JPH088623A - High frequency circuit element using resonator - Google Patents

High frequency circuit element using resonator

Info

Publication number
JPH088623A
JPH088623A JP6135621A JP13562194A JPH088623A JP H088623 A JPH088623 A JP H088623A JP 6135621 A JP6135621 A JP 6135621A JP 13562194 A JP13562194 A JP 13562194A JP H088623 A JPH088623 A JP H088623A
Authority
JP
Japan
Prior art keywords
frequency circuit
temperature
high frequency
circuit element
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6135621A
Other languages
Japanese (ja)
Other versions
JP3161227B2 (en
Inventor
Koichi Mizuno
紘一 水野
Akira Enohara
晃 榎原
Hidetaka Tono
秀隆 東野
Kentaro Setsune
謙太郎 瀬恒
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP13562194A priority Critical patent/JP3161227B2/en
Publication of JPH088623A publication Critical patent/JPH088623A/en
Application granted granted Critical
Publication of JP3161227B2 publication Critical patent/JP3161227B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
    • Y02B30/70—Efficient control or regulation technologies, e.g. for control of refrigerant flow, motor or heating

Landscapes

  • Control Of Temperature (AREA)
  • Control Of Motors That Do Not Use Commutators (AREA)
  • Non-Reversible Transmitting Devices (AREA)

Abstract

PURPOSE:To stabilize the characteristic of a high frequency circuit element by controlling the temperatures by a temperature control mechanism and keeping the environmental temperature of the circuit element at a fixed level. CONSTITUTION:A high frequency circuit element consists of a high frequency circuit, a temperature controller which controls the temperature of the high frequency circuit, and a heat conductor which secures the thermal connection between the high frequency circuit and the temperature controller. That is, a resonator 12 and an input/output terminal 13 are produced on a substrate 11 by means of the thin film of an electric conductor (an Au thin film, a superconductive thin film, etc.). Meanwhile a ground electrode 14 is provided on the rear surface of the substrate 11. Then another substrate also having an electrode 14 on its rear surface is placed opposite to the substrate 11 so that a transmission line type high frequency circuit of a strip line structure is obtained and stored in a Cu package 21. The entire surface of the package 21 is plated by Au. Furthermore the package 21 touches the temperature controller to serve as a heat conductor that secures the thermal connection between the high frequency circuit and the temperature controller.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は、通信システムなどの高
周波信号処理装置に用いられるフィルタ、分波器などを
はじめとする共振器を基本に構成される高周波回路素子
に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-frequency circuit element based on a resonator such as a filter and a duplexer used in a high-frequency signal processing device such as a communication system.

【０００２】[0002]

【従来の技術】高周波通信システムにおいては、フィル
タ、分波器などをはじめとする共振器を基本に構成され
る高周波回路素子は不可欠の要素である。特に、移動体
通信システムなどにおいては、周波数帯域の有効利用の
ために狭帯域なフィルタが要求される。また、移動体通
信の基地局や通信衛星などにおいては、狭帯域、低損
失、かつ小型で、大きな電力に耐えることのできるフィ
ルタが強く要望されている。2. Description of the Related Art In a high frequency communication system, a high frequency circuit element which is basically composed of a resonator such as a filter or a duplexer is an essential element. Particularly, in mobile communication systems and the like, narrow band filters are required for effective use of frequency bands. Further, in mobile communication base stations, communication satellites, and the like, there is a strong demand for a filter that has a narrow band, low loss, is small, and can withstand a large amount of power.

【０００３】現在用いられている共振器フィルタなどの
高周波回路素子としては、誘電体共振器を用いたもの、
伝送線路構造を用いたもの、表面弾性波素子を用いたも
のなどが主流となっている。このうち、伝送線路構造を
用いたものは、小型で、マイクロ波、ミリ波領域の高周
波まで適用することができ、さらに、基板上に形成する
２次元的な構造であり、他の回路や素子との組み合わせ
が容易であるために、広く利用されている。従来、この
タイプの共振器としては、伝送線路による１／２波長共
振器が最も一般的に利用されており、さらに、この１／
２波長共振器を複数個結合させることにより、フィルタ
などの高周波回路素子が構成されている。As a high frequency circuit device such as a resonator filter currently used, one using a dielectric resonator,
The ones using a transmission line structure and those using a surface acoustic wave device are the mainstream. Among them, the one using a transmission line structure is small, can be applied to high frequencies in the microwave and millimeter wave regions, and is a two-dimensional structure formed on a substrate, and other circuits and elements. It is widely used because it can be easily combined with. Conventionally, as this type of resonator, a ½ wavelength resonator using a transmission line is most commonly used.
A high frequency circuit element such as a filter is configured by coupling a plurality of two-wavelength resonators.

【０００４】一方、伝送線路を用いた高周波回路の導体
に、直流抵抗がゼロである超伝導体を用いることによっ
て高周波回路の低損失化および高周波特性の向上がはか
られている。従来の金属系超伝導体の場合は１０Ｋ程度
の極低温環境が必要であったが、高温酸化物超伝導体の
発見によって比較的高い温度（７７Ｋ程度）で超伝導現
象を利用できるようになり、これら高温超伝導材料を用
いた伝送線路型素子が検討されるようになってきた。On the other hand, by using a superconductor having a direct current resistance of zero as a conductor of a high frequency circuit using a transmission line, the loss of the high frequency circuit and the high frequency characteristics are improved. In the case of conventional metal-based superconductors, an extremely low temperature environment of about 10K was required, but the discovery of high-temperature oxide superconductors made it possible to use superconductivity at relatively high temperatures (about 77K). , Transmission line type devices using these high temperature superconducting materials have been studied.

【０００５】[0005]

【発明が解決しようとする課題】一般に超伝導体の各種
特性は温度に対して変化し、従って、超伝導体を用いた
素子の特性もまた温度に対して変化する。このことは、
超伝導体を用いた伝送線路型高周波回路素子でも同様で
ある。これら温度に対する特性不安定性は程度の差はあ
るが、従来の金属導電体を用いた素子にも存在する。特
に、超伝導体を用いた高周波回路で大電力を扱う場合、
局所的発熱が顕著になり、特性変化や、極端な場合、素
子破壊などを起こすことが判明した。Generally, various characteristics of superconductors change with temperature, and therefore the characteristics of devices using superconductors also change with temperature. This is
The same applies to a transmission line type high frequency circuit element using a superconductor. Although the characteristic instability with respect to the temperature varies to some extent, it also exists in the element using the conventional metal conductor. Especially when handling high power in a high-frequency circuit using a superconductor,
It was found that the local heat generation became remarkable, causing characteristic changes and, in extreme cases, element destruction.

【０００６】本発明は、前記従来技術の課題を解決する
ため、特に大電力応用可能な高周波回路素子において、
その特性を安定化するために温度制御機構を備えた素子
構成を提供することを目的とする。In order to solve the above-mentioned problems of the prior art, the present invention provides a high-frequency circuit element that can be applied to high power,
It is an object of the present invention to provide an element structure provided with a temperature control mechanism to stabilize its characteristics.

【０００７】[0007]

【課題を解決するための手段】前記課題を解決するた
め、本発明に係る高周波回路素子の基本的構成は、基板
上に形成された電気伝導体からなる縮退していない直行
する２つのダイポールモードを共振モードとして有する
共振器と、その基板自体を加熱、あるいは冷却するため
の温度調整機構と、さらにそれらを熱的に結合する熱伝
導体と、各構成要素の温度を測定する温度測定手段を備
えたものである。ここで縮退していない直行する２つの
ダイポールモードと言う語句について説明しておく。円
板型共振器において、円盤の周辺に一箇所ずつ正、負の
電荷が分布する共振モードをダイポールモードといい、
また、任意の形状の平面型共振器においてもこの定義は
適用できる。２次元的な形状を考えた場合、この任意の
ダイポールモードは、電流方向が直交した互いに独立な
２つのダイポールモードに分解できる。共振器形状が真
円の場合、直行した各モードの共振周波数は同一であり
（エネルギーは同一であり）縮退していると言う。一般
に任意形状の共振器の場合、これら独立なモードの周波
数は異なるため、エネルギーは縮退していない。例とし
て楕円形状の共振器を考えると、直交した独立の２つの
ダイポールモードは、各々楕円の長軸と短軸方向を向い
ており、共振周波数は各々長軸、短軸の長さにより決定
される。本明細書で記述した縮退していない直行する２
つのダイポールモードとは、例えば楕円形状の共振器に
おけるこのような共振モードをさす。ただし共振器形状
は楕円形状のみでなく、任意形状の共振器についても同
様に縮退してなく、かつ直交した２つのダイポールモー
ドを考えることができる。In order to solve the above-mentioned problems, the basic structure of the high-frequency circuit device according to the present invention has two non-degenerate orthogonal dipole modes made of an electric conductor formed on a substrate. A resonator having a resonance mode, a temperature adjusting mechanism for heating or cooling the substrate itself, a heat conductor for thermally coupling them, and a temperature measuring means for measuring the temperature of each component. Be prepared. Here, the two non-degenerate direct dipole modes will be described. In the disk type resonator, the resonance mode in which positive and negative charges are distributed one by one around the disk is called dipole mode.
Moreover, this definition can be applied to a planar resonator having an arbitrary shape. Considering a two-dimensional shape, this arbitrary dipole mode can be decomposed into two independent dipole modes whose current directions are orthogonal to each other. When the resonator shape is a perfect circle, the resonance frequencies of the orthogonal modes are the same (the energy is the same) and degenerate. Generally, in the case of a resonator having an arbitrary shape, the frequencies of these independent modes are different, and therefore the energy is not degenerated. Considering an elliptical resonator as an example, two independent orthogonal dipole modes are oriented in the major axis and minor axis directions of the ellipse, and the resonance frequency is determined by the major axis and minor axis lengths, respectively. It Non-degenerate direct 2 as described in this specification
One dipole mode refers to such a resonance mode in an elliptical resonator, for example. However, the resonator shape is not limited to the elliptical shape, and two dipole modes that are not degenerate and are orthogonal to each other can be considered for a resonator having an arbitrary shape.

【０００８】本発明はまた、温度調整機構の熱を効率よ
く共振器に伝える、あるいは逆に共振器の温度を効率よ
く取り去る為に、各種応用に最適な種々の熱伝導体、あ
るいは各種熱伝導体に合う熱交換機能を提供する。熱伝
導体としては、熱伝導率が高い固体、金属箔、すくなく
ともＡｕ、Ａｇ、Ｐｔ、Ｐｄ、Ｃｕ、Ａｌのうち一種類
を含むか、もしくはこれら材料の合金の金属箔、電気伝
導性を示すペースト状物質、気体あるいは液体、あるい
はヘリウムガスである。The present invention also provides various heat conductors or various heat conductors most suitable for various applications in order to efficiently transfer the heat of the temperature adjusting mechanism to the resonator, or conversely to remove the temperature of the resonator efficiently. Provides a heat exchange function that fits the body. The heat conductor includes a solid having a high heat conductivity, a metal foil, at least one of Au, Ag, Pt, Pd, Cu, and Al, or a metal foil of an alloy of these materials, which exhibits electrical conductivity. It is a pasty substance, gas or liquid, or helium gas.

【０００９】また、効率的に温度計測を行い、結果を温
度調整器にフィードバックするため、種々の温度測定方
法を提供する。それらは、各種温度測定手段として、基
板上に接して直接形成された導電体、あるいは超伝導体
の抵抗値変化を計測する方法であり、また基板、あるい
は熱伝導体に接し、互いに接触する形で形成された異な
る導電性材料よりなる熱電対の接点に生じる熱起電力を
計測する方法である。Further, various temperature measuring methods are provided in order to efficiently measure the temperature and feed back the result to the temperature controller. As various temperature measuring means, they are a method of measuring a change in resistance value of a conductor or a superconductor formed directly on a substrate, and also a method of contacting a substrate or a heat conductor and contacting each other. It is a method of measuring the thermoelectromotive force generated at the contact points of the thermocouples made of different conductive materials.

【００１０】また、以上の共振器は、小型化を考慮して
伝送線路型を念頭に置いている。そのため共振器の構造
は、マイクロストリップ線路構造、ストリップ線路構造
又はコプレナー導波路構造などである。Further, the above-mentioned resonator is of a transmission line type in consideration of miniaturization. Therefore, the structure of the resonator is a microstrip line structure, a strip line structure, a coplanar waveguide structure, or the like.

【００１１】[0011]

【作用】本発明に係る高周波回路素子の構成によれば、
温度調整機構によって温度を制御することによって素子
の環境温度を一定に保つことにより素子特性の安定かが
できる。素子特性の安定化が確認された原因は推定の域
をでないが、温度制御により局所的な発熱を抑えるたた
めと考えられ、高周波素子の安定動作には、温度制御を
局所的に制御することが効果的であると見られる。According to the configuration of the high frequency circuit element according to the present invention,
By controlling the temperature with the temperature adjustment mechanism, the environmental temperature of the element is kept constant, so that the element characteristics can be stabilized. The reason why the stabilization of the element characteristics was confirmed is beyond the range of estimation, but it is considered that the local heat generation is suppressed by the temperature control.For stable operation of the high frequency element, it is possible to control the temperature control locally. Seems to be effective.

【００１２】温度制御をする際に、熱伝導率の大きな材
料を熱伝導体とすることで効率的に温度調節できる。ま
た、各構成要素の温度を測定し、その結果に従い温度調
整機構の温度を制御するフィードバック回路を備えるこ
とにより、急激な温度変化に追従して高周波回路素子の
温度を一定に保つことができることを見いだした。この
ことは信号とともに入力する電気的雑音、あるいは突発
的な熱的雑音に対する素子特性の安定化に有効である。
また、共振器の材料に超伝導体を用いた構成とすると、
高周波特性の低損失化に有効であるが、この共振器の特
性安定化には低温での温度の安定性を高めること（変動
が少ないこと）が重要であり、この点で前記温度調整機
構と温度センサー、フィードバック回路の有用性が顕著
であった。When the temperature is controlled, it is possible to efficiently adjust the temperature by using a material having a large thermal conductivity as the heat conductor. Further, by providing a feedback circuit that measures the temperature of each component and controls the temperature of the temperature adjustment mechanism according to the result, it is possible to keep the temperature of the high-frequency circuit element constant by following a rapid temperature change. I found it. This is effective in stabilizing element characteristics against electrical noise input with a signal or sudden thermal noise.
In addition, if the structure using a superconductor as the material of the resonator,
Although it is effective in reducing the loss of high-frequency characteristics, it is important to increase the temperature stability at low temperatures (less fluctuation) in order to stabilize the characteristics of this resonator. The usefulness of the temperature sensor and the feedback circuit was remarkable.

【００１３】また、温度調整機構の熱を効率よく共振器
に伝える、あるいは逆に共振器の温度を効率よく取り去
る為に、熱伝導体として、熱伝導率が高い固体を用いる
と、効率的に温度制御できるだけでなく、熱伝導体自体
をを高周波回路素子のパッケージとしても利用でき、実
用的な構成であることを見いだした。特に、真鋳、Ｃ
ｕ、Ａｌ等のブロックを加工し、高周波回路素子全体を
覆うパッケージ形状とし、温度調整機構に接触させ温度
を一定に保つことで、素子特性を安定化でき、また高周
波回路素子の放射損失を低減できることを見いだした。
この時、パッケージ全体にＡｕ、あるいはＡｕを含む合
金をコートすることで高周波損失の低減に効果があるこ
とを見いだした。特にＣｕや、Ｃｕを含む真鋳等は熱伝
導度ともに熱容量が大きく、突発的な熱雑音に対して温
度変化を小さく抑えるとともに、安価であり加工も容易
であるため実用的である。Further, in order to efficiently transfer the heat of the temperature adjusting mechanism to the resonator or, on the contrary, to efficiently remove the temperature of the resonator, if a solid having a high thermal conductivity is used as the heat conductor, it is efficient. It has been found that not only the temperature can be controlled but also the heat conductor itself can be used as a package for a high-frequency circuit element, which is a practical configuration. In particular, true casting, C
By processing a block of u, Al, etc., to form a package that covers the entire high-frequency circuit element, and keeping the temperature constant by contacting it with a temperature adjustment mechanism, the element characteristics can be stabilized and the radiation loss of the high-frequency circuit element can be reduced. I found what I could do.
At this time, it was found that coating the entire package with Au or an alloy containing Au was effective in reducing high frequency loss. In particular, Cu and true casting containing Cu have a large thermal conductivity and a large heat capacity, suppress a temperature change to a small amount due to sudden thermal noise, are inexpensive, and are easy to process, and thus are practical.

【００１４】さらに共振器を形成した基板と熱伝導体、
あるいは温度調整機構の間に金属箔、すくなくともＡ
ｕ、Ａｇ、Ｐｔ、Ｐｄ、Ｃｕ、Ａｌのうち一種類を含む
か、もしくはこれら材料の合金の金属箔をはさみ、熱伝
導体とすると、接触面積が増し、熱的な結合を改善でき
ることを見いだした。また金属箔は、共振器構造の電気
的な接地面とも良好な電気的接触をし、素子特性の安定
化に効果が見られた。このことは熱伝導体として、電気
伝導性を示すペースト状物質を用いた場合も同様である
が、電気伝導性ペーストの場合は、さらに接触面積が大
きく、良好なることで熱伝導が改善された。また装置
（パッケージ）の接地面と共振器接地面の良好な電気的
接触をとる際にも接触面積が大きく有用であった。さら
に、気体あるいは液体を還流させ熱伝導を行うと、温度
制御時の応答を早くできることを見いだした。特に超伝
導体を用いた高周波回路素子では、冷却を要するが、ヘ
リウムガスを用いることにより低温でも液化、さらには
固化することなく、良好な温度制御が可能であることを
見いだした。高周波電流は表皮効果により共振器表面を
流れるため、共振器表面での発熱が大きい。共振器表面
にヘリウムガス、あるいは他の流体を吹き付ける、還流
させる等することにより、効果的な温度制御が可能であ
ることを見いだした。A substrate on which a resonator is further formed and a heat conductor,
Or a metal foil, at least A between the temperature adjustment mechanism
It has been found that if a metal foil containing one of u, Ag, Pt, Pd, Cu and Al or sandwiching an alloy of these materials is used as a heat conductor to increase the contact area, the thermal coupling can be improved. It was The metal foil also made good electrical contact with the electrical ground plane of the resonator structure, and was effective in stabilizing the device characteristics. This also applies to the case where a paste-like substance having electrical conductivity is used as the heat conductor, but in the case of the electrically conductive paste, the contact area is further large, and the heat conduction is improved by the improvement. . In addition, the contact area was large and useful when making good electrical contact between the ground plane of the device (package) and the ground plane of the resonator. Furthermore, they have found that when a gas or a liquid is refluxed to conduct heat, the response during temperature control can be accelerated. In particular, it has been found that a high-frequency circuit element using a superconductor requires cooling, but by using helium gas, good temperature control can be performed without liquefying or solidifying even at a low temperature. Since the high-frequency current flows on the resonator surface due to the skin effect, heat generation on the resonator surface is large. It was found that effective temperature control is possible by spraying or refluxing helium gas or other fluid on the resonator surface.

【００１５】一方、各種温度センサーを、基板もしくは
熱伝導体に機械的に接触させ温度計測をすることで、簡
便な方法でありながら効率的に温度計測を行い、結果を
温度調整器にフィードバックすることができることを見
いだした。とくに基板上に接して直接形成された導電
体、あるいは超伝導体の温度に対する抵抗値変化を測定
し温度を計測する方法を用いると、基板との熱的な接触
が良好であり、精度の良い温度計測ができることを見い
だした。この時、抵抗体としては、高周波回路素子を形
成した導体をそのまま利用でき、高周波回路素子のパタ
ーニングと同時に形成できるため簡便でありながら精度
の高い温度計測手法を提供できることを見いだした。ま
た、基板、あるいは熱伝導体に接し、互いに接触する形
で形成された異なる導電性材料よりなる熱電対を形成
し、その接点に生じる熱起電力を計測する方法を用いる
と、熱接触が良好であり、しかも熱電対自体の発熱が小
さいため、小型高周波回路素子の特性に影響を及ぼさな
いことを見いだした。また、この熱電対構造は、各種接
地面に用いた導体を一方の電極として利用できるため、
比較的簡便に形成できることも見いだした。On the other hand, various temperature sensors are mechanically brought into contact with the substrate or the heat conductor to measure the temperature, so that the temperature can be efficiently measured though it is a simple method and the result is fed back to the temperature controller. I found that I could do it. Especially, if the method of measuring the temperature by measuring the resistance change with respect to the temperature of the conductor or superconductor formed directly on the substrate is used, the thermal contact with the substrate is good and the accuracy is high. I found that I could measure temperature. At this time, it has been found that a conductor on which a high-frequency circuit element is formed can be used as a resistor as it is and can be formed simultaneously with patterning of the high-frequency circuit element, so that a simple and highly accurate temperature measurement method can be provided. In addition, if a thermocouple consisting of different conductive materials formed in contact with the substrate or heat conductor is formed and the thermoelectromotive force generated at the contact is measured, good thermal contact can be obtained. Moreover, since the heat generation of the thermocouple itself is small, it has been found that it does not affect the characteristics of the small high frequency circuit element. In addition, this thermocouple structure can use the conductor used for various ground planes as one electrode,
It was also found that it can be formed relatively easily.

【００１６】また、同一基板上に温度センサーと共に、
温度調節器を直接形成し、基板を熱伝導体とすると、構
成が簡便でありながら、良好な温度制御が可能であり、
実用的に有効であることを見いだした。Further, together with the temperature sensor on the same substrate,
If the temperature controller is directly formed and the substrate is a heat conductor, good temperature control is possible while the structure is simple.
It was found to be practically effective.

【００１７】以上の共振器は、小型化を考慮して伝送線
路型を念頭に置いているため、その共振器の構造は、マ
イクロストリップ線路構造、ストリップ線路構造又はコ
プレナー導波路構造のいずれかが有利である。特にスト
リップ線路は放射損失が低く抑えられるため高性能な高
周波回路素子を提供する。また、マイクロストリップ線
路型は、基板が一枚ですむために実用的な高周波回路素
子を提供する。Since the above-mentioned resonator has a transmission line type in consideration of miniaturization, the structure of the resonator is either a microstrip line structure, a strip line structure or a coplanar waveguide structure. It is advantageous. In particular, the strip line provides a high-performance high-frequency circuit element because the radiation loss can be suppressed low. In addition, the microstrip line type provides a practical high-frequency circuit element because only one substrate is required.

【００１８】[0018]

【実施例】以下、実施例を用いて本発明をさらに具体的
に説明する。EXAMPLES The present invention will be described in more detail below with reference to examples.

【００１９】図１は本発明に係る発明の一実施例を示す
概念図である。図１に示すように本発明では、高周波回
路１、その高周波回路の温度を調整する温度調整器２、
高周波回路と温度調整器との熱的な結合を受け持つ熱伝
導体３よりなる。さらに場合によっては、各部位の温度
測定手段とその結果を温度調整器にフィードバックする
フィードバック回路５より構成される。本発明は高周波
回路の温度を調整すること、もしくは一定に保つことが
目的であり、高周波回路の構造、温度調整器の動作タイ
プ等はいかなるものでもよい。一方本発明は、超伝導体
を高周波回路に用いた際に有効性をより明らかにするも
のである。すなわち、超伝導体を一定温度に冷却する
際、より効果を表わす。FIG. 1 is a conceptual diagram showing an embodiment of the present invention. As shown in FIG. 1, in the present invention, a high frequency circuit 1, a temperature controller 2 for adjusting the temperature of the high frequency circuit,
The heat conductor 3 is responsible for the thermal coupling between the high frequency circuit and the temperature controller. Further, in some cases, it is composed of temperature measuring means of each part and a feedback circuit 5 for feeding back the result to the temperature controller. The purpose of the present invention is to adjust the temperature of the high-frequency circuit, or to keep it constant, and the structure of the high-frequency circuit, the operation type of the temperature controller, etc. may be any. On the other hand, the present invention further clarifies the effectiveness when the superconductor is used in a high frequency circuit. That is, it is more effective when the superconductor is cooled to a constant temperature.

【００２０】（実施例１）図２は、高周波回路および熱
伝導体部分の断面図である。基板１１上に共振器１２と
入出力端子１３を電気伝導体（例えばＡｕ薄膜、あるい
は超伝導薄膜など）の薄膜で作製し、その基板１１の裏
面には接地電極１４を設けている。また対向するように
同じく基板１１と裏面に接地電極１４を設けた基板を配
置し、ストリップライン構造の伝送線路型高周波回路と
した。この高周波回路をＣｕ製のパッケージ２１内に設
置した。このパッケージは全面をＡｕでメッキしてい
る。このパッケージ２１は温度調整器に接して設置され
ており、高周波回路と温度調整器とを熱的に結合する熱
伝導体となっている。以上の部分は図１において１、及
び３の部分に対応する。(Embodiment 1) FIG. 2 is a sectional view of a high frequency circuit and a heat conductor portion. The resonator 12 and the input / output terminal 13 are made of a thin film of an electric conductor (for example, Au thin film or superconducting thin film) on the substrate 11, and the ground electrode 14 is provided on the back surface of the substrate 11. Similarly, the substrate 11 and the substrate provided with the ground electrode 14 on the back surface are arranged so as to face each other to form a transmission line type high frequency circuit having a stripline structure. This high-frequency circuit was installed in the Cu package 21. The entire surface of this package is plated with Au. The package 21 is installed in contact with the temperature controller and serves as a heat conductor that thermally couples the high frequency circuit and the temperature controller. The above parts correspond to the parts 1 and 3 in FIG.

【００２１】（実施例２）図３は図２に対して対向する
基板を用いないマイクロストリップライン構造としたも
のである。接地面１４は導電ペースト２６によってパッ
ケージ２１に接着している。パッケージ２１は同じくＣ
ｕ製の熱伝導体とし、温度調整器に接している。また、
パッケージ内の空間に還流あるいは対流するガスあるい
は液体を注入し、もう一つの熱伝導体としている。この
構成は超伝導体を共振器としたときに有効であった。す
なわち、超伝導状態を得るために共振器を冷却する必要
があるが、熱容量の大きいヒートシンクとしてＡｕメッ
キしたＣｕ製のパッケージを冷却器に接触させた。ま
た、液体ヘリウム温度付近で動作させる際は冷却したヘ
リウムガスを基板表面（共振器表面）に還流することに
より安定な温度制御とともに迅速な温度制御を行うもの
である。また、液体窒素温度で使用する際は、液体窒素
温度に冷却した、ヘリウムガス、アルゴンガス等の不活
性ガスや、液体窒素自体、液体窒素温度で固化しないフ
レオン系の有機溶剤等を基板表面に還流した。(Embodiment 2) FIG. 3 shows a microstrip line structure which does not use a substrate facing FIG. The ground plane 14 is adhered to the package 21 with a conductive paste 26. Package 21 is also C
It is a heat conductor made of u and is in contact with the temperature controller. Also,
Gas or liquid that flows back or convection is injected into the space inside the package to form another heat conductor. This structure was effective when the superconductor was used as a resonator. That is, although it is necessary to cool the resonator to obtain the superconducting state, a Cu-made package plated with Au as a heat sink having a large heat capacity was brought into contact with the cooler. When operating near the liquid helium temperature, the cooled helium gas is returned to the substrate surface (resonator surface) to perform stable temperature control and rapid temperature control. When used at liquid nitrogen temperature, inert gas such as helium gas and argon gas cooled to liquid nitrogen temperature, liquid nitrogen itself, Freon-based organic solvent that does not solidify at liquid nitrogen temperature, etc. Refluxed.

【００２２】（実施例３）図４に熱伝導体を金属箔、あ
るいはペースト状物質とした場合の断面図を示す。金属
箔、あるいはペースト状物質を熱伝導体３として接地面
１４と温度調整器２間に挿入することにより、高周波回
路素子１２の形成された基板１１と熱伝導体２間の接触
面積を増すことができ、効率的な温度制御が可能であっ
た。また、図の場合には基板裏面に接地面１４を設けた
マイクロストリップライン型の高周波回路を記している
が、接地面１４と共に、温度調整器２表面、さらに熱伝
導体３である金属箔、あるいはペースト状物質を良好な
電気伝導体とすることで周囲電位と接地面電位とを容易
に同一にでき実用的に効果的であった。(Embodiment 3) FIG. 4 shows a cross-sectional view when the heat conductor is a metal foil or a paste-like substance. Increasing the contact area between the substrate 11 on which the high-frequency circuit element 12 is formed and the heat conductor 2 by inserting a metal foil or a paste-like substance as the heat conductor 3 between the ground plane 14 and the temperature controller 2. And efficient temperature control was possible. Further, in the case of the drawing, a microstrip line type high frequency circuit in which a ground plane 14 is provided on the back surface of the substrate is shown, but together with the ground plane 14, the surface of the temperature regulator 2 and a metal foil which is the heat conductor 3, Alternatively, by using a paste-like substance as a good electric conductor, the ambient potential and the ground plane potential can be easily made the same, which is practically effective.

【００２３】（実施例４）図５はストリップライン型高
周波回路素子に対して対向する基板を用いないマイクロ
ストリップライン構造とし、高周波回路素子の温度を測
定するセンサーを備えたものである（平面図）。共振器
は楕円形状とし、温度センサーは共振器を作製した基板
上に作製した薄膜状の抵抗体１５である。抵抗体１５の
抵抗値の変化より温度を決定する。この温度測定結果は
外部でモニターされ、場合によってはフィードバック回
路で温度調整器の出力を制御する。抵抗体１５は、たと
えばＰｔの薄膜センサーや、カーボン薄膜センサー、酸
化物薄膜を用いたものなど基板上に作製できれば構わな
い。また、高周波回路は、ストリップライン型でもコプ
レーナ型でも良いことはいうまでもない。(Embodiment 4) FIG. 5 shows a microstrip line structure in which a substrate facing a strip line type high frequency circuit element is not used, and a sensor for measuring the temperature of the high frequency circuit element is provided (plan view). ). The resonator has an elliptical shape, and the temperature sensor is a thin film resistor 15 formed on the substrate on which the resonator is formed. The temperature is determined by the change in the resistance value of the resistor 15. The temperature measurement result is monitored externally, and in some cases a feedback circuit controls the output of the temperature regulator. The resistor 15 may be formed on a substrate such as a Pt thin film sensor, a carbon thin film sensor, or an oxide thin film sensor. Needless to say, the high frequency circuit may be a strip line type or a coplanar type.

【００２４】（実施例５）図６には、高周波回路素子の
温度測定方法の他の実施例を示す。高周波回路素子１２
の基板１１裏面に接地面１４を設け、その接地面を熱電
対の一方の電極とし、他の材料を接触させたものであ
る。高周波回路素子１２の温度は熱電対１６の起電力で
測定する構造となっている。通常接地面１４は電気伝導
性の良い材料、例えばＡｕ、Ｃｕ、超伝導体等を用いる
が、これらに接して異種伝導材料を接触させることによ
り容易に熱電対を形成できる。一般に低温で使用される
熱電対はＡｕＦｅ−クロメル熱電対であるが、接地面の
一部にＡｕＦｅ合金を用い、クロメル電極を接触させる
だけで容易に温度計測が可能であった。また、熱伝導体
に同様に熱電対を形成し、熱伝導体の温度に対して制御
を加えても、同様に高周波回路素子の温度制御が可能で
ある。(Embodiment 5) FIG. 6 shows another embodiment of the method for measuring the temperature of a high-frequency circuit element. High frequency circuit element 12
A ground plane 14 is provided on the back surface of the substrate 11, and the ground plane is used as one electrode of the thermocouple and is brought into contact with another material. The temperature of the high frequency circuit element 12 is measured by the electromotive force of the thermocouple 16. Normally, the ground plane 14 is made of a material having good electric conductivity, such as Au, Cu, or a superconductor, but a thermocouple can be easily formed by bringing it into contact with a different conductive material. Generally, the thermocouple used at a low temperature is an AuFe-chromel thermocouple, but it was possible to easily measure the temperature by using an AuFe alloy for a part of the ground plane and bringing the chromel electrode into contact. Further, even if a thermocouple is formed on the heat conductor and the temperature of the heat conductor is controlled, the temperature of the high frequency circuit element can be controlled similarly.

【００２５】（具体的実施例）本発明をさらに良く理解
するために、具体的な実施例を示す。図７に、本実施例
で作製した高周波回路素子の構成を示す。共振器１２は
楕円型導体板であり、直径は約７ｍｍ、長軸・短軸比と
入出力結合の間隙は帯域幅が約２％となるように設定し
た。作製手順は、まず、ランタンアルミナ単結晶からな
る基板１１の両面に厚さ１μｍの高温酸化物超伝導体を
形成した。高温酸化物超伝導体としては通常Ｈｇ系超伝
導体と言われるものであり、主としてＨｇＢａ2ＣｕＯx
（１２０１相）と呼ばれる薄膜を用いた。この薄膜は９
０Ｋ以上で超伝導転移をした。その後、真空蒸着法によ
り厚み１μｍのＡｕ薄膜を片面に形成し超伝導体とＡｕ
薄膜よりなる接地面１４とした。次にフォトリソグラフ
ィーとアルゴンイオンビームエッチングの手法によっ
て、楕円型導体を接地面と逆の表面上の超伝導薄膜にお
いてパターン化した。Ｃｕ製のパッケージ２１表面にＡ
ｕをメッキし、その中に共振器を形成した基板１１を設
置し、さらにそれに対向するように同じくランタンアル
ミナ単結晶基板１１の片面に超伝導薄膜（１２０１相Ｈ
ｇＢａ2ＣｕＯx）とＡｕ薄膜を形成した基板を設置し、
ストリップライン型の共振器からなる高周波回路素子を
構成した。図では若干の空隙が存在するが、実際には基
板は重ね合わされている。パッケージ２１と設置面１４
間は導電ペースト２６（ここではＡｇペーストを用い
た）で接着し、熱伝導性と、電気的接地を確保してい
る。また、パッケージ２１にＡｕＦｅ−クロメル熱電対
を接触させ、熱起電力を測定し温度モニターをおこなっ
た。パッケージ全体は小型の出力を電気的に制御できる
冷凍器により冷却し、その冷凍器にたいし、熱起電力に
対応する制御信号をフィードバックし、温度の調節を行
った。この高周波回路素子の場合の挿入損失の入力電力
依存では、32.1 dBm（１Ｗ以上）の電力に対しても挿入
損失が変化のないことが確認された。また、対向する基
板の相対的な位置を若干調整することにより、高周波回
路素子の特性が調整できることを確認した。Specific Examples In order to better understand the present invention, specific examples will be shown. FIG. 7 shows the configuration of the high-frequency circuit device manufactured in this example. The resonator 12 is an elliptical conductor plate, and has a diameter of about 7 mm, and the major axis / minor axis ratio and the gap between the input and output are set to have a bandwidth of about 2%. In the manufacturing procedure, first, a high-temperature oxide superconductor having a thickness of 1 μm was formed on both surfaces of the substrate 11 made of lanthanum alumina single crystal. High-temperature oxide superconductors are generally called Hg-based superconductors, and are mainly HgBa 2 CuO x.
A thin film called (1201 phase) was used. This thin film is 9
Superconducting transition occurred at 0K and above. After that, an Au thin film having a thickness of 1 μm is formed on one surface by a vacuum deposition method to form a superconductor and Au.
The ground plane 14 made of a thin film was used. The elliptical conductor was then patterned in the superconducting thin film on the surface opposite the ground plane by photolithography and argon ion beam etching techniques. A on the surface of the Cu package 21
A substrate 11 on which u is plated and a resonator is formed is placed therein, and the superconducting thin film (1201 phase H
gBa 2 CuO x ) and a substrate on which an Au thin film is formed,
A high-frequency circuit element consisting of a stripline resonator was constructed. Although there are some voids in the figure, the substrates are actually stacked. Package 21 and installation surface 14
The space is bonded with a conductive paste 26 (here, Ag paste is used) to secure thermal conductivity and electrical grounding. Further, an AuFe-chromel thermocouple was brought into contact with the package 21, the thermoelectromotive force was measured, and the temperature was monitored. The entire package was cooled by a refrigerator with a small output that can be electrically controlled, and a control signal corresponding to the thermoelectromotive force was fed back to the refrigerator to adjust the temperature. With respect to the input power dependence of the insertion loss in the case of this high-frequency circuit element, it was confirmed that the insertion loss did not change even with a power of 32.1 dBm (1 W or more). It was also confirmed that the characteristics of the high-frequency circuit element can be adjusted by slightly adjusting the relative positions of the opposing substrates.

【００２６】[0026]

【発明の効果】高周波素子、特に超伝導体を用いた素子
では、温度の揺らぎによってその特性が変化する。また
大電力を投入した場合などは高周波損失で発熱し、温度
が上昇する。これらのことは、大きな電力の信号を扱う
場合に顕著となり問題となる。しかしながら、本明細書
で説明したとおり、本発明の高周波回路素子では、温度
制御機構を備え、温度を一定に保つ機能を有するため、
この特性変化（ゆらぎ）を抑える効果がある。このこと
は超伝導体を用いた高周波素子で顕著な効果を現した。
また、良好な熱伝導体を用いることによって、温度制御
性を高める効果がある。特に導電ペーストを用いると、
熱伝導体の機能と同時に接地面電位を取る機能も有し、
実用的な効果が高い。さらに、薄膜状の温度センサーを
用いると、共振器を作製した基板上に集積化するのに有
利であり、温度測定精度も高くできる効果がある。ま
た、熱電対型の温度計測手段は、測定時の発熱がほとん
ど生じず、また簡便に形成できて実用的に効果が高かっ
た。The characteristics of a high frequency element, especially an element using a superconductor, changes due to temperature fluctuations. Also, when a large amount of power is input, heat is generated due to high frequency loss, and the temperature rises. These things become remarkable and become a problem when handling a signal of large power. However, as described in this specification, the high-frequency circuit element of the present invention includes the temperature control mechanism and has the function of keeping the temperature constant,
This has the effect of suppressing this characteristic change (fluctuation). This has shown a remarkable effect in the high frequency element using the superconductor.
In addition, the use of a good heat conductor has the effect of enhancing the temperature controllability. Especially when using conductive paste,
It also has the function of taking the ground plane potential at the same time as the function of the heat conductor,
Highly practical effect. Furthermore, the use of a thin film temperature sensor is advantageous for integration on the substrate on which the resonator is manufactured, and has the effect of increasing the temperature measurement accuracy. Further, the thermocouple type temperature measuring means hardly generate heat during measurement, and it can be easily formed, which is highly effective in practice.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明に係る温度制御型高周波回路素子の概念
図FIG. 1 is a conceptual diagram of a temperature control type high frequency circuit element according to the present invention.

【図２】本発明に係る第１の実施例であるストリップラ
イン型高周波回路素子の断面図FIG. 2 is a sectional view of a stripline type high frequency circuit device according to a first embodiment of the present invention.

【図３】本発明に係る第２の実施例であるマイクロスト
リップライン型高周波回路素子の断面図FIG. 3 is a sectional view of a microstrip line type high frequency circuit device according to a second embodiment of the present invention.

【図４】本発明に係る第３の実施例のマイクロストリッ
プライン型高周波回路素子を示す断面図FIG. 4 is a sectional view showing a microstrip line type high frequency circuit device according to a third embodiment of the present invention.

【図５】本発明に係る第４の実施例での、温度モニター
方法の一例を示す平面図FIG. 5 is a plan view showing an example of a temperature monitoring method according to the fourth embodiment of the present invention.

【図６】本発明に係る第５の実施例での、温度モニター
方法の他の一例を示す断面図FIG. 6 is a cross-sectional view showing another example of the temperature monitoring method according to the fifth embodiment of the present invention.

【図７】本発明に係る高周波回路素子の具体的実施例を
示す断面図FIG. 7 is a cross-sectional view showing a specific example of the high-frequency circuit element according to the present invention.

【符号の説明】[Explanation of symbols]

１ 高周波回路素子 ２ 温度調整器 ３ 熱伝導体 ４ 温度測定手段 ５ フィードバック回路 １１ 基板 １２ 共振器 １３ 入出力端子 １４ 接地面 １５ 抵抗体 １６ 熱電対 ２１ パッケージ ２６ 導電ペースト DESCRIPTION OF SYMBOLS 1 High frequency circuit element 2 Temperature regulator 3 Thermal conductor 4 Temperature measuring means 5 Feedback circuit 11 Substrate 12 Resonator 13 Input / output terminal 14 Ground plane 15 Resistor 16 Thermocouple 21 Package 26 Conductive paste

フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０１Ｐ 1/208 ＺＡＡ Ａ 1/30 ＺＡＡ Ｚ (72)発明者 瀬恒 謙太郎 大阪府門真市大字門真1006番地 松下電器 産業株式会社内Continuation of the front page (51) Int.Cl. 6 Identification number Reference number within the agency FI Technical indication location H01P 1/208 ZAA A 1/30 ZAA Z (72) Inventor Kentaro Se Tsune 1006 Kadoma, Kadoma, Osaka Prefecture Matsushita Denki Sangyo Co., Ltd.

Claims (11)

【特許請求の範囲】[Claims] 【請求項１】温度測定手段と、温度調整機構と、基板上
に形成された電気伝導体からなる縮退していない直交す
る２つのダイポールモードを共振モードとして有する共
振器と、さらに前記温度調整機構と、前記基板もしくは
前記電気伝導体とを熱的に結合する熱伝導体とを構成要
素に含むことを特徴とする高周波回路素子。1. A temperature measuring means, a temperature adjusting mechanism, a resonator having two non-degenerate orthogonal dipole modes made of an electric conductor formed on a substrate as resonance modes, and the temperature adjusting mechanism. And a thermal conductor that thermally couples the substrate or the electrical conductor, as a constituent element. 【請求項２】温度測定手段と、温度調整機構が、当該基
板上に形成されたことを特徴とする請求項１記載の高周
波回路素子。2. The high-frequency circuit element according to claim 1, wherein the temperature measuring means and the temperature adjusting mechanism are formed on the substrate. 【請求項３】電気伝導体が超伝導体であることを特徴と
する請求項１または２記載の高周波回路素子。3. The high frequency circuit device according to claim 1, wherein the electric conductor is a superconductor. 【請求項４】熱伝導体が固体であることを特徴とする請
求項１、２または３記載の高周波回路素子。4. The high frequency circuit element according to claim 1, wherein the heat conductor is solid. 【請求項５】熱伝導体が金属箔であることを特徴とする
請求項４記載の高周波回路素子。5. The high-frequency circuit element according to claim 4, wherein the heat conductor is a metal foil. 【請求項６】熱伝導体となる金属箔が、すくなくともＡ
ｕ、Ａｇ、Ｐｔ、Ｐｄ、Ｃｕ、Ａｌのうち一種類を含む
か、もしくはこれら材料の合金で構成されたことを特徴
とする請求項５記載の高周波回路素子。6. A metal foil serving as a heat conductor is at least A.
The high frequency circuit element according to claim 5, wherein the high frequency circuit element contains at least one of u, Ag, Pt, Pd, Cu, and Al, or is made of an alloy of these materials. 【請求項７】熱伝導体が電気伝導性を示すペースト形状
であることを特徴とする請求項１、２または３記載の高
周波回路素子。7. The high-frequency circuit element according to claim 1, 2 or 3, wherein the heat conductor is in the form of a paste exhibiting electrical conductivity. 【請求項８】熱伝導体が気体あるいは液体であることを
特徴とする請求項１、２または３記載の高周波回路素
子。8. The high frequency circuit element according to claim 1, 2 or 3, wherein the heat conductor is a gas or a liquid. 【請求項９】熱伝導体がヘリウムガスであることを特徴
とする請求項８記載の高周波回路素子。9. The high frequency circuit element according to claim 8, wherein the heat conductor is helium gas. 【請求項１０】温度測定手段が、前記基板上に形成され
た導電体の抵抗値変化によることを特徴とする請求項
１、２または３記載の高周波回路素子。10. The high-frequency circuit element according to claim 1, wherein the temperature measuring means is based on a change in resistance value of a conductor formed on the substrate. 【請求項１１】温度測定手段が、前記基板に接し、互い
に接触する形で形成された異なる導電性材料よりなる接
点の熱起電力によることを特徴とする請求項１、２また
は３記載の高周波回路素子。11. The high frequency wave according to claim 1, 2 or 3, wherein the temperature measuring means is based on a thermoelectromotive force of a contact made of a different conductive material which is formed so as to be in contact with the substrate and in contact with each other. Circuit element.
JP13562194A 1994-06-17 1994-06-17 High frequency circuit element using resonator Expired - Fee Related JP3161227B2 (en)

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Application Number Priority Date Filing Date Title
JP13562194A JP3161227B2 (en) 1994-06-17 1994-06-17 High frequency circuit element using resonator

Publications (2)

Publication Number Publication Date
JPH088623A true JPH088623A (en) 1996-01-12
JP3161227B2 JP3161227B2 (en) 2001-04-25

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6367266B1 (en) 1998-10-07 2002-04-09 Fujitsu Limited Heat insulation chamber, thermostatic chamber and cryostat

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6367266B1 (en) 1998-10-07 2002-04-09 Fujitsu Limited Heat insulation chamber, thermostatic chamber and cryostat

Also Published As

Publication number Publication date
JP3161227B2 (en) 2001-04-25

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