermetic metal cap 12 that covers the hermetic base 10. A light receiving window 16 is formed in the center of the upper surface of the cap 12, and an infrared incident filter 17 is formed in the light receiving window 16.
Is attached.

【0012】ハーメチックベース10上には、図5、図
6に示すセラミック基板20が載置され、このセラミッ
ク基板20の表面に形成された回路パターン18に、抵
抗体21やFET22がハンダ付けされて取り付けられ
ている。さらに、セラミック基板20上には、センサ素
子5を支持した一対の金属製の支柱24の基端部がハン
ダにより固定され、回路パターン18に接続している。
支柱24は、例えば、銅の丸棒にハンダメッキしたもの
で、センサ素子5を2本の支柱24により支持し、さら
に、センサ素子5とセラミック基板20との間の電気的
接続も図っている。また、センサ素子5は、支柱24の
先端部に載置されて、例えばエポキシ樹脂に銀等を混合
させた導電性接着剤26により固定されている。
The ceramic substrate 20 shown in FIGS. 5 and 6 is placed on the hermetic base 10, and the resistor 21 and the FET 22 are soldered to the circuit pattern 18 formed on the surface of the ceramic substrate 20. It is installed. Further, on the ceramic substrate 20, the base end portions of the pair of metal columns 24 supporting the sensor element 5 are fixed by solder and connected to the circuit pattern 18.
The support column 24 is, for example, a copper round bar solder-plated, the sensor element 5 is supported by the two support columns 24, and electrical connection between the sensor element 5 and the ceramic substrate 20 is also achieved. . The sensor element 5 is placed on the tip of the support column 24, and is fixed by, for example, a conductive adhesive 26 in which silver or the like is mixed with epoxy resin.

【0013】ハーメチックベース10とセラミック基板
20の周縁部には、3本のリード端子28が貫通してい
る。リード端子28は、センサ素子5を支持した支柱2
4とは別体で、ハーメチックベース10とセラミック基
板20に貫通して、その先端部が、ハンダ30によりセ
ラミック基板20上の回路パターン18に接続されると
ともにセラミック基板20に固定されている。そして、
セラミック基板20上の回路パターン18を介して、セ
ラミック基板20上のFET22等につながっている。
Three lead terminals 28 pass through the peripheral portions of the hermetic base 10 and the ceramic substrate 20. The lead terminal 28 is the support column 2 supporting the sensor element 5.
It is separate from 4, and penetrates through the hermetic base 10 and the ceramic substrate 20, and its tip end is connected to the circuit pattern 18 on the ceramic substrate 20 by the solder 30 and fixed to the ceramic substrate 20. And
It is connected to the FET 22 and the like on the ceramic substrate 20 via the circuit pattern 18 on the ceramic substrate 20.

【0014】キャップ12は、その周縁部がハーメチッ
クベース10の周縁部に、抵抗溶接され、完全に内部が
密封される。そして、ケース体内部には、窒素ガスが充
填され、外部環境の変化による特性変動の影響が抑制さ
れる。
The peripheral edge of the cap 12 is resistance-welded to the peripheral edge of the hermetic base 10 to completely seal the inside. The inside of the case body is filled with nitrogen gas, and the influence of characteristic changes due to changes in the external environment is suppressed.

【0015】この実施例の焦電センサ素子の動作は、先
ず、センサ素子5の視野内に赤外線放射体がない場合、
センサ素子5からの出力信号は、ノイズのみであり、検
知信号は出力されない。一方、センサ素子5の視野内を
人等の赤外線放射体が通り過ぎた場合、センサ素子5か
らの出力信号は、人が入った時及び出たときで、各々プ
ラスマイナスに振れる。そして、FET22により所定
のレベルにインピーダンス変換された検知信号が、リー
ド端子28から出力される。
The operation of the pyroelectric sensor element of this embodiment is as follows. First, when there is no infrared radiator in the field of view of the sensor element 5,
The output signal from the sensor element 5 is only noise, and no detection signal is output. On the other hand, when an infrared radiator such as a person passes through the field of view of the sensor element 5, the output signal from the sensor element 5 fluctuates positively and negatively when a person enters and exits. Then, the detection signal whose impedance is converted to a predetermined level by the FET 22 is output from the lead terminal 28.

【0016】この実施例の焦電センサ素子によれば、セ
ンサ素子5がセラミック基板1から効率よく分割されて
多数取ることができ、1枚のセラミック基板1から取る
ことができる焦電センサ素子5の数が大幅に増え、コス
トダウンに寄与するとともに、センサ装置の小型化にも
大きく寄与するものである。なお、センサ素子5の大き
さは適宜選択可能なものであり、電極である金属薄膜の
数、形状または幅も適宜設定可能である。
According to the pyroelectric sensor element of this embodiment, the sensor element 5 can be efficiently divided from the ceramic substrate 1 and a large number can be taken, and the pyroelectric sensor element 5 can be taken from one ceramic substrate 1. This greatly increases the number of devices, which contributes to cost reduction and also contributes to downsizing of the sensor device. The size of the sensor element 5 can be appropriately selected, and the number, shape, or width of the metal thin film that is the electrode can be appropriately set.

【0017】次にこの発明の焦電センサ素子の他の実施
例について図7に基づいて説明する。ここで上述の実施
例と同様の部材は同一の符号を付して説明を省略する。
この実施例では、焦電効果のある長方形のセンサ基板6
の表面の一部に、金属薄膜7が形成され、このセンサ基
板6の裏面にも、このセンサ基板6を挟んでこの金属薄
膜7と対面する位置に金属薄膜8による電極が形成され
ている。この金属薄膜7,8は少なくとも一部が、セン
サ基板6を挟んで表裏面で重なり合えば良いもので、そ
の大きさや数は適宜設定可能なものである。
Next, another embodiment of the pyroelectric sensor element of the present invention will be described with reference to FIG. Here, the same members as those in the above-described embodiment are designated by the same reference numerals and the description thereof will be omitted.
In this embodiment, a rectangular sensor substrate 6 having a pyroelectric effect is used.
A metal thin film 7 is formed on a part of the surface of the sensor substrate 6, and an electrode formed by the metal thin film 8 is also formed on the back surface of the sensor substrate 6 so as to face the metal thin film 7 with the sensor substrate 6 interposed therebetween. At least a part of the metal thin films 7 and 8 may be overlapped on the front and back sides with the sensor substrate 6 interposed therebetween, and the size and the number thereof can be set appropriately.

【0018】この実施例の焦電センサ素子の製造方法
は、焦電効果のある基板1の表面に所定間隔でストライ
プ状に金属薄膜7を形成し、同様に裏面にも所定間隔で
ストライプ状に金属薄膜8を形成する。このとき、表面
の金属薄膜7と裏面の金属薄膜8とが互いにその一部が
センサ基板6を挟んで対面するように形成する。そし
て、金属薄膜7,8のストライプの長手方向と平行な方
向に、この金属薄膜7,8を各々分割する。さらに、こ
の金属薄膜7,8の長手方向と直角方向にも基板1を分
割し、分割後の状態で金属薄膜7,8の長手方向の辺が
短辺となる長方形のセンサ素子5を形成する。
In the method for manufacturing the pyroelectric sensor element of this embodiment, the metal thin films 7 are formed in stripes on the front surface of the substrate 1 having a pyroelectric effect at predetermined intervals, and similarly, on the back surface are also formed in stripes at predetermined intervals. The metal thin film 8 is formed. At this time, the metal thin film 7 on the front surface and the metal thin film 8 on the back surface are formed so that a part thereof faces each other with the sensor substrate 6 interposed therebetween. Then, the metal thin films 7 and 8 are each divided in a direction parallel to the longitudinal direction of the stripes of the metal thin films 7 and 8. Further, the substrate 1 is divided also in the direction perpendicular to the longitudinal direction of the metal thin films 7 and 8, and the rectangular sensor element 5 in which the side in the longitudinal direction of the metal thin films 7 and 8 is the short side is formed after the division. .

【0019】この実施例の焦電センサ素子によっても上
記実施例と同様の効果が得られ、さらに、デュアルタイ
プ以外の焦電センサ素子にも利用可能なものである。
The pyroelectric sensor element of this embodiment has the same effect as that of the above-mentioned embodiment, and can be applied to pyroelectric sensor elements other than the dual type.

【0020】[0020]

【発明の効果】この発明の焦電センサ素子は、簡単な構
成で、多数個取りの基板からセンサ素子を分割して多数
取ることができ、コストダウンに寄与するとともに、セ
ンサ装置の小型化も図ることができる。
The pyroelectric sensor element of the present invention has a simple structure and can be divided into a large number of sensor elements from a multi-piece substrate, contributing to cost reduction and downsizing of the sensor device. Can be planned.

【図面の簡単な説明】[Brief description of drawings]

【図1】この発明の一実施例の焦電センサ素子の表面
(A)と裏面(B)を示す図である。
FIG. 1 is a diagram showing a front surface (A) and a back surface (B) of a pyroelectric sensor element according to an embodiment of the present invention.

【図2】この実施例の焦電センサ素子を得るセラミック
基板の部分破断平面図である。
FIG. 2 is a partially cutaway plan view of a ceramic substrate from which a pyroelectric sensor element of this example is obtained.

【図3】この実施例の焦電センサ素子を得る表面側の蒸
着用のマスクの平面図である。
FIG. 3 is a plan view of a mask for vapor deposition on the front surface side for obtaining the pyroelectric sensor element of this embodiment.

【図4】この実施例の焦電センサ素子を得る裏面側の蒸
着用のマスクの平面図である。
FIG. 4 is a plan view of a mask for vapor deposition on the back surface side for obtaining the pyroelectric sensor element of this embodiment.

【図5】この実施例の焦電センサ素子を取りつけたセン
サ装置の斜視図である。
FIG. 5 is a perspective view of a sensor device to which the pyroelectric sensor element of this embodiment is attached.

【図6】この実施例の焦電センサ装置の縦断面図であ
る。
FIG. 6 is a vertical cross-sectional view of the pyroelectric sensor device of this embodiment.

【図7】この発明の他の実施例の焦電センサ素子の平面
図である。
FIG. 7 is a plan view of a pyroelectric sensor element according to another embodiment of the present invention.

【図8】従来の焦電センサ素子の平面図である。FIG. 8 is a plan view of a conventional pyroelectric sensor element.

【符号の説明】[Explanation of symbols]

1 基板 5 センサ素子 6 センサ基板 7,8 金属薄膜 1 substrate 5 sensor element 6 sensor substrate 7, 8 metal thin film

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 焦電効果のある長方形のセンサ基板表面
に、金属薄膜が形成され、このセンサ基板の裏面にも、
このセンサ基板を挟んで上記表面側の金属薄膜と少なく
とも一部が対面する位置に金属薄膜による電極が形成さ
れている焦電センサ素子。
1. A metal thin film is formed on the surface of a rectangular sensor substrate having a pyroelectric effect.
A pyroelectric sensor element in which an electrode made of a metal thin film is formed at a position where at least a portion of the sensor substrate faces the metal thin film on the front surface side of the sensor substrate.
【請求項2】 焦電効果のある長方形のセンサ基板表面
に、長方形の短辺側の両端部を残して金属薄膜が形成さ
れ、このセンサ基板の裏面には、基板中央部を残して、
長方形の短辺側の両端部に互いに独立した電極が金属薄
膜により形成されている焦電センサ素子。
2. A rectangular sensor substrate surface having a pyroelectric effect, a metal thin film is formed on the surface of the rectangular sensor substrate, leaving both ends on the short side of the rectangle.
A pyroelectric sensor element in which electrodes, which are independent of each other, are formed of metal thin films at both ends on the short side of a rectangle.
【請求項3】 焦電効果のある基板表面に所定間隔でス
トライプ状に金属薄膜を形成し、同様に裏面にも所定間
隔でストライプ状に金属薄膜を形成し、上記表面の金属
薄膜と裏面の金属薄膜とが互いにその一部が上記センサ
基板を挟んで対面し、この基板を、上記表面側の金属薄
膜と平行に分割し、この金属薄膜の長手方向と直角方向
にも上記基板を分割し、分割後の状態で上記金属薄膜の
長手方向の辺が短辺となる長方形のセンサ素子を形成す
る焦電センサ素子の製造方法。
3. A metal thin film is formed in stripes on a front surface of a substrate having a pyroelectric effect at predetermined intervals, and similarly, metal thin films are formed on the back surface in stripes at predetermined intervals. The metal thin film and the metal thin film partially face each other with the sensor substrate interposed therebetween, and the substrate is divided in parallel with the metal thin film on the front surface side, and the substrate is also divided in the direction perpendicular to the longitudinal direction of the metal thin film. A method for manufacturing a pyroelectric sensor element, comprising forming a rectangular sensor element in which a side in a longitudinal direction of the metal thin film is a short side in a state after being divided.
【請求項4】 焦電効果のある基板表面に所定間隔でス
トライプ状に金属薄膜を形成し、同様に裏面にも所定間
隔でストライプ状に金属薄膜を形成し、上記表面の金属
薄膜と裏面の金属薄膜とが互いに各ストライプ間の隙間
に対面する位置に形成され、この基板を、上記表面側の
金属薄膜の間の部分でその金属薄膜と平行に分割し裏面
側の金属薄膜を各々2分割するように分割するととも
に、この金属薄膜の長手方向と直角方向にも上記基板を
分割し、分割後の状態で上記金属薄膜の長手方向の辺が
短辺となる長方形のセンサ素子を形成する焦電センサ素
子の製造方法。
4. A metal thin film is formed in stripes on a front surface of a substrate having a pyroelectric effect at predetermined intervals, and a metal thin film is also formed on the back surface in stripes at predetermined intervals. A metal thin film is formed at a position facing each other in the gap between the stripes, the substrate is divided parallel to the metal thin film in the portion between the metal thin films on the front surface side, and the metal thin film on the back surface side is divided into two parts. And the substrate is also divided in the direction perpendicular to the longitudinal direction of the metal thin film, and a rectangular sensor element whose longitudinal side is the short side is formed in the state after the division. Method for manufacturing an electric sensor element.
JP24874294A 1994-09-16 1994-09-16 Pyroelectric sensor element and manufacturing method thereof Expired - Lifetime JP2963348B2 (en)

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Application Number Priority Date Filing Date Title
JP24874294A JP2963348B2 (en) 1994-09-16 1994-09-16 Pyroelectric sensor element and manufacturing method thereof

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP31137896A Division JPH09166486A (en) 1996-11-06 1996-11-06 Pyroelectric sensor element and its manufacturing method

Publications (2)

Publication Number Publication Date
JPH0886692A true JPH0886692A (en) 1996-04-02
JP2963348B2 JP2963348B2 (en) 1999-10-18

Family

ID=17182694

Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Link
JP (1) JP2963348B2 (en)

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